DMP3008SFG_17 [DIODES]
30V P-CHANNEL ENHANCEMENT MODE MOSFET;型号: | DMP3008SFG_17 |
厂家: | DIODES INCORPORATED |
描述: | 30V P-CHANNEL ENHANCEMENT MODE MOSFET |
文件: | 总7页 (文件大小:201K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DMP3008SFG
30V P-CHANNEL ENHANCEMENT MODE MOSFET
POWERDI®
Product Summary
Features and Benefits
•
•
Low RDS(ON) – ensures on state losses are minimized
I
D max
V(BR)DSS
RDS(ON) max
Small form factor thermally efficient package enables higher
density end products
TA = 25°C
17mΩ @ VGS = -10V
25mΩ @ VGS = -4.5V
-8.6A
•
Occupies just 33% of the board area occupied by SO-8 enabling
smaller end product
-30V
-7.1A
•
•
•
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Description and Applications
•
•
Case: POWERDI3333-8
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
This MOSFET has been designed to minimize the on-state resistance
(RDS(on)) and yet maintain superior switching performance, making it
ideal for high efficiency power management applications.
•
•
•
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See diagram
Terminals: Finish ⎯ Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
•
•
•
Backlighting
Power Management Functions
DC-DC Converters
•
Weight: 0.008 grams (approximate)
Drain
POWERDI3333-8
Pin 1
S
S
S
G
Gate
D
D
D
Source
D
Top View
Bottom View
Internal Schematic
Ordering Information (Note 4)
Part Number
DMP3008SFG-7
DMP3008SFG-13
Case
POWERDI3333-8
POWERDI3333-8
Packaging
2000/Tape & Reel
3000/Tape & Reel
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
S31 = Product Type Marking Code
YYWW = Date Code Marking
YY = Last digit of year (ex: 11 = 2011)
WW = Week code (01 ~ 53)
S31
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DMP3008SFG
Document number: DS35598 Rev. 5 - 2
DMP3008SFG
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Drain-Source Voltage
Symbol
VDSS
Value
-30
Units
V
V
Gate-Source Voltage
±20
VGSS
T
T
A = 25°C
A = 70°C
Steady
State
-8.6
-7.0
A
A
A
A
ID
ID
ID
ID
Continuous Drain Current (Note 6) VGS = -10V
TA = 25°C
TA = 70°C
-11.7
-9.3
t<10s
T
T
A = 25°C
A = 70°C
Steady
State
-7.1
-5.6
Continuous Drain Current (Note 6) VGS = -4.5V
TA = 25°C
TA = 70°C
-9.6
-7.6
t<10s
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
-80
A
A
IDM
IS
Maximum Continuous Body Diode Forward Current (Note 6)
-3.0
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Symbol
PD
Value
0.9
Units
W
Total Power Dissipation (Note 5)
Steady state
140
72
2.2
57
30
7.1
°C/W
°C/W
W
°C/W
°C/W
°C/W
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Rθ
JA
t<10s
PD
Steady state
t<10s
Thermal Resistance, Junction to Ambient (Note 6)
Rθ
JA
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
Rθ
JC
-55 to +150
°C
TJ, TSTG
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
100
10
100
90
P
= 10µs
R
W
DS(on)
Single Pulse
Limited
R
R
T
= 57
°
C/W
= r * R
θJA
θ
JA
80
70
60
50
40
30
20
θ
JA(t)
(t)
- T = P * R
J
A
θJA(t)
DC
P
= 10s
W
1
P
= 1s
W
P
= 100ms
W
P
= 10ms
W
P
= 1ms
W
P
= 100µs
W
0.1
T
T
= 150°C
J(max)
= 25°C
A
10
0
Single Pulse
0.01
100
0.0001 0.001 0.01
0.1
t1, PULSE DURATION TIME (sec)
Fig. 2 Single Pulse Maximum Power Dissipation
1
10
100 1,000
0.1
1
10
-VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 1 SOA, Safe Operation Area
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DMP3008SFG
Document number: DS35598 Rev. 5 - 2
DMP3008SFG
1
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.9
D = 0.05
D = 0.02
D = 0.01
D = 0.005
0.01
R
R
(t) = r(t) * R
= 57°C/W
θ
JA
θJA
θJA
Duty Cycle, D = t1/ t2
Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1,000
t1, PULSE DURATION TIMES (sec)
Fig. 3 Transient Thermal Resistance
Electrical Characteristics TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
Symbol
Min
Typ
Max
Unit
Test Condition
-30
⎯
⎯
V
µA
BVDSS
IDSS
⎯
⎯
⎯
⎯
-1.0
VGS = 0V, ID = -250µA
V
V
DS = -30V, VGS = 0V
nA
IGSS
±100
GS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
-1.1
⎯
⎯
⎯
⎯
-1.6
12.5
18.5
13
-2.1
17
V
VGS(th)
VDS = VGS, ID = -250μA
VGS = -10V, ID = -10A
VGS = -4.5V, ID = -10A
VDS = -15V, ID = -10A
VGS = 0V, IS = -1A
Static Drain-Source On-Resistance
RDS (ON)
mΩ
25
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
S
V
|Yfs|
VSD
⎯
-1.0
-0.7
2230
328
294
6.4
47
Ciss
Coss
Crss
RG
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
VDS = -15V, VGS = 0V
f = 1.0MHz
Output Capacitance
pF
Reverse Transfer Capacitance
Gate Resistance
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
Total Gate Charge (VGS = -10V)
Total Gate Charge (VGS = -4.5V)
Gate-Source Charge
Qg
23
Qg
nC
VDS = -15V, ID = -10A
9.4
5.6
10.5
8.5
90
Qgs
Qgd
tD(on)
tr
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
ns
VGS = -10V, VDS = -15V, RG = 6Ω
Turn-Off Delay Time
tD(off)
tf
Turn-Off Fall Time
40
Notes:
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
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DMP3008SFG
Document number: DS35598 Rev. 5 - 2
DMP3008SFG
30
25
20
30
25
20
V
= -5.0V
DS
V
= 10V
GS
V
= 4.5V
GS
V
= 4.0V
GS
V
= 3.5V
15
10
15
10
GS
V
= 3.0V
GS
T
= 150°C
A
T
= 85°C
A
T
= 125°C
A
5
0
5
0
T
= 25°C
A
T
= -55°C
V
= 2.5V
A
GS
1
2
3
4
0
0.5
1.0
1.5
2.0
-VGS, GATE-SOURCE VOLTAGE (V)
-VDS, DRAIN -SOURCE VOLTAGE(V)
Fig. 5 Typical Transfer Characteristics
Fig. 4 Typical Output Characteristics
0.04
0.03
0.05
0.04
V
= -4.5V
GS
T
T
= 150°C
A
= 125°C
A
0.03
0.02
T
= 85°C
A
0.02
T
= 25°C
A
T
= -55°C
A
0.01
0
0.01
0
0
5
10
15
20
25
30
0
5
10
15
20
25
30
-ID, DRAIN SOURCE CURRENT
-ID, DRAIN SOURCE CURRENT (A)
Fig. 6 Typical On-Resistance vs.
Drain Current and Gate Voltage
Fig. 7 Typical On-Resistance vs.
Drain Current and Temperature
1.7
1.5
0.05
0.04
1.3
1.1
0.9
0.03
0.02
V
I
= -4.5V
GS
= -5A
D
V
I
= -10V
GS
0.01
0
= -10A
0.7
0.5
D
-50 -25
TJ, JUNCTION TEMPERATURE (
Fig. 8 On-Resistance Variation with Temperature
0
25
50
75 100 125 150
-50 -25
TJ, JUNCTION TEMPERATURE (
Fig. 9 On-Resistance Variation with Temperature
0
25
50
75 100 125 150
°C)
°
C)
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DMP3008SFG
Document number: DS35598 Rev. 5 - 2
DMP3008SFG
2.5
2.0
20
18
16
14
12
10
1.5
1.0
8
6
4
0.5
0
2
0
-50 -25
0
25
50
75 100 125 150
0.4
0.6
0.8
1.0
1.2
TA, AMBIENT TEMPERATURE (°C)
-VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 10 Gate Threshold Variation vs. Ambient Temperature
Fig. 11 Diode Forward Voltage vs. Current
10,000
10,000
1,000
f = 1MHz
T
= 150°C
= 125°C
A
T
A
C
iss
1,000
100
T
= 85°C
A
C
oss
10
1
C
rss
T
= 25°C
A
100
0
5
10
15
20
25
30
0
5
10
-VDS, DRAIN-SOURCE VOLTAGE(V)
Fig. 13 Typical Drain-Source Leakage Current vs. Voltage
15
20
25
30
-VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 12 Typical Junction Capacitance
10
8
6
4
2
0
0
10
20
30
40
50
60
Qg, TOTAL GATE CHARGE (nC)
Fig. 14 Gate-Charge Characteristics
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DMP3008SFG
Document number: DS35598 Rev. 5 - 2
DMP3008SFG
Package Outline Dimensions
POWERDI3333-8
Dim Min Max Typ
A
A3
D
E
3.25 3.35 3.30
3.25 3.35 3.30
A1
D
D2 2.22 2.32 2.27
E2 1.56 1.66 1.61
D2
L
(4x)
A
A1
A3
b
b2
L
0.75 0.85 0.80
0
−
0.05 0.02
0.203
1
8
4
5
Pin 1 ID
E2
−
0.27 0.37 0.32
0.20
0.35 0.45 0.40
b2
(4x)
E
−
−
L1
e
Z
0.39
0.65
0.515
−
−
−
−
−
−
L1
(3x)
All Dimensions in mm
Z (4x)
e
b (8x)
Suggested Pad Layout
X
G
Dimensions
Value (in mm)
0.650
C
G
G1
Y
Y1
Y2
Y3
X
0.230
0.420
3.700
2.250
1.850
0.700
2.370
8
5
4
Y2
Y3
G1
Y1
Y
1
X2
0.420
X2
C
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DMP3008SFG
Document number: DS35598 Rev. 5 - 2
DMP3008SFG
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
POWERDI is a registered trademark of Diodes Incorporated
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May 2012
© Diodes Incorporated
DMP3008SFG
Document number: DS35598 Rev. 5 - 2
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