HFCT-5951NG [AVAGO]
FIBER OPTIC TRANSCEIVER, 1270-1570nm, 622Mbps(Tx), 622Mbps(Rx), BOARD/PANEL MOUNT, LC CONNECTOR, PLASTIC, DIP-10;
| 型号： | HFCT-5951NG |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | FIBER OPTIC TRANSCEIVER, 1270-1570nm, 622Mbps(Tx), 622Mbps(Rx), BOARD/PANEL MOUNT, LC CONNECTOR, PLASTIC, DIP-10 通信 ATM 异步传输模式 放大器 光纤 |
| 文件： | 总19页 (文件大小：316K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Agilent HFCT-5951NL/NG and
HFCT-5952NL/NG Single Mode Laser
Small Form Factor Transceivers for ATM,
SONET OC-12/SDH STM-4 (L4.1)
Part of the Agilent METRAK family
Data Sheet
Features
•
HFCT-595xNL/NG are compliant
to the long reach SONET OC-12/
SDH STM-4 (L4.1) specifications
Multisourced 2 x 5 and 2 x 10
package styles with LC receptacle
Single +3.3 V power supply
Temperature range:
•
•
•
Description
The HFCT-595xNL/NG
transceivers are high
HFCT-595xNL/NG: 0 °C to +70 °C
Wave solder and aqueous wash
process compatible
Manufactured in an ISO9002
certified facility
Performance HFCT-595xNL/NG:
Links of 40 km with 9/125 µm SMF
Fully Class 1 CDRH/IEC 825
compliant
The receiver section uses a
MOVPE grown planar PIN
photodetector for low dark
current and excellent
responsivity.
•
•
•
•
•
performance, cost effective
modules for serial optical data
communications applications
specified for a signal rate of
622 Mb/s. They are designed
to provide SONET/SDH
compliant links for 622 Mb/s
long reach links.
A pseudo-ECL logic interface
simplifies interface to external
circuitry.
These transceivers are supplied
in the new industry standard
2 x 5 and 2 x 10 DIP style
footprint with the LC fiber
connector interface and are
fully compliant with SFF Multi
Source Agreement (MSA).
Pin Outs:
All modules are designed for
single mode fiber and operate
at a nominal wavelength of
1300 nm. They incorporate
high performance, reliable, long
wavelength optical devices and
proven circuit technology to
give long life and consistent
service.
HFCT-5951NL/NG
HFCT-5952NL/NG
2 x 5
2 x 10
Applications
•
SONET/SDH equipment
interconnect,
STS-12/SDH STM-4 rate
Long reach (up to 40 km)
ATM links
•
The transmitter section
consists of a Distributed
Feedback Laser (DFB)
packaged in conjunction with
an optical isolator for excellent
back reflection performance.
The transmitter has full IEC
825 and CDRH Class 1 eye
safety.
Functional Description
Receiver Section
Design
Noise Immunity
Figure 1 also shows a filter
function which limits the
bandwidth of the preamp
output signal. The filter is
designed to bandlimit the
preamp output noise and thus
improve the receiver
The receiver section contains
an InGaAs/InP photo detector
and a preamplifier mounted in
an optical subassembly. This
optical subassembly is coupled
to a postamp/decision circuit.
The receiver includes internal
circuit components to filter
power supply noise. However
under some conditions of EMI
and power supply noise,
external power supply filtering
may be necessary (see
The postamplifier is ac coupled
to the preamplifier as
sensitivity.
application section).
These components will reduce
the sensitivity of the receiver
as the signal bit rate is
illustrated in Figure 1. The
coupling capacitors are large
enough to pass the SONET/
SDH test pattern at 622 MBd
without significant distortion
or performance penalty. If a
lower signal rate, or a code
which has significantly more
low frequency content is used,
sensitivity, jitter and pulse
distortion could be degraded.
The Signal Detect Circuit
The signal detect circuit works
by sensing the peak level of
the received signal and
comparing this level to a
reference. The SD output is
low voltage TTL.
increased above 622 Mb/s.
The device incorporates a
photodetector bias circuit. This
output must be connected to
V
CC
and can be monitored by
connecting through a series
resistor (see application
section).
PHOTODETECTOR
BIAS
DATA OUT
FILTER
TRANS-
IMPEDANCE
PRE-
PECL
OUTPUT
BUFFER
AMPLIFIER
AMPLIFIER
DATA OUT
GND
TTL
OUTPUT
BUFFER
SIGNAL
DETECT
CIRCUIT
SD
Figure 1. Receiver Block Diagram
2
Functional Description
Transmitter Section
Design
The transmitter section uses a
distributed feedback (DFB)
laser as its optical source, see
Figure 2. The source is
packaged in conjunction with
an optical isolator to provide
excellent back reflection
performance. The package has
been designed to be compliant
with IEC 825 eye safety
requirements under any single
fault condition. The optical
output is controlled by a
custom IC that detects the
laser output via the monitor
photodiode. This IC provides
both dc and ac current drive
to the laser to ensure correct
modulation, eye diagram and
extinction ratio over
The transmitter section also
includes monitor circuitry for
both the laser diode bias
current and laser diode optical
power.
temperature, supply voltage
and operating life.
DFB
LASER
PHOTODIODE
(rear facet monitor)
DATA
LASER
MODULATOR
DATA
PECL
INPUT
LASER BIAS
DRIVER
BMON(+)
BMON(-)
LASER BIAS
CONTROL
PMON(+)
PMON(-)
Figure 2. Simplified Transmitter Schematic
3
Package
The overall package concept
for the Agilent transceiver
The electrical subassemblies
consist of high volume
multilayer printed circuit
The housing is then encased
with a metal EMI protective
shield. Four ground
consists of four basic elements; boards on which the IC and
connections are provided for
connecting the EMI shield to
signal ground.
two optical subassemblies and
two electrical subassemblies.
They are housed as illustrated
in the block diagram in
Figure 3.
various surface-mounted
passive circuit elements are
attached.
The pcb’s for the two electrical
subassemblies both carry the
signal pins that exit from the
bottom of the transceiver. The
solder posts are fastened into
the molding of the device and
are designed to provide the
mechanical strength required
to withstand the loads
imposed on the transceiver by
mating with the LC
connectored fiber cables.
Although they are not
The receiver electrical
subassembly includes an
internal shield for the
electrical and optical
The package outline drawing
and pin out are shown in
Figures 4, 5 and 6. The details subassemblies to ensure high
of this package outline and pin immunity to external EMI
out are compliant with the
multisource definition of the 2
x 5 and 2 x 10 DIP. The low
profile of the Agilent
transceiver design complies
with the maximum height
allowed for the LC connector
over the entire length of the
package.
fields.
The optical subassemblies are
each attached to their
respective transmit or receive
electrical subassemblies. These
two units are than fitted
within the outer housing of the
transceiver that is molded of
filled nonconductive plastic to
provide mechanical strength.
connected electrically to the
transceiver, it is recommended
to connect them to chassis
ground.
RX SUPPLY
Note 3
PHOTO DETECTOR
BIAS Note 2
DATA OUT
DATA OUT
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
QUANTIZER IC
RX GROUND
SIGNAL
DETECT
LC
TX GROUND
Note 1
RECEPTACLE
DATA IN
DATA IN
Tx DISABLE
LASER BIAS
MONITORING
LASER
OPTICAL
SUBASSEMBLY
LASER DRIVER
AND CONTROL
CIRCUIT
B
B
MON(+) Note 1
MON(-) Note 1
LASER DIODE
OUTPUT POWER
MONITORING
Note 1
PMON(+) Note 1
MON(-) Note 1
P
TX SUPPLY
CASE
Note 1: THESE FUNCTIONS ONLY AVAILABLE ON 2 x 10 PINOUT DESIGN
Note 2: CONNECTED TO RXVCC IN 2 x 5 DESIGN
Note 3: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.
Figure 3. Block Diagram.
4
+ 0
- 0.2
+0
13.59
0.535
13.59
(0.535)
MAX
15.0 0.2
(0.591 0.008)
(
)
-0.008
TOP VIEW
48.5 0.2
(1.91 0.008)
6.25
(0.246)
4.06 0.1
(0.16 0.004)
10.8 0.2
(0.425 0.008)
9.8
(0.386)
MAX
3.81 0.15
(0.15 0.006)
Ø 1.07 0.1
(0.042 0.004)
9.6 0.2
(0.378 0.008)
1
0.1
0.25 0.1
(0.01 0.004)
20 x 0.5 0.2
(0.02 0.008)
(0.039 0.004)
10.16 0.1
(0.4 0.004)
1
0.1
19.5 0.3
(0.768 0.012)
(0.039 0.004)
BACK VIEW
FRONT VIEW
SIDE VIEW
1.78 0.1
(0.07 0.004)
48.5 0.2
(1.91 0.008)
9.8
(0.386)
MAX
G MODULE - NO EMI NOSE SHIELD
3.81 0.1
(0.15 0.004)
0.25 0.1
(0.01 0.004)
20 x 0.5 0.2
(0.02 0.008)
1.78 0.1
(0.07 0.004)
Ø 1.07 0.1
(0.042 0.004)
1
0.1
19.5 0.3
(0.768 0.012)
(0.039 0.004)
SIDE VIEW
20 x 0.25 0.1 (PIN THICKNESS)
(0.01 0.004)
NOTE: END OF PINS
CHAMFERED
BOTTOM VIEW
DIMENSIONS IN MILLIMETERS (INCHES)
DIMENSIONS SHOWN ARE NOMINAL. ALL DIMENSIONS MEET THE MAXIMUM PACKAGE OUTLINE DRAWING IN THE SFF MSA.
Figure 4. HFCT-595xNL/NG Package Outline Drawing (2 x 10 Design shown)
5
Connection Diagram (HFCT-5952NL/NG)
RX
TX
Mounting Studs/
Solder Posts
Package
Grounding Tabs
o
o
o
o
o
o
o
o
o
o
o
o
o
o
o
o
o
o
o
o
PHOTO DETECTOR BIAS
RECEIVER SIGNAL GROUND
RECEIVER SIGNAL GROUND
NOT CONNECTED
1
2
3
4
5
6
7
8
9
20
19
18
17
16
15
14
13
12
11
LASER DIODE OPTICAL POWER MONITOR - POSITIVE END
LASER DIODE OPTICAL POWER MONITOR - NEGATIVE END
LASER DIODE BIAS CURRENT MONITOR - POSITIVE END
LASER DIODE BIAS CURRENT MONITOR - NEGATIVE END
TRANSMITTER SIGNAL GROUND
TRANSMITTER DATA IN BAR
TRANSMITTER DATA IN
TRANSMITTER DISABLE
TRANSMITTER SIGNAL GROUND
Top
View
NOT CONNECTED
RECEIVER SIGNAL GROUND
RECEIVER POWER SUPPLY
SIGNAL DETECT
RECEIVER DATA OUTPUT BAR
RECEIVER DATA OUTPUT
10
TRANSMITTER POWER SUPPLY
Figure 5. Pin Out Diagram (Top View)
Pin Descriptions:
Pin 1 Photo Detector Bias, VpdR:
Pin 9 Receiver Data Out Bar RD-:
No internal terminations are
provided. See recommended
circuit schematic.
Pin 17 Laser Diode Bias Current Monitor
- Negative End B
The laser diode bias current is
accessible by measuring the
voltage developed across pins 17
and 18. Dividing the voltage by
10 Ohms (internal) will yield the
value of the laser bias current.
Pin 1 must be connected to VCC
for the receiver to function.
This pin enables monitoring of
photo detector bias current. It
must be connected directly to
–
MON
Pin 10 Receiver Data Out RD+:
No internal terminations are
provided. See recommended
circuit schematic.
V
CC
RX, or to V RX through a
CC
resistor (Max 200 R) for
monitoring photo detector bias
current.
Pin 18 Laser Diode Bias Current Monitor
Pin 11 Transmitter Power Supply
- Positive End B +
MON
V
CC
TX:
Pins 2, 3, 6 Receiver Signal Ground V
RX:
Directly connect these pins to
the receiver ground plane.
See pin 17 description.
EE
Provide +3.3 V dc via the
recommended transmitter power
supply filter circuit. Locate the
power supply filter circuit as
Pin 19 Laser Diode Optical Power
Monitor - Negative End P
–
MON
The back facet diode monitor
current is accessible by
close as possible to the V TX
CC
Pins 4, 5 DO NOT CONNECT
pin.
measuring the voltage developed
across pins 19 and 20. The
voltage across a 200 Ohm
internal resistor between pins 19
and 20 will be proportional to
the photo current.
Pin 7 Receiver Power Supply V RX:
CC
Pins 12, 16 Transmitter Signal Ground
Provide +3.3 V dc via the
V
EE
TX:
recommended receiver power
supply filter circuit. Locate the
power supply filter circuit as
Directly connect these pins to
the transmitter signal ground
plane.
close as possible to the V RX
CC
pin. Note: the filter circuit
Pin 20 Laser Diode Optical Power
Pin 13 Transmitter Disable T
:
DIS
should not cause V to drop
Monitor - Positive End P
+
MON
CC
Optional feature, connect this
pin to +3.3 V TTL logic high “1”
to disable module. To enable
module connect to TTL logic low
“0”.
below minimum specification.
See pin 19 description.
Pin 8 Signal Detect SD:
Mounting Studs/Solder Posts
The two mounting studs are
provided for transceiver
mechanical attachment to the
circuit board. It is
recommended that the holes in
the circuit board be connected to
chassis ground.
Normal optical input levels to
the receiver result in a logic “1”
output.
Pin 14 Transmitter Data In TD+:
No internal terminations are
provided. See recommended
circuit schematic.
Low optical input levels to the
receiver result in a logic “0”
output.
Pin 15 Transmitter Data In Bar TD-:
No internal terminations are
provided. See recommended
circuit schematic.
This Signal Detect output can be
used to drive a TTL input on an
upstream circuit, such as Signal
Detect input or Loss of Signal-
Package Grounding Tabs
Connect four package grounding
tabs to signal ground.
bar.
6
Connection Diagram (HFCT-5951NL/NG)
RX
TX
Mounting Studs/
Solder Posts
Package
Grounding Tabs
Top
View
o
o
o
o
o
o
o
o
o
o
RECEIVER SIGNAL GROUND
RECEIVER POWER SUPPLY
SIGNAL DETECT
RECEIVER DATA OUT BAR
RECEIVER DATA OUT
1
2
3
4
5
10
9
8
7
6
TRANSMITTER DATA IN BAR
TRANSMITTER DATA IN
TRANSMITTER DISABLE
TRANSMITTER SIGNAL GROUND
TRANSMITTER POWER SUPPLY
Figure 6 - Pin Out Diagram (Top View)
Pin Descriptions:
Pin 1 Receiver Signal Ground V RX: Pin 4 Receiver Data Out Bar RD-:
Directly connect this pin to the No internal terminations are
Pin 9 Transmitter Data In TD+:
No internal terminations are
provided. See recommended
circuit schematic.
EE
receiver ground plane.
provided. See recommended
circuit schematic.
Pin 2 Receiver Power Supply V RX:
CC
Provide +3.3 V dc via the
Pin 5 Receiver Data Out RD+:
No internal terminations are
provided. See recommended
circuit schematic.
Pin 10 Transmitter Data In Bar TD-:
No internal terminations are
provided. See recommended
circuit schematic.
recommended receiver power
supply filter circuit. Locate
the power supply filter circuit
as close as possible to the V
RX pin. Note: the filter circuit
CC
Pin 6 Transmitter Power Supply
Mounting Studs/Solder Posts
The two mounting studs are
provided for transceiver
mechanical attachment to the
circuit board. It is
recommended that the holes in
the circuit board be connected
to chassis ground.
V
TX:
CC
should not cause V to drop
CC
Provide +3.3 V dc via the
recommended transmitter
power supply filter circuit.
Locate the power supply filter
circuit as close as possible to
below minimum specification.
Pin 3 Signal Detect SD:
Normal optical input levels to
the receiver result in a logic
“1” output.
the V TX pin.
CC
Pin 7 Transmitter Signal Ground
Low optical input levels to the
receiver result in a logic “0”
output.
Package Grounding Tabs
Connect four package
grounding tabs to signal
ground.
V
TX:
EE
Directly connect this pin to the
transmitter signal ground
plane.
This Signal Detect output can
be used to drive a low voltage
TTL input on an upstream
circuit, such as Signal Detect
input or Loss of Signal-bar.
Pin 8 Transmitter Disable T
:
DIS
Optional feature, connect this
pin to +3.3 V TTL logic high
“1” to disable module. To
enable module connect to TTL
logic low “0”.
7
optical power (dBm avg) and
the lowest receiver sensitivity
(dBm avg). This OPB provides
the necessary optical signal
range to establish a working
fiber-optic link. The OPB is
allocated for the fiber-optic
cable length and the
corresponding link penalties.
For proper link performance,
all penalties that affect the
link performance must be
accounted for within the link
optical power budget.
Data Line Interconnections
Application Information
Agilent’s HFCT-595xNL/NG
fiber-optic transceivers are
designed to couple to +3.3 V
PECL signals. The transmitter
driver circuit regulates the
output optical power. The
regulated light output will
maintain a constant output
optical power provided the
data pattern is reasonably
balanced in duty cycle. If the
data duty cycle has long,
continuous state times (low or
high data duty cycle), then the
output optical power will
gradually change its average
output optical power level to
its preset value.
The Applications Engineering
Group at Agilent is available
to assist you with technical
understanding and design
trade-offs associated with
these transceivers. You can
contact them through your
Agilent sales representative.
The following information is
provided to answer some of
the most common questions
about the use of the parts.
Optical Power Budget and Link
Penalties
Electrical and Mechanical Interface
Recommended Circuit
Figures 7 and 8 show the
recommended interface for
deploying the Agilent
The worst-case Optical Power
Budget (OPB) in dB for a
fiber-optic link is determined
by the difference between the
minimum transmitter output
transceiver in a +3.3 V system.
See Figure 7a
V
(+3.3 V)
CC
82 Ω
Z = 50 Ω
Z = 50 Ω
V
(+3.3 V)
CC
100 nF
100 nF
T
(LVTTL)
-
DIS
V
(+3.3 V)
CC
130 Ω
B
B
130 Ω
MON
82 Ω
TD-
+
MON
NOTE A
130 Ω
130 Ω
P
-
MON
TD+
P
+
MON
20 19 18 17 16 15 14 13 12 11
V
(+3.3 V)
CC
1 µH
10 µF
T
C2
C1
C3
X
V
(+3.3 V)
CC
R
X
1 µH
RD+
RD-
10 µF
1
2
3
4
5
6
7
8
9
10
Z = 50 Ω
V
RX (+3.3 V)
CC
100 Ω
NOTE B
100 nF
100 nF
200 Ω
Z = 50 Ω
NOTE C
V
(+3.3 V)
CC
10 nF
3 k
130 Ω
130 Ω
10 kΩ
SD
LVTTL
Note: C1 = C2 = C3 = 10 nF or 100 nF
Note A: CIRCUIT ASSUMES OPEN EMITTER OUTPUT
Note B: CIRCUIT ASSUMES HIGH IMPENDANCE INTERNAL BIAS @ V - 1.3 V.
Note C: THE BIAS RESISTOR FOR VpdR SHOULD NOT EXCEED 200 OHM.
Figure 7. Recommended Interface Circuit (HFCT-5952NL/NG)
THIS IS NOT REQUIRED
BY THE HFCT-5952NL
CC
8
V
(+3.3 V)
The transmitter electrical
CC
termination schemes shown in
Figure 7 and 8 maybe replaced
by an alternative low-current
scheme as per the evaluation
board (see Figures 7a and 7b).
82 Ω
100 nF
100 nF
TD-
V
(+3.3 V)
CC
130 Ω
82 Ω
TD+
The termination scheme in
Figure 7a provides a minimum
component count to ensure
LVPECL termination and
biasing requirements are met.
Figure 7b shows an alternative
scheme for low current dc
biasing where a 100 ohm
differential (50 ohm single
ended) termination of the data
lines is required.
130 Ω
Figure 7a.LVPECL termination and biasing scheme
V
(+3.3 V)
CC
RI
3K3
100 nF
100 nF
PIN 15
PIN 14
TD-
V
(+3.3 V)
R2
CC
100
R5
5KI
R3
3K3
TD+
R4
5K1
Figure 7b. Low current dc biasing scheme
9
See Figure 7a
VCC (+3.3 V)
100 nF
100 nF
82 Ω
Z = 50 Ω
Z = 50 Ω
VCC (+3.3 V)
TDIS (LVTTL)
130 Ω
130 Ω
82 Ω
130 Ω
6
TD-
100 nF
NOTE A
130 Ω
TD+
10
9
8
7
VCC (+3.3 V)
VCC (+3.3 V)
1 µH
TX
10 µF
1 µH
C2
C1
C3
100 nF
V
CC (+3.3 V)
82 Ω
82 Ω
RX
RD+
C4 *
10 µF
1
2
3
4
5
Z = 50 Ω
130 Ω
NOTE B
100 nF
100 nF
RD-
Z = 50 Ω
V
CC (+3.3 V)
130
Ω
130 Ω
130 Ω
10 k Ω
SD
LVTTL
THIS IS NOT REQUIRED
BY THE HFCT-5951NL
Note: C1 = C2 = C3 = 10 nF or 100 nF
Note A: CIRCUIT ASSUMES OPEN EMITTER OUTPUT
Note B: WHEN INTERNAL BIAS IS PROVIDED REPLACE SPLIT RESISTORS WITH 100Ω TERMINATION
* C4 IS AN OPTIONAL BYPASS CAPACITOR FOR ADDITIONAL LOW FREQUENCY NOISE FILTERING.
Figure 8. Recommended Interface Circuit (HFCT-5951NL/NG)
The HFCT-595xNL/NG have a
transmit disable function
which is a single-ended +3.3 V
TTL input which is dc-coupled the postamplifier stages. The
to pin 13 on the HFCT-
5952NL/NG and pin 8 on the
HFCT-5951NL/NG. In addition
the HFCT-5952NL/NG offers
the designer the option of
monitoring the laser diode bias NG and pins 14 and 15 on the
current and the laser diode
optical power. The voltage
measured between pins 17 and should be terminated with
18 is proportional to the bias
current through an internal 10
Ω resistor. Similarly the optical in V . If the outputs are
power rear facet monitor
circuit provides a photo
current which is proportional
to the voltage measured
between pins 19 and 20, this
voltage is measured across an
internal 200 Ω resistor.
As for the receiver section, it
is internally ac-coupled
between the preamplifier and
5952NL/NG modules. Signal
Detect should not be ac-
coupled externally to the
follow-on circuits because of
its infrequent state changes.
actual Data and Data-bar
outputs of the postamplifier
are dc-coupled to their
respective output pins (pins 9
and 10 on the HFCT -5951NL/
The HFCT-5952NL/NG offers
the designer the option of
monitoring the PIN photo
detector bias current. Figures
7 and 8 show a resistor
network, which could be used
to do this. Note that the photo
detector bias current pin must
HFCT-5952NL/NG). The two
data outputs of the receiver
identical load circuits to avoid
unnecessarily large ac currents
be connected to V . Agilent
CC
also recommends that a
decoupling capacitor is used
on this pin.
CC
loaded identically the ac
current is largely nulled.
Signal Detect is a single-ended,
+3.3 V TTL compatible output
signal that is dc-coupled to
pin 3 on the HFCT-5951NL/NG
and pin 8 on the HFCT-
10
Power Supply Filtering and Ground
Planes
It is important to exercise care
in circuit board layout to
achieve optimum performance
from these transceivers.
8.89
(0.35)
3.56
(0.14)
2 x Ø 2.29 MAX. 2 x Ø 1.4 0.1
2 x Ø 1.4 0.1
(0.055 0.004)
7.11
(0.28)
(0.09)
(0.055 0.004)
4 x Ø 1.4 0.1
(0.055 0.004)
10.16
(0.4)
13.34
(0.525)
Figures 7 and 8 show the
power supply circuit which
complies with the small form
factor multisource agreement.
It is further recommended that
a continuous ground plane be
provided in the circuit board
directly under the transceiver
to provide a low inductance
ground for signal return
current. This recommendation
is in keeping with good high
frequency board layout
7.59
(0.299)
9.59
(0.378)
2
(0.079)
9 x 1.78
(0.07)
2
3
3
2 x Ø 2.29
(0.079)
(0.118)
(0.118)
(0.09)
4.57
(0.18)
20 x Ø 0.81 0.1
(0.032 0.004)
6
16
3.08
(0.236)
(0.63)
(0.121)
practices.
DIMENSIONS IN MILLIMETERS (INCHES)
NOTES:
1. THIS FIGURE DESCRIBES THE RECOMMENDED CIRCUIT BOARD LAYOUT FOR THE SFF TRANSCEIVER.
2. THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING STANDOFFS. NO METAL TRACES OR
GROUND CONNECTION IN KEEP-OUT AREAS.
3. 2 x 10 TRANSCEIVER MODULE REQUIRES 26 PCB HOLES (20 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE
GROUNDING TABS).
PACKAGE GROUNDING TABS SHOULD BE CONNECTED TO SIGNAL GROUND.
4. 2 x 5 TRANSCEIVER MODULE REQUIRES 16 PCB HOLES (10 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE
GROUNDING TABS).
Package footprint and front panel
considerations
The Agilent transceiver
complies with the circuit board
“Common Transceiver
Footprint” hole pattern defined
in the current multisource
agreement which defined the 2
x 5 and 2 x 10 package styles.
This drawing is reproduced in
Figure 9 with the addition of
ANSI Y14.5M compliant
dimensioning to be used as a
guide in the mechanical layout
of your circuit board. Figure
10 shows the front panel
dimensions associated with
such a layout.
PACKAGE GROUNDING TABS SHOULD BE CONNECTED TO SIGNAL GROUND.
5. THE MOUNTING STUDS SHOULD BE SOLDERED TO CHASSIS GROUND FOR MECHANICAL INTEGRITY AND TO
ENSURE FOOTPRINT COMPATIBILITY WITH OTHER SFF TRANSCEIVERS.
6. HOLES FOR HOUSING LEADS MUST BE TIED TO SIGNAL GROUND.
Figure 9. Recommended Board Layout Hole Pattern
Signal Detect
Electromagnetic Interference (EMI)
One of a circuit board
designer’s foremost concerns is
the control of electromagnetic
emissions from electronic
equipment. Success in
The Signal Detect circuit
provides a de-asserted output
signal when the optical link is
broken (or when the remote
transmitter is OFF). The Signal
Detect threshold is set to
transition from a high to low
state between the minimum
receiver input optional power
and -45 dBm avg. input
optical power indicating a
definite optical fault (e.g.
unplugged connector for the
receiver or transmitter, broken
fiber, or failed far-end
controlling generated
Electromagnetic Interference
(EMI) enables the designer to
pass a governmental agency’s
EMI regulatory standard and
more importantly, it reduces
the possibility of interference
to neighboring equipment.
Agilent has designed the
HFCT-595xNL/NG to provide
excellent EMI performance.
The EMI performance of a
chassis is dependent on
Eye Safety Circuit
For an optical transmitter
device to be eye-safe in the
event of a single fault failure,
the transmitter must either
maintain eye-safe operation or
be disabled.
The HFCT-595xNL/NG is
intrinsically eye safe and does
not require shut down
circuitry.
transmitter or data source).
The Signal Detect does not
detect receiver data error or
error-rate. Data errors can be
determined by signal
physical design and features
which help improve EMI
processing offered by upstream suppression. Agilent
PHY ICs. encourages using standard RF
suppression practices and
avoiding poorly EMI-sealed
enclosures.
11
Agilent’s HFCT-5951NL/HFCT-
5952NL OC-12/STM-4 LC
transceivers have nose shields
which provide a convenient
chassis connection to the nose
of the transceiver. This nose
shield improves system EMI
performance by closing off the
LC aperture. Localized
shielding is also improved by
tying the four metal housing
package grounding tabs to
signal ground on the PCB.
Though not obvious by
15.24
(0.6)
10.16 0.1
(0.4 0.004)
TOP OF PCB
B
B
DETAIL A
1
(0.039)
15.24
(0.6)
inspection, the nose shield and
metal housing are electrically
separated for customers who
do not wish to directly tie
chassis and signal grounds
together. Figure 10 shows the
recommended positioning of
the transceivers with respect
to the PCB and faceplate.
A
SOLDER POSTS
14.22 0.1
(0.56 0.004)
15.75 MAX. 15.0 MIN.
(0.62 MAX. 0.59 MIN.)
SECTION B - B
DIMENSIONS IN MILLIMETERS (INCHES)
Package and Handling Instructions
Flammability
1. FIGURE DESCRIBES THE RECOMMENDED FRONT PANEL OPENING FOR A LC OR SG SFF TRANSCEIVER.
2. SFF TRANSCEIVER PLACED AT 15.24 mm (0.6) MIN. SPACING.
The HFCT-595xNL/NG
Figure 10. Recommended Panel Mounting
transceivers housing consists
of high strength, heat resistant
and UL 94 V-0 flame retardant
plastic and metal packaging.
Recommended Solder fluxes
Solder fluxes used with the
HFCT-595xNL/NG should be
water-soluble, organic fluxes.
Recommended solder fluxes
include Lonco 3355-11 from
London Chemical West, Inc. of
Burbank, CA, and 100 Flux
from Alpha-Metals of Jersey
City, NJ.
chloroform, ethyl acetate,
methylene dichloride, phenol,
methylene chloride, or
N-methylpyrolldone. Also,
Agilent does not recommend
the use of cleaners that use
halogenated hydrocarbons
because of their potential
environmental harm.
Recommended Solder and Wash
Process
The HFCT-595xNL/NG are
compatible with industry-
standard wave solder
processes.
LC SFF Cleaning Recommendations
In the event of contamination
of the optical ports, the
Process plug
The transceivers are supplied
with a process plug for
Recommended Cleaning/
Degreasing Chemicals
Alcohols: methyl, isopropyl,
isobutyl.
Aliphatics: hexane, heptane
Other: naphtha.
recommended cleaning process
is the use of forced nitrogen.
If contamination is thought to
have remained, the optical
ports can be cleaned using a
NTT international Cletop stick
type (diam. 1.25 mm) and
HFE7100 cleaning fluid.
protection of the optical port
within the LC connector
receptacle. This process plug
prevents contamination during
wave solder and aqueous rinse
as well as during handling,
shipping and storage. It is
made of a high-temperature,
molded sealing material.
Do not use partially
halogenated hydrocarbons such
as 1,1.1 trichloroethane,
ketones such as MEK, acetone,
12
Regulatory Compliance
The second case to consider is
static discharges to the exterior
of the equipment chassis
containing the transceiver parts.
To the extent that the LC
connector receptacle is exposed
to the outside of the equipment
chassis it may be subject to
Eye Safety
The Regulatory Compliance for
transceiver performance is
shown in Table 1. The overall
equipment design will determine
the certification level. The
transceiver performance is
offered as a figure of merit to
These laser-based transceivers
are classified as AEL Class I
(U.S. 21 CFR(J) and AEL Class 1
per EN 60825-1 (+A11). They
are eye safe when used within
the data sheet limits per CDRH.
They are also eye safe under
normal operating conditions and
under all reasonably foreseeable
single fault conditions per
EN60825-1. Agilent has tested
the transceiver design for
compliance with the
requirements listed below under
normal operating conditions and
under single fault conditions
where applicable. TUV Rheinland
has granted certification to these
transceivers for laser eye safety
and use in EN 60950 and
assist the designer in considering whatever system-level ESD test
their use in equipment designs.
criteria that the equipment is
intended to meet.
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage
is important.
Electromagnetic Interference (EMI)
Most equipment designs utilizing
these high-speed transceivers
from Agilent will be required to
meet FCC regulations in the
United States, CENELEC
EN55022 (CISPR 22) in Europe
and VCCI in Japan. Refer to EMI
section (page 9) for more details.
The first case is during handling
of the transceiver prior to
mounting it on the circuit board.
It is important to use normal
ESD handling precautions for
ESD sensitive devices. These
precautions include using
grounded wrist straps, work
benches, and floor mats in ESD
controlled areas.
EN 60825-2 applications. Their
performance enables the
transceivers to be used without
concern for eye safety up to 3.6
Immunity
Transceivers will be subject to
radio-frequency electromagnetic
fields following the IEC 61000-4-
3 test method.
V transmitter V
.
CC
Table 1: Regulatory Compliance - Targeted Specification
Feature
Electrostatic Discharge
(ESD) to the
Test Method
MIL-STD-883
Method 3015
Performance
Class 2 (>2 kV).
Electrical Pins
Electrostatic Discharge
(ESD) to the LC
Receptacle
Variation of IEC 61000-4-2
Tested to 8 kV contact discharge.
Electromagnetic
Interference (EMI)
FCC Class B
CENELEC EN55022 Class B
(CISPR 22A)
Margins are dependent on customer board and chassis
designs.
VCCI Class I
Immunity
Variation of IEC 61000-4-3
Typically show no measurable effect from a
10 V/m field swept from 27 to 1000 MHz applied to the
transceiver without a chassis enclosure.
Accession Number: ) 9521220-43
Laser Eye Safety
and Equipment Type
Testing
FDA CDRH 21-CFR 1040
Class 1
IEC 60825-1
Amendment 2 2001-01
License Number: ) 933/510104/02
Component
Recognition
Underwriters Laboratories and
Canadian Standards Association
Joint Component Recognition
for Information Technology
Equipment Including Electrical
Business Equipment.
UL File. E173874
13
CAUTION:
There are no user serviceable
parts nor any maintenance
required for the HFCT-
595xNL/NG. All adjustments
are made at the factory before
shipment to our customers.
Tampering with or modifying
the performance of the HFCT-
595xNL/NG will result in
voided product warranty. It
may also result in improper
operation of the HFCT-
595xNL/NG circuitry, and
possible overstress of the laser
source. Device degradation or
product failure may result.
Connection of the HFCT-
595xNL/NG to a non-approved
optical source, operating above
the recommended absolute
maximum conditions or
operating the HFCT-595xNL/
NG in a manner inconsistent
with its design and function
may result in hazardous
radiation exposure and may be
considered an act of modifying
or manufacturing a laser
product. The person(s)
performing such an act is
required by law to recertify
and reidentify the laser
product under the provisions
of U.S. 21 CFR (Subchapter J).
14
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in
isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that limiting values
of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for extended
periods can adversely affect device reliability.
Parameter
Symbol
Min.
-40
Typ.
Max.
+85
3.6
Unit
°C
V
Reference
Storage Temperature
Supply Voltage
TS
VCC
VI
-0.5
-0.5
1
Data Input Voltage
Data Output Current
Relative Humidity
VCC
50
V
ID
mA
%
RH
85
Recommended Operating Conditions
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Ambient Operating Temperature
HFCT-595*NL/NG
TA
0
+70
3.47
°C
2
Supply Voltage
VCC
3.14
V
Power Supply Rejection
PSR
VD
100
50
mVPk-Pk
3
Transmitter Differential Input Voltage
Data Output Load
0.3
1.6
1.0
0.6
V
W
RDL
TTL Signal Detect Output Current - Low
TTL Signal Detect Output Current - High
Transmit Disable Input Voltage - Low
Transmit Disable Input Voltage - High
Transmit Disable Assert Time
Transmit Disable Deassert Time
IOL
mA
µA
V
IOH
-400
2.2
TDIS
TDIS
TASSERT
TDEASSERT
V
10
µs
ms
4
5
1.0
Process Compatibility
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Wave Soldering and Aqueous Wash
T
SOLD/tSOLD
+260/10 °C/sec.
6
Notes:
1. The transceiver is class 1 eye safe up to V = 3.6 V.
2. Ambient operating temperature utilizes air flow of 2 ms over the device.
CC
-1
3. Tested with a sinusoidal signal in the frequency range from 10 Hz to 1 MHz on the V supply with the recommended power supply filter in place.
CC
Typically less than a 1 dB change in sensitivity is experienced.
4. Time delay from Transmit Disable Assertion to laser shutdown.
5. Time delay from Transmit Disable Deassertion to laser start-up.
6. Aqueous wash pressure <110 psi.
15
Transmitter Electrical Characteristics
HFCT-595*NL/NG: T = 0 °C to +70 °C, V = 3.14 V to 3.47 V
A
CC
Parameter
Symbol
ICCT
Min.
Typ.
30
Max.
120
Unit
mA
W
Reference
Supply Current
Power Dissipation
1
PDIST
0.10
800
0.42
930
Data Input Voltage Swing (single-ended)
VIH - VIL
250
mV
Transmitter Differential
Data Input Current - Low
Transmitter Differential
IIL
-350
-2
µA
Data Input Current - High
Laser Diode Bias Monitor Voltage
IIH
18
350
700
200
µA
mV
mV
2, 3
2, 3
Power Monitor Voltage
10
Receiver Electrical Characteristics
HFCT-595*NL/NG: T = 0°C to +70 °C, V = 3.14 V to 3.47 V
A
CC
Parameter
Symbol
ICCR
Min.
Typ.
70
Max.
110
0.38
930
0.5
Unit
mA
W
Reference
Supply Current
Power Dissipation
1
4
5
6
6
7
7
PDISR
VOH - VOL
tr
0.23
800
Data Output Voltage Swing (single-ended)
Data Output Rise Time
575
mV
ns
ns
V
Data Output Fall Time
tf
0.5
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
Signal Detect Assert Time (OFF to ON)
Signal Detect Deassert Time (ON to OFF)
VOL
0.8
VOH
2.0
2.3
V
ASMAX
ANSMAX
100
100
µs
µs
Notes:
1. Excluding data output termination currents.
2. The laser bias monitor current and laser diode optical power are calculated as ratios of the corresponding voltages to their current sensing
resistors, 10 W and 200 W (see Figure 7). On the 2 x 10 version only.
3. On the 2 x 10 version only.
4. Power dissipation value is the power dissipated in the receiver itself. It is calculated as the sum of the products of V and I minus the sum of the
CC
CC
products of the output voltages and currents.
5. These outputs are compatible with 10 k, 10 kH, and 100 k ECL and PECL inputs.
6. These are 20-80% values.
7. SD is LVTTL compatible.
16
Transmitter Optical Characteristics
HFCT-595*NL/NG: T = 0 °C to +70 °C, V = 3.14 V to 3.47 V
A
CC
Parameter
Symbol
Min.
-3
Typ.
Max.
2
Unit
dBm
nm
Reference
Output Optical Power 9 µm SMF
Center Wavelength
Spectral Width - rms
Optical Rise Time
POUT
lC
s
1
1280
1335
1
nm rms
ps
2
3
3
tr
250
250
Optical Fall Time
tf
ps
Extinction Ratio
ER
10
dB
Output Optical Eye
Compliant with eye mask Telcordia GR-253-CORE and ITU-T G.957
Back Reflection Sensitivity
Jitter Generation
-8.5
70
7
dB
4
5
5
pk to pk
RMS
25
2
mUI
mUI
dB
Side Mode Suppression Ratio
SMSR
30
Receiver Optical Characteristics
HFCT-595*NL/NG: T = 0 °C to +70 °C, V = 3.14 V to 3.47 V
A
CC
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Receiver Sensitivity
Receiver Overload
P
P
IN MIN
IN MAX
-32
-28
dBm avg. 6, 7
dBm avg. 6
nm
-8
l
Input Operating Wavelength
Signal Detect - Asserted
Signal Detect - Deasserted
Signal Detect - Hysteresis
Optical Return Loss, ORL
1270
1570
-28
PA
-34
dBm avg.
dBm avg.
dB
PD
-45
0.5
-34.3
1.7
PA - PD
4
-35
-14
dB
Notes:
1. The output power is coupled into a 1 m single-mode fiber. Minimum output optical level is at end of life.
2. The relationship between FWHM and RMS values for spectral width can be derived from the assumption of a Gaussian shaped spectrum which
results in RMS = FWHM/2.35.
3. These are unfiltered 20-80% values.
4. This meets the “desired” requirement in SONET specification (GR253). The figure given is the allowable mismatch for 1 dB degradation in receiver
sensitivity.
23
5. For the jitter measurements, the device was driven with SONET OC-12C data pattern filled with a 2 -1 PRBS payload.
23
6. Minimum sensitivity and saturation levels for a 2 -1 PRBS with 72 ones and 72 zeros inserted. Over the range the receiver is guaranteed to provide
-10
output data with a Bit Error Rate better than or equal to 1 x 10
7. Beginning of life sensitivity at +25 °C is -29 dBm.
.
17
Design Support Materials
Agilent has created a number
of reference designs with
major PHY IC vendors in order
to demonstrate full
functionality and
interoperability. Such design
information and results can be
made available to the designer
as a technical aid. Please
contact your Agilent
representative for further
information if required.
Ordering Information
Temperature range 0 °C to +70 °C
HFCT-5951NL 2 x 5 footprint
HFCT-5952NL 2 x 10 footprint
HFCT-5951NG 2 x 5 footprint
HFCT-5952NG 2 x 10 footprint
with EMI nose shield
with EMI nose shield
without EMI nose shield
without EMI nose shield
Class 1 Laser Product: This product conforms to the
applicable requirements of 21 CFR 1040 at the date of
manufacture
Date of Manufacture:
Agilent Technologies Inc., No 1 Yishun Ave 7, Singapore
Handling Precautions
1. The HFCT-595xNL/NG can be damaged by current surges or overvoltage.
Power supply transient precautions should be taken.
2. Normal handling precautions for electrostatic sensitive devices
should be taken.
www.agilent.com/
semiconductors
For product information and a complete list
of distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916)788-6763
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152(Domestic/Inter-
national), or 0120-61-1280(Domestic Only)
Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes:5988-8206EN
August 3, 2004
5988-9967EN
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