B37933K5010B570_技术文档

Multilayer ceramic capacitors

Chip, HQF

Series/Type:

Chip

Date:

February 2009

The following products presented in this data sheet are being withdrawn.

Substitute Products: See www.epcos.com/withdrawal_mlcc

Ordering Code

Substitute Product

Date of

Withdrawal

Deadline Last

Orders

Last Shipments

B37923K5100J070

B37923K5120J060

B37923K5120J070

2009-06-26

2010-06-30

2010-12-31

information contained therein without EPCOS' prior express consent is prohibited.

Ordering Code

Substitute Product

Date of

Withdrawal

Deadline Last

Orders

Last Shipments

B37933K5000B460

B37923K5150J060

B37933K5000B470

B37923K5150J070

B37933K5000B560

B37923K5180J060

B37933K5000B570

B37923K5180J070

B37933K5000B660

B37923K5220J060

B37933K5000B670

B37923K5220J070

B37933K5000B760

B37933K5000B770

B37933K5000B860

B37933K5000B870

B37933K5000B960

B37933K5000B970

B37933K5010B060

B37933K5010B070

B37933K5010B260

B37933K5010B270

B37933K5010B560

B37933K5010B570

B37933K5010B860

B37933K5010B870

B37933K5020B260

B37933K5020B270

B37933K5020B760

B37933K5020B770

B37933K5030B360

B37933K5030B370

B37933K5030B960

B37933K5030B970

B37933K5040C760

B37933K5040C770

B37933K5050C660

B37933K5050C670

2009-06-26

2010-06-30

2010-12-31

Ordering Code

Substitute Product

Date of

Withdrawal

Deadline Last

Orders

Last Shipments

B37933K5060C860

B37933K5060C870

B37933K5080C260

B37933K5080C270

B37933K5100J060

B37933K5100J070

B37933K5120J060

B37933K5120J070

B37933K5150J060

B37933K5150J070

B37933K5180J060

B37933K5180J070

B37933K5220J060

B37933K5220J070

B37933K5270J060

B37933K5270J070

B37933K5820J060

B37933K5820J070

B37923K5000B360

B37923K5000B370

B37923K5000B460

B37923K5000B470

B37923K5000B560

B37923K5000B570

B37923K5000B660

B37923K5000B670

B37923K5000B760

B37923K5000B770

B37923K5000B860

B37923K5000B870

B37923K5000B960

B37923K5000B970

B37923K5010B060

B37923K5010B070

B37923K5010B260

B37923K5010B270

B37923K5010B560

B37923K5010B570

2009-06-26

2010-06-30

2010-12-31

Ordering Code

Substitute Product

Date of

Withdrawal

Deadline Last

Orders

Last Shipments

B37923K5010B860

B37923K5010B870

B37923K5020B260

B37923K5020B270

B37923K5020B760

B37923K5020B770

B37923K5030B360

B37923K5030B370

B37923K5030B960

B37923K5030B970

B37923K5040C760

B37923K5040C770

B37923K5050C660

B37923K5050C670

B37923K5060C860

B37923K5060C870

B37923K5080C260

B37923K5080C270

B37923K5100J060

2009-06-26

2010-06-30

2010-12-31

For further information please contact your nearest EPCOS sales office, which will also support

you in selecting a suitable substitute. The addresses of our worldwide sales network are

presented at www.epcos.com/sales.

Multilayer ceramic capacitors

HQF

Chip

HQF

Ordering code system

B37923

K

5

100

J

0

60

Type and size

Chip size (inch/mm) = Temperature characteristic HQF

0402/1005 ꢀ B37923

0603/1608 ꢀ B37933

Termination

Standard:

K ꢀ nickel barrier for all case sizes

Rated voltage

5 (Code) ꢀ 50 VDC

Capacitance, coded (example)

100 ꢀ 10 ꢁ 10⁰pF = 10 pF

Capacitance tolerance

C_R< 10 pF:

B

C

D

C

F

ꢀ ±0.1 pF (standard for capacitance values ≤ 3.9 pF)

ꢀ ±0.25 pF (standard for capacitance values ≤ 8.2 pF)

ꢀ ±0.5 pF

_R≥ 10 pF:

ꢀ ±1%

G

J

K

ꢀ ±2%

ꢀ ±5% (standard)

ꢀ ±10%

Decimal place for cap. values < 10 pF, otherwise not used

Packaging

60 ꢀ cardboard tape, 180-mm reel

70 ꢀ cardboard tape, 330-mm reel

Please read Cautions and warnings and

Page 2 of 19

Important notes at the end of this document.

Multilayer ceramic capacitors

HQF

Features

Ultra-low ESR and high Q factor

Tight capacitance tolerances

High stability with respect to time,

temperature (T_CC: 0 ± 60 ppm/°C), frequency and voltage

Class 1 characteristic with copper inner electrodes

Excellent attenuation

High self-resonant frequency

Lower power dissipation / Less energy absorption

Based on AEC-Q200 Rev-C

Applications

High-frequency applications

Matching circuits

Cellular communication, Bluetooth, DECT

Cable TV, satellite TV (LNB), GPS, satellite radio

Filters, RF amplifiers, VCOs

Termination

Nickel barrier terminations (Ni) for lead-free soldering

Options

Alternative capacitance values and tolerances available on request

Delivery mode

Cardboard tape, 180-mm and 330-mm reel available

Electrical data

Temperature characteristic

Climatic category

Standard

C0H

55/125/56

EIA

(IEC 60068-1)

Dielectric

Rated voltage

Class 1

50

V_R

VDC

Test voltage

V_test2.5 ꢁ V_R/5 s

Capacitance range

Temperature coefficient

Dissipation factor

Insulation resistance¹⁾

Time constant¹⁾

C_R

0.3 pF ... 82 pF

0 ±60 ꢁ 10^-6/K

(limit value)

(at +25 °C)

(at +125 °C)

(at +25 °C)

(at +125 °C)

tan δ < 1.0 ꢁ 10^-3

R_ins

τ

> 10⁵

> 10⁴

> 1000

> 100

MΩ

s

Time constant¹⁾

τ

s

Operating temperature range

Ageing

T_op

ꢂ55 ... +125

none

°C

1) For C_R>10 nF the time constant τ = C ꢁ R_insis given.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 3 of 19

Multilayer ceramic capacitors

HQF

Capacitance tolerances

C_R

C_R≤ 3.9 pF

4.7 pF ≤ C_R≤ 8.2 pF

Code letter

Tolerance

B (standard)

C

B

C (standard)

D

±0.1 pF

±0.25 pF

±0.1 pF

±0.25 pF

±0.5 pF

C_R

C_R≥ 10 pF

Code letter

Tolerance

F

G

J (standard)

K

±1%

±2%

±5%

±10%

Dimensional drawing

Dimensions (mm)

Case size

(inch) 0402

(mm) 1005

0603

1608

l

1.0 ±0.10

0.5 ±0.05

0.1 ꢂ0.40

1.6 ±0.15

0.8 ±0.10

0.1 ꢂ0.40

w

th

k

Tolerances to CECC 32101-801

Please read Cautions and warnings and

Important notes at the end of this document.

Page 4 of 19

Multilayer ceramic capacitors

HQF

Recommended solder pad

Recommended dimensions (mm) for reflow soldering

Case size

(inch/mm)

0402/1005

0603/1608

Type

A

C

D

single chip

0.35 ... 0.45 1.0 ... 1.4

0.4 ... 0.6

0.6 ... 0.8

0.6 ... 0.7

1.8 ... 2.2

Recommended dimensions (mm) for wave soldering

Case size

(inch/mm)

0603/1608

Type

A

C

D

single chip

0.8 ... 0.9

2.2 ... 2.8

0.6 ... 0.8

Termination

Please read Cautions and warnings and

Important notes at the end of this document.

Page 5 of 19

Multilayer ceramic capacitors

HQF

Product range for HQF chip capacitors

Size

inch (l x w)

0402

0603

mm (l x w)

1005

1608

Type

B37923

50

B37933

50

C_R\ V_R(VDC)

0.3 pF

0.4 pF

0.5 pF

0.6 pF

0.7 pF

0.8 pF

0.9 pF

1.0 pF

1.2 pF

1.5 pF

1.8 pF

2.2 pF

2.7 pF

3.3 pF

3.9 pF

4.7 pF

5.6 pF

6.8 pF

8.2 pF

10 pF

12 pF

15 pF

18 pF

22 pF

27 pF

82 pF

Please read Cautions and warnings and

Important notes at the end of this document.

Page 6 of 19

Multilayer ceramic capacitors

HQF

Ordering codes and packing for HQF, 50 VDC, nickel barrier terminations

Chip thickness

Cardboard tape,

180-mm reel

Cardboard tape,

330-mm reel

** ꢀ 60

** ꢀ 70

C_R

Ordering code

mm

pcs./reel

Case size 0402, 50 VDC

0.3 pF B37923K5000B3** 0.5 ±0.05

0.4 pF B37923K5000B4** 0.5 ±0.05

0.5 pF B37923K5000B5** 0.5 ±0.05

0.6 pF B37923K5000B6** 0.5 ±0.05

0.7 pF B37923K5000B7** 0.5 ±0.05

0.8 pF B37923K5000B8** 0.5 ±0.05

0.9 pF B37923K5000B9** 0.5 ±0.05

1.0 pF B37923K5010B0** 0.5 ±0.05

1.2 pF B37923K5010B2** 0.5 ±0.05

1.5 pF B37923K5010B5** 0.5 ±0.05

1.8 pF B37923K5010B8** 0.5 ±0.05

2.2 pF B37923K5020B2** 0.5 ±0.05

2.7 pF B37923K5020B7** 0.5 ±0.05

3.3 pF B37923K5030B3** 0.5 ±0.05

3.9 pF B37923K5030B9** 0.5 ±0.05

4.7 pF B37923K5040C7** 0.5 ±0.05

5.6 pF B37923K5050C6** 0.5 ±0.05

6.8 pF B37923K5060C8** 0.5 ±0.05

8.2 pF B37923K5080C2** 0.5 ±0.05

10000

50000

10 pF

12 pF

15 pF

18 pF

22 pF

B37923K5100J0** 0.5 ±0.05

B37923K5120J0** 0.5 ±0.05

B37923K5150J0** 0.5 ±0.05

B37923K5180J0** 0.5 ±0.05

B37923K5220J0** 0.5 ±0.05

Please read Cautions and warnings and

Important notes at the end of this document.

Page 7 of 19

Multilayer ceramic capacitors

HQF

Ordering codes and packing for HQF, 50 VDC, nickel barrier terminations

Chip thickness

Cardboard tape,

180-mm reel

Cardboard tape,

330-mm reel

** ꢀ 60

** ꢀ 70

C_R

Ordering code

mm

pcs./reel

Case size 0603, 50 VDC

0.4 pF B37933K5000B4** 0.8 ±0.1

0.5 pF B37933K5000B5** 0.8 ±0.1

0.6 pF B37933K5000B6** 0.8 ±0.1

0.7 pF B37933K5000B7** 0.8 ±0.1

0.8 pF B37933K5000B8** 0.8 ±0.1

0.9 pF B37933K5000B9** 0.8 ±0.1

1.0 pF B37933K5010B0** 0.8 ±0.1

1.2 pF B37933K5010B2** 0.8 ±0.1

1.5 pF B37933K5010B5** 0.8 ±0.1

1.8 pF B37933K5010B8** 0.8 ±0.1

2.2 pF B37933K5020B2** 0.8 ±0.1

2.7 pF B37933K5020B7** 0.8 ±0.1

3.3 pF B37933K5030B3** 0.8 ±0.1

3.9 pF B37933K5030B9** 0.8 ±0.1

4.7 pF B37933K5040C7** 0.8 ±0.1

5.6 pF B37933K5050C6** 0.8 ±0.1

6.8 pF B37933K5060C8** 0.8 ±0.1

8.2 pF B37933K5080C2** 0.8 ±0.1

4000

16000

10 pF

12 pF

15 pF

18 pF

22 pF

27 pF

82 pF

B37933K5100J0** 0.8 ±0.1

B37933K5120J0** 0.8 ±0.1

B37933K5150J0** 0.8 ±0.1

B37933K5180J0** 0.8 ±0.1

B37933K5220J0** 0.8 ±0.1

B37933K5270J0** 0.8 ±0.1

B37933K5820J0** 0.8 ±0.1

Please read Cautions and warnings and

Important notes at the end of this document.

Page 8 of 19

Multilayer ceramic capacitors

HQF

Typical RF performance for HQF capacitors, case size 0402, 50 VDC

1)

2)

Capacitance

pF

f_res

ESR @ 1 GHz²⁾

mΩ

Q @ 1 GHz²⁾

ESR @ f_res

mΩ

MHz

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10

23400

20350

19700

17400

15100

14450

12600

12000

10600

8900

7100

6400

6000

5500

5350

4650

3950

4100

3650

3350

2600

2300

2200

560

490

440

405

375

355

335

320

295

265

245

225

205

185

170

155

145

130

120

110

102

92

920

805

720

650

600

560

520

490

440

390

350

310

275

245

225

200

175

155

140

120

104

88

710

605

535

485

445

415

385

365

330

290

265

235

210

190

175

155

140

125

115

105

94

12

15

82

18

84

70

74

22

78

56

66

1) Measured with impedance analyser E4991 A, parts not soldered.

2) Measured with network analyser HP 8753D, parts soldered.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 9 of 19

Multilayer ceramic capacitors

HQF

Typical RF performance for HQF capacitors, case size 0603, 50 VDC

3)

4)

Capacitance

pF

f_res

ESR @ 1 GHz⁴⁾

mΩ

Q @ 1 GHz⁴⁾

ESR @ f_res

mΩ

MHz

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10

17800

17100

13600

12200

11400

10600

9600

8800

7900

6900

5750

5100

4700

4150

3550

3130

2850

2730

2580

2400

2150

2050

1870

1780

445

400

385

345

325

315

300

275

250

240

215

200

185

175

165

150

140

130

120

110

102

96

860

805

755

635

595

560

525

455

395

360

305

270

235

210

185

160

135

115

96

595

540

510

440

410

390

365

335

300

285

250

235

210

200

185

170

155

140

130

118

108

100

90

12

76

15

62

18

50

22

88

34

27

80

26

82

3)

4)

Capacitance

pF

f_res

ESR @ 1 GHz⁴⁾

mΩ

Q @ 1 GHz⁴⁾

105

ESR @ f_res

mΩ

MHz

930

82

52

3) Measured with impedance analyser E4991 A, parts not soldered.

4) Measured with network analyser HP 8753D, parts soldered.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 10 of 19

Multilayer ceramic capacitors

HQF

Typical characteristics for case size 0402¹⁾

ESR versus capacitance C

(for not soldered parts)

at self-resonant frequency (for soldered parts)

ESR versus frequency f

Self-resonant frequency f_resversus

capacitance C

1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 11 of 19

Multilayer ceramic capacitors

HQF

Typical characteristics for case size 0402¹⁾

Q factor versus capacitance C

Q factor versus frequency f

1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 12 of 19

Multilayer ceramic capacitors

HQF

Typical characteristics for case size 0603¹⁾

ESR versus capacitance C

(for not soldered parts)

at self-resonant frequency (for soldered parts)

ESR versus frequency f

Self-resonant frequency f_resversus

capacitance C

1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 13 of 19

Multilayer ceramic capacitors

HQF

Typical characteristics for case size 0603¹⁾

Q factor versus capacitance C

Q factor versus frequency f

1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 14 of 19

Multilayer ceramic capacitors

HQF

Cautions and warnings

How to select ceramic capacitors

Remember the following when selecting ceramic capacitors:

1. Ceramic capacitors that must fulfill high quality requirements must be qualified based on

AEC-Q200 Rev-C.

2. When ceramic capacitors are used at the connection to a battery or power supply (e.g. clamp

15 or 30 in an automobile) or for safety-relevant applications, two single ceramic capacitors

should be connected in series. Alternatively a ceramic capacitor with integrated series circuits

should be used in order to reduce the possibility of a short circuit caused by a fracture. The

MLSC from EPCOS contains such a series circuit in a single component.

3. The use of multilayer varistors (MLVs) is recommended for ESD protection (see chapter

“Effects on mechanical, thermal and electrical stress”, section 1.4).

4. Additional stress factors such as continuous operating voltage or application-specific derating

must be taken into account in the selection of components (refer to chapter “Reliability”).

Recommendations for the circuit board design

1. Components with an optimized geometrical design are preferable where permitted by the

application.

2. Use at least FR4 circuit board material.

3. Geometrically optimized circuit boards are preferable, especially those that cannot be

deformed.

4. Ceramic capacitors should be placed with a sufficient minimum distance from the edge of a

circuit board. High bending forces may be exerted there when boards are separated and

during further processing of a board (e.g. when incorporating it in a housing).

5. Ceramic capacitors should always be placed parallel to the possible bending axis of a circuit

board.

6. Screw connections should not be used to fix a board or connect several boards. Components

should not be placed near screw holes. If screw connections are unavoidable, they should be

cushioned, for instance using rubber pads.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 15 of 19

Multilayer ceramic capacitors

HQF

Recommendations for processing

1. Ensure correct positioning of a ceramic capacitor on the solder pad.

2. Be careful when using casting, injection-molded and molding compounds and cleaning

agents. They can damage a capacitor.

3. Support a circuit board and reduce placement forces.

4. Do not straighten a board (manually) if it is distorted by soldering.

5. Separate boards with a peripheral saw, or preferably with a milling head (no dicing or

breaking).

6. Be careful when subsequently placing heavy or leaded components (e.g. transformers or

snap-in components) because of the danger of bending and fracture.

7. When testing, transporting, packing or inserting a board, avoid any deformation of it so that

components are not damaged.

8. Avoid excessive force when plugging a connector into a device soldered onto a board.

9. Only mount ceramic capacitors using the soldering process (reflow or wave) that is

permissible for them (see chapter “Soldering directions”).

10. When soldering, select the softest solder profile possible (heating time, peak temperature,

cooling time) to avoid thermal stress and damage.

11. Ensure the correct solder meniscus height and solder quantity.

12. Ensure correct dosing of the cement.

13. Ceramic capacitors with external silver-palladium terminations are intended for conductive

adhesion - they are not suited for lead-free soldering processes.

This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 16 of 19

Multilayer ceramic capacitors

HQF

Symbols and terms

Symbol

A

English

Area

German

Fläche

C

Capacitance

Kapazität

C₀

C₁

C_R

C₂₀

C₂₅

∆C

Initial (original) capacitance

Capacitance value after one hour's use Kapazitätswert nach einer Stunde

Rated capacitance

Capacitance at 20 °C

Capacitance at 25 °C

Capacitance change

Anfangskapazität

Nennkapazität

Kapazität bei 20 °C

Kapazität bei 25 °C

Kapazitätsänderung

D

Bending displacement

Durchbiegung

E_a

Activation energy

Aktivierungsenergie

ESR

Equivalent series resistance

Ersatzserienwiderstand

F

Force

Kraft

f

Frequency

Frequenz

f_meas

f_res

Measuring frequency

Self-resonant frequency

Messfrequenz

Eigenresonanzfrequenz

I_test

k

Test current

Prüfstrom

Ageing constant

Inductance

Alterungskonstante

Induktivität

L

N

Quantity (integer values)

Power dissipation or loss

Anzahl (ganzzahliger Wert)

Verlustleistung

P_loss

Q_el

Q

Electrical charge

Quality

Elektrische Ladung

Güte

R_ins

R_P

R_S

Insulation resistance

Parallel resistance

Series resistance (circuit resistance)

Isolationswiderstand

Parallelwiderstand

Serienwiderstand

S_V

Rate of rise of a voltage pulse

Flankensteilheit eines Spannungsimpulses

T

Temperature

Temperatur

T_meas

T_op

T_ref

T_test

t

Measuring temperature

Operating temperature

Reference temperature

Test temperature

Time

Messtemperatur

Betriebstemperatur

Bezugstemperatur

Prüftemperatur

Zeit

t_r

Rise time of a voltage pulse

Test duration

Dissipation factor

Anstiegszeit eines Spannungsimpulses

Prüfdauer

Verlustfaktor

t_test

tan δ

Please read Cautions and warnings and

Important notes at the end of this document.

Page 17 of 19

Multilayer ceramic capacitors

HQF

Symbol

English

German

V

Voltage

Spannung

V₀

Initial (original) voltage (basic voltage

level)

Measuring voltage

Rated voltage

Anfangsspannung

(Spannungsgrundpegel)

Messspannung

V_meas

V_R

Nennspannung

V_S

V_RMS

Amplitude of a voltage pulse

Measuring (root-mean-square or

effective) AC voltage

Test voltage

Hub des Spannungsimpulses

Effektivspannung

V_test

|Z|

Prüfspannung

Magnitude of impedance (AC

resistance)

Betrag der Impedanz

(Wechselstromwiderstand)

α

Temperature coefficient

Temperaturkoeffizient

ε₀

ε_r

Absolute dielectric constant

Relative dielectric constant

Absolute Dielektrizitätskonstante

Relative Dielektrizitätskonstante

λ

τ

Failure rate

Ausfallrate

Time constant

Zeitkonstante

Abbreviations / Notes

Symbol

English

German

Lead spacing (in mm)

Surface-mounted devices

Rastermaß (in mm)

Oberflächenmontierbares Bauelement

*

To be replaced by a number in ordering Platzhalter für Zahl im Bestellnummern-

codes, type designations etc.

code oder für die Typenbezeichnung.

Platzhalter für einen Buchstaben.

Alle Maße sind in mm angegeben.

+

To be replaced by a letter.

All dimensions are given in mm.

The commas used in numerical values Verwendete Kommas in Zahlenwerten

denote decimal points. bezeichnen Dezimalpunkte.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 18 of 19

Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for

certain areas of application. These statements are based on our knowledge of typical re-

quirements that are often placed on our products in the areas of application concerned. We

nevertheless expressly point out that such statements cannot be regarded as binding

statements about the suitability of our products for a particular customer application.

As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar

with them than the customers themselves. For these reasons, it is always ultimately incum-

bent on the customer to check and decide whether an EPCOS product with the properties de-

scribed in the product specification is suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or

failure before the end of their usual service life cannot be completely ruled out in the

current state of the art, even if they are operated as specified. In customer applications

requiring a very high level of operational safety and especially in customer applications in

which the malfunction or failure of an electronic component could endanger human life or

health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by

means of suitable design of the customer application or other action taken by the customer

(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by

third parties in the event of malfunction or failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this

publication may contain substances subject to restrictions in certain jurisdictions (e.g.

because they are classed as hazardous). Useful information on this will be found in our Ma-

terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de-

tailed questions, please contact our sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this

publication may change from time to time. The same is true of the corresponding product

specifications. Please check therefore to what extent product descriptions and specifications

contained in this publication are still applicable before or when you place an order. We also

reserve the right to discontinue production and delivery of products. Consequently, we

cannot guarantee that all products named in this publication will always be available. The

aforementioned does not apply in the case of individual agreements deviating from the fore-

going for customer-specific products.

6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver-

sion of the "General Terms of Delivery for Products and Services in the Electrical In-

dustry" published by the German Electrical and Electronics Industry Association

(ZVEI).

7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP,

MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT,

SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse,

WindCap are trademarks registered or pending in Europe and in other countries. Further

information will be found on the Internet at www.epcos.com/trademarks.

Page 19 of 19


型号：	B37933K5010B570
厂家：	EPCOS
描述：	Multilayer ceramic capacitors 多层陶瓷电容器电容器陶瓷电容器
文件：	总22页 (文件大小：717K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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