TSC693E [ATMEL]

Microprocessor Circuit, CMOS, PQFP256;


型号：	TSC693E
厂家：	ATMEL
描述：	Microprocessor Circuit, CMOS, PQFP256 外围集成电路
文件：	总132页 (文件大小：1060K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TSC693E

Memory Controller

User's Manual

For Embedded Real time 32-bit Computer

(ERC32)

for SPACE Applications

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

TABLE OF CONTENTS

Page

1.1.

INTRODUCTION ....................................................................................... 4

Scope ......................................................................................................... 4

1.2.

1.2.1.

1.2.2.

Documents................................................................................................. 5

Applicable Documents............................................................................ 5

Reference Documents ............................................................................. 5

1.3.

Glossary..................................................................................................... 6

1.4.

Definitions................................................................................................. 7

Bit Numbering ........................................................................................ 7

Signal Names .......................................................................................... 7

Registers.................................................................................................. 7

1.4.1.

1.4.2.

1.4.3.

2.1.

GENERAL OVERVIEW OF ERC32.......................................................... 8

ERC32 Overview ...................................................................................... 8

3.1.

MEMORY CONTROLLER FUNCTIONS............................................... 10

Data Types............................................................................................... 12

3.2.

Memory Interface .................................................................................... 12

Memory Control Signals....................................................................... 12

RAM ..................................................................................................... 12

Extended RAM................................................................................... 13

Boot PROM .......................................................................................... 14

Extended PROM................................................................................. 14

Exchange Memory ................................................................................ 15

I/O ......................................................................................................... 15

Extended I/O....................................................................................... 17

MEC Memory Map............................................................................... 18

3.2.1.

3.2.2.

3.2.2.1.

3.2.3.

3.2.3.1.

3.2.4.

3.2.5.

3.2.5.1.

3.2.6.

3.3.

3.4.

DMA Interface......................................................................................... 19

Bus Arbiter .............................................................................................. 20

3.5.

Execution Modes..................................................................................... 20

Reset Mode ........................................................................................... 22

Run Mode.............................................................................................. 22

System Halt Mode................................................................................. 22

Power-Down Mode............................................................................... 23

Error Halt Mode.................................................................................... 23

3.5.1.

3.5.2.

3.5.3.

3.5.4.

3.5.5.

3.6.

Wait-State and Timeout Generator.......................................................... 23

3.7.

Memory Access Protection...................................................................... 24

Unimplemented Areas .......................................................................... 24

RAM Write Access Protection.............................................................. 25

Boot PROM Write Protection............................................................... 26

3.7.1.

3.7.2.

3.7.3.

3.8.

3.9.

EDAC...................................................................................................... 27

Check Bit Generator.............................................................................. 28

Syndrome Generator ............................................................................. 29

Syndrome Detector ............................................................................... 30

3.9.1.

3.9.2.

3.9.3.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

3.9.4.

3.9.5.

Fault Injection ....................................................................................... 31

Memory and I/O Parity ......................................................................... 31

Memory Redundancy .............................................................................. 32

Synchronous Traps.................................................................................. 32

Interrupts (Asynchronous Traps)............................................................. 33

General Purpose and Real Time Clock Timers....................................... 36

Watch Dog............................................................................................... 38

UART...................................................................................................... 40

Parity Checking ....................................................................................... 41

Error Handler........................................................................................... 42

System Availability ................................................................................. 47

3.10.

3.11.

3.12.

3.13.

3.14.

3.15.

3.16.

3.17.

3.18.

3.19.

Test mode and Test Access Port.............................................................. 47

EDAC Test............................................................................................ 47

Parity Test ............................................................................................. 47

Interrupt Test......................................................................................... 47

Error Test .............................................................................................. 48

Test Access Port (TAP) ........................................................................ 48

3.19.1.

3.19.2.

3.19.3.

3.19.4.

3.19.5.

3.20.

System Clock........................................................................................... 48

3.21.

3.21.1.

3.21.2.

MEC Registers ........................................................................................ 49

4.1.

MEMORY CONTROLLER SIGNAL DESCRIPTIONS ......................... 63

Memory Controller Signal Summary ...................................................... 63

4.2.

MEC Detailed Signal Descriptions ......................................................... 65

IU/FPU Interface Signals ...................................................................... 65

Memory System Interface Signals ........................................................ 71

Interrupt and Control Signals................................................................ 75

Test Access Port Signals....................................................................... 77

UART Interface..................................................................................... 78

Power and Clock Signals ...................................................................... 79

4.2.1.

4.2.2.

4.2.3.

4.2.4.

4.2.5.

4.2.6.

ELECTRICAL AND MECHANICAL SPECIFICATION........................ 80

5.1.

Maximum Rating and DC Characteristics .............................................. 80

Maximum Ratings................................................................................. 80

Operating Range ................................................................................... 80

DC Characteristics over the Operating Range ...................................... 80

Capacitance Ratings.............................................................................. 81

5.1.1.

5.1.2.

5.1.3.

5.1.4.

5.2.

5.2.1.

5.2.2.

Package Description................................................................................ 81

Pin Assignments.................................................................................... 81

Package Diagram .................................................................................. 82

APPENDIX 1 - TIMING DIAGRAMS

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

1. INTRODUCTION

1.1. Scope

This document constitutes a functional specification of iteration two of the TSC693E

Memory Controller (MEC) which is an element in the ERC32 microprocessor core. It is

intended to function as a User's guide both for the software and hardware developers.

The document is divided into the following sections:

GENERAL OVERVIEW OF ERC32

A short overview of a typical ERC32 based system.

TSC693E MEMORY CONTROLLER FUNCTIONS

Detailed description of the MEC functions including software interface.

TSC693E MEMORY CONTROLLER SIGNAL DESCRIPTIONS

Functional description of MEC signals.

TSC693E ELECTRICAL AND MECHANICAL SPECIFICATION

TIMING DIAGRAMS (APPENDIX 1)

Timing specifications and diagrams.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

1.2. Documents

1.2.1. Applicable Documents

AD1

AD2

AD3

ESA 32-Bit Microprocessor and Computer Development Programme

Statement of Work, WDI/JG/1317/NL, Issue 2.1, 28-05-1991.

Specification for a 32-bit embedded computing core (ERC32),

WDI/JG/1334/NL, Issue 3, 29-05-1991.

32-bit Microprocessor Software Tools Technical Requirements,

WDI/1339/FGM/NL, 05-06-1991.

AD4

ERC32 Technical Specification, MCD/SPC/0001/SE, issue 7, 1 Apr 1994.

Reference Documents

1.2.2.

RD1

RD2

RD3

SPARC Standard Version 7

TSC691E Integer Unit

TSC692E Floating Point Unit User's Manual

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

1.3. Glossary

ASI

ATAC

Applicable Document

Address Space Identifier

Ada TAsking Coprocessor

Chip Select

DMA

EDAC

Direct Memory Access

Error Detection And Correction

EEPROM Electrically Erasable Programmable Read Only Memory

ERC32

EXM

FAR

FPU

I/O

32 bit Embedded Real-time Computing Core

EXchange Memory

Failing Address Register

Floating Point Unit

Input/Output

ICR

IFR

IMR

IPR

Interrupt Clear Register

Interrupt Force Register

Interrupt Mask Register

Interrupt Pending Register

Integer Unit

MEC

PROM

RAM

ROM

RTC

MEmory Controller

Programmable Read Only Memory

Random Access Memory

Reference Document

Read Only Memory

Real Time Clock

SFSRSystem Fault Status Register

Software

TAP

TBC

TBD

UART

Test Access Port

To Be Confirmed

To Be Defined

Universal Asynchronous Receiver Transmitter

Watch Dog

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

1.4. Definitions

1.4.1. Bit Numbering

In this document the following conventions are used:

The most significant bit in a vector has the highest bit number and the leftmost

position in a field.

The least significant bit in a vector has the lowest bit number and the rightmost

position in a field.

1.4.2. Signal Names

The following conventions are used for signal names:

Signal names are written in capital letters, SIGNALNAME.

Active low signals are named, SIGNALNAME*.

1.4.3. Registers

The following convention is used for registers.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

2. GENERAL OVERVIEW OF ERC32

2.1. ERC32 Overview

The objective of the ERC32 is to provide a high performance 32-bit computing core for

on-board embedded real-time computers. The core is characterized by low circuit

complexity and power consumption. Extensive concurrent error detection and support

for fault-tolerance and reconfiguration is emphasized.

In addition to the main objective, the ERC32 core is possible to use for performance

demanding research applications in deep space probes. In addition to the above

characteristics the radiation tolerance and error masking are important. By including

support for reconfigurable of the error handling the different demands from the

applications can be optimized for the best purpose in each case.

The ERC32 is to be used as a building block only requiring memory and application

specific peripherals to be added to form a complete on-board computer. All other system

support functions are provided by the core.

The ERC32 incorporates the followings functions:

Processor, which consists of one Integer Unit: TSC691E (called IU in this

document) and one Floating Point Unit: TSC692E (called FPU in this document).

The processor includes concurrent error detection facilities.

Memory Controller: TSC693E (called MEC in this document), which is a unit

consisting of all necessary support functions such as memory control and

protection, EDAC, wait state generator, timers, interrupt handler, watch dog,

UARTs, and test support. The unit also includes concurrent error detection

facilities.

One or two oscillator(s).

Buffers necessary to interface with memory and peripherals.

Figure 1 schematically shows a basic ERC32 computer with external functions added to

form a complete system.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

Ctrl

Hold

MEC

FPU

Error

Data

Address

Ctrl

ERC32

Check bits

BOOT PROM

RAM

Check bits

I/O

IRQ

ATAC

IRQ

External IRQs

Figure 1 - ERC32 Computer with typical peripherals

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

3. MEMORY CONTROLLER FUNCTIONS

All support functions of the ERC32 except for the local clock/oscillator and address and

data bus drivers (buffers and latches) are incorporated in one single chip memory

controller unit (MEC).

The MEC is designed to interface the IU and the FPU to external memory and I/O units

thus forming a system, with which computers for on-board embedded real-time

applications can be built. In order to achieve this the MEC constitutes all necessary

support and on-chip resources accordingly:

System start up control and reset

Power down mode control

System clock

Watchdog function

Memory interface to RAM ranging from 256 Kbyte to 32 Mbyte

Memory interface to PROM ranging from 128 Kbyte to 4 Mbyte

I/O interface to exchange memory (e.g. DPRAM) ranging from 4 Kbyte to 512

Kbyte.

I/O interface to four peripherals

DMA interface

Bus arbiter

Programmable wait-state generator

Programmable memory access protection

Memory redundancy control

EDAC, with byte and halfword write support

Trap handler including 15-level interrupt controller

One 32-bit general purpose timer with 16-bit scaler

One 32-bit timer with 8-bit scaler (Real-Time-Clock)

UART function with two serial channels

Built-in concurrent error detection including support for master/slave checking of

IU and FPU

System error handler

Parity control on system bus

Test support including a minimal TAP interface

The MEC interfaces directly to the address, data, and control buses of the IU and FPU,

requiring no additional components. It also interfaces directly to external memory and

I/O units only requiring additional buffers for the address and data bus.

The architecture of the MEC is illustrated in Figure 2.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

MEC Architecture

ExtIntack

Errors*

ExtINT(4:0)

Reset*

CLK

CLK2

Syshalt*

Ctrl &

Interrupt &

Cpuhalt*

Support

Error handler

Sysreset*

SysAv / MecErr*

* Internal Interrupt

* External Iterrupt

* Failing Registers

* Error Reset/Halt

* Startup Ctrl

* Reset gen.

* Clock gen.

* Power Down

IRL(3:0)

INTACK

WDCLK

Memctrl

Control

System Bus Interface

MemCS*

ROMCS*

ROMWRT*

Prom8*

Address

decoder

Access

Protect

Access

Control

IOctrl

Busrdy*

IOSel*

Mhold*

MDS*

Buserr*

NoPar*

ExtHOLD*

ExtCCV

EDAC

Config

WaitSt.

Timers

MEXC*

Buffers,

Latches

& Parity

checkers

Bus

Arbiter

DMAREQ*

DMAGNT*

A/Apar

* RTC

* One

ASI/Size/Par

Data/Dpar

General

purpose

AOE/COE/DOE*

Bhold*

IMCtrl/IMpar

TCK

TDI

TDO

TMS

UARTS

Two program-

mable serial

full duplex

channels.

TxA/TxB

RxA/RxB

Test acc.

Port

TRST

Figure 2 - MEC architecture

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

3.1. Data Types

Data type definitions follow the SPARC standard version 7. A byte is 8 bits wide, a

halfword is 16 bits wide, a word is 32 bits wide, and a double word is 64 bits wide.

Organization and addressing of data in memory follow the "Big-Endian" convention

wherein lower addresses contain the high-order bytes. For a stored word, address N

corresponds to the most significant byte and N+3 corresponds to the least significant

byte.

3.2. Memory Interface

3.2.1. Memory Control Signals

The MEC asserts a system address latch enable signal, ALE*, when the IU address or

the DMA address is valid. This signal is asserted once in every memory access cycle.

Four buffer enable signals are provided, RAMBEN*, ROMBEN*, MEMBEN* and

IOBEN*. RAMBEN* is asserted during RAM access. ROMBEN* is asserted during

boot PROM access. MEMBEN* is asserted both during RAM and boot PROM access.

IOBEN* is asserted during I/O, Extended general area and exchange memory access.

DDIR and DDIR* are output by the MEC to indicate buffer direction.

As RAM chip select signals MEMCS*(9:0) are provided. The boot PROM chip select

signal is ROMCS*. Four I/O device chip select signals are provided, IOSEL(3:0).

EXMCS* is used as chip select signal for exchange memory.

For RAM and boot PROM write access two strobe pairs are provided, MEMWR1*(1:0)

and MEMWR2*(1:0). MEMWR1* is used to strobe data, D(31:0) into memory.

MEMWR2* is used to strobe check bits, CB(6:0) and parity, DPARIO, into memory.

For I/O and exchange memory write access the IOWR* strobe is provided.

As output enable to memory during read access, OE*(1:0) is provided.

BUSRDY* is used to control access cycle length when accessing I/O, exchange memory

and extended areas.

BUSERR* is used to signal erroneous access to the MEC when accessing I/O, exchange

memory and extended areas.

3.2.2. RAM

The MEC is reprogrammable to interface with a number of different RAM sizes and

organisations. The table below shows all possible memory sizes and organisations:

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

Table 1 - Memory sizes and organizations, using 8-bit wide memory-chips

RAM Size Chip org.

8 CS used =

Chip org.

4 CS used =

16 (+ 4) chips

Chip org.

2 CS used =

8 (+ 2) chips

Chip org.

1 CS used =

4 (+ 1) chips

32 (+ 8) chips

8k chips

16k chips

32k chips

64k chips

128k chips

256k chips

512k chips

1M chips

2M chips

32k chips

64k chips

128k chips

256k chips

512k chips

1M chips

2M chips

4M chips

64k chips

128k chips

256k chips

512k chips

1M chips

2M chips

4M chips

8M chips

256 Kbyte

512 Kbyte

1 Mbyte

2 Mbyte

4 Mbyte

8 Mbyte

16 Mbyte

32 Mbyte

16k chips

32k chips

64k chips

128k chips

256k chips

512k chips

1M chips

Selection of RAM size is performed by programming the Memory Configuration

It is possible to divide the selected RAM size into one, two, four, or eight equally sized

memory blocks by programming the Memory Configuration Register. The default value

after system reset is one block. A memory block is a block composed of 32-bit data,

parity bit, and 7-bit check code and controlled with one chip select signal.

The MEC provides eight RAM memory chip selects. One, two, four, or eight chip

selects are possible to use corresponding to the programmed number of memory blocks.

The default value after system reset is one chip select. The MEC also provides two

additional RAM chip selects to handle memory redundancy. See paragraph 3.10.

In the RAM area a store subword (byte or half-word) is implemented as a read-modify-

write since check bits must be generated over the whole word, see Figure 3 below.

CLK2

CLK

A (31:0)

Store Address

IU drives byte store data

MEC loads whole word MEC drives new word

Old checkbits MEC drives new checkword

D (31:0),DPARIO

CB(6:0)

Figure 3 - RAM Store Subword sequence

3.2.2.1. Extended RAM

In addition to the nominal RAM area, an extended RAM area is reserved in the MEC

memory map. The MEC does not provide any chip select signals for the extended RAM

area, i.e. address decoding must be implemented with external logic. The extended

RAM area is BUSRDY* controlled with the same number of waitstates as the RAM

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

area. In addition, one extra clock cycle is always introduced in the beginning of the cycle

for the external address decoding. Byte, halfword and word access is allowed.

3.2.3. Boot PROM

The MEC allows software to be executed from a single byte-wide PROM. Alternatively,

a full wide EDAC protected (40 bits) PROM can be used. Hereafter this start-up PROM

is called boot PROM.

One extra clock cycle is always introduced in the beginning of the cycle for the address

decoding. The IU supports byte operations on data, but for instruction fetches it needs a

full 32 bit wide word. In the case that byte-wide boot PROM is used (selected by

asserting the PROM8* input pin of the MEC), the MEC performs an 8 to 32 bit

conversion of the boot PROM data during read access. This means that a word access to

byte-wide boot PROM will correspond to four byte fetches. The total number of cycles

required for each word read will then be equal to 4*(1+ no. of boot PROM

waitstates)+2.

When 32-bit wide PROM is used both EDAC and parity bits must be supplied to the

MEC.

During read operations, byte, halfword and word access is allowed. If the boot PROM is

based on EEPROM devices, the MEC supports write access, but note that only byte

write is supported if byte-wide EEPROM is used. The write access possibility is enabled

by asserting the Prom Write Control signal (ROMWRT*).

The following sizes of the boot PROM are allowed: 128 Kbytes, 256 Kbytes,

512 Kbytes, 1 Mbytes, 2 Mbytes, 4 Mbytes, 8 Mbytes and 16 Mbytes. Selection of

PROM size is to be performed by programming the Memory Configuration Register

(see page 51). The default size of the boot PROM after system reset is the minimum

size, 128 Kbytes. The MEC provides one PROM chip select output.

3.2.3.1. Extended PROM

In addition to the boot PROM area, an extended PROM area is reserved in the MEC

memory map. The MEC does not provide any chip select signals for the extended

PROM area, i.e. address decoding must be implemented with external logic. The

extended PROM area is BUSRDY* controlled with the same number of waitstates as

the boot PROM area. In addition, one extra clock cycle is always introduced in the

beginning of the cycle for the external address decoding. The number of cycles is

however always at least two even if the PROM area waitstate value has been

programmed to zero. The same restrictions as for boot PROM apply regarding data

width and write access.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

3.2.4. Exchange Memory

The MEC supports a dedicated exchange memory area that can be used for system bus

interchange of data.

The following sizes of the exchange memory are allowed: 4 Kbytes, 8 Kbytes,

16 Kbytes, 32 Kbytes, 64 Kbytes, 128 Kbytes, 256 Kbytes, and 512 Kbytes. Selection of

exchange memory size is done by programming the Memory Configuration Register

(see page 52). The default value of the exchange memory size after system reset is the

minimum size, 4 Kbytes. The MEC provides one exchange memory chip select output.

Only word access is allowed in the exchange memory area. Any attempt to access byte

or halfword data in the exchange memory will cause a memory exception.

In case the exchange memory includes EDAC check bits and parity bits, these protection

bits will be treated in the same manner as for the main memory. If the exchange memory

does not include any check bits, the MEC will generate the parity to the IU. The default

is that no EDAC or parity is implemented in the exchange memory. If the exchange

memory implements check bits, this must be defined in the Memory Configuration

The MEC is designed to allow implementation of the exchange memory with a

DPRAM. The BUSY signal from the DPRAM can then be connected to the BUSRDY*

signal of the MEC. The MEC waits one cycle at the start of the access for the assertion

of the BUSRDY* signal. If the BUSRDY* signal is asserted in the beginning of the

second cycle, the normal data wait-state controlled access continues. If the BUSRDY*

signal is deasserted during the wait-states, the MEC will delay the access until the

BUSRDY* signal has been asserted and then continue with the normal data wait-state

controlled access. If a cycle is prolonged to more than 256 clock cycles, the Bus

Timeout function will signal a system bus error.

The minimum length of an exchange memory access is three clock cycles.

3.2.5. I/O

Four address decoded I/O select outputs are provided in the MEC.

The minimum length of an I/O access for each I/O select is programmable in the MEC.

The BUSRDY* signal is used to prolong I/O access for devices with variable access

time. The BUSERR* signal is used to signal to the MEC that a bus error has occurred.

Table 2 gives the encoding for the system bus transaction response signals. The

transactions that signal a system bus error, set the corresponding bit in the System Fault

Status Register (SFSR) of the MEC, which then responds by asserting Error to the

interrupt logic. These bits describe system bus error cases, in addition the bus timeout is

set if the internal bus time out timer causes abortion.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

Table 2 - Bus Transaction Response Signals

BUSERR* BUSRDY* Action

Nothing (not ready)

Data Strobe (ready)

Nothing (not ready)

System Bus Error

* denotes an active low signal

An I/O cycle which is to be extended beyond that of the number of wait-states set in the

MEC for the corresponding I/O select output, requires that the BUSRDY* signal is

deasserted as input to the MEC. The BUSRDY* signal must be deasserted no later than

the number of system clock cycles equal to the wait-states set in the MEC after start of

the access.

The actual length of an IO cycle will equal the number of programmed waitstates,

possibly extended a number of clock cycles by deassertion of the BUSRDY* signal. If a

cycle is prolonged to more than 256 clock cycles, the Bus Timeout function will signal a

system bus error. As the BUSRDY* signal is used to extend the IO cycle, one waitstate

is minimum for I/O access. Programming the no. of IO waitstates to zero will have no

effect, i.e. one waitstate is inserted anyway.

Each I/O unit is enabled by programming the I/O Configuration Register (see page

54). The default value after system reset is no I/O unit enabled.

Each of the four I/O units is programmable to following sizes: 512 bytes, 1 Kbyte, 2

Kbytes, 4 Kbytes, 8 Kbytes, 16 Kbytes, 32 Kbytes, 64 Kbytes, 128 Kbytes, 256 Kbytes,

512 Kbytes, 1 Mbyte, 2 Mbytes, 4 Mbytes, 8 Mbytes, 16 Mbytes.

Selection of each individual I/O unit size is performed by programming the I/O

Configuration Register (see page 54). The default value after system reset is 512 bytes

for all units.

In case the I/O unit includes a parity bit, the parity will be treated in the same manner as

for the main memory. If the I/O unit does not include parity, the MEC will generate

parity to the IU. The I/O Configuration Register (see page 54) is used to determine for

each individual I/O unit if the MEC shall use parity checking and generation. The

default is no parity is implemented for the I/O units.

Since the I/O unit never includes EDAC check bits, the store subword (half-word or

byte) instruction in the I/O area is different from the store subword in the RAM area. In

the RAM area a store subword is implemented as a read-modify-write since check bits

must be generated over the whole word. In the I/O area a store subword is implemented

as a store word from a timing point of view, but the subword (byte or halfword) is

repeated by the IU on the other subwords in the full word, see Figure 4.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

DATA BIT

SAME DATA AS ON BITS

(7:0)

SAME DATA AS ON BITS

(7:0)

SAME DATA AS ON BITS

(7:0)

STORE BYTE

IU DATA

STORE HALF-WORD

SAME DATA AS ON BITS (15:0)

IU DATA

Figure 4 - Store Subword Data Layout

3.2.5.1. Extended I/O

In addition to the nominal I/O area, an extended I/O area is reserved in the MEC

memory map. The MEC does not provide any chip select signals for the extended I(O

area, i.e. address decoding must be implemented with external logic. The extended I/O

area is BUSRDY* controlled with the same number of waitstates as the nominal I/O

area. The number of waitstates is however always at least one even if the I/O area

waitstate value has been programmed to zero. The same no. of waitstates and parity

option as for I/O area 3 apply.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

3.2.6. MEC Memory Map

The MEC memory map is shown in Table 3.

Table 3 - MEC Memory map

Address

(hexadecimal)

Memory contents

Size (Bytes)

128k - 16M

Data size and parity

options

0x00000000

Boot PROM

* 8-bit mode

8 to 32 bit conversion

No parity

Only byte write

* 40-bit mode

Parity+EDAC mandatory

Only word write

The same settings as for

Boot PROM

Parity/EDAC options

Only word accesses

Parity only

0x01000000

0x01F00000

0x01F80000

Extended PROM area

15M

BUSRDY* controlled

Exchange memory

BUSRDY* controlled

MEC Registers

4k - 512k

512k (136 used)

Word write and Word/

Hword/ Byte read

Parity/EDAC options

All data sizes allowed

The same settings as for

RAM Memory

0x02000000

0x04000000

0x10000000

RAM Memory

(8 blocks)

Extended RAM area

BUSRDY* controlled

I/O area 0

8 * 32k - 8 * 4M

192M

0 - 16M

Parity option

All data sizes allowed

As above

The same settings as for

I/O area 3

0x11000000

0x12000000

0x13000000

0x14000000

I/O area 1

I/O area 2

I/O area 3

Extended I/O area

BUSRDY* controlled

0 - 16M

1728M

0x80000000

Extended general area

BUSRDY* controlled

No parity/EDAC

All data sizes allowed

1) Neither access protection nor chip select generation is performed by the MEC for the

extended areas. Note that these areas are only controlled by the BUSRDY* signal.

In the I/O areas and in the Extended areas one waitstate is always inserted, since the

MEC has to wait for the BUSRDY* signal. In the Exchange Memory area two

waitstates are always inserted to wait for the BUSRDY* signal. In the I/O areas and in

the Extended areas the BUSRDY* signal works as a ready signal to tell the accessing

unit that data is ready. In the Exchange Memory area the BUSRDY* signal works as a

busy signal to tell the accessing unit that the access can not yet start.

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3.3. DMA Interface

The MEC supports Direct Memory Access (DMA). The DMA unit requests access to

the processor bus by asserting the DMA request signal, DMAREQ*. When the DMA

unit receives the DMAGNT* signal in response, the processor bus is granted. In case the

processor is in the power down mode the IU is permanent three-stated, and a

DMAREQ* will directly give a DMAGNT*. The detailed timing for DMA accesses is

defined in Appendix A.

It is possible to enable/disable DMA access to the system bus by programming the

MEC Control Register (see page 51). The default status after system reset is DMA

enabled (i.e. permitted).

If DMA is enabled, the MEC asserts BHOLD* and deasserts AOE*, COE*, and DOE*

following an DMA Request and then asserts DMA Grant.

A memory cycle started by the processor is not interrupted by a DMA access before it is

finished. The following signals shall be used by the DMA unit during the access:

DMAREQ* to be generated by the DMA unit asking for access

DMAGNT* generated by the MEC when DMA access is granted

SYSCLK from the MEC to be used as synchronizing clock

A[31:0], ASI[3:0] address and SIZE[1:0], WRT, WE*, RD, DXFER,

LDSTO, LOCK to be generated by the DMA unit.

SIZE0 and SIZE1, to be driven by the DMA during DMA transfers. Note

that only word transfers are allowed in DMA mode, which means that the

values of the size bits must always be driven to SIZE0 = 0 and SIZE1 = 1

in DMA mode.

APAR, ASPAR and IMPAR parity bits, to be generated by the DMA unit

in case parity is enabled for the DMA

D[31:0] data generated by the DMA unit in case of write cycle or fetched

by the DMA unit during read cycle

DPARIO, data parity, to be generated and possibly checked by the DMA

unit in case parity is enabled for the DMA

DMAAS line used for address strobe to be generated by the DMA unit

when the address is valid. Assertion of this signal will initiate the memory

access.

DRDY* line used for indicating data ready for the DMA unit or data

written on write. It is generated by the MEC

MEXC* generated by the MEC indicating a memory access exception

when no valid data can be supplied from the memory system, e.g. access

violation or error.

If no subsequent DMA cycles are to be issued the DMA unit shall remove the

DMAREQ* signal as soon as it has fetched the data on read after that it has received

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DRDY*, or when DRDY* is removed on write. The MEC will then remove the

DMAGNT* signal.

It is possible to enable/disable DMA parity by programming the MEC Control

disabled. If DMA parity is enabled it has to be generated during write and possibly

checked by the DMA during read. If DMA parity is not enabled the MEC generates the

parity bit to be stored in the memory in case of write accesses.

Memory access protection is active also during DMA, i.e. attempted write access to

protected memory segments will lead to a memory exception, depending on how the

ASI bits are driven by the DMA unit (user or supervisor mode).

Normally, the same restrictions apply to DMA access of MEC registers as for the IU in

User mode, see page 49. However during system halt (i.e. CPUHALT signal active), the

DMA has the same access rights as the IU in supervisor mode for MEC register access.

With register write access, memory protection could be changed to permit DMA to

access all areas.

The MEC includes a DMA session timeout function preventing the DMA unit to

lockout the IU/FPU by asserting DMAREQ* for a long time. If the DMA Request input

is not deasserted within 1024 system clock cycles after the assertion of DMA Grant, the

memory exception output is asserted and the DMA Grant is removed. The DMA session

timeout function is possible to enable or disable by programming the MEC Control

Note that the DMA session timeout function is not the same as a bus timeout, rather an

session scheme timeout. In case of a bus timeout during DMA, the MEC asserts the

Memory Exception output and removes the Bus Grant. For further actions taken see

paragraph 3.17.

3.4. Bus Arbiter

The IU and the FPU always have the lowest priority to the system bus and are denied

access to memory in case of a request from a DMA unit, unless the IU is performing a

locked access or after a DMA exception cycle to allow interrupt handling.

Thus the DMA is granted access to the system bus provided this has been enabled by the

IU in the MEC. In other words the IU has the capability to prevent DMA accesses by

disabling DMA in the MEC.

3.5. Execution Modes

The execution modes of the ERC32 as controlled by the MEC is shown in Figure 5.

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ERROR

HALT

System Reset

RESET

a n d

DMA

(RUN)

H A L T s e l e c t e d

E r r o r d e t e c t e d

SYSTEM

HALT

SYSTEM

HALT

SYSTEM

HALT

DMA

(Power down)

RUN

SYSTEM

HALT

POWER

DOWN

1) System halt mode is entered upon

assertion of SYSHALT* and exited

when SYSHALT* is deasserted.

Figure 5 - ERC32 Execution Modes

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3.5.1. Reset Mode

When the SYSRES* input is asserted, the MEC issues a reset of itself and asserts the

RESET* output which is intended be used as reset signal to all other components in the

system (e.g. IU and FPU). The SYSRES* signal shall be applied for at least four clock

cycles.

After the assertion of SYSRES*, the MEC starts the ERC32 system in the reset mode

which means that all MEC registers will be initialized to their reset contents.

The reset signal from the MEC to the IU/FPU etc., RESET*, is minimum 16 clock

cycles long, i.e. it will remain asserted 16 system clock cycles after SYSRES* has been

deasserted.

Reset mode is also entered when the RESET* output of the MEC is asserted from any

other reason than SYSRES* :

Software reset which is caused by the software writing to a Software Reset

Watchdog reset which is caused by a Watchdog counter timeout (see paragraph

3.14.)

Error reset which is caused by a hardware parity error, EDAC uncorrectable error

or a comparison error (see paragraph 3.17.)

When the reset cause is one of the above, all MEC registers will be initialized to their

reset contents except the Error and Reset Status Register (see page 61) which

contains the source of the last processor reset (System reset, software reset, error reset,

watch dog reset). By reading that register upon reset, the IU can determine the cause of

the reset.

3.5.2. Run Mode

In this mode the IU/FPU is executing, all timers of the MEC are running (if software

enabled) and the UART is running.

3.5.3. System Halt Mode

System Halt mode is entered when the SYSHALT* input of the MEC is asserted. The

CPUHALT* output is asserted, freezing IU/FPU execution. All timers are halted and the

UART operation is stopped.

The MEC allows DMA accesses during system halt mode, in which DMA has

permanent access to the system, i.e. DMAGNT* is asserted immediately on DMA

request.

When SYSHALT* is deasserted, the previous mode is entered.

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3.5.4. Power-Down Mode

This mode is entered by writing to the Power Down Register (see page 52) in the MEC,

which will cause the MEC bus arbiter to remove the bus ownership from the IU. The

entering of power-down mode must first permitted by programming the MEC Control

In power-down mode the MEC asserts and maintains the BHOLD* and deasserts and

maintains the AOE*, COE*, and DOE* output signals. If an external interrupt is

asserted whilst being in power down mode the MEC deasserts the BHOLD* and asserts

the AOE*, COE*, and DOE* output signals. And thereafter ensures that all data at all

inputs to the IU/FPU are the same as it was before BHOLD* was asserted. The IU gets

back the bus ownership and the MEC leaves the power-down mode.

The MEC allows DMA accesses during power-down mode, in which DMA has

permanent access to the system, i.e. DMAGNT* is asserted immediately on DMA

request.

3.5.5. Error Halt Mode

Error Halt mode is entered under the following circumstances:

A hardware parity error, EDAC uncorrectable error or a comparison error (see

paragraph 3.17.) has occurred.

The IU enters error mode (by asserting the ERROR* output)

In Error Halt mode, the CPUHALT* and SYSERR* outputs of the MEC are asserted

(note that SYSERR* is also asserted if a masked error occurs even though Error Halt

mode is not entered in this case). All timers are halted and the UART operation is

stopped in this mode. The only way to exit Error Halt Mode is through Cold Reset by

asserting SYSRES*.

The MEC allows DMA accesses during error halt mode, in which DMA has permanent

access to the system, i.e. DMAGNT* is asserted immediately on DMA request.

Error Halt Mode can be induced by software by first setting the EWE bit in the Test

Control Register (see page 61) and then write an error to the Error and Reset Status

the chosen error is set to halt in the MEC Control Register.

3.6. Wait-State and Timeout Generator

It is possible to control the wait state generation by programming a Waitstate

Configuration Register (see page 55) in the MEC. The maximum programmable

number of wait-states is applied as default at reset.

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It is possible to program the number of wait states for the following combinations:

RAM read

RAM write

PROM read

PROM write (i.e. EEPROM write)

ExM read/write (i.e. Exchange memory read/write)

Four individual I/O peripherals read/write

The MEC supports wait state generation by asserting the MHOLD* output in the second

memory access cycle.

On exchange memory accesses the MEC will sense the bus ready signal (BUSRDY*)

after the first two cycles of the access. If the bus ready signal is asserted at this time the

MEC will continue with the programmed no. of wait states. However, if the bus ready

signal is deasserted, the start of the access is put on hold. Once the bus ready signal is

asserted again, the access will start with the programmed no. of waitstates.

On I/O and extended area accesses the MEC will sense the bus ready signal

(BUSRDY*) after the first cycle of the access. If the bus ready signal is asserted at this

time the MEC will continue with the programmed no. of wait states. If the bus ready

signal is deasserted at this time, the MEC will introduce wait states until the bus ready

signal is again asserted.

Note the difference between wait state handling for exchange memory and wait state

handling for I/O. For exchange memory, the access will start when BUSRDY* is

asserted, i.e. after BUSRDY* is asserted an access with the programmed no. of wait

states will be performed. BUSRDY* is then handled as for the I/O and extended area.

On the other hand, during I/O and extended area access, assertion of BUSRDY* signals

the end of the access, i.e. the access will finish one cycle after BUSRDY* has been

asserted (at the earliest after the programmed no. of wait states).

A bus timeout function of 256 or 1024 system clock cycles is provided for the bus ready

controlled memory areas, 256 system clocks in the Extended RAM, Extended General

and Extended I/O areas and 1024 system clocks in the Extended PROM area. The MEC

Control Register (see page 51) is used to select this function. The default after system

reset is that the bus timeout function is enabled.

The bus timeout counter will start when the access is initiated. If the bus ready signal is

not asserted before a valid number of system clock cycles, a memory exception will

occur. For further actions taken see paragraph 3.17.

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3.7. Memory Access Protection

3.7.1. Unimplemented Areas

Accesses to all unimplemented memory areas are handled by the MEC and detected as

illegal, according to Table 3 (page 18). The memory and I/O configuration registers

define the size of memory and I/O areas. The unused area of the memory space,

dependent on the programming of the memory size, is decoded as illegal.

If an access from the IU is attempted to an illegal area, the memory exception output is

asserted. If an access from the DMA is attempted to an illegal area, the memory

exception output (MEXC*) and the DMA access error interrupt output are asserted.

For the extended areas no access protection is implemented. However, since these areas

are bus ready( BUSRDY*) controlled the bus timeout function will detect an access to

an unimplemented extended area.

When the IU issues the trap service routine, the contents of the MEC System Fault

Status Register (SFSR) give the cause of the exception.

When a memory data access violation error occurs (RAM write protection or illegal

area) the associated bus address is latched in a separate register, MEC Failing Address

instruction fetch error will not latch the bus address.

For further actions taken see paragraph 3.17.

3.7.2. RAM Write Access Protection

In addition to the access protection defined by the fixed memory map in the MEC which

will detect any access to unimplemented and illegal addresses, the MEC can be

programmed to detect and mask write accesses in any part of the RAM. The protection

scheme is enabled only for data area, not for the instruction area.

The programmable write access protection is segment based. A segment defines an area

where write cycles are allowed. Any write cycle outside a segment is trapped and does

not change the memory contents. Two segments are implemented. Each segment is

implemented with two registers: the Segment Base Register and the Segment End

enabling bits for supervisor/user mode (SE/UE). The segment end register contains the

first address outside the segment, i.e. last address of segment plus one word. Only word

aligned addresses are supported. The segments are only active during RAM access, i.e.

they can only be mapped to the RAM area.

If both the SE and UE bits of the Segment Base Register are cleared, write protection is

effectively disabled for that segment.

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The segment access protection can also be used as a block protect function by setting the

BP bit in the MEC Control Register. The BP bit inverts the address criterion for the

protection function so that any access within the segment is detected.

If a write access protection error is detected a memory exception is generated and the

SFSR and Failing Address Register is updated as for unimplemented area accesses,

see also paragraph 3.17.

In normal mode, (BP=0), a memory exception is generated only if both segments

indicated a write protection error. In block protect mode (BP=1), a memory exception is

generated if any of the segments indicate a write protection error.

3.7.3. Boot PROM Write Protection

The MEC supports PROM write only when it is qualified by the external enable signal

ROMWRT and the enable bit in the Memory Configuration Register (see page 52).

The MEC only supports byte write operations for an 8-bit wide PROM and only word

write operations for a 40-bit wide PROM.

If a write access to PROM is attempted when any of the above conditions are not

fulfilled, the SFSR and Failing Address Register is updated as for unimplemented area

accesses, see also paragraph 3.17.

3.8. Register Access Protection

All MEC registers except the UART RX and TX registers are readable in all access

modes: user, supervisor, and DMA. The UART RX and TX registers are only readable

in supervisor mode. The MEC allows word, halfword and byte accesses when a register

is read. The total 32-bit data (together with the parity bit) are thus always issued on the

data bus.

All MEC registers which are writeable, are writeable only in supervisor mode or in

DMA mode if the CPUHALT* is active and only as full 32-bit size data write accesses

to the registers.

If a register access violation is performed by the IU, the memory exception output is

asserted. If a register access violation is performed by the DMA, the memory exception

output (MEXC*) and the DMA access error interrupt output are asserted.

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3.9. EDAC

The MEC includes a 32-bit EDAC (Error Detection And Correction). Seven bits

(CB[6:0]) are used as check bits over the data bus. The Data Bus Parity Input/Output

signal (DPARIO) is used to check and generate the odd parity over the 32-bit data bus.

This means that altogether 40 bits are used when the EDAC is enabled.

The MEC EDAC uses a seven bit Hamming code which detects any double bit error on

the 40-bit bus as a non-correctable error. In addition, the EDAC detects all bits stuck-at-

one and stuck-at-zero failure for any nibble¹in the data word as a non-correctable error.

Stuck-at-one and stuck-at-zero for all 32 bits of the data word is also detected as a non-

correctable error.

The EDAC corrects any single bit data error on the 40-bit bus. However, in order to

correct any error in memory (e.g. Single Event Upset induced) the data has to be read

and re-written by software as the MEC does not automatically write back the corrected

data.

A nibble is defined as a bit group of four within the data word, D(3:0), D(7:4) etc.

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3.9.1. Check Bit Generator

The Check Bit Generator generates the seven check bits plus parity bit that is to be fed

to a multiplexer. The output from the multiplexer is either the check bits generated by

the Check Bit Generator or the contents of the check bits in the Test Control register.

(CB = checkbit, DPARIO = parity bit)

CB0 =

CB1 =

CB2 =

CB3 =

CB4 =

CB5 =

CB6 =

D31 xor D30 xor D29 xor D28 xor D24 xor D21 xor D20 xor D19 xor

D15 xor D11 xor D10 xor D09 xor D08 xor D05 xor D04 xor D01

D30 xor D28 xor D25 xor D24 xor D20 xor D17 xor D16 xor D15 xor

D13 xor D12 xor D09 xor D08 xor D07 xor D06 xor D04 xor D03

not (D31 xor D26 xor D22 xor D19 xor D18 xor D16 xor D15 xor D14 xor

D10 xor D08 xor D06 xor D05 xor D04 xor D03 xor D02 xor D01)

D31 xor D30 xor D27 xor D23 xor D22 xor D19 xor D15 xor D14 xor

D13 xor D12 xor D10 xor D09 xor D08 xor D07 xor D04 xor D00

not (D30 xor D29 xor D27 xor D26 xor D25 xor D24 xor D21 xor D19 xor

D17 xor D12 xor D10 xor D09 xor D04 xor D03 xor D02 xor D00)

D31 xor D26 xor D25 xor D23 xor D21 xor D20 xor D18 xor D14 xor

D13 xor D11 xor D10 xor D09 xor D08 xor D06 xor D05 xor D00

D31 xor D30 xor D29 xor D28 xor D27 xor D23 xor D22 xor D19 xor

D18 xor D17 xor D16 xor D15 xor D11 xor D07 xor D02 xor D01

DPARIO = Odd parity over D31 to D0 = not (D31 xor D30 xor .... xor D01 xor D00)

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3.9.2. Syndrome Generator

The Syndrome Generator generates the internally used and externally observable

syndrome bits (SY(7:0)). It uses the read data bits and the eight read check bits.

The coding of the syndrome is given below:

SY7 =

CB6(Read Data) xor CB5(Read Data) xor not(CB4(Read Data)) xor

CB3(Read Data) xor not(CB2(Read Data)) xor CB1(Read Data) xor

CB0(Read Data) xor Read Parity

SY6 =

SY5 =

SY4 =

SY3 =

SY2 =

SY1 =

SY0 =

CB6(Read Data) xor Read Checkbit6

CB5(Read Data) xor Read Checkbit5

CB4(Read Data) xor Read Checkbit4

CB3(Read Data) xor Read Checkbit3

CB2(Read Data) xor Read Checkbit2

CB1(Read Data) xor Read Checkbit1

CB0(Read Data) xor Read Checkbit0

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3.9.3. Syndrome Detector

If there is a correctable error in the read data word, the correction is performed

according to the following procedure:

In case of Syndrome(7:0)

when "00111000" => Corrected Data = Data xor "000000000000000000000000000000001"

when "01000101" => Corrected Data = Data xor "000000000000000000000000000000010"

when "01010100" => Corrected Data = Data xor "000000000000000000000000000000100"

when "00010110" => Corrected Data = Data xor "000000000000000000000000000001000"

when "00011111" => Corrected Data = Data xor "000000000000000000000000000010000"

when "00100101" => Corrected Data = Data xor "000000000000000000000000000100000"

when "00100110" => Corrected Data = Data xor "000000000000000000000000001000000"

when "01001010" => Corrected Data = Data xor "000000000000000000000000010000000"

when "00101111" => Corrected Data = Data xor "000000000000000000000000100000000"

when "00111011" => Corrected Data = Data xor "000000000000000000000001000000000"

when "00111101" => Corrected Data = Data xor "000000000000000000000010000000000"

when "01100001" => Corrected Data = Data xor "000000000000000000000100000000000"

when "00011010" => Corrected Data = Data xor "000000000000000000001000000000000"

when "00101010" => Corrected Data = Data xor "000000000000000000010000000000000"

when "00101100" => Corrected Data = Data xor "000000000000000000100000000000000"

when "01001111" => Corrected Data = Data xor "000000000000000001000000000000000"

when "01000110" => Corrected Data = Data xor "000000000000000010000000000000000"

when "01010010" => Corrected Data = Data xor "000000000000000100000000000000000"

when "01100100" => Corrected Data = Data xor "000000000000001000000000000000000"

when "01011101" => Corrected Data = Data xor "000000000000010000000000000000000"

when "00100011" => Corrected Data = Data xor "000000000000100000000000000000000"

when "00110001" => Corrected Data = Data xor "000000000001000000000000000000000"

when "01001100" => Corrected Data = Data xor "000000000010000000000000000000000"

when "01101000" => Corrected Data = Data xor "000000000100000000000000000000000"

when "00010011" => Corrected Data = Data xor "000000001000000000000000000000000"

when "00110010" => Corrected Data = Data xor "000000010000000000000000000000000"

when "00110100" => Corrected Data = Data xor "000000100000000000000000000000000"

when "01011000" => Corrected Data = Data xor "000001000000000000000000000000000"

when "01000011" => Corrected Data = Data xor "000010000000000000000000000000000"

when "01010001" => Corrected Data = Data xor "000100000000000000000000000000000"

when "01011011" => Corrected Data = Data xor "001000000000000000000000000000000"

when "01101101" => Corrected Data = Data xor "010000000000000000000000000000000"

when "00000000" => Corrected Data = Data xor "100000000000000000000000000000000"

when "10000000" => Corrected Data = Data xor "000000000000000000000000000000000" (no error)

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A correctable error is detected if

Syndrome(7:0) = "00111000" | "01000101" | "01010100" | "00010110" | "00011111"

| "00100101" | "00100110" | "01001010" | "00101111" | "00111011"

| "00111101" | "01100001" | "00011010" | "00101010" | "00101100"

| "01001111" | "01000110" | "01010010" | "01100100" | "01011101"

| "00100011" | "00110001" | "01001100" | "01101000" | "00010011"

| "00110010" | "00110100" | "01011000" | "01000011" | "01010001"

| "01011011" | "01101101" | "00000000" | "10000001" | "10000010"

| "10000100" | "10001000" | "10010000" | "10100000" | "11000000".

The non correctable error is detected if

Syndrome(7:0) are not equal to "00111000" | "01000101" | "01010100" | "00010110"

| "00100101" | "00100110" | "01001010" | "00101111" | "00111011"

| "00111101" | "01100001" | "00011010" | "00101010" | "00101100"

| "01001111" | "01000110" | "01010010" | "01100100" | "01011101"

| "00100011" | "00110001" | "01001100" | "01101000" | "00010011"

| "00110010" | "00110100" | "01011000" | "01000011" | "01010001"

| "01011011" | "01101101" | "00000000" | "10000001" | "10000010"

| "10000100" | "10001000" | "10010000" | "10100000" | "11000000"

| "10000000" | "00011111".

3.9.4. Fault Injection

Moved to paragraph 3.19.

3.9.5. Memory and I/O Parity

The MEC handles parity towards memory and I/O in a special way. The MEC can be

programmed to use no parity, only parity or parity and EDAC protection towards

memory. Towards I/O, the MEC can be programmed to use no parity or only parity.

The signal used for the parity bit is DPARIO. This pin is used by the MEC to check and

generate the odd parity over the 32-bit data bus according to Table 4 below.

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Table 4 - MEC parity handling

Accessed memory area

Memory

Read Write

parity enabled

RAM and exchange memory

ROM, 8-bit access

ROM, 40-bit access

MEC registers

IO areas

Extended general area

DMA access with DMA parity enabled

DMA access with DMA parity disabled

Yes

G = parity generated, C = parity checked, N= parity not checked nor generated

Note: When a correctable error occurs in the RAM or exchange memory

MEC generates parity (G) even if parity is enabled.

3.10. Memory Redundancy

The MEC dedicates chip selects for two redundant memory banks for replacement of

faulty banks. A memory bank is a block composed of 32-bit data, parity and a 7-bit

checkcode and controlled with one chip select signal. The size of the redundant memory

banks are dependent of the memory size register.

Exclusion of a faulty memory block and selection of a redundant memory block is

performed by programming the Memory Configuration Register (see page 52). This

remapping has no influence on the performance.

3.11. Synchronous Traps

Memory access error are signaled by the MEC by assertion of the MEXC* signal. This

event will force the IU to vector to either an instruction access exception or a data

access exception, see [RD2].

Upon detecting an instruction or data exception, the IU enters the corresponding trap.

The trap handler software can identify the synchronous fault with the aid from the Error

Handler functions included in the MEC (see paragraph 3.17.).

The MEC is capable of handling 9 different fault events which all will result in a

synchronous trap of the type instruction access exception or data access exception in the

IU by assertion of the MEXC* signal.

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Parity error on control bus

This occurs if the MEC detects a parity error on the external control bus.

Parity error on the data bus

This trap occurs if the MEC detects a parity error on the external data bus.

Parity error on address bus

This trap occurs if the MEC detects a parity error on the external address bus.

Access to protected area

This trap occurs if any addressing device performs an access which does not

match the memory protection scheme.

Access to unimplemented area

This trap occurs if any addressing device performs an access with invalid address

to an unimplemented area.

MEC register access violation

This trap occurs if an illegal access is attempted to an internal MEC register.

Uncorrectable error in memory

The trap occurs if the EDAC detects a non-correctable error.

Bus time-out

This trap occurs if the ready generation times out i.e. if, during a BUSRDY*

controlled access, BUSRDY* is not asserted within 256 clock cycles.

System bus error

This trap occurs if the Bus error (BUSERR*) input is asserted.

3.12. Interrupts (Asynchronous Traps)

The MEC handles 15 different events corresponding to asynchronous traps.

The MEC allocates each specific interrupt to an interrupt level. The interrupt allocation

is in accordance with the scheme in Table 5 (page 35).

The following interrupts, representing asynchronous traps, asserts the Interrupt Request

Level (IRL) inputs of the processor:

Watch Dog time-out

This interrupt occurs if the watchdog timer times out.

DMA time-out

This interrupt occurs if the DMA session exceeds permitted time.

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DMA access error

This interrupt occurs if the DMA performs an access violation or illegal access.

UART error

This interrupt is generated by the UARTs if an error is detected.

UART A and B Data Ready or Transmitter Ready

These interrupts are generated by the UARTs each time a data word has been

correctly received and each time a data word has been sent.

Real Time Clock

This interrupt is issued by the real time clock timer tick.

General purpose timer

This interrupt is issued by the general purpose timer.

Correctable error in memory

This interrupt occurs if the EDAC detects and corrects an error.

Masked Hardware Errors

This occurs when there is a hardware error set in the Error and Reset Status

to an Error Halt or Warm Reset instead of an interrupt, see paragraph 3.5.).

5 external individually prioritized interrupts

The sources of these interrupts are located outside the ERC32. Consequently these

interrupts are inputs to the MEC.

The interrupt allocation for the asynchronous traps is in accordance with the scheme in

Table 5 (page 35).

It is possible to mask each individual interrupt (except interrupt 15) by setting the

corresponding bit in the Interrupt Mask Register (see page 57).

The MEC includes a specific register called Interrupt Pending Register (see page 56),

which reflects the pending interrupts. It is possible to clear pending interrupts by setting

the corresponding bit in the Interrupt Clear Register (see page 57).

(Interrupt test description moved to paragraph 3.19.)

The interrupts in the IPR are cleared automatically when the interrupt is acknowledged.

The MEC will sample the trap address in order to know which bit to clear.

Upon receiving an interrupt, external or forced, the MEC issues a request on its IRL

outputs to the IU with the corresponding interrupt level. If two or more interrupts occur

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simultaneously, the interrupt with the highest priority level is issued to the IU. If a

higher level interrupt is recognized by the MEC before the lower level interrupt request

is acknowledged, the higher level interrupt will replace the lower level interrupt request.

By programming the Interrupt Shape Register (see page 56), it is possible to define

the external interrupts to be either active low or active high and to define the external

interrupts to be either edge or level sensitive. Also, by programming the ISR, it is

possible to make one of the external interrupts generate a pulse on the EXTINTACK

output when the IU acknowledges the interrupt.

The external interrupt inputs are filtered such that both level and edge sensitive

interrupts are detected only if the external interrupt is active for at least two system

clock cycles.

Edge sensitive interrupts will be detected only when a transition occurs (from high to

low if programmed to be active low and vice-versa), i.e. the corresponding bit in IPR

will be set.

Level sensitive interrupts will be detected, i.e. the corresponding bit in IPR will be set as

long as the interrupt line is asserted. When the interrupt line is deasserted, the

corresponding bit in IPR will be cleared.

Table 5 - Interrupt Trap Type and default priority assignments

Trap

Priority

Trap Type

0x1F

0x1E

0x1D

0x1C

0x1B

0x1A

0x19

Interrupt level/no

Watch Dog time-out

Ext. Interrupt 4

Real Time Clock

General purpose timer

Ext. Interrupt 3

Ext. Interrupt 2

DMA time-out

DMA access error

UART error

0x18

0x17

Correctable error in mem.

UART B Data Ready or

Transmitter Ready

UART A Data Ready or

Transmitter Ready

Ext. Interrupt 1

0x16

0x15

0x14

0x13

0x12

0x11

Ext. Interrupt 0

Masked Hardware errors

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3.13. General Purpose and Real Time Clock Timers

Two timers (apart from the special Watchdog timer) are available in the MEC. These

timers provide, in addition to a generalized counter mechanisms, a mechanism for

setting the step size in which actual time counts are performed (a two-stage counter).

Each timer/counter pulse generator consists of two parts:

pre-SCALER

COUNTER

SCALER is a counter to adjust the step size in which COUNTER does the actual time

count.

COUNTER is a counter to actually count time in steps as set by the value in SCALER.

COUNTER is decrements when SCALER reaches zero.

The implementation is shown in Figure 6.

Timer function

Set Preload

The Counter

Set Preload

The Scaler

Interrupt

SYSCLK

Zero indication

Control (Enable, Load, Reload, Hold, Stop at zero)

Figure 6 - Timer implementation

Both timers are clocked by the internal system clock. The timers are programmable by

writing to the Timer Control Register (see page 59). They are possible to program to

be either of single-shot type or periodical type, in both cases generate an interrupt when

the delay time has elapsed. If the timer is not programmed with a new value when set to

periodical type, it restarts from the latest programmed value and continue to count

down, thus generating interrupts periodically. The Real Time Clock Timer interrupt

has higher priority than the General Purpose Timer interrupt. It is possible to halt and

restart the timers by writing to the Timer Control Register. The only functional

difference between the two timers is that the Real Time Clock Timer has an 8-bit

scaler while the General Purpose Timer has a 16-bit scaler providing a wider range.

While the signal CPUHALT* is active, the timers are temporary halted.

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The Real Time Clock Timer (see page 58) is implemented as one down counting 8-bit

scaler and one down counting 32-bit counter. The current value of the scaler and counter

of the Real Time Clock can be read.

The timer scaler load value is programmable in Real Time Clock Program Register

<Scaler> (see page 58). The timer count load value is programmable in Real Time

Clock Program Register <Counter> (see page 58). The value of these registers will

not be altered unless reprogrammed or reset. After system reset the Real Time Clock is

not running and must be programmed as required.

The General Purpose Timer (see page 58) is implemented as one down counting 16-bit

scaler and one down counting 32-bit counter. The current value of the scaler and counter

of the General Purpose Timer can be read.

The timer scaler load value is programmable in General Purpose Timer Program

General Purpose Timer Program Register <Counter> (see page 58). The value of

these registers will not be altered unless reprogrammed or reset. After system reset the

General Purpose Timer is not running and must be programmed as required.

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3.14. Watch Dog

The watch dog function consists of a Watchdog Timer (see page 57). The watch dog is

supplied from a separate external input (WDCLK) which must have a frequency which

is at least three times lower than SYSCLK. This input could be divided by 16 in a

prescaler or routed directly to the scaler of the watch dog as set in the MEC Control

The WDCLK input consists of a Schmitt-trigger to allow clock supply from an external

RC oscillator.

It is possible to program the timer by setting a specific value in the Watchdog Program

and Timeout Acknowledge Register (see page 57). The register consists of one scaler

field and one counter field corresponding directly to the scaler field and the counter field

of the watchdog timer.

After system reset or processor reset, the timer is enabled and starts running. The default

value is the scaler set to maximum and the counter set to maximum. By writing to the

Trap Door Set (see page 57) after system reset, the timer can be disabled. After the

disabling of the watch dog timer a write operation to the Watchdog Program and

Timeout Acknowledge Register (see page 57) starts the timer counting with the value

of the specified fields. Note that the Watchdog cannot be disabled once the Watchdog

Program and Timeout Acknowledge Register has been written.

If the timer is refreshed by writing to Watchdog Program and Timeout Acknowledge

counting with the new delay value. If the timer is not refreshed (reprogrammed) before

the counter reaches zero value, an interrupt is issued to the IU. Simultaneously, the timer

starts counting a reset timeout period with the programmed delay time. Then, if the

timer is acknowledged by writing to Watchdog Program and Timeout Acknowledge

elapses again, the timer restarts counting with the new delay value, but if the timer is not

acknowledged before the reset timeout period elapses, a processor reset is issued by the

MEC.

The Watchdog is temporary halted when the CPUHALT* signal is active.

Figure 7 explains all the states and transitions of the watchdog timer.

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System / processor reset

Init

Watchdog Program (New value

Watchdog

timeout

default value

Trap Door set

disabled

Watchdog

Program

(new value)

Watchdog Program

(Refresh)

enabled

normal mode

Watchdog Timeout acknowledge

(New value)

Watchdog Timeout

Reset timer

enabled

Interrupt

Reset Timeout

Processor reset

halted

Figure 7 - Watchdog timer states and transitions

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3.15. UART

The MEC includes two full duplex asynchronous receiver transmitters (UARTs).

The data format of the UARTs is eight bits. It is possible to choose between even or odd

parity, or no parity, and between one and two stop bits by programming the MEC

Control Register (see page 51). After system reset odd parity and one stop bit are set.

The baud rate of the UART is set by programming the MEC Control Register (see

page 51). After system reset the baud rate is set to system clock frequency divided by 32

which is probably not a usable baud rate. It follows that the baud rate in the MEC

Control Register must be programmed after system reset.

The UARTs provides double buffering, i.e. each UART consists of a transmitter holding

(see page 62).

Figure 9 - removed

The receiver converts serial start bit, data word, parity bit and stop bit(s) into parallel

form. The transmitter converts parallel data into serial form automatically adding start

bit, parity bit, and stop bit(s).

To output a byte on the serial output the following procedure should be followed. First,

the UART Status Register should be read in order to check that the transmitter holding

the previous byte to be output may be lost (note that the TSE bit is not useful for the

purpose of checking if a character may be written to the RX/TX register). Then, the byte

to be output (RTD, bits 0-7) is written in the RX and TX register. The byte written will

then automatically be transferred to the transmitter send register and converted to serial

form also adding start bit, parity bit, and stop bit(s). The above described sequence can

be part of a trap handler for the UART interrupt.

When a data byte has been received on the serial interface an interrupt is issued to the

IU. The byte received is converted to parallel form and loaded into the receiver data

overrun error, i.e. the preceding byte has not been read before a complete following byte

is received, are indicated by the bits FE, PE, and OE, respectively in the UART status

A correctly received byte is indicated by the Data Ready bits for channel A and B (DRA,

bit 0 and DRB, bit 16) when reading the UART status register.

The UARTs generate an interrupt each time a data word has been received, a data word

has been sent, and if an error is detected. There is one interrupt from each UART (A and

B) to indicate that data is correctly received or that the transmitter register is empty.

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There is another interrupt to indicate errors, but this interrupt is common for both UART

channels.

The UART uses an internal clock which is 16 times faster than the baud-rate, and

samples each bit 16 times, to ensure error free reception. The clock is derived either

from the system clock or can use the watchdog clock with a UART oscillator input.

The baudrate of the UARTs can be programmed in the Scaler field and UBR bit of the

MEC Control Register. The scaler shall be set to:

Clock

Scaler =

¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾

- 1

32 * Baudrate * (2 - UBR)

Where Clock is either the frequency of the system clock (SYSCLK) or the watchdog

clock (WDCLK) selected by UCS (bit 23 in MEC Control Register). UBR is the value

of the UBR bit. Baudrate is the desired baudrate. Note that the resulting actual baudrate

will probably not be exactly the desired one. This is due to the fact that Scaler is an

integer number, and the above given equation may yield a non-integer result, depending

on the Clock frequency.

The UART is temporary halted when CPUHALT* is active and no transmission is

performed by the UART.

The external UART interfaces consist of one transmit data output for each UART

channel (TXA and TXB) and one receive data input for each UART channel (RXA and

RXB).

Note that no hardware handshake signals, such as CTS or RTS are implemented. Any

handshaking must be implemented in software (e.g. using XON/XOFF).

3.16. Parity Checking

The MEC includes parity checking and generation if required on the external data bus

(DPARIO). It includes parity checking on the external address bus (APAR). It also

includes parity checking on ASI and SIZE (ASPAR) together with parity generation and

checking on all internal registers. The MEC also includes parity generation and

checking on the external control bus to the IU (IMPAR). If a parity error is detected on

the external data bus, the external address, the external ASI and SIZE, the external

control bus, the memory exception output (MEXC*) is asserted. If a memory exception

event occurs the System Fault Status Register (see page 60) is updated and reflects the

type and location of parity errors.

All external parity checking can be disabled using the NOPAR* signal.

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3.17. Error Handler

The MEC has one error output signal (SYSERR*) which indicates that an unmasked

error has occurred. Any error signaled on the error inputs from the IU and the FPU is

latched and reflected in the Error and Reset Status Register (see page 61).

It is possible to program an error mask in the MEC Control Register for each type of

error in order to determine whether the specific error shall lead to the MEC ignoring the

error or asserting a processor halt or processor reset. It is possible to choose either a

processor halt or processor reset by programming the MEC Control Register (see page

51). As default, an error leads to a processor halt.

All unmasked errors, asserts the SYSERR* pin and this pin is asserted until all the

unmasked error bits in the Error and Reset Status Register (see page 61) are cleared.

In Figure 8 a schematic view of the error handler is shown.

ERSR

MCR

Errors

Reset

Halt

MCR Error Mask

SYSERR*

Masked Hardware Error

Interrupt Level 1

IMR

Figure 8 - Error Handler Schematic

A MEC hardware error occurs, if a parity error is detected on the internal registers. A

detected MEC hardware error will cause the MEC to assert the MECHWERR* and

SYSERR* signals. The memory exception output (MEXC*) is not asserted in this case.

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The MEC provides inputs for handling of the following IU and FPU errors (see RD2

and RD3):

- IU Error Mode (IUERR*)

- IU Hardware Error (IUHWERR*)

- IU Comparison Error (IUCMPERR*)

- FPU Hardware Error (FPUHWERR*)

- FPU Comparison Error (FPUCMPERR*)

A detected error on those inputs will cause the MEC to assert the SYSERR* signal. IU,

FPU and MEC errors are latched even if previous errors are latched.

The MEC also provides inputs for handling of master/slave checking for the IU/FPU.

In Figure 9 a system is shown where master checkers are used on both the IU and FPU.

Master Checker on IU and FPU

FPU

CMPERR

HWERR

ERROR

CMPERR

HWERR

MEC

IUCMPERR

IUHWERR

IUERR

FPUCMPERR

FPUHWERR

SYSERR

SYSAV

MECHWERR

CIU

CFPU

CMPERR

HWERR

ERROR

CMPERR

HWERR

Figure 9 - Master/Slave configuration on IU and FPU

A detected comparison error (CMPERR) from either of the checking devices will cause

the MEC to assert the SYSERR* signal if the comparison error is unmasked.

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The MEC detects illegal register access, e.g. write to internal register in non supervisor

mode. The memory exception output (MEXC*) is asserted by the MEC, if such an

access is made or if an access to an internal MEC register with erroneous data size is

attempted.

A list of all events (synchronous traps) that cause a MEXC* is found on page 33. Less

critical errors and some other events are called asynchronous traps. These events do not

cause a MEXC* but only an interrupt. A list of all asynchronous traps is found on page

33. The MEC always completes the current cycle when an error is detected and the

MEXC* is generated in the beginning of the next cycle.

Apart from issuing MEXC* and/or interrupt, synchronous and asynchronous events also

cause the MEC to latch some internal registers to hold information about the occurred

error. If a trap event occurs the System Fault Status Register (see page 60) is updated

and reflects the type of error in accordance with the conditions in the table. Also the

Error and Reset Status Register (see page 61) is updated reflecting the type of error in

accordance with the conditions in the table. The associated bus address is latched in the

Failing Address Register (see page 60) in accordance with the conditions in the table.

IU data fault valid and asynchronous fault valid are implemented in the System Fault

Status Register. DMA errors will not overwrite the System Fault Status Register if IU

data fault valid bit is set.

If a data access results in an error, the Failing Address Register is always updated,

even if an error has already been latched before. With data access is meant an IU

operand fetch or a DMA, i.e. the ASI bits indicate an ongoing data load/store cycle.

The following figure shows all possible latching scenarios for the SFSR and FAR

registers.

MATRA MHS

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TSC693E

NO ERROR

Synchronous

data error

detected

EDAC

Corectable error

detected

All errors cleared

by SW *

All errors cleared

for IU or DMA

for IU and DMA

by SW *

SYNCH.

DATA

ERROR

EDAC

CORRECTABLE

ERROR

EDAC

Corectable error

detected

for IU and DMA

IU Synchronous

data error only

Synchronous

data error

detected

for IU or DMA

Each transition will update the SFSR and FAR registers

* FAR will keep its old value

Figure 12 - Error Handler Modes

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TSC693E

The following tables show when updating of the registers is made.

Synchronous trap events

SFSR

FAR

Control bus parity error

Address bus parity error

Data bus parity error

Memory access protection

error

Unimplemented address

violation

MEC register violation error

EDAC uncorrectable error

Bus time-out

System bus error

Asynchronous trap events

Watchdog timeout *

Ext. interrupt 4

SFSR

ERSR

FAR

Real time clock interrupt

General purpose timer interrupt

Ext. interrupt 3

Ext. interrupt 2

DMA session timeout

DMA access error

UART error interrupt

EDAC correctable error

UART B data received or transmitter

ready interrupt

UART A data received or

transmitter ready interrupt

Ext. interrupt 1

Ext. interrupt 0

Masked hardware error interrupt

U : register updated, parity updated

SFSR : System Fault Status register

ERSR : Error and Reset Status Register

FAR : Failing Address Register

* SFSR is updated at the time of Watchdog interrupt while ERSR is only updated if the

Watchdog elapsed causes a halt or reset.

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3.18. System Availability

The SYSAV bit in the Error and Reset Status Register (see page 61) can be used by

software to indicate system availability. The SYSAV bit is cleared by reset and is

programmable by software. Note that the SYSAV output of the MEC will be asserted

only if the SYSAV bit is set and SYSERR* is deasserted, i.e. no error has been

detected.

3.19. Test mode and Test Access Port

The MEC includes a number of test facilities such as EDAC test, Parity test, Interrupt

test, Error test and a simple Test Access Port. These test functions are controlled using

the Test Control Register (TCR) (see page 61).

3.19.1. EDAC Test

The EDAC function allows fault injection for memory test purposes and also test of the

EDAC function itself. By enabling EDAC test mode in TCR (ET=1), the bits in the CB

field of TCR will substitute the normal checkbits during store cycles.

3.19.2. Parity Test

The MEC register parity function allows fault injection for parity test purposes. By

enabling parity test mode in TCR (PT=1), wrong parity will be generated when any

MEC register is read.

3.19.3. Interrupt Test

It is possible to test and force interrupts by setting the corresponding bit in the Interrupt

Force Register (page 57). Clearing of interrupts by setting the corresponding bit in the

Interrupt Clear Register (ICR) will always clear the corresponding bit(s) in the

Interrupt Pending Register (IPR), but will never affect the interrupts set in the

Interrupt Force Register (IFR). However, it is possible to remove these interrupts by

clearing the corresponding bit in IFR.

If the MEC is in interrupt test mode the handling of IFR and IPR is different:

When "Interrupt test" is not enabled:

Setting or clearing a bit in IFR will only affect IFR. The corresponding

interrupt will not be forced.

When the interrupt is acknowledged, the MEC will automatically clear the

bit in the IPR corresponding to the trap address as described above.

When "Interrupt test" is enabled:

Setting a bit in IFR will force the corresponding interrupt if it is not

masked in IMR.

MATRA MHS

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When the interrupt is acknowledged, the MEC will automatically clear the

corresponding bit in the IFR if this bit is set, otherwise it will clear the

corresponding bit in the IPR. In this way no external interrupts are lost.

Interrupt test mode is enabled in the Test Control Register (see page 61).

3.19.4. Error Test

The MEC error detection and handling allows fault injection for test purpose. By

enabling Error test mode in TCR (EWE=1), an error could be simulated by writing to

the Error and Reset Status Register, bits 5-0.

3.19.5. Test Access Port (TAP)

The MEC includes a Test Access Port (TAP) interface (IEEE standard 1149.1) for

debugging and test purposes. The TAP does however not implement any scan function

in the present version of the MEC, and only implements the Bypass register.

The timing of the TAP signals is according to IEEE 1149.1. This means that TDI and

TMS are sampled by the ERC32 devices on the rising edge of TCK, and that TDO is

driven on the falling edge .

Figure 12 - removed

3.20. System Clock

The MEC provides a system clock signal (SYSCLK) with a nominal 50 % duty cycle for

the IU/FPU and the rest of the system.

The system clock is obtained by dividing an external clock signal (CLK2) by two.

Please note that the MEC itself uses both SYSCLK and CLK2 directly. Some MEC

output signals are clocked by the CLK2 negative edge which means that the CLK2 duty

cycle has a direct impact on the system performance.

When interfacing peripherals (I/O interface, DMA interface etc.) it is highly

recommended that only SYSCLK rising edge is used as reference as far as possible.

CLK2 should be used as input to the MEC only.

MATRA MHS

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TSC693E

3.21. MEC Registers

The writeable registers of the MEC are only writeable in the supervisor mode or in

DMA mode during CPUHalt*. All registers except the UART RX and TX are readable

in every access mode. The UART RX and TX registers are only readable in supervisor

mode or in DMA mode during CPUHalt*. Read/write byte, halfword are not allowed in

any mode and will generate Memory Exception, MEXC*.

3.21.1. Register Address Map

MEC Register

Address (hex)

MEC Control Register

Software Reset Register

Power Down Register

01F8 0000

01F8 0004

01F8 0008

Unimplemented area 01F8 000C

Memory Configuration Register

I/O Configuration Register

01F8 0010

01F8 0014

Waitstate Configuration Register

01F8 0018

Unimplemented area 01F8 001C

Access Protection Segment 1 Base Register

Access Protection Segment 1 End Register

Access Protection Segment 2 Base Register

Access Protection Segment 2 End Register

01F8 0020

01F8 0024

01F8 0028

01F8 002C

Unimplemented area 01F8 0030 - 01F8 0040

Interrupt Shape Register

Interrupt Pending Register

Interrupt Mask Register

Interrupt Clear Register

Interrupt Force Register

01F8 0044

01F8 0048

01F8 004C

01F8 0050

01F8 0054

Unimplemented area 01F8 0058 - 01F8 005C

Watchdog Program and Timeout Acknowledge Register

Watchdog Trap Door Set

01F8 0060

01F8 0064

Unimplemented area 01F8 0068 - 01F8 007C

Real Time Clock Timer <Counter>

Real Time Clock Program Register <Counter>

Real Time Clock <Scaler>

Real Time Clock Program Register <Scaler>

General Purpose Timer <Counter>

01F8 0080

01F8 0084

01F8 0088

General Purpose Timer Program Register <Counter>

General Purpose Timer <Scaler>

General Purpose Timer Program Register <Scaler>

01F8 0088

01F8 008C

Unimplemented area 01F8 0090 - 01F8 0094

Timer Control Register

01F8 0098

Unimplemented area 01F8 009C

01F8 00A0

System Fault Status Register

Failing Address Register

01F8 00A4

Unimplemented area 01F8 00A8 - 01F8 00AC

01F8 00B0

Unimplemented area 01F8 00B4 - 01F8 00CC

01F8 00D0

Error and Reset Status Register

Test Control Register

Unimplemented area 01F800D4 - 01F800DC

01F8 00E0

UART Channel A RX and TX Register

UART Channel B RX and TX Register

UART Status Register

01F8 00E4

01F8 00E8

Unimplemented area 01F8 00EC - 01FF FFFF

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3.21.2. Register Configuration and Bit Allocation

For each register the following information is given:

Address of the register

Bits is the bit allocation of the register. A bit can either have a unique function or

a number of bits can be grouped together into a specific field.

Name is the abbreviation for each bit or field.

Reset value states the value for each bit or field to be obtained after the assertion

of system reset.

Function explains the function and use of each bit or field.

r/w explains if the bit or field can be read and/or written.

Note that in some cases only part of the 32-bit register is used. The non usable bits are

marked as reserved and will always have a fix value (generally zero) when being read

and can thus not be altered by a write operation.

NOTE !! All reserved bits have to be written with zeros in order to avoid parity error

resulting in a MEC internal error.

Certain registers below are not true registers in the sense that they only correspond to a

write operation with any data. Any data may be used when writing to these registers.

Nevertheless, they are part of the register memory map and therefore included.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

MEC Control Register

01F8 0000 H

Bits

Name

Reset value

Function

r/w

PRD

Power-down

r/w

1 : enabled (allowed)

0 : disabled

SWR

Software reset

1 : enabled (allowed)

0 : disabled

Bus timeout

1 : enabled

r/w

BTO

0 : disabled

Block protection instead of normal access protection

1 : enabled

0 : disabled

WDCS

Watchdog clock supply

1 : external clock with prescaler (divide by 16)

0 : external clock, no prescaler

IU Error Mode Mask

1 : Error masked (= disabled)

0 : Error not masked

Reset or Halt when IU error mode (ERROR*)

1 : Reset

IUEMMSK

RHIUEM

IUHEMSK

RHIUHE

IUCMPMSK

RHIUCMP

FPUCMPMSK

RHFPUCMP

MECHEMSK

RHMECHE

0 : Halt

IU Hardware Error Mask

1 : Error masked (= disabled)

0 : Error not masked

Reset or Halt when IU Hardware Error (HWERR*)

1 : Reset

0 : Halt

IU Comparison Error Mask

1 : Error masked (= disabled)

0 : Error not masked

Reset or Halt when IU comparison error

1 : Reset

0 : Halt

FPU Comparison Error Mask

1 : Error masked (= disabled)

0 : Error not masked

Reset or Halt when FPU comparison error

1 : Reset

0 : Halt

MEC HW Error Mask

1 : Error masked (= disabled)

0 : Error not masked

Reset or Halt when MEC HW Error (MECHWERR)

1 : Reset

0 : Halt

reserved

DMAE

Not used

DMA

r/w

1 : enabled

0 : disabled

DPE

DST

UBR

UPE

DMA Parity Enabled

1 : enabled

0 : disabled

DMA session timeout

1 : enabled

0 : disabled

UART baud rate(1)

1 : No change of UART scaler baudrate

0 : Divide UART scaler baudrate by two

UART parity enable

1 : parity enabled

0 : no parity

UART parity

1 : odd parity

0 : even parity

UART stop bits

1 : two stop bits

0 : one stop bit

UART clock supply

1 : system clock

0 : external clock

UART scaler,

r/w

USB

UCS

Scaler

31-24

00000001

(1)

1 - 255: Divide factor

0: stops the UART clock

The scaler shall be set to: Scaler = Clock/(32*Baudrate*(2-UBR))-1

Where Clock is either the frequency of the system clock (SYSCLK) or the watchdog clock (WDCLK) selected by UCS (bit

23 in MEC Control Register). UBR is the value of the UBR bit. Baudrate is the desired baudrate. Note that the resulting

actual baudrate will probably not be exactly the desired one. This is due to the fact that Scaler is an integer number, and

the above given equation may yield a non-integer result, depending on the Clock frequency.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

Software Reset Register

01F8 0004 H

Write only with any data. A write to this register will cause the MEC to issue the

RESET* signal if the software reset function is enabled in the MEC Control register.

If the software reset function is not enabled, a write to this register will have no effect.

Power Down Register

01F8 0008 H

Write only with any data. A write to this register will cause the system to enter power

down mode (see paragraph 3.5.4.) if the power down function is enabled in the MEC

Control Register.

If the power down function is not enabled, a write to this register will have no effect.

Memory Configuration Register

01F8 0010 H

Bits

Name

Reset value

Function

r/w

1-0

RBCS

Number of RAM blocks (chip selects used)

r/w

00 : MEMCS<0> active

01 : MEMCS<1:0> active

10 : MEMCS<3:0> active

11 : MEMCS<7:0> active

RBS0

RBR0

Redundant RAM block0 selected.

0 : not selected

1 : selected

r/w

5-3

000

Redundant RAM block0 can replace any of the RAM blocks. The

MEMCS corresponding to the replaced block will be inactive and

MEMCS<8> will be active instead.

000 : MEMCS<0> inactive and replaced

001 : MEMCS<1> inactive and replaced

010 : MEMCS<2> inactive and replaced

011 : MEMCS<3> inactive and replaced

100 : MEMCS<4> inactive and replaced

101 : MEMCS<5> inactive and replaced

110 : MEMCS<6> inactive and replaced

111 : MEMCS<7> inactive and replaced

Redundant RAM block1 selected.

0 : not selected

RBS1

r/w

1 : selected

9-7

RBR1 (1)

000

Redundant RAM block1 can replace any of the RAM blocks. The

MEMCS corresponding to the replaced block will be inactive and

MEMCS<9> will be active instead.

000 : MEMCS<0> inactive and replaced

001 : MEMCS<1> inactive and replaced

010 : MEMCS<2> inactive and replaced

011 : MEMCS<3> inactive and replaced

100 : MEMCS<4> inactive and replaced

101 : MEMCS<5> inactive and replaced

110 : MEMCS<6> inactive and replaced

111 : MEMCS<7> inactive and replaced

RAM size

12-10

RSIZ

000

r/w

000 : 256 Kbyte

001 : 512 Kbyte

010 : 1 Mbyte

011 : 2 Mbyte

100 : 4 Mbyte

101 : 8 Mbyte

110 : 16 Mbyte

111 : 32 Mbyte

RPA (3)

REC

RAM memory parity protected

1 : enabled

0 : disabled

r/w

RAM EDAC protected

1 : enabled

0 : disabled

(Note: When EDAC is enabled parity is enabled independent of RPA)

Reserved

PWR

Not used

PROM write function

r/w

1 : enabled if external ROMWRT* present

0 : disabled

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

P8 (2)

PSIZ

PROM 8-bit wide

1 : 40-bit wide, EDAC and Parity

0 : 8-bit wide, Parity generation

PROM size

20-18

000

r/w

000 : 128 Kbyte

001 : 256 Kbyte

010 : 512 Kbyte

011 : 1 Mbyte

100 : 2 Mbyte

101 : 4 Mbyte

110 : 8 Mbyte

111 : 16 Mbyte

23-21

26-24

Reserved

ESIZ

000

Not used

Exchange memory size

000 : 4 Kbyte

r/w

001 : 8 Kbyte

010 : 16 Kbyte

011 : 32 Kbyte

100 : 64 Kbyte

101 :128 Kbyte

110 :256 Kbyte

111 :512 Kbyte

EPA (3)

EEC

Exchange memory parity protected

1 : enabled

0 : disabled

Exchange memory EDAC protected

1 : enabled

r/w

0 : disabled

(Note: When EDAC is enabled parity is enabled independent of EPA)

EEX

Exchange memory exists

1 : exists

0 : exists not

r/w

31-30

Reserved

Not used

If RBR0 and RBR1 are set to the same value, RBR1 settings will have no effect.

Is at reset automatically written with same value as PROM8 input pin to MEC. A write operation to this bit has no effect

(is don't care).

If the NOPAR* signal is asserted, data parity is not checked even if enabled in this register.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

I/O Configuration Register

01F8 0014 H

Bits

Name

Reset value

Function

r/w

3-0

SIZ0

0000

I/O unit<0> size.

0000 : 512 bytes

0001 : 1 Kbytes

0010 : 2 Kbytes

0011 : 4 Kbytes

0100 : 8 Kbytes

0101 : 16 Kbytes

0110 : 32 Kbytes

0111 : 64 Kbytes

1000 : 128 Kbytes

1001 : 256 Kbytes

1010 : 512 Kbytes

1011 : 1 Mbytes

1100 : 2 Mbytes

1101 : 4 Mbytes

1110 : 8 Mbytes

1111 : 16 Mbytes

r/w

IO0

I/O unit <0> enabled1 : enable

0 : disabled

Parity supplied by I/O unit <0>

1 : Yes (Note: MEC checks parity)

0 : No (Note: MEC generated parity)

Not used

r/w

PA0

11-8

Reserved

SIZ1

0000

Not used

I/O unit<1> size.

r/w

Coded as for I/O unit<0>

I/O unit<1> enabled

1 : enabled

IO1

r/w

0 : disabled

PA1

Parity supplied by I/O unit <1>

1 : Yes (Note: MEC checks parity)

0 : No (Note: MEC generated parity)

Not used

I/O unit<2> size.

19-16

Reserved

SIZ2

0000

r/w

Coded as I/O unit<0>

I/O unit<2> enabled

1 : enabled

IO2

r/w

0 : disabled

PA2

Parity supplied by I/O unit <2>

1 : Yes (Note: MEC checks parity)

0 : No (Note: MEC generated parity)

Not used

I/O unit<3> size.

27-24

Reserved

SIZ3

0000

r/w

Coded as I/O unit<0>

I/O unit<3> enabled

1 : enabled

IO3

r/w

0 : disabled

PA3

Parity supplied by I/O unit <3>

1 : Yes (Note: MEC checks parity)

0 : No (Note: MEC generated parity)

Not used

Reserved

Not used

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

Waitstate Configuration Register

01F8 0018 H

Bits

Name

Reset value

Function

r/w

1-0

RAR

RAM read, no. of waitstates.

00 : 0 WS

01 : 1 WS

10 : 2 WS

11 : 3 WS

3-2

7-4

RAW

PRR

RAM write, no of waitstates.

00 : 0 WS

01 : 1 WS

10 : 2 WS

11 : 3 WS

PROM read, no. of waitstates.

1111

0000 : 0 WS

0001 : 0 WS

0010 : 1 WS

1111 : 14 WS

11-8

PRW

1111

PROM write, no. of waitstates.

0000 : 0 WS

0001 : 0 WS

0010 : 1 WS

1111 : 15 WS

Exchange memory read/write, no. of waitstates.

0000 : 0 WS

0001 : 0 WS

0010 : 1 WS

1111 : 15 WS

IO 0 read/write, no. of waitstates.

0000 : "0 WS" See Note 1) below

0001 : 0 WS

0010 : 1 WS

1111 : 14 WS

IO 1 read/write, no. of waitstates.

0000 : "0 WS" See Note 1) below

0001 : 0 WS

0010 : 1 WS

1111 : 14 WS

IO 2 read/write, no. of waitstates.

0000 : "0 WS" See Note 1) below

0001 : 0 WS

0010 : 1 WS

15-12

19-16

23-20

27-24

31-28

EXRW

IO0RW

IO1RW

IO2RW

IO3RW

1111 : 14 WS

IO 3 read/write, no. of waitstates.

0000 : "0 WS" See Note 1) below

0001 : 0 WS

0010 : 1 WS

1111 : 14 WS

Note 1) In the I/O area the MEC will always insert one waitstate to wait for the BUSRDY* signal, even when "0 WS" is

programmed in the above register.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

Access Protection Segment 1 Base Register

Access Protection Segment 2 Base Register

01F8 0020 H

01F8 0028 H

Bits

Name

Reset value

Function

r/w

22-0

SEGBASE

Segment start address. The base address for the segment is calculated

according to the formula BASEADDR = 0x02000000+SEGBASE*4

0 = access protection disabled in user mode

1 = access protection enabled in user mode

0 = access protection disabled in supervisor mode

1 = access protection enabled in supervisor mode

Not used

r/w

31-25

Note )

The Access Protection is enable only for data write cycles.

Access Protection Segment 1 End Register

Access Protection Segment 2 End Register

01F8 0024 H

01F8 002C H

Bits

Name

Reset value

Function

r/w

22-0

SEGEND

Segment end address denoting the first address outside the segment. The

end address for the segment is calculated according to the formula

ENDADDR = 0x02000000+SEGEND*4

r/w

0x000000

31-23

Not used

r/w

Interrupt Shape Register

01F8 0044 H

Bits

Name

Reset value

Function

r/w

4-0

EDGE

00000

External interrupts edge or level triggered

xxxx1 : external interrupt 0 edge triggered

xxxx0 : external interrupt 0 level triggered

xxx1x : external interrupt 1 edge triggered

xxx0x : external interrupt 1 level triggered

r/w

1xxxx : external interrupt 4 edge triggered

0xxxx : external interrupt 4 level triggered

Acknowledge on external interrupt.

000 : No action

7-5

ACK

000

r/w

001 : external interrupt 0 acknowledged

010 : external interrupt 1 acknowledged

011 : external interrupt 2 acknowledged

100 : external interrupt 3 acknowledged

101 : external interrupt 4 acknowledged

110 : No action

111 : No action

12-8

POL

00000

External interrupts polarity

r/w

xxxx1 : external interrupt 0 active high

xxxx0 : external interrupt 0 active low

xxx1x : external interrupt 1 active high

xxx0x : external interrupt 1 active low

1xxxx : external interrupt 4 active high

0xxxx : external interrupt 4 active low

Not used

31-13

Reserved

Interrupt Pending Register

01F8 0048 H

Bits

15-1

Name

Reserved

Reset value

Function

Not used

Pending interrupts

bit 1 = 1 : interrupt 1 pending

bit 1 = 0 : interrupt 1 not pending

r/w

bit 15 = 1 : interrupt 15 pending

bit 15 = 0 : interrupt 15 not pending

Not used

31-16

Reserved

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

Interrupt Mask Register

01F8 004C H

Bits

14-1

Name

Reserved

Reset value

3FFFh

Function

Not used

Masked interrupts

r/w

bit 1 = 1 : interrupt 1 masked

bit 1 = 0 : interrupt 1 not masked

bit 14 = 1 : interrupt 14 masked

bit 14 = 0 : interrupt 14 not masked

Not used

31-15

Reserved

Interrupt Clear Register

01F8 0050 H

Bits

15-1

Name

Reserved

Reset value

Function

Not used

Cleared interrupts

bit 1 = 1 : interrupt 1 cleared

bit 1 = 0 : interrupt 1 not cleared

r/w

bit 15 = 1 : interrupt 15 cleared

bit 15 = 0 : interrupt 15 not cleared

Not used

31-16

Reserved

Interrupt Force Register

01F8 0054 H

Bits

15-1

Name

Reserved

Reset value

Function

Not used

Forced interrupts

r/w

bit 1 = 1 : interrupt 1 forced

bit 1 = 0 : interrupt 1 not forced

bit 15 = 1 : interrupt 15 forced

bit 15 = 0 : interrupt 15 not forced

Not used

31-16

Reserved

Watchdog Program

and Timeout Acknowledge Register 01F8 0060 H

Bits

15-0

23-16

31-24

Name

WDC

WDS

WDR

Reset value

FFFFh

FFh

Function

r/w

Preset 16-bit counter value

Preset 8-bit scaler value

Preset 8-bit reset counter value

FFh

The timeout for the watchdog before the watchdog interrupt occurs is calculated as:

WDCS×

Timeout =(16

(WDS+1) (WDC+1))/WDCLK

The timeout for the watchdog before warm reset occurs is calculated as:

WDCS×

Reset timeout = Timeout + 16

(WDS+1) (WDR+1)/WDCLK

Where WDCS is the Watchdog Clock Supply bit of the MEC Control Register and WDCLK is the

frequency of the WDCLK input signal.

Watchdog Trap Door Set

01F8 0064 H

Write only with any data. A write to this register after reset but before the watchdog has

elapsed will disable the watchdog. The watchdog will stay disabled until it is

reprogrammed by writing to the Watchdog Program and Timeout Acknowledge

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

Real Time Clock Timer <Counter> 01F8 0080 H

Bits

Name

Reset value

Function

r/w

31-0

RTCC

FFFFFFFFh

Down counting 32-bit counter

Real Time Clock

Program Register <Counter>

01F8 0080 H

Bits

Name

Reset value

Function

r/w

31-0

RTCC

FFFFFFFFh

Programmed 32-bit counter value

Real Time Clock <Scaler>

01F8 0084 H

Bits

7-0

31-8

Name

RTCS

Reserved

Reset value

FFh

Function

Down counting 8-bit scaler

Not used

r/w

Real Time Clock

Program Register <Scaler>

01F8 0084 H

Bits

7-0

31-8

Name

RTCS

Reserved

Reset value

FFh

Function

Programmed 8-bit scaler value

Not used

r/w

The timeout for the real time clock before the interrupt occurs is calculated as:

Timeout =((RTCC) (RTCS+1))/SYSCLK

where SYSCLK is the system clock frequency.

General Purpose Timer <Counter> 01F8 0088 H

Bits

Name

Reset value

Function

r/w

31-0

GPTC

FFFFFFFFh

Down counting 32-bit counter

General Purpose Timer

Program Register <Counter>

01F8 0088 H

Bits

Name

Reset value

Function

r/w

31-0

GPTC

FFFFFFFFh

Programmed 32-bit counter value

General Purpose Timer <Scaler>

01F8 008C H

Bits

15-0

31-16

Name

GPTS

Reserved

Reset value

FFFFh

Function

Down counting 16-bit scaler

Not used

r/w

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

General Purpose Timer

Program Register <Scaler>

01F8 008C H

Bits

15-0

31-16

Name

GPTS

Reserved

Reset value

FFFFh

Function

Programmed 16-bit scaler value

Not used

r/w

The timeout for the general purpose timer before the interrupt occurs is calculated as:

Timeout =((GPTC) (GPTS+1))/SYSCLK

where SYSCLK is the system clock frequency.

Timer Control Register

01F8 0098 H

Bits

Name

Reset value

Function

r/w

GCR

General Purpose Timer Counter Reload

1 :

0 :

reload counter at zero and restart

stop counter at zero

GCL

GSE

GSL

General Purpose Timer counter load

1 :

0 :

load counter with preset value and start if enabled

no function

General Purpose Timer enable

1 :

0 :

enable counting

hold scaler (and counter)

General Purpose Timer Scaler load

1 :

0 :

load scaler with preset value and start if enabled

no function

Reserved

RTCCR

Not used

Real Time Clock Counter Reload

1 :

0 :

reload counter at zero and restart

stop counter at zero

RTCCL

RTCSE

RTCSL

Reserved

Real Time Clock counter load

1 :

0 :

load counter with preset value and start if enabled

no function

Real Time Clock Scaler enable

1 :

0 :

enable counting

hold scaler (and counter)

Real Time Clock Scaler load

1 :

0 :

load scaler with preset value and start if enabled

no function

31-12

Not used

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

System Fault Status Register

01F8 00A0 H

Bits

1-0

Name

Reserved

SDFV

Reset value

Function

Not used

IU data fault valid

r/w

1 :

0 :

valid

not valid

6-3

SRFT

1111

Data fault type or DMA error type

0000 : Parity error on control bus

0001 : Parity error on data bus

0010 : Parity error on address bus

0011 : Access to protected area

0100 : Access to unimplemented area

0101 : MEC register parity error

0110 : MEC register access violation

0111 : Uncorrectable error in memory

1000 : Bus time-out

r/w

1001 : System bus error

1010 to 1110 : Not used

1111 : Reset value

Reserved

ASFV

Not used

Asynchronous fault valid

1 : valid

r/w

0 : not valid

10-9

ASFT

Asynchronous fault type

00 : Watch Dog time-out

01 : DMA time-out/access error

10 : UART error

r/w

11 : Correctable error in memory

15-12

Reserved

0000

Not used

Access type

r/w

see table below

31-16

Reserved

Not used

Note 1) If this register is written the data is irrelevant. The register is set to the value 00000078 hex.

Note 2) DMA errors will not overwrite the System Fault Status Register if IU data fault valid bit is set.

Note 3) The information about ASFT can be extracted by SW from the IPR as well.

Access type

Access Type

Access Mode

ASI

0000

0001

0010

0011

0100

0101

0110

0111

1000

1001

1010

1011

1100

1101

1110

1111

Load

User Data RAM/ROM/Register

Supervisor Data RAM/ROM/Register

Not used

DMA RAM/ROM/Register

User I/O/Exchange

Supervisor I/O/Exchange

DMA I/O/Exchange

User Data RAM/ROM/Register

Supervisor Data RAM/ROM/Register

Not used

DMA RAM/ROM/Register

User I/O/Exchange

0xA

0xB

Do not care

0xA, 0x8

0xB, 0x9

Do not care

0xA

0xB

Do not care

0xA, 0x8

0xB, 0x9

Do not care

Load

Load/execute

Load

Store

Supervisor I/O/Exchange

DMA I/O/Exchange

Note:

Accesses in the "Extended general area" are treated as RAM Accesses from an Access Type point of view.

Failing Address Register01F8 00A4 H

Bits

Name

Reset value

Function

r/w

31-0

FFA

Failing address

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

Error and Reset Status Register

01F8 00B0 H

Bits

Name

Reset value

Function

r/w

IUEM

IU error mode

1 : error

r/w

0 : no error

IU hardware error

1 : error

0 : no error

IU comparison error

1 : error

0 : no error

FPU hardware error (no MEC action)

1 : error

0 : no error

FPU comparison error

1 : error

0 : no error

MEC hardware error.

1 : Internal parity error

0 : no error

IUHE

r/w

IUCMP

FPUHE

FPUCMP

MECHE

11 - 6

Not used

r/w

SYSAV

HLT

ERC32 System availability

1 : System available

0 : System not available

IU/FPU halted

1 : active

0 : not active

Reset cause.

15-14

RSTC

00 : system reset

01 : software reset

10 : error reset

11 : watchdog reset

Not used

31-16

Reserved

Note: Bit 5-0 are only writeable when the EWE bit in the Test Control Register is set

Test Control Register

01F8 00D0 H

Bits

6-0

16-7

Name

Reset value

Function

Check bits

Not used

EDAC test enable

0: Testing disabled

1: Memory test enabled

Parity test

1 : test enabled

0 : test disabled

Interrupt Force Register Write Enable

1 : enabled

0 : disabled

Error Write Enable

1: Write to Error and Reset Status Register enabled

0: Write to Error and Reset Status Register disabled

Not used

r/w

EWE

31-21

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

UART Channel A

RX and TX Register

01F8 00E0 H

Bits

7-0

31-8

Name

RTD

Reserved

Reset value

Function

Rx/Tx data

not used

r/w

UART Channel B

RX and TX Register

01F8 00E4 H

Bits

7-0

31-8

Name

RTD

Reserved

Reset value

Function

Rx/Tx data

not used

r/w

UART Status Register

01F8 00E8 H

Bits

Name

Reset value

Function

r/w

DRA

Data Ready in channel A

TSEA

THEA

Reserved

FEA

Transmitter A Send Register Empty (no data to send)

Transmitter A Holding register Empty (ready to load data)

Not used

Framing Error in receiver A

Parity Error in receiver A

PEA

OEA

CUA

Overrun Error in receiver A

Clear UART A (bit read as zero)

Not used

r/w

15-8

31-24

Reserved

DRB

TSEB

THEB

Reserved

FEB

PEB

OEB

CUB

Reserved

Data Ready in channel B

Transmitter B Send Register Empty (no data to send)

Transmitter B Holding register Empty (ready to load data)

Not used

Framing Error in receiver B

Parity Error in receiver B

Overrun Error in receiver B

Clear UART B (bit read as zero)

not used

r/w

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

4. MEMORY CONTROLLER SIGNAL DESCRIPTIONS

4.1. Memory Controller Signal Summary

Table 6 lists the MEC signals. They are listed according to the signal name; the number

of pins allocated; the input (I), output(O) operating modes; a signal description; if it is

protected by parity (P); and the classification and grouping related to electrical

characteristics.

An asterisk *, after the signal name indicates that the signal is active low (true at a logic

0 level).

Table 6 - MEC Signal Summary

Signal

#Pins I/O/Z Description

Par Pin Type

IU/FPU Interface Signals

A[31:0]

APAR

Address Bus

TTL

Address Bus Parity

Address Space Identifier

Bus Transaction Size

ASI and SIZE Parity

Data Bus

Data Bus Parity Input/Output

DMA Address Strobe

Data Ready during DMA access

External Hold Input (FHOLD*)

External CCV Input (FCCV)

Integer Unit Nullify Cycle

Data Transfer

Atomic Load-Store

Bus Lock

Read Access

Write Enable

Advanced Write

ASI[3:0]

SIZE[1:0]

ASPAR

D[31:0]

DPARIO

DMAAS

DRDY*

EXTHOLD*

EXTCCV

INULL

DXFER

LDSTO

LOCK

WE*

WRT

IMPAR

AOE*

COE*

DOE*

BHOLD*

MDS*

MEXC*

TTL

I/O

TTL/CMOS

TTL

IU to MEC Control Parity

Address Output Enable

Control Output Enable

Data Output Enable

Bus Hold

TTL

CMOS

Memory Data Strobe

Memory Exception

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

MHOLD*

Memory System Interface Signals

Memory Bus Hold

CMOS

BA[1:0]

Latched Address used for 8-bit

Wide Boot PROM

CMOS

CB[6:0]

ALE*

PROM8*

I/O

Check Bits

TTL/CMOS

CMOS

TTL

Address Latch Enable

Select 8-bit Wide PROM

PROM Chip Select

Memory Chip Select

Output Enable

Memory Write Strobe

Check Bit Memory Write Strobe

RAM Buffer Enable

ROM Buffer Enable

Memory Buffer Enable

Buffer Data Direction

IO Chip Select

ROMCS*

MEMCS*[9:0]

OE*[1:0]

MEMWR1*[1:0]

MEMWR2*[1:0]

RAMBEN*

ROMBEN*

MEMBEN*

DDIR

CMOS

DDIR*

IOSEL*[3:0]

IOWR*

IO and Exchange Memory Write

Strobe

IOBEN*

EXMCS*

BUSRDY*

BUSERR*

DMAREQ*

DMAGNT*

IO and Exchange Mem.Buf.Enable

Exchange Memory Chip Select

Bus Ready

Bus Error

DMA Request

CMOS

TTL

DMA Grant

CMOS

Interrupt and Control Signals

IRL[3:0]

INTACK

EXTINT[4:0]

EXTINTACK

SYSRESET*

RESET*

Interrupt Request Level

Interrupt Acknowledge

External Interrupt

External Interrupt Acknowledge

System Reset

CMOS

TTL

CMOS

SCH_TR

CMOS

TTL

Reset

IU Error

IUERR*

IUHWERR*

IUCMPERR*

FPUHWERR*

FPUCMPERR*

MECHWERR*

SYSERR*

SYSAV

SYSHALT*

NOPAR*

IU Hardware Error

IU Comparison Error

FPU Hardware Error

FPU Comparison Error

MEC Hardware Error

System Error

System Availability

System Halt

No Parity

CMOS

TTL

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

ROMWRT*

CPUHALT*

ROM Write Enable

Processor (IU and FPU) Halt

TTL

CMOS

Test Access Port Signals

TCK

TRST*

TMS

TDI

Test Clock

Test Reset

Test Mode Select

Test Data Input

Test Data Output

TTL

TDO

CMOS

UART Interface

WDCLK

RXA

RXB

TXA

TXB

Watch Dog Clock

TTL

CMOS

Receive Data channel

Receive Data channel B

Transmit Data channel A

Transmit Data channel B

Power and Clock Signals

CLK2

SYSCLK[1:0]

VCCI

VCCO

VSSI

218

Double Frequency Clock

System Clock

Main internal VCC

Output driver VCC

Main internal VSS

Output driver VSS

TTL

TTL/CMOS

VSSO

Number of pins

4.2. MEC Detailed Signal Descriptions

4.2.1. IU/FPU Interface Signals

A[31:0] - Address Bus (input)

The address bus for the MEC is an input-only bus. The MEC uses the address bus to

perform decoding, to generate select signals, and to check against the memory access

protection scheme. It is also used to address the MEC registers. In case of Direct

Memory Access, DMA, the address bus is driven by the DMA unit.

APAR - Address Bus Parity (input)

This input is used by the MEC to check the odd parity over the 32-bit address bus. In

case of Direct Memory Access, DMA, this signal must be driven by the DMA unit in

case DMA parity is enabled.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

ASI[3:0] - Address Space Identifier (input)

These four bits constitute the Address Space Identifier (ASI), which identifies the

memory address space to which the memory access is being directed. The ASI bits are

latched by the MEC and are used to detect supervisor mode, instruction or data access,

etc. A DMA unit must supply these bits.

SIZE[1:0] - Bus Transaction Size (input)

The coding on these pins specifies for the MEC the size of the data being transferred

during a memory access. A DMA unit must drive these bits to '10', since only word

transfers are allowed in DMA mode.

ASPAR - ASI and SIZE Parity (input)

This input is used by the MEC to check the odd parity over the ASI[3:0] and the

SIZE[1:0] signals. A DMA unit must supply this bit in case DMA parity is enabled.

Note that although ASI[7:0] exist in the IU, only ASI[3:0] are connected to the MEC.

This means that from the IU, only alternate address space accesses with ASI[7:4]

containing 0, 2 or 4 ones may be used (ASI[7:4] = 0000, 0011, 0101, 0110, 1001, 1010,

1100 or 1111), otherwise an ASI and SIZE parity error will be detected in the MEC, as

the IU computes ASPAR over the full ASI[7:0] range.

D[31:0] - Data Bus (bi-directional)

These pins form a 32-bit bi-directional data bus that serves as the interface between the

IU and the MEC. It is driven by the MEC only during read of its internal registers, when

reading the boot PROM in 8-bit mode, and when a single bit error is detected by the

EDAC. When implementing a system with an 8-bit PROM, the PROM shall be

connected to bits D[7:0]. In case of Direct Memory Access, DMA, it is driven or read by

the DMA unit.

DPARIO - Data Bus Parity Input/Output (bi-directional)

This pin is used by the MEC to check and generate the odd parity over the 32-bit data

bus during write cycles. A DMA unit must supply this bit in case DMA parity is

enabled. See also Table 4 on page 32.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

DMAAS - DMA Address Strobe (input)

During DMA transfers (when the external DMA is bus master) this input is used to

inform the MEC that the address from the DMA is valid and that the access cycle shall

start. DMAAS can be asserted multiple times during DMA grant.

DRDY* - Data Ready during DMA access (output)

During DMA read transfers (when the external DMA is bus master) this output is used

to inform the DMA unit that the data are valid. During DMA write transfers this signal

indicates that data have been written into memory.

INULL - Integer Unit Nullify Cycle (input)

INULL is output from the IU to indicate that the current memory access is nullified. See

further the IU signal description.

ExtHOLD* - External unit Hold (input)

This signal input is used to synchronize coprocessor compare instructions with branch

instructions. The MEC shall use this signal for prolonging of ongoing cycle. See further

the FPU FHold / CHold signal description.

ExtCCV - External unit Condition Codes Valid (input)

This signal input is used to hold the MEC when a coprocessor can not continue

execution. The MEC shall use this signal for prolonging of ongoing cycle. See further

the FPU FCCV / CCCV signal description.

DXFER - Data Transfer (input)

DXFER is used to differentiate between the addresses being sent out for instruction

fetches and the addresses of data fetches. DXFER is asserted by the processor during the

address cycles of all bus data transfer cycles, including both cycles of store single and all

three cycles of store double and atomic load-store. DXFER is sent out unlatched and is

latched in the MEC before it is used. A DMA unit must supply this signal during a

DMA session.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

LDSTO - Atomic Load-Store (input)

This signal is used to identify an atomic load-store to the system and is asserted by the

integer unit during all the data cycles (the load cycle and both store cycles) of atomic

load-store instructions. LDSTO is sent out unlatched and is latched in the MEC before it

is used. A DMA unit must supply this signal during a DMA session.

LOCK -Bus Lock (input)

LOCK is asserted by the processor when it needs to retain control of the bus (address

and data) for multiple cycle transactions (Load Double, Store Single and Double,

Atomic Load-Store). The bus will not be granted to another bus master as long as

LOCK is asserted. Note that BHOLD* should not be asserted in the processor clock

cycle which follows a cycle in which LOCK is asserted. LOCK is sent out unlatched and

must be latched externally before it is used. A DMA unit must supply this signal during

a DMA session.

RD - Read Access (input)

RD is used in conjunction with SIZE[1:0], ASI[3:0] and LDSTO to determine the type

of transfer and to check the write access rights of bus transactions. It may also be used to

turn off the output drivers of data RAMs during a store operation. A DMA unit must

supply this signal during a DMA session, deasserted low for write and asserted high for

read accesses.

WE* - Write Enable (input)

WE* is asserted by the integer unit during the cycle in which the store data is on the data

bus. For a store single instruction, this is during the second store address cycle; the

second and third store address cycles of store double instructions, and the third load-

store address cycle of atomic load-store instructions. It is sent out unlatched and is

latched in the MEC before it is used. To avoid writing to memory during memory

exceptions, WE* is internally qualified by MHOLD* and MEXC*. A DMA unit must

supply this signal during a DMA session, asserted low for write and deasserted high for

read accesses.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

WRT - Advanced Write (input)

WRT is an early write signal, asserted by the processor during the first store address

cycle of integer single or double store instructions, the first store address cycle of

floating-point single or double store instructions, and the second load-store address

cycle of atomic load-store instructions. WRT is sent out unlatched and is latched in the

MEC before it is used. A DMA unit must supply this signal during a DMA session,

deasserted low for read and asserted high for write accesses.

IMPAR - IU to MEC Control Parity (input)

This input is used by the MEC to check the odd parity over the LDSTO, DXFER,

LOCK, WRT, RD, and WE* signals. This signal must be driven by the DMA if DMA

uses parity.

AOE* - Address Output Enable (output)

The MEC deasserts this signal when an external master (DMA unit) uses the address

bus.

COE* - Control Output Enable (output)

The MEC deasserts this signal when an external master (DMA unit) uses the control

bus.

DOE* - Data Output Enable (output)

The MEC deasserts this signal when an external master (DMA unit) uses the data bus.

BHOLD* - Bus Hold (output)

The MEC asserts this signal during DMA accesses.

MDS* - Memory Data Strobe (output)

During nominal execution with the IU as bus master, MDS* is asserted by the MEC to

enable the clock to the instruction register of the IU (during an instruction fetch) or to

the load result register (during a data fetch) while the pipeline is frozen with an

MHOLDA/B*.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

MEXC* - Memory Exception (output)

Assertion of this signal by the MEC initiates an instruction access exception or data

access exception trap and indicates to the IU that the memory system was unable to

supply a valid instruction or data. It is asserted when a parity error, uncorrectable EDAC

error, access violation, bus time-out or system bus error is detected. If this signal is

asserted during a DMA transfer, the DMA must withdraw its DMA request and end the

DMA cycle.

MHOLD* - Memory Bus Hold (output)

MHOLD* is used to freeze the clock to both the IU and floating-point unit during a

cache miss (for systems with cache memory) or when accessing a slow memory. It is

generated by the MEC to insert wait states during memory or I/O accesses.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

4.2.2. Memory System Interface Signals

BA[1:0] - Boot PROM Latched Address used for 8-bit Wide PROM (output)

These outputs are used when 8-bit wide PROM is connected to the MEC. During a read

access to the PROM, the BA[1:0] will be asserted four times in order to get the four

bytes needed to generate a 32-bit word. The MEC will assert the BA[1:0] in the

sequence according to Table 7.

Table 7 - BA[1:0] Sequence

BA[1:0] Bits in the 32-bit word

[7:0]

[15:8]

[23:16]

[31:24]

CB[6:0] - Check Bits (bi-directional)

CB[6:0] is the EDAC checkword over the 33-bit data bus consisting of D[31:0] and the

parity bit (DPARIO). When IU performs a write operation to the main memory, the

MEC will assert the EDAC checkword on the CB[6:0]. During read access from the

main memory, CB[6:0] are input signals and will be used for checking and correction of

the data word and the parity bit. During read access to areas which do not generate a

parity bit, the MEC will latch the data from the accessed address and drive the correct

parity bit on the DPARIO pin.

ALE* - Address Latch Enable (output)

This output is asserted when the address from the IU or a DMA unit is to be latched by

an external latch. The signal is intended to be used to enable the clock input of a flip-

flop used to latch the address from the IU.

PROM8* - Select 8-bit Wide PROM (input)

This input indicates that only 8-bit wide PROM is connected to the MEC. The eight data

lines from the PROM is to be connected to the D[7:0] signals. The MEC will perform a

8-bit to 32-bit conversion when the IU reads from the PROM. There is no EDAC or

parity checking on accesses to the PROM when PROM8 is asserted, and EDAC and

parity bits must be supplied by the PROM when PROM8 is deasserted.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

ROMCS* - PROM Chip Select (output)

This output is asserted whenever there is an access to the PROM. It can be connected

directly to the PROM chip select pins.

MEMCS*[9:0] - Memory Chip Select (output)

MEMCS*[9:0] is asserted during an access to the main memory. MEMCS*[9:8] are

redundant signals, used to substitute any of the nominal memory banks when memory

connected to any of MEMCS*[7:0] malfunctions.

OE*[1:0] - Output Enable (output)

OE*[1:0] are asserted during read accesses to the main memory and is used to control

memory devices with output enable features. Two signals are provided in order to avoid

an external buffer, since a single OE* signal would be too heavily loaded in typical

system.

MEMWR1*[1:0] - Memory Write (output)

MEMWR1* is asserted during write access to RAM, extended RAM, boot PROM

extended boot PROM. It is intended to be used as write strobe to the memory devices. If

latching buffers are used for the data bus, this signal can be used as a strobe to latch the

data and the MEMWR2* signal can be used to write the data into the main memory.

Two signals are provided in order to avoid an external buffer, since a single signal

would be too heavily loaded in typical system.

MEMWR2*[1:0] - Check Bit Write (output)

MEMWR2* is asserted during write access to RAM, extended RAM, boot PROM

extended boot PROM and exchange memory. It is intended to be used as write strobe to

check bit memory devices, if implemented. If latching buffers are used for the data bus,

this signal can be used to write both the check bits into the check bit memory and the

data bits into the main memory. Two signals are provided in order to avoid an external

buffer, since a single signal would be too heavily loaded in typical system.

RAMBEN* - RAM Buffer Enable (output)

RAMBEN* is asserted during memory accesses to RAM. It is intended to be used as

buffer enable for data and check bit buffers in the RAM.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

ROMBEN* - Boot PROM Buffer Enable (output)

ROMBEN* is asserted during memory accesses to boot PROM. It is intended to be used

as buffer enable for data and check bit buffers in the boot PROM areas.

MEMBEN* - Memory Buffer Enable (output)

MEMBEN* is asserted during memory accesses to both RAM and boot PROM. It is

intended to be used as buffer enable for data and check bit buffers in the RAM and boot

PROM areas if RAM and boot PROM share the same buffers.

DDIR - Data Direction (output)

DDIR is used for determining the direction of the data buffers connected between the

local ERC32 bus and the ERC32 system bus. The DDIR is asserted when the data flows

from the local bus to the system bus i.e. during write operations. It is valid during all

memory accesses.

DDIR* - Data Direction (output)

DDIR* is used for determining the direction of the data buffers connected between the

local ERC32 bus and the ERC32 system bus. The DDIR* is asserted when the data

flows from the local bus to the system bus i.e. during write operations. It is valid during

all memory accesses.

IOSEL*[3:0] - IO Chip Select (output)

These four select signals are used to enable one of four possible I/O address areas.

IOWR* - IO Write (output)

IOWR* is asserted during write operations to the I/O area, extended I/O area and the

exchange memory area.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

IOBEN* - IO Buffer Enable (output)

IOBEN* is asserted during I/O access, extended I/O area extended general area and

exchange memory access in order to enable the data buffers for the I/O and exchange

memory.

EXMCS* - Exchange Memory Chip Select (output)

EXMCS* is asserted when the exchange memory is accessed.

BUSRDY* - Bus Ready (input)

BUSRDY* is to be generated by a unit in the I/O area, exchange memory area or in the

extended areas, which requires extended time when accessed in addition to the

preprogrammed number of wait states. (Note however that waitstates can not be

preprogrammed for units in the extended general area, only for extended I/O, boot

PROM and RAM)

BUSERR* - Bus Error (input)

BUSERR* is to be generated together with BUSRDY* by a unit in the I/O area,

exchange memory area or in the extended areas if an error is detected by the accessed

unit during an access.

DMAREQ* - DMA Request (input)

DMAREQ* is to be issued by a unit requesting the access to the processor bus as a

master.

DMAGNT* - DMA Grant (output)

DMAGNT* is generated by the MEC as a response to a DMAREQ*. DMAGNT* is

sent after that the MEC has asserted BHOLD* and deasserted AOE*, DOE*, and COE*

for holding and three-stating the IU.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

4.2.3. Interrupt and Control Signals

IRL[3:0] - Interrupt Request Level (output)

The state of these pins defines the Interrupt Request Level (IRL). IRL[3:0] = 0000

indicates that no external interrupts are pending and is the normal state of the IRL pins.

IRL[3:0] = 1111 signifies a nonmaskable interrupt. All other interrupt levels are

maskable by the Processor Interrupt Level (PIL) field of the Processor State Register

(PSR). External interrupts are latched and prioritized by the MEC before they are passed

to the IU.

INTACK - Interrupt Acknowledge (input)

INTACK is asserted by the IU when an external interrupt is taken, not when it is

sampled and latched. The MEC will clear the corresponding pending interrupt when

INTACK is asserted.

EXTINT[4:0] - External Interrupt (input)

The five external interrupt inputs are programmable to be level or edge sensitive, and

active high (rising) or active low (falling).

EXTINTACK - External Interrupt Acknowledge (output)

EXTINTACK is for giving acknowledge to an interrupting unit which requires such a

signal. It is programmable to which of the five external interrupt input it is associated. It

is issued as soon as the IU has recognized the interrupt by asserting the INTACK signal.

SYSRESET* - System Reset (input)

Assertion of this pin will reset the MEC. Following this the MEC will then assert

RESET* for a minimum of sixteen clock cycles. SYSRESET* must be asserted for a

minimum of four clock cycles.

RESET* - Reset (output)

RESET* will be asserted when the IU and the FPU is to be synchronously reset. This

occurs when either SYSRESET* is asserted or the MEC initiate a reset due to an error

or a programming command.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

IUERR* - IU Error (input)

This input is connected to the ERROR* output of the (master) IU and is asserted when

the (master) IU enters error mode.

IUHWERR* - IU Hardware Error (input)

This input is connected to the HWERR* output of the (master) IU and is asserted when

the IU detects an internal hardware error.

IUCMPERR* - IU Comparison Error (input)

This input is connected to the CMPERR* signal of the slave IU in a master/slave

configuration and is asserted when there is a comparison error.

FPUHWERR* - FPU Hardware Error (input)

This input is connected to the HWERROR* output of the (master) FPU and is asserted

whenever there is an error in the (master) FPU.

FPUCMPERR* - FPU Comparison Error (input)

This input is connected to the CMPERR* signal of the slave FPU in a master/slave

configuration and is asserted when there is a comparison error.

MECHWERR* - MEC Hardware Error (output)

MECHWERR is an output indicating that a hardware error has been detected in the

MEC.

SYSERR* - System Error (output)

This output is asserted whenever an unmasked error is set in the ERSR register. It stays

asserted until the ERSR is cleared. The error can originate from either the IU, the FPU,

or the MEC itself. SYSERR* is used to signal to the system outside the ERC32 based

computer.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

SYSAV - System Availability (output)

This signal is asserted whenever the system is available, i.e. when the SYSAV bit in the

ERSR is set and the CPUHALT* and SYSERR* signals are deasserted. The SYSAV bit

is cleared by reset and is programmable by software.

SYSHALT* - System Halt (input)

SYSHALT* is used by the system outside to halt the ERC32. By asserting this signal,

the MEC will assert CPUHALT* halting the IU and the FPU. This signal could be used

for testing through the DMA or the TAP interface.

NOPAR* - No Parity (input)

Assertion of this signal will disable the parity checking of all signals related to the

ERC32 local buses. The parity generation on the data bus (towards memory and IO

units) is not affected by this signal, but note that parity checking is disabled if NOPAR*

is asserted. This is a static signal and shall not change when running.

ROMWRT* - ROM Write Enable (input)

Assertion of this signal will validate (allow) programming (write operations) of the boot

PROM when EEPROM devices are used.

CPUHALT* - Processor (IU and FPU) Halt (output)

This output is intended to be connected to the HALT* inputs of the IU and of the FPU

and is used to halt the IU, the FPU and possibly other units in the system.

4.2.4. Test Access Port Signals

The following Test Access Port interface (IEEE standard 1149.1) is used to perform

boundary scan for test and debugging purposes.

TCK - Test Clock (input)

Test clock for scan registers.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

TRST* - Test Reset (input)

Reset the TAP controller.

TMS - Test Mode Select (input)

Selects test mode of the TAP controller.

TDI - Test Data Input (input)

Test scan register data input.

TDO - Test Data Output (output)

Test scan register data output, not affected by MODE.

4.2.5. UART Interface

WDCLK - Watch Dog Clock (input)

WDCLK is the WD clock input but this clock can also be used as a clock input for the

UART interface. The clock frequency of WDCLK must be less than the clock frequency

of SYSCLK, i.e. f

< f

WDCLK

SYSCLK

RXA - Receive Data channel A (input)

RXA is the serial data input for channel A of the UART.

RXB - Receive Data channel B (input)

RXB is the serial data input for channel B of the UART.

TXA - Transmit Data channel A (output)

TXA is the serial data output for channel A of the UART.

TXB - Transmit Data channel B (output)

TXB is the serial data output for channel B of the UART.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

4.2.6. Power and Clock Signals

CLK2 - Double Frequency Clock (input)

CLK2 is the input clock to the ERC32 hardware. The frequency of this clock must be

twice the clock frequency used to clock the IU and the FPU. Note that the external

timing of the MEC is affected by the duty cycle of CLK2, as some MEC output signals

are latched with respect to the edges of CLK2.

SYSCLK[1:0] - Clock (output)

SYSCLK is a nominally 50% duty-cycle clock generated by the MEC from CLK2 and is

used for clocking the IU and the FPU as well as other system logic. The SYSCLK is

used as input clock during MEC slave mode.

VCCI, VCCO - Power (inputs)

These pins provide +5 V power to various sections of the MEC. Power is supplied on

two different buses to provide clean, stable power to each section: output drivers, and

the main internal circuitry. VCCO pins supply the output driver bus; and the VCCI pins

supply main internal circuitry.

VSSI, VSSO - Ground (inputs)

These pins provide ground return for the power signals. Ground is supplied on different

buses to match the power signals to each section: VSSO pins for the output driver bus;

VSSI pins for the main internal circuitry bus.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

5. ELECTRICAL AND MECHANICAL SPECIFICATION

5.1. Maximum Rating and DC Characteristics

5.1.1. Maximum Ratings

Storage Temperature

-65°C to 150°C

Ambient Temperature with power applied

-55°C to 125°C

-0.5 V to +7.0 V

Supply Voltage^[1]

Input Voltage

5.1.2. Operating Range

Range

Military

Ambient Temperature^[2]

-55°C to 125°C

Vcc

5 V ±10%

5.1.3. DC Characteristics over the Operating Range

Parameters Description Test

Min

Max Units

Conditions

Vcc=Min,

Ioh=-2.0mA

Vcc=Min

VOH

Output HIGH Voltage

3.7

VOL

VIH

VIL

IIZ

Output LOW Voltage

Input HIGH Voltage

Input LOW Voltage

Input Leakage Current

0.5 V

Vcc V

0.8 V

2.1

-0.5

-10

Vcc=Max,

Vss£VIN£Vcc

IOZ

Output Leakage Current Vcc=Max,

-15

Vss£Vout£

Vcc

ISC

Output Short Circuit

Current

Supply Current

(All outputs loaded to

50 pF)

Vcc=Max,

Vout=0V

Vcc=5V,

f=20 MHz

-30

-350 mA

100 mA

ICCop

ICCsb

Standby Current

Vcc=5V,

f=0 MHz

1 mA

Notes:

All power and ground pins must be connected before power is applied.

Ambient temperature is defined as the 'instant on' case temperature.

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

5.1.4. Capacitance Ratings

ERC32 MEC

Parameters Description

Max. (pF)

CIN

CIO

Input Capacitance

Input/Output Bus Capacitance 10

5.2. Package Description

5.2.1. Pin Assignments

Signal

ASI3

ASPAR

BA0

BA1

BHOLD*

BUSERR*

BUSRDY*

CB0

CB1

CB2

CB3

CB4

CB5

CB6

CLK2

COE*

CPUHALT*

D10

D11

D12

D13

D14

D15

D16

D17

D18

D19

D20

190

195

148

130

134

Signal

D21

D22

D23

D24

D25

D26

D27

D28

D29

D30

D31

Signal

111

251

186

184

199

198

138

236

235

129

250

141

133

131

139

137

191

187

248

211

140

Signal

189

185

182

181

180

179

178

177

176

174

175

172

173

170

171

168

167

166

165

164

162

161

160

159

158

157

155

154

153

152

150

151

IOSEL3*

IOWR*

IRL0

IRL1

IRL2

113

119

208

205

206

203

247

245

246

223

220

254

ROMCS*

ROMWRT *

RXA

RXB

SIZE0

VCCO15

VCCO16

VCCO17

VSSI1

VSSI2

VSSI3

192

163

144

136

252

210

122

106

IRL3

SIZE1

IUCMPERR*

IUERR*

IUHWERR*

LDSTO

LOCK

SYSAV

SYSCLK_0

SYSCLK_1

SYSERR*

SYSHALT*

SYSRESET*

TCK

TDI

TDO

TMS

TRST*

TXA

TXB

VCCI1

VCCI2

VCCI3

VCCI4

VCCI5

VCCO1

VCCO2

VCCO3

VCCO4

VCCO5

VCCO6

VCCO7

VCCO8

VCCO9

VCCO10

VCCO11

VCCO12

VCCO13

VCCO14

VSSI4

VSSI5

VSSO1

VSSO2

VSSO3

VSSO4

VSSO5

VSSO6

VSSO7

VSSO8

VSSO9

VSSO10

VSSO11

VSSO12

VSSO13

VSSO14

VSSO15

VSSO16

VSSO17

WDCLK

WE*

A10

A11

A12

A13

A14

A15

A16

A17

A18

A19

A20

A21

A22

A23

A24

A25

A26

A27

A28

A29

A30

A31

ALE*

AOE*

APAR

ASI0

ASI1

ASI2

DDIR

MDS*

MECHWERR* 200

DDIR*

DMAAS

DMAGNT*

DMAREQ*

DOE*

DPARIO

DRDY*

DXFER

EXMCS*

EXTCCV

EXTHOLD*

EXTINT0

EXTINT1

EXTINT2

EXTINT3

EXTINT4

EXTINTACK

FPUCMPERR* 244

FPUHWERR*

IMPAR

INTACK

INULL

IOBEN*

IOSEL0*

IOSEL1*

IOSEL2*

232

231

228

142

253

227

222

110

226

225

128

127

126

125

124

132

MEMBEN*

MEMCS0*

MEMCS1*

MEMCS2*

MEMCS3*

MEMCS4*

MEMCS5*

MEMCS6*

MEMCS7*

MEMCS8*

MEMCS9*

MEMWR1_0*

MEMWR1_1*

MEMWR2_0*

MEMWR2_1*

MEXC*

MHOLD*

NOPAR*

OE0*

OE1*

PROM8*

RAMBEN*

RESET*

104

239

143

202

238

215

219

103

102

101

100

255

256

147

213

212

146

107

242

209

121

105

WRT

243

237

214

224

118

116

115

112

145

197

196

193

194

216

108

ROMBEN*

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

5.2.2. Package Diagram

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

APPENDIX 1

TIMING DIAGRAMS

(SYSCLK @ 10 MHz)

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

Figure

Diagram Name

CLK2 to SYSCLK Skew

RAM Load-Store sequence at 0 WS with EDAC and/or Parity Protection

RAM Load at 1 waitstate with EDAC and/or Parity Protection

RAM Store at 1 waitstate with EDAC and/or Parity Protection

RAM Load with Correctable Error

Issue

RAM Load with Uncorrectable Error

RAM Load at 1 Waitstate with Access Violation

RAM Store at 1 Waitstate with Access Violation

RAM Store at 0 Waitstate with Access Violation

RAM Store Byte/Halfword with No Error / Correctable Error

RAM Store Byte/Halfword with Uncorrectable Error

RAM Store Double

RAM Store Double with exception in 2:nd word

PROM bytewide Load at 2 waitstates

PROM bytewide Store at 1 waitstate

PROM 40-bit wide Load at 2 waitstate

PROM 40-bit wide Store at 1 waitstate

MEC Register Load

MEC Register Store

Exchange Memory Load with no parity or EDAC protection

Exchange Memory Store with EDAC and/or parity protection

Exchange Memory Load with Busy and with EDAC and/or parity protection

Exchange Memory Store with Busy and with EDAC and/or parity protection

IO Load at 3 waitstates

IO Store at 2 waitstates

IO Load with Busy

IO Store at 0 waitstate with Busy

Extended Area Load with Busy

Extended Area Store with Busy

DMA RAM Load

10.

11.

12.

13.

14.

15.

16.

17.

18.

19.

20.

21.

22.

23.

24.

25.

26.

27.

28.

29.

30.

31.

32.

33.

34.

35.

36.

37.

38.

39.

40.

41.

42.

43.

44.

45.

46.

DMA RAM Store

DMA IO Load

DMA IO Store

DMA IO Load with Exception

DMA RAM Load with Correctable Error

DMA RAM Load with Uncorrectable Error

Power Down Mode after writing to Power Down Register

TAP Control Timing

Reset Timing

Halt Timing

External Error with Reset Timing

External Error with CPUHALT Timing

Internal MEC Error with Reset Timing

Internal MEC Error with CPUHALT Timing

Edge Triggered Interrupt Timing

Level Triggered Interrupt Timing

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

Name

Min

Max

Comment

SYSCLK period

Reference Edge

0,45*t3 0,55*t3 CLK2, high and low pulse width

CLK2 period

Address Input Setup Time

Address Input Hold Time

SYSCLK+

ASI(7:0), SIZE(1:0), RD, WRT, WE*, LOCK, LDSTO, DXFER Input Setup

Time

ASI(7:0), SIZE(1:0), RD, WRT, WE*, LOCK, LDSTO, DXFER Input Hold

Time

SYSCLK+

t9 *)

t10*)

ALE* Output Delay

SYSCLK-

Address Valid

SYSCLK+

Address Valid to MEC Internal Chip Select Delay

MEMCS*(9:0), ROMCS*, EXMCS* Maximum Clock to

Output Delay

t11

MEMCS*(9:0), ROMCS*, EXMCS* Minimum Clock to

Output Delay

SYSCLK+

t12 *)

t13

MEMCS*(9:0), ROMCS*, EXMCS* Output Latch

Propagation Delay

MEMBEN*, RAMBEN*, ROMBEN* Output Delay

CLK2+ (lo->hi),

CLK2- (hi->lo)

CLK2+

t14

t15

t16

DDIR Output Delay

MEMWR1*, MEMWR2*, IOWR* Output Delay

OE* Output Delay

CLK2-

CLK2+ (lo->hi),

CLK2- (hi->lo)

SYSCLK+

SYSCLK- (lo->hi),

SYSCLK+ (hi->lo)

SYSCLK-

SYSCLK+

SYSCLK-

SYSCLK+

SYSCLK-

t17

t18

Boot PROM Address (BA) Output Delay

IOSEL*(3:0) Clock to Output Delay

t19

t20

t21

t22

t23

t24

t25

t26

t27 **)

t28

t29

t30

t31

t32

t35

t36

t37

t38

t39

t40

t42

t43

t44

t45

t46

Data Setup Time During Store

Data Hold Time During Store

MEC Data and DPARIO Maximum Output Delay

MEC Data and DPARIO Valid to High-Z Delay

CB* Output Maximum Delay

CB* Output Valid to High-Z Delay

MEXC* Output Delay

MHOLD*, BHOLD* Output Delay

AOE*, COE*, DOE*, TOE* Output Delay

INTACK Input Setup Time

INTACK Input Hold Time

SYSRESET*, SYSHALT* Input Setup

SYSRESET*, SYSHALT* Input Hold

RESET*, CPUHALT* Output Delay

INULL Input Setup

INULL Input Hold

MDS/DRDY* Output Delay

BUSRDY*, BUSERR* Input Setup

BUSRDY*, BUSERR* Input Hold

DMAREQ* Input Setup Time

DMAGNT* Output Delay

IRL(3:0), EXTINTACK Output Delay

EXTINT(4:0) Input Setup

SYSCLK-

SYSCLK+

EXTINT(4:0) Input Hold

IUERR*, IUHWERR, IUCMPERR*, FPUHWERR*, FPUCMPERR* Input

Setup

t47

IUERR*, IUHWERR, IUCMPERR*, FPUHWERR*, FPUCMPERR* Input

Hold

SYSCLK+

t48

t49

t50

t53

t54

SYSERR*, SYSAV, MECHWERR* Output Delay

NOPAR, ROMWRT*, PROM8* Input Setup Time

NOPAR, ROMWRT*, PROM8* Input Hold Time

APAR, ASPAR, IMPAR Input Setup Time

APAR, ASPAR, IMPAR Input Hold Time

SYSCLK+

SYSRESET-

SYSRESET+

SYSCLK+

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

t55

t56

t57

t58

t59

t60

t61

t62

t63

t66

t68

t69

t70

t71

t73

100

1000

TCLK Period Time

TRST* Input Setup

TRST* Input Hold

TMS Input Setup

TMS Input Hold

TDI Input Setup

TDI Input Hold

TDO Output Delay

WDCLK Clock Period Time

DPARIO generation Time including Output Delay

ExtHold, ExtCCV Input Setup

SYSCLK High to Low Output Delay

SYSCLK Low to High Output Delay

Data and checkbits Setup Time MEC during load

Data Valid to MHOLD* Delay when MEC checks parity

and checkbits

TCLK +

>t1

Data Valid

SYSCLK+

CLK2+

SYSCLK+

Data Valid

t74

t75

t78

DMAAS Input Setup

DMMAS Input Hold

Data, Parity and Checkbits Hold during Load

SYSCLK+

SYSCLK-

SYSCLK+

For the chip select timing the following formula applies:

If (address valid before SYSCLK+) > t9 then (chip select output delay time) = t10

else (chip select output delay time) = t9+t12

**)

DOE* is deasserted on SYSCLK- during store byte/halfword

Abreviations used in the timing diagrams :

FAn: Fetch address n,

SAn: Store address n,

LAn: Load address n,

TAn: Trapp address n

FDn: Fetch data n,

SDn: Store data n,

LDn: Load data n,

TDn: Trapp data n,

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

t69

t70

t69

t70

SYSCLK

Figure 1) CLK2 to SYSCLK Skew

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

LA1

A (31:0)

ALE*

FA1

SA1

FA2

t10

t12

t11

MEMCS*(0)

MEMCS*(1)

t10

t13

t12

t11

t13

t14

RAMBEN*,MEMBEN*

DDIR

t14

t15

MEMWR1*

MEMWR2*

OE*

t15

t16

t20

t71

t78

t19

SD1

D (31:0),DPARIO

CB(6:0)

FD1

LD1

t23

t24

FCB1

LCB1

SCB1

Figure 2) RAM Load-Store Sequence at 0 Waitstates with EDAC and/or Parity Protection

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

A (31:0)

LA1

FA2

FA3

LA1

ALE*

t10

t13

t12

MEMCS*(0)

t13

RAMBEN*, MEMBEN*

DDIR

t14

t16

t14

t16

OE*

MHOLD*

t26

t37

t26

t37

t26

t37

MDS*

t71

t78

D (31:0),DPARIO

CB(6:0)

FD1

LD1

FD2

t71

FCB1

LCB1

FCB2

Figure 3) RAM Load at 1 waitstate with EDAC and/or Parity Protection

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

A (31:0)

SA1

FA2

FA3

ALE*

t10

t13

t12

t11

MEMCS*(0)

t13

t14

t13

t14

RAMBEN*, MEMBEN*

DDIR

t15

MEMWR1*

MEMWR2*

MHOLD*

t15

t26

t20

t19

SD1

D (31:0),DPARIO

CB(6:0)

FD1

t23

t24

FCB1

SCB1

Figure 4) RAM Store at 1 waitstate with EDAC and/or Parity Protection

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

A (31:0)

LA1

FA2

FA3

ALE*

t10

t13

t12

t11

MEMCS*(0)

t13

t16

t13

t16

t13

t16

RAMBEN*, MEMBEN*

DDIR

t16

OE*

t26

t73

t26

t37

MHOLD*

MDS*

t37

t43

IRL(3:0)

t71

LD1 ERROR

t78

t21

LD1 OK

t22

D (31:0),DPARIO

CB(6:0)

FD1

FD2

FCB1

LCB1

FCB2

Figure 5) RAM Load at 0 waitstate with Correctable Error

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

A (31:0)

LA1

FA2

FA3

ALE*

t10

t13

t16

t12

MEMCS*(0)

t13

t16

t13

t16

RAMBEN*, MEMBEN*

DDIR

t16

OE*

t26

t73

t26

t37

t25

MHOLD*

MDS*

t37

t25

MEXC*

t71

t78

D (31:0),DPARIO

CB(6:0)

FD1

LD1 ERROR

FD2

t71

LCB1

FCB1

FCB2

Figure 6) RAM Load with Uncorrectable Error at 0 WS

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

A (31:0)

LA1

FA2

FA3

ALE*

t10

t13

t12

t13

t11

MEMCS*(0)

t13

t16

t13

RAMBEN*, MEMBEN*

DDIR

t16

t26

t37

t25

OE*

MHOLD*

MDS*

t26

t37

t25

MEXC*

D (31:0),DPARIO

CB(6:0)

FD1

FD2

FCB1

FCB2

Figure 7) RAM Load at 1 Waitstate with Access Violation

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

A (31:0)

FA1

SA1

FA2

TA1

ALE*

MEMCS*(0)

t12

t10

t13

t11

t13

t14

t13

RAMBEN*, MEMBEN*

t14

DDIR

MEMWR1*

MEMWR2*

t26

t37

MHOLD*

MDS*

t37

t25

MEXC*

Due to the violation no data is stored

SD1

D (31:0),DPARIO

FD1

FD2

Figure 8) RAM Store at 1 waitstate with Access Violation

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

A (31:0)

ALE*

FA1

SA1

FA2

TA1

TA2

t10

t12

t11

MEMCS*(0)

t13

t14

t13

RAMBEN*, MEMBEN*

t14

DDIR

MEMWR1*

MEMWR2*

t26

t37

t26

t37

MHOLD*

MDS*

t25

MEXC*

Due to the violation no data is stored

SD1

D (31:0),DPARIO

FD1

FD2

TD1

TD2

Figure 9) RAM Store at 0 waitstate with Access Violation

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

A (31:0)

FA1

SA1

FA2

FA3

SIZE(1:0)

ALE*

00/01

t10

t13

t12

t11

MEMCS*(0)

t13

t14

MEMBEN*

DDIR

t14

t15

MEMWR1*

MEMWR2*

OE*

t15

t16

t26

MHOLD*

DOE*

t27

t20

t78

t19

IU drives subword

t71

t21

t22

D (31:0),DPARIO

CB(6:0)

FD0

FD1

Old data

New data

FD2

t71

t23

t24

FCB0

FCB1

Old CB

New CB

FCB2

Figure 10) RAM Store Byte/Halfword with No Error / Correctable Error

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

A (31:0)

FA1

SA1

FA2

TA1

SIZE(1:0)

ALE*

00/01

t10

t13

t12

t11

MEMCS*(0)

MEMBEN*

t13

t14

t16

DDIR

MEMWR1*

MEMWR2*

t16

OE*

DOE*

t27

t26

MHOLD*

MDS*

t37

t25

MEXC*

t20

t78

t19

IU drives subword

t71

t21

t22

(31:0),DPARIO

CB(6:0)

FD0

FD1

Old data

New data

FD2

t71

t23

t24

FCB0

FCB1

Old CB

New CB

FCB2

Figure 11) RAM Store Byte/Halfword with Uncorrectable Error

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

A (31:0)

SIZE(1:0)

ALE*

FA1

DSA1

DSA2

FA2

FA3

t10

t13

t12

t11

MEMCS*

t13

MEMBEN*

DDIR

t14

t15

MEMWR1*

MEMWR2*

OE*

t15

t16

t26

MHOLD*

t20

t19

t20

t19

DSD2

D (31:0),DPARIO

CB(6:0)

FD0

FD1

DSD1

FD2

t23

t24

FCB0

FCB1

DCB1

DCB2

FCB2

Figure 12) RAM Store Double at 0 WS

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

A (31:0)

SIZE(1:0)

ALE*

FA1

DSA1

DSA2

FA2

TA1

t10

t13

t12

t11

MEMCS*

t13

MEMBEN*

DDIR

t14

t15

MEMWR1*

MEMWR2*

OE*

t15

t16

t26

MHOLD*

MDS*

t37

t25

MEXC*

t19

t20

D (31:0),DPARIO

CB(6:0)

FD0

FD1

DSD1

DSD2

FD2

t23

t24

FCB0

FCB1

DCB1

DCB2

FCB2

Figure 13) RAM Store Double at 0 WS with exception in 2:nd word

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

5--7

ACCESS OF BYTE 2 AND 1 ARE NOT SHOWN HERE

CLK2

SYSCLK

A (31:0)

FA1

LA1

FA2

FA3

ALE*

t12

t10

t11

ROMCS*

t13

ROMBEN*

t13

t16

t13

MEMBEN*

DDIR

t16

t17

OE*

BA(1:0)

MHOLD*

MDS*

t17

01/10

t26

t37

t78

t71

LD1 BYTE 3

t71

LD BYTE 0

t21 t22

LD1 IU DATA

D (31:0)

DPARIO

FD1

BYTE 2/1

t21 t22

generated

FDP1

Figure 14) PROM bytewide Load at 2 waitstates

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

A (31:0)

SA1

FA2

SIZE(1:0)

ALE*

t10

t11

ROMCS*

t13

MEMBEN*

ROMBEN*

RAMBEN*

DDIR

t13

t14

t13

t14

t15

MEMWR1*

OE*

t16

t17

BA(1:0)

BYTE ADDRESS

t26

MHOLD*

t20

t19

D (7:0)

FD1

SD1

FD2

Fig 15) PROM Bytewide Store at 1 WS

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

A (31:0)

FA1

LA1

FA2

FA3

ALE*

ROMCS*

t10

t11

t13

MEMBEN*

ROMBEN*

RAMBEN*

DDIR

t16

OE*

MHOLD*

MDS*

t26

t37

t78

PROMtpd

t71

LD1

D (31:0),DPARIO

CB(6:0)

FD0

FD1

FD2

t71

LCB1

FCB0

FCB1

FCB2

Fig 16) PROM 40 bit wide load at 2 WS

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

A (31:0)

ALE*

FA1

SA1

FA2

FA3

t10

t11

ROMCS*

t13

MEMBEN*

ROMBEN*

RAMBEN*

t14

DDIR

MEMWR1*

MEMWR2*

OE*

t15

t16

t26

MHOLD*

IUDATAtpd

IUDATAhold

D (31:0),DPARIO

CB(6:0)

FD0

FD1

LD1

FD2

t23

Fig 17) PROM 40 bit wide store at 1 WS

t20

FCB0

FCB1

LCB1

FCB2

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

A (31:0)

ASI(7:0)

SIZE(1:0)

ALE*

FA1

09H

LA1

0BH

FA2

09H

FA3

09H

DXFER

WRT

WE*

t16

OE*

t21

t22

D (31:0), DPARIO

CB(6:0)

FD0

FD1

LD1

FD2

FCB0

FCB1

FCB2

Fig 18) MEC Register Load

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

A (31:0)

ASI(7:0)

SIZE(1:0)

ALE*

FA1

09H

SA1

0BH

SA1

0BH

FA2

09H

FA3

09H

DXFER

WRT

WE*

t14

t16

t14

DIR

OE*

t16

t19

IUDATAtpd

SD1

t20

IUDATAhold

(31:0), DPARIO

CB(6:0)

FD0

FCB0

FD1

FCB1

FD2

FCB2

Fig 19) MEC Register Store

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

Addr Wait1

Addr Wait2

Load

SYSCLK

A (31:0)

FA1

LA1

FA2

FA3

ALE*

t10

t12

t11

EXMCS*

t13

t16

t13

t16

IOBEN*

DDIR

OE*

MHOLD*

MDS*

t26

t37

t38

t39

BUSRDY*

D (31:0)

DPARIO

EMEMtpd

t71

t78

FD0

FD1

LD1

FD2

t66

Fig 20) Exchange Memory Load with no Parity or EDAC Protection

FDP0

FDP1

DPAR

FDP2

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

Addr Wait1

Addr Wait2

Store 1

Store 2

SYSCLK

A (31:0)

ALE*

FA1

SA1

FA2

FA3

t10

t13

t12

t11

EXMCS*

IOBEN*

DDIR

t13

t14

t15

IOWR*

t15

MEMWR2*

OE*

t16

t26

MHOLD*

MDS*

t38

t39

BUSRDY*

t20

t19

IUDATAtpd

t23

IUDATAhold

D (31:0), DPARIO

CB(6:0)

FD0

FD1

SD1

FD2

t24

FCB0

FCB1

SCB1

FCB2

Fig 21) Exchange Memory Store with EDAC and/or Parity Protection

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

Addr Wait1

Busy N+1 Cycl.

WS Cycl.

Load

SYSCLK

A (31:0)

FA1

LA1

FA2

FA3

ALE*

t10

t12

t11

EXMCS*

t13

t16

t13

IOBEN*

DDIR

t16

OE*

MHOLD*

MDS*

t26

t37

t39

t38

BUSRDY*

D (31:0)

t71

t78

EMEMtpd

FD0

FD1

LD1

FD2

t66

DPARIO

FDP0

FDP1

DPAR

FDP2

Fig 22) Exchange Memory Load Busy with EDAC and/or Parity Protection

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

Addr Wait1

Addr Wait2

Busy N+1 Cycl.

Store 1

Store 2

SYSCLK

A (31:0)

ALE*

FA1

SA1

FA2

FA3

t10

t13

t12

t11

EXMCS*

IOBEN*

DDIR

t13

t14

t15

IOWR*

t15

MEMWR2*

OE*

t16

t26

MHOLD*

MDS*

t39

t38

BUSRDY*

t20

t19

SD1

IUDATAtpd

IUDATAhold

D (31:0), DPARIO

CB(6:0)

FD0

FD1

FD2

t23

t24

FCB0

FCB1

SCB1

FCB2

Fig 23) Exchange Memory Store with Busy and with EDAC and/or Parity Protection

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

Wait1

Wait2

Wait3

Load

Wait 4

SYSCLK

LA1

A (31:0)

ALE*

FA1

FA2

FA3

t18

IOSEL*(x)

t13

IOBEN*

DDIR

t26

MHOLD*

MDS*

OE*

t37

t16

t78

IOtpd

t71

LD1

D (31:0),DPARIO

FD0

FD1

FD2

Fig 24) IO Load at 3 waitstates

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

Wait1

Wait 2

Store 1

Store 2

SYSCLK

A (31:0)

ALE*

FA1

SA1

FA2

FA3

FA4

t18

IOSEL*(x)

IOBEN*

DDIR

t13

t14

t15

IOWR*

t26

MHOLD*

MDS*

t16

OE*

BUSRDY*

t19

t20

IUDATAtpd

D (31:0),DPARIO

FD0

FD1

LD1

FD2

FD3

Fig 25) IO Store at 2 waitstates

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

Wait1

Busy Waiting

Load

Wait 4

SYSCLK

LA1

A (31:0)

ALE*

FA1

FA2

FA3

t18

IOSEL*(x)

t13

IOBEN*

DDIR

t26

MHOLD*

MDS*

t37

t16

OE*

t38

t39

t38

t39

BUSRDY*

t78

IOtpd

t71

LD1

D (31:0),DPARIO

FD0

FD1

FD2

Fig 26) IO Load with Busy

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

Wait1

Busy waiting

Store 1

Store 2

SYSCLK

A (31:0)

ALE*

FA1

SA1

FA2

FA3

FA4

t18

IOSEL*(x)

IOBEN*

DDIR

t13

t14

t15

IOWR*

t26

MHOLD*

MDS*

t16

OE*

t38

t39

t38

t39

BUSRDY*

t19

t20

IUDATAtpd

31:0),DPARIO

FD0

FD1

STD1

FD2

FD3

Fig 27) IO Store at 0 waitstates with Busy

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

Addr Wait1

Busy N+1 Cycl.

Load

SYSCLK

A (31:0)

FA1

LA1

FA2

ALE*

t13

t16

t13

t16

xxBEN*

DDIR

OE*

MHOLD*

MDS*

t26

t37

t39

t38

BUSRDY*

D (31:0)

t71

t78

EDATAtpd

FD0

FD1

LD1

FD2

t66

DPARIO

FDP0

FDP1

DPAR

FDP2

Fig 28) Extended Area Load with Busy

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

Addr Wait1

Busy waiting

Store 1

Store 2

SYSCLK

A (31:0)

ALE*

FA1

SA1

FA2

FA3

t13

xxBEN*

DDIR

t14

t15

MEMWR1*

MEMWR2*

OE*

t15

t16

t26

MHOLD*

MDS*

t39

t38

t39

BUSRDY*

t20

t19

IUDATAtpd

t23

IUDATAhold

D (31:0), DPARIO

CB(6:0)

FD0

FD1

SD1

FD2

t24

FCB0

FCB1

SCB1

FCB2

Fig 29) Extended Area Store with Busy

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

DMAADRtpd

DMAADRhold

A(31:0)

FA0

FA1

DMAA1

DMAA2 If block transfer

FA1

FA2

SIZE(1:0)

ALE*

Block transfer

t10

t11

MEMCS*(0)

t13

t16

t13

t16

t13

MEMBEN*

DDIR

OE*

BHOLD*

t26

Block transfer

t27

COE*/AOE*/DOE*

DMAAS

HIGH: If block transfer

t74

t75

t74

Block transfer

t75

t40

DMAREQ*

LOW: If block transfer

t42

DMAGNT*

LOW: If block transfer

WRT

t37

DRDY*

t21

t71

DMAD

t78

t22

D(31:0)

CB(6:0)

FD0

Corrected DMAD

FD1

FCB0

DMACB

FCB1

Fig30) DMA RAM Load

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

DMAADRtpd

DMAADRhold

A(31:0)

FA0

FA1

DMAA1

DMAA2 If block transfer

FA1

FA2

SIZE(1:0)

ALE*

MEMCS*(0)

MEMBEN*

DDIR

Block transfer

t10

t11

t13

t14

t15

MEMWR1*

t15

MEMWR2*

OE*

t26

Block transfer

BHOLD*

OE*/AOE*/DOE*

DMAAS

t27

HIGH: If block transfer

t74

t75

t74

Block transfer

t75

t40

DMAREQ*

LOW: If block transfer

t42

DMAGNT*

LOW: If block transfer

WRT

t37

DRDY*

D(31:0)

CB(6:0)

t19

t20

FD0

DMAD1

DMAD2block tr.

FD1

t23

DMACB

t24

FCB0

FCB1

Fig31) DMA RAM Store

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

DMAADRtpd

DMAADRhold

A(31:0)

FA1

DMAA1

DMAA2 If block transfer

FA1

FA2

SIZE(1:0)

ALE*

Block transfer

t18

IOSEL*

t13

t16

t13

IOBEN*

DDIR

OE*

BHOLD*

t26

Block transfer

t27

COE*/AOE*/DOE*

DMAAS

HIGH: If block transfer

t74

t75

t74

Block transfer

t75

t40

DMAREQ*

LOW: If block transfer

t42

DMAGNT*

WRT

t37

DRDY*

t71

t78

D(31:0)

CB(6:0)

FD0

DMAD

FD1

FCB0

FCB1

Fig 32: DMA IO Load

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

DMAADRtpd

DMAADRhold

A(31:0)

FA0

FA1

DMAA1

DMAA2 If block transfer

FA1

FA2

SIZE(1:0)

Block transfer

ALE*

IOSEL*

IOBEN*

DDIR

t18

t13

t14

t15

IOWR*

OE*

t26

Block transfer

BHOLD*

OE*/AOE*/DOE*

DMAAS

t27

HIGH: If block transfer

t74

t75

t74

t75

Block transfer

t40

DMAREQ*

LOW: If block transfer

t42

DMAGNT*

WRT

t37

DRDY*

D(31:0)

CB(6:0)

t19

t20

FD0

DMAD1

DMAD2block tr.

FD1

t23

t24

FCB0

DMACB

FCB1

Fig33) DMA IO Store

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

DMAADRtpd

DMAADRhold

A(31:0)

FA1

DMAA1

DMAA2 If block transfer

FA1

FA2

SIZE(1:0)

ALE*

Block transfer

t18

IOSEL*

t13

t16

t13

IOBEN*

DDIR

OE*

BHOLD*

t26

Block transfer

t27

COE*/AOE*/DOE*

DMAAS

HIGH: If block transfer

t74

t75

t74

Block transfer

t75

t40

DMAREQ*

LOW: If block transfer

t42

DMAGNT*

WRT

t37

DRDY*

MEXC*

t25

t71

t78

D(31:0)

CB(6:0)

FD0

DMAD with Exception

FD1

FCB0

FCB1

Fig 34: DMA IO Load with exception

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

DMAADRtpd

DMAADRhold

A(31:0) FA0

FA1

DMAA1

DMAA2 If block transfer

FA1

FA2

SIZE(1:0)

ALE*

Block transfer

t10

t11

MEMCS*(0)

t13

t16

t13

t16

t13

MEMBEN*

DDIR

OE*

BHOLD*

t26

Block transfer

t27

COE*/AOE*/DOE*

DMAAS

HIGH: If block transfer

t74

t75

t74

Block transfer

t75

t40

DMAREQ*

LOW: If block transfer

t42

DMAGNT*

LOW: If block transfer

WRT

t37

DRDY*

t43

IRL

MEXC*

t21

t71

t78

t22

D(31:0)

CB(6:0)

FD0

DMAD

Corrected DMAD

FD1

FCB0

DMACB

FCB1

Fig35) DMA RAM Load with Correctable error

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

DMAADRtpd

DMAADRhold

A(31:0) FA0

FA1

DMAA1

DMAA2 If block transfer

FA1

FA2

SIZE(1:0)

ALE*

Block transfer

t10

t11

MEMCS*(0)

t13

t16

t13

t16

t13

MEMBEN*

DDIR

OE*

BHOLD*

t26

Block transfer

t27

COE*/AOE*/DOE*

DMAAS

HIGH: If block transfer

t74

t75

t74

Block transfer

t75

t40

DMAREQ*

LOW: If block transfer

t42

DMAGNT*

LOW: If block transfer

WRT

t37

DRDY*

IRL

t25

MEXC*

t21

t71

DMAD

t78

t22

D(31:0)

CB(6:0)

FD0

Invalid DMAD

FD1

FCB0

DMACB

FCB1

Fig36) DMA RAM Load with Uncorrectable error

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

N Cycles

N+1

N+2

N+3

N+4

CLK2

SYSCLK

A (31:0)

ASI(7:0)

FA1

09H

SA1

0BH

SA1

0BH

FA2

09H

FA2

09H

FA2

09H

FA3

09H

ALE*

DXFER

WRT

WE*

t26

Power down mode until any interrupt detected by MEC

BHOLD*

COE*/AOE*/DOE*

DMAREQ*

t27

t40

DMA alowed

t40

t42

DMAGNT*

OE*

t43

IRL(3:0)

INTRERRUPT ASSERTED

t19

SD1

t20

D (31:0), DPARIO

CB(6:0)

FD0

FD1

FD2

FCB0

FCB1

FCB2

Fig 37) Power down mode after writing to MEC Power Down Register

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

Logic RESET

IDLE

Sel. DR Sc.

Sel. IR Sc.

Capt. IR

Shift IR

Exit IR

Update IR

IDLE

t55

TCLK1

TRST*

TMS

t57

t56

t59

t58

t59

t58

t61

t60

TDI

t62

TDO

Fig 38) TAP Control Timing

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

15 cycles

CLK2

All clocks are not shown

SYSCLK

A(31:0)

FAn

09 H

FAn+1

09 H

0 H

09 H

4 H

09 H

8 H

09 H

ASI(7:0)

SIZE(1:0)

ALE*

t36

t35

INULL

t30

t31

t30

SYSRESET*

NOPAR*

t49

t50

CMODE*

PROM8*

IU Boot using 40-bit PROM

t32

RESET* is asserted for 16 SYSCLK

t32

RESET*

Fig 39) Reset Timing

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

A(31:0)

FAn-1

09 H

FAn

09 H

FAn+1

09 H

FAn+1

09 H

FAn+1

09 H

FAn+2

09 H

FAn+3

09 H

FAn+4

09 H

ASI(7:0)

SIZE(1:0)

ALE*

t30

t30 t31

t31

SYSHALT*

BHOLD*

SYSAV

t26

t48

t32

t48

t32

CPUHALT*

D31:0),DPARIO

FDn-2

FDn-1

FDn

FDn+1

FDn+2

FDn+3

Fig 40) Halt Timing

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

13 cycles

CLK2

Not all cyclkes is shown

SYSCLK

A(31:0)

FAn-1

09 H

FAn

FAn+1

09 H

FAn+1

09 H

0 H

09 H

4 H

8 H

ASI(7:0)

SIZE(1:0)

09 H

ALE*

XERR*

SYSAV

t46 t47

t48

t32

RESET* asserted for 16 SYSCLK cycles

RESET*

D31:0),DPARIO

FDn-2

FDn-1

FDn

FD0

FD4

Fig 41) External Error with Reset Timing

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

A(31:0)

FAn-1

FAn

FAn+1

09 H

FAn+1

09 H

ASI(7:0)

SIZE(1:0)

09 H

ALE*

XERR*

t46

t47

t48

t26

SYSERR*

BHOLD*

SYSAV

t48

t32

CPUHALT*

D31:0),DPARIO

FDn-2

FDn-1

FDn

Fig 42) External Error with Halt Timing

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

13 cycles

CLK2

Not all cyclkes is shown

SYSCLK

A(31:0)

FAn-1

09 H

FAn

FAn+1

09 H

FAn+1

09 H

0 H

09 H

4 H

8 H

ASI(7:0)

SIZE(1:0)

09 H

ALE*

MECHWERR*

SYSERR*

t48

t32

SYSAV

t32

RESET* asserted for 16 SYSCLK cycles

RESET*

D31:0),DPARIO

FDn-2

FDn-1

FDn

FD0

FD4

Fig 43) Internal MEC Error with Reset Timing

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

SYSCLK

A(31:0)

FAn-1

FAn

FAn+1

09 H

FAn+1

09 H

ASI(7:0)

SIZE(1:0)

09 H

ALE*

MECHWERR*

SYSERR*

BHOLD*

t48

t26

t48

t32

SYSAV

CPUHALT*

D31:0),DPARIO

FDn-2

FDn-1

FDn

Fig 44) Internal MEC Error with Halt Timing

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

Prioritized

Sampled

Latched

Taken

SYSCLK

A(31:0)

FA(-1)

FD(-2)

FA0

FA1

FD0

FA2

FA3

FA4

FD3

TTA0

TTA1

TD0

TSA0

TD1

TSA1

TSD0

TSA2

ALE*

D31:0),DPARIO

INULL

FD(-1)

FD1

FD2

FD4

TSD1

t43

IRL(3:0)

0 H

2 H

0 H

t44

t45

EXTINT(0)

t29

t28

INTACK

Fig 45) Edge triggered interrupt Timing

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E

CLK2

Prioritized

Sampled

Latched

Taken

SYSCLK

A(31:0)

FA(-1)

FD(-2)

FA0

FA1

FD0

FA2

FA3

FA4

FD3

TTA0

TTA1

TD0

TSA0

TD1

TSA1

TSD0

t43

TSA2

ALE*

D31:0),DPARIO

INULL

FD(-1)

FD1

FD2

FD4

TSD1

t43

IRL(3:0)

EXTINT(0)

0 H

2 H

0 H

t44

t45

t43

EXTINTACK

t29

t28

INTACK

Fig 46) Level triggered interrupt Timing

MATRA MHS

Rev. D (10 Apr. 97)

TSC693E [ATMEL]

相关型号：

TSC695E

TSC695F

TSC695F-25MA

TSC695F-25MA-E

TSC695F-25MAMQ

TSC695F-25MB-E

TSC695F-25SASB

TSC695F-25SASV

TSC695FL

TSC695FL-15MA

TSC695FL-15MA-E

TSC695FL-15MB-E