CGHV37400F [CREE]

400 W, 3500 - 3700 MHz, 50-Ohm Input/Output Matched, GaN HEMT for S-Band Radar Systems;
CGHV37400F
型号: CGHV37400F
厂家: CREE, INC    CREE, INC
描述:

400 W, 3500 - 3700 MHz, 50-Ohm Input/Output Matched, GaN HEMT for S-Band Radar Systems

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CGHV37400F  
400 W, 3500 - 3700 MHz, 50-Ohm Input/Output Matched, GaN HEMT for S-Band Radar Systems  
Cree’s CGHV37400F is a gallium nitride (GaN) high electron mobility transistor (HEMT)  
designed specifically with high efficiency, high gain and wide bandwidth capabilities,  
which makes the CGHV37400F ideal for 3.5 - 3.7 GHz S-Band radar amplifier applications.  
The transistor is matched to 50-ohms on the input and 50-ohms on the output. The  
CGHV35400 is based on Cree’s high power density 50 V, 0.4 µm GaN on silicon carbide  
(SiC) foundry process. The transistor is supplied in a ceramic/metal flange package, type  
440217.  
Typical Performance Over 3.5-3.7 GHz (TC = 25˚C) of Demonstration Amplifier  
Parameter  
3.5 GHz  
3.6  
3.7 GHz  
Units  
Output Power  
555  
560  
555  
W
Gain  
11.4  
55  
11.5  
55  
11.4  
55  
dB  
%
Drain Efficiency  
Note:  
Measured in the CGHV37400F-AMP application circuit, under 100 μs pulse width, 10% duty cycle, PIN = 46 dBm.  
Features  
3.3 - 3.8 GHz Operation  
550 W Typical Output Power  
11.5 dB Power Gain  
55% Typical Drain Efficiency  
50 Ohm Internally Matched  
<0.3 dB Pulsed Amplitude Droop  
Subject to change without notice.  
www.cree.com/rf  
1
Absolute Maximum Ratings (not simultaneous)  
Parameter  
Symbol  
PW  
Rating  
100  
Units  
µs  
Conditions  
Pulse Width  
Duty Cycle  
DC  
10  
%
Drain-Source Voltage  
VDSS  
VGS  
125  
Volts  
Volts  
˚C  
25˚C  
25˚C  
Gate-to-Source Voltage  
Storage Temperature  
-10, +2  
-65, +150  
225  
TSTG  
Operating Junction Temperature  
Maximum Forward Gate Current  
Maximum Drain Current1  
Soldering Temperature2  
Screw Torque  
T
˚C  
J
IGMAX  
IDMAX  
TS  
80  
mA  
A
25˚C  
25˚C  
24  
245  
˚C  
40  
in-oz  
˚C/W  
˚C/W  
˚C  
τ
Pulsed Thermal Resistance, Junction to Case  
Pulsed Thermal Resistance, Junction to Case  
Case Operating Temperature  
RθJC  
RθJC  
TC  
0.22  
0.30  
-40, +125  
100 μsec, 10%, 85˚C , PDISS = 418 W  
500 μsec, 10%, 85˚C, PDISS = 418 W  
Notes:  
1 Current limit for long term, reliable operation  
2 Refer to the Application Note on soldering at http://www.cree.com/rf/tools-and-support/document-library  
Electrical Characteristics  
Characteristics  
Symbol  
Min.  
Typ.  
Max.  
Units  
Conditions  
DC Characteristics1 (TC = 25˚C)  
Gate Threshold Voltage  
VGS(th)  
VGS(Q)  
IDS  
-3.8  
-3.0  
-2.7  
75.5  
-2.3  
VDC  
VDC  
A
VDS = 10 V, ID = 83.6 mA  
VDS = 50 V, ID = 0.5 A  
Gate Quiescent Voltage  
Saturated Drain Current2  
62.7  
150  
VDS = 6.0 V, VGS = 2.0 V  
VGS = -8 V, ID = 83.6 mA  
Drain-Source Breakdown Voltage  
VBR  
VDC  
RF Characteristics3 (TC = 25˚C, F0 = 3.5 - 3.7 GHz unless otherwise noted)  
Output Power at 3.5 GHz  
Output Power at 3.6 GHz  
Output Power at 3.7 GHz  
Power Gain at 3.5 GHz  
Power Gain at 3.6 GHz  
Power Gain at 3.7 GHz  
Drain Efficiency  
POUT1  
POUT2  
POUT3  
GP1  
555  
560  
555  
11.4  
11.5  
11.4  
55  
W
W
VDD = 50 V, IDQ = 1000 mA, PIN = 46 dBm  
VDD = 50 V, IDQ = 1000 mA, PIN = 46 dBm  
VDD = 50 V, IDQ = 1000 mA, PIN = 46 dBm  
VDD = 50 V, IDQ = 1000 mA, PIN = 46 dBm  
VDD = 50 V, IDQ = 1000 mA, PIN = 46 dBm  
VDD = 50 V, IDQ = 1000 mA, PIN = 46 dBm  
VDD = 50 V, IDQ = 1000 mA, PIN = 46 dBm  
VDD = 50 V, IDQ = 1000 mA, PIN = -10 dBm  
VDD = 50 V, IDQ = 1000 mA, PIN = -10 dBm  
VDD = 50 V, IDQ = 1000 mA, PIN = -10 dBm  
VDD = 50 V, IDQ = 1000 mA, PIN = 46 dBm  
No damage at all phase angles, VDD = 50 V, IDQ = 1000 mA, PIN = 46 dBm Pulsed  
W
dB  
dB  
dB  
%
GP2  
GP3  
DE  
Small Signal Gain  
S21  
S11  
S22  
D
14  
dB  
dB  
dB  
dB  
Y
Input Return Loss  
-9  
Output Return Loss  
Amplitude Droop  
-6  
-0.3  
5:1  
Output Stress Match  
Notes:  
VSWR  
1 Measured on wafer prior to packaging.  
2 Scaled from PCM data.  
3 Measured in CGHV37400F-AMP. Pulse Width = 100 μS, Duty Cycle = 10%.  
4 The device is not recommended for 5:1 VSWR applications below 3.3 GHz.  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
2
CGHV37400F Rev 0.0  
Electrostatic Discharge (ESD) Classifications  
Parameter  
Symbol  
HBM  
Class  
Test Methodology  
JEDEC JESD22 A114-D  
JEDEC JESD22 C101-C  
Human Body Model  
Charge Device Model  
1A (> 250 V)  
II (200 < 500 V)  
CDM  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
3
CGHV37400F Rev 0.0  
Typical Performance  
Figure 1. - Typical Small Signal Gain and Return Losses vs Frequency  
VDD = 50 V, IDQ = 1.0 A  
Figure 2. - CGHV37400F Output Power and Drain Efficiency vs Frequency  
VDD = 50 V, IDQ = 1.0 A, PIN = 46 dBm, Pulse Width = 100µs, Duty Cycle = 10 %, TCASE = 25˚C  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
4
CGHV37400F Rev 0.0  
Typical Performance  
Figure 3. - Typical Output Power vs Input Power of the CGHV37400F  
VDD = 50 V, IDQ = 1.0 A, Pulse Width = 100µs, Duty Cycle = 10%, TCASE = 25˚C  
Figure 2. - CGHV37400F Drain Efficiency and Gain vs Input Power  
VDD = 50 V, IDQ = 1.0 A, Pulse Width = 100µs, Duty Cycle = 10 %, TCASE = 25˚C  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
5
CGHV37400F Rev 0.0  
CGHV37400F-AMP Application Circuit Bill of Materials  
Designator  
Description  
Qty  
R1  
R2  
RES, 511, OHM, +/- 1%, 1/16W, 0603  
RES, 5.1, OHM, +/- 1%, 1/16W, 0603  
CAP, 6.8pF, +/-0.25%, 250V, 0603  
CAP, 10.0pF, +/-1%, 250V, 0805  
CAP, 10.0pF, +/-5%, 250V, 0603  
CAP, 470pF, 5%, 100V, 0603, X  
CAP, 33000 pF, 0805, 100V, X7R  
CAP, 10uF 16V TANTALUM  
1
1
1
3
1
2
1
1
1
1
1
2
1
1
1
1
1
C1  
C2, C7, C8  
C3  
C4, C9  
C5  
C6  
C10  
C11  
C12  
J1,J2  
J3  
CAP, 1.0uF, 100V, 10%, X7R, 1210  
CAP, 33uF, 20%, G CASE  
CAP, 3300uF, +/-20%, 100V, ELECTROLYTIC  
CONN, SMA, PANEL MOUNT JACK, FL  
HEADER, RT>PLZ, 0.1CEN LK 9POS  
CONNECTOR; SMB, Straight, JACK, SMD  
CABLE, 18 AWG, 4.2  
J4  
W1  
-
PCB, RO4350, 2.5 X 4.0 X 0.030  
CGHV37400F  
Q1  
CGHV37400F Power Dissipation De-rating Curve  
450  
400  
350  
300  
250  
200  
Note 1  
Note 1. Area exceeds Maximum Case Temperature (See Page 2).  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
6
CGHV37400F Rev 0.0  
CGHV37400F-AMP Application Circuit Outline  
CGHV37400F-AMP Application Circuit Schematic  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
7
CGHV37400F Rev 0.0  
Product Dimensions CGHV37400F (Package Type — 440217)  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
8
CGHV37400F Rev 0.0  
Part Number System  
CGHV37400F  
Package  
Power Output (W)  
Upper Frequency (GHz)  
Cree GaN High Voltage  
Parameter  
Value  
Units  
Upper Frequency1  
Power Output  
Package  
3.7  
400  
GHz  
W
-
Flange  
Table 1.  
Note1: Alpha characters used in frequency code  
indicate a value greater than 9.9 GHz. See Table  
2 for value.  
Character Code  
Code Value  
A
B
C
D
E
0
1
2
3
4
5
6
7
8
9
F
G
H
J
K
1A = 10.0 GHz  
2H = 27.0 GHz  
Examples:  
Table 2.  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
9
CGHV37400F Rev 0.0  
Product Ordering Information  
Order Number  
Description  
Unit of Measure  
CGHV37400F  
GaN HEMT  
Each  
CGHV37400F-TB  
Test board without GaN HEMT  
Each  
CGHV37400F-AMP  
Test board with GaN HEMT installed  
Each  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
10  
CGHV37400F Rev 0.0  
Disclaimer  
Specifications are subject to change without notice. Cree, Inc. believes the information contained within this data sheet to be accurate  
and reliable. However, no responsibility is assumed by Cree for any infringement of patents or other rights of third parties which may  
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Cree. Cree makes no warranty,  
representation or guarantee regarding the suitability of its products for any particular purpose. “Typical” parameters are the average  
values expected by Cree in large quantities and are provided for information purposes only. These values can and do vary in different  
applications and actual performance can vary over time. All operating parameters should be validated by customer’s technical experts  
for each application. Cree products are not designed, intended or authorized for use as components in applications intended for surgical  
implant into the body or to support or sustain life, in applications in which the failure of the Cree product could result in personal injury or  
death or in applications for planning, construction, maintenance or direct operation of a nuclear facility.  
For more information, please contact:  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
www.cree.com/rf  
Sarah Miller  
Marketing  
Cree, RF Components  
1.919.407.5302  
Ryan Baker  
Marketing & Sales  
Cree, RF Components  
1.919.407.7816  
Tom Dekker  
Sales Director  
Cree, RF Components  
1.919.407.5639  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
11  
CGHV37400F Rev 0.0  

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