HSMY-C680 [AVAGO]

Right Angle Surface Mount ChipLEDs; 直角表面黏着封装ChipLED
HSMY-C680
型号: HSMY-C680
厂家: AVAGO TECHNOLOGIES LIMITED    AVAGO TECHNOLOGIES LIMITED
描述:

Right Angle Surface Mount ChipLEDs
直角表面黏着封装ChipLED

文件: 总8页 (文件大小:369K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HSMx-C680  
Right Angle Surface Mount ChipLEDs  
Data Sheet  
Description  
Features  
The HSMx-C680 series of chip-type LEDs are designed to  
illuminate at a right angle to the direction of mounting.  
When mounted on a PC board, these devices will emit  
light in a direction parallel to the board.  
•ꢀ Right Angle Mounting  
•ꢀ Compatible with IR Reflow Soldering Process  
•ꢀ Available in a Wide Variety of Colors  
•ꢀ Available in 8 mm Tape on 178mm (7”) Diameter Reels  
The small 3.0 x 1.0 x 2.0mm footprint of the HSMx-C680  
is designed for applications where space is limited. These  
devices are available in four colors and use untinted, non-  
diffused optics.  
Applications  
•ꢀ LCD backlighting  
•ꢀ Keypad Side/Backlighting  
•ꢀ Light Piping  
The HSMx-C680 series of parts are compatible with IR  
reflow soldering process only.  
•ꢀ Right Angle Indicator  
Package Dimensions  
3.0  
Device Selection Guide  
1.0  
Part Number  
HSMA-C680  
HSMC-C680  
HSMG-C680  
HSMH-C680  
HSML-C680  
HSMS-C680  
HSMY-C680  
Parts per Reel Color  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
AlInGaP Amber  
0.3  
0.3  
AlInGaP Red  
GaP Green  
2.0  
AS AlGaAs Red  
AlInGaP Orange  
GaP High Efficiency Red, HER  
GaP Yellow  
2.0  
1.0  
0.25  
0.25  
ANODE  
(CATHODE FOR  
HSMH-C680)  
0.88  
CATHODE  
(ANODE FOR  
HSMH-C680)  
R 0.45  
POLARITY MARK  
CATHODE  
TO REINFORCE SOLDERING  
(NON-PIN CONNECTION)  
ANODE  
CAUTION: HSMx-C680 LEDs are Class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appro-  
priate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.  
Absolute Maximum Ratings at T = 25°C  
A
Parameter  
AlInGaP  
GaP  
25  
65  
5
AS AlGaAs  
Units  
mA  
mW  
V
DC Forward Current  
30  
25  
65  
5
Power Dissipation  
72  
5
Reverse Voltage (IR = 100mA)  
LED Junction Temperature  
Operating Temperature Range  
Storage Temperature Range  
Soldering Temperature  
95  
95  
95  
°C  
-40 to 85°C  
-40 to 85 °C  
See reflow soldering profile (Figure 6 & 7)  
Electrical Characteristics at T = 25°C  
A
Forward Voltage  
V (Volts)  
F
Reverse Breakdown  
[1]  
V (Volts)  
R
Thermal Resistance  
@ I = 20mA  
@ I = 100mA  
Rq (°C/W)  
J-P  
F
R
Part Number  
AlInGaP Amber  
AlInGaP Red  
GaP Green  
Typ.  
Max.  
2.4  
2.4  
2.6  
2.6  
2.4  
2.6  
2.6  
Typ.  
5
Typ.  
500  
500  
300  
300  
500  
300  
300  
2.0  
2.0  
2.2  
1.8  
2.0  
2.0  
2.1  
5
5
AS AlGaAs Red  
AlInGaP Orange  
GaP HER  
5
5
5
GaP Yellow  
5
Notes:  
1. VF tolerance : 0.1V  
Optical Characteristics at T = 25°C  
A
Luminous Intensity  
Color, Dominant  
Wavelength  
ld (nm)  
Color,  
Viewing Angle  
[1]  
I
V
(mcd)  
[3]  
Peak Wavelength  
lPeak [(nm)  
Typical  
2q  
1/2  
@ 20mA  
[2]  
(Degrees)  
Typical  
Part Number  
AlInGaP Amber  
AlInGaP Red  
GaP Green  
Min.  
28.5  
28.5  
4.5  
Typ.  
76.9  
62.3  
13.3  
30.7  
108.6  
5.1  
Typical  
591  
630  
573  
642  
604  
621  
589  
594  
643  
568  
657  
611  
636  
588  
115  
115  
125  
125  
115  
125  
125  
AS AlGaAs Red  
AlInGaP Orange  
GaP HER  
7.2  
28.5  
2.8  
GaP Yellow  
2.8  
9.3  
Notes:  
1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED  
package.  
2. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.  
3.  
q
is the off-axis angle where the luminous intensity is ½ the peak intensity.  
1/2  
2
[1]  
Color Bin Limits  
GaP HER  
AlIn GaP Amber  
Dominant Wavelength (nm)  
Minimum Maximum  
Dominant Wavelength (nm)  
Bin ID  
Bin ID  
Minimum  
582.0  
584.5  
587.0  
589.5  
592.0  
594.5  
Maximum  
-
620.0  
635.0  
A
B
C
D
E
584.5  
587.0  
589.5  
592.0  
594.5  
597.0  
Tolerance : 1nm  
GaP Yellow  
Dominant Wavelength (nm)  
Minimum Maximum  
F
Bin ID  
Tolerance : 1nm  
A
B
C
D
E
582.0  
584.5  
584.5  
587.0  
589.5  
592.0  
594.5  
587.0  
589.5  
592.0  
594.5  
597.0  
AlInGaP Red  
Dominant Wavelength (nm)  
Bin ID  
Minimum  
Maximum  
F
-
620.0  
635.0  
Tolerance : 1nm Notes:  
Tolerance : 1nm  
1. Bin categories are established for classification of products. Products  
may not be available in all categories. Please contact your Avago  
representative for information on current available bins.  
GaP Green  
Dominant Wavelength (nm)  
Bin ID  
Minimum  
561.5  
Maximum  
[1]  
Light Intensity (I ) Bin Limits  
V
A
B
C
D
E
564.5  
567.5  
570.5  
573.5  
576.5  
Intensity (mcd)  
Minimum Maximum  
564.5  
Bin ID  
567.5  
H
J
2.80  
4.50  
4.50  
7.20  
570.5  
573.5  
K
7.20  
11.20  
18.00  
28.50  
45.00  
71.50  
112.50  
Tolerance : 1nm  
L
11.20  
18.00  
28.50  
45.00  
71.50  
M
N
P
AS AlGaAs HER  
Dominant Wavelength (nm)  
Bin ID  
Minimum  
Maximum  
Q
-
630.0  
650.0  
Tolerance : 15ꢀ  
Tolerance : 1nm  
Notes:  
1. Bin categories are established for classification of products. Products  
may not be available in all categories. Please contact your Avago  
representative for information on current available bins.  
AlInGaP Orange  
Dominant Wavelength (nm)  
Bin ID  
Minimum  
597.0  
600.0  
603.0  
606.0  
609.0  
612.0  
Maximum  
A
B
C
D
E
600.0  
603.0  
606.0  
609.0  
612.0  
615.0  
F
Tolerance : 1nm  
3
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
AlInGaP Orange  
AlInGaP Red  
GaP HER  
GaP Yellow  
AlInGaP Amber  
GaP Green  
AS AlGaAs  
380  
430  
480  
530  
580  
630  
680  
730  
780  
480  
530  
580  
630  
680  
730  
780  
WAVELENGTH - nm  
WAVELENGTH - nm  
Figure 1. Relative intensity vs. wavelength..  
100  
100  
10  
1
AlInGaP Red  
10  
GaP Green  
GaP Yellow  
GaP HER  
AlInGaP  
Amber & Orange  
1
AS AlGaAs Red  
0.1  
0.1  
0
1
2
3
1.5  
1.7  
1.9  
2.1  
2.3  
2.5  
FORWARD VOLTAGE - V  
FORWARD VOLTAGE - V  
Figure 2. Forward current vs. forward voltage.  
1.4  
1.2  
1.4  
1.2  
1
1
AlInGaP Orange  
GaP & AlGaAs  
0.8  
0.8  
0.6  
0.4  
0.2  
AlInGaP Red & Amber  
0.6  
0.4  
0.2  
0
0
0
5
10  
15  
20  
25  
30  
0
5
10  
15  
20  
25  
30  
DC FORWARD CURRENT - mA  
DC FORWARD CURRENT - mA  
Figure 3. Luminous intensity vs. forward current.  
4
30  
25  
35  
30  
25  
20  
15  
10  
5
20  
15  
10  
5
AlInGaP  
0
0
0
20  
40  
60  
80  
100  
0
20  
40  
60  
80  
100  
AMBIENT TEMPERATURE - °C  
AMBIENT TEMPERATURE – °C  
Figure 4. Maximum forward current vs. ambient temperature.  
10 - 30 SEC.  
255 - 260 °C  
3 °C/SEC. MAX.  
10 SEC. MAX.  
230 C MAX.  
217 °C  
200 °C  
6 °C/SEC. MAX.  
4 C/SEC. MAX.  
140-160 C  
150 °C  
3 °C/SEC. MAX.  
–3 C/SEC. MAX.  
4 C/SEC.  
MAX.  
100 SEC. MAX.  
60 - 120 SEC.  
OVER 2 MIN.  
TIME  
TIME  
(Acc. to J-STD-020C)  
Figure 5.. Recommended reflow soldering profile.  
Figure 6. Recommended Pb-free reflow soldering profile.  
EMITTED DIRECTION  
Figure 7. Recommended soldering land pattern.  
Notes:  
1. All dimensions are in millimeters (inches).  
2. Tolerance is 0.1mm ( 0.004in.) unless otherwise specified.  
5
USER FEED DIRECTION  
CATHODE SIDE  
PRINTED LABEL  
Figure 8. Reeling orientation.  
8.0 1.0 ꢀ0.ꢂ15 0.0ꢂꢃ3  
10.50 1.0 ꢀ0.ꢁ1ꢂ 0.0ꢂꢃ3  
Ø 20.20 MIN.  
ꢀØ 0.7ꢃ5 MIN.3  
Ø 1ꢂ.1 0.5  
ꢀØ 0.516 0.0203  
ꢂ.0 0.5  
ꢀ0.118 0.0203  
5ꢃ.60 1.00  
178.ꢁ0 1.00  
ꢀ2.ꢂꢁ6 0.0ꢂꢃ3  
ꢀ7.02ꢁ 0.0ꢂꢃ3  
ꢁ.0 0.5  
5.0 0.5  
ꢀ0.1ꢃ7 0.0203  
ꢀ0.157 0.0203  
6
PS  
Figure 9. Reel dimensions.  
6
4.00 ± 0.10  
(0.157 ± 0.004)  
1.20  
0.20  
1.50 + 0.100  
(0.059 + 0.004)  
CATHODE  
Ø
1.75 ± 0.10  
(0.069 ± 0.004)  
3.50 ± 0.05  
(0.138 ± 0.002)  
DIM. A  
(SEE TABLE)  
8.00 ± 0.30  
(0.315 ± 0.012)  
DIM. B  
(SEE TABLE)  
USER FEED  
DIRECTION  
Ø1.1  
4.00 ± 0.10  
(0.157 ± 0.004)  
TABLE 1  
2.00 ± 0.05  
(0.079 ± 0.002)  
DIM. A  
DIM. B  
DIM. C  
PART NUMBER  
± ±0.10 (0.004)  
± ±0.10 (0.004)  
2.30±(0.091)  
± ±0.10 (0.004)  
HSMx-C680  
3.35±(0.132)  
1.20±(0.047)  
DIMENSIONS±IN±MILLIMETERS±(INCHES)  
Figure 10. Carrier Tape Dimensions  
END  
START  
THERE SHALL BE A  
MINIMUM OF 40 mm  
(1.57 INCH) OF EMPTY  
COMPONENT POCKETS  
SEALED WITH COVER  
TAPE.  
MOUNTED WITH  
COMPONENTS  
THERE SHALL BE A  
MINIMUM OF 40 mm  
(1.57 INCH) OF EMPTY  
COMPONENT POCKETS  
SEALED WITH COVER  
TAPE.  
150 mm-360 mm  
(5.9 - 14.2 INCH)  
MAY CONSIST  
OF CARRIER  
AND/OR  
COVER TAPE.  
Figure 11. Tape leader and trailer dimensions.  
7
Reflow Soldering:  
For more information on reflow soldering, refer to Ap-  
plication Note AN-1060, Surface Mounting SMT LED  
Indicator Components.  
Storage Condition:  
5 to 30°C @ 60%RH max.  
Baking is required before mounting, if:  
1. Humidity Indicator Card is > 10% when read at 23  
5°C.  
2. Device expose to factory conditions <30°C/60%RH  
more than 672 hours  
Recommended baking condition:  
60 5°C for 20 hours.  
For product information and a complete list of distributors, please go to our web site: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.  
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved.  
AV02-0481EN - May 26, 2011  

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