HSMN-A401-P7QM2 [AVAGO]
SMT LED Surface Mount LED Indicator; SMT LED表面贴装LED指示灯
| 型号： | HSMN-A401-P7QM2 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | SMT LED Surface Mount LED Indicator |
| 文件： | 总9页 (文件大小：1186K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HSMx-A4xx-xxxxx
SMTLEDSurfaceMountLEDIndicator
DataSheet
Description
Features
Avago Power PLCC-4 is an extension of our PLCC-2
SMT LEDs. The package can be driven at higher
current due to its superior package design. The
product is able to dissipate heat more efficiently
compared to the conventional PLCC-2 SMT LEDs. In
proportion to the increase in driving current, this
family of LEDs is able to produce higher light output
compared to the conventional PLCC-2 SMT LEDs.
• Industry standard PLCC-4
• HighreliabilityLEDpackage
• High brightness using AlInGaP and InGaN dice
technologies
• Highopticalefficiency
• Higher ambient temperature at the same current possible
compared to PLCC-2
• Available infullselectionofcolors
• Super wide viewing angle at 120˚
These SMT LEDs have higher reliability and better
performance and are designed to work under a wide
range of environmental conditions. This higher
reliability makes them suitable for use under harsh
environment and conditions like automotive. In
addition, they are also suitable to be used in electronic
signs and signals.
• Available in 8mm carrier tape on 7-inch reel
• Compatible with both IR and TTW soldering process
JEDEC MSL 2a
Applications
• Interior automotive
To facilitate easy pick and place assembly, the LEDs
are packed in EIA-compliant tape and reel. Every reel
will be shipped in single intensity and color bin (except
for red color), to provide close uniformity.
– Instrument panel backlighting
–Centralconsole backlighting
–Cabinbacklighting
– Navigation and audio system
– Dome lighting
– Push button backlighting
These LEDs are compatible with IR solder reflow
process. Due to the high reliability feature of these
products, they also can be mounted using through-the-
wave soldering process.
• Exteriorautomotive
– Turn signals
– CHMSL
– Rear combination lamp
– Puddle light
There are a variety of colors and various viewing
angles (30°, 60° and 120°) available in these SMT
LEDs. Ideally, the 30°parts are suitable for light piping
where focused intensities are required. As for the 60°
and 120°, theyare most suitable for automotive interior
and exterior lighting and electronic signs applications.
• Electronic signs andsignals
– Interior full color sign
– Variable message sign
• Office automation, home appliances, industrialequipment
– Front panel backlighting
– Push button backlighting
–Displaybacklighting
CAUTION: HSMN-, HSMK-, HSMM-A40x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate
precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Dimensions
2.8 ± 0.2
2.2 ± 0.2
1.9 ± 0.2
0.1 TYP.
0.8 ± 0.1
A
C
3.2 ± 0.2
3.5 ± 0.2
0.8 ± 0.3
C
C
0.5 ± 0.1
0.7 ± 0.1
CATHODE MARKING
NOTES:
ALL DIMENSIONS IN mm.
ELECTRICAL CONNECTION BETWEEN ALL CATHODES IS RECOMMENDED.
Device Selection Guide
Color
Part Number
Min. IV (mcd)
180.00
285.00
355.00
560.00
285.00
450.00
560.00
450.00
285.00
450.00
560.00
45.00
Max. IV (mcd)
355.00
Test Current (mA) Dice Technology
Red
HSMC-A400-S30M1
HSMC-A401-T40M1
HSMC-A401-T80M1
HSMZ-A400-U80M1
HSMJ-A401-T40M1
HSMJ-A401-U40M1
HSMV-A400-U80M1
HSML-A401-U40M1
HSMA-A400-T35M1
HSMA-A401-U45M1
HSMU-A400-U85M1
HSME-A401-P4PM1
HSMM-A401-R7YM2
HSMM-A401-S4YM2
HSMM-A401-S7YM2
HSMM-A400-T8YM2
HSMK-A401-R40M2
HSMK-A400-T80M2
HSMN-A401-P4QM2
HSMN-A401-P7QM2
HSMN-A400-Q8QM2
50
50
50
50
50
50
50
50
50
50
50
50
30
30
30
30
30
30
30
30
30
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
InGaN
715.00
900.00
1400.00
715.00
Red Orange
1125.00
1400.00
1125.00
560.00
Orange
Amber
1125.00
1400.00
112.50
Emerald Green
Green
140.00
180.00
224.00
355.00
112.50
355.00
45.00
285.00
450.00
InGaN
450.00
InGaN
900.00
InGaN
Cyan
Blue
285.00
InGaN
900.00
InGaN
112.50
InGaN
56.00
112.50
InGaN
90.00
224.00
InGaN
Notes:
1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be
aligned with this axis.
2. IV tolerance = ±12 %.
2
Part Numbering System
HSM x – A x x x – x x x x x
8 9
1
2
3
4
5
6
7
Packaging Option
Color Bin Selection
Intensity Bin Select
Device Specific Configuration
Package Type
LED Chip Color
Absolute Maximum Ratings (T = 25°C)
A
Parameters
HSMC/J /L/A/E
HSMZ/V/U
HSMM/K/N
30 mA
[1]
[3,4]
[3,4]
DCForwardCurrent
70 mA
70 mA
[2]
PeakForwardCurrent
200 mA
180 mW
200 mA
240 mW
90 mA
PowerDissipation
Reverse Voltage
114 mW
5 V
JunctionTemperature
OperatingTemperature
Storage Temperature
110°C
–40°C to +100°C
–40°C to +100°C
Notes:
1. Derate linearly as shown in figure 5.
2. Duty factor = 10%, Frequency = 1 kHz.
3. Drive current between 10 mA and 70 mA is recommended for best long-term performance.
4. Operation at currents below 5 mA is not recommended.
3
Optical Characteristics (T = 25°C)
A
Peak
Dominant
Luminous
Efficacy η
(Degrees) (lm/W)
Typ.
Luminous Intensity/
TotalFlux
[3]
Wavelength Wavelength ViewingAngle
v
[1]
[2]
Part
λ
(nm)
λ
(nm)
2θ
I (mcd)/Φ (mlm)
PEAK
D
1/2
v
v
Color
Number
Typ.
635
639
621
623
609
592
594
576
568
518
502
468
Typ.
626
630
615
617
605
590
592
575
567
525
505
470
Typ.
120
120
120
120
120
120
120
120
120
120
120
120
Typ.
Red
HSMC
HSMZ
HSMJ
150
155
240
263
320
480
500
560
610
500
300
75
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
RedOrange
HSMV
HSML
HSMA
HSMU
HSME
Orange
Amber
YellowGreen
EmeraldGreen HSME
Green
Cyan
Blue
HSMM
HSMK
HSMN
Notes:
1. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the device.
D
2. θ is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
1/2
3. Radiant intensity, I in watts/steradian, may be calculated from the equation I = I /η , where I is the luminous intensity in candelas and η is
e
e
v
v
v
v
the luminous efficacy in lumens/watt.
Electrical Characteristics (T = 25°C)
A
Forward Voltage
Reverse Voltage
V (Volts) @ I = 50 mA
V @ 100 µA
R
F
F
Part Number
HSMC/J/L/A/E
HSMZ/V/U
Typ.
Max.
Min.
2.2
2.8
2.5
5
3.4
5
Forward Voltage
Reverse Voltage
V (Volts) @ I = 30 mA
V @ 10 µA
R
F
F
Part Number
Typ.
Max.
Min.
HSMM/K/N
3.8
4.6
5
1.0
BLUE
EMERALD GREEN
YELLOW GREEN
0.9
CYAN
0.8
GREEN
0.7
AMBER
0.6
0.5
0.4
0.3
ORANGE
RED ORANGE
RED
0.2
0.1
0
380
430
480
530
580
630
680
730
780
WAVELENGTH – nm
Figure 1. Relative Intensity Vs. Wavelength.
4
1.2
1.0
0.8
0.6
0.4
0.2
0
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
80
70
60
50
40
30
20
10
0
HSMC/J/L/A/E
HSMZ/V/U
HSMM/K/N
4 5
0
5
10 15 20 25
30 35
0
10 20 30 40 50 60 70 80
0
1
2
3
FORWARD CURRENT – mA
FORWARD CURRENT – mA
FORWARD VOLTAGE – V
Figure 2. Forward Current Vs. Forward Voltage. Figure 3. Relative Intensity Vs. Forward
Current (AlInGaP).
Figure 4. Relative Intensity Vs. Forward
Current (InGaN).
35
540
530
80
70
60
50
40
30
20
10
0
30
300°C/W
InGaN GREEN
520
25
20
15
10
5
300°C/W
350°C/W
470°C/W
350°C/W
470°C/W
510
500
InGaN CYAN
490
480
InGaN BLUE
470
460
0
0
20
40
60
80
100 120
0
20
40
60
80
100 120
0
5
10 15 20 25 30 35
AMBIENT TEMPERATURE – °C
AMBIENT TEMPERATURE – °C
CURRENT – mA
Figure 6. Dominant Wavelength Vs. Forward
Current – InGaN Devices.
Figure 5a. Maximum Forward Current Vs.
Ambient Temperature, Derated Based On
Figure 5b. Maximum Forward Current Vs.
Ambient Temperature, Derated Based On
T max = 110°C (AlInGaP).
T max = 110°C (InGaN).
J
J
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-70
-50
-30
-10
10
30
50
70
90
ANGLE – DEGREES
Figure 7. Radiation Pattern.
5
X
X
2.60
(0.103)
0.40 (0.016)
1.10
(0.043)
Y
Y
0.50
(0.020)
4.50 (0.178)
1.50 (0.059)
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
DIMENSIONS IN mm (INCHES).
SOLDER RESIST
Figure 8a. Recommended Soldering Pad Pattern.
X
X
0.5 (0.020)
6.1 (0.240)
2.8 (0.110)
Y
2.0 (0.079)
2.0 (0.079)
6.0 (0.236)
1.0 (0.039)
Y
3.0 (0.118)
DIMENSIONS IN mm (INCHES).
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
ThermalResistance
300°C/W
Solder Pad Area (xy)
>16 mm2
350°C/W
>12 mm2
470°C/W
>8 mm2
10 to 20 SEC.
Figure 8b. Recommended Soldering Pad Pattern (TTW).
+5 °C
-0 °C
255 °C
217 °C
3 °C/SEC. MAX.
125 °C ± 25 °C
6 °C/SEC. MAX.
20 SEC. MAX.
240°C MAX.
3°C/SEC. MAX.
100-150°C
183°C
MAX. 120 SEC.
60 to 150 SEC.
–6°C/SEC.
MAX.
3°C/SEC.
MAX.
TIME
120 SEC. MAX. 60-150 SEC.
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 9a. Recommended SnPb Reflow Soldering Profile.
Figure 9b. Recommended Pb-free Reflow Soldering Profile.
Note: For detailed information on reflow soldering of Avago surface
mount LEDs, refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
200
150
100
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
FLUXING
PREHEAT
SOLDER: SN63; FLUX: RMA
50
30
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
0
10 20 30 40 50 60 70 80 90 100
TIME – SECONDS
Figure 10. Recommended Wave Soldering Profile.
6
TRAILER
COMPONENT
LEADER
200 mm MIN. FOR 180 REEL.
200 mm MIN. FOR 330 REEL.
480 mm MIN. FOR 180 REEL.
960 mm MIN. FOR 330 REEL.
C
A
USER FEED DIRECTION
Figure 11. Tape Leader and Trailer Dimensions.
+0.1
–0
2 ± 0.05
4 ± 0.1
3.6 ± 0.1
1.5
B
1.75 ± 0.1
C
C
C
A
5.5 ± 0.05
A
A
3.8 ± 0.1
+0.3
–0.1
12
+0.1
1
B
–0
8 ± 0.1
0.229 ± 0.01
VIEW B-B
3.45 ± 0.1
VIEW A-A
ALL DIMENSIONS IN mm.
Figure 12. Tape Dimensions.
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 13. Reeling Orientation.
7
Intensity Bin Select (X X )
Individual reel will contain parts from
one half bin only.
Color Bin Select (X )
Individual reel will contain parts from
one full bin only.
Color Bin Limits
Emerald
5 6
7
Green
Min. (nm)
Max. (nm)
555.5
X
Min. Iv Bin
X
7
5
A
B
C
D
552.5
555.5
558.5
561.5
0
Full Distribution
A and B only
558.5
X
6
Z
Y
W
V
U
T
S
561.5
564.5
0
3
4
5
7
8
9
Full Distribution
B and C only
3 half bins starting from X 1
C and D only
5
Yellow
Green
4 half bins starting from X 1
D and E only
5
Min. (nm)
564.5
Max. (nm)
567.5
5 half bins starting from X 1
E and F only
5
E
F
3 half bins starting from X 2
F and G only
5
567.5
570.5
4 half bins starting from X 2
G and H only
5
G
H
570.5
573.5
5 half bins starting from X 2
Q
P
A, B and C only
B, C and D only
C, D and E only
D, E and F only
E, F and G only
F, G and H only
A, B, C and D only
E, F, G and H only
B, C, D and E only
C, D, E and F only
A, B, C, D and E only
B, C, D, E and F only
5
573.5
576.5
N
M
L
K
1
Amber/
Yellow
Intensity Bin Limits
Min. (nm)
582.0
Max. (nm)
584.5
Bin ID
N1
N2
P1
Min. (mcd) Max. (mcd)
A
B
C
D
E
F
28.50
35.50
584.5
587.0
35.50
45.00
587.0
589.5
45.00
56.00
589.5
592.0
2
P2
56.00
71.50
592.0
594.5
3
Q1
Q2
R1
71.50
90.00
594.5
597.0
4
90.00
112.50
140.00
180.00
224.00
285.00
355.00
450.00
560.00
715.00
900.00
1125.00
1400.00
1800.00
5
Orange
Min. (nm)
597.0
Max. (nm)
600.0
112.50
140.00
180.00
224.00
285.00
355.00
450.00
560.00
715.00
900.00
1125.00
1400.00
6
A
B
C
D
E
R2
600.0
603.0
S1
Color Bin Limits
603.0
606.0
S2
Blue
A
Min. (nm)
Max. (nm)
465.0
606.0
609.0
T1
460.0
465.0
470.0
475.0
609.0
612.0
T2
B
470.0
U1
U2
V1
C
475.0
Red
Orange
Min. (nm)
611.0
Max. (nm)
616.0
D
480.0
A
B
V2
616.0
620.0
Cyan
A
Min. (nm)
490.0
Max. (nm)
495.0
W1
W2
Red
Min. (nm)
Max. (nm)
B
495.0
500.0
Full Distribution
Tolerance of each bin limit = ± 12%
C
500.0
505.0
Tolerance of each bin limit = ± 1 nm
D
505.0
510.0
Green
Min. (nm)
515.0
Max. (nm)
520.0
Packaging Option (X X )
8 9
A
B
C
D
Test
Package
Reel
Size
Option Current Type
520.0
525.0
M1
M2
50 mA Top Mount 7 inch
30 mA Top Mount 7 inch
525.0
530.0
530.0
535.0
8
Forward Voltage Bin Table
For HSMZ/V/U – A4xx-xxxxx only
BIN
VA
VB
VC
VD
VE
MIN.
1.9
MAX.
2.2
2.2
2.5
2.5
2.8
2.8
3.1
3.1
3.4
Tolerance of each bin limit = ± 0.05
This product is qualified as Moisture Sensitive Level 2a per JEDEC J-
STD-020. Precaution when handling this moisture sensitive product is
important to ensure the reliability of the product. Refer to Avago
Application Note AN 5305 Handling of Moisture Sensitive Surface
Mount Devices for details.
A. Storage before use
– Unopen moisture barrier bag (MBB) can be stored at <40°C/90% RH
for 12 months. If the actual shelf life has exceeded 12 months and the
HIC indicates that baking is not required, then it is safe to reflow the
LEDs per the original MSL rating.
– It is not recommended to open the MBB prior to assembly
(e.g., for IQC).
B. Control after opening the MBB
– The humidity indicator card (HIC) shall be read immediately upon
opening of MBB.
– The LEDs must be kept at <30°C/60% RH at all times and all high
temperature related processes, including soldering, curing or rework,
need to be completed within 672 hours.
C. Control of unfinished reel
– Unused LEDs need to be stored in sealed MBB with desiccant or in
desiccator at <5% RH.
D. Control of assembled boards
– If the PCB soldered with the LEDs is to be subjected to other high
temperature processes, the PCB needs to be stored in sealed MBB
with desiccant or in desiccator at <5% RH to ensure no LEDs have
exceeded their floor life of 672 hours.
E. Baking is required if:
– “10%” or “15%” HIC indicator turns pink.
– The LEDs are exposed to conditions of >30°C/60% RH at any time.
– The LEDs' floor life exceeds 672 hours.
Recommended baking conditions: 60±5°C for 20 hours.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0312EN
AV02-0479EN June 20, 2007
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