HC05J5AGRS [ETC]
68HC(7)05J5A General Release Specification ; 68HC ( 7 ) 05J5A常规版本规格\n型号: | HC05J5AGRS |
厂家: | ETC |
描述: | 68HC(7)05J5A General Release Specification
|
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中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Freescale Semiconductor, Inc.
HC05J5AGRS/H
REV 2.1
68HC05J5A
68HRC05J5A
68HC705J5A
68HRC705J5A
SPECIFICATION
(General Release)
July 16, 1999
Semiconductor Products Sector
Motorola reserves the right to make changes without further notice to any products herein
to improve reliability, function or design. Motorola does not assume any liability arising out
of the application or use of any product or circuit described herein; neither does it convey
any license under its patent rights nor the rights of others. Motorola products are not
designed, intended, or authorized for use as components in systems intended for surgical
implant into the body, or other applications intended to support or sustain life, or for any
other application in which the failure of the Motorola product could create a situation
where personal injury or death may occur. Should Buyer purchase or use Motorola
products for any such unintended or unauthorized application, Buyer shall indemnify and
hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors
harmless against all claims, costs, damages, and expenses, and reasonable attorney
fees arising out of, directly or indirectly, any claim of personal injury or death associated
with such unintended or unauthorized use, even if such claim alleges that Motorola was
negligent regarding the design or manufacture of the part.
Motorola, Inc., 1999
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GENERAL RELEASE SPECIFICATION
TABLE OF CONTENTS
Section
Page
SECTION 1
GENERAL DESCRIPTION
1.1
1.2
1.3
1.4
FEATURES...................................................................................................... 1-1
MASK OPTIONS.............................................................................................. 1-2
MCU STRUCTURE.......................................................................................... 1-2
PIN ASSIGNMENTS........................................................................................ 1-4
FUNCTIONAL PIN DESCRIPTION.................................................................. 1-4
1.5
1.5.1
1.5.2
1.5.3
1.5.4
1.5.5
1.5.6
V
AND V .............................................................................................. 1-4
DD SS
OSC1, OSC2/R............................................................................................ 1-4
RESET......................................................................................................... 1-6
IRQ (MASKABLE INTERRUPT REQUEST)................................................ 1-6
PA0-PA7...................................................................................................... 1-6
PB0-PB5...................................................................................................... 1-7
SECTION 2
MEMORY
2.1
2.2
2.3
2.4
I/O AND CONTROL REGISTERS ................................................................... 2-2
RAM ................................................................................................................. 2-2
ROM................................................................................................................. 2-2
I/O REGISTERS SUMMARY ........................................................................... 2-3
SECTION 3
CENTRAL PROCESSING UNIT
3.1
3.2
3.3
3.4
3.5
3.6
3.6.1
3.6.2
3.6.3
3.6.4
3.6.5
REGISTERS .................................................................................................... 3-1
ACCUMULATOR (A)........................................................................................ 3-2
INDEX REGISTER (X)..................................................................................... 3-2
STACK POINTER (SP).................................................................................... 3-2
PROGRAM COUNTER (PC) ........................................................................... 3-2
CONDITION CODE REGISTER (CCR)........................................................... 3-3
Half Carry Bit (H-Bit).................................................................................... 3-3
Interrupt Mask (I-Bit).................................................................................... 3-3
Negative Bit (N-Bit)...................................................................................... 3-3
Zero Bit (Z-Bit) ............................................................................................. 3-3
Carry/Borrow Bit (C-Bit)............................................................................... 3-4
SECTION 4
INTERRUPTS
4.1
4.2
4.3
4.4
4.5
4.5.1
CPU INTERRUPT PROCESSING................................................................... 4-1
RESET INTERRUPT SEQUENCE .................................................................. 4-2
SOFTWARE INTERRUPT (SWI)..................................................................... 4-3
HARDWARE INTERRUPTS ............................................................................ 4-3
EXTERNAL INTERRUPT (IRQ)....................................................................... 4-3
IRQ CONTROL/STATUS REGISTER (ICSR) $0A...................................... 4-5
MC68HC05J5A
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TABLE OF CONTENTS
Section
Page
4.5.2
4.5.3
4.5.4
OPTIONAL EXTERNAL INTERRUPTS (PA0-PA3) .................................... 4-6
TIMER INTERRUPT (MFT) ......................................................................... 4-7
TIMER1 INTERRUPT (16-BIT TIMER)........................................................ 4-7
SECTION 5
RESETS
5.1
5.2
5.2.1
5.2.2
5.2.3
5.2.4
EXTERNAL RESET (RESET).......................................................................... 5-2
INTERNAL RESETS........................................................................................ 5-2
POWER-ON RESET (POR) ........................................................................ 5-2
COMPUTER OPERATING PROPERLY RESET (COPR)........................... 5-2
LOW VOLTAGE RESET (LVR) ................................................................... 5-3
ILLEGAL ADDRESS RESET (ILADR)......................................................... 5-3
SECTION 6
LOW POWER MODES
6.1
STOP INSTRUCTION...................................................................................... 6-2
STOP Mode................................................................................................. 6-3
HALT Mode.................................................................................................. 6-3
WAIT INSTRUCTION....................................................................................... 6-4
DATA-RETENTION MODE.............................................................................. 6-4
COP WATCHDOG TIMER CONSIDERATIONS ............................................. 6-4
6.1.1
6.1.2
6.2
6.3
6.4
SECTION 7
INPUT/OUTPUT PORTS
7.1
7.2
SLOW OUTPUT FALLING-EDGE TRANSITION............................................. 7-1
PORT A............................................................................................................ 7-1
Port A Data Register.................................................................................... 7-2
Port A Data Direction Register..................................................................... 7-2
Port A Pulldown/up Register........................................................................ 7-3
Port A Drive Capability................................................................................. 7-3
Port A I/O Pin Interrupts............................................................................... 7-3
PORT B............................................................................................................ 7-4
Port B Data Register.................................................................................... 7-4
Port B Data Direction Register..................................................................... 7-5
Port B Pulldown/up Register........................................................................ 7-5
I/O PORT PROGRAMMING ............................................................................ 7-6
Pin Data Direction........................................................................................ 7-6
Output Pin.................................................................................................... 7-6
Input Pin....................................................................................................... 7-6
I/O Pin Transitions ....................................................................................... 7-7
I/O Pin Truth Tables..................................................................................... 7-7
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.3
7.3.1
7.3.2
7.3.3
7.4
7.4.1
7.4.2
7.4.3
7.4.4
7.4.5
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GENERAL RELEASE SPECIFICATION
TABLE OF CONTENTS
Section
Page
SECTION 8
MULTI-FUNCTION TIMER
8.1
8.2
8.3
8.3.1
8.3.2
8.4
OVERVIEW...................................................................................................... 8-2
COMPUTER OPERATING PROPERLY (COP) WATCHDOG ........................ 8-2
MFT REGISTERS............................................................................................ 8-2
Timer Counter Register (TCR) $09.............................................................. 8-3
Timer Control/Status Register (TCSR) $08 ................................................. 8-3
OPERATION DURING STOP MODE .............................................................. 8-5
OPERATION DURING WAIT/HALT MODE..................................................... 8-5
8.5
SECTION 9
16-BIT TIMER
9.1
9.2
9.3
9.4
9.5
9.6
9.7
TIMER1 COUNTER REGISTERS (TCNTH, TCNTL) ...................................... 9-2
ALTERNATE COUNTER REGISTERS (ACNTH, ACNTL).............................. 9-3
INPUT CAPTURE REGISTERS ...................................................................... 9-5
TIMER1 CONTROL REGISTER (T1CR) ......................................................... 9-8
TIMER1 STATUS REGISTER (T1SR)............................................................. 9-9
TIMER1 OPERATION DURING WAIT MODE................................................. 9-9
TIMER1 OPERATION DURING STOP MODE................................................ 9-9
SECTION 10
INSTRUCTION SET
10.1 ADDRESSING MODES ................................................................................. 10-1
10.1.1 Inherent...................................................................................................... 10-1
10.1.2 Immediate.................................................................................................. 10-1
10.1.3 Direct ......................................................................................................... 10-2
10.1.4 Extended.................................................................................................... 10-2
10.1.5 Indexed, No Offset..................................................................................... 10-2
10.1.6 Indexed, 8-Bit Offset.................................................................................. 10-2
10.1.7 Indexed, 16-Bit Offset................................................................................ 10-3
10.1.8 Relative...................................................................................................... 10-3
10.1.9 Instruction Types ....................................................................................... 10-3
10.1.10 Register/Memory Instructions.................................................................... 10-4
10.1.11 Read-Modify-Write Instructions ................................................................. 10-5
10.1.12 Jump/Branch Instructions .......................................................................... 10-5
10.1.13 Bit Manipulation Instructions...................................................................... 10-7
10.1.14 Control Instructions.................................................................................... 10-7
10.1.15 Instruction Set Summary ........................................................................... 10-8
MC68HC05J5A
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TABLE OF CONTENTS
Section
Page
SECTION 11
ELECTRICAL SPECIFICATIONS
11.1 MAXIMUM RATINGS..................................................................................... 11-1
11.2 THERMAL CHARACTERISTICS................................................................... 11-1
11.3 FUNCTIONAL OPERATING RANGE ............................................................ 11-1
11.4 DC ELECTRICAL CHARACTERISTICS........................................................ 11-2
11.5 CONTROL TIMING........................................................................................ 11-5
SECTION 12
MECHANICAL SPECIFICATIONS
12.1 16-PIN PDIP (CASE #648) ............................................................................ 12-1
12.2 16-PIN SOIC (CASE #751G) ......................................................................... 12-1
12.3 20-PIN PDIP (CASE #738) ............................................................................ 12-2
12.4 20-PIN SOIC (CASE #751D) ......................................................................... 12-2
APPENDIX A
MC68HRC05J5A
A.1 INTRODUCTION..............................................................................................A-1
A.2 RC OSCILLATOR CONNECTIONS.................................................................A-1
A.3 ELECTRICAL CHARACTERISTICS................................................................A-2
APPENDIX B
MC68HC705J5A
B.1 INTRODUCTION..............................................................................................B-1
B.2 MEMORY.........................................................................................................B-1
B.3 MASK OPTION REGISTERS (MOR)...............................................................B-1
B.4 BOOTSTRAP MODE .......................................................................................B-4
B.5 EPROM PROGRAMMING...............................................................................B-4
B.5.1
B.5.2
EPROM Program Control Register (PCR)...................................................B-4
Programming Sequence..............................................................................B-5
B.6 ELECTRICAL CHARACTERISTICS................................................................B-6
APPENDIX C
MC68HRC705J5A
C.1 INTRODUCTION..............................................................................................C-1
C.2 RC OSCILLATOR CONNECTIONS.................................................................C-1
C.3 ELECTRICAL CHARACTERISTICS................................................................C-2
APPENDIX D
ORDERING INFORMATION
D.1 MC ORDER NUMBERS...................................................................................D-1
MOTOROLA
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GENERAL RELEASE SPECIFICATION
LIST OF FIGURES
Title
Figure
Page
1-1
1-2
1-3
2-1
2-2
2-3
2-4
3-1
4-1
4-2
4-3
5-1
6-1
7-1
7-2
7-3
8-1
8-2
8-3
8-4
9-1
9-2
9-3
9-4
9-5
9-6
9-7
9-8
9-9
MC68HC05J5A Block Diagram........................................................................ 1-3
Pin Assignments for 16-Pin and 20-Pin Packages........................................... 1-4
Oscillator Connections ..................................................................................... 1-5
MC68HC05J5A Memory Map .......................................................................... 2-1
I/O Registers Memory Map .............................................................................. 2-2
I/O Registers $0000-$000F.............................................................................. 2-3
I/O Registers $0010-$001F.............................................................................. 2-4
MC68HC05 Programming Model..................................................................... 3-1
Interrupt Processing Flowchart ........................................................................ 4-2
IRQ Function Block Diagram............................................................................ 4-3
IRQ Status & Control Register ......................................................................... 4-5
Reset Block Diagram ....................................................................................... 5-1
STOP/HALT/WAIT Flowcharts......................................................................... 6-2
Port B Data Direction Register......................................................................... 7-1
Port A I/O Circuitry ........................................................................................... 7-2
Port B I/O Circuitry ........................................................................................... 7-4
Multi-Function Timer Block Diagram................................................................ 8-1
COP Watchdog Timer Location ....................................................................... 8-2
Timer Counter Register.................................................................................... 8-3
Timer Control/Status Register (TCSR)............................................................. 8-3
16-Bit Timer Block Diagram ............................................................................. 9-1
16-Bit Timer Counter Block Diagram ............................................................... 9-2
16-Bit Timer Counter Registers (TCNTH, TCNTL) .......................................... 9-3
Alternate Counter Block Diagram..................................................................... 9-4
Alternate Counter Registers (ACNTH, ACNTL) ............................................... 9-4
Timer Input Capture Block Diagram................................................................. 9-5
Timer1 Capture Control Register ..................................................................... 9-6
TCAP Input Signal Conditioning....................................................................... 9-6
TCAP Input Comparator Output....................................................................... 9-7
9-10 Input Capture Registers (ICH, ICL).................................................................. 9-7
9-11 Timer Control Register (T1CR) ........................................................................ 9-8
9-12 Timer Status Registers (T1SR)........................................................................ 9-9
12-1 16-Pin PDIP Mechanical Dimensions ............................................................ 12-1
12-2 16-Pin SOIC Mechanical Dimensions............................................................ 12-1
12-3 20-Pin PDIP Mechanical Dimensions ............................................................ 12-2
12-4 20-Pin SOIC Mechanical Dimensions............................................................ 12-2
A-1 RC Oscillator Connections...............................................................................A-1
A-2 Typical Internal Operating Frequency for RC Oscillator Connections..............A-2
B-1 MC68HC705J5A Memory Map ........................................................................B-3
B-2 EPROM Programming Sequence ....................................................................B-5
C-1 RC Oscillator Connections...............................................................................C-1
C-2 Typical Internal Operating Frequency for RC Oscillator Connections..............C-2
MC68HC05J5A
REV 2.1
MOTOROLA
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LIST OF FIGURES
Title
Figure
Page
MOTOROLA
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MC68HC05J5A
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GENERAL RELEASE SPECIFICATION
LIST OF TABLES
Title
Table
Page
4-1
6-1
7-1
7-2
8-1
Vector Address for Interrupts and Reset.......................................................... 4-1
COP Watchdog Timer Recommendations....................................................... 6-5
Port A I/O Pin Functions................................................................................... 7-7
Port B I/O Pin Functions................................................................................... 7-7
RTI Rates and COP Reset Times.................................................................... 8-5
10-1 Register/Memory Instructions ........................................................................ 10-4
10-2 Read-Modify-Write Instructions ..................................................................... 10-5
10-3 Jump and Branch Instructions........................................................................ 10-6
10-4 Bit Manipulation Instructions .......................................................................... 10-7
10-5 Control Instructions ........................................................................................ 10-7
10-6 Instruction Set Summary ............................................................................... 10-8
10-7 Opcode Map................................................................................................. 10-14
11-1 DC Electrical Characteristics, VDD=5 V ........................................................ 11-2
11-2 DC Electrical Characteristics, VDD=2.2V ..................................................... 11-3
11-3 Control Timing, VDD=5V............................................................................... 11-5
11-4 Control Timing, VDD=2.2V............................................................................ 11-5
A-1 Functional Operating Range ............................................................................A-2
A-2 DC Electrical Characteristics, VDD=5V...........................................................A-2
B-1 Functional Operating Range ............................................................................B-6
B-2 EPROM Programming Electrical Characteristics.............................................B-6
B-3 DC Electrical Characteristics, VDD=5 V ..........................................................B-6
C-1 Functional Operating Range ............................................................................C-2
C-2 DC Electrical Characteristics, VDD=5 V ..........................................................C-2
D-1 MC Order Numbers..........................................................................................D-1
MC68HC05J5A
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LIST OF TABLES
Title
Table
Page
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GENERAL RELEASE SPECIFICATION
SECTION 1
GENERAL DESCRIPTION
The MC68HC05J5A is a member of the low-cost high-performance M68HC05
Family of 8-bit microcontroller units (MCUs). The M68HC05 Family is based on
the customer-specified integrated circuit design strategy. All MCUs in the family
use the popular M68HC05 central processing unit (CPU) and are available with a
variety of subsystems, memory sizes and types, and package types.
The MC68HC05J5A is an enhanced version of the MC68HC05J5, with expanded
RAM, ROM sizes, and an additional 16-bit timer with TCAP. This MCU is available
in 20-pin PDIP, 20-pin SOIC, 16-pin PDIP, and 16-pin SOIC packages. The 16-pin
version has four less I/O lines.
Three variation on the MC68HC05J5A device are available; a summary of their
differences are listed in the following table:
DEVICE
ROM TYPE
2560 bytes ROM
2560 bytes ROM
2560 bytes EPROM
2560 bytes EPROM
OSCILLATOR OPTION
Crystal/resonator or external clock oscillator
RC oscillator
REFERENCE
—
MC68HC05J5A
MC68HRC05J5A
MC68HC705J5A
MC68HRC705J5A
Appendix A
Appendix B
Appendix C
Crystal/resonator or external clock oscillator
RC oscillator
1.1
FEATURES
The features of the MC68HC05J5A include the following:
•
•
•
•
•
•
•
Industry standard M68HC05 CPU core
Fully static operation with no minimum clock speed
Power-saving STOP and WAIT modes
Memory-Mapped Input/Output (I/O) registers
2560 Bytes of user ROM with security feature
128 Bytes of user RAM
On-Chip Oscillator:
– Crystal/Resonator oscillator
– External clock oscillator
•
•
15-Bit Multi-function Timer
16-Bit Programmable Timer with Input Capture
MC68HC05J5A
REV 2.1
GENERAL DESCRIPTION
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•
14 Bidirectional I/O pins (10 I/O pins on 16-pin package)
– PA0-PA5, PB0, and PB3-PB5: with software programmable input pull-
down devices
– PB1, PB2, PA6 and PA7: open-drained I/O pins with software
programmable pull-up devices
– PA6, PA7, and PB1: with slow output falling transition feature
– PA7: with falling-edge interrupt capability
– PA0-PA3: with maskable rising-edge only or rising-edge and high
level interrupt capability
– 20-pin package: PB1 and PB2, each with 25mA current sink
capability
– 16-pin package: PB1 with 50mA current sink capability
Computer Operation Properly (COP) Watchdog
Low Voltage Reset Circuit
•
•
•
•
Illegal Address Reset
20-pin PDIP, 20-pin SOIC, 16-pin PDIP, and 16-pin SOIC packages
1.2
MASK OPTIONS
The following mask options are available on the MC68HC05J5A:
MASK
OPTION
STOP instruction convert to WAIT
External interrupt pins (IRQ, PA0-PA3)
Port A and Port B pull-down/pull-up resistors
PA0-PA3 external interrupt capability
Oscillator Delay Option (internal clock cycles)
Low Voltage Reset
[Enabled] or [Disabled]
[Edge-triggered] or [Edge and level triggered]
[Enabled] or [Disabled]
[Enabled] or [Disabled]
[224] or [4064]
[Enabled] or [Disabled]
COP Watchdog Timer
[Enabled] or [Disabled]
1.3
MCU STRUCTURE
Figure 1-1 shows the structure of MC68HC05J5A MCU.
MOTOROLA
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GENERAL DESCRIPTION
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OSC1 OSC2/R
RESET
IRQ
PA0①
PA1①
PA2①
PA3①
PA4②
PA5②
PA6③
PA7④
CORE
TIMER
(COP)
OSCILLATOR
AND DIVIDE
BY 2
LOW
VOLTAGE
RESET
PORT
A
REG
DATA
DIR
REG
16-BIT
TIMER
TCAP⑤
CPU CONTROL
68HC05 CPU
ALU
VDD
PB0⑤
PB1⑥
PB2⑥⑦
PB3⑦
PB4⑦
PB5⑦
VSS
PORT
B
REG
DATA
DIR
REG
ACCUM
INDEX REG
STK PTR
CPU REGISERS
0 0 0 0 0 0 0 0 1 1
PROGRAM COUNTER
①
: External edge interrupt capability
: 8 mA current sink
: Open-drained with internal pull-up and
8 mA current sink
COND CODE REG 1 1 1 H I N Z C
②
③
④: External interrupt capability, open-drained
with internal pull-up and 8 mA current sink
⑤: Shared pin: PB0/TCAP
⑥
: 25 mA current sink open-drained with
internal pull-up
2560 BYTES
ROM
128 BYTES
RAM
⑦: not bonded out in 16-pin package
Figure 1-1. MC68HC05J5A Block Diagram
MC68HC05J5A
REV 2.1
GENERAL DESCRIPTION
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1.4
PIN ASSIGNMENTS
1
16
15
14
13
12
11
10
9
PB3
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
OSC2/R
PB1
VDD
VSS
PB2
2
3
4
5
6
7
8
PB1
OSC1
RESET
PA7
OSC2/R
OSC1
RESET
PA7
VDD
VSS
IRQ/VPP
PA0
IRQ/VPP
PA0
PA6
PA5
PA1
PA6
PA4
PA1
PA2
PA5
PB0/TCAP
PA2
PA3
PA4
PA3
PB0/TCAP
PB4
PB5
IRQ/VPP: VPP is only available on EPROM parts
Figure 1-2. Pin Assignments for 16-Pin and 20-Pin Packages
FUNCTIONAL PIN DESCRIPTION
1.5
The following paragraphs give a description of the general function of each pin
assigned in Figure 1-2.
1.5.1 V AND V
DD
SS
Power is supplied to the MCU through V
and V . V
is the positive supply,
DD
SS DD
and V is ground. The MCU operates from a single power supply.
SS
Very fast signal transitions occur on the MCU pins. The short rise and fall times
place very high short-duration current demands on the power supply. To prevent
noise problems, special care should be taken to provide good power supply
bypassing at the MCU by using bypass capacitors with good high-frequency char-
acteristics that are positioned as close to the MCU as possible. Bypassing
requirements vary, depending on how heavily the MCU pins are loaded.
1.5.2 OSC1, OSC2/R
The OSC1 and OSC2/R pins are the connections for the on-chip oscillator. The
OSC1 and OSC2/R pins can accept the following sets of components:
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GENERAL DESCRIPTION
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1. A crystal as shown in Figure 1-3(a)
2. A ceramic resonator as shown in Figure 1-3(a)
3. An external clock signal as shown in Figure 1-3(b)
The frequency, f
, of the oscillator or external clock source is divided by two to
OSC
produce the internal operating frequency, f
.
OP
Crystal Oscillator
The circuit in Figure 1-3(a) shows a typical oscillator circuit for an AT-cut, parallel
resonant crystal. The crystal manufacturer’s recommendations should be fol-
lowed, as the crystal parameters determine the external component values
required to provide maximum stability and reliable start-up. The load capacitance
values used in the oscillator circuit design should include all stray capacitances.
The crystal and components should be mounted as close as possible to the pins
for start-up stabilization and to minimize output distortion. An internal start-up
resistor is provided between OSC1 and OSC2/R for the crystal type oscillator.
MCU
MCU
R
OSC
OSC2/R
OSC1
OSC1 OSC2/R
unconnected
37pF
37 pF
External Clock
(a) Crystal or ceramic
resonator connection
(b) External clock source
connection
R
: see Section 11. Electrical Specifications.
OSC
Figure 1-3. Oscillator Connections
Ceramic Resonator Oscillator
In cost-sensitive applications, a ceramic resonator can be used in place of the
crystal. The circuit in Figure 1-3(a) can be used for a ceramic resonator. The res-
onator manufacturer’s recommendations should be followed, as the resonator
parameters determine the external component values required for maximum sta-
bility and reliable starting. The load capacitance values used in the oscillator cir-
cuit design should include all stray capacitances. The ceramic resonator and
components should be mounted as close as possible to the pins for start-up stabi-
lization and to minimize output distortion. An internal start-up resistor is provided
between OSC1 and OSC2/R for the ceramic resonator type oscillator.
External Clock
An external clock from another CMOS-compatible device can be connected to the
OSC1 input, with the OSC2/R input not connected, as shown in Figure 1-3(b).
MC68HC05J5A
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1.5.3 RESET
This is an I/O pin. This pin can be used as an input to reset the MCU to a known
start-up state by pulling it to the low state. The RESET pin contains a steering
diode to discharge any voltage on the pin to V , when the power is removed. An
DD
internal pull-up is also connected between this pin and V . The RESET pin con-
DD
tains an internal Schmitt trigger to improve its noise immunity as an input. This pin
is an output pin if LVR triggers an internal reset.
1.5.4 IRQ (MASKABLE INTERRUPT REQUEST)
This input pin drives the asynchronous IRQ interrupt function of the CPU. The IRQ
interrupt function has a mask option to provide either only negative edge-sensitive
triggering or both negative edge-sensitive and low level-sensitive triggering. If the
option is selected to include level-sensitive triggering, the IRQ input requires an
external resistor to V for "wired-OR" operation, if desired. The IRQ pin contains
DD
an internal Schmitt trigger as part of its input to improve noise immunity.
Each of the PA0 through PA3 I/O pins may be connected as an OR function with
the IRQ interrupt function by a mask option. This capability allows keyboard scan
applications where the transitions or levels on the I/O pins will behave the same
as the IRQ pin, except for the inverted phase. The edge or level sensitivity
selected by a separate mask option for the IRQ pin also applies to the I/O pins
OR’ed to create the IRQ signal. Besides, PA7 also has falling-edge only interrupt
capability whose functionality is controlled by another set of register bits.
1.5.5 PA0-PA7
These eight I/O lines comprise Port A. PA6 and PA7 are open-drained pins with
pull-up devices whereas PA0 to PA5 are push-pull pins with pull-down devices.
PA4 to PA7 are also capable of sinking 8mA.
The state of any pin is software programmable and all Port A lines are configured
as inputs during power-on or reset. The lower four I/O pins (PA0 to PA3) can be
connected via an internal OR gate to the IRQ interrupt function enabled by a mask
option. Another independent interrupt source comes from the falling-edge on PA7.
PA7 interrupt source is associated with a second set of interrupt control/status
bits. All Port A pins except PA6 and PA7 have software programmable pull-down
devices also provided by a mask option. PA6 and PA7 pins have software
programmable pull-up devices also provided by the same mask option. Pull-up
devices on PA6 and PA7 once enabled are always enabled regardless of pin
direction configuration, unlike pull-down devices on PA0 to PA5 which are
activated only when these pins are configured as input pins.
PA6 and PA7 pins, when configured as output pins, also have slow output falling-
edge transition feature to reduce EMI. The falling-edge transition time is set at
250ns typical at a specified load of 500pF, assuming the bus rate is 2MHz. The
slow transition output feature of PA6 and PA7, along with that of PB1 and PB2,
MOTOROLA
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can be enabled or disabled by software. Both PA6 and PA7 pins have Schmitt
trigger input for better noise immunity. V and V are specified at 2.4V and 0.8V,
IH
IL
respectively.
The slow transition feature of PA6 and PA7 pins can be enabled or disabled by
software. Once enabled, slow transition feature is applied to both pins while in
output mode.
1.5.6 PB0-PB5
NOTE
I/O lines PB2 to PB5 are not available on the 16-pin package.
These six I/O lines comprise Port B. PB0, PB3 to PB5 are push-pull I/O lines with
pull-down resistor. PB1 and PB2 are open-drain I/O lines with pull-up resistor.
The state of any line is software programmable and is configured as an input
during power-on or reset. I/O lines PB1 and PB2 have software programmable
pull-up device, whereas PB0, PB3 to PB5 have software programmable pull-down
device, provided by mask option. Pull-up devices on PB1 and PB2 lines once
enabled are always enabled regardless of pin direction configuration; unlike pull-
down devices on PB0, PB3-PB5 lines, which are activated only when the pin is
configured as input pin.
Similar to PA6 and PA7, PB1 also has a slow output falling transition feature when
configured as an output line. PB1 has 25mA sink capability at 0.5V V .
OL
PB2 output is one clock cycle (250ns if bus rate is 2MHz) late than other I/O pins
if slow output transition feature is enabled. PB2 has 25mA sink capability at 0.5V
V .
OL
NOTE
For the 16-pin package, PB1 and PB2 are bonded to the same pin and is labelled
PB1. This PB1 pin has 50mA sink capability if PB1 and PB2 data register bits they
are written with the same value at the same write cycle. The falling transition time
of PB1 is set at 250ns typical at a specified load of 50pF, assuming that the bus
rate is 2MHz. The slow transition feature on this PB1 pin is longer than PB1 pin for
the 20-pin package.
NOTE
If Port Data Register PB1 and PB2 are not written with the same value, PB1 pin
on the 16-pin package will sink 25mA only and the output transition time will be
shorter.
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MOTOROLA
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SECTION 2
MEMORY
The MC68HC05J5A has 4K-bytes of addressable memory consisting 32 bytes of
I/O, 128 bytes of user RAM, and 2560 bytes of user ROM, as shown in
Figure 2-1.
$0000
0000
$0000
I/O
32 Bytes
I/O
Registers
$001F
$0020
0031
0032
32 bytes
(see Figure 2-2)
unimplemented
96 Bytes
$007F
$0080
0127
0128
$001F
User RAM 128 Bytes
Stack
$00C0
$00FF
$0100
0192
0255
0256
COP Watchdog Timer*
Reserved
$0FF0
$0FF1
$0FF2
$0FF3
$0FF4
$0FF5
$0FF6
$0FF7
$0FF8
$0FF9
$0FFA
$0FFB
$0FFC
$0FFD
$0FFE
$0FFF
unimplemented
512 Bytes
Reserved
0767
0768
$02FF
$0300
Reserved
Reserved
Reserved
User ROM
2560 Bytes
Timer1 Vector (High Byte)
Timer1 Vector (Low Byte)
MFT Vector (High Byte)
MFT Vector (Low Byte)
IRQ Vector (High Byte)
IRQ Vector (Low Byte)
SWI Vector (High Byte)
SWI Vector (Low Byte)
Reset Vector (High Byte)
Reset Vector (Low Byte)
3327
3328
$0CFF
$0D00
unimplemented
256 Bytes
$0DFF
$0E00
3583
3584
Internal Test & Vectors
496 Bytes ROM
$0FEF
$0FF0
4079
4080
ROM Reserved
6 Bytes
$0FF5
$0FF6
$0FFF
4085
4086
User Vectors ROM
10 Bytes
* Writing a 0 to bit 0 of $0FF0 clears the COP Timer.
Reading $0FF0 returns ROM data.
4095
Figure 2-1. MC68HC05J5A Memory Map
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2.1
I/O AND CONTROL REGISTERS
The I/O and Control Registers reside in locations $0000-$001F. The overall orga-
nization of these registers is shown in Figure 2-2. The bit assignments for each
register are shown in Figure 2-3 and Figure 2-4. Reading from unimplemented
bits will return unknown states, and writing to unimplemented bits will be ignored.
Port A Data Register
Port B Data Register
$0000
$0001
Timer1 Capture Control Register
$0002
$0003
$0004
$0005
unimplemented (1)
Port A Data Direction Register
Port B Data Direction Register
unimplemented (2)
MFT Control & Status Register
MFT Counter Register
$0008
$0009
$000A
IRQ Control & Status Register
unimplemented (5)
Port A Pulldown/up Register
Port B Pulldown/up Register
$0010
$0011
$0012
Timer1 Registers (4)
unimplemented (2)
Timer1 Registers (4)
$0015
$0018
$001B
unimplemented (3)
Reserved
$001E
$001F
Reserved for Test
Figure 2-2. I/O Registers Memory Map
2.2
2.3
RAM
The total RAM consists of 128 bytes (including the stack) at locations $0080
through $00FF. The stack begins at address $00FF and proceeds down to $00C0.
Using the stack area for data storage or temporary work locations requires care to
prevent it from being overwritten due to stacking from an interrupt or subroutine
call.
ROM
There are a total of 2570 bytes of user ROM on-chip. This includes 2560 bytes of
user ROM from locations $0300 to $0CFF for user program storage and 10 bytes
for user vectors from locations $0FF6 to $0FFF.
MOTOROLA
2-2
MEMORY
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2.4
I/O REGISTERS SUMMARY
ADDR
REGISTER
Port A Data
PORTA
R/W BIT 7 BIT 6 BIT 5 BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
R
$0000
PA7
0
PA6
0
PA5
PB5
PA4
PB4
PA3
PA2
PA1
PA0
W
R
Port B Data
PORTB
$0001
$0002
$0003
$0004
$0005
$0006
$0007
$0008
$0009
$000A
$000B
$000C
$000D
$000E
$000F
PB3
PB2
PB1
PB0
W
R
Timer1 Capture Control
T1CC
TCAPS
W
R
Unimplemented
W
R
Port A Data Direction
DDRA
DDRA7 DDRA6 DDRA5 DDRA4 DDRA3 DDRA2 DDRA1 DDRA0
0
W
R
Port B Data Direction
DDRB
SLOWE
DDRB5 DDRB4 DDRB3 DDRB2 DDRB1 DDRB0
W
R
Unimplemented
Unimplemented
W
R
W
R
MFT Ctrl/Status
TCSR
TOF
RTIF
0
0
TOFE
TMR5
RTIE
RT1
RT0
W
R
TOFR
TMR3
RTIFR
TMR2
MFT Counter
TCR
TMR7
TMR6
TMR4
TMR1
TMR0
W
R
IRQ Control/Status
ICSR
0
0
IRQF
IRQF1
0
0
IRQE
IRQE1
W
R
R
IRQR
IRQR1
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
W
R
W
R
W
R
W
R
W
unimplemented bits
reserved bits
R
Figure 2-3. I/O Registers $0000-$000F
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ADDR
REGISTER
Port A Pull-down/up
PDURA
R/W BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
R
$0010
W
R
PURA7 PURA6 PDRA5 PDRA4 PDRA3 PDRA2 PDRA1 PDRA0
Port B Pull-down/up
PDURB
$0011
$0012
$0013
$0014
$0015
$0016
$0017
$0018
$0019
$001A
$001B
$001C
$001D
$001E
$001F
W
R
PDRB5 PDRB4 PDRB3 PURB2 PURB1 PDRB0
Timer1 Control
T1CR
0
0
0
0
0
0
0
0
0
ICIE
ICF
T1OIE
T1OF
IEDGE
0
W
R
Timer1 Status
T1SR
0
W
R
Input Capture High
ICH
BIT15
BIT7
BIT14
BIT6
BIT13
BIT5
BIT12
BIT4
BIT11
BIT3
BIT10
BIT2
BIT9
BIT1
BIT8
BIT0
W
R
Input Capture Low
ICL
W
R
Unimplemented
Unimplemented
W
R
W
R
Timer1 Counter High
TCNTH
BIT15
BIT7
BIT14
BIT6
BIT13
BIT5
BIT12
BIT4
BIT11
BIT3
BIT10
BIT2
BIT9
BIT1
BIT9
BIT1
BIT8
BIT0
BIT8
BIT0
W
R
Timer1 Counter Low
TCNTL
W
R
Alt. Counter High
ACNTH
BIT15
BIT7
BIT14
BIT6
BIT13
BIT5
BIT12
BIT4
BIT11
BIT3
BIT10
BIT2
W
R
Alt. Counter Low
ACNTL
W
R
Unimplemented
Unimplemented
Reserved
W
R
W
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
W
R
Reserved
W
unimplemented bits
reserved bits
R
Figure 2-4. I/O Registers $0010-$001F
MOTOROLA
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MEMORY
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SECTION 3
CENTRAL PROCESSING UNIT
The MC68HC05J5A has an 4k-bytes memory map. The stack has only 64 bytes.
Therefore, the stack pointer has been reduced to only 6 bits and will only
decrement down to $00C0 and then wrap-around to $00FF. All other instructions
and registers behave as described in this chapter.
3.1
REGISTERS
The MCU contains five registers which are hard-wired within the CPU and are not
part of the memory map. These five registers are shown in Figure 3-1 and are
described in the following paragraphs.
7
6
5
4
3
2
1
0
ACCUMULATOR
INDEX REGISTER
A
X
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
1
1
STACK POINTER
SP
PC
CC
PROGRAM COUNTER
CONDITION CODE REGISTER
1
1
1
H
I
N
Z
C
HALF-CARRY BIT (FROM BIT 3)
INTERRUPT MASK
NEGATIVE BIT
ZERO BIT
CARRY BIT
Figure 3-1. MC68HC05 Programming Model
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3.2
ACCUMULATOR (A)
The accumulator is a general purpose 8-bit register as shown in Figure 3-1. The
CPU uses the accumulator to hold operands and results of arithmetic calculations
or non-arithmetic operations. The accumulator is not affected by a reset of the
device.
3.3
INDEX REGISTER (X)
The index register shown in Figure 3-1 is an 8-bit register that can perform two
functions:
•
•
Indexed addressing
Temporary storage
In indexed addressing with no offset, the index register contains the low byte of
the operand address, and the high byte is assumed to be $00. In indexed
addressing with an 8-bit offset, the CPU finds the operand address by adding the
index register content to an 8-bit immediate value. In indexed addressing with a
16-bit offset, the CPU finds the operand address by adding the index register
content to a 16-bit immediate value.
The index register can also serve as an auxiliary accumulator for temporary
storage. The index register is not affected by a reset of the device.
3.4
STACK POINTER (SP)
The stack pointer shown in Figure 3-1 is a 16-bit register. In MCU devices with
memory space less than 64k-bytes the unimplemented upper address lines are
ignored. The stack pointer contains the address of the next free location on the
stack. During a reset or the reset stack pointer (RSP) instruction, the stack pointer
is set to $00FF. The stack pointer is then decremented as data is pushed onto the
stack and incremented as data is pulled off the stack.
When accessing memory, the ten most significant bits are permanently set to
0000000011. The six least significant register bits are appended to these ten fixed
bits to produce an address within the range of $00FF to $00C0. Subroutines and
interrupts may use up to 64($C0) locations. If 64 locations are exceeded, the
stack pointer wraps around and overwrites the previously stored information. A
subroutine call occupies two locations on the stack and an interrupt uses five
locations.
3.5
PROGRAM COUNTER (PC)
The program counter shown in Figure 3-1 is a 16-bit register. In MCU devices
with memory space less than 64k-bytes the unimplemented upper address lines
are ignored. The program counter contains the address of the next instruction or
operand to be fetched.
MOTOROLA
3-2
CENTRAL PROCESSING UNIT
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Normally, the address in the program counter increments to the next sequential
memory location every time an instruction or operand is fetched. Jump, branch,
and interrupt operations load the program counter with an address other than that
of the next sequential location.
3.6
CONDITION CODE REGISTER (CCR)
The CCR shown in Figure 3-1 is a 5-bit register in which four bits are used to
indicate the results of the instruction just executed. The fifth bit is the interrupt
mask. These bits can be individually tested by a program, and specific actions can
be taken as a result of their states. The condition code register should be thought
of as having three additional upper bits that are always ones. Only the interrupt
mask is affected by a reset of the device. The following paragraphs explain the
functions of the lower five bits of the condition code register.
3.6.1 Half Carry Bit (H-Bit)
When the half-carry bit is set, it means that a carry occurred between bits 3 and 4
of the accumulator during the last ADD or ADC (add with carry) operation. The
half-carry bit is required for binary-coded decimal (BCD) arithmetic operations.
3.6.2 Interrupt Mask (I-Bit)
When the interrupt mask is set, the internal and external interrupts are disabled.
Interrupts are enabled when the interrupt mask is cleared. When an interrupt
occurs, the interrupt mask is automatically set after the CPU registers are saved
on the stack, but before the interrupt vector is fetched. If an interrupt request
occurs while the interrupt mask is set, the interrupt request is latched. Normally,
the interrupt is processed as soon as the interrupt mask is cleared.
A return from interrupt (RTI) instruction pulls the CPU registers from the stack,
restoring the interrupt mask to its state before the interrupt was encountered. After
any reset, the interrupt mask is set and can only be cleared by the Clear I-Bit
(CLI), or WAIT instructions.
3.6.3 Negative Bit (N-Bit)
The negative bit is set when the result of the last arithmetic operation, logical
operation, or data manipulation was negative. (Bit 7 of the result was a logical
one.)
The negative bit can also be used to check an often tested flag by assigning the
flag to bit 7 of a register or memory location. Loading the accumulator with the
contents of that register or location then sets or clears the negative bit according
to the state of the flag.
3.6.4 Zero Bit (Z-Bit)
The zero bit is set when the result of the last arithmetic operation, logical
operation, data manipulation, or data load operation was zero.
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3.6.5 Carry/Borrow Bit (C-Bit)
The carry/borrow bit is set when a carry out of bit 7 of the accumulator occurred
during the last arithmetic operation, logical operation, or data manipulation. The
carry/borrow bit is also set or cleared during bit test and branch instructions and
during shifts and rotates.This bit is neither set by an INC nor by a DEC instruction.
MOTOROLA
3-4
CENTRAL PROCESSING UNIT
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SECTION 4
INTERRUPTS
The MCU can be interrupted in six different ways:
•
•
•
•
•
•
Non-maskable Software Interrupt Instruction (SWI)
External Asynchronous Interrupt (IRQ)
Optional External Interrupt via IRQ on PA0-PA3 (by a mask option)
External Interrupt via IRQ on PA7
Multi-Function Timer (MFT)
16-Bit Timer Interrupt (Timer1)
4.1
CPU INTERRUPT PROCESSING
Interrupts cause the processor to save register contents on the stack and to set
the interrupt mask (I-bit) to prevent additional interrupts. Unlike RESET, hardware
interrupts do not cause the current instruction execution to be halted, but are con-
sidered pending until the current instruction is complete.
If interrupts are not masked (I-bit in the CCR is clear) and the corresponding inter-
rupt enable bit is set the processor will proceed with interrupt processing. Other-
wise, the next instruction is fetched and executed. If an interrupt occurs the
processor completes the current instruction, then stacks the current CPU register
states, sets the I-bit to inhibit further interrupts, and finally checks the pending
hardware interrupts. If more than one interrupt is pending following the stacking
operation, the interrupt with the highest vector location shown in Table 4-1 will be
serviced first. The SWI is executed the same as any other instruction, regardless
of the I-bit state.
When an interrupt is to be processed the CPU fetches the address of the appro-
priate interrupt software service routine from the vector table at locations $0FF6
thru $0FFF as defined in Table 4-1.
Table 4-1. Vector Address for Interrupts and Reset
Flag
CPU
Register
Name
Interrupts
Interrupt
Vector Address
N/A
N/A
ICSR
TCSR
TCSR
T1SR
N/A
N/A
Reset
Software
RESET
SWI
IRQ
MFT
MFT
$0FFE-$0FFF
$0FFC-$0FFD
$0FFA-$0FFB
$0FF8-$0FF9
$0FF8-$0FF9
$0FF6-$0FF7
IRQF/IRQF1 External Interrupt
TOF
RTIF
T1OF, ICF
MFT Overflow
Real Time Interrupt
Timer1 Interrupt
TIMER1
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An RTI instruction is used to signify when the interrupt software service routine is
completed. The RTI instruction causes the register contents to be recovered from
the stack and normal processing to resume at the next instruction that was to be
executed when the interrupt took place. Figure 4-1 shows the sequence of events
that occur during interrupt processing.
From
RESET
Is
I-Bit
Y
Set?
N
IRQ
External
Interrupt?
Clear IRQ
Request
Latch if IRQE1 is
cleared
Y
Y
N
TIMER
Internal
Interrupt?
Stack PC, X, A, CC
Set I-Bit in CCR
N
Fetch Next
Instruction
Load PC From:
SWI: $0FFC, $0FFD
IRQ: $0FFA-$0FFB
TIMER: $0FF8-$0FF9
TIMER1: $0FF6-$0FF7
SWI
Instruction
?
Y
Y
N
RTI
Instruction
?
Restore Registers
from stack
N
CC, A, X, PC
Execute
Instruction
Figure 4-1. Interrupt Processing Flowchart
RESET INTERRUPT SEQUENCE
4.2
The RESET function is not in the strictest sense an interrupt; however, it is acted
upon in a similar manner as shown in Figure 4-1. A low level input on the RESET
pin or an internally generated RST signal causes the program to vector to its start-
ing address which is specified by the contents of memory locations $0FFE and
$0FFF. The I-bit in the condition code register is also set.
MOTOROLA
4-2
INTERRUPTS
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4.3
SOFTWARE INTERRUPT (SWI)
The SWI is an executable instruction and a non-maskable interrupt since it is exe-
cuted regardless of the state of the I-bit in the CCR. As with any instruction, inter-
rupts pending during the previous instruction will be serviced before the SWI
opcode is fetched. The interrupt service routine address is specified by the con-
tents of memory locations $0FFC and $0FFD.
4.4
4.5
HARDWARE INTERRUPTS
All hardware interrupts except RESET are maskable by the I-bit in the CCR. If the
I-bit is set, all hardware interrupts (internal and external) are disabled. Clearing
the I-bit enables the hardware interrupts. There are two types of hardware inter-
rupts which are explained in the following sections.
EXTERNAL INTERRUPT (IRQ)
The IRQ pin provides an asynchronous interrupt to the CPU. A block diagram of
the IRQ function is shown in Figure 4-2.
to BIH & BIL
instruction
sensing
IRQ Pin
PA0
V
DD
PA1
PA2
PA3
IRQ
LATCH
IRQF
R
Mask Option
(Port A External Int.)
RST
IRQR
Mask Option
(IRQ Level)
IRQ Fetch Vector
IRQE1
IRQE
to IRQ
processing
in CPU
IRQE1
V
DD
IRQF1
IRQ1
LATCH
PA7
R
RST
IRQR1
Figure 4-2. IRQ Function Block Diagram
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The IRQ pin is a source of IRQ interrupts and a mask option can also enable the
other four lower Port A pins (PA0 thru PA3) to act as other IRQ interrupt sources.
The last source of IRQ interrupt comes from PA7 whenever there is a falling edge
on PA7 and IRQE1 is enabled. There is no mask option associated with PA7 inter-
rupt.
Refer to Figure 4-2 for the following descriptions. IRQ interrupt source comes
from IRQ and IRQ1 latches. The IRQ latch will be set on the falling edge of the
IRQ pin or on any rising edge of PA0-3 pins if PA0-3 interrupts have been enabled.
The IRQ1 latch will be set on the falling edge of PA7 if PA7 interrupt has been
enabled. If "edge-only" sensitivity is chosen by a mask option, only the IRQ latch
output can activate an IRQF flag which creates a request to the CPU to generate
the IRQ interrupt sequence.This makes the IRQ interrupt sensitive to the following
cases:
1. Falling edge on the IRQ pin.
2. Rising edge on any PA0-PA3 pin with IRQ enabled (via mask option).
If level sensitivity is chosen, the rising edge signal on the clock input of the IRQ
latch can also activate an IRQF flag which creates an IRQ request to the CPU to
generate the IRQ interrupt sequence. This makes the IRQ interrupt sensitive to
the following cases:
1. Low level on the IRQ pin.
2. Falling edge on the IRQ pin.
3. High level on any PA0- PA3 pin with IRQ enabled (via mask option).
4. Rising edge on any PA0- PA3 pin with IRQ enabled (via mask option).
The IRQE enable bit controls whether an active IRQF flag can generate an IRQ
interrupt sequence. This interrupt is serviced by the interrupt service routine
located at the address specified by the contents of $0FFA and $0FFB.
The IRQ latch is automatically cleared by entering the interrupt service routine IF
IRQE1 enable bit is cleared. If IRQE1 enable bit is also set, the only way of clear-
ing IRQF is by writing a logic one to the IRQR acknowledge bit. Writing a logic one
to the IRQR acknowledge bit in the ICSR is the other way of clearing IRQF flag,
regardless of the status of the IRQE1 bit, besides IRQ vector fetch. This condi-
tional reset of IRQF flag provides a way for the user to differentiate the interrupt
sources from IRQ and IRQ1 latches and also to make it J1A compatible if PA7
interrupt is not used. As long as the output state of the IRQF flag bit is active the
CPU will continuously re-enter the IRQ interrupt sequence until the active state is
removed or the IRQE enable bit is cleared.
PA7 interrupt source, if enabled by IRQE1 enable bit, triggers IRQ interrupt on
PA7 falling edge only.The IRQ1 latch (IRQF1 flag) can ONLY be cleared by writing
a logic one to the IRQR1 acknowledge bit in the ICSR. IRQ vector fetch can NOT
clear IRQF1 flag. IRQ interrupt caused by PA7 falling edge also vectors to $0FFA
and $0FFB.
MOTOROLA
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4.5.1 IRQ CONTROL/STATUS REGISTER (ICSR) $0A
The IRQ interrupt function is controlled by the ICSR located at $000A. All unused
bits in the ICSR will read as logic zeros. The IRQF, IRQF1, IRQE1 bits are cleared
and IRQE bit is set by reset.
7
IRQE
1
6
IRQE1
0
5
0
4
0
3
2
1
0
0
0
R
IRQF
IRQF1
ICSR
$000A
IRQR1
W
IRQR
R
reset
0
0
0
0
0
0
RESERVED FOR TEST
UNIMPLEMENTED
R
Figure 4-3. IRQ Status & Control Register
IRQR 1 - PA7 Interrupt Acknowledge
The IRQR1 acknowledge bit clears an IRQ interrupt triggered by a falling edge
on PA7 by clearing the IRQ1 latch.The IRQR1 acknowledge bit will always read
as a logic zero.
1 = Writing a logic one to the IRQR1 acknowledge bit will clear the IRQ1
latch.
0 = Writing a logic zero to the IRQR1 acknowledge bit will have no effect
on the IRQ1 latch.
IRQR - IRQ Interrupt Acknowledge
The IRQR acknowledge bit clears an IRQ interrupt by clearing the IRQ latch.
The IRQR acknowledge bit will always read as a logic zero.
1 = Writing a logic one to the IRQR acknowledge bit will clear the IRQ
latch.
0 = Writing a logic zero to the IRQR acknowledge bit will have no effect
on the IRQ latch.
IRQF1 - PA7 Interrupt Request Flag
Writing to the IRQF1 flag bit will have no effect on it. If the additional setting of
IRQF1 flag bit is not cleared in the IRQ service routine and the IRQE1 enable
bit remains set the CPU will re-enter the IRQ interrupt sequence continuously
until either the IRQF1 flag bit or the IRQE1 enable bit is cleared. The IRQF1
latch is cleared by reset.
1 = Indicates that an IRQ request triggered by a falling edge on PA7 is
pending.
0 = Indicates that no IRQ request triggered by a falling edge on PA7 is
pending. The IRQF1 flag bit can ONLY be cleared by writing a logic
one to the IRQR1 acknowledge bit. Doing so before exiting the
service routine will mask out additional occurrences of the IRQF1.
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IRQF - IRQ Interrupt Request Flag
Writing to the IRQF flag bit will have no effect on it. If the additional setting of IRQF
flag bit is not cleared in the IRQ service routine and the IRQE enable bit remains
set the CPU will re-enter the IRQ interrupt sequence continuously until either the
IRQF flag bit or the IRQE enable bit is clear. The IRQF latch is cleared by reset.
1 = Indicates that an IRQ request is pending.
0 = Indicates that no IRQ request triggered by pins PA0-3 or IRQ is
pending. The IRQF flag bit is cleared once the IRQ vector is fetched
AND if IRQE1 is also cleared. If IRQE1 is set, then the only way of
clearing IRQF flag is by writing a logic one to IRQR bit. The IRQF
flag bit can be cleared, regardless of the status of the IRQE1 bit, by
writing a logic one to the IRQR acknowledge bit to clear the IRQ
latch and also conditioning the external IRQ sources to be inactive
(if the level sensitive interrupts are enabled via mask option). Doing
so before exiting the service routine will mask out additional
occurrences of the IRQF.
IRQE1 - PA7 Interrupt Enable
The IRQE1 bit enables/disables the IRQF1 flag bit to initiate an IRQ interrupt
sequence.
1 = Enables IRQF1 interrupt, that is, the IRQF1 flag bit can generate an
interrupt sequence. Execution of the STOP or WAIT instructions will
leave the IRQE1 bit to be UNAFFECTED.
0 = The IRQF1 flag bit cannot generate an interrupt sequence. Reset
clears the IRQE1 enable bit, thereby disabling PA7 interrupts.
IRQE - IRQ Interrupt Enable
The IRQE bit enables/disables the IRQF flag bit to initiate an IRQ interrupt
sequence.
1 = Enables IRQF interrupt, that is, the IRQF flag bit can generate an
interrupt sequence. Reset sets the IRQE enable bit, thereby
enabling IRQ interrupts once the I-bit is cleared. Execution of the
STOP or WAIT instructions causes the IRQE bit to be set in order to
allow the external IRQ to exit these modes.
0 = The IRQF flag bit cannot generate an interrupt sequence.
4.5.2 OPTIONAL EXTERNAL INTERRUPTS (PA0-PA3)
The IRQ interrupt can also be triggered by the inputs on the PA0 thru PA3 port
pins if enabled by a single mask option. If enabled, the lower four bits of Port A
can activate the IRQ interrupt function, and the interrupt operation will be the
same as for inputs to the IRQ pin. This mask option of PA0-3 interrupt allow all of
these input pins to be OR’ed with the input present on the IRQ pin. All PA0 thru
PA3 pins must be selected as a group as an additional IRQ interrupt. All the PA0-3
interrupt sources are also controlled by the IRQE enable bit.
MOTOROLA
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NOTE
The BIH and BIL instructions will only apply to the level on the IRQ pin itself, and
not to the output of the logic OR function with the PA0 thru PA3 pins. The state of
the individual Port A pins can be checked by reading the appropriate Port A pins
as inputs.
NOTE
If enabled, the PA0 thru PA3 and PA7 pins will cause an IRQ interrupt regardless
of whether these pins are configured as inputs or outputs.
4.5.3 TIMER INTERRUPT (MFT)
The TIMER interrupt is generated by the multi-function timer when either a timer
overflow or a real time interrupt has occurred as described in Section 8.The inter-
rupt flags and enable bits for the Timer interrupts are located in the Timer Control
& Status Register (TCSR) located at $0008. The I-bit in the CCR must be clear in
order for the TIMER interrupt to be enabled. Either of these two interrupts will vec-
tor to the same interrupt service routine located at the address specified by the
contents of memory locations $0FF8 and $0FF9.
4.5.4 TIMER1 INTERRUPT (16-BIT TIMER)
The Timer1 interrupt is generated by the 16-bit Timer when either a timer1 over-
flow or a input capture has occurred as described in Section 9. The interrupt flags
and enable bits for the Timer1 interrupt are located in the Timer1 Control & Status
Register (T1CR & T1SR) located at $0012, $0013. The I-bit in the CCR must be
cleared in order to enable the Timer1. Either of these two interrupts will vector to
the same interrupt service routine located at the address specified by the contents
of memory locations $0FF6 and $0FF7.
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SECTION 5
RESETS
The MCU can be reset from five sources: one external input and four internal
restart conditions.
•
•
•
•
•
Initial power up of device (power on reset)
A logic zero applied to the RESET pin (external reset)
Timeout of the COP watchdog (COP reset)
Low voltage applied to the device (LVR reset)
Fetch of an opcode from an address not in the memory map (illegal
address reset)
Figure 5-1 shows a block diagram of the reset sources and their interaction.
To Interrupt
IRQ
logic
V
DD
R
Mode
Select
LATCH
R
RESET
OSC
Data
Address
COP Watchdog
(COPR)
CPU
RST
S
To other
peripherals
Illegal Address
(ILADR)
Address
LATCH
PH2
Power-On Reset
(POR)
V
DD
Low Voltage Reset
(LVR)
Figure 5-1. Reset Block Diagram
MC68HC05J5A
REV 2.1
RESETS
MOTOROLA
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5.1
EXTERNAL RESET (RESET)
The RESET pin is the only external source of a reset. This pin is connected to a
Schmitt trigger input gate to provide an upper and lower threshold voltage sepa-
rated by a minimum amount of hysteresis. This external reset occurs whenever
the RESET pin is pulled below the lower threshold and remains in reset until the
RESET pin rises above the upper threshold. This active low input will generate the
RST signal and reset the CPU and peripherals. This pin is also an output pin
whenever the LVR triggers an internal reset. Termination of the external RESET
input or the internal COP Watchdog reset or LVR are the only reset sources that
can alter the operating mode of the MCU.
NOTE
Activation of the RST signal is generally referred to as reset of the device, unless
otherwise specified.
5.2
INTERNAL RESETS
The four internally generated resets are the initial power-on reset function, the
COP Watchdog Timer reset, the illegal address detector reset and the low voltage
reset (LVR). Termination of the external RESET input or the internal COP Watch-
dog Timer or LVR are the only reset sources that can alter the operating mode of
the MCU. The other internal resets will not have any effect on the mode of opera-
tion when their reset state ends.
5.2.1 POWER-ON RESET (POR)
The internal POR is generated on power-up to allow the clock oscillator to stabi-
lize. The POR is strictly for power turn-on conditions and is not able to detect a
drop in the power supply voltage (brown-out). There is an oscillator stabilizing
delay after the oscillator becomes active. The delay time could be 224 or 4064 of
internal processor bus clock cycles (PH2) which is a mask option.
The POR will generate the RST signal which will reset the CPU. If any other reset
function is active at the end of this delay time, the RST signal will remain in the
reset condition until the other reset condition(s) end.
5.2.2 COMPUTER OPERATING PROPERLY RESET (COPR)
The internal COPR reset is generated automatically (if the COP is enabled) by a
time-out of the COP Watchdog Timer. This time-out occurs if the counter in the
COP Watchdog Timer is not reset (cleared) within a specific time by a software
reset sequence. The COP Watchdog Timer can be disabled by a mask option.
Refer to Section 8.2 for more information on this time-out feature. COP reset also
forces the RESET pin low
MOTOROLA
5-2
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The COPR will generate the RST signal which will reset the CPU and other
peripherals. Also, the COPR will establish the mode of operation based on the
state of the IRQ pin at the time the COPR signal ends. If the voltage on the IRQ
pin is at the V
level, the state of the PB0 pin during the last rising edge of the
TST
RESET pin will determine which Test Mode (Internal or Expanded) the MCU will
be in. If the voltage at the IRQ pin is in the normal operating range (V to V ),
SS
DD
the MCU will enter Single-Chip Mode when the COPR signal ends. If any other
reset function is active at the end of the COPR reset signal, the RST signal will
remain in the reset condition until the other reset condition(s) end.
5.2.3 LOW VOLTAGE RESET (LVR)
The internal LVR reset is generated when V falls below the specified LVR trig-
DD
ger value V
for at least one t
. In typical applications, the power supply de-
LVR
CYC
coupling circuit will eliminate negative-going voltage glitches of less than one
. This reset will hold the MCU in the reset state until V rises above V
t
.
LVR
CYC
DD
Whenever V is above V
and below 4.5V, the MCU is guaranteed to operate
DD
LVR
although not within specification. The output from the LVR is connected directly to
the internal reset circuitry and also forces the RESET pin low. The internal reset
will be removed once the power supply voltage rises above V , at which time a
LVR
normal power-on-reset sequence occurs.
5.2.4 ILLEGAL ADDRESS RESET (ILADR)
The internal ILADR reset is generated when an instruction opcode fetch occurs
from an address which is not implemented in the RAM ($0080 - $00FF) nor ROM
($0300-$0CFF, $0E00-$0FFF). The ILADR will generate the RST signal which will
reset the CPU and other peripherals. If any other reset function is active at the end
of the ILADR reset signal, the RST signal will remain in the reset condition until
the other reset condition(s) end. Notice that ILADR also forces the RESET pin low.
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MOTOROLA
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SECTION 6
LOW POWER MODES
There are three modes of operation that reduce power consumption:
•
•
•
Stop mode
Wait mode
Halt mode
The WAIT and STOP instructions provide two power saving modes by stopping
various internal modules and/or the on-chip oscillator. The STOP and WAIT
instructions are not normally used if the COP Watchdog Timer is enabled. A mask
option is provided to convert the STOP instruction to a HALT, which is a WAIT-like
instruction that does not halt the COP Watchdog Timer but has a recovery delay.
The flow of the STOP, HALT, and WAIT modes are shown in Figure 6-1.
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MOTOROLA
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STOP
HALT
WAIT
External Oscillator Active
and
Internal Timer Clock Active
Stop
Conversion to
Halt?
Y
N
Stop Internal Processor Clock,
Clear I-Bit in CCR,
External Oscillator Active
and
Internal Timer Clock Active
Stop External Oscillator,
Stop Internal Timer Clock,
Reset Startup Delay
and set IRQE in ICSR
Stop Internal Processor Clock,
Clear I-Bit in CCR,
Stop Internal Processor Clock,
Clear I-Bit in CCR,
Y
External
RESET?
and set IRQE in ICSR
and set IRQE in ICSR
N
Y
IRQ
External
Interrupt?
External
RESET?
Y
Y
External
RESET?
N
N
N
IRQ
External
Interrupt?
Y
IRQ
External
Interrupt?
TIMER
Internal
Interrupt?
Y
Y
N
Restart External Oscillator,
start Stabilization Delay
N
N
TIMER
Internal
Interrupt?
Y
COP
Internal
RESET?
Y
N
End
of Stabilization
Delay?
N
Y
COP
Internal
Y
RESET?
N
Restart
Internal Processor Clock
N
1. Fetch Reset Vector
or
2. Service Interrupt
a. Stack
b. Set I-Bit
c. Vector to Interrupt Routine
Figure 6-1. STOP/HALT/WAIT Flowcharts
6.1
STOP INSTRUCTION
The STOP instruction can result in one of two modes of operation depending on
the STOP mask option chosen. One option is for the STOP instruction to operate
like the STOP in normal MC68HC05 family members and place the device in the
MOTOROLA
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STOP Mode. The other option is for the STOP instruction to behave like a WAIT
instruction (except that the restart time will involve a delay) and place the device in
the HALT Mode.
6.1.1 STOP Mode
Execution of the STOP instruction in this mode (selected by a mask option) places
the MCU in its lowest power consumption mode. In the STOP Mode the internal
oscillator is turned off, halting all internal processing, including the COP Watchdog
Timer.
When the CPU enters STOP Mode the interrupt flags (TOF and RTIF) and the
interrupt enable bits (TOFE and RTIE) in the TCSR are cleared by internal hard-
ware to remove any pending timer interrupt requests and to disable any further
timer interrupts. Execution of the STOP instruction automatically clears the I-bit in
the Condition Code Register and sets the IRQE enable bit in the IRQ Control/Sta-
tus Register so that the IRQ external interrupt is enabled. All other registers,
including the other bits in the TCSR, and memory remain unaltered. All input/out-
put lines remain unchanged.
The MCU can be brought out of the STOP Mode only by an IRQ external interrupt
or an externally generated RESET or an LVR reset. When exiting the STOP Mode
the internal oscillator will resume after a 224 or 4064 internal processor clock
cycle oscillator stabilizing delay which is selected by a mask option.
NOTE
Execution of the STOP instruction with the STOP Mode Mask Option will cause
the oscillator to stop and therefore disable the COP Watchdog Timer. If the COP
Watchdog Timer is to be used, the STOP Mode should be changed to the HALT
Mode by choosing the appropriate mask option. See Section 6.4 for more details.
6.1.2 HALT Mode
Execution of the STOP instruction in this mode (selected by a mask option) places
the MCU in a low-power mode, which consumes more power than the STOP
Mode. In the HALT Mode the internal processor clock is halted, suspending all
processor and internal bus activity. Internal timer clocks remain active, permitting
interrupts to be generated from the timer (MFT or Timer 1) or a reset to be gener-
ated from the COP Watchdog Timer. Execution of the STOP instruction automati-
cally clears the I-bit in the Condition Code Register and sets the IRQE enable bit
in the IRQ Control/Status Register so that the IRQ external interrupt is enabled.
All other registers, memory, and input/output lines remain in their previous states.
The HALT Mode may be terminated by a Timer interrupt, an external IRQ, an LVR
reset, or external RESET occurs. Since the internal timer is still running in the
HALT mode, the wake up delay timer (oscillator stabilizing delay timer) may start
counting from an unknown value. So, the internal processor clock will resume
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after a varied delay time which is from one to 224 or 4064 internal processor clock
cycles (the POR delay time). The HALT Mode is not intended for normal use, but
is provided to keep the COP Watchdog Timer active should the STOP instruction
opcode be inadvertently executed.
6.2
WAIT INSTRUCTION
The WAIT instruction places the MCU in a low-power mode, which consumes
more power than the STOP Mode. In the WAIT Mode the internal processor clock
is halted, suspending all processor and internal bus activity. Internal timer clocks
remain active, permitting interrupts to be generated from the timer or a reset to be
generated from the COP Watchdog Timer. Execution of the WAIT instruction auto-
matically clears the I-bit in the Condition Code Register and sets the IRQE enable
bit in the IRQ Control/Status Register so that the IRQ external interrupt is enabled.
All other registers, memory, and input/output lines remain in their previous states.
If timer (MFT or Timer 1) interrupts are enabled, a TIMER interrupt will cause the
processor to exit the WAIT Mode and resume normal operation.The Timer may be
used to generate a periodic exit from the WAIT Mode. The WAIT Mode may also
be exited when an external IRQ or an LVR reset or an external RESET occurs.
6.3
DATA-RETENTION MODE
If the LVR mask option is selected and since LVR kicks in whenever V is below
DD
the specified LVR trigger voltage which is higher than that required of the Data
Retention mode, the Data Retention mode will not exist. Data Retention Mode is
only meaningful if LVR mask option is not selected.
The contents of RAM and CPU registers are retained at supply voltage as low as
2.0 VDC. This is called the data-retention mode where the data is held, but the
device is not guaranteed to operate. The RESET pin must be held low during
data-retention mode.
6.4
COP WATCHDOG TIMER CONSIDERATIONS
The COP Watchdog Timer is active in all modes of operation if enabled by a mask
option.Thus, emulation of applications that do not service the COP should only be
done with devices that have the COP Mask Option disabled.
If the COP Watchdog Timer is selected by the mask option, any execution of the
STOP instruction (either intentional or inadvertent due to the CPU being dis-
turbed) will cause the oscillator to halt and prevent the COP Watchdog Timer from
timing out unless the STOP to HALT conversion feature is enabled. Therefore, it is
recommended that the STOP instruction should be converted to a HALT instruc-
tion if the COP Watchdog Timer is enabled.
If the COP Watchdog Timer is selected by the mask option, the COP will reset the
MCU when it times out. Therefore, it is recommended that the COP Watchdog
should be disabled for a system that must have intentional uses of the WAIT Mode
for periods longer than the COP time-out period.
MOTOROLA
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LOW POWER MODES
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The recommended interactions and considerations for the COP Watchdog Timer,
STOP instruction, and WAIT instruction are summarized in Table 6-1.
Table 6-1. COP Watchdog Timer Recommendations
IF the following conditions exist:
STOP Instruction
THEN the
COP Watchdog Timer
should be as follows:
WAIT Time
converted to HALT
by mask option
WAIT Time less than
COP Time-Out
Enable or disable COP
by mask option
converted to HALT
by mask option
WAIT Time more than
COP Time-Out
Disable COP
by mask option
Acts as STOP
any length
WAIT Time
Disable COP
by mask option
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SECTION 7
INPUT/OUTPUT PORTS
In the normal operating mode there are 14 usable bidirectional I/O lines arranged
as one 8-bit I/O port (Port A), and one 6-bit I/O port (Port B). The individual bits in
these ports are programmable as either inputs or outputs under software control
by the data direction registers (DDR’s). Also, if enabled by a single mask option all
Port A and Port B I/O pins may have individual software programmable pull-down
or pull-up devices. Also, PA4-PA7 and PB1-PB2 pins have high current sink capa-
bility; PA0-PA3 may function as additional IRQ interrupt input sources. Note that
both PA6 and PA7 pins have Schmitt trigger input for better noise immunity. V
IH
and V specified at 2.4V and 0.8V, respectively.
IL
The four port pins, PB2-PB5 are only available on the 20-pin version of the device.
7.1
SLOW OUTPUT FALLING-EDGE TRANSITION
7
6
0
5
4
3
2
DDRB2
0
1
DDRB1
0
0
DDRB0
0
R
DDRB
$0005
DDRB5
DDRB4
DDRB3
SLOWE
0
W
reset
0
0
0
0
Figure 7-1. Port B Data Direction Register
SLOWE - Slow Transition Enable
The slow transition feature is controlled by the SLOWE bit of DDRB (Port B
Data Direction Register).
1 = Enables the slow falling-edge output transition feature on the four I/
O lines: PA6, PA7, PB1, and PB2. If the pin is configured as an
output pin.
0 = Disables slow falling-edge output transition feature on the four I/O
lines: PA6, PA7, PB1, and PB2. Default value of SLOWE bit is
cleared.
7.2
PORT A
Port A is a 8-bit bidirectional port which shares five of its pins with the IRQ inter-
rupt system as shown in Figure 7-2. Note that both PA6 and PA7 pins have
Schmitt trigger input for better noise immunity. Only the PA6 and PA7 pins are
open-drained type with slow output transition feature.
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Each Port A pin is controlled by the corresponding bits in a data direction register,
a data register and a pulldown/up register. The Port A Data Register is located at
address $0000. The Port A Data Direction Register (DDRA) is located at address
$0004. The Port A Pulldown/up Register (PDURA) is located at address $0010.
Reset operation will clear the DDRA and the PDURA. The Port A Data Register is
unaffected by reset.
VDD
Read $0004
5K
Pullup
Write $0004
Data Direction
Register Bit
Write $0000
I/O
Pin
Output
Data
Register Bit
8 mA Sink
Capability
(Bits 4-7 Only)
Read $0000
Write $0010
100 µA
Pulldown
Pulldown/up
Register Bit
Internal HC05
Data Bus
Reset
(RST)
Mask Option
(Software Pulldown/up Inhibit)
Note1: All the I/O port pins may have either pullup or pulldown device.
Note2: PA6 and PA7 output drivers are the open-drained type
PA0-PA3 and PA7 only:
to IRQ
interrupt system
Figure 7-2. Port A I/O Circuitry
7.2.1 Port A Data Register
Each Port A I/O pin has a corresponding bit in the Port A Data Register. When a
Port A pin is programmed as output, the corresponding data register bit deter-
mines the logic state of that pin. When a Port A pin is programmed as input, any
read from the Port A Data Register will return the logic state of the corresponding
I/O pin. The Port A data register is unaffected by reset.
7.2.2 Port A Data Direction Register
Each Port A I/O pin may be programmed as input by clearing the corresponding
bit in the DDRA, or programmed as output by setting the corresponding bit in the
DDRA. The DDRA can be accessed at address $0004. The DDRA is cleared by
reset.
If configured as output pins, PA6 and PA7 have slow output falling-edge transition
feature. The slow transition feature is controlled by the SLOWE bit of DDRB.
SLOWE bit, if set and if the pin is configured as an output pin, enables the slow
falling-edge output transition feature of all four I/O lines, PA6, PA7, PB1, and PB2.
MOTOROLA
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7.2.3 Port A Pulldown/up Register
All Port A I/O pins may have software programmable pulldown/up devices enabled
by the applicable mask option. If the pulldown/up mask option is selected, the pull-
down/up is activated whenever the corresponding bit in the PDURA is clear. If the
corresponding bit in the PDURA bit is set or the mask option for pulldown/up is not
chosen, the pulldown/up will be disabled. A pulldown on an I/O pin is activated
only if the I/O pin is programmed as an input whereas a pullup device on an I/O
pin is always activated whenever enabled, regardless of port direction.
The PDURA is a write-only register. Any reads of location $0010 will return unde-
fined results. Since reset clears both the DDRA and the PDURA, all pins will ini-
tialize as inputs with the pulldown active and pullup devices active (if enabled by
mask option).
Typical value of port A pullup is 5KΩ.
7.2.4 Port A Drive Capability
The outputs for the upper four bits of Port A (PA4, PA5, PA6 and PA7) are capable
of sinking approximately 8mA of current to V .
SS
7.2.5 Port A I/O Pin Interrupts
The inputs to PA0, PA1, PA2, PA3 may be connected to the IRQ input of the CPU
if enabled by a mask option.The input to PA7 is also connected to the IRQ input of
the CPU, yet it is only enabled or disabled by software, not by mask option. PA7
interrupt capability is controlled by a set of control and status bits (IRQE1, IRQF1,
IRQR1), different from the set of control and status bits for that of PA0-PA3 and
IRQ pin (IRQE, IRQF, IRQR) in the same ICSR (Interrupt Control and Status Reg-
ister).
When connected as an alternate source of an IRQ interrupt, PA0-3 input pins will
behave the same as the IRQ pin itself, except that their active state is a logical one
or a rising edge. The IRQ pin has an active state that is a logical zero or a falling
edge. PA7 interrupt occurs, if enabled, only upon the falling edge at the input.
If mask options for both level and edge sensitivity interrupts are chosen, the pres-
ence of a logic one or occurrence of a rising edge on any one of the lower four
Port A pins will cause an IRQ interrupt request. If the edge-only sensitivity is
selected, the occurrence of a rising edge on any one of the lower four Port A pins
will cause an IRQ interrupt request. As long as any one of the lower four Port A
IRQ inputs remains at a logic one level, the other of the lower four Port A IRQ
inputs are effectively ignored.
NOTE
The BIH and BIL instructions will only apply to the level on the IRQ pin itself, and
not to the internal IRQ input to the CPU. Therefore BIH and BIL cannot be used to
test the state of the lower four Port A input pins as a group nor that of PA7.
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7.3
PORT B
Port B is a 6-bit bidirectional port which functions as shown in Figure 7-3. Only
PB1 and PB2 are of open-drained type. Each Port B pin is controlled by the corre-
sponding bits in a data direction register, a data register and a pulldown/up regis-
ter. The Port B Data Register is located at address $0001. The Port B Data
Direction Register (DDRB) is located at address $0005. The Port B Pulldown/up
Register (PDURB) is located at address $0011. Reset clears the DDRB and the
PDURB. The Port B Data Register is unaffected by reset.
Please note that only PB0 and PB1 pins are bonded out in the 16-pin package
type. Actually, the PB1 and PB2 I/O port lines are short and bonded to the PB1 on
the 16-pin package. Both PB1 and PB2 are of open-drained type, capable of typi-
cally sinking 25mA current at V 0.5V max. In order to constitute a single pin
OL
capable of typically sinking 50mA, both PB1 and PB2 have to be written with the
same value at the same write cycle.
VDD
Read $0005
30K
Pullup
Write $0005
Data Direction
Register Bit
Write $0001
I/O
Pin
Output
Data
Register Bit
Read $0001
Write $0011
Pulldown/up
Register Bit
100 µA
Pulldown
Internal HC05
Data Bus
Reset
(RST)
Mask Option
(Software Pulldown/up Inhibit)
Note1: All the I/O port pins may have either pullup or pulldown device.
Note2: PB1 and PB2 output drivers are the open-drained type
Figure 7-3. Port B I/O Circuitry
Port Pin PB0 is shared with TCAP input of the 16-Timer input capture function.
The input capture function can be programmed for a positive edge or the negative
edge TCAP input. When an expected edge is generated on this pin, the counter
value at that moment will be captured into a capture register. For the details about
this feature please refer to the Section 9.
7.3.1 Port B Data Register
All Port B I/O pins have a corresponding bit in the Port B Data Register. When a
Port B pin is programmed as output the corresponding data register bit
determines the logic state of the output pin. When a Port B pin is programmed as
input, any read from the Port B Data Register will return the logic state of the
MOTOROLA
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corresponding I/O pin. The Port B data register is unaffected by reset. Unused bits
6 and 7 will always read as logic zeros, and any write to these bits will be ignored.
The Port B data register is unaffected by reset.
7.3.2 Port B Data Direction Register
Port B I/O pins may be programmed as an input by clearing the corresponding bit
in the DDRB, or programmed as an output by setting the corresponding bit in the
DDRB. The DDRB can be accessed at address $0005. Unused bits 6 and 7 will
always read as logic zeros, and any write to these bits will be ignored.The DDRB
is cleared by reset.
If configured as output pins, PB1 and PB2 have slow output falling-edge transition
feature. The slow transition feature is controlled by the SLOWE bit of DDRB.
SLOWE bit, if set and if the pin is configured as an output pin, enables the slow
falling-edge output transition feature of all four I/O lines, PA6, PA7, PB1 and PB2.
For the 16-pin package type, care should be taken in using PB1 pin, which is
bonded to two internal port B I/O lines PB1 and PB2, to constitute a 50mA current
sinking driver. Both PB1 and PB2 I/O lines are capable of sinking 25mA. If they
are written with the same logic 0 value in the same write cycle, PB1 pin will sink
50 mA. If they are written with different values in the same write cycle, PB1 pin will
sink only 25mA.
For the 20-pin package type, I/O lines PB1 and PB2 are not bonded to the same
pin. Hence, to constitute a 50mA current sinking driver, PB1 and PB2 pins have to
be tied together externally and controlled in the same way as in the16-pin pack-
age type case.
Also, if the slow transition feature of pin PB1 is enabled, a combination of I/O lines
PB1 and PB2, is also a combination of slow transition features of I/O lines PB1
and PB2. PB2 line falling-edge output transition occurs t
/2 after the write
CYC
cycle, with a standard I/O edge transition time. Whereas for PB1 line, the falling-
edge transition occurring immediately after the write cycle, but with an edge tran-
sition time slower than standard I/Os, similar to PA6 and PA7 pins.
The net result is, for the 16-pin package type, since both PB1 and PB2 I/O lines
are bonded to the same PB1 pin, the combination of delayed PB1 line sharp-edge
output and the non-delayed slow transition output yields the desired slow output
falling-edge transition.
For the 20-pin package, PB1 and PB2 pins should be tied externally to create a
driver with the desired slow output falling-edge transition feature. If SLOWE is set
and PB2 pin is not tied to PB1 pin, be advised that the output at PB2 changes
state t
/2 after the write cycle.
CYC
7.3.3 Port B Pulldown/up Register
All Port B I/O pins may have software programmable pulldown/up devices enabled
by a mask option. If the pulldown/up mask option is selected, the pulldown/up is
activated whenever the corresponding bit in the PDURB is clear. A pulldown on an
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I/O pin is activated only if the I/O pin is programmed as an input whereas a pullup
device on an I/O pin is always activated whenever enabled, regardless of port
direction.
The PDURB is a write-only register. Any reads of location $0011 will return unde-
fined results. Since reset clears both the DDRB and the PDURB, all pins will ini-
tialize as inputs with the pulldown devices active and pullup devices active (if
chosen via mask option).
Typical value of port B pullup is 30KΩ.
7.4
I/O PORT PROGRAMMING
All I/O pins can be programmed as inputs or outputs, with or without pulldown/up
devices.
7.4.1 Pin Data Direction
The direction of a pin is determined by the state of its corresponding bit in the
associated port Data Direction Register (DDR). A pin is configured as an output if
its corresponding DDR bit is set to a logic one. A pin is configured as an input if its
corresponding DDR bit is cleared to a logic zero.
The data direction bits DDRB0-DDRB5 and DDRA0-DDRA7 are read/write bits
which can be manipulated with read-modify-write instructions. At power-on or
reset, all DDRs are cleared which configures all port pins as inputs. If the pull-
down/up mask option is chosen, all pins will initially power-up with their software
programmable pulldowns/ups enabled.
7.4.2 Output Pin
When an I/O pin is programmed as an output pin, the state of the corresponding
data register bit will determine the state of the pin. The state of the data register
bits can be altered by writing to address $0000 for Port A and address $0001 for
Port B. Reads of the corresponding data register bit at address $0000 or $0001
will return the state of the data register bit (not the state of the I/O pin itself).
Therefore bit manipulation is possible on all pins programmed as outputs.
If the corresponding bit in the pulldown/up register is clear (and the pulldown/up
mask option is chosen), only output pins with pullups have an activated pullup
device connected to the pin. For those pins with pulldowns and configured as out-
put pins, the pulldowns will be inactivated regardless of the state of the corre-
sponding pulldown/up register bit. Since the pulldown/up register bits are write-
only, bit manipulation should not be used on these register bits.
7.4.3 Input Pin
When an I/O pin is programmed as an input pin, the state of the pin can be deter-
mined by reading the corresponding data register bit. Any writes to the corre-
sponding data register bit for an input pin will be ignored in the sense that the
written value will not be reflected on the pin, rather it is only reflected in the port
data register. Please refer to Table 7-1 and Table 7-2 for details.
MOTOROLA
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INPUT/OUTPUT PORTS
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If the corresponding bit in the pulldown/up register is clear (and the pulldown/up
mask option is chosen) the input pin will also have an activated pulldown/up
device. Since the pulldown/up register bits are write-only, bit manipulation should
not be used on these register bits.
7.4.4 I/O Pin Transitions
A "glitch" can be generated on an I/O pin when changing it from an input to an out-
put unless the data register is first preconditioned to the desired state before
changing the corresponding DDR bit from a zero to a one.
If pulldowns are enabled by mask option, a floating input can be avoided by clear-
ing the pulldown/up register bit before changing the corresponding DDR from a
one to a zero. This will insure that the pulldown device will be activated before the
I/O pin changes from a driven output to a pulled low/high input.
7.4.5 I/O Pin Truth Tables
Every pin on Port A and Port B may be programmed as an input or an output
under software control as shown in Table 7-1 and Table 7-2. All port I/O pins may
also have software programmable pulldown/up devices if selected by the appropri-
ate mask option.
Table 7-1. Port A I/O Pin Functions
Accesses to
PDURA
at $0010
Accesses
to DDRA
@ $0004
Accesses to
Data Register
@ $0000
DDRA
I/O Pin Mode
Read/Write
Read
Read
Write
Write
0
1
IN, Hi-Z
OUT
U
U
PDURA0-7 DDRA0-7 I/O Pin
PDURA0-7 DDRA0-7 PA0-7
*
PA0-7
* Does not affect input,
U is undefined
but stored to data register
Table 7-2. Port B I/O Pin Functions
Accesses to
PDURB
at $0011
Accesses
to DDRB
@ $0005
Accesses to
Data Register
@ $0001
DDRA
I/O Pin Mode
Read/Write
Read
Read
Write
Write
0
1
IN, Hi-Z
OUT
U
U
PDURB0-2 DDRB0-2 I/O Pin
PDURB0-2 DDRB0-2 PB0-5
*
PB0-5
U is undefined
* Does not affect input,
but stored to data register
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MOTOROLA
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SECTION 8
MULTI-FUNCTION TIMER
The Multi-Function Timer module is a 15-stage ripple counter with Timer Over
Flow (TOF), Real Time Interrupt (RTI), COP Watchdog, and the Power-On Reset
delay function.
MC68HC05 Internal Bus
8
$09 TCR
Timer Counter Register (TCR)
8
2
Internal
Timer Clock
(NTF1)
f
/2
op
÷4
TCR
8
10
f
/2
op
f
/2
op
OSCDLY
(mask option)
7-bit counter
MUX
POR
17
16
15
14
÷2
÷2
÷2
÷2
12
f
/2
op
TCBP
Overflow
Detect
Circuit
RTI Select Circuit
$08 TCSR
Timer Control & Status Register
TCSR
TOF RTIF TOFE RTIE TOFR RTIFR RT1 RT0
COP
Clear
COP Watchdog
Resetable Timer
(÷8)
Interrupt Circuit
To Interrupt
Logic
To Reset
Logic
Figure 8-1. Multi-Function Timer Block Diagram
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8.1
OVERVIEW
As shown in Figure 8-1, the Timer is driven by the timer clock, NTF1, divided by
four. NTF1 has the same phase and frequency as the processor bus clock, PH2,
but is not stopped by the WAIT or HALT Modes. This signal drives an 8-bit ripple
counter. The value of this 8-bit ripple counter can be read by the CPU at any time
by accessing the Timer Counter Register (TCR) at address $09. A timer overflow
function is implemented on the last stage of this counter, giving a possible inter-
rupt at the rate of f /1024. The POR function is generated at f /224 stage or at
op
op
f /4064 stage, which is selected by a mask option.
op
The last stage of the 8-bit counter also drives a further 7-bit counter. The final four
14
15
stages is used by the RTI circuit, giving possible RTI rates of f /2 , f /2 ,
OP
OP
16
17
f
/2 or f /2 , selected by RT1 and RT0 (see Table 8-1). The RTI rate selec-
OP
OP
tor bits, and the RTI and TOF enable bits and flags are located in the Timer Con-
trol and Status Register at location $08.
The power-on cycle clears the entire counter chain and begins clocking the
counter. After 224 or 4064 cycles, the power-on reset circuit is released which
again clears the counter chain and allows the device to come out of reset. At this
point, if RESET is not asserted, the timer will start counting up from zero and nor-
mal device operation will begin. If RESET is asserted at any time during operation
the counter chain will be cleared.
8.2
COMPUTER OPERATING PROPERLY (COP) WATCHDOG
The COP Watchdog is enabled by a mask option.
The COP Watchdog Timer function is implemented by using the output of the RTI
circuit and further dividing it by eight. The minimum COP reset rates are listed in
Table 8-1. If the COP circuit times out, an internal reset is generated and the nor-
mal reset vector is fetched.
Preventing a COP time-out is done by writing a “0” to bit-0 of address $0FF0.
When the COP is cleared, only the final divide by eight stage (output of the RTI) is
cleared.
7
6
5
4
3
2
1
0
R
COP
$0FF0
W
COPR
Reading $0FF0 returns the contents of Test ROM.
Unimplemented
Figure 8-2. COP Watchdog Timer Location
MFT REGISTERS
8.3
The 15-stage Multi-function Timer contains two registers: a Timer Counter Regis-
ter and a Timer Control/Status Register.
MOTOROLA
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MULTI-FUNCTION TIMER
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8.3.1 Timer Counter Register (TCR) $09
The Timer Counter Register is a read-only register which contains the current
value of the 8-bit ripple counter at the beginning of the timer chain. This counter is
clocked at f divided by 4 and can be used for various functions including a soft-
op
ware input capture. Extended time periods can be attained using the TOF function
to increment a temporary RAM storage location thereby simulating a 16-bit (or
more) counter. The value of each bit of the TCR is shown in Figure 8-3. This reg-
ister is cleared by reset.
7
6
5
4
3
2
1
0
R
TMR7
TMR6
TMR5
TMR4
TMR3
TMR2
TMR1
TMR0
TCR
$09
W
Reset
0
0
0
0
0
0
0
0
Figure 8-3. Timer Counter Register
8.3.2 Timer Control/Status Register (TCSR) $08
The TCSR contains the timer interrupt flag bits, the timer interrupt enable bits, and
the real time interrupt rate select bits. Bit 2 and bit 3 are write-only bits which will
read as logical zeros. Figure 8-4 shows the value of each bit in the TCSR follow-
ing reset.
7
6
5
TOFE
0
4
RTIE
0
3
0
2
0
1
RT1
1
0
RT0
1
R
TOF
RTIF
TCSR
$08
W
TOFR
RTIFR
Reset
0
0
0
0
Figure 8-4. Timer Control/Status Register (TCSR)
TOF - Timer Overflow Flag
The TOF is a read-only flag bit.
1 = Set when the 8-bit ripple counter rolls over from $FF to $00. A
TIMER Interrupt request will be generated if TOFE is also set.
0 = Reset by writing a logical one to the TOF acknowledge bit, TOFR.
Writing to the TOF flag bit has no effect on its value. This bit is
cleared by reset.
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RTIF - Real Time Interrupt Flag
The RTIF is a read-only flag bit.
1 = Set when the output of the chosen (1 of 4 selections) Real Time
Interrupt stage goes active. A TIMER Interrupt request will be
generated if RTIE is also set.
0 = Reset by writing a logical one to the RTIF acknowledge bit, RTIFR.
Writing to the RTIF flag bit has no effect on its value. This bit is
cleared by reset.
TOFE - Timer Overflow Enable
The TOFE is an enable bit that allows generation of a TIMER Interrupt upon
overflow of the Timer Counter Register.
1 = When set, the TIMER Interrupt is generated when the TOF flag bit is
set.
0 = When cleared, no TIMER interrupt caused by TOF bit set will be
generated. This bit is cleared by reset.
RTIE - Real Time Interrupt Enable
The RTIE is an enable bit that allows generation of a TIMER Interrupt by the
RTIF bit.
1 = When set, the TIMER Interrupt is generated when the RTIF flag bit is
set.
0 = When cleared, no TIMER interrupt caused by RTIF bit set will be
generated. This bit is cleared by reset.
TOFR - Timer Overflow Acknowledge
The TOFR is an acknowledge bit that resets the TOF flag bit. This bit is unaf-
fected by reset. Reading the TOFR will always return a logical zero.
1 = Clears the TOF flag bit.
0 = Does not clear the TOF flag bit.
RTIFR - Real Time Interrupt Acknowledge
The RTIFR is an acknowledge bit that resets the RTIF flag bit. This bit is unaf-
fected by reset. Reading the RTIFR will always return a logical zero.
1 = Clears the RTIF flag bit.
0 = Does not clear the RTIF flag bit.
RT1, RT0 - Real Time Interrupt Rate Select
The RT0 and RT1 control bits select one of four taps for the Real Time Interrupt
circuit. Table 8-1 shows the available interrupt rates for two f values. Both the
op
RT0 and RT1 control bits are set by reset, selecting the lowest periodic rate and
therefore the maximum time in which to alter these bits if necessary. Care
should be taken when altering RT0 and RT1 if the time-out period is imminent
or uncertain. If the selected tap is modified during a cycle in which the counter
is switching, an RTIF could be missed or an additional one could be generated.
To avoid problems, the COP should be cleared just prior to changing RTI taps.
MOTOROLA
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MULTI-FUNCTION TIMER
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Table 8-1. RTI Rates and COP Reset Times
RTI Rates at f Freq. specified:
Min. COP Reset at f Freq. specified:
OP
OP
RT1
RT0
Divider
16384
32768
65536
131072
1MHz
2MHz
Divider
131072
262144
524288
1048576
1MHz
131ms
262ms
524ms
1059ms
2MHz
66ms
0
0
1
1
0
1
0
1
16.384ms
32.768ms
65.536ms
131.072ms
8.192ms
16.384ms
32.768ms
65.536ms
131ms
262ms
524ms
8.4
OPERATION DURING STOP MODE
The timer system is cleared when going into STOP mode. When STOP is exited
by an external interrupt or an LVR reset or an external RESET, the internal oscilla-
tor will resume, followed by a 224 (or 4064) internal processor oscillator stabilizing
delay. The timer system counter is then cleared and operation resumes. If chosen
by a mask option, the STOP instruction will initiate HALT mode and the effects on
the timer are as described in Section 8.5.
8.5
OPERATION DURING WAIT/HALT MODE
The CPU clock halts during the WAIT/HALT mode, but the timer remains active. If
interrupts are enabled, a timer interrupt or custom periodic interrupt will cause the
processor to exit the WAIT/HALT mode.
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MOTOROLA
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SECTION 9
16-BIT TIMER
This 16-bit Timer (Timer1) is a Programmable Timer with an Input Capture
function. Figure 9-1 shows a block diagram of the 16-bit programmable timer.
EDGE
SIGNAL
SELECT
PB0/
TCAP
ICH ($14)
ICL ($15)
CONDITIONING
& DETECT
LOGIC
TCNTH ($18) TCNTL ($19)
ACNTH ($1A) ACNTL ($1B)
TCAPS
(bit 7 at $02)
INTERNAL
CLOCK
OSC
16-BIT COUNTER
÷ 4
(f
÷ 2)
TIMER1
INTERRUPT
REQUEST
RESET
TIMER1 CONTROL REGISTER
$12
TIMER1 STATUS REGISTER
$13
INTERNAL DATA BUS
Figure 9-1. 16-Bit Timer Block Diagram
MC68HC05J5A
REV 2.1
16-BIT TIMER
MOTOROLA
9-1
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The basis of the 16-bit Timer is a 16-bit free-running counter which increases in
count with each internal bus clock cycle. The counter is the timing reference for
the input capture and output compare functions. The input capture and output
compare functions provide a means to latch the times at which external events
occur, to measure input waveforms, and to generate output waveforms and timing
delays. Software can read the value in the 16-bit free-running counter at any time
without affect the counter sequence.
Because of the 16-bit timer architecture, the I/O registers are pairs of 8-bit regis-
ters. Each register pair contains the high and low byte of that function. Generally,
accessing the low byte of a specific timer function allows full control of that func-
tion; however, an access of the high byte inhibits that specific timer function until
the low byte is also accessed.
Because the counter is 16 bits long and preceded by a fixed divide-by-four pres-
caler, the counter rolls over every 262,144 internal clock cycles. Timer resolution
with a 4MHz crystal oscillator is 2 microsecond/count.
The interrupt capability and the input capture edge are controlled by the timer con-
trol register (T1CR) located at $0012 and the status of the interrupt flags can be
read from the timer status register (T1SR) located at $0013.
9.1
TIMER1 COUNTER REGISTERS (TCNTH,TCNTL)
The functional block diagram of the 16-bit free-running timer counter and timer
registers is shown in Figure 9-2. The timer registers include a transparent buffer
latch on the LSB of the 16-bit timer counter.
READ
TCNTL
LATCH
TCNTL ($19)
TCNTL LSB
READ
TCNTH
READ
TCNTH ($18)
($FFFC)
INTERNAL
CLOCK
OSC
RESET
÷ 4
16-BIT COUNTER
(f
÷ 2)
OVERFLOW (T1OF)
TIMER1
INTERRUPT
REQUEST
TIMER1 CONTROL REG.
$12
TIMER1 STATUS REG.
$13
INTERNAL
DATA
BUS
Figure 9-2. 16-Bit Timer Counter Block Diagram
MOTOROLA
9-2
16-BIT TIMER
MC68HC05J5A
REV 2.1
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The timer counter registers (TCNTH, TCNTL) shown in Figure 9-3 are read-only
locations which contain the current high and low bytes of the 16-bit free-running
counter. Writing to the timer registers has no effect. Reset of the device presets
the timer counter to $FFFC.
BIT 7
Bit15
BIT 6
Bit14
BIT 5
Bit13
BIT 4
Bit12
BIT 3
Bit11
BIT 2
Bit10
BIT 1
Bit9
BIT 0
Bit8
TCNTH
$0018
R
W
reset:
1
Bit7
1
1
Bit6
1
1
Bit5
1
1
Bit4
1
1
Bit3
1
1
Bit2
1
1
Bit1
0
1
Bit0
0
TCNTL
$0019
R
W
reset:
Figure 9-3. 16-Bit Timer Counter Registers (TCNTH, TCNTL)
The TCNTL latch is a transparent read of the LSB until the a read of the TCNTH
takes place. A read of the TCNTH latches the LSB into the TCNTL location until
the TCNTL is again read. The latched value remains fixed even if multiple reads of
the TCNTH take place before the next read of the TCNTL. Therefore, when read-
ing the MSB of the timer at TCNTH the LSB of the timer at TCNTL must also be
read to complete the read sequence.
During power-on-reset (POR), the counter is initialized to $FFFC and begins
counting after the oscillator start-up delay. Because the counter is 16 bits and pre-
ceded by a fixed divide-by-four prescaler, the value in the counter repeats every
262, 144 internal bus clock cycles (524, 288 oscillator cycles).
When the free-running counter rolls over from $FFFF to $0000, the timer overflow
flag bit (T1OF) is set in the T1SR. When the T1OF is set, it can generate an inter-
rupt if the timer overflow interrupt enable bit (T1OIE) is also set in the T1CR. The
T1OF flag bit can only be reset by reading the TCNTL after reading the T1SR.
Other than clearing any possible T1OF flags, reading the TCNTH and TCNTL in
any order or any number of times does not have any effect on the 16-bit free-run-
ning counter.
NOTE
To prevent interrupts from occurring between readings of the TCNTH and TCNTL,
set the I bit in the condition code register (CCR) before reading TCNTH and clear
the I bit after reading TCNTL.
9.2
ALTERNATE COUNTER REGISTERS (ACNTH, ACNTL)
The functional block diagram of the 16-bit free-running timer counter and alternate
counter registers is shown in Figure 9-4. The alternate counter registers behave
the same as the timer counter registers, except that any reads of the alternate
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counter will not have any effect on the T1OF flag bit and Timer interrupts. The
alternate counter registers include a transparent buffer latch on the LSB of the 16-
bit timer counter.
INTERNAL
DATA
BUS
READ
ACNTL
LATCH
ACNTL ($1B)
TMR LSB
READ
ACNTH
READ
ACNTH ($1A)
INTERNAL
CLOCK
OSC
($FFFC)
RESET
÷ 4
16-BIT COUNTER
(f
÷ 2)
Figure 9-4. Alternate Counter Block Diagram
The alternate counter registers (ACNTH, ACNTL) shown in Figure 9-5 are read-
only locations which contain the current high and low bytes of the 16-bit free-run-
ning counter. Writing to the alternate counter registers has no effect. Reset of the
device presets the timer counter to $FFFC.
BIT 7
Bit15
BIT 6
Bit14
BIT 5
Bit13
BIT 4
Bit12
BIT 3
Bit11
BIT 2
Bit10
BIT 1
Bit9
BIT 0
Bit8
ACNTH
$001A
R
W
reset:
1
Bit7
1
1
Bit6
1
1
Bit5
1
1
Bit4
1
1
Bit3
1
1
Bit2
1
1
Bit1
0
1
Bit0
0
ACNTL
$001B
R
W
reset:
Figure 9-5. Alternate Counter Registers (ACNTH, ACNTL)
The ACNTL latch is a transparent read of the LSB until the a read of the ACNTH
takes place. A read of the ACNTH latches the LSB into the ACNTL location until
the ACNTL is again read. The latched value remains fixed even if multiple reads of
the ACNTH take place before the next read of the ACNTL. Therefore, when read-
ing the MSB of the timer at ACNTH the LSB of the timer at ACNTL must also be
read to complete the read sequence.
During power-on-reset (POR), the counter is initialized to $FFFC and begins
counting after the oscillator start-up delay. Because the counter is 16 bits and pre-
ceded by a fixed divide-by-four prescaler, the value in the counter repeats every
262,144 internal bus clock cycles (524,288 oscillator cycles).
Reading the ACNTH and ACNTL in any order or any number of times does not
have any effect on the 16-bit free-running counter or the T1OF flag bit.
MOTOROLA
9-4
16-BIT TIMER
MC68HC05J5A
REV 2.1
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NOTE
To prevent interrupts from occurring between readings of the ACNTH and ACNTL,
set the I bit in the condition code register (CCR) before reading ACNTH and clear
the I bit after reading ACNTL.
9.3
INPUT CAPTURE REGISTERS
INTERNAL
DATA
BUS
READ
ICH
EDGE
SELECT
& DETECT
LOGIC
READ
ICH ($14)
ICL ($15)
LATCH
SIGNAL
CONDITIONING
PB0/
TCAP
ICL
INTERNAL
CLOCK
÷ 4
16-BIT COUNTER
INPUT CAPTURE (ICF)
(f
÷ 2)
OSC
TIMER1
INTERRUPT
REQUEST
TCAPS
(bit7 at $02)
RESET
TIMER1 CONTROL REG.
$12
TIMER1 STATUS REG.
$13
INTERNAL
DATA
BUS
Figure 9-6. Timer Input Capture Block Diagram
The input capture function is a technique whereby an external signal (connected
to PB0/TCAP pin) is used to trigger the 16-bit timer counter. In this way it is possi-
ble to relate the timing of an external signal to the internal counter value, and
hence to elapsed time.
NOTE
Since the TCAP pin is shared with the PB0 I/O pin, changing the state of the PB0
DDR or Data Register can cause an unwanted TCAP interrupt. This can be
avoided by clearing the ICIE bit before changing the configuration of PB0, and
clearing any pending interrupts before enabling ICIE.
The signal on the TCAP pin is first directed to a schmitt trigger or a voltage
comparator as shown in Figure 9-8. Setting the TCAPS bit to “1” will enable the
comparator and the V /2 reference voltage.
DD
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BIT 7
TCAPS
0
BIT 6
0
BIT 5
0
BIT 4
0
BIT 3
0
BIT 2
0
BIT 1
0
BIT 0
0
T1CC
$0002
R
W
reset:
Figure 9-7.Timer1 Capture Control Register
TCAPS — Timer Input Capture Comparator Enable
1 = Timer input capture comparator is selected.
0 = Timer input capture comparator schmitt trigger is selected.
NOTE
When the comparator and V /2 reference are enabled, PB0 pin will automatically
DD
becomes an input pin, irrespective of DDR setting. However, it is recommended to
set PB0 as an input first (via DDR), before enabling the comparator. A read of PB0
will reflect the TCAP pin status, not the PB0 register bit.
The comparator uses the V /2 reference as the compare voltage, resulting in a
DD
typical output as shown in Figure 9-9.
Switching off the V /2 voltage reference by clearing TCAPS=0 will further save
DD
power when the MCU is in a low power mode.
PB0 I/O
PORT LOGIC
PB0/
TCAP
Schmitt Trigger
Voltage
Reference
To edge select and
detect logic
MUX
Comparator
+
–
V
÷ 2
DD
V
REF
TCAPS bit
EN
Figure 9-8. TCAP Input Signal Conditioning
MOTOROLA
9-6
16-BIT TIMER
MC68HC05J5A
REV 2.1
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V
DD
Output of Comparator
V
÷ 2
DD
Signal on TCAP pin
Time
Figure 9-9. TCAP Input Comparator Output
When the input capture circuitry detects an active edge on the TCAP pin, it
latches the contents of the free-running timer counter registers into the input cap-
ture registers as shown in Figure 9-6.
Latching values into the input capture registers at successive edges of the same
polarity measures the period of the selected input signal. Latching the counter val-
ues at successive edges of opposite polarity measures the pulse width of the sig-
nal.
The input capture registers are made up of two 8-bit read-only registers (ICH, ICL)
as shown in Figure 9-10. The input capture edge detector contains a Schmitt trig-
ger to improve noise immunity. The edge that triggers the counter transfer is
defined by the input edge bit (IEDG) in the T1CR. Reset does not affect the con-
tents of the input capture registers.
The result obtained by an input capture will be one count higher than the value of
the free-running timer counter preceding the external transition. This delay is
required for internal synchronization. Resolution is affected by the prescaler,
allowing the free-running timer counter to increment once every four internal clock
cycles (eight oscillator clock cycles).
BIT 7
Bit15
BIT 6
Bit14
BIT 5
Bit13
BIT 4
Bit12
BIT 3
Bit11
BIT 2
Bit10
BIT 1
Bit9
BIT 0
Bit8
ICH
R
$0014
W
reset:
U
Bit7
U
U
Bit6
U
U
Bit5
U
U
Bit4
U
U
Bit3
U
U
Bit2
U
U
Bit1
U
U
Bit0
U
ICL
R
$0015
W
reset:
U = UNAFFECTED BY RESET
Figure 9-10. Input Capture Registers (ICH, ICL)
MC68HC05J5A
REV 2.1
16-BIT TIMER
MOTOROLA
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Reading the ICH inhibits further captures until the ICL is also read. Reading the
ICL after reading the timer status register (T1SR) clears the ICF flag bit. does not
inhibit transfer of the free-running counter. There is no conflict between reading
the ICL and transfers from the free-running timer counters. The input capture reg-
isters always contain the free-running timer counter value which corresponds to
the most recent input capture.
NOTE
To prevent interrupts from occurring between readings of the ICH and ICL, set the
I bit in the condition code register (CCR) before reading ICH and clear the I bit
after reading ICL.
9.4
TIMER1 CONTROL REGISTER (T1CR)
The timer control register is shown in Figure 9-11 performs the following func-
tions:
•
•
•
•
Enables input capture interrupts
Enables output compare interrupts
Enables timer overflow interrupts
Control the active edge polarity of the TCAP signal on pin PB0/TCAP
Reset clears all the bits in the T1CR with the exception of the IEDG bit which is
unaffected.
BIT 7
ICIE
0
BIT 6
0
BIT 5
T1OIE
0
BIT 4
0
BIT 3
0
BIT 2
0
BIT 1
IEDG
U
BIT 0
0
T1CR
$0012
R
W
reset:
0
0
0
0
0
U = UNAFFECTED BY RESET
Figure 9-11. Timer Control Register (T1CR)
ICIE - INPUT CAPTURE INTERRUPT ENABLE
This read/write bit enables interrupts caused by an active signal on the PB0/
TCAP pin. Reset clears the ICIE bit.
1 = Input capture interrupts enabled.
0 = Input capture interrupts disabled.
T1OIE - TIMER OVERFLOW INTERRUPT ENABLE
This read/write bit enables interrupts caused by a timer1 overflow. Reset clears
the T1OIE bit.
1 = Timer1 overflow interrupts enabled.
0 = Timer1 overflow interrupts disabled.
MOTOROLA
9-8
16-BIT TIMER
MC68HC05J5A
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IEDG - INPUT CAPTURE EDGE SELECT
The state of this read/write bit determines whether a positive or negative transi-
tion on the TCAP pin triggers a transfer of the contents of the timer register to
the input capture register. Reset has no effect on the IEDG bit.
1 = Positive edge (low to high transition) triggers input capture.
0 = Negative edge (high to low transition) triggers input capture.
9.5
TIMER1 STATUS REGISTER (T1SR)
The timer status register (T1SR) shown in Figure 9-12 contains flags for the fol-
lowing events:
•
An active signal on the PB0/TCAP pin, transferring the contents of the
timer registers to the input capture registers.
•
An overflow of the timer registers from $FFFF to $0000.
Writing to any of the bits in the T1SR has no effect. Reset does not change the
state of any of the flag bits in the T1SR.
BIT 7
ICF
BIT 6
0
BIT 5
T1OF
BIT 4
0
BIT 3
0
BIT 2
0
BIT 1
0
BIT 0
0
T1SR
$0013
R
W
reset:
U
U
U
0
0
0
0
0
U = UNAFFECTED BY RESET
Figure 9-12. Timer Status Registers (T1SR)
ICF - INPUT CAPTURE FLAG
The ICF bit is automatically set when an edge of the selected polarity occurs on
the PB0/TCAP pin. Clear the ICF bit by reading the timer status register with
the ICF set, and then reading the low byte (ICL, $0015) of the input capture
registers. Reset has no effect on ICF.
T1OF - TIMER1 OVERFLOW FLAG
The T1OF bit is automatically set when the 16-bit timer counter rolls over from
$FFFF to $0000. Clear the T1OF bit by reading the timer status register with
the T1OF set, and then accessing the low byte (TCNTL, $0019) of the timer
registers. Reset has no effect on T1OF.
9.6
9.7
TIMER1 OPERATION DURING WAIT MODE
During WAIT mode the 16-bit timer continues to operate normally and may gener-
ate an interrupt to trigger the MCU out of the WAIT mode.
TIMER1 OPERATION DURING STOP MODE
When the MCU enters the STOP mode the free-running counter stops counting
(the internal processor clock is stopped). It remains at that particular count value
until the STOP mode is exited by applying a low signal to the IRQ pin, at which
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time the counter resumes from its stopped value as if nothing had happened. If
STOP mode is exited via an external reset (logic low applied to the RESET pin)
the counter is forced to $FFFC.
If a valid input capture edge occurs at the PB0/TCAP pin during the STOP mode
the input capture detect circuitry will be armed. This action does not set any flags
or “wake up” the MCU, but when the MCU does “wake up” there will be an active
input capture flag (and data) from the first valid edge. If the STOP mode is exited
by an external reset, no input capture flag or data will be present even if a valid
input capture edge was detected during the STOP mode.
MOTOROLA
9-10
16-BIT TIMER
MC68HC05J5A
REV 2.1
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SECTION 10
INSTRUCTION SET
This section describes the addressing modes and instruction types.
10.1 ADDRESSING MODES
The CPU uses eight addressing modes for flexibility in accessing data. The
addressing modes define the manner in which the CPU finds the data required to
execute an instruction. The eight addressing modes are the following:
•
•
•
•
•
•
•
•
Inherent
Immediate
Direct
Extended
Indexed, No Offset
Indexed, 8-Bit Offset
Indexed, 16-Bit Offset
Relative
10.1.1 Inherent
Inherent instructions are those that have no operand, such as return from interrupt
(RTI) and stop (STOP). Some of the inherent instructions act on data in the CPU
registers, such as set carry flag (SEC) and increment accumulator (INCA).
Inherent instructions require no memory address and are one byte long.
10.1.2 Immediate
Immediate instructions are those that contain a value to be used in an operation
with the value in the accumulator or index register. Immediate instructions require
no memory address and are two bytes long. The opcode is the first byte, and the
immediate data value is the second byte.
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10.1.3 Direct
Direct instructions can access any of the first 256 memory addresses with two
bytes. The first byte is the opcode, and the second is the low byte of the operand
address. In direct addressing, the CPU automatically uses $00 as the high byte of
the operand address. BRSET and BRCLR are three-byte instructions that use
direct addressing to access the operand and relative addressing to specify a
branch destination.
10.1.4 Extended
Extended instructions use only three bytes to access any address in memory. The
first byte is the opcode; the second and third bytes are the high and low bytes of
the operand address.
When using the Motorola assembler, the programmer does not need to specify
whether an instruction is direct or extended. The assembler automatically selects
the shortest form of the instruction.
10.1.5 Indexed, No Offset
Indexed instructions with no offset are one-byte instructions that can access data
with variable addresses within the first 256 memory locations. The index register
contains the low byte of the conditional address of the operand. The CPU
automatically uses $00 as the high byte, so these instructions can address
locations $0000–$00FF.
Indexed, no offset instructions are often used to move a pointer through a table or
to hold the address of a frequently used RAM or I/O location.
10.1.6 Indexed, 8-Bit Offset
Indexed, 8-bit offset instructions are two-byte instructions that can access data
with variable addresses within the first 511 memory locations. The CPU adds the
unsigned byte in the index register to the unsigned byte following the opcode. The
sum is the conditional address of the operand. These instructions can access
locations $0000–$01FE.
Indexed 8-bit offset instructions are useful for selecting the kth element in an
n-element table. The table can begin anywhere within the first 256 memory
locations and could extend as far as location 510 ($01FE). The k value is typically
in the index register, and the address of the beginning of the table is in the byte
following the opcode.
MOTOROLA
10-2
INSTRUCTION SET
MC68HC05J5A
REV 2.1
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10.1.7 Indexed, 16-Bit Offset
Indexed, 16-bit offset instructions are three-byte instructions that can access data
with variable addresses at any location in memory. The CPU adds the unsigned
byte in the index register to the two unsigned bytes following the opcode. The sum
is the conditional address of the operand. The first byte after the opcode is the
high byte of the 16-bit offset; the second byte is the low byte of the offset. These
instructions can address any location in memory.
Indexed, 16-bit offset instructions are useful for selecting the kth element in an
n-element table anywhere in memory.
As with direct and extended addressing, the Motorola assembler determines the
shortest form of indexed addressing.
10.1.8 Relative
Relative addressing is only for branch instructions. If the branch condition is true,
the CPU finds the conditional branch destination by adding the signed byte
following the opcode to the contents of the program counter. If the branch
condition is not true, the CPU goes to the next instruction. The offset is a signed,
two’s complement byte that gives a branching range of –128 to +127 bytes from
the address of the next location after the branch instruction.
When using the Motorola assembler, the programmer does not need to calculate
the offset, because the assembler determines the proper offset and verifies that it
is within the span of the branch.
10.1.9 Instruction Types
The MCU instructions fall into the following five categories:
•
•
•
•
•
Register/Memory Instructions
Read-Modify-Write Instructions
Jump/Branch Instructions
Bit Manipulation Instructions
Control Instructions
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10.1.10 Register/Memory Instructions
Most of these instructions use two operands. One operand is in either the
accumulator or the index register. The CPU finds the other operand in memory.
Table 10-1 lists the register/memory instructions.
Table 10-1. Register/Memory Instructions
Instruction
Add Memory Byte and Carry Bit to Accumulator
Add Memory Byte to Accumulator
AND Memory Byte with Accumulator
Bit Test Accumulator
Mnemonic
ADC
ADD
AND
BIT
Compare Accumulator
CMP
CPX
EOR
LDA
Compare Index Register with Memory Byte
EXCLUSIVE OR Accumulator with Memory Byte
Load Accumulator with Memory Byte
Load Index Register with Memory Byte
Multiply
LDX
MUL
ORA
SBC
STA
OR Accumulator with Memory Byte
Subtract Memory Byte and Carry Bit from Accumulator
Store Accumulator in Memory
Store Index Register in Memory
STX
Subtract Memory Byte from Accumulator
SUB
MOTOROLA
10-4
INSTRUCTION SET
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10.1.11 Read-Modify-Write Instructions
These instructions read a memory location or a register, modify its contents, and
write the modified value back to the memory location or to the register.The test for
negative or zero instruction (TST) is an exception to the read-modify-write
sequence because it does not write a replacement value. Table 10-2 lists the
read-modify-write instructions.
Table 10-2. Read-Modify-Write Instructions
Instruction
Mnemonic
ASL
Arithmetic Shift Left
Arithmetic Shift Right
Clear Bit in Memory
Set Bit in Memory
ASR
BCLR
BSET
CLR
Clear
Complement (One’s Complement)
Decrement
COM
DEC
Increment
INC
Logical Shift Left
LSL
Logical Shift Right
LSR
Negate (Two’s Complement)
Rotate Left through Carry Bit
Rotate Right through Carry Bit
Test for Negative or Zero
NEG
ROL
ROR
TST
10.1.12 Jump/Branch Instructions
Jump instructions allow the CPU to interrupt the normal sequence of the program
counter. The unconditional jump instruction (JMP) and the jump to subroutine
instruction (JSR) have no register operand. Branch instructions allow the CPU to
interrupt the normal sequence of the program counter when a test condition is
met. If the test condition is not met, the branch is not performed. All branch
instructions use relative addressing.
Bit test and branch instructions cause a branch based on the state of any
readable bit in the first 256 memory locations. These three-byte instructions use a
combination of direct addressing and relative addressing. The direct address of
the byte to be tested is in the byte following the opcode. The third byte is the
signed offset byte. The CPU finds the conditional branch destination by adding the
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10-5
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third byte to the program counter if the specified bit tests true. The bit to be tested
and its condition (set or clear) is part of the opcode. The span of branching is from
–128 to +127 from the address of the next location after the branch instruction.
The CPU also transfers the tested bit to the carry/borrow bit of the condition code
register. Table 10-3 lists the jump and branch instructions.
Table 10-3. Jump and Branch Instructions
Instruction
Branch if Carry Bit Clear
Branch if Carry Bit Set
Branch if Equal
Mnemonic
BCC
BCS
BEQ
BHCC
BHCS
BHI
Branch if Half-Carry Bit Clear
Branch if Half-Carry Bit Set
Branch if Higher
Branch if Higher or Same
Branch if IRQ Pin High
Branch if IRQ Pin Low
Branch if Lower
BHS
BIH
BIL
BLO
Branch if Lower or Same
Branch if Interrupt Mask Clear
Branch if Minus
BLS
BMC
BMI
Branch if Interrupt Mask Set
Branch if Not Equal
Branch if Plus
BMS
BNE
BPL
Branch Always
BRA
Branch if Bit Clear
BRCLR
BRN
BRSET
BSR
Branch Never
Branch if Bit Set
Branch to Subroutine
Unconditional Jump
Jump to Subroutine
JMP
JSR
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10.1.13 Bit Manipulation Instructions
The CPU can set or clear any writable bit in the first 256 bytes of memory. Port
registers, port data direction registers, timer registers, and on-chip RAM locations
are in the first 256 bytes of memory. The CPU can also test and branch based on
the state of any bit in any of the first 256 memory locations. Bit manipulation
instructions use direct addressing. Table 10-4 lists these instructions.
Table 10-4. Bit Manipulation Instructions
Instruction
Mnemonic
BCLR
Clear Bit
Branch if Bit Clear
Branch if Bit Set
Set Bit
BRCLR
BRSET
BSET
10.1.14 Control Instructions
These register reference instructions control CPU operation during program
execution. Control instructions, listed in Table 10-5, use inherent addressing.
Table 10-5. Control Instructions
Instruction
Mnemonic
CLC
Clear Carry Bit
Clear Interrupt Mask
CLI
No Operation
NOP
RSP
RTI
Reset Stack Pointer
Return from Interrupt
Return from Subroutine
Set Carry Bit
RTS
SEC
SEI
Set Interrupt Mask
Stop Oscillator and Enable IRQ Pin
Software Interrupt
STOP
SWI
Transfer Accumulator to Index Register
Transfer Index Register to Accumulator
Stop CPU Clock and Enable Interrupts
TAX
TXA
WAIT
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10-7
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10.1.15 Instruction Set Summary
Table 10-6 is an alphabetical list of all M68HC05 instructions and shows the effect
of each instruction on the condition code register.
Table 10-6. Instruction Set Summary
Effect on
Source
Form
CCR
Operation
Description
H I N Z C
ADC #opr
ADC opr
ADC opr
ADC opr,X
ADC opr,X
ADC ,X
IMM A9 ii
DIR B9 dd
EXT C9 hh ll
2
3
4
5
4
3
Add with Carry
A ← (A) + (M) + (C)
↕ —
↕
↕
↕
↕
↕
↕
IX2
IX1
IX
D9 ee ff
E9 ff
F9
ADD #opr
ADD opr
ADD opr
ADD opr,X
ADD opr,X
ADD ,X
IMM AB ii
DIR BB dd
EXT CB hh ll
2
3
4
5
4
3
Add without Carry
Logical AND
A ← (A) + (M)
↕ —
↕
IX2
IX1
IX
DB ee ff
EB ff
FB
AND #opr
AND opr
AND opr
AND opr,X
AND opr,X
AND ,X
IMM A4 ii
DIR B4 dd
EXT C4 hh ll
2
3
4
5
4
3
A ← (A) (M)
— —
↕ —
IX2
IX1
IX
D4 ee ff
E4 ff
F4
ASL opr
ASLA
ASLX
ASL opr,X
ASL ,X
38 dd
48
58
68 ff
78
5
3
3
6
5
Arithmetic Shift Left
(Same as LSL)
— —
— —
↕
↕
↕
↕
↕
↕
↕
C
0
b7
b7
b0
b0
ASR opr
ASRA
ASRX
ASR opr,X
ASR ,X
DIR
INH
INH
IX1
IX
37 dd
47
57
67 ff
77
5
3
3
6
5
C
Arithmetic Shift Right
Branch if Carry Bit
Clear
BCC rel
PC ← (PC) + 2 + rel ? C = 0
— — — — — REL
24 rr
3
DIR (b0) 11 dd
DIR (b1) 13 dd
DIR (b2) 15 dd
DIR (b3) 17 dd
DIR (b4) 19 dd
DIR (b5) 1B dd
DIR (b6) 1D dd
DIR (b7) 1F dd
5
5
5
5
5
5
5
5
BCLR n opr
Clear Bit n
Mn ← 0
— — — — —
Branch if Carry Bit
Set (Same as BLO)
BCS rel
BEQ rel
PC ← (PC) + 2 + rel ? C = 1
PC ← (PC) + 2 + rel ? Z = 1
— — — — — REL
— — — — — REL
25 rr
27 rr
3
3
Branch if Equal
MOTOROLA
10-8
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Table 10-6. Instruction Set Summary (Continued)
Effect on
CCR
Source
Form
Operation
Description
H I N Z C
Branch if Half-Carry
Bit Clear
BHCC rel
PC ← (PC) + 2 + rel ? H = 0
PC ← (PC) + 2 + rel ? H = 1
— — — — — REL
28 rr
3
Branch if Half-Carry
Bit Set
BHCS rel
BHI rel
— — — — — REL
29 rr
22 rr
24 rr
3
3
3
Branch if Higher
PC ← (PC) + 2 + rel ? C Z = 0 — — — — — REL
PC ← (PC) + 2 + rel ? C = 0 — — — — — REL
Branch if Higher or
Same
BHS rel
Branch if IRQ Pin
High
BIH rel
BIL rel
PC ← (PC) + 2 + rel ? IRQ = 1 — — — — — REL 2F rr
3
3
Branch if IRQ Pin
Low
PC ← (PC) + 2 + rel ? IRQ = 0 — — — — — REL 2E rr
BIT #opr
BIT opr
BIT opr
BIT opr,X
BIT opr,X
BIT ,X
IMM A5 ii
2
3
4
5
4
3
DIR
B5 dd
Bit Test
Accumulator with
Memory Byte
EXT C5 hh ll
(A) (M)
— — ↕ ↕ —
IX2
IX1
IX
D5 ee ff
E5 ff
F5
p
Branch if Lower
(Same as BCS)
BLO rel
BLS rel
PC ← (PC) + 2 + rel ? C = 1
— — — — — REL
25 rr
23 rr
3
3
Branch if Lower or
Same
PC ← (PC) + 2 + rel ? C Z = 1 — — — — — REL
Branch if Interrupt
Mask Clear
BMC rel
BMI rel
BMS rel
PC ← (PC) + 2 + rel ? I = 0
PC ← (PC) + 2 + rel ? N = 1
PC ← (PC) + 2 + rel ? I = 1
— — — — — REL 2C rr
— — — — — REL 2B rr
— — — — — REL 2D rr
3
3
3
Branch if Minus
Branch if Interrupt
Mask Set
BNE rel
BPL rel
BRA rel
Branch if Not Equal
Branch if Plus
PC ← (PC) + 2 + rel ? Z = 0
PC ← (PC) + 2 + rel ? N = 0
PC ← (PC) + 2 + rel ? 1 = 1
— — — — — REL
— — — — — REL 2A rr
— — — — — REL 20 rr
26 rr
3
3
3
Branch Always
DIR (b0) 01 dd rr
DIR (b1) 03 dd rr
DIR (b2) 05 dd rr
DIR (b3) 07 dd rr
DIR (b4) 09 dd rr
DIR (b5) 0B dd rr
DIR (b6) 0D dd rr
DIR (b7) 0F dd rr
5
5
5
5
5
5
5
5
BRCLR n opr rel Branch if bit n clear
PC ← (PC) + 2 + rel ? Mn = 0 — — — — ↕
DIR (b0) 00 dd rr
DIR (b1) 02 dd rr
DIR (b2) 04 dd rr
DIR (b3) 06 dd rr
DIR (b4) 08 dd rr
DIR (b5) 0A dd rr
DIR (b6) 0C dd rr
DIR (b7) 0E dd rr
5
5
5
5
5
5
5
5
BRSET n opr rel Branch if Bit n Set
PC ← (PC) + 2 + rel ? Mn = 1 — — — — ↕
BRN rel
Branch Never
PC ← (PC) + 2 + rel ? 1 = 0
— — — — — REL
21 rr
3
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10-9
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Table 10-6. Instruction Set Summary (Continued)
Effect on
CCR
Source
Form
Operation
Description
H I N Z C
DIR (b0) 10 dd
DIR (b1) 12 dd
DIR (b2) 14 dd
DIR (b3) 16 dd
DIR (b4) 18 dd
DIR (b5) 1A dd
DIR (b6) 1C dd
DIR (b7) 1E dd
5
5
5
5
5
5
5
5
BSET n opr
Set Bit n
Mn ← 1
— — — — —
PC ← (PC) + 2; push (PCL)
SP ← (SP) – 1; push (PCH)
SP ← (SP) – 1
Branch to
Subroutine
BSR rel
— — — — — REL AD rr
6
PC ← (PC) + rel
CLC
CLI
Clear Carry Bit
C ← 0
I ← 0
— — — — 0
INH
98
9A
2
2
Clear Interrupt Mask
— 0 — — — INH
CLR opr
CLRA
CLRX
CLR opr,X
CLR ,X
M ← $00
A ← $00
X ← $00
M ← $00
M ← $00
DIR
INH
3F dd
4F
5F
6F ff
7F
5
3
3
6
5
Clear Byte
— — 0 1 — INH
IX1
IX
CMP #opr
CMP opr
CMP opr
CMP opr,X
CMP opr,X
CMP ,X
IMM A1 ii
DIR B1 dd
EXT C1 hh ll
2
3
4
5
4
3
Compare
Accumulator with
Memory Byte
(A) – (M)
— —
— —
— —
— —
— —
↕
↕
↕
↕
↕
↕
↕
IX2
IX1
IX
D1 ee ff
E1 ff
F1
COM opr
COMA
COMX
COM opr,X
COM ,X
M ← ( ) = $FF – (M)
DIR
INH
INH
IX1
IX
33 dd
43
53
63 ff
73
5
3
3
6
5
M
A ← ( ) = $FF – (M)
A
Complement Byte
(One’s Complement)
X ← ( ) = $FF – (M)
↕ 1
X
M ← ( ) = $FF – (M)
M
M ← ( ) = $FF – (M)
M
CPX #opr
CPX opr
CPX opr
CPX opr,X
CPX opr,X
CPX ,X
IMM A3 ii
DIR B3 dd
EXT C3 hh ll
2
3
4
5
4
3
Compare Index
Register with
Memory Byte
(X) – (M)
↕
↕
IX2
IX1
IX
D3 ee ff
E3 ff
F3
DEC opr
DECA
DECX
DEC opr,X
DEC ,X
M ← (M) – 1
A ← (A) – 1
X ← (X) – 1
M ← (M) – 1
M ← (M) – 1
DIR
INH
INH
IX1
IX
3A dd
4A
5A
6A ff
7A
5
3
3
6
5
Decrement Byte
↕ —
EOR #opr
EOR opr
EOR opr
EOR opr,X
EOR opr,X
EOR ,X
IMM A8 ii
DIR B8 dd
EXT C8 hh ll
2
3
4
5
4
3
EXCLUSIVE OR
Accumulator with
Memory Byte
A ← (A) (M)
↕ —
IX2
IX1
IX
D8 ee ff
E8 ff
F8
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10-10
INSTRUCTION SET
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Table 10-6. Instruction Set Summary (Continued)
Effect on
CCR
Source
Form
Operation
Description
H I N Z C
INC opr
INCA
INCX
INC opr,X
INC ,X
M ← (M) + 1
A ← (A) + 1
X ← (X) + 1
M ← (M) + 1
M ← (M) + 1
DIR
INH
INH
IX1
IX
3C dd
4C
5C
6C ff
7C
5
3
3
6
5
Increment Byte
— —
↕
↕ —
JMP opr
JMP opr
JMP opr,X
JMP opr,X
JMP ,X
DIR BC dd
EXT CC hh ll
2
3
4
3
2
Unconditional Jump
Jump to Subroutine
PC ← Jump Address
— — — — —
— — — — —
IX2
IX1
IX
DC ee ff
EC ff
FC
JSR opr
JSR opr
JSR opr,X
JSR opr,X
JSR ,X
DIR BD dd
EXT CD hh ll
5
6
7
6
5
PC ← (PC) + n (n = 1, 2, or 3)
Push (PCL); SP ← (SP) – 1
Push (PCH); SP ← (SP) – 1
PC ← Conditional Address
IX2
IX1
IX
DD ee ff
ED ff
FD
LDA #opr
LDA opr
LDA opr
LDA opr,X
LDA opr,X
LDA ,X
IMM A6 ii
DIR B6 dd
EXT C6 hh ll
2
3
4
5
4
3
Load Accumulator
with Memory Byte
A ← (M)
X ← (M)
— —
↕
↕ —
IX2
IX1
IX
D6 ee ff
E6 ff
F6
LDX #opr
LDX opr
LDX opr
LDX opr,X
LDX opr,X
LDX ,X
IMM AE ii
DIR BE dd
EXT CE hh ll
2
3
4
5
4
3
Load Index Register
with Memory Byte
— —
— —
↕
↕
↕ —
IX2
IX1
IX
DE ee ff
EE ff
FE
LSL opr
LSLA
LSLX
LSL opr,X
LSL ,X
DIR
INH
INH
IX1
IX
38 dd
48
58
68 ff
78
5
3
3
6
5
Logical Shift Left
(Same as ASL)
C
0
↕
↕
b7
b0
LSR opr
LSRA
LSRX
LSR opr,X
LSR ,X
DIR
INH
INH
IX1
IX
34 dd
44
54
64 ff
74
5
3
3
6
5
0
C
Logical Shift Right
Unsigned Multiply
— — 0
↕
↕
b7
b0
MUL
X : A ← (X) × (A)
0 — — — 0
INH
42
11
NEG opr
NEGA
NEGX
NEG opr,X
NEG ,X
M ← –(M) = $00 – (M)
A ← –(A) = $00 – (A)
X ← –(X) = $00 – (X)
M ← –(M) = $00 – (M)
M ← –(M) = $00 – (M)
DIR
INH
INH
IX1
IX
30 ii
40
50
60 ff
70
5
3
3
6
5
Negate Byte
(Two’s Complement)
— —
↕
↕
↕
NOP
No Operation
— — — — — INH
9D
2
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10-11
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Table 10-6. Instruction Set Summary (Continued)
Effect on
CCR
Source
Form
Operation
Description
H I N Z C
ORA #opr
IMM AA ii
DIR BA dd
EXT CA hh ll
2
3
4
5
4
3
ORA opr
ORA opr
ORA opr,X
ORA opr,X
ORA ,X
Logical OR
Accumulator with
Memory
A ← (A) (M)
— —
↕
↕ —
IX2
IX1
IX
DA ee ff
EA ff
FA
ROL opr
ROLA
ROLX
ROL opr,X
ROL ,X
DIR
INH
INH
IX1
IX
39 dd
49
59
69 ff
79
5
3
3
6
5
Rotate Byte Left
through Carry Bit
C
— —
— —
↕
↕
↕
↕
b7
b0
ROR opr
RORA
RORX
ROR opr,X
ROR ,X
DIR
INH
INH
IX1
IX
36 dd
46
56
66 ff
76
5
3
3
6
5
Rotate Byte Right
through Carry Bit
C
↕
↕
b7
b0
RSP
RTI
Reset Stack Pointer
Return from Interrupt
SP ← $00FF
— — — — — INH
9C
80
2
SP ← (SP) + 1; Pull (CCR)
SP ← (SP) + 1; Pull (A)
SP ← (SP) + 1; Pull (X)
SP ← (SP) + 1; Pull (PCH)
SP ← (SP) + 1; Pull (PCL)
↕
↕
↕
↕
↕
INH
9
Return from
Subroutine
SP ← (SP) + 1; Pull (PCH)
SP ← (SP) + 1; Pull (PCL)
RTS
— — — — — INH
81
6
SBC #opr
SBC opr
SBC opr
SBC opr,X
SBC opr,X
SBC ,X
IMM A2 ii
DIR B2 dd
EXT C2 hh ll
2
3
4
5
4
3
Subtract Memory
Byte and Carry Bit
from Accumulator
A ← (A) – (M) – (C)
— —
↕
↕
↕
IX2
IX1
IX
D2 ee ff
E2 ff
F2
SEC
SEI
Set Carry Bit
C ← 1
I ← 1
— — — — 1
INH
99
2
2
Set Interrupt Mask
— 1 — — — INH
9B
STA opr
STA opr
STA opr,X
STA opr,X
STA ,X
DIR
B7 dd
4
5
6
5
4
EXT C7 hh ll
Store Accumulator in
Memory
M ← (A)
— —
↕
↕ —
IX2
IX1
IX
D7 ee ff
E7 ff
F7
Stop Oscillator and
Enable IRQ Pin
STOP
— 0 — — — INH
DIR
8E
2
STX opr
STX opr
STX opr,X
STX opr,X
STX ,X
BF dd
4
5
6
5
4
EXT CF hh ll
Store Index
Register In Memory
M ← (X)
— —
↕
↕ —
IX2
IX1
IX
DF ee ff
EF ff
FF
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Table 10-6. Instruction Set Summary (Continued)
Effect on
CCR
Source
Form
Operation
Description
H I N Z C
SUB #opr
IMM A0 ii
DIR B0 dd
EXT C0 hh ll
2
3
4
5
4
3
SUB opr
SUB opr
SUB opr,X
SUB opr,X
SUB ,X
Subtract Memory
Byte from
Accumulator
A ← (A) – (M)
— —
↕
↕
↕
IX2
IX1
IX
D0 ee ff
E0 ff
F0
PC ← (PC) + 1; Push (PCL)
SP ← (SP) – 1; Push (PCH)
SP ← (SP) – 1; Push (X)
SP ← (SP) – 1; Push (A)
SP ← (SP) – 1; Push (CCR)
SP ← (SP) – 1; I ← 1
SWI
TAX
Software Interrupt
— 1 — — — INH
83
97
10
PCH ← Interrupt Vector High Byte
PCL ← Interrupt Vector Low Byte
Transfer
Accumulator to
Index Register
X ← (A)
(M) – $00
A ← (X)
— — — — — INH
2
TST opr
TSTA
TSTX
TST opr,X
TST ,X
DIR
INH
3D dd
4D
5D
6D ff
7D
4
3
3
5
4
Test Memory Byte
for Negative or Zero
— —
↕
↕ —
INH
IX1
IX
Transfer Index
Register to
Accumulator
TXA
— — — — — INH
— 0 — — — INH
9F
8F
2
2
Stop CPU Clock and
Enable
WAIT
Interrupts
A
C
Accumulator
Carry/borrow flag
opr
PC
Operand (one or two bytes)
Program counter
CCR
dd
Condition code register
Direct address of operand
Direct address of operand and relative offset of branch instruction
Direct addressing mode
High and low bytes of offset in indexed, 16-bit offset addressing
Extended addressing mode
PCH
PCL
REL
rel
rr
SP
X
Z
Program counter high byte
Program counter low byte
Relative addressing mode
Relative program counter offset byte
Relative program counter offset byte
Stack pointer
dd rr
DIR
ee ff
EXT
ff
Offset byte in indexed, 8-bit offset addressing
Half-carry flag
Index register
Zero flag
H
hh ll
I
High and low bytes of operand address in extended addressing
Interrupt mask
#
Immediate value
Logical AND
ii
Immediate operand byte
Logical OR
IMM
INH
IX
IX1
IX2
M
Immediate addressing mode
Inherent addressing mode
Indexed, no offset addressing mode
Indexed, 8-bit offset addressing mode
Indexed, 16-bit offset addressing mode
Memory location
Logical EXCLUSIVE OR
Contents of
Negation (two’s complement)
Loaded with
( )
–( )
←
?
:
↕
—
If
Concatenated with
Set or cleared
Not affected
N
n
Negative flag
Any bit
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Table 10-7. Opcode Map
Bit Manipulation Branch
Read-Modify-Write
Control
Register/Memory
DIR
DIR
REL
DIR
INH
INH
IX1
IX
INH
INH
IMM
DIR
EXT
IX2
IX1
IX
MSB
LSB
MSB
LSB
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
5
5
3
5
3
3
6
5
9
2
3
4
5
4
3
BRSET0
BSET0
BRA
NEG
NEGA
NEGX
NEG
NEG
RTI
SUB
SUB
SUB
SUB
SUB
SUB
CMP
SBC
CPX
AND
BIT
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
3
DIR
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
DIR
5
2
2
2
2
2
REL
3
2
DIR
1
INH
1
INH
2
IX1
1
IX
1
1
INH
6
2
2
2
2
2
2
2
IMM
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
DIR
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
EXT
4
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
IX2
5
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
IX1
4
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
IX
3
5
BRCLR0
BCLR0
BRN
RTS
CMP
CMP
CMP
CMP
CMP
3
DIR
DIR
5
REL
3
INH
IMM
2
DIR
3
EXT
4
IX2
5
IX1
4
IX
3
5
11
BRSET1
BSET1
BHI
MUL
SBC
SBC
SBC
SBC
SBC
3
DIR
DIR
5
REL
3
1
1
1
INH
3
IMM
2
DIR
3
EXT
4
IX2
5
IX1
4
IX
3
5
5
3
6
5
10
BRCLR1
BCLR1
BLS
COM
COMA
COMX
COM
COM
LSR
SWI
CPX
CPX
CPX
CPX
CPX
3
DIR
DIR
5
REL
3
2
2
DIR
5
INH
3
1
1
INH
3
2
2
IX1
6
1
1
IX
5
1
INH
IMM
2
DIR
3
EXT
4
IX2
5
IX1
4
IX
3
5
BRSET2
BSET2
BCC
LSR
LSRA
LSRX
LSR
AND
AND
AND
AND
AND
3
DIR
DIR
5
REL
3
DIR
INH
INH
IX1
IX
IMM
2
DIR
3
EXT
4
IX2
5
IX1
4
IX
3
5
BRCLR2
BCLR2 BCS/BLO
BIT
BIT
BIT
BIT
LDA
STA
BIT
LDA
STA
3
DIR
DIR
5
2
2
2
2
2
2
2
2
2
2
2
REL
3
IMM
2
DIR
3
EXT
4
IX2
5
IX1
4
IX
3
5
5
3
3
6
5
BRSET3
BSET3
BNE
ROR
RORA
RORX
ROR
ROR
ASR
LDA
LDA
LDA
LDA
STA
EOR
ADC
ORA
ADD
JMP
JSR
LDX
STX
3
DIR
DIR
5
REL
3
2
2
DIR
5
1
1
INH
3
1
1
INH
3
2
2
IX1
6
1
1
IX
5
IMM
DIR
4
EXT
5
IX2
6
IX1
5
IX
4
5
2
RCLR3
BCLR3
BEQ
ASR
ASRA
ASRX
ASR
TAX
STA
STA
3
DIR
DIR
5
REL
3
DIR
5
INH
3
INH
3
IX1
6
IX
5
1
1
1
1
1
1
1
INH
2
DIR
3
EXT
4
IX2
5
IX1
4
IX
3
5
2
BRSET4
BSET4
BHCC
ASL/LSL ASLA/LSLA ASLX/LSLX ASL/LSL ASL/LSL
CLC
EOR
EOR
EOR
EOR
EOR
3
DIR
DIR
5
REL
3
2
2
2
DIR
5
1
1
1
INH
3
1
1
1
INH
3
2
2
2
IX1
6
1
1
1
IX
5
INH
2
2
2
2
2
IMM
2
DIR
3
EXT
4
IX2
5
IX1
4
IX
3
5
BRCLR4
BCLR4
BHCS
ROL
ROLA
ROLX
ROL
ROL
DEC
SEC
ADC
ADC
ADC
ADC
ADC
DIR
DIR
5
REL
3
DIR
5
INH
3
INH
3
IX1
6
IX
5
INH
2
IMM
2
DIR
3
EXT
4
IX2
5
IX1
4
IX
3
5
BRSET5
BSET5
BPL
DEC
DECA
DECX
DEC
CLI
ORA
ORA
ORA
ORA
ORA
3
DIR
DIR
5
REL
3
DIR
INH
INH
IX1
IX
INH
2
IMM
2
DIR
3
EXT
4
IX2
5
IX1
4
IX
3
5
BRCLR5
BCLR5
BMI
SEI
ADD
ADD
ADD
ADD
ADD
3
DIR
DIR
5
REL
3
INH
2
IMM
DIR
2
EXT
3
IX2
4
IX1
3
IX
2
5
5
3
3
6
5
BRSET6
BSET6
BMC
INC
INCA
INCX
INC
TST
INC
TST
RSP
JMP
JMP
JMP
JSR
LDX
STX
JMP
JSR
LDX
STX
3
DIR
DIR
5
REL
3
2
2
DIR
4
1
1
INH
3
1
1
INH
3
2
2
IX1
5
1
1
IX
4
INH
2
DIR
5
EXT
6
IX2
7
IX1
6
IX
5
5
6
BRCLR6
BCLR6
BMS
TST
TSTA
TSTX
NOP
BSR
JSR
JSR
DIR
DIR
5
REL
3
DIR
INH
INH
IX1
IX
INH
2
2
REL
2
DIR
3
EXT
4
IX2
5
IX1
4
IX
3
5
2
BRSET7
BSET7
BIL
STOP
LDX
LDX
LDX
3
DIR
DIR
5
REL
3
1
1
INH
2
IMM
DIR
4
EXT
5
IX2
6
IX1
5
IX
4
5
5
3
3
6
5
2
BRCLR7
BCLR7
BIH
CLR
CLRA
CLRX
CLR
CLR
WAIT
TXA
STX
STX
3
DIR
DIR
REL
2
DIR
1
INH
1
INH
2
IX1
1
IX
INH
1
INH
DIR
EXT
IX2
IX1
IX
INH = Inherent
IMM = Immediate
DIR = Direct
REL = Relative
IX = Indexed, No Offset
IX1 = Indexed, 8-Bit Offset
IX2 = Indexed, 16-Bit Offset
MSB
0
MSB of Opcode in Hexadecimal
LSB
5 Number of Cycles
LSB of Opcode in Hexadecimal
0
BRSET0 Opcode Mnemonic
3
DIR Number of Bytes/Addressing Mode
EXT = Extended
Freescale Semiconductor, Inc.
July 16, 1999
GENERAL RELEASE SPECIFICATION
SECTION 11
ELECTRICAL SPECIFICATIONS
This section provides the electrical and timing specifications for the
MC68HC05J5A.
11.1 MAXIMUM RATINGS
(Voltages referenced to V
)
SS
Rating
Symbol
Value
Unit
V
Supply Voltage
V
–0.3 to +7.0
DD
Test Mode (IRQ Pin Only)
V
V
– 0.3 to 2V + 0.3
V
IN
SS
DD
Current Drain Per Pin Excluding PB1, PB2, V and V
I
25
mA
°C
°C
DD
SS
Operating Junction Temperature
Storage Temperature Range
T
+150
J
T
–65 to +150
stg
NOTE
Maximum ratings are the extreme limits the device can be exposed to without
causing permanent damage to the chip. The device is not intended to operate at
these conditions.
The MCU contains circuitry that protect the inputs against damage from high
static voltages; however, do not apply voltages higher than those shown in the
table below. Keep V and V
within the range from V ≤ (V or V
) ≤ V .
IN
OUT
SS
IN
OUT
DD
Connect unused inputs to the appropriate voltage level, either V or V .
SS
DD
11.2 THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Thermal Resistance
θ
PDIP
SOIC
60
60
°C/W
°C/W
JA
θ
JA
11.3 FUNCTIONAL OPERATING RANGE
Characteristic
Symbol
Value
Unit
Operating Temperature Range
T
0 to +70
°C
A
5.0 ±10%
2.2 ±10%
Operating Voltage Range
V
V
DD
MC68HC05J5A
REV 2.1
ELECTRICAL SPECIFICATIONS
MOTOROLA
11-1
For More Information On This Product,
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GENERAL RELEASE SPECIFICATION
July 16, 1999
11.4 DC ELECTRICAL CHARACTERISTICS
Table 11-1. DC Electrical Characteristics, V =5 V
DD
2
1
Symbol
Min
Typ
Max
Unit
Characteristic
Output Voltage
= 10.0 µA
V
—
—
—
0.1
—
OL
V
I
V
V
V
– 0.1
Load
OH
DD
DD
Output High Voltage
(I =–0.8 mA) PA0-5, PB0, PB3-5
V
– 0.8
—
—
V
V
Load
OH
Output Low Voltage
(I
(I
(I
= 1.6mA) PA0-3, PB0, PB3-5
= 8mA) PA4-7
= 25mA) PB1, PB2 (see note 8)
—
—
—
—
—
—
0.4
0.4
0.5
Load
Load
Load
V
OL
Input High Voltage
PA0-5, PB0-5, IRQ, RESET, OSC1
V
0.7×V
—
—
V
DD
V
V
V
V
IH
DD
Input Low Voltage
PA0-5, PB0-5, IRQ, RESET, OSC1
V
V
0.2×V
—
IL
SS
DD
Positive-Going Input Threshold Voltage
PA6, PA7
V
—
1.7
T+
T–
Negative-Going Input Threshold Voltage
PA6, PA7
V
—
1.15
—
Supply Current
3
RUN
—
—
6
2
8
4
mA
mA
4
WAIT
I
5
DD
STOP
LVR on
LVR off
—
—
40
20
80
40
µA
µA
I/O Ports Hi-Z Leakage Current
PA0-7, PB0-5
I
—
—
±10
µA
µA
Z
(without individual pull-down/up activated)
Input Pull-down Current
PA0-5, PB0, PB3-5
(with individual pull-down activated)
I
50
100
200
IL
Input Pull-up Current
RESET
—
–140
—
–180
—
–240
±1
µA
µA
Input Current
IRQ, OSC1
I
in
Capacitance
Ports (as Input or Output)
RESET, IRQ, OSC1, OSC2/R
C
C
—
—
—
—
12
8
pF
pF
out
in
Crystal/Ceramic Resonator Oscillator Mode
Internal Resistor
R
—
—
3
MΩ
OSC1 to OSC2/R
OSC
MOTOROLA
11-2
ELECTRICAL SPECIFICATIONS
MC68HC05J5A
REV 2.1
For More Information On This Product,
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Freescale Semiconductor, Inc.
July 16, 1999
GENERAL RELEASE SPECIFICATION
Table 11-1. DC Electrical Characteristics, V =5 V
DD
2
1
Symbol
Min
Typ
Max
Unit
Characteristic
Pull-up Resistor
6
2
15
5
30
10
60
PA6, PA7
KΩ
KΩ
R
PULLUP
PB1, PB2
LVR Trigger Voltage
V
2.52
—
2.8
/2
—
—
V
V
LVRI
TCAP Input Threshold Voltage
V
V
TCAP
DD
1. V = 5.0Vdc ±10%, V = 0 Vdc, T = 0°C to +70°C, unless otherwise noted.
DD
SS
A
2. Typical values reflect average measurements at midpoint of voltage range, 25°C only.
3. Run (Operating) I , Wait I : Measured using external square wave clock source to OSC1 (f = 2.0 MHz), all
OSC
DD
DD
inputs 0.2 Vdc from rail; no DC loads, less than 50pF on all outputs, C = 20 pF on OSC2/R.
L
4. Wait I : Only MFT and Timer1 active.
DD
Wait I is affected linearly by the OSC2/R capacitance.
DD
5. Stop I measured with OSC1 = V
.
DD
SS
6. Input voltage level on PA6 or PA7 higher than 2.4V is guaranteed to be recognized as logical one and as logic
zero if lower than 0.8V. PA6 and PA7 pull-up resistor values are specified under the condition that pin voltage
ranges from 0V to 2.4V.
Table 11-2. DC Electrical Characteristics, V =2.2V
DD
2
1
Symbol
Min
Typ
Max
Unit
Characteristic
Output Voltage
= 10.0 µA
V
—
—
—
0.1
—
OL
V
I
V
V
V
– 0.1
Load
OH
DD
DD
Output High Voltage
(I =–0.4 mA) PA0-5, PB0, PB3-5
V
– 0.3
—
—
V
V
Load
OH
Output Low Voltage
(I
(I
(I
= 0.8mA) PA0-3, PB0, PB3-5
= 2mA) PA4-7
= 8mA) PB1, PB2 (see note 8)
—
—
—
—
—
—
0.3
0.3
0.4
Load
Load
Load
V
OL
Input High Voltage
PA0-5, PB0-5, IRQ, RESET, OSC1
V
0.7×V
—
—
V
DD
V
V
V
V
IH
DD
Input Low Voltage
PA0-5, PB0-5, IRQ, RESET, OSC1
V
V
0.2×V
—
IL
SS
DD
Positive-Going Input Threshold Voltage
PA6, PA7
V
—
0.7
0.5
T+
T–
Negative-Going Input Threshold Voltage
PA6, PA7
V
—
—
Supply Current
3
RUN
—
—
—
1
0.2
6
2
0.4
15
mA
mA
µA
I
4
DD
WAIT
5
STOP (LVR off)
MC68HC05J5A
REV 2.1
ELECTRICAL SPECIFICATIONS
MOTOROLA
11-3
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Freescale Semiconductor, Inc.
GENERAL RELEASE SPECIFICATION
July 16, 1999
Table 11-2. DC Electrical Characteristics, V =2.2V
DD
2
1
Symbol
Min
Typ
Max
Unit
Characteristic
I/O Ports Hi-Z Leakage Current
PA0-7, PB0-5
I
—
—
±10
µA
Z
(without individual pull-down/up activated)
Input Pull-down Current
PA0-5, PB0, PB3-5
(with individual pull-down activated)
I
50
100
200
µA
IL
Input Pull-up Current
RESET
—
–10
—
–20
—
–45
±1
µA
µA
Input Current
IRQ, OSC1
I
in
Capacitance
Ports (as Input or Output)
RESET, IRQ, OSC1, OSC2/R
C
C
—
—
—
—
12
8
pF
pF
out
in
Crystal/Ceramic Resonator Oscillator Mode
Internal Resistor
R
—
—
3
MΩ
OSC1 to OSC2/R
OSC
Pull-up Resistor
6
PA6, PA7
KΩ
KΩ
2
15
5
30
10
60
R
PULLUP
PB1, PB2
LVR Trigger Voltage
TCAP Input Threshold Voltage
LVR must be disabled (mask option) for V =2.2V
DD
V
—
V
/2
DD
—
V
TCAP
1. V = 2.2Vdc ±10%, V = 0 Vdc, T = 0°C to +70°C, unless otherwise noted.
DD
SS
A
2. Typical values reflect average measurements at midpoint of voltage range, 25°C only.
3. Run (Operating) I , Wait I : Measured using external square wave clock source to OSC1 (f = 2.0 MHz), all
OSC
DD
DD
inputs 0.2 Vdc from rail; no DC loads, less than 50pF on all outputs, C = 20 pF on OSC2/R.
L
4. Wait I : Only MFT and Timer1 active.
DD
Wait I is affected linearly by the OSC2/R capacitance.
DD
5. Stop I measured with OSC1 = V
.
DD
SS
6. Input voltage level on PA6 or PA7 higher than 2.4V is guaranteed to be recognized as logical one and as logic
zero if lower than 0.8V. PA6 and PA7 pull-up resistor values are specified under the condition that pin voltage
ranges from 0V to 2.4V.
MOTOROLA
11-4
ELECTRICAL SPECIFICATIONS
MC68HC05J5A
REV 2.1
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Freescale Semiconductor, Inc.
July 16, 1999
GENERAL RELEASE SPECIFICATION
11.5 CONTROL TIMING
Table 11-3. Control Timing, V =5V
DD
1
Characteristic
Symbol
Min
Max
Units
Frequency of Operation
Crystal Oscillator Option
External Clock Source
f
f
—
DC
4.2
4.2
MHz
MHz
OSC
OSC
Internal Operating Frequency
Crystal Oscillator (f
÷ 2)
÷ 2)
f
f
—
DC
2.1
2.1
MHz
MHz
OSC
OP
OP
External Clock (f
OSC
Cycle Time (1/f
)
t
415
1.5
—
—
—
—
ns
OP
CYC
RESET Pulse Width Low
t
t
t
t
RL
CYC
CYC
CYC
IRQ Interrupt Pulse Width Low (Edge-Triggered)
IRQ Interrupt Pulse Period
t
0.5
ILIH
2
t
see note
ILIL
IHIL
IHIH
PA0 to PA3 Interrupt Pulse Width High
(Edge-Triggered)
—
t
0.5
t
CYC
CYC
PA0 to PA3 Interrupt Pulse Period
PA7 Interrupt Pulse Width Low
OSC1 Pulse Width
t
see note 3
0.5
—
—
—
t
t
t
ILIH
CYC
t
, t
200
ns
OH OL
Output High to Low Transition Period on
PA6, PA7, PB1
t
0.5 (typical)
t
3
SLOW
CYC
1. V = 5.0Vdc ±10%, V = 0 Vdc, T = 0°C to +70°C, unless otherwise noted.
DD
SS
A
2. The minimum period t
or t
CYC
should not be less than the number of cycles it takes to execute the interrupt
ILIL
IHIH
service routine plus 19 t
.
3. t
is a parameter dependent on f
and loading.
slow
OSC
Table 11-4. Control Timing, V =2.2V
DD
1
Characteristic
Symbol
Min
Max
Units
Frequency of Operation
Crystal Oscillator Option
External Clock Source
f
f
—
DC
2.1
2.1
MHz
MHz
OSC
OSC
1. V = 2.2Vdc ±10%, V = 0 Vdc, T = 0°C to +70°C, unless otherwise noted.
DD
SS
A
MC68HC05J5A
REV 2.1
ELECTRICAL SPECIFICATIONS
MOTOROLA
11-5
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
GENERAL RELEASE SPECIFICATION
July 16, 1999
MOTOROLA
11-6
ELECTRICAL SPECIFICATIONS
MC68HC05J5A
REV 2.1
For More Information On This Product,
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Freescale Semiconductor, Inc.
July 16, 1999
GENERAL RELEASE SPECIFICATION
SECTION 12
MECHANICAL SPECIFICATIONS
This section provides the mechanical dimensions for the four available packages
for MC68HC05J5A.
12.1 16-PIN PDIP (CASE #648)
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
16
1
9
8
B
S
INCHES
MILLIMETERS
DIM
A
B
C
D
F
MIN
MAX
0.770
0.270
0.175
0.021
0.70
MIN
18.80
6.35
3.69
0.39
1.02
MAX
19.55
6.85
4.44
0.53
1.77
F
0.740
0.250
0.145
0.015
0.040
C
L
SEATING
PLANE
–T–
G
H
J
K
L
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
0.21
2.80
7.50
0
K
M
0.008
0.015
0.130
0.305
10
0.38
3.30
7.74
10
H
J
0.110
0.295
0
G
D 16 PL
0.25 (0.010)
M
S
0.020
0.040
0.51
1.01
M
M
T
A
Figure 12-1. 16-Pin PDIP Mechanical Dimensions
12.2 16-PIN SOIC (CASE #751G)
–A–
16
9
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
–B–
8X P
0.010 (0.25)
M
M
B
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
1
8
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
J
16X D
M
S
S
0.010 (0.25)
T
A
B
F
MILLIMETERS
INCHES
DIM
A
B
C
D
MIN
10.15
7.40
2.35
0.35
0.50
MAX
10.45
7.60
2.65
0.49
0.90
MIN
MAX
0.411
0.299
0.104
0.019
0.035
0.400
0.292
0.093
0.014
0.020
R X 45
C
F
G
J
K
M
P
R
1.27 BSC
0.050 BSC
–T–
0.25
0.10
0
0.32
0.25
7
0.010
0.004
0
0.012
0.009
7
M
SEATING
14X G
K
PLANE
10.05
0.25
10.55
0.75
0.395
0.010
0.415
0.029
Figure 12-2. 16-Pin SOIC Mechanical Dimensions
MC68HC05J5A
REV 2.1
MECHANICAL SPECIFICATIONS
MOTOROLA
12-1
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12.3 20-PIN PDIP (CASE #738)
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
20
1
11
10
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
B
L
C
INCHES
MILLIMETERS
DIM
A
B
C
D
MIN
MAX
1.070
0.260
0.180
0.022
MIN
25.66
6.10
3.81
0.39
MAX
27.17
6.60
4.57
0.55
1.010
0.240
0.150
0.015
–T–
SEATING
PLANE
K
E
0.050 BSC
1.27 BSC
M
0.050
0.070
1.27
1.77
F
G
J
K
L
N
E
0.100 BSC
2.54 BSC
0.008
0.110
0.015
0.140
0.21
2.80
0.38
3.55
G
F
J 20 PL
0.300 BSC
7.62 BSC
D 20 PL
0.25 (0.010)
M
M
0.25 (0.010)
T B
M
N
0
15
0
15
0.020
0.040
0.51
1.01
M
M
T
A
Figure 12-3. 20-Pin PDIP Mechanical Dimensions
12.4 20-PIN SOIC (CASE #751D)
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
20
11
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
10X P
–B–
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
M
M
0.010 (0.25)
B
1
10
MILLIMETERS
INCHES
20X D
0.010 (0.25)
DIM
A
B
C
D
MIN
12.65
7.40
2.35
0.35
0.50
MAX
12.95
7.60
2.65
0.49
0.90
MIN
MAX
0.510
0.299
0.104
0.019
0.035
J
0.499
0.292
0.093
0.014
0.020
M
S
S
T
A
B
F
F
G
J
K
M
P
R
1.27 BSC
0.050 BSC
0.25
0.10
0
0.32
0.25
7
0.010
0.004
0
0.012
0.009
7
R X 45
10.05
0.25
10.55
0.75
0.395
0.010
0.415
0.029
C
SEATING
PLANE
–T–
M
18X G
K
Figure 12-4. 20-Pin SOIC Mechanical Dimensions
MOTOROLA
12-2
MECHANICAL SPECIFICATIONS
MC68HC05J5A
REV 2.1
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GENERAL RELEASE SPECIFICATION
APPENDIX A
MC68HRC05J5A
This appendix describes the MC68HRC05J5A, a resistor-capacitor (RC) oscillator
mask option version of the MC68HC05J5A. The entire MC68HC05J5A data sheet
applies to the MC68HRC05J5A, with exceptions outlined in this appendix.
A.1 INTRODUCTION
The MC68HRC05J5A is a resistor-capacitor (RC) oscillator mask option version
of the MC68HC05J5A. The MC68HRC05J5A is functionally identical to the
MC68HC05J5A with the exception that the MC68HRC05J5A supports the RC
oscillator only, as outlined in Appendix A.2.
A.2 RC OSCILLATOR CONNECTIONS
This is the only oscillator option supported by the MC68HRC05J5A device.
On the MC68HRC05J5A device, an external resistor is connected between
OSC2/R pin and the V pin as shown in Figure A-1. The typical operating fre-
SS
quency f
is set at 4MHz with the external R tied to V . Use the graph in
OSC
SS
Figure A-2 to select the value of R for the required oscillator frequency.
The tolerance of this RC oscillator is guaranteed to be no greater than ±15% at
the specified conditions of 0°C to 40°C and 5V ±10% V providing that the toler-
DD
ance of the external resistor R is at most ±1% and the center frequency range is
from 3.8MHz to 4.2MHz. The center frequency is the nominal operating frequency
of the RC oscillator and can be adjusted by adjusting the external R value to
change the internal VCO charging current.
In order to obtain an oscillator clock with the best possible tolerance, the external
resistor connected to the OSC2/R pin should be grounded as close to the VSS pin
as possible and the other terminal of this external resistor should be connected as
close to the OSC2/R pin as possible.
MCU
OSC2/R
OSC1
R
Figure A-1. RC Oscillator Connections
MC68HC05J5A
REV 2.1
MOTOROLA
A-1
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6
5
4
VDD = 5V ±10% at 25°C
3
2
1
5
10
15
20
25
30
RESISTANCE R (kΩ)
Figure A-2. Typical Internal Operating Frequency
for RC Oscillator Connections
A.3 ELECTRICAL CHARACTERISTICS
Table A-1. Functional Operating Range
Characteristic
Symbol
Value
0 to +70
5.0 ±10%
Unit
°C
Operating Temperature Range
Operating Voltage Range
T
A
V
V
DD
Table A-2. DC Electrical Characteristics, V =5V
DD
2
1
Symbol
Min
Typ
Max
Unit
Characteristic
Supply Current
3
RUN
—
—
6
2
8
4
mA
mA
4
WAIT
I
DD
STOP
LVR on
LVR off
—
—
40
20
80
40
µA
µA
1. V = 5.0Vdc ±10%, V = 0 Vdc, T = 0°C to +70°C, unless otherwise noted.
DD
SS
A
2. Typical values reflect average measurements at midpoint of voltage range, 25°C only.
3. Run (Operating) I , Wait I : Measured using external square wave clock source to OSC1 (f = 2.0 MHz), all
OSC
DD
DD
inputs 0.2 Vdc from rail; no DC loads, less than 50pF on all outputs, C = 20 pF on OSC2/R.
L
4. Wait I : Only MFT and Timer1 active.
DD
Wait I is affected linearly by the OSC2/R capacitance.
DD
MOTOROLA
A-2
MC68HC05J5A
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APPENDIX B
MC68HC705J5A
This appendix describes the MC68HC705J5A, the emulation part for
MC68HC05J5A. The entire MC68HC05J5A data sheet applies to the
MC68HC705J5A, with exceptions outlined in this appendix.
B.1 INTRODUCTION
The MC68HC705J5A is an EPROM version of the MC68HC05J5A, and is avail-
able for user system evaluation and debugging. The MC68HC705J5A is function-
ally identical to the MC68HC05J5A with the exception of the 2560 bytes user
ROM is replaced by 2560 bytes user EPROM. Also, the mask options available on
the MC68HC05J5A are implemented using the Mask Option Register (MOR) in
the MC68HC705J5A.
The MC68HC705J5A is not available in the 16-pin SOIC package.
B.2 MEMORY
The MC68HC705J5A memory map is shown in Figure B-1.
B.3 MASK OPTION REGISTERS (MOR)
The Mask Option Register (MOR) consists of two bytes of EPROM used to select
the features controlled by mask options on the MC68HC05J5A. In order to pro-
gram this register the MORON bit in PCR need to be set to “1” before doing the
EPROM programming process.
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
PULLREN
1
BIT 2
BIT 1
BIT 0
MOR1
$0200
R
STOPMD IRQTRIG
PAINTEN OSCDLY LVREN
W
erased:
reset:
X
X
1
1
1
1
1
Unaffected by reset
BIT 7
0
BIT 6
0
BIT 5
0
BIT 4
BIT 3
BIT 2
0
BIT 1
0
BIT 0
COP_EN
1
MOR2
$0201
erased:
reset:
R
W
0
0
Unaffected by reset
MC68HC05J5A
REV 2.1
MOTOROLA
B-1
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STOPMD — STOP Mode Option
1 = STOP mode is selected.
0 = STOP mode is converted to HALT mode.
IRQTRIG — IRQ, PA0-PA3 Interrupt Option
1 = Edge-triggered only.
0 = Edge-and-level-triggered.
PULLREN — Port A and B Pull-up/down Option
1 = Connected.
0 = Disconnected
PAINTEN — PA0-PA3 External Interrupt Option
1 = External interrupt capability on PA0-PA3 disabled.
0 = External interrupt capability on PA0-PA3 enabled.
OSCDLY — Oscillator Delay Option
1 = 224 internal clock cycles.
0 = 4064 internal clock cycles.
LVREN — LVR Option
1 = Low Voltage Reset circuit enabled.
0 = Low Voltage Reset circuit disabled.
COP_EN — COP Watchdog Timer Option
1 = Disabled.
0 = Enabled.
MOTOROLA
B-2
MC68HC05J5A
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$0000
0000
$0000
I/O
32 Bytes
I/O
Registers
$001F
$0020
0031
0032
32 bytes
(see Figure 2-2)
unimplemented
96 Bytes
Program Control Register
$001E
$001F
$007F
$0080
0127
0128
User RAM 128 Bytes
Stack
$00C0
$00FF
$0100
0192
0255
0256
COP Watchdog Timer*
Reserved
$0FF0
$0FF1
$0FF2
$0FF3
$0FF4
$0FF5
$0FF6
$0FF7
$0FF8
$0FF9
$0FFA
$0FFB
$0FFC
$0FFD
$0FFE
$0FFF
unimplemented
256 Bytes
$0200
$0201
Mask Option Registers 1 & 2
Reserved
unimplemented
254 Bytes
0767
0768
$02FF
$0300
Reserved
Reserved
Reserved
User EPROM
2560 Bytes
Timer1 Vector (High Byte)
Timer1 Vector (Low Byte)
MFT Vector (High Byte)
MFT Vector (Low Byte)
IRQ Vector (High Byte)
IRQ Vector (Low Byte)
SWI Vector (High Byte)
SWI Vector (Low Byte)
Reset Vector (High Byte)
Reset Vector (Low Byte)
3327
3328
$0CFF
$0D00
unimplemented
256 Bytes
$0DFF
$0E00
3583
3584
Bootloader ROM
496 Bytes
$0FEF
$0FF0
4079
4080
ROM Reserved
6 Bytes
$0FF5
$0FF6
$0FFF
4085
4086
User Vectors EPROM
10 Bytes
* Writing a 0 to bit 0 of $0FF0 clears the COP Timer.
Reading $0FF0 returns ROM data.
4095
Figure B-1. MC68HC705J5A Memory Map
MC68HC05J5A
REV 2.1
MOTOROLA
B-3
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B.4 BOOTSTRAP MODE
Bootloader mode is entered upon the rising edge of RESET if the IRQ/V pin is
PP
at V
and the PB0 pin is at logic zero. The Bootloader program is masked in the
TST
ROM area from $0E00 to $0FEF. This program handles copying of user code from
an external EPROM into the on-chip EPROM. The bootload function has to be
done from an external EPROM. The bootloader performs one programming pass
at 1ms per byte then does a verify pass.
The user code must be a one-to-one correspondence with the internal EPROM
addresses.
B.5 EPROM PROGRAMMING
Programming the on-chip EPROM is achieved by using the Program Control Reg-
ister located at address $3E.
Please contact Motorola for programming board availability.
B.5.1 EPROM Program Control Register (PCR)
This register is provided for programming the on-chip EPROM in the
MC68HC705J5A.
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
MORON
0
BIT 1
ELAT
0
BIT 0
PGM
0
PCR
R
0
R
0
0
0
R
0
0
R
0
0
R
0
$001E
W
R
reset:
0
R
= Reserved
MORON – Mask Option Register ON
0 = Disable programming to Mask Option Register ($0200 & $0201)
1 = Enable programming to Mask Option Register ($0200 & $0201)
ELAT – EPROM LATch control
0 = EPROM address and data bus configured for normal reads
1 = EPROM address and data bus configured for programming (writes
to EPROM cause address and data to be latched). EPROM is in
programming mode and cannot be read if ELAT is 1. This bit should
not be set when no programming voltage is applied to the V pin.
pp
PGM – EPROM ProGraM command
0 = Programming power is switched OFF from EPROM array.
1 = Programming power is switched ON to EPROM array. If ELAT ≠ 1,
then PGM = 0.
Bits [7:3] – Reserved
These are reserved bits and should remain zero.
MOTOROLA
B-4
MC68HC05J5A
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B.5.2 Programming Sequence
The EPROM programming sequence is:
1. Set the ELAT bit
2. Write the data to the address to be programmed
3. Set the PGM bit
4. Delay for a time t
PGMR
5. Clear the PGM bit
6. Clear the ELAT bit
The last two steps must be performed with separate CPU writes.
CAUTION
It is important to remember that an external programming voltage must be applied
to the V pin while programming, but it should be equal to V
during normal
PP
DD
operations.
Figure B-2 shows the flow required to successfully program the EPROM.
START
ELAT=1
Write EPROM byte
PGM=1
Wait 1ms
PGM=0
ELAT=0
Write
additional
byte?
Y
N
END
Figure B-2. EPROM Programming Sequence
MC68HC05J5A
REV 2.1
MOTOROLA
B-5
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B.6 ELECTRICAL CHARACTERISTICS
Table B-1. Functional Operating Range
Characteristic
Symbol
Value
Unit
°C
Operating Temperature Range
Operating Voltage Range
T
–40 to +85
5.0 ±10%
A
V
V
DD
Table B-2. EPROM Programming Electrical Characteristics
Characteristic
Symbol
Min
10
—
1
Typ
12
3
Max
Unit
V
Programming Voltage
V
IRQ/V
15
PP
PP
Programming Current
I
IRQ/V
—
mA
ms
PP
PP
Programming Time
per byte
t
4
—
EPGM
Table B-3. DC Electrical Characteristics, V =5 V
DD
2
1
Symbol
Min
Typ
Max
Unit
Characteristic
Output Voltage
= 10.0 µA
V
—
—
—
0.1
—
OL
V
I
V
V
V
– 0.1
Load
OH
DD
DD
Output High Voltage
(I =–0.8 mA) PA0-5, PB0, PB3-5
V
– 0.8
—
—
V
V
Load
OH
Output Low Voltage
(I
(I
(I
(I
= 1.6mA) PA0-3, PB0, PB3-5
= 8mA) PA4, PA5
= 6mA) PA6, PA7
—
—
—
—
—
0.4
0.4
0.4
0.5
Load
Load
Load
Load
V
—
—
—
OL
= 25mA) PB1, PB2 (see note 8)
Input High Voltage
PA0-5, PB0-5, IRQ, RESET, OSC1
V
0.7×V
—
—
V
DD
V
V
V
V
IH
DD
Input Low Voltage
PA0-5, PB0-5, IRQ, RESET, OSC1
V
V
0.2×V
—
IL
SS
DD
Positive-Going Input Threshold Voltage
PA6, PA7
V
—
1.7
T+
T–
Negative-Going Input Threshold Voltage
PA6, PA7
V
—
1.15
—
MOTOROLA
B-6
MC68HC05J5A
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GENERAL RELEASE SPECIFICATION
Table B-3. DC Electrical Characteristics, V =5 V
DD
2
1
Symbol
Min
Typ
Max
Unit
Characteristic
Supply Current
3
RUN
—
—
6
2
10
4
mA
mA
4
WAIT
I
5
DD
STOP
LVR on
LVR off
—
—
40
10
80
30
µA
µA
I/O Ports Hi-Z Leakage Current
PA0-7, PB0-5
I
—
—
±10
µA
µA
Z
(without individual pull-down/up activated)
Input Pull-down Current
PA0-5, PB0, PB3-5
(with individual pull-down activated)
I
50
100
200
IL
Input Pull-up Current
RESET
—
–50
—
–100
—
–200
±1
µA
µA
Input Current
IRQ, OSC1
I
in
Capacitance
Ports (as Input or Output)
RESET, IRQ, OSC1, OSC2/R
C
C
—
—
—
—
12
8
pF
pF
out
in
Crystal/Ceramic Resonator Oscillator Mode
Internal Resistor
R
—
—
2
MΩ
OSC1 to OSC2/R
OSC
Pull-up Resistor
6
2
10
5
30
10
60
PA6, PA7
KΩ
KΩ
R
PULLUP
PB1, PB2
LVR Trigger Voltage
TCAP Input Threshold Voltage
V
2.7
—
3.0
—
—
V
V
LVRI
V
V
/2
DD
TCAP
1. V = 5.0Vdc ±10%, V = 0 Vdc, T = –40°C to +85°C, unless otherwise noted.
DD
SS
A
2. Typical values reflect average measurements at midpoint of voltage range, 25°C only.
3. Run (Operating) I , Wait I : Measured using external square wave clock source to OSC1 (f = 2.0 MHz), all
OSC
DD
DD
inputs 0.2 Vdc from rail; no DC loads, less than 50pF on all outputs, C = 20 pF on OSC2/R.
L
4. Wait I : Only MFT and Timer1 active.
DD
Wait I is affected linearly by the OSC2/R capacitance.
DD
5. Stop I measured with OSC1 = V
.
DD
SS
6. Input voltage level on PA6 or PA7 higher than 2.4V is guaranteed to be recognized as logical one and as logic
zero if lower than 0.8V. PA6 and PA7 pull-up resistor values are specified under the condition that pin voltage
ranges from 0V to 2.4V.
MC68HC05J5A
REV 2.1
MOTOROLA
B-7
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MOTOROLA
B-8
MC68HC05J5A
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GENERAL RELEASE SPECIFICATION
APPENDIX C
MC68HRC705J5A
This appendix describes the MC68HRC705J5A, the emulation part for
MC68HRC05J5A, and a resistor-capacitor (RC) oscillator mask option version of
the MC68HC705J5A. The entire MC68HC05J5A data sheet and appendix B
applies to the MC68HRC705J5A, with exceptions outlined in this appendix.
C.1 INTRODUCTION
The MC68HRC705J5A is a resistor-capacitor (RC) oscillator mask option version
of the MC68HC705J5A (see Appendix B). The MC68HRC705J5A is functionally
identical to the MC68HC705J5A with the exception that the MC68HRC705J5A
supports the RC oscillator only, as outlined in Appendix C.2.
The MC68HRC705J5A is not available in the 16-pin SOIC package.
C.2 RC OSCILLATOR CONNECTIONS
This is the only oscillator option supported by the MC68HRC705J5A device.
On the MC68HRC705J5A device, an external resistor is connected between
OSC2/R pin and the V pin as shown in Figure C-1. The typical operating fre-
SS
quency f
is set at 4MHz with the external R tied to V . Use the graph in
OSC
SS
Figure C-2 to select the value of R for the required oscillator frequency.
The tolerance of this RC oscillator is guaranteed to be no greater than ±15% at
the specified conditions of 0°C to 40°C and 5V ±10% V providing that the toler-
DD
ance of the external resistor R is at most ±1% and the center frequency range is
from 3.8MHz to 4.2MHz. The center frequency is the nominal operating frequency
of the RC oscillator and can be adjusted by adjusting the external R value to
change the internal VCO charging current.
In order to obtain an oscillator clock with the best possible tolerance, the external
resistor connected to the OSC2/R pin should be grounded as close to the VSS pin
as possible and the other terminal of this external resistor should be connected as
close to the OSC2/R pin as possible.
MCU
OSC2/R
OSC1
R
Figure C-1. RC Oscillator Connections
MC68HC05J5A
REV 2.1
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6
5
4
VDD = 5V ±10% at 25°C
3
2
1
5
10
15
20
25
30
RESISTANCE R (kΩ)
Figure C-2. Typical Internal Operating Frequency for RC Oscillator Connections
C.3 ELECTRICAL CHARACTERISTICS
Table C-1. Functional Operating Range
Characteristic
Symbol
Value
Unit
°C
Operating Temperature Range
Operating Voltage Range
T
–40 to +85
5.0 ±10%
A
V
V
DD
Table C-2. DC Electrical Characteristics, V =5 V
DD
2
1
Symbol
Min
Typ
Max
Unit
Characteristic
Supply Current
3
RUN
—
—
6
2
10
4
mA
mA
4
WAIT
I
5
DD
STOP
LVR on
LVR off
—
—
40
10
80
30
µA
µA
1. V = 5.0Vdc ±10%, V = 0 Vdc, T = –40°C to +85°C, unless otherwise noted.
DD
SS
A
2. Typical values reflect average measurements at midpoint of voltage range, 25°C only.
3. Run (Operating) I , Wait I : Measured using external square wave clock source to OSC1 (f = 2.0 MHz), all
OSC
DD
DD
inputs 0.2 Vdc from rail; no DC loads, less than 50pF on all outputs, C = 20 pF on OSC2/R.
L
4. Wait I : Only MFT and Timer1 active.
DD
Wait I is affected linearly by the OSC2/R capacitance.
DD
5. Stop I measured with OSC1 = V
.
DD
SS
MOTOROLA
C-2
MC68HC05J5A
REV 2.1
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
July 16, 1999
GENERAL RELEASE SPECIFICATION
APPENDIX D
ORDERING INFORMATION
This section contains ordering numbers for the MC68HC05J5A,
MC68HRC05J5A, MC68HC705J5A, and MC68HRC705J5A.
D.1 MC ORDER NUMBERS
Table D-1. MC Order Numbers
Pin
Count
Package
Type
Operating
Temperature
MC Order Number
Device Type
MC68HC05J5AJP
16
16
20
20
16
16
20
20
16
20
20
16
20
20
PDIP
SOIC
PDIP
SOIC
PDIP
SOIC
PDIP
SOIC
PDIP
PDIP
SOIC
PDIP
PDIP
SOIC
2560 bytes ROM,
MC68HC05J5AJDW
MC68HC05J5AP
0 °C to +70 °C
0 °C to +70 °C
crystal/resonator or external
oscillator option
MC68HC05J5ADW
MC68HRC05J5AJP
MC68HRC05J5AJDW
MC68HRC05J5AP
MC68HRC05J5ADW
MC68HC705J5ACJP
MC68HC705J5ACP
MC68HC705J5ACDW
MC68HRC705J5ACJP
MC68HRC705J5ACP
MC68HRC705J5ACDW
2560 bytes ROM,
RC oscillator option
2560 bytes OTPROM,
–40 °C to +85 °C crystal/resonator or external
oscillator option
2560 bytes OTPROM,
–40 °C to +85 °C
RC oscillator option
NOTES:
C = extended temperature
P = plastic dual-in-line package (PDIP)
DW = small outline integrated circuit (SOIC)
MC68HC05J5A
REV 2.1
MOTOROLA
D-1
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
GENERAL RELEASE SPECIFICATION
July 16, 1999
MOTOROLA
D-2
MC68HC05J5A
V 2.1
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the
suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for
each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not
designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or
for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use
Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and
distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or
death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
How to reach us:
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1-800-441-2447 or 1-303-675-2140
JAPAN: Nippon Motorola Ltd. SPD, Strategic Planning Office 4-32-1, Nishi-Gotanda, Shinagawa-ku, Tokyo 141, Japan. 03-5487-8488
TM
Mfax , Motorola Fax Back System: RMFAX0@email.sps.mot.com; http://sps.motorola.com/mfax/; TOUCHTONE 1-602-244-6609;
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Mfax is a trademark of Motorola, Inc.
© Motorola, Inc., 1999
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