CSPEMI608 [CALMIRCO]
LCD EMI Filter Array with ESD Protection; 带ESD保护液晶EMI滤波器阵列
| 型号： | CSPEMI608 |
| 厂家： | 
CALIFORNIA MICRO DEVICES CORP |
| 描述： | LCD EMI Filter Array with ESD Protection |
| 文件： | 总12页 (文件大小：1894K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PRELIMINARY
CSPEMI606/608
LCD EMI Filter Array with ESD Protection
Features
Product Description
•
•
Six and eight channels of EMI filtering
CAMD's CSPEMI606 and CSPEMI608 are EMI filter
arrays with ESD protection, which integrate six and
eight Pi- filters (C-R-C), respectively. The CSPEMI60x
has component values of 15pF-100Ω-15pF. These
devices include ESD protection diodes on every pin,
which provide a very high level of protection for sensi-
tive electronic components that may be subjected to
electrostatic discharge (ESD). The ESD diodes con-
nected to the filter ports are designed and character-
ized to safely dissipate ESD strikes of 15kV, beyond
the maximum requirement of the IEC 61000-4-2 inter-
national standard. Using the MIL-STD-883 (Method
3015) specification for Human Body Model (HBM)
ESD, the pins are protected for contact discharges at
greater than 30kV.
+15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
+30kV ESD protection on each channel (HBM)
Better than 30dB of attenuation at 1GHz to 3GHz
15-bump, 2.960mm x 1.330mm footprint
Chip Scale Package (CSPEMI606)
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
•
•
•
•
•
•
20-bump, 4.000mm x 1.458mm footprint
Chip Scale Package (CSPEMI608)
Lead-free version available
This device is particularly well suited for portable elec-
tronics (e.g. wireless handsets, PDAs, notebook com-
puters) because of its small package format and easy-
to-use pin assignments. In particular, the CSPEMI60x
is ideal for EMI filtering and protecting data lines from
ESD for the LCD display in clamshell handsets.
Applications
•
•
LCD data lines in clamshell wireless handsets
EMI filtering & ESD protection for high-speed I/O
data ports
•
•
•
•
Wireless handsets / cell phones
Notebook computers
PDAs / Handheld PCs
The CSPEMI606 and CSPEMI608 are available in
space-saving, low-profile chip-scale packages with
optional lead-free finishing.
EMI filtering for high-speed data lines
Electrical Schematic
100Ω
FILTERn*
FILTERn*
15pF
15pF
GND
(Pins B1-Bn)
1 of n EMI Filtering + ESD Channels
(n=6 for CSPEMI606, 8 for CSPEMI608)
* See Package/Pinout Diagram for expanded pin information.
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com
1
PRELIMINARY
CSPEMI606/608
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
TOP VIEW
(Bumps Up View)
(Bumps Down View)
Orientation
Marking
1
2
3
4
5
6
(see note 2)
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
C1
C2
C3
C4
C5
C6
A
B
C
GND
GND
GND
B1
B2
B3
606
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
Orientation
Marking
A1
A2
A3
A4
A5
A6
A1
CSPEMI606 CSP Package
Orientation
Marking
1
2
3
4
5
6
7
8
(see note 2)
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
A
B
C
C1
C2
C3
C4
C5
C6
C7
C8
GND
GND
GND
GND
B1
B2
B3
B4
EMI608
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
Orientation
Marking
A1
A2
A3
A4
A5
A6
A7
A8
A1
Notes:
CSPEMI608 CSP Package
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
CSPEMI606 CSPEMI608
NAME
NAME
DESCRIPTION
DESCRIPTION
Filter Channel 1
Filter Channel 2
Filter Channel 3
Filter Channel 4
Filter Channel 5
Filter Channel 6
Filter Channel 7
Filter Channel 8
Device Ground
CSPEMI606 CSPEMI608
NAME
NAME
DESCRIPTION
DESCRIPTION
Filter Channel 1
Filter Channel 2
Filter Channel 3
Filter Channel 4
Filter Channel 5
Filter Channel 6
Filter Channel 7
Filter Channel 8
PIN(s)
A1
PIN(s)
A1
PIN(s)
C1
C2
C3
C4
C5
C6
-
PIN(s)
C1
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
GND
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
A2
A2
C2
A3
A3
C3
A4
A4
C4
A5
A5
C5
A6
A6
C6
-
A7
C7
-
A8
-
C8
B1-B3
B1-B4
Ordering Information
PART NUMBERING INFORMATION
2
Standard Finish
Lead-free Finish
Ordering Part
Ordering Part
1
1
Bumps
15
Package
CSP
Number
Part Marking
606
Number
Part Marking
606
CSPEMI606
CSPEMI608
CSPEMI606G
CSPEMI608G
20
CSP
EMI608
EMI608
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2003 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 10/10/03
PRELIMINARY
CSPEMI606/608
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
°C
Storage Temperature Range
DC Power per Resistor
DC Package Power Rating
-65 to +150
100
mW
mW
500
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
°C
1
ELECTRICAL OPERATING CHARACTERISTICS
SYMBOL PARAMETER
CONDITIONS
MIN
80
TYP
100
15
MAX
120
18
UNITS
Ω
R
C
Resistance
Capacitance
At 2.5V DC, 1MHz, 30mV
AC
12
pF
V
Diode Standoff Voltage
I
=10µA
5.5
V
DIODE
DIODE
I
Diode Leakage Current (reverse bias)
V
=+3.3V
DIODE
100
nA
LEAK
V
Signal Voltage
Positive Clamp
Negative Clamp
I
= 10mA
SIG
LOAD
5.6
-0.4
6.8
-0.8
9.0
-1.5
V
V
V
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
Notes 2,4 and 5
ESD
30
15
kV
kV
b) Contact Discharge per IEC 61000-4-2
Level 4
V
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Notes 2,3,4 and 5
CL
+12
-7
V
V
Negative Transients
Cut-off Frequency
R=100Ω, C=15pF
fC
Z
=50Ω, Z
=50Ω
LOAD
120
MHz
SOURCE
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214 L Fax: 408.263.7846
L
www.calmicro.com
3
PRELIMINARY
CSPEMI606/608
Performance Information
Typical Filter Performance (T =25°C, DC Bias=0V, 50 Ohm Environment)
A
Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B1)
Figure 2. Insertion Loss VS. Frequency (A2-C2 to GND B1)
© 2003 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 10/10/03
PRELIMINARY
CSPEMI606/608
Performance Information (cont’d)
Typical Filter Performance (T =25°C, DC Bias=0V, 50 Ohm Environment)
A
Figure 3. Insertion Loss VS. Frequency (A3-C3 to GND B2)
Figure 4. Insertion Loss VS. Frequency (A4-C4 to GND B2)
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214 L Fax: 408.263.7846
L
www.calmicro.com
5
PRELIMINARY
CSPEMI606/608
Performance Information (cont’d)
Typical Filter Performance (T =25°C, DC Bias=0V, 50 Ohm Environment)
A
Figure 5. Insertion Loss VS. Frequency (A5-C5 to GND B3)
Figure 6. Insertion Loss VS. Frequency (A6-C6 to GND B3)
© 2003 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 10/10/03
PRELIMINARY
CSPEMI606/608
Performance Information (cont’d)
Typical Filter Performance (T =25°C, DC Bias=0V, 50 Ohm Environment)
A
Figure 7. Insertion Loss VS. Frequency
(A7-C7 to GND B4, CSPEMI608 Only)
Figure 8. Insertion Loss VS. Frequency
(A8-C8 to GND B4, CSPEMI608 Only)
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214 L Fax: 408.263.7846
L
www.calmicro.com
7
PRELIMINARY
CSPEMI606/608
Performance Information (cont’d)
Figure 9. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25°C)
© 2003 California Micro Devices Corp. All rights reserved.
8
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 10/10/03
PRELIMINARY
CSPEMI606/608
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
0.275mm
Pad Size on PCB
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
0.325mm Round
0.125mm - 0.150mm
0.330mm Round
50/50 by volume
No Clean
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
OSP (Entek Cu Plus 106A)
+50µm
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Soldering Maximum Temperature
+20µm
60 seconds
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 10. Recommended Non-Solder Mask Defined Pad Illustration
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
Figure 11. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 12. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214 L Fax: 408.263.7846
L
www.calmicro.com
9
PRELIMINARY
CSPEMI606/608
Mechanical Details
CSPEMI606/608 devices are packaged in a custom
Chip Scale Packages (CSP). Dimensions for each of
these devices are presented in the following pages.
Mechanical Package Diagrams
CSPEMI606 Mechanical Specifications
BOTTOM VIEW
A1
The package dimensions for the CSPEMI606 are pre-
sented below.
SIDE
VIEW
B2
B1
C1
C
B
A
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
15
1
2
3
4
5
6
D1
D2
0.30 DIA.
Millimeters
Nom Max
Inches
Nom
63/37 Sn/Pb (Eutectic) or
Dim
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
Min
Min
Max
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
2.915 2.960 3.005 0.1148 0.1165 0.1183
1.285 1.330 1.375 0.0506 0.0524 0.0541
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.561 0.605 0.649 0.0221 0.0238 0.0255
0.355 0.380 0.405 0.0140 0.0150 0.0159
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CSPEMI606 Chip Scale Package
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
© 2003 California Micro Devices Corp. All rights reserved.
10
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 10/10/03
PRELIMINARY
CSPEMI606/608
Mechanical Details (cont’d)
CSPEMI608 Mechanical Specifications
Mechanical Package Diagrams
The package dimensions for the CSPEMI608 are pre-
sented below.
BOTTOM VIEW
A1
SIDE
C1
B2
VIEW
B1
C
B
A
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
20
1
2
3
4
5
6
7
8
D1
D2
Millimeters
Nom Max
Inches
Nom
0.30 DIA.
Dim
63/37 Sn/Pb (Eutectic) or
Min
Min
Max
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
3.955 4.000 4.045 0.1557 0.1575 0.1593
1.413 1.458 1.503 0.0556 0.0574 0.0592
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.200 0.250 0.300 0.0079 0.0098 0.0118
0.244 0.294 0.344 0.0096 0.0116 0.0135
0.561 0.605 0.649 0.0221 0.0238 0.0255
0.355 0.380 0.405 0.0140 0.0150 0.0159
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CSPEMI608 Chip Scale Package
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214 L Fax: 408.263.7846
L
www.calmicro.com
11
PRELIMINARY
CSPEMI606/608
Mechanical Details (cont’d)
CSP Tape and Reel Specifications
POCKET SIZE (mm)
B X A X K
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
P
P
1
PART NUMBER
CSPEMI606
CHIP SIZE (mm)
2.96 X 1.33 X 0.6
4.00 X 1.46 X 0.6
REEL
3500
3500
0
0
0
0
3.10 X 1.45 X 0.74
4.11 X 1.57 X 0.76
8mm
8mm
178mm (7")
178mm (7")
4mm 4mm
4mm 4mm
CSPEMI608
10 Pitches Cumulative
Tolerance On Tape
0.2 mm
P
o
Top
Cover
Tape
A
o
W
B
o
K
o
For Tape Feeder Reference
Embossment
Only including Draft.
Center Lines
of Cavity
P
1
Concentric Around B.
User Direction of Feed
Figure 13. Tape and Reel Mechanical Data
© 2003 California Micro Devices Corp. All rights reserved.
12
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 10/10/03
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