CG2163X3_17 [CEL]

Broadband SPDT RF Switch;
CG2163X3_17
型号: CG2163X3_17
厂家: CALIFORNIA EASTERN LABS    CALIFORNIA EASTERN LABS
描述:

Broadband SPDT RF Switch

光电二极管
文件: 总8页 (文件大小:617K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
RF SWITCH  
CG2163X3  
Broadband SPDT RF Switch  
DESCRIPTION  
PACKAGE  
The CG2163X3 is a GaAs MMIC SPDT(Single Pole  
Double Throw) switch which was developed for  
2.4 GHz and 6 GHz dual-band wireless LAN  
6-pin XSON Package  
(1.5mm x 1.5mm x 0.37mm)  
FEATURES  
Control voltage :  
VC(H) = 1.8 to 5.0 V (3.0V TYP.)  
VC(L) = -0.2 to 0.2 V (0V TYP.)  
Low insertion loss :  
Lins1 = 0.40 dB TYP. @ f = 2.4 to 2.5 GHz  
Lins2 = 0.50 dB TYP. @ f = 4.9 to 6.0 GHz  
High isolation :  
ISL1 = 40 dB TYP. @ f = 2.4 to 2.5 GHz  
ISL2 = 31 dB TYP. @ f = 4.9 to 6.0 GHz  
Power handling :  
Pin(1db) = +33 dBm TYP. @ f = 2.5 GHz  
VC(H) = 3.0 V, VC(L) = 0 V  
APPLICATIONS  
Dual-band wireless  
LAN (IEEE802.11a/b/g/n/ac)  
Pin(1db) = +32 dBm TYP. @ f = 6.0 GHz,  
VC(H) = 3.0 V, VC(L) = 0 V  
ORDERING INFORMATION  
Part Number  
CG2163X3  
Order Number  
CG2163X3-C2  
Package  
6-pin plastic  
TSON  
Marking  
C06  
Description  
Embossed tape 8 mm wide  
Pin 1, 6 face the perforation  
side of the tape  
(Pb-Free)  
MOQ 10 kpcs/reel  
CG2163X3-EVAL  
CG2163X3-EVAL  
Evaluation Board with DC  
block capacitors, power  
supply bypass capacitors,  
and RF and DC connectors  
MOQ 1  
1
This document is subject to change without notice.  
Date Published: January 2017  
CDS-0015-03 (Issue G)  
CG2163X3  
PIN CONFIGURATION AND  
INTERNAL BLOCK DIAGRAM  
TRUTH TABLE  
VC1  
High  
Low  
VC2  
Low  
High  
RFC-RF1  
OFF  
RFC-RF2  
ON  
ON  
OFF  
ABSOLUTE MAXIMUM RATINGS  
A
(T = +25˚C, unless otherwise specified)  
Parameter  
Control Voltage  
Symbol  
VC  
Rating  
6.0Note 1  
Unit  
V
+33.5Note 2  
Input Power  
Pin  
dBm  
Operating Ambient Temperature  
Storage Temperature  
TA  
˚C  
˚C  
-45 +85  
Tstg  
-55 +150  
Note 1. |VC1 - VC2|6.0V  
2. 3.0V|VC1 - VC2|5.0V  
RECOMMENDED OPERATING RANGE  
A
(T = +25˚C, unless otherwise specified)  
Parameter  
Symbol  
f1  
MIN.  
TYP.  
-
MAX.  
Unit  
GHz  
Operating Frequency  
2.4  
4.9  
2.5  
6.0  
f2  
-
+3.0  
0
GHz  
V
Switch Control Voltage (H)  
Switch Control Voltage (L)  
VC(H)  
VC(L)  
+1.8  
-0.2  
+5.0  
+0.2  
V
2
This document is subject to change without notice.  
CG2163X3  
ELECTRICAL CHARACTERISTICS  
A
(T =+25˚C, VC(H)=3.0V, VC(L)=0V, Zo=50Ω, DC Block Capacitance=4pF, unless otherwise specified)  
Parameter  
Symbol  
Lins1  
Test Conditions  
MIN.  
-
TYP.  
0.40  
MAX.  
Unit  
dB  
Insertion Loss  
0.60  
f = 2.4 to 2.5 GHz  
Lins2  
ISL1  
ISL2  
RL1  
-
37  
28  
-
0.50  
40  
0.80  
dB  
dB  
f = 4.9 to 6.0 GHz  
f = 2.4 to 2.5 GHz  
f = 4.9 to 6.0 GHz  
f = 2.4 to 2.5 GHz  
f = 4.9 to 6.0 GHz  
Isolation  
-
-
-
-
-
31  
dB  
Return Loss  
15  
dB  
RL2  
-
15  
dB  
1 dB Compression Point  
Note  
Pin(1dB)  
f = 2.4 to 2.5 GHz,  
VC(H)=1.8V, VC(L)=0V  
f = 2.4 to 2.5 GHz,  
VC(H)=3.0V, VC(L)=0V  
f = 4.9 to 6.0 GHz,  
VC(H)=1.8V, VC(L)=0V  
f = 4.9 to 6.0 GHz  
VC(H)=3.0V, VC(L)=0V  
f = 2.5GHz  
2-tone 5MHz Spacing  
-
+29  
dBm  
-
-
-
-
+33  
+26  
+32  
+55  
-
-
-
-
dBm  
dBm  
dBm  
dBm  
3
IIP  
3rd Order Input  
Intercept Point  
Switch Control Speed  
Switch Control Current  
tsw  
-
-
80  
2
-
-
ns  
50% CTL to 90/10%  
RF None  
Icont  
μA  
Note Pin(1dB) is the measured input power level when the insertion loss increases 1dB more than that of the  
linear range.  
3
This document is subject to change without notice.  
CG2163X3  
EVALUATION CIRCUIT  
The application circuits and their parameters are for reference only and are not intended for use in actual designs.  
DC Blocking Capacitors are required at all RF ports.  
PACKAGE DIMENSIONS  
6-pin Plastic XSON (Unit: mm)  
4
This document is subject to change without notice.  
CG2163X3  
RECOMMENDED SOLDERING CONDITIONS  
Recommended Soldering Conditions are available on CEL’s Part Summary page under Associated Documents  
5
This document is subject to change without notice.  
CG2163X3  
REVISION HISTORY  
Version  
CDS-0015-03 (Issue A)  
February 17, 2016  
Change to current version  
Page(s)  
N/A  
Initial datasheet  
CDS-0015-03 (Issue B)  
March 11, 2016  
Added Eval Board ordering information  
Updated “Note” definition  
1
3
CDS-0015-03 (Issue C)  
March 15, 2016  
CDS-0015-03 (Issue D)  
April 4, 2016  
Updated Marking information  
Correction to Truth Table: VC1 and VC2  
Removed “preliminary”  
1, 2  
2
CDS-0015-03 (Issue E)  
May 9, 2016  
CDS-0015-03 (Issue F)  
August 11, 2016  
All  
3, 5  
CDS-0015-03 (Issue G)  
January 10, 2017  
Revised Electrical Characteristics table  
Added “Recommended Soldering Conditions” section  
6
This document is subject to change without notice.  
CG2163X3  
[CAUTION]  
All information included in this document is current as of the date this document is issued. Such information,  
however, is subject to change without any prior notice.  
You should not alter, modify, copy, or otherwise misappropriate any CEL product, whether in whole or in part.  
CEL does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of  
third parties by or arising from the use of CEL products or technical information described in this document. No  
license, expressed, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual  
property rights of CEL or others.  
Descriptions of circuits, software and other related information in this document are provided only to illustrate the  
operation of semiconductor products and application examples. You are fully responsible for the incorporation of  
these circuits, software, and information in the design of your equipment. CEL assumes no responsibility for any  
losses incurred by you or third parties arising from the use of these circuits, software, or information.  
CEL has used reasonable care in preparing the information included in this document, but CEL does not warrant  
that such information is error free. CEL assumes no liability whatsoever for any damages incurred by you resulting  
from errors in or omissions from the information included herein.  
Although CEL endeavors to improve the quality and reliability of its products, semiconductor products have specific  
characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions.  
Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or  
damage caused by fire in the event of the failure of a CEL product, such as safety design for hardware and software  
including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging  
degradation or any other appropriate measures  
Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final  
products or system manufactured by you.  
Please use CEL products in compliance with all applicable laws and regulations that regulate the inclusion or use of  
controlled substances, including without limitation, the EU RoHS Directive.  
CEL assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and  
regulations.  
This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent  
of CEL.  
Please contact CEL if you have any questions regarding the information contained in this document or CEL  
products, or if you have any other inquiries.  
7
This document is subject to change without notice.  
CG2163X3  
[CAUTION]  
This product uses gallium arsenide (GaAs) of the toxic substance appointed in laws and ordinances.  
GaAs vapor and powder are hazardous to human health if inhaled or ingested.  
Do not dispose in fire or break up this product.  
Do not chemically make gas or powder with this product.  
When discarding this product, please obey the laws of your country.  
Do not lick the product or in any way allow it to enter the mouth.  
[CAUTION]  
Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can  
damage this device. This device must be protected at all times from ESD. Static charges may easily  
produce potentials of several kilovolts on the human body or equipment, which can discharge  
without detection. Industry-standard ESD precautions should be used at all times.  
CEL Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054 • Tel: (408) 919-2500 • www.cel.com  
For a complete list of sales offices, representatives and distributors,  
Please visit our website: www.cel.com/contactus  
For inquiries email us at rfw@cel.com  
8
This document is subject to change without notice.  

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