4322-025-15101 [ETC]
CORE FULL EFD12-3C90 PAIR ; CORE FULL EFD12-3C90 PAIR\n型号: | 4322-025-15101 |
厂家: | ETC |
描述: | CORE FULL EFD12-3C90 PAIR
|
文件: | 总38页 (文件大小:1229K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
technical note
Philips Magnetic Products
SMD Coil Formers and Cores
Philips
Components
SMD Coil Formers
and Cores
Contents
Introduction
Ferrite Material Properties
Range Overview
E5.3/2.7/2
E6.3/2.9/2
EFD10
3
6
7
8
10
12
14
16
18
20
22
24
26
28
30
32
34
EFD12
EFD15
EFD20
EP7
ER9.5
ER11
RM4/I
RM5/I
RM6S/I
RM6S/ILP
Tag plate TGPS-9
1
Philips Magnetic Products
Range of SMD accessories and cores
2
Philips Magnetic Products
Introduction
With its new range of surface-mount coil formers, Philips
Components offers a real solution to circuit designers
wishing to take maximum advantage of surface-mount
technology in their designs.
The trend toward full surface-mount technology has been
hampered by the problems of introducing inductive
components (inductors and transformers for example) in
surface-mount execution.
These devices, consisting of cores, coil-formers and
windings held together by clips, were not easily converted
to surface-mount versions, and former designs, based on
"gull-wing" terminations (see Fig.1) have not been entirely
satisfactory.
Disadvantages of "gull-wing" pins
In particular, tensions introduced by the winding wire,
> 0.1 mm
which is wrapped around the upper part of the gull-wing
terminations, can severely degrade the coplanarity of the
solder pads. The use of thin wire windings is a partial
solution to this problem but this introduces limitations on
coil design. Furthermore, during soldering of the winding
wire to the termination, spillage of solder onto the solder
pad can further degrade coplanarity. However, for very
small coil formers gull-wing pins are the only possible
design due to space limitations. For small to medium sized
coil formers there is a better solution: U-pins.
Fig.1 The “gull-wing” design.
3
Philips Magnetic Products
Advantages of the U-pin design
The introduction of Philips' new range of surface-mount,
coil formers, however, solves all these problems. These
feature "U-pin" terminations (Fig.2) securely embedded in
the plastic coil former body. These pins are thicker and
wider than most gull-wing pins and therefore stronger.
The solder pads, located beneath the plastic body and in
contact with it, form a rigid structure with a guaranteed
coplanarity of less than 0.1 mm, according to
IEC 191-2Q.
The upper part of the U-pins protrude from the plastic
body and offer a large area on which to terminate the
windings. Since these are physically separated from the
solder pads, tension introduced by the winding wire will
not affect coplanarity, and neither will solder used to attach
the winding wires spill onto the solder pads. The contact
surface of the pads is also much larger than typical gull-
wing solder pads, making them ideal for these relatively
heavy components.
clean solder pads
Moreover, with this design, the thickness of the winding
wire is no longer a limitation, allowing circuit designers far
more freedom in their choice of wire.
High-grade plastic
The coil former body is of high-grade liquid-crystal
polymer (LCP) offering excellent thermal stability. The
body is exceptionally tough and can withstand soldering
o
temperatures up to 350 C and operating temperatures up
< 0.1 mm
o
to 180 C.
Excellent ferrites
In combination with Philips' extensive range of ferrite
cores, these new coil formers provide surface-mount
solutions in a host of applications from wide-band signal
transformers to power transformers.
When assembled with windings, coil-formers, cores and a
newly-designed clip with a flat upper surface (ideal for
vacuum pickup), the products can easily be inserted by a
pick and place assembly line.
Fig.2 The U-pin design
4
Philips Magnetic Products
5
Philips Magnetic Products
Ferrite material properties
PARAMETER
SYMBOL UNIT
TEST CONDITIONS
3F3
3F4
4F1
3E4
3E5
3E6
Initial permeability
µ
-
f = ≤10 kHz, B < 0.1mT, 1800
900
80
4700 10000 12000
i
o
T = 25 C
f = 10 kHz, T = 25 C
o
Saturation flux density B
at Field strength
Remanence
mT
A/m
mT
500
3000
150
15
450
3000
150
60
330
3000
200
170
-
360
250
100
10
360
250
80
5
-
400
250
100
s
H
o
B
T = 25 C
r
o
Coercivity
H
A/m
T = 25 C
4
-
c
3
Power loss density
(typical, sine wave
excitation)
P
kW/m
f = 25kHz, B = 200mT
70
-
v
f = 100kHz, B = 100mT 50
f = 500kHz, B = 50mT 180
200
180
140
240
≥220
10
-
-
-
-
-
-
f = 1MHz, B = 30mT
f = 3MHz, B = 10mT
-
300
-
≥200
2
300
150
≥260
-
-
-
-
o
Curie temperature
Resistivity (DC)
Density
T
C
≥125 ≥125 ≥130
c
o
5
ρ
Ωm
g/cm
T = 25 C
10
1
4.8
0.5
4.9
0.5
4.9
3
o
T = 25 C
4.8
4.7
4.6
6
Philips Magnetic Products
Range overview
Core Type
Core materials
SMD
3F3
3F4
3E4
3E5
3E6
coil former
E5.3/2.7/2
E6.3/2.9/2
EFD10
EFD12
EFD15
EFD20
EP7
ER9.5
ER11
RM4/I
RM5/I
RM6/I
RM6/ILP
EFD assembly
7
Philips Magnetic Products
E5.3/2.7/2
± 0.1
3.6
2.3
1.2
± 0.1
+0.1
0
3.7
-0,15
1.5
0
2.6min.
0.5
0.6
3.7
4.9
1.85
5.3max.
7.85max.
Fig. 1 SMD coil former for E5.3/2.7/2
Winding data
Number of
sections
Number of
solder pads
Winding area
Winding width Average length
Type number
2
(mm )
(mm)
of turn (mm)
1
2
6
6
1.5
2 × 0.6
2.6
2 × 1.0
12.6
13
CPHS E5.3/2-1S-6P
CPHS E5.3/2-2S-6P
Coil former data
Coil former material
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance
with UL94V-0.
Solder pad material
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
o
Maximum operating temperature
Resistance to soldering heat
Solderability
155 C, IEC 85 class F
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s
Clip data
1.5
6
Clip material
Clamping force
Type number
stainless (CrNi) steel
5N
CLM-E5.3/2
Fig. 2 Clamp for E5.3/2.7/2
Cover data
Cover material
Liquid crystal polymer
(LCP)
Type number
COV-E5.3/2
4.8 max
1.6 max
Fig. 3 Cover for E5.3/2.7/2
8
Philips Magnetic Products
E5.3/2.7/2
Effective core parameters
symbol
parameter
value
unit
+0.2
0
3.8
1.4
-1
Σ (l/A)
core factor (C1)
effective volume
effective length
effective area
5.13
31.4
12.7
2.5
mm
mm
mm
mm
mm
g
0
-0.1
3
V
e
l
e
2
2
A
e
A
minimum area
mass of core half
2.3
0.08
min
m
±
0.1
5.25
Fig. 3 E5.3/2.7/2 core half
Core halves for general purpose transformers and power applications
Grade
A (nH)
µ
Airgap (µm)
Type number
L
e
3F3
3F4
3E5
3E6
265 ±25%
165 ±25%
1400 +40/-30%
1600 +40/-30%
1080
675
5700
6520
0
0
0
0
E5.3/2.7/2-3F3
E5.3/2.7/2-3F4
E5.3/2.7/2-3E5
E5.3/2.7/2-3E6
Properties of core sets under power conditions
B(mT) at
H = 250 A/m
f = 25kHz
Core loss at
f = 100 kHz
B = 100mT
Core loss at
f = 400 kHz
B = 50mT
Core loss at
Core loss at
f = 3MHz
B = 10mT
Grade
f = 1MHz
B = 30mT
o
o
o
o
o
T = 100 C
T = 100 C
T = 100 C
T = 100 C
T = 100 C
3F3
3F4
≥ 300
≥ 250
≤ 0.005
≤ 0.008
-
-
-
-
≤ 0.006
≤ 0.010
9
Philips Magnetic Products
E6.3/2.9/2
4.4
1.6
5.5
3.5 ± 0.08
0
- 0.1
3.5
2.3 ± 0.05
+0.1
2.7 min.
1.5
0
0.6
1.2
5.08
8.6 max.
2.54
6.4 max.
Fig. 1 SMD coil former for E6.3/2.9/2
Winding data
Number of
sections
Number of
solder pads
Winding area
Winding width Average length
Type number
2
(mm )
(mm)
of turn (mm)
1
2
6
6
1.62
2 × 0.45
2.7
2 × 0.75
12.8
12.8
CPHS-E6.3/2-1S-6P
CPHS-E6.3/2-2S-6P
Coil former data
Coil former material
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance
with UL94V-0.
Solder pad material
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
o
Maximum operating temperature
Resistance to soldering heat
Solderability
155 C, IEC 85 class F
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s
Cover data
7.7 max
5.1 max.
Cover material
Liquid crystal polymer
(LCP)
Type number
COV-E6.3/2
Fig. 2 Cover for E6.3/2.9/2
10
Philips Magnetic Products
E6.3/2.9/2
Effective core parameters
+ 0.2
0
3.6
symbol
parameter
value
unit
0
- 0.1
1.4
-1
Σ (l/A)
core factor (C1)
effective volume
effective length
effective area
3.67
40.6
12.2
3.3
mm
mm
mm
mm
mm
g
3
V
e
l
e
2
2
A
e
A
minimum area
mass of core half
2.6
0.12
min
m
0
6.3
- 0.25
Fig. 3 E6.3/2.9/2 core half
Core halves for general purpose transformers and power applications
Grade
A (nH)
µ
Airgap (µm)
Type number
L
e
3F3
3F4
3E5
3E6
360 ±25%
225 ±25%
1700 +40/-30%
2100 +40/-30%
1050
660
4960
6130
0
0
0
0
E6.3/2.9/2-3F3
E6.3/2.9/2-3F4
E6.3/2.9/2-3E5
E6.3/2.9/2-3E6
Properties of core sets under power conditions
B(mT) at
H = 250 A/m
f = 25kHz
Core loss at
f = 100 kHz
B = 100mT
Core loss at
f = 400 kHz
B = 50mT
Core loss at
Core loss at
f = 3MHz
B = 10mT
Grade
f = 1MHz
B = 30mT
o
o
o
o
o
T = 100 C
T = 100 C
T = 100 C
T = 100 C
T = 100 C
3F3
3F4
≥ 300
≥ 250
≤ 0.007
≤ 0.010
−
−
-
−
≤ 0.008
≤ 0.013
11
Philips Magnetic Products
EFD10
1.8
7.3-0.15
5.7-0.1
4.8+0.1
7.1-0.15
6.05min.
0.8
1.8
12
14.7max.
3
2
9
11.7max.
3
MBW122
Fig. 1 SMD coil former for EFD10
Winding data
Number of
sections
Number of
solder pads
Winding area
Winding width Average length
Type number
2
(mm )
(mm)
of turn (mm)
1
8
4.2
6.05
14.8
CPHS-EFD10-1S-8P
Coil former data
Coil former material
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance
with UL94V-0.
Solder pad material
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
o
Maximum operating temperature
Resistance to soldering heat
Solderability
155 C, IEC 85 class F
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s
Clamp data
12 - 0.3
± 0.2
10.5
9.4
8
Clamp material
Clamping force
Type number
stainless(CrNi) steel
15N
CLM-EFD10
8
10 - 0.3
4
MBW128
Fig. 2 Clamp for EFD10
12
Philips Magnetic Products
EFD10
Effective core parameters
symbol
parameter
value
unit
-1
Σ (l/A)
core factor (C1)
effective volume
effective length
effective area
3.29
171
23.7
7.2
mm
mm
mm
3
V
e
l
e
2
A
mm
e
2
A
minimum area
mass of core half
6.5
0.45
mm
g
min
m
10.5 ± 0.3
7.65 ± 0.25
4.55 ± 0.15
MBW131
Fig. 3 EFD10 core half
Core sets for general purpose transformers and power applications
Grade
A (nH)
µ
Airgap (µm)
Type number
L
e
3F3
25±5%
40±8%
63±10%
500±25%
25±5%
40±8%
66
105
165
1290
66
105
165
730
3670
5240
540
300
170
0
520
280
150
0
EFD10-3F3-A25-S
EFD10-3F3-A40-S
EFD10-3F3-A63-S
EFD10-3F3-S
EFD10-3F4-A25-S
EFD10-3F4-A40-S
EFD10-3F4-A63-S
EFD10-3F4-S
3F4
63±10%
280±25%
1400 +40/-30%
2000 +40/-30%
3E4
3E5
0
0
EFD10-3E4-S
EFD10-3E5-S
Properties of core sets under power conditions
B(mT) at
H = 250 A/m
f = 25kHz
Core loss at
f = 100 kHz
B = 100mT
Core loss at
f = 400 kHz
B = 50mT
Core loss at
Core loss at
f = 3MHz
B = 10mT
Grade
f = 1MHz
B = 30mT
o
o
o
o
o
T = 100 C
T = 100 C
T = 100 C
T = 100 C
T = 100 C
3F3
3F4
≥ 315
≥ 250
≤ 0.02
≤ 0.035
−
−
−
−
≤ 0.034
≤ 0.055
13
Philips Magnetic Products
EFD12
1.8
8.65-0.15
6.55-0.1
5.65+0.1
8.7-0.15
7.65min.
0.8
1.8
13.4
3
9
16.2max.
2
13.7max.
3
MBW123
Fig. 1 SMD coil former for EFD12
Winding data
Number of
sections
Number of
solder pads
Winding area
Winding width Average length
Type number
2
(mm )
(mm)
of turn (mm)
1
8
6.5
7.65
18.6
CPHS-EFD12-1S-8P
Coil former data
Coil former material
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance
with UL94V-0.
Solder pad material
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
o
Maximum operating temperature
Resistance to soldering heat
Solderability
155 C, IEC 85 class F
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s
Clamp data
14 - 0.3
11.5
Clamp material
Clamping force
Type number
stainless(CrNi) steel
20N
CLM-EFD12
± 0.2
9.4
12.5
10.5
12 - 0.3
4
MBW129
Fig. 2 clamp for EFD12
14
Philips Magnetic Products
EFD12
Effective core parameters
symbol
parameter
value
unit
-1
Σ (l/A)
core factor (C1)
effective volume
effective length
effective area
2.50
325
28.5
11.4
10.7
0.9
mm
mm
mm
3
V
e
l
e
2
A
mm
e
2
A
minimum area
mass of core half
mm
g
min
m
12.5 ± 0.3
9 ± 0.25
5.4 ± 0.15
MBW132
Fig. 3 EFD12 core half
Core sets for general purpose transformers and power applications
Grade
A (nH)
µ
Airgap (µm)
Type number
L
e
3F3
40±5%
63±8%
100±10%
700±25%
40±5%
80
125
200
1370
80
125
200
760
3780
5570
490
280
160
0
470
260
140
0
EFD12-3F3-A40-S
EFD12-3F3-A63-S
EFD12-3F3-A100-S
EFD12-3F3-S
EFD12-3F4-A40-S
EFD12-3F4-A63-S
EFD12-3F4-A100-S
EFD12-3F4-S
3F4
63±8%
100±10%
380±25%
1900 +40/-30%
2800 +40/-30%
3E4
3E5
0
0
EFD12-3E4-S
EFD12-3E5-S
Properties of core sets under power conditions
B(mT) at
H = 250 A/m
f = 25kHz
Core loss at
f = 100 kHz
B = 100mT
Core loss at
f = 400 kHz
B = 50mT
Core loss at
Core loss at
f = 3MHz
B = 10mT
Grade
f = 1MHz
B = 30mT
o
o
o
o
o
T = 100 C
T = 100 C
T = 100 C
T = 100 C
T = 100 C
3F3
3F4
≥ 315
≥ 250
≤ 0.04
≤ 0.065
−
−
−
−
≤ 0.065
≤ 0.11
15
Philips Magnetic Products
EFD15
2
10.55 - 0.15
6.65 - 0.1
5.55+0.1
10.4 - 0.15
9.15 min
1.8
3.75
11.25
1
16
18.7 max
2
16.7 max
3.75
MBW143
Fig. 1 SMD coil former for EFD15
Winding data
Number of
sections
Number of
solder pads
Winding area
(mm2)
Winding width Average length
Type number
(mm)
of turn (mm)
1
8
16.7
9.15
25.6
CPHS-EFD15-1S-8P
Coil former data
Coil former material
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance
with UL94V-0.
Solder pad material
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
o
Maximum operating temperature
Resistance to soldering heat
Solderability
155 C, IEC 85 class F
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s
Clip data
4.5
5
Clip material
Clamping force
Type number
stainless(CrNi) steel
12.5N each
CLI-EFD15
2.6
MBW144
Fig. 2 Clip for EFD15
0
Clamp data
16.5
-0.3
± 0.2
15
13.5
12
Clamp material
Clamping force
Type number
stainless(CrNi) steel
25N
CLM-EFD15
12.5
± 0.2
14.3
4
Fig. 2 Clamp for EFD15
16
Philips Magnetic Products
EFD15
Effective core parameters
symbol
parameter
value
unit
-1
Σ (l/A)
core factor (C1)
effective volume
effective length
effective area
2.27
510
34.0
15.0
12.2
1.4
mm
mm
mm
3
V
e
l
e
2
A
mm
e
2
A
minimum area
mass of core half
mm
g
min
15 ± 0.4
11 ± 0.35
5.3 ± 0.15
m
MBW145
Fig. 3 EFD15 core half
Core sets for general purpose transformers and power applications
Grade
A (nH)
µ
Airgap (µm)
Type number
L
e
3F3
63±5%
100±8%
160±10%
780±25%
63±5%
115
180
290
1400
115
180
290
720
3610
≥ 4510
350
170
100
0
350
160
90
0
EFD15-3F3-A63-S
EFD15-3F3-A100-S
EFD15-3F3-A160-S
EFD15-3F3-S
EFD15-3F4-A63-S
EFD15-3F4-A100-S
EFD15-3F4-A160-S
EFD15-3F4-S
3F4
100±8%
160±10%
400±25%
2000 +40/-30%
≥ 2500
3E4
3E5
0
0
EFD15-3E4-S
EFD15-3E5-S
Properties of core sets under power conditions
B(mT) at
H = 250 A/m
f = 25kHz
Core loss at
f = 100 kHz
B = 100mT
Core loss at
f = 400 kHz
B = 50mT
Core loss at
Core loss at
f = 3MHz
B = 10mT
Grade
f = 1MHz
B = 30mT
o
o
o
o
o
T = 100 C
T = 100 C
T = 100 C
T = 100 C
T = 100 C
3F3
3F4
≥ 315
≥ 250
≤ 0.06
≤ 0.10
−
−
−
−
≤ 0.10
≤ 0.16
17
Philips Magnetic Products
EFD20
2
14.8 - 0.2
10.5 - 0.15
9.2 + 0.1
14.8-0.2
13.5 min
1.8
1
7.5 ±0.05
15 ± 0.05
21.7 max
21
23.7 max
2
3.75
MBW148
Fig. 1 SMD coil former for EFD20
Winding data
Number of
sections
Number of
solder pads
Winding area
Winding width Average length
Type number
2
(mm )
(mm)
of turn (mm)
1
10
27.7
13.5
34.1
CPHS-EFD20-1S-10P
Coil former data
Coil former material
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance
with UL94V-0.
Solder pad material
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
o
Maximum operating temperature
Resistance to soldering heat
Solderability
155 C, IEC 85 class F
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s
Clip data
5
6
Clip material
Clamping force
Type number
stainless(CrNi) steel
20N each
CLI-EFD20
4
MBW146
Fig. 2 Clip for EFD20
Clamp data
0
- 0.3
21.5
±
0.2
20
18.5
17
Clamp material
Clamping force
Type number
stainless(CrNi) steel
30N
CLM-EFD20
17.5
4
±
0.2
19.3
Fig. 2 Clamp for EFD20
18
Philips Magnetic Products
EFD20
Effective core parameters
symbol
parameter
value
unit
-1
Σ (l/A)
core factor (C1)
effective volume
effective length
effective area
1,52
1460
47.0
31.0
29.0
3.5
mm
mm
mm
3
V
e
l
e
2
A
mm
e
2
A
minimum area
mass of core half
mm
g
min
20 ± 0.55
15.4 ± 0.5
8.9 ± 0.2
m
MBW147
Fig. 3 EFD20 core half
Core halves/sets for general purpose transformers and power applications
Grade
A (nH)
µ
Airgap (µm)
Type number
L
e
3F3
63±3%
100±3%
160±5%
250±8%
315±10%
1200±25%
63±3%
100±3%
160±5%
250±8%
315±10%
650±25%
75
120
195
300
425
1450
75
120
195
300
425
785
500
240
140
90
65
0
500
240
140
90
65
0
EFD20-3F3-E63-S
EFD20-3F3-A100-S
EFD20-3F3-A160-S
EFD20-3F3-A250-S
EFD20-3F3-A315-S
EFD20-3F3
EFD20-3F4-E63-S
EFD20-3F4-A100-S
EFD20-3F4-A160-S
EFD20-3F4-A250-S
EFD20-3F4-A315-S
EFD20-3F4
3F4
Properties of core sets under power conditions
B(mT) at
H = 250 A/m
f = 25kHz
Core loss at
f = 100 kHz
B = 100mT
Core loss at
f = 400 kHz
B = 50mT
Core loss at
Core loss at
f = 3MHz
B = 10mT
Grade
f = 1MHz
B = 30mT
o
o
o
o
o
T = 100 C
T = 100 C
T = 100 C
T = 100 C
T = 100 C
3F3
3F4
≥ 315
≥ 300
≤ 0.17
≤ 0.28
−
−
−
−
≤ 0.44
≤ 0.50
19
Philips Magnetic Products
EP7
7-0.1
4.5-0.1
4.9-0.1
3.9min.
1.8
3.5+0.1
0.8
1.8
7.15
9.85max.
3
6
2
3
MBW124
9.2max.
Fig. 1 SMD coil former for EP7
Winding data
Number of
sections
Number of
solder pads
Winding area
(mm2)
Winding width Average length
Type number
CPHS-EP7-1S-6P
(mm)
of turn (mm)
1
6
4.7
3.9
17.9
Coil former data
Coil former material
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance
with UL94V-0.
Solder pad material
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
o
Maximum operating temperature
Resistance to soldering heat
Solderability
155 C, IEC 85 class F
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s
Clip data
9.4+0,2
Clip material
Clamping force
Type number
stainless(CrNi) steel
22N
CLI-EP7
4.3
0.25
MBW130
Fig. 2 clip for EP7
20
Philips Magnetic Products
EP7
Effective core parameters
symbol
parameter
value
unit
7.2 + 0.4
3.4 - 0.2
-1
Σ (l/A)
core factor (C1)
effective volume
effective length
effective area
1.45
165
15.5
10.7
8.55
0.8
mm
mm
mm
mm
mm
g
3
V
e
l
e
2
2
A
e
A
minimum area
mass of core set
min
m
9.4 - 0.4
MBW133
Fig. 3 EP7 core set
Core sets for general purpose transformers and power applications
Grade
A (nH)
µ
Airgap (µm)
Type number
L
e
3F3
25±3%
40±3%
63±3%
100±3%
160±5%
1000±25%
100±3%
160±5%
30
48
76
790
440
260
150
85
0
150
85
0
EP7-3F3-E25
EP7-3F3-A40
EP7-3F3-A63
EP7-3F3-A100
EP7-3F3-A160
EP7-3F3
EP7-3F4-A100
EP7-3F4-A160
EP7-3F4
121
193
1210
121
193
730
6300
7000
3F4
600±25%
5200 +40/-30%
5800 +40/-30%
3E5
3E6
0
0
EP7-3E5
EP7-3E6
Properties of core sets under power conditions
B(mT) at
H = 250 A/m
f = 25kHz
Core loss at
f = 100 kHz
B = 100mT
Core loss at
f = 400 kHz
B = 50mT
Core loss at
Core loss at
f = 3MHz
B = 10mT
Grade
f = 1MHz
B = 30mT
o
o
o
o
o
T = 100 C
T = 100 C
T = 100 C
T = 100 C
T = 100 C
3F3
3F4
≥ 315
≥ 250
≤ 0.02
≤ 0.035
−
−
−
−
≤ 0.033
≤ 0.053
21
Philips Magnetic Products
ER9.5
ø 7.3 ± 0,1
ø 4.45± 0.08
ø 3.6 ±0.08
1.6
8.6 max.
0.7
8.1
2
6
11.7max.
2
Fig. 1 SMD coil former for ER9.5
Winding data
Number of
sections
Number of
solder pads
Winding area
Winding width Average length
Type number
2
(mm )
(mm)
of turn (mm)
1
8
2.8
2.05
18.4
CPVS-ER9.5-1S-8P
Coil former data
Coil former material
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance
with UL94V-0.
Solder pad material
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
o
Maximum operating temperature
Resistance to soldering heat
Solderability
155 C, IEC 85 class F
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s
Clamp data
4
5.5
Clamp material
Clamping force
Type number
stainless(CrNi)steel
20N
CLM-ER9.5
Fig. 2 clamp for ER9.5
22
Philips Magnetic Products
ER9.5
Effective core parameters
symbol
parameter
value
unit
0
3.5
-1
- 0.2
Σ (l/A)
core factor (C1)
effective volume
effective length
effective area
1.67
120
14.2
8.47
7.60
0.35
mm
mm
3
V
e
l
mm
e
2
A
mm
e
2
A
minimum area
mass of core half
mm
0
min
9.5
7.1
- 0.3
m
g
+ 0.2
0
+ 0.25
0
7.5
Fig. 3 ER9.5 core half
Core sets for general purpose transformers and power applications
Grade
A (nH)
µ
Airgap (µm)
Type number
L
e
3F3
3F4
3E5
3E6
850±25%
525±25%
3600 +40/-30%
4800 +40/-30%
1145
700
4780
6380
0
0
0
0
ER9.5-3F3-S
ER9.5-3F4-S
ER9.5-3E5-S
ER9.5-3E6-S
Properties of core sets under power conditions
B(mT) at
H = 250 A/m
f = 25kHz
Core loss at
f = 100 kHz
B = 100mT
Core loss at
f = 400 kHz
B = 50mT
Core loss at
Core loss at
f = 3MHz
B = 10mT
Grade
f = 1MHz
B = 30mT
o
o
o
o
o
T = 100 C
T = 100 C
T = 100 C
T = 100 C
T = 100 C
3F3
3F4
≥ 300
≥ 250
≤ 0.015
≤ 0.025
−
−
−
−
≤ 0.024
≤ 0.038
23
Philips Magnetic Products
ER11
+0.1
ø 8.5-0.2
1.6
ø 5.3± 0.1
ø 4.5± 0.1
10.6 max.
0.7
4
8
9.2
12.35max.
2
Fig. 1 SMD coil former for ER11
Winding data
Number of
sections
Number of
solder pads
Winding area
Winding width Average length
Type number
CPVS-ER11-1S-10P
2
(mm )
(mm)
of turn (mm)
1
10
2.8
1.85
21.6
Coil former data
Coil former material
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance
with UL94V-0.
Solder pad material
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
o
Maximum operating temperature
Resistance to soldering heat
Solderability
155 C, IEC 85 class F
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s
Clip data
4.4
5.6
Clip material
Clamping force
Type number
stainless(CrNi) steel
25N
CLM-ER11
Fig. 2 clamp for ER11
24
Philips Magnetic Products
ER11
Effective core parameters
symbol
parameter
value
unit
0
4.25
-1
- 0.25
Σ (l/A)
core factor (C1)
effective volume
effective length
effective area
1.23
174
14.7
11.9
10.3
0.5
mm
mm
3
V
e
l
mm
e
2
A
mm
e
2
A
minimum area
mass of core half
mm
min
0
11
- 0.35
m
g
+0.2
0
8
+0.3
0
8.7
Fig. 3 ER11 core half
Core sets for general purpose transformers and power applications
Grade
A (nH)
µ
Airgap (µm)
Type number
L
e
3F3
3F4
3E5
3E6
1200±25%
725±25%
5000 +40/-30%
6700 +40/-30%
1170
710
4890
6560
0
0
0
0
ER11-3F3-S
ER11-3F4-S
ER11-3E5-S
ER11-3E6-S
Properties of core sets under power conditions
B(mT) at
H = 250 A/m
f = 25kHz
Core loss at
f = 100 kHz
B = 100mT
Core loss at
f = 400 kHz
B = 50mT
Core loss at
Core loss at
f = 3MHz
B = 10mT
Grade
f = 1MHz
B = 30mT
o
o
o
o
o
T = 100 C
T = 100 C
T = 100 C
T = 100 C
T = 100 C
3F3
3F4
≥ 300
≥ 250
≤ 0.025
≤ 0.040
−
−
−
−
≤ 0.035
≤ 0.056
25
Philips Magnetic Products
RM4/I
ø 7.85-0.15
ø 4.9-0.1
ø 4+0.1
2
2
1.8
1
7.5
7
10.65 max
11.15 max
3.75
MBW125
Fig. 1 SMD coil former for RM4/I
Winding data
Number of
sections
Number of
solder pads
Winding area
Winding width Average length
Type number
2
(mm )
(mm)
of turn (mm)
1
6
8.4
5.75
19.8
CPVS-RM4-1S-6P
Coil former data
Coil former material
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance
with UL94V-0.
Solder pad material
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
o
Maximum operating temperature
Resistance to soldering heat
Solderability
155 C, IEC 85 class F
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s
Clip data
2.1
Clip material
Clamping force
Type number
stainless steel
5 N each
CLI-RM4/5
Fig. 2 Clip for RM4/I
26
Philips Magnetic Products
RM4/I
Effective core parameters
symbol
parameter
value
unit
-1
Σ (l/A)
core factor (C1)
effective volume
effective length
effective area
1.69
322
23.3
13.8
11.5
1.7
mm
mm
mm
3
V
e
l
e
2
A
mm
e
2
A
minimum area
mass of core set
mm
g
> 5.8
min
11 - 0.5
m
ø 3.9 - 0.2
ø 7.95 + 0.4
MBW134
Fig. 3 RM4/I core set
Core sets for general purpose transformers and power applications
Grade
A (nH)
µ
Airgap (µm)
Type number
L
e
3F3
100±3%
160±3%
250±10%
950±25%
100±3%
134
215
336
1280
134
215
336
750
4700
170
100
50
0
150
80
40
0
RM4/I-3F3-A100
RM4/I-3F3-A160
RM4/I-3F3-A250
RM4/I-3F3
RM4/I-3F4-A100
RM4/I-3F4-A160
RM4/I-3F4-A250
RM4/I-3F4
3F4
3E5
160±3%
250±10%
560±25%
3500 +40/-30%
0
RM4/I-3E5
Properties of core sets under power conditions
B(mT) at
H = 250 A/m
f = 25kHz
Core loss at
f = 100 kHz
B = 100mT
Core loss at
f = 400 kHz
B = 50mT
Core loss at
Core loss at
f = 3MHz
B = 10mT
Grade
f = 1MHz
B = 30mT
o
o
o
o
o
T = 100 C
T = 100 C
T = 100 C
T = 100 C
T = 100 C
3F3
3F4
≥ 300
≥ 250
≤ 0.05
≤ 0.07
−
−
−
−
≤ 0.065
≤ 0.11
27
Philips Magnetic Products
RM5/I
0
ø10.1
− 0.15
0
ø5.9
− 0.1
+0.1
ø5
0
2
1
1.8
3.75
2
14.9 max.
3.75
11.25
14.25 max.
Fig. 1 SMD coil former for RM5/I
Winding data
Number of
sections
Number of
solder pads
Winding area
Winding width Average length
Type number
2
(mm )
(mm)
of turn (mm)
1
8
9.8
4.9
24.9
CPVS-RM5-1S-8P
Coil former data
Coil former material
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance
with UL94V-0.
Solder pad material
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
o
Maximum operating temperature
Resistance to soldering heat
Solderability
155 C, IEC 85 class F
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s
Clip data
2.1
Clip material
Clamping force
Type number
stainless (CrNi)steel
5 N each
CLI-RM4/5
Fig. 2 Clip for RM5/I
28
Philips Magnetic Products
RM5/I
Effective core parameters
symbol
parameter
value
unit
-1
Σ (l/A)
core factor (C1)
effective volume
effective length
effective area
0.935
574
23.2
24.8
18.1
3.3
mm
mm
mm
3
V
e
l
e
2
A
mm
e
2
A
minimum area
mass of core set
mm
g
> 6
min
14.6 - 0,6
m
ø 4.9 - 0.2
ø 10.2 + 0.4
MBW135
Fig. 3 RM5/I core set
Core sets for general purpose transformers and power applications
Grade
A (nH)
µ
Airgap (µm)
Type number
L
e
3F3
100±3%
160±3%
250±3%
1700±25%
100±3%
160±3%
74
119
186
1270
74
119
186
750
4980
7050
300
160
90
0
300
160
90
0
RM5/I-3F3-A100
RM5/I-3F3-A160
RM5/I-3F3-A250
RM5/I-3F3
RM5/I-3F4-A100
RM5/I-3F4-A160
RM5/I-3F4-A250
RM5/I-3F4
3F4
250±3%
1000±25%
6700 +40/-30%
9500 +40/-30%
3E5
3E6
0
0
RM5/I-3E5
RM5/I-3E6
Properties of core sets under power conditions
B(mT) at
H = 250 A/m
f = 25kHz
Core loss at
f = 100 kHz
B = 100mT
Core loss at
f = 400 kHz
B = 50mT
Core loss at
Core loss at
f = 3MHz
B = 10mT
Grade
f = 1MHz
B = 30mT
o
o
o
o
o
T = 100 C
T = 100 C
T = 100 C
T = 100 C
T = 100 C
3F3
3F4
≥ 315
≥ 250
≤ 0.08
≤ 0.11
−
−
−
−
≤ 0.11
≤ 0.20
29
Philips Magnetic Products
RM6S/I
ø 12.3-0.25
ø 7.55-0.15
ø 6.5+0.15
2
2
1
14.7
1.8
5
12.5
17.45 max
3.75
3.75
5
15.7 max
MBW127
Fig. 1 SMD coil former for RM6S/I
Winding data
Number of
sections
Number of
solder pads
Winding area
Winding width Average length
Type number
2
(mm )
(mm)
of turn (mm)
1
8
14
6.25
31
CPVS-RM6S-1S-8P
Coil former data
Coil former material
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance
with UL94V-0.
Solder pad material
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
o
Maximum operating temperature
Resistance to soldering heat
Solderability
155 C, IEC 85 class F
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s
Clip data
2.3
Clip material
Clamping force
Type number
stainless (CrNi) steel
10 N each
CLI-RM6
MBW138
Fig. 2 Clip for RM6S/I
30
Philips Magnetic Products
RM6S/I
Effective core parameters
symbol
parameter
value
unit
14.7 - 0.6
-1
Σ (l/A)
core factor (C1)
effective volume
effective length
effective area
0.784
1090
29.2
37.0
31.2
4.9
mm
mm
3
V
e
l
mm
e
2
A
mm
e
2
A
minimum area
mass of core set
mm
min
> 8.8
m
g
17.9 - 0.7
ø 6.4 - 0.2
ø 12.4 + 0.5
MBW136
Fig. 3 RM6S/I core set
Core sets for general purpose transformers and power applications
Grade
A (nH)
µ
Airgap (µm)
Type number
L
e
3F3
63±3%
100±3%
160±3%
250±3%
2150±25%
63±3%
100±3%
160±3%
250±3%
39
62
100
156
1350
39
950
500
300
150
0
950
500
300
150
0
RM6S/I-3F3-A63
RM6S/I-3F3-A100
RM6S/I-3F3-A160
RM6S/I-3F3-A250
RM6S/I-3F3
RM6S/I-3F4-A63
RM6S/I-3F4-A100
RM6S/I-3F4-A160
RM6S/I-3F4-A250
RM6S/I-3F4
3F4
62
100
156
780
5370
6200
1250±25%
8600 +40/-30%
12500 +40/-30%
3E5
3E6
0
0
RM6S/I-3E5
RM6S/I-3E6
Properties of core sets under power conditions
B(mT) at
H = 250 A/m
f = 25kHz
Core loss at
f = 100 kHz
B = 100mT
Core loss at
f = 400 kHz
B = 50mT
Core loss at
Core loss at
f = 3MHz
B = 10mT
Grade
f = 1MHz
B = 30mT
o
o
o
o
o
T = 100 C
T = 100 C
T = 100 C
T = 100 C
T = 100 C
3F3
3F4
≥ 315
≥ 250
≤ 0.14
≤ 0.20
−
−
−
−
≤ 0.22
≤ 0.35
31
Philips Magnetic Products
RM6S/ILP
2
ø 12.3 - 0.25
ø 7.55 - 0.15
ø 6.5 +0.15
2
1
14.7
1.8
5
12.5
17.45 max
3.75
3.75
5
15.7 max
MBW142
Fig. 1 SMD coil former for RM6S/ILP
Winding data
Number of
sections
Number of
solder pads
Winding area
Winding width Average length
Type number
2
(mm )
(mm)
of turn (mm)
1
8
6.4
2.8 min
31.0
CPVS-RM6S/LP-1S-8P
Coil former data
Coil former material
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance
with UL94V-0.
Solder pad material
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
o
Maximum operating temperature
Resistance to soldering heat
Solderability
155 C, IEC 85 class F
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s
Clip data
2.3
Clip material
Clamping force
Type number
stainless (CrNi) steel
10 N each
CLI-RM6/LP
Fig. 2 Clip for RM6S/ILP
32
Philips Magnetic Products
RM6S/ILP
Effective core parameters
symbol
parameter
value
unit
-1
14.7 - 0.6
Σ (l/A)
core factor (C1)
effective volume
effective length
effective area
0.580
820
21.8
37.5
31.2
4.2
mm
mm
mm
mm
mm
g
3
V
e
l
e
2
2
A
e
A
minimum area
mass of core set
min
> 8.8
m
17.9 - 0.7
ø 6.4 - 0.2
ø 12.4 +0.5
MBW140
Fig. 3 RM6S/ILP core set
Core sets for general purpose transformers and power applications
Grade
A (nH)
µ
Airgap (µm)
Type number
L
e
3F3
3F4
3E5
3E6
2700±25%
1600±25%
10500 +40/-30%
15000 +40/-30%
1250
740
4850
6930
0
0
0
0
RM6S/ILP-3F3
RM6S/ILP-3F4
RM6S/ILP-3E5
RM6S/ILP-3E6
Properties of core sets under power conditions
B(mT) at
H = 250 A/m
f = 25kHz
Core loss at
f = 100 kHz
B = 100mT
Core loss at
f = 400 kHz
B = 50mT
Core loss at
Core loss at
f = 3MHz
B = 10mT
Grade
f = 1MHz
B = 30mT
o
o
o
o
o
T = 100 C
T = 100 C
T = 100 C
T = 100 C
T = 100 C
3F3
3F4
≥ 300
≥ 250
≤ 0.10
≤ 0.15
−
−
−
−
≤ 0.16
≤ 0.26
33
Philips Magnetic Products
TGPS-9
13 max.
1.75max.
1.8
0.8
0.3
3
9
3
Fig. 1 Tag plate for 9mm ring cores.
Winding data
Number of
sections
Number of
solder pads
Winding area
Winding width Average length
Type number
2
(mm )
(mm)
of turn (mm)
-
8
-
-
-
TGPS-9
Coil former data
Coil former material
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance
with UL94V-0.
Solder pad material
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
o
Maximum operating temperature
Resistance to soldering heat
Solderability
155 C, IEC 85 class F
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s
Cover data
0.6(4x)
Cover material
Polyamide (PA4.6)
glass reinforced, flame retardant
in accordance with UL94V-0.
o
Maximum operating 130 C, IEC 85 class B
temperature
Type number
11.7 max
0.6
6 max.
COV-9
Fig. 2 Cover for TGPS-9
34
Philips Magnetic Products
TN9/6/3
Effective core parameters
symbol
parameter
value
unit
-1
Σ (l/A)
core factor (C1)
effective volume
effective length
effective area
5.17
102
22.9
4.44
0.5
mm
mm
mm
9.4 ± 0.3
3.4 ± 0.3
3
V
e
l
e
2
A
mm
g
e
m
mass of core
5.5 ± 0.3
Fig. 3 TN9/6/3 ring core
Ring core data
Grade
A (nH)
µ
Colour code
Type number
L
e
3F3
440 ±25%
2070 ±30%
2435 ±30%
1800
8500
10000
blue
yellow/white
purple/white
TN9/6/3-3F3
TL9/6/3-3E5
TC9/6/3-3E6
1)
3E5
2)
3E6
Note
1. Ring cores in 3E5 are lacquered and therefore have different dimensions: OD = 9.3±0.4 mm, ID = 5.75±0.3mm, H = 3.25±0.3mm.
2. Ring cores in 3E6 are coated with parylene and therefore have different dimensions: OD = 9.0±0.2 mm, ID = 6.0±0.2mm, H = 3.0±0.15mm.
35
Philips Magnetic Products
Philips Components-aworldwidecompany
Australia: Philips Components Pty Ltd., NORTH RYDE,
Philippines: Philips Semiconductors Philippines Inc.,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
METRO MANILA, Tel. +63 2 816 6345, Fax. +63 2 817 3474
Austria: Österreichische Philips Industrie GmbH, WIEN,
Poland: Philips Poland Sp. z.o.o., WARSZAWA,
Tel. +43 1 60 101 12 41, Fax. +43 1 60 101 12 11
Tel. +48 22 612 2594, Fax. +48 22 612 2327
Belarus: Philips Office Belarus, MINSK,
Portugal: Philips Portuguesa S.A.,
Tel. +375 172 200 924/733, Fax. +375 172 200 773
Philips Components: LINDA-A-VELHA,
Tel. +351 1 416 3160/416 3333, Fax. +351 1 416 3174/416 3366
Benelux: Philips Nederland B.V., EINDHOVEN, NL,
Tel. +31 40 2783 749, Fax. +31 40 2788 399
Russia: Philips Russia, MOSCOW,
Tel. +7 95 755 6918, Fax. +7 95 755 6919
Brazil: Philips Components, SÃO PAULO,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
Singapore: Philips Singapore Pte Ltd., SINGAPORE,
Tel. +65 350 2000, Fax. +65 355 1758
Canada: Philips Electronics Ltd., SCARBOROUGH,
Tel. +1 416 292 5161, Fax. +1 416 754 6248
South Africa: S.A. Philips Pty Ltd., JOHANNESBURG,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
China: Philips Company, SHANGHAI,
Tel. +86 21 6354 1088, Fax. +86 21 6354 1060
Spain: Philips Components, BARCELONA,
Tel. +34 93 301 63 12, Fax. +34 93 301 42 43
Denmark: Philips Components A/S, COPENHAGEN S,
Tel. +45 3329 3333, Fax. +45 3329 3905
Sweden: Philips Components AB, STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Finland: Philips Components, ESPOO,
Tel. +358 9 615 800, Fax. +358 9 615 80510
Switzerland: Philips Components AG, ZÜRICH,
Tel. +41 1 488 22 11, Fax. +41 1 481 7730
France: Philips Composants, SURESNES,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6493
Taiwan: Philips Taiwan Ltd., TAIPEI,
Tel. +886 2 2134 2900, Fax. +886 2 2134 2929
Germany: Philips Components GmbH, HAMBURG,
Tel. +49 40 2489-0, Fax. +49 40 2489 1400
Thailand: Philips Electronics (Thailand) Ltd., BANGKOK,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Greece: Philips Hellas S.A., TAVROS,
Tel. +30 1 4894 339/+30 1 4894 239, Fax. +30 1 4814 240
Turkey: Türk Philips Ticaret A.S., GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Hong Kong: Philips Hong Kong, KOWLOON,
Tel. +852 2784 3000, Fax. +852 2784 3003
United Kingdom: Philips Components Ltd., DORKING,
Tel. +44 1306 512 000, Fax. +44 1306 512 345
India: Philips India Ltd., MUMBAI,
Tel. +91 22 4930 311, Fax. +91 22 4930 966/4950 304
United States:
• Display Components, ANN ARBOR, MI,
Tel. +1 734 996 9400, Fax. +1 734 761 2776
Indonesia: P.T. Philips Development Corp., JAKARTA,
Tel. +62 21 794 0040, Fax. +62 21 794 0080
• Magnetic Products, SAUGERTIES, NY,
Tel. +1 914 246 2811, Fax. +1 914 246 0487
Ireland: Philips Electronics (Ireland) Ltd., DUBLIN,
Tel. +353 1 7640 203, Fax. +353 1 7640 210
• Passive Components, SAN JOSE, CA,
Tel. +1 408 570 5600, Fax. +1 408 570 5700
Israel: Rapac Electronics Ltd., TEL AVIV,
Tel. +972 3 6450 444, Fax. +972 3 6491 007
Yugoslavia (Federal Republic of): Philips Components, BELGRADE,
Tel. +381 11 625344/373,Fax. +381 11 635 777
Italy: Philips Components S.r.l., MILANO,
Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Internet:
Japan: Philips Japan Ltd., TOKYO,
• Display Components: www.dc.comp.philips.com
• Passive Components: www.passives.comp.philips.com
Tel. +81 3 3740 5135, Fax. +81 3 3740 5035
Korea (Republic of): Philips Electronics (Korea) Ltd., SEOUL,
For all other countries apply to:
Tel. +82 2 709 1472, Fax. +82 2 709 1480
Philips Components, Building BF-1, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31-40-27 23 903.
Malaysia: Philips Malaysia SDN Berhad,
Components Division, PULAU PINANG,
Tel. +60 3 750 5213, Fax. +60 3 757 4880
COB20
Philips Electronics N.V. 1998
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to
be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher
for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.
Mexico: Philips Components, EL PASO, U.S.A.,
Tel. +52 915 772 4020, Fax. +52 915 772 4332
New Zealand: Philips New Zealand Ltd., AUCKLAND,
Tel. +64 9 815 4000, Fax. +64 9 849 7811
Norway: Norsk A/S Philips, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: Philips Electrical Industries of Pakistan Ltd., KARACHI,
Tel. +92 21 587 4641-49, Fax. +92 21 577 035/+92 21 587 4546
Printed in The Netherlands
9398 237 50011
Date of release: 6/97
Philips
Components
Magnetic Products NAFTA Sales Offices
Alabama
Alaska
Arizona
Arkansas
California - Northern
California - Southern
Colorado
Connecticut
Deleware
Florida
Georgia
Over and Over, Inc., Charlotte, NC
Eclipse Marketing Group, Redmond, WA
Harper and Two, Tempe, AZ
(708) 583-9100
(206) 885-6991
(602) 804-1290
(440) 269-8585
(408) 988-6300
(801) 264-8050
(440) 269-8585
(617) 932-4748
(617) 932-4748
(704) 583-9100
(704) 583-9100
(310) 424-3030
(206) 885-6991
(801) 264-8050
(440) 269-8585
(319) 377-4666
(314) 997-4558
(219) 482-2725
(317) 462-4446
(319) 377-4666
(913) 469-1312
(316) 721-0500
(317) 462-4446
(440) 269-8585
(617) 932-4748
(440) 269-8585
(617) 932-4748
(440) 269-8585
(612) 946-9510
(704) 583-9100
(314) 997-4558
(913) 469-1312
(801) 264-8050
(319) 377-4666
(408) 988-6300
(602) 804-1290
(617) 932-4748
(617) 932-4748
(602) 804-1290
(440) 269-8585
(617) 932-4748
(704) 583-9100
(612) 946-9510
(440) 269-8585
(440) 269-8585
(503) 642-1661
(440) 269-8585
(617) 932-4748
(617) 932-4748
(704) 583-9100
(612) 946-9510
(704) 583-9100
(440) 269-8585
(801) 264-8050
(617) 932-4748
(440) 269-8585
(206) 885-6991
(440) 269-8585
(440) 269-8585
(440) 269-8585
(801) 264-8050
(416) 292-5161
(915) 772-4020
(809) 783-6544
(809) 783-6544
Philips Components, Willoughby, OH
Criterion Sales, Santa Clara, CA
Harper and Two, Signal Hill, CA
Philips Components, Willoughby, OH
Philips Components, Woburn, MA
Philips Components, Woburn, MA
Over and Over, Charlotte, NC
Over and Over, Charlotte, NC
Hawaii
Harper and Two, Signal Hill, CA
Eclipse Marketing Group, Redmond, WA
Electrodyne, Inc., Salt Lake City, UT
Philips Components, Willoughby, OH
Lorenz Sales, Cedar Rapids, IA
Lorenz Sales, St. Louis, MO
Corrao Marsh, Fort Wayne, IN
Corrao Marsh, Green eld, IN
Lorenz Sales, Cedar Rapids, IA
Lorenz Sales, Overland Park, KS
Lorenz Sales, Wichita, KS
Idaho - Northern
Idaho - Southern
Illinois - Northern
Illinois - Quad Cities
Illinois - Southern
Indiana - Northern
Indiana - Central and Southern
Iowa - All except Quad Cities
Kansas - Northeast
Kansas - All except Northeast
Kentucky
Louisiana
Maine
Maryland
Massachusetts
Michigan
Corrao Marsh, Green eld, IN
Philips Components, Willoughby, OH
Philips Components, Woburn, MA
Philips Components, Willoughby, OH
Philips Components, Woburn, MA
Philips Components, Willoughby, OH
Electronic Component Sales, Minneapolis, MN
Over and Over, Charlotte, NC
Minnesota
Mississippi
Missouri - Eastern
Missouri - Western
Montana
Lorenz Sales, St. Louis, MO
Lorenz Sales, Overland Park, KS
Electrodyne, Inc., Salt Lake City, UT
Lorenz Sales, Cedar Rapids, IA
Criterion Sales, Santa Clara, CA
Harper and Two, Tempe, AZ
Philips Components, Woburn, MA
Philips Components, Woburn, MA
Harper and Two, Tempe, AZ
Nebraska
Nevada - Central and Northern
Nevada - Sourthern
New Hampshire
New Jersey
New Mexico
New York - Western
New York - All other
North Carlolina
North Dakota
Ohio
Oklahoma
Oregon
Pennsylvania - Western
Pennsylvania - Eastern
Rhode Island
South Carolina
South Dakota
Tennesse
Philips Components, Willoughby, OH
Philips Components, Woburn, MA
Over and Over, Charlotte, NC
Electronic Component Sales, Minneapolis, MN
Philips Components, Willoughby, OH
Philips Components, Willoughby, OH
Eclipse Marketing Group, Beaverton, OR
Philips Components, Willoughby, OH
Philips Components, Woburn, MA
Philips Components, Woburn, MA
Over and Over, Charlotte, NC
Electronic Component Sales, Minneapolis, MN
Over and Over, Charlotte, NC
Texas
Utah
Vermont
Virginia
Philips Components, Willoughby, OH
Electrodyne, Inc., Salt Lake City, UT
Philips Components, Woburn, MA
Philips Components, Willoughby, OH
Eclipse Marketing Group, Redmond, WA
Philips Components, Willoughby, OH
Philips Components, Willoughby, OH
Philips Components, Willoughby, OH
Electrodyne, Inc., Salt Lake City, UT
Philips Components, Scarborough, ON
Philips Components, El Paso, TX
Max Anderson Co., Caperra Heights, PR
Max Anderson Co., Caperra Heights, PR
Washington
Washington DC
West Virginia
Wisconsin
Wyoming
Canada
Mexico
Puerto Rico
Virgin Islands
相关型号:
©2020 ICPDF网 联系我们和版权申明