CLD-AP90_技术文档

Soldering & handling

®

Cꢀꢁꢁ Xlꢂmp XB-d leds

TaBle of ConTenTS

inTroduCTion

Handling XLamp XB-D LeDs.................................2

Circuit Board Prꢀparation & Layouts ......................4

Casꢀ Tꢀmpꢀraturꢀ (T_s) Mꢀasurꢀmꢀnt Point .............4

Notꢀs on Soldꢀring XLamp XB-D LeDs...................5

Moisturꢀ Sꢀnsitiꢁity ............................................6

XLamp XB-D LED Reﬂow Soldering Characteristics ..7

Chꢀmicals & Conformal Coatings ..........................8

Assꢀmbly Storagꢀ & Handling...............................9

Tapꢀ and Rꢀꢀl - XB-D LeDs ................................10

Packaging & Labꢀls...........................................11

This application notꢀ appliꢀs to XLamp XB-D LeDs

which haꢁꢀ ordꢀr codꢀs in thꢀ following format.

XBDxxx-xx-xxxx-xxxxxxxxx

This application notꢀ ꢀxplains how XLamp XB-D LeDs

and assꢀmbliꢀs containing thꢀsꢀ LeDs should bꢀ

handlꢀd during manufacturing. Plꢀasꢀ rꢀad thꢀ ꢀntirꢀ

documꢀnt to undꢀrstand how to propꢀrly handlꢀ

XLamp XB-D LeDs.

Crꢀꢀ logo and XLamp arꢀ rꢀgistꢀrꢀd tradꢀmarks of Crꢀꢀ, Inc. This documꢀnt is proꢁidꢀd for informational purposꢀs only and is not

a warranty or a speciﬁcation. For product speciﬁcations, please see the data sheets available at www.cree.com.

Creꢀeꢀ, Inc.

4600 Silicon Drivꢁeꢀ

Durham, NC 27703

USA Teꢀl: +1.919.313.5300

www.cree.com/xlamp

xlamp xB-D leD solDering & hanDling

handling Xlaꢃꢄ XB-d ledS

ꢃꢂꢅꢆꢂꢇ hꢂꢅꢈꢇꢉꢅꢊ

Usꢀ twꢀꢀzꢀrs to grab XLamp XB-D LeDs at thꢀ basꢀ. Do not touch thꢀ lꢀns with thꢀ twꢀꢀzꢀrs. Do not touch thꢀ lꢀns with

ﬁngers. Do not push on the lens.

Do not apply morꢀ than 1000 g of shꢀar forcꢀ onto thꢀ lꢀns. excꢀssiꢁꢀ forcꢀ on thꢀ lꢀns could damagꢀ thꢀ LeD.

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Crꢀꢀ rꢀcommꢀnds thꢀ following at all timꢀs whꢀn handling XLamp XB-D LeDs or assꢀmbliꢀs containing thꢀsꢀ LeDs:

•

Aꢁoid putting ꢀxcꢀssiꢁꢀ mꢀchanical strꢀss on thꢀ LeD lꢀns.

Never touch the optical surface with ﬁngers or sharp objects. The LED lens surface could be soiled or damaged,

which would affꢀct thꢀ optical pꢀrformancꢀ of thꢀ LeD.

Whꢀnꢀꢁꢀr possiblꢀ, Crꢀꢀ rꢀcommꢀnds thꢀ usꢀ of a pick & placꢀ tool to rꢀmoꢁꢀ XLamp XB-D LeDs from thꢀ factory tapꢀ

& rꢀꢀl packaging.

of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a speciﬁcation. For product speciﬁcations, please see the data sheets available at

of Cree, Inc.

www.cree.com.

2

xlamp xB-D leD solDering & hanDling

ꢄꢉck & ꢄꢇꢂcꢁ nꢋzzꢇꢁ

For pick and place nozzles coming into contact with silicone-covered LED components, Cree recommends nozzles be

constructꢀd of non-mꢀtallic matꢀrials. Crꢀꢀ and sꢀꢁꢀral of Crꢀꢀ’s customꢀrs haꢁꢀ had good succꢀss using nozzlꢀs

fabricated from Teﬂon or from 90d urethane. The following pick & place tool is speciﬁc to the XB Family LEDs.

All dimꢀnsions in mm.

2.500

+.100/-.000

4.500

1.125

Add features as required

5.500

4x 15.0°

to interface with customer's tool

2.500

+.100/-.000

4x R.200

2.300 ± .050 thru

2.400 +.050/-.000

x 90°

of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a speciﬁcation. For product speciﬁcations, please see the data sheets available at

of Cree, Inc.

www.cree.com.

3

xlamp xB-D leD solDering & hanDling

CirCuiT Board ꢄreꢄaraTion & layouTS

Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s speciﬁcations before

placing or soldꢀring XLamp XB-D LeDs onto thꢀ PCB.

Thꢀ diagram bꢀlow shows thꢀ rꢀcommꢀndꢀd PCB soldꢀr pad layout for XLamp XB-D LeDs.

All dimꢀnsions in mm.

0.852

0.36

0.426

0.82

0.426

0.46

0.284

2.272

0.36

2.34

1.136

0.284

0.28

0.36

0.92

2.34

2.272

Rꢀcommꢀndꢀd PCB Soldꢀr Pad

Rꢀcommꢀndꢀd Stꢀncil Pattꢀrn

CaSe TeꢃꢄeraTure (T_S) ꢃeaSureꢃenT ꢄoinT

XLamp XB-D LeD casꢀ tꢀmpꢀraturꢀ (T_s) should bꢀ mꢀasurꢀd on thꢀ PCB surfacꢀ, as closꢀ to thꢀ LeD’s thꢀrmal pad as

possiblꢀ. This mꢀasurꢀmꢀnt point is shown in thꢀ picturꢀ bꢀlow.

Thꢀrmocouplꢀ sitꢀ

if no sꢀparatꢀ pad

Pad for thꢀrmocouplꢀ

It is not rꢀquirꢀd to usꢀ a soldꢀr footprint for thꢀ thꢀrmal pad that is largꢀr than thꢀ XLamp XB-D LeD itsꢀlf. In tꢀsting,

Cree has found such a solder pad to have insigniﬁcant impact on the resulting T mꢀasurꢀmꢀnt.

s

of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a speciﬁcation. For product speciﬁcations, please see the data sheets available at

of Cree, Inc.

www.cree.com.

4

xlamp xB-D leD solDering & hanDling

noTeS on Soldering Xlaꢃꢄ XB-d ledS

XLamp XB-D LEDs are designed to be reﬂow soldered to a PCB. Reﬂow soldering may be done by a reﬂow oven or by

placing the PCB on a hotplate and following the reﬂow soldering proﬁle listed on the previous page.

Do not waꢁꢀ soldꢀr XLamp XB-D LeDs. Do not hand soldꢀr XLamp XB-D LeDs.

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Wrong

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CorreCT

Sꢋꢇꢈꢁꢀ ꢄꢂstꢁ Tꢌpꢁ

Cree strongly recommends using “no clean” solder paste with XLamp XB-D LEDs so that cleaning the PCB after reﬂow

soldꢀring is not rꢀquirꢀd. Crꢀꢀ usꢀs thꢀ following soldꢀr pastꢀ intꢀrnally.

Indium Corporation of Amꢀrica® Part numbꢀr 82676

•

Sn62/Pb36/Ag2 composition

Flux: NC-SMQ92J

Crꢀꢀ rꢀcommꢀnds thꢀ following soldꢀr pastꢀ compositions: SnPbAg, SnAgCu and SnAg.

Sꢋꢇꢈꢁꢀ ꢄꢂstꢁ Tꢍꢉckꢅꢁss

The choice of solder and the application method will dictate the speciﬁc amount of solder. For the most consistent

rꢀsults, an automatꢀd dispꢀnsing systꢀm or a soldꢀr stꢀncil printꢀr is rꢀcommꢀndꢀd. Crꢀꢀ has sꢀꢀn positiꢁꢀ rꢀsults

using solder thickness that results in a 3-mil (75-μm) bond line.

P

X

CorreCT

Wrong

of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a speciﬁcation. For product speciﬁcations, please see the data sheets available at

of Cree, Inc.

www.cree.com.

5

xlamp xB-D leD solDering & hanDling

aꢎtꢁꢀ Sꢋꢇꢈꢁꢀꢉꢅꢊ

Aftꢀr soldꢀring, allow XLamp XB-D LeDs to rꢀturn to room tꢀmpꢀraturꢀ bꢀforꢀ subsꢀquꢀnt handling. Handling of thꢀ

dꢀꢁicꢀ, ꢀspꢀcially around thꢀ lꢀns, bꢀforꢀ cooling could rꢀsult in damagꢀ to thꢀ LeD.

Crꢀꢀ rꢀcommꢀnds ꢁꢀrifying thꢀ soldꢀr procꢀss by chꢀcking thꢀ consistꢀncy of thꢀ soldꢀr bond of sꢀꢁꢀral trial PCBs

after reﬂow. This can be done by X-ray or by shearing selected devices from the circuit board. The solder should

appear completely re-ﬂown (no solder grains evident). The solder areas should show minimum evidence of voids on the

backsidꢀ of thꢀ packagꢀ and thꢀ PCB.

Cꢇꢁꢂꢅꢉꢅꢊ ꢄCBs aꢎtꢁꢀ Sꢋꢇꢈꢁꢀꢉꢅꢊ

Cree recommends using “no clean” solder paste so that ﬂux cleaning is not necessary after reﬂow soldering. If PCB

clꢀaning is nꢀcꢀssary, Crꢀꢀ rꢀcommꢀnds thꢀ usꢀ of isopropyl alcohol (IPA).

Do not usꢀ ultrasonic clꢀaning.

ꢃoiSTure SenSiTiviTy

In testing, Cree has found XLamp XB-D LEDs to have unlimited ﬂoor life in conditions ≤ 30 ºC / 85% relative humidity

(RH). Howꢀꢁꢀr, Crꢀꢀ rꢀcommꢀnds kꢀꢀping XLamp LeDs in thꢀir sꢀalꢀd moisturꢀ-barriꢀr packaging until immꢀdiatꢀly

prior to usꢀ. Crꢀꢀ also rꢀcommꢀnds rꢀturning any unusꢀd LeDs to thꢀ rꢀsꢀalablꢀ moisturꢀ-barriꢀr bag and closing thꢀ

bag immediately after use. Moisture testing included a 168-hour soak at 85 ºC / 85% RH followed by 3 reﬂow cycles,

with ꢁisual and ꢀlꢀctrical inspꢀctions at ꢀach stagꢀ.

of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a speciﬁcation. For product speciﬁcations, please see the data sheets available at

of Cree, Inc.

www.cree.com.

6

xlamp xB-D leD solDering & hanDling

Xlaꢃꢄ XB-d led refloW Soldering CharaCTeriSTiCS

In testing, Cree has found XLamp XB-D LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed

below. As a general guideline, Cree recommends that users follow the recommended soldering proﬁle provided by the

manufacturꢀr of soldꢀr pastꢀ usꢀd.

Notꢀ that this gꢀnꢀral guidꢀlinꢀ is offꢀrꢀd as a starting point and may rꢀquirꢀ adjustmꢀnt for cꢀrtain PCB dꢀsigns and

conﬁgurations of reﬂow soldering equipment.

Proﬁle Feature

lꢁꢂꢈ-Bꢂsꢁꢈ Sꢋꢇꢈꢁꢀ

lꢁꢂꢈ-fꢀꢁꢁ Sꢋꢇꢈꢁꢀ

Aꢁꢀragꢀ Ramp-Up Ratꢀ (Ts_maxto Tp)

3 °C/sꢀcond max.

100 °C

3 °C/sꢀcond max.

150 °C

Prꢀhꢀat: Tꢀmpꢀraturꢀ Min (Ts_min

Prꢀhꢀat: Tꢀmpꢀraturꢀ Max (Ts_max

Prꢀhꢀat: Timꢀ (ts_minto ts_max

)

150 °C

60-120 sꢀconds

183 °C

200 °C

60-180 sꢀconds

217 °C

)

Timꢀ Maintainꢀd Aboꢁꢀ: Tꢀmpꢀraturꢀ (T_L)

Timꢀ Maintainꢀd Aboꢁꢀ: Timꢀ (t_L)

60-150 sꢀconds

Peak/Classiﬁcation Temperature (Tp)

215 °C

260 °C

Timꢀ Within 5 °C of Actual Pꢀak Tꢀmpꢀraturꢀ (tp)

Ramp-Down Ratꢀ

10-30 sꢀconds

6 °C/sꢀcond max.

6 minutꢀs max.

20-40 sꢀconds

6 °C/sꢀcond max.

8 minutꢀs max.

Timꢀ 25 °C to Pꢀak Tꢀmpꢀraturꢀ

Notꢀ: All tꢀmpꢀraturꢀs rꢀfꢀr to topsidꢀ of thꢀ packagꢀ, mꢀasurꢀd on thꢀ packagꢀ body surfacꢀ.

of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a speciﬁcation. For product speciﬁcations, please see the data sheets available at

of Cree, Inc.

www.cree.com.

7

xlamp xB-D leD solDering & hanDling

CheꢃiCalS & Conforꢃal CoaTingS

Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a

complꢀtꢀ and currꢀnt list of rꢀcommꢀndꢀd chꢀmicals, conformal coatings and harmful chꢀmicals consult Crꢀꢀ’s Chꢀmical

Compatibility Application Notꢀ (www.crꢀꢀ.com/products/pdf/XLamp_Chꢀmical_Comp.pdf). Thꢀ ꢁidꢀo at www.youtubꢀ.

com/watch?ꢁ=t24bf9D_1SA illustratꢀs thꢀ procꢀss Crꢀꢀ has dꢀꢁꢀlopꢀd for tꢀsting thꢀ compatibility of chꢀmicals and

materials with LEDs. You should also consult your regional Cree Field Applications Engineer.

rꢁcꢋmmꢁꢅꢈꢁꢈ Cꢇꢁꢂꢅꢉꢅꢊ Sꢋꢇꢆtꢉꢋꢅs

Crꢀꢀ has found thꢀ following chꢀmicals to bꢀ safꢀ to usꢀ with XLamp XB-D LeDs.

•

Watꢀr

Isopropyl alcohol (IPA)

Cꢍꢁmꢉcꢂꢇs Tꢁstꢁꢈ ꢂs hꢂꢀmꢎꢆꢇ

In general, subject to the speciﬁcs in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals

to bꢀ harmful to XLamp XB-D LeDs. Crꢀꢀ rꢀcommꢀnds not using thꢀsꢀ chꢀmicals anywhꢀrꢀ in an LeD systꢀm containing

XLamp XB-D LeDs. Thꢀ fumꢀs from ꢀꢁꢀn small amounts of thꢀ chꢀmicals may damagꢀ thꢀ LeDs.

•

Chꢀmicals that might outgas aromatic hydrocarbons (ꢀ.g., toluꢀnꢀ, bꢀnzꢀnꢀ, xylꢀnꢀ)

Mꢀthyl acꢀtatꢀ or ꢀthyl acꢀtatꢀ (i.ꢀ., nail polish rꢀmoꢁꢀr)

Cyanoacrylatꢀs (i.ꢀ., “Supꢀrgluꢀ”)

Glycol ꢀthꢀrs (including Radio Shack® Prꢀcision elꢀctronics Clꢀanꢀr - dipropylꢀnꢀ glycol monomꢀthyl ꢀthꢀr)

Formaldehyde or butadiene (including Ashland PLIOBOND® adhesive)

ꢄꢋtꢁꢅtꢉꢂꢇ ꢋꢎ Sꢉꢇꢏꢁꢀ Tꢂꢀꢅꢉsꢍꢉꢅꢊ

XLamp XB-D LeDs contain silꢁꢀr platꢀd parts that may tarnish (turn black) oꢁꢀr timꢀ whꢀn ꢀxposꢀd to oxidizing

substancꢀs such as sulfur, chlorinꢀ, or othꢀr halogꢀn compounds. Oxidation of thꢀ lꢀads can rꢀducꢀ thꢀ ability to makꢀ a

good soldꢀr connꢀction and affꢀct thꢀ light output of thꢀ LeD. exposurꢀ to oxidizing substancꢀs can comꢀ from matꢀrials

usꢀd nꢀar thꢀ LeD during manufacturing or from thꢀ air around thꢀ LeDs during storagꢀ.

To rꢀducꢀ thꢀ potꢀntial of tarnishing for XLamp XB-D LeDs, Crꢀꢀ rꢀcommꢀnds that customꢀrs minimizꢀ ꢀxposurꢀ of

thꢀ LeDs to oxidizing substancꢀs at all timꢀs, including dry box storagꢀ, manufacturing and product tꢀsting. Potꢀntial

sources of oxidizing substances include paper, air ﬁlters, some cleaning chemicals, cardboard boxes and rubber anti-

static mats.

of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a speciﬁcation. For product speciﬁcations, please see the data sheets available at

of Cree, Inc.

www.cree.com.

8

xlamp xB-D leD solDering & hanDling

aSSeꢃBly STorage & handling

Do not stack PCBs or assemblies containing XLamp XB-D LEDs so that anything rests on the LED lens. Force applied

to thꢀ LeD lꢀns may rꢀsult in thꢀ lꢀns bꢀing knockꢀd off. PCBs or assꢀmbliꢀs containing XLamp XB-D LeDs should bꢀ

stackꢀd in a way to allow at lꢀast 2 cm clꢀarancꢀ aboꢁꢀ thꢀ LeD lꢀns.

Do not use bubble wrap directly on top of XLamp XB-D LEDs. Force from the bubble wrap can potentially damage the

LeD.

P

CorreCT

X

Wrong

of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a speciﬁcation. For product speciﬁcations, please see the data sheets available at

of Cree, Inc.

www.cree.com.

9

xlamp xB-D leD solDering & hanDling

Taꢄe and reel - XB-d ledS

All Crꢀꢀ carriꢀr tapꢀs conform to eIA-481D, Automatꢀd Componꢀnt Handling Systꢀms Standard.

All dimꢀnsions in mm.

1.50 +.10/-.00

1.75 ±.10

4.00 ±.10

2.00 ±.10

B

12.00 Nominal

12.30 Max

10.25 ±.10

.30 ± .10

8.00 ±.10

5.50 ±.10

1.50 ± .10

2.000 +/-.10

User Feed Direction

Cover Tape

Pocket Tape

13mm

7"

of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a speciﬁcation. For product speciﬁcations, please see the data sheets available at

of Cree, Inc.

www.cree.com.

10

xlamp xB-D leD solDering & hanDling

ꢄaCꢐaging & laBelS

Thꢀ diagrams bꢀlow show thꢀ packaging and labꢀls Crꢀꢀ will usꢀ to ship XLamp XB-D LeDs. XLamp XB-D LeDs arꢀ

shippꢀd in tapꢀ loadꢀd on a rꢀꢀl. each moisturꢀ barriꢀr bag contains only onꢀ rꢀꢀl. each box may contain multiplꢀ rꢀꢀls.

Vacuum-Sealed

Moisture Barrier Bag

Label with Cree Bin

CREE Bin Code

& Barcode Label

Code, Qty, Lot #

Label with Cree Bin

Label with Customer

P/N, Qty, Lot #, PO #

Code, Qty, Lot #

Patent Label

Label with Customer Order Code,

Qty, Reel ID, PO#

Label with Cree Bin Code,

Qty, Lot #

of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a speciﬁcation. For product speciﬁcations, please see the data sheets available at

of Cree, Inc.

www.cree.com.

11


型号：	CLD-AP90
厂家：	CREE, INC
描述：	CreeÂ® XLampÂ® XB-D LEDs CreeÂ® XLampÂ® XB -D LED灯
文件：	总11页 (文件大小：1072K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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