DMP3007SPS-13 [DIODES]

Power Field-Effect Transistor,;
DMP3007SPS-13
型号: DMP3007SPS-13
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

Power Field-Effect Transistor,

文件: 总7页 (文件大小:460K)
中文:  中文翻译
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DMP3007SPS  
Green  
P-CHANNEL ENHANCEMENT MODE MOSFET  
POWERDI  
Product Summary  
Features and Benefits  
Low RDS(ON) Minimizes On-State Losses  
Small Form Factor Thermally Efficient Package Enables Higher  
Density End Products  
ID Max  
BVDSS  
RDS(ON) Max  
TC = +25°C  
7mΩ @ VGS = -10V  
16mΩ @ VGS = -4.5V  
-90A  
-60A  
100% Unclamped Inductive Switching Ensures More Reliability  
ESD Protected Gate  
-30V  
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Description and Applications  
Mechanical Data  
This MOSFET is designed to minimize the on-state resistance  
(RDS(ON)) and yet maintain superior switching performance, making it  
ideal for high-efficiency power management applications.  
Case: PowerDI5060-8  
Case Material: Molded Plastic, "Green" Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Connections Indicator: See Diagram  
Terminals: Finish Matte Tin Annealed over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208  
Weight: 0.097 grams (Approximate)  
Backlighting  
Power Management Functions  
DC-DC Converters  
D
ESD PROTECTED  
PowerDI5060-8  
S
S
D
D
D
D
Pin1  
G
S
G
Gate Protection  
Diode  
S
Top View  
Pin Configuration  
Top View  
Bottom View  
Internal Schematic  
Ordering Information (Note 4)  
Part Number  
Case  
Packaging  
DMP3007SPS-13  
2,500/Tape & Reel  
PowerDI5060-8  
Notes:  
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.  
Marking Information  
D
D
D
D
= Manufacturer’s Marking  
P3007SS = Product Type Marking Code  
YYWW = Date Code Marking  
YY = Year (ex: 16 = 2016)  
P3007SS  
YY WW  
WW = Week (01 to 53)  
S
S
S
G
POWERDI is a registered trademark of Diodes Incorporated  
1 of 7  
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September 2016  
© Diodes Incorporated  
DMP3007SPS  
Document number: DS39051 Rev.3 - 2  
DMP3007SPS  
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
VDSS  
Value  
-30  
Unit  
V
Gate-Source Voltage  
±25  
V
VGSS  
TC = +25°C  
Continuous Drain Current, VGS = -10V (Note 7)  
TC = +70°C  
-90  
-70  
A
ID  
Maximum Continuous Body Diode Forward Current (Note 7)  
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)  
Avalanche Current, L=1mH (Note 8)  
-90  
-160  
-16  
A
A
IS  
IDM  
IAS  
EAS  
A
Avalanche Energy, L=1mH (Note 8)  
130  
mJ  
Thermal Characteristics  
Characteristic  
Symbol  
PD  
R  
Value  
1.4  
Unit  
W
Total Power Dissipation (Note 5)  
TA = +25°C  
Steady State  
TA = +25°C  
Steady State  
TC = +25°C  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
90  
°C/W  
W
JA  
2.7  
PD  
R  
Thermal Resistance, Junction to Ambient (Note 6)  
Total Power Dissipation (Note 7)  
47  
80  
°C/W  
W
JA  
PD  
R  
Thermal Resistance, Junction to Case (Note 7)  
Operating and Storage Temperature Range  
1.5  
°C/W  
°C  
JC  
-55 to +150  
TJ, TSTG  
Electrical Characteristics (TA = +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 9)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
-30  
-1  
V
BVDSS  
IDSS  
VGS = 0V, ID = -250μA  
μA  
μA  
VDS = -24V, VGS = 0V  
VGS = ±20V, VDS = 0V  
±10  
IGSS  
ON CHARACTERISTICS (Note 9)  
Gate Threshold Voltage  
-1.0  
4.5  
12  
-3.0  
7
V
mΩ  
V
VGS(TH)  
RDS(ON)  
VSD  
VDS = VGS, ID = -250μA  
VGS = -10V, ID = -15A  
VGS = -4.5V, ID = -10A  
VGS = 0V, IS = -1A  
Static Drain-Source On-Resistance  
16  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 10)  
Input Capacitance  
-0.7  
-1.2  
2,826  
606  
305  
23  
pF  
pF  
pF  
Ciss  
Coss  
Crss  
Rg  
VDS = -15V, VGS = 0V,  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
VDS = 0V, VGS = 0V, f = 1.0MHz  
VDS = -15V, ID = -11.5A  
31.2  
64.2  
10.6  
11.6  
4.8  
nC  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
ns  
nC  
Total Gate Charge (VGS = -4.5V)  
Total Gate Charge (VGS = -10V)  
Gate-Source Charge  
Qg  
Qg  
Qgs  
Qgd  
tD(ON)  
tR  
Gate-Drain Charge  
Turn-On Delay Time  
Turn-On Rise Time  
4.3  
VDD = -15V, VGS = -10V,  
Rg = 6, ID = -11.5A  
Turn-Off Delay Time  
306  
125  
19  
tD(OFF)  
tF  
Turn-Off Fall Time  
Reverse Recovery Time  
Reverse Recovery Charge  
tRR  
IS = -11.5A, dI/dt = 100A/μs  
9.8  
QRR  
Notes:  
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.  
7. Thermal resistance from junction to soldering point (on the exposed drain pad).  
8. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = +25°C.  
9. Short duration pulse test used to minimize self-heating effect.  
10. Guaranteed by design. Not subject to product testing.  
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© Diodes Incorporated  
DMP3007SPS  
Document number: DS39051 Rev.3 - 2  
DMP3007SPS  
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
30  
25  
20  
15  
10  
5
VGS = -3.5V  
VDS = -5V  
VGS=-4.0V  
VGS = -4.5V  
VGS = -10.0V  
VGS = -3.0V  
TJ=125  
TJ=85℃  
TJ=25℃  
TJ=150℃  
VGS = -2.7V  
VGS = -2.5V  
TJ=-55℃  
0
0.0  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
0
0.5  
1
1.5  
2
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. Typical Output Characteristic  
VGS, GATE-SOURCE VOLTAGE (V)  
Figure 2. Typical Transfer Characteristic  
ID = -11.5A  
10.00  
9.00  
8.00  
7.00  
6.00  
5.00  
4.00  
3.00  
2.00  
1.00  
0.00  
30  
25  
20  
15  
10  
5
VGS = -4.5V  
VGS = -10V  
ID = -8.5A  
0
0
5
10  
15  
20  
25  
30  
0
5
10  
15  
20  
25  
ID, DRAIN-SOURCE CURRENT (A)  
VGS, GATE-SOURCE VOLTAGE (V)  
Figure 4. Typical Transfer Characteristic  
Figure 3. Typical On-Resistance vs. Drain Current and  
Gate Voltage  
2
1.8  
1.6  
1.4  
1.2  
1
8
VGS = -10V  
7
6
5
4
3
2
1
0
VGS = -10V, ID = -11.5A  
150℃  
125℃  
85℃  
25℃  
VGS = -4.5V, ID = -8.5A  
-55℃  
0.8  
0.6  
0.4  
-50  
-25  
0
25  
50  
75  
100 125 150  
0
5
10  
15  
20  
25  
30  
TJ, JUNCTION TEMPERATURE ()  
ID, DRAIN CURRENT (A)  
Figure 6. On-Resistance Variation with Temperature  
Figure 5. Typical On-Resistance vs. Drain Current and  
Temperature  
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September 2016  
© Diodes Incorporated  
DMP3007SPS  
Document number: DS39051 Rev.3 - 2  
DMP3007SPS  
12  
10  
8
3
2.5  
2
VGS = -4.5V, ID = -8.5A  
ID = -1mA  
6
1.5  
1
ID = -250μA  
4
VGS = -10V, ID = -11.5A  
2
0.5  
0
0
-50  
-25  
TJ, JUNCTION TEMPERATURE ()  
Figure 7. On-Resistance Variation with Temperature  
0
25  
50  
75  
100 125 150  
-50  
-25  
0
25  
50  
75  
100 125 150  
TJ, JUNCTION TEMPERATURE ()  
Figure 8. Gate Threshold Variation vs. Junction  
Temperature  
30  
25  
20  
15  
10  
5
10000  
f=1MHz  
VGS = 0V  
Ciss  
1000  
Coss  
TJ = 85oC  
TJ = 125oC  
TJ = 25oC  
Crss  
TJ = 150oC  
TJ = -55oC  
0
100  
0
0.3  
0.6  
0.9  
1.2  
0
2
4
6
8
10  
12  
VSD, SOURCE-DRAIN VOLTAGE (V)  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 10. Typical Junction Capacitance  
Figure 9. Diode Forward Voltage vs. Current  
1000  
100  
10  
10  
9
8
7
6
5
4
3
2
1
0
RDS(ON) Limited  
PW =1µs  
PW =10µs  
PW =100µs  
PW =1ms  
PW =10ms  
VDS = -15V, ID = -11.5A  
TJ(Max) = 150℃  
TC = 25℃  
1
PW =100ms  
PW =1s  
Single Pulse  
DUT on on infinite  
heatsink  
VGS= -10V  
0.1  
0.1  
1
10  
100  
0
10  
20  
30  
40  
50  
60  
70  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 12. SOA, Safe Operation Area  
Qg (nC)  
Figure 11. Gate Charge  
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© Diodes Incorporated  
DMP3007SPS  
Document number: DS39051 Rev.3 - 2  
DMP3007SPS  
1
D=0.7  
D=0.5  
D=0.3  
D=0.9  
0.1  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
D=0.005  
D=Single Pulse  
0.01  
RθJC(t) = r(t) * RθJC  
RθJC = 1.5/W  
Duty Cycle, D = t1 / t2  
0.001  
1E-06  
1E-05  
0.0001  
0.001  
0.01  
0.1  
1
10  
t1, PULSE DURATION TIME (sec)  
Figure 13. Transient Thermal Resistance  
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© Diodes Incorporated  
DMP3007SPS  
Document number: DS39051 Rev.3 - 2  
DMP3007SPS  
Package Outline Dimensions  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
PowerDI5060-8  
D
D1  
Detail A  
c
PowerDI5060-8  
Dim  
A
A1  
b
b2  
b3  
c
Min  
0.90  
0.00  
0.33  
0.200  
0.40  
0.230  
Max  
1.10  
0.05  
0.51  
0.350 0.273  
0.80 0.60  
Typ  
1.00  
0( 4X)  
A1  
0.41  
E1 E  
e
0.330 0.277  
5.15 BSC  
D
D1  
D2  
D3  
E
E1  
E2  
E3  
e
G
K
L
L1  
M
4.70  
3.70  
3.90  
5.10  
4.10  
4.30  
6.15 BSC  
6.00  
3.68  
4.39  
1.27 BSC  
0.71  
  
0.71  
0.200 0.175  
4.035 3.635  
1.40  
12º  
8º  
4.90  
3.90  
4.10  
01 ( 4X)  
1
b ( 8X)  
L
e/2  
1
5.60  
3.28  
3.99  
5.80  
3.48  
4.19  
b2 ( 4X)  
D3  
K
0.51  
0.51  
0.51  
0.100  
3.235  
1.00  
10º  
0.61  
0.61  
A
D2  
b3 ( 4X)  
E3  
E2  
M
M1  
Detail A  
G
L1  
M1  
Θ
Θ1  
1.21  
11º  
7º  
6º  
All Dimensions in mm  
Suggested Pad Layout  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
PowerDI5060-8  
X4  
Y2  
Dimensions  
Value (in mm)  
1.270  
X3  
C
G
G1  
X
X1  
X2  
X3  
X4  
Y
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
0.660  
0.820  
0.610  
4.100  
0.755  
4.420  
5.610  
1.270  
0.600  
1.020  
0.295  
1.825  
3.810  
0.180  
6.610  
Y3  
Y1  
X2  
Y5  
Y4  
X1  
Y7  
G1  
C
Y6  
Y( 4x)  
X
G
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© Diodes Incorporated  
DMP3007SPS  
Document number: DS39051 Rev.3 - 2  
DMP3007SPS  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2016, Diodes Incorporated  
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DMP3007SPS  
Document number: DS39051 Rev.3 - 2  

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