CY2XP22ZXC [CYPRESS]

Crystal to LVPECL Clock Generator; 水晶LVPECL时钟发生器
CY2XP22ZXC
型号: CY2XP22ZXC
厂家: CYPRESS    CYPRESS
描述:

Crystal to LVPECL Clock Generator
水晶LVPECL时钟发生器

时钟发生器
文件: 总8页 (文件大小:234K)
中文:  中文翻译
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PRELIMINARY  
CY2XP22  
Crystal to LVPECL Clock Generator  
Features  
One LVPECL Output Pair  
Pb-free 8-Pin TSSOP Package  
Selectable Frequency Multiplication: x2.5 or x5  
External Crystal Frequency: 25.0 MHz  
Output Frequency: 62.5 MHz or 125 MHz  
Supply Voltage: 3.3V or 2.5V  
Commercial and Industrial Temperature Ranges  
Functional Description  
Low RMS Phase Jitter at 125 MHz, using 25 MHz Crystal  
(1.875 MHz to 20 MHz): 0.4 ps (Typical)  
The CY2XP22 is a PLL (Phase Locked Loop) based high  
performance clock generator that uses an external reference  
crystal. It is specifically targeted at FibreChannel and Gigabit  
Ethernet applications. It produces a selectable output frequency  
that is 2.5 or 5 times the crystal frequency. With a 25 MHz crystal,  
the user can select either a 62.5 MHz or 125 MHz output. It uses  
Cypress’s low noise VCO technology to achieve less than 1 ps  
typical RMS phase jitter. The CY2XP22 has a crystal oscillator  
interface input and one LVPECL output pair.  
Phase Noise at 125 MHz:  
Offset  
1 kHz  
Noise Power  
–117 dBc/Hz  
–126 dBc/Hz  
–131 dBc/Hz  
–131 dBc/Hz  
10 kHz  
100 kHz  
1 MHz  
Logic Block Diagram  
XIN  
External  
Crystal  
CLK  
CRYSTAL  
OSCILLATOR  
LOW -N OISE  
PLL  
OUTPUT  
DIVIDER  
CLK#  
XOUT  
F_SEL  
Pinouts  
Figure 1. Pin Diagram - 8-Pin TSSOP  
VDD  
VSS  
XOUT  
XIN  
1
2
3
4
8
7
6
5
VDD  
CLK  
CLK#  
F_SEL  
Table 1. Pin Definition - 8-Pin TSSOP  
Pin Number  
Pin Name  
VDD  
I/O Type  
Description  
1, 8  
2
Power  
Power  
3.3V or 2.5V power supply  
Ground  
VSS  
3, 4  
5
XOUT, XIN  
F_SEL  
XTAL output and input  
CMOS input  
Parallel resonant crystal interface  
Frequency Select: see Frequency Table  
Differential Clock Output  
6,7  
CLK#, CLK  
LVPECL output  
Cypress Semiconductor Corporation  
Document #: 001-10229 Rev. *C  
198 Champion Court  
San Jose  
,
CA 95134-1709  
408-943-2600  
Revised June 15, 2009  
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PRELIMINARY  
CY2XP22  
Frequency Table  
Inputs  
PLL Multiplier Value  
Output Frequency (MHz)  
Crystal Frequency (MHz)  
F_SEL  
25  
0
1
5
125  
2.5  
62.5  
Absolute Maximum Conditions  
Parameter  
Description  
Conditions  
Min  
–0.5  
–0.5  
–65  
Max  
Unit  
V
VDD  
Supply Voltage  
4.4  
VDD + 0.5  
150  
[1]  
VIN  
Input Voltage, DC  
Relative to VSS  
V
TS  
Temperature, Storage  
Temperature, Junction  
Non operating  
°C  
°C  
V
TJ  
135  
ESDHBM  
UL–94  
ESD Protection, Human Body Model  
Flammability Rating  
JEDEC STD 22-A114-B  
At 1/8 in.  
2000  
V–0  
[2]  
ΘJA  
Thermal Resistance, Junction to Ambient 0 m/s airflow  
100  
91  
°C/W  
1 m/s airflow  
2.5 m/s airflow  
87  
Operating Conditions  
Parameter  
Description  
Min  
3.135  
2.375  
0
Max  
3.465  
2.625  
70  
Unit  
V
VDD  
TA  
3.3V Supply Voltage  
2.5V Supply Voltage  
V
Ambient Temperature, Commercial  
Ambient Temperature, Industrial  
°C  
°C  
ms  
–40  
85  
TPU  
Power up time for all VDD to reach minimum specified voltage (ensure power ramps  
is monotonic)  
0.05  
500  
DC Electrical Characteristics  
Parameter  
Description  
Test Conditions  
Min  
Typ  
Max  
Unit  
[3]  
IDD  
Operating Supply Current with  
output terminated  
VDD = 3.465V, FOUT = 125 MHz,  
output terminated  
150  
mA  
VDD = 2.625V, FOUT = 125 MHz,  
output terminated  
145  
mA  
V
VOH  
LVPECL Output High Voltage  
LVPECL Output Low Voltage  
VDD = 3.3V or 2.5V, RTERM = 50Ω to VDD –1.15  
DD – 2.0V  
VDD –0.75  
VDD –1.625  
1000  
V
VOL  
VDD = 3.3V or 2.5V, RTERM = 50Ω to VDD –2.0  
DD – 2.0V  
V
V
VOD1  
VOD2  
LVPECL Peak-to-Peak Output  
Voltage Swing  
VDD = 3.3V or 2.5V, RTERM = 50Ω to  
600  
mV  
mV  
V
DD – 2.0V  
LVPECL Output Voltage Swing  
V
1.5V  
DD = 2.5V, RTERM = 50Ω to VDD  
500  
1000  
(VOH - VOL  
)
Notes  
1. The voltage on any input or IO pin cannot exceed the power pin during power up.  
2. Simulated using Apache Sentinel TI software. The board is derived from the JEDEC multilayer standard. It measures 76 x 114 x 1.6 mm and has 4-layers of  
copper (2/1/1/2 oz.). The internal layers are 100% copper planes, while the top and bottom layers have 50% metalization. No vias are included in the model.  
3.  
I
includes approximately 24 mA of current that is dissipated externally in the output termination resistors.  
DD  
Document #: 001-10229 Rev. *C  
Page 2 of 8  
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PRELIMINARY  
CY2XP22  
DC Electrical Characteristics (continued)  
Parameter  
Description  
Test Conditions  
Min  
Typ  
Max  
Unit  
VOCM  
LVPECL Output Common Mode VDD = 2.5V, RTERM = 50Ω to VDD  
1.2  
V
Voltage (VOH + VOL)/2  
1.5V  
VIH  
VIL  
IIH  
Input High Voltage, F_SEL  
Input Low Voltage, F_SEL  
Input High Current, F_SEL  
Input Low Current, F_SEL  
Input Capacitance, F_SEL  
Pin Capacitance, XIN & XOUT  
0.7*VDD  
–0.3  
VDD + 0.3  
0.3*VDD  
115  
V
V
F_SEL = VDD  
F_SEL = VSS  
µA  
µA  
pF  
pF  
IIL  
–50  
CIN  
CINX  
15  
4.5  
AC Electrical Characteristics[4]  
Parameter  
FOUT  
Description  
Output Frequency  
Conditions  
Min  
62.5  
Typ  
Max  
125  
Unit  
MHz  
ps  
TR, TF  
TJitter(φ)  
TDC  
Output Rise or Fall Time  
RMS Phase Jitter (Random)  
Output Duty Cycle  
20% to 80% of full output swing  
125 MHz, (1.875–20 MHz)  
500  
0.4  
50  
ps  
Measured at zero crossing point  
Time for CLK to reach valid  
48  
52  
10  
%
TLOCK  
Startup Time  
ms  
frequency measured from the time  
VDD = VDD(min.) or from F_SEL  
changing  
Recommended Crystal Specifications[5]  
Parameter  
Description  
Min  
Max  
Unit  
Mode  
F
Mode of Oscillation  
Frequency  
Fundamental  
25  
25  
50  
7
MHz  
Ω
ESR  
C0  
Equivalent Series Resistance  
Shunt Capacitance  
pF  
Notes  
4. Not 100% tested, guaranteed by design and characterization.  
5. Characterized using an 18 pF parallel resonant crystal.  
Document #: 001-10229 Rev. *C  
Page 3 of 8  
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PRELIMINARY  
CY2XP22  
Parameter Measurements  
Figure 2. 3.3V Output Load AC Test Circuit  
2V  
SCOPE  
Z = 50Ω  
Z = 50Ω  
VDD  
LVPECL  
CLK  
50Ω  
50Ω  
CLK#  
VSS  
-1.3V +/- 0.165V  
Figure 3. 2.5V Output Load AC Test Circuit  
2V  
SCOPE  
Z = 50Ω  
Z = 50Ω  
VDD  
LVPECL  
CLK  
50Ω  
50Ω  
CLK#  
VSS  
-0.5V +/- 0.125V  
Figure 4. Output DC Parameters  
VA  
CLK  
VOD  
VOCM = (VA + VB)/2  
CLK#  
VB  
Figure 5. Output Rise and Fall Time  
CLK#  
80% 80%  
20%  
20%  
CLK  
TR  
TF  
Document #: 001-10229 Rev. *C  
Page 4 of 8  
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PRELIMINARY  
CY2XP22  
Figure 6. RMS Phase Jitter  
Phase noise  
Noise  
Power  
Phase noise mask  
Offset Frequency  
f2  
f1  
Area Under the Masked Phase Noise Plot  
RMS Jitter =  
Figure 7. Output Duty Cycle  
CLK  
TPW  
TDC  
=
TPERIOD  
CLK#  
TPW  
TPERIOD  
Document #: 001-10229 Rev. *C  
Page 5 of 8  
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PRELIMINARY  
CY2XP22  
Application Information  
Figure 9. LVPECL Output Termination  
Power Supply Filtering Techniques  
As in any high speed analog circuitry, noise at the power supply  
pins can degrade performance. To achieve optimum jitter perfor-  
mance, use good power supply isolation practices. Figure 8 illus-  
trates a typical filtering scheme. Since all the current flows  
through pin 1, the resistance and inductance between this pin  
and the supply is minimized. A 0.01 or 0.1 µF ceramic chip  
capacitor is also located close to this pin to provide a short and  
low impedance AC path to ground. A 1 to 10 µF ceramic or  
tantalum capacitor is located in the general vicinity of this device  
and may be shared with other devices.  
3.3V  
125Ω  
125Ω  
Z0 = 50Ω  
CLK  
IN  
Z0 = 50Ω  
CLK#  
84Ω  
84Ω  
Figure 8. Power Supply Filtering  
Crystal Interface  
V
DD  
(Pin 8)  
The CY2XP22 is characterized with 18 pF parallel resonant  
crystals. The capacitor values shown in Figure 10 are deter-  
mined using a 25 MHz 18 pF parallel resonant crystal and are  
chosen to minimize the ppm error. Note that the optimal values  
for C1 and C2 depend on the parasitic trace capacitance and are  
thus layout dependent.  
3.3V  
10µ  
V
DD  
(Pin 1)  
.μ
0.01 µF  
F
Figure 10. Crystal Input Interface  
XIN  
Termination for LVPECL Output  
C1  
30 pF  
The CY2XP22 implements its LVPECL driver with a current  
steering design. For proper operation, it requires a 50 ohm dc  
termination on each of the two output signals. For 3.3V  
operation, this data sheet specifies output levels for termination  
to VDD–2.0V. This same termination voltage can also be used for  
X1  
Device  
18 pF Parallel  
Crystal  
XOUT  
V
DD = 2.5V operation, or it can be terminated to VDD-1.5V. Note  
C2  
that it is also possible to terminate with 50 ohms to ground (VSS),  
but the high and low signal levels differ from the data sheet  
values. Termination resistors are best located close to the desti-  
nation device. To avoid reflections, trace characteristic  
impedance (Z0) should match the termination impedance.  
Figure 9 shows a standard termination scheme.  
27 pF  
Document #: 001-10229 Rev. *C  
Page 6 of 8  
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PRELIMINARY  
CY2XP22  
Ordering Information  
Part Number  
CY2XP22ZXC  
Package Type  
Product Flow  
Commercial, 0°C to 70°C  
8-pin TSSOP  
CY2XP22ZXCT  
CY2XP22ZXI  
8-pin TSSOP - Tape and Reel  
8-pin TSSOP  
Commercial, 0°C to 70°C  
Industrial, -40°C to 85°C  
Industrial, -40°C to 85°C  
CY2XP22ZXIT  
8-pin TSSOP - Tape and Reel  
Package Drawing and Dimensions  
Figure 11. 8-Pin Thin Shrunk Small Outline Package (4.40 MM Body) Z8  
PIN 1 ID  
1
DIMENSIONS IN MM[INCHES] MIN.  
MAX.  
6.25[0.246]  
6.50[0.256]  
4.30[0.169]  
4.50[0.177]  
8
0.65[0.025]  
BSC.  
0.25[0.010]  
BSC  
0.19[0.007]  
0.30[0.012]  
1.10[0.043] MAX.  
GAUGE  
PLANE  
0°-8°  
0.076[0.003]  
0.85[0.033]  
0.95[0.037]  
0.50[0.020]  
0.70[0.027]  
0.05[0.002]  
0.15[0.006]  
0.09[[0.003]  
0.20[0.008]  
SEATING  
PLANE  
2.90[0.114]  
3.10[0.122]  
51-85093-*A  
Document #: 001-10229 Rev. *C  
Page 7 of 8  
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PRELIMINARY  
CY2XP22  
Document History Page  
Document Title: CY2XP22 Crystal to LVPECL Clock Generator  
Document Number: 001-10229  
Submission  
Date  
Orig. of  
Change  
REV.  
ECN NO.  
Description of Change  
**  
*A  
*B  
506262  
838060  
2700242  
See ECN  
See ECN  
RGL  
RGL  
New Data Sheet  
Changed status from Advance to Preliminary  
04/30/2009 KVM/PYRS Reformatted  
Revised phase noise values  
Replaced VCC with VDD; VEE with VSS; updated pin names  
Removed pull-up resistor on F_SEL  
Corrected temperature range, added industrial temperature range  
Increased IDD from 120 / 100 mA to 150 / 140 mA  
Added CINX parameter, revised CIN parameter  
Revised LVPECL output specs  
Added thermal resistance information  
Changed VIL, VIH, IIL & IIH specs  
Revised suggested crystal load capacitor values  
*C  
2718898  
06/15/09  
WWZ  
Minor ECN to post data sheet to external web  
Sales, Solutions, and Legal Information  
Worldwide Sales and Design Support  
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office  
closest to you, visit us at cypress.com/sales.  
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© Cypress Semiconductor Corporation, 2007-2009. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of  
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for  
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as  
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems  
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),  
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,  
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress  
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without  
the express written permission of Cypress.  
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES  
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not  
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where  
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer  
assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
Use may be limited by and subject to the applicable Cypress software license agreement.  
Document #: 001-10229 Rev. *C  
Revised June 15, 2009  
Page 8 of 8  
All products and company names mentioned in this document may be the trademarks of their respective holders.  
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