HD74HC564RP [ETC]

FLIP-FLOP|OCTAL|D TYPE|HC-CMOS|SOP|20PIN|PLASTIC ; 触发器|八路| D型| HC -CMOS |专科| 20PIN |塑料\n


型号：	HD74HC564RP
厂家：	ETC
描述：	FLIP-FLOP\|OCTAL\|D TYPE\|HC-CMOS\|SOP\|20PIN\|PLASTIC 触发器\|八路\| D型\| HC -CMOS \|专科\| 20PIN \|塑料\n 触发器
文件：	总11页 (文件大小：65K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

HD74HC564/HD74HC574

Octal D-type Flip-Flops (with 3-state outputs)

Description

These devices are positive edge triggered flip-flops. The difference between HD74HC564 and

HD74HC574 is only that the former has inverting outputs and the latter has noninvertering outputs.

Data at the D inputs, meeting the set-up and hold time requirements, are transferred to the Q or Q outputs

on positive going transitions of the clock (CK) input. when a high logic level is applied to the output cotrol

(OC) input, all outputs go to a high impedance state, regardless of what signals are present at the other

inputs and the state of the storage elements.

Features

•

High Speed Operation: t_pd(Clock to Output) = 13 ns typ (C_L= 50 pF)

High Output Current: Fanout of 15 LSTTL Loads

Wide Operating Voltage: V_CC= 2 to 6 V

Low Input Current: 1 µA max

Low Quiescent Supply Current: I_CC(static) = 4 µA max (Ta = 25°C)

Function Table

Outputs

Output Control

Clock

Data

HD74HC564

HD74HD574

Q₀

Q₀:

level of Q before the indicated Steady-sate input conditions were established.

complement of Q₀or level of Q before the indicated Steady-state input Conditions were established.

HD74HC564/HD74HC574

Pin Arrangement

HD74HC564

Output

Control

20 VCC

19 1Q

18 2Q

17 3Q

16 4Q

2D 3

6D 7

7D 8

8D 9

14 6Q

13 7Q

12 8Q

Clock

GND

(Top view)

HD74HC564/HD74HC574

HD74HC574

Output

Control

20 VCC

19 1Q

18 2Q

17 3Q

16 4Q

2D 3

6D 7

7D 8

8D 9

14 6Q

13 7Q

12 8Q

Clock

GND

(Top view)

Absolute Maximum Ratings

Item

Symbol

V_CC

Rating

–0.5 to +7.0

Unit

Supply voltage range

Input voltage

V_IN

–0.5 to V_CC+ 0.5

Output voltage

V_OUT

I_OUT

I_CC, I_GND

I_IK

–0.5 to V_CC+ 0.5

Output current

±35

°C

DC current drain per V_CC, GND

DC input diode current

DC output diode current

Power Dissipation per package

Storage temperature

±75

±20

I_OK

±20

P_T

500

Tstg

–65 to +150

HD74HC564/HD74HC574

Block Diagram

HD74HC564

CLK

HD74HC564/HD74HC574

HD74HC574

CLK

HD74HC564/HD74HC574

DC Characteristics

Ta = –40 to

Ta = 25°C

+85°C

Item

Symbol V_CC(V) Min Typ Max Min Max Unit Test Conditions

Input voltage

V_IH

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

4.5

6.0

2.0

4.5

6.0

4.5

6.0

1.5

—

0.5

1.5

3.15

4.2

—

3.15 —

—

4.2

—

V_IL

0.5

1.35

1.8

—

1.35 —

1.8

—

Output voltage

V_OH

1.9 2.0

4.4 4.5

5.9 6.0

4.18 —

5.68 —

1.9

4.4

5.9

4.13

5.63

—

Vin = V_IHor V_ILI_OH= –20 µA

—

I_OH= –6 mA

I_OH= –7.8 mA

—

V_OL

—

0.0 0.1

0.1

0.33

Vin = V_IHor V_ILI_OL= 20 µA

—

0.26 —

I_OL= 6 mA

I_OL= 7.8 mA

Off-state output

current

I_OZ

Iin

±0.5 —

±5.0 µA

Vin = V_IHor V_IL,

Vout = V_CCor GND

Input current

6.0

—

±0.1 —

±1.0 µA

Vin = V_CCor GND

Quiescent supply I_CC

current

4.0

—

µA

Vin = V_CCor GND, Iout = 0 µA

HD74HC564/HD74HC574

AC Characteristics (C_L= 50 pF, Input t_r= t_f= 6 ns)

Ta = –40 to

+85°C

Ta = 25°C

Symbol V_CC(V) Min Typ Max Min Max Unit Test Conditions

Item

Maximum clock

frequency

f_max

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

—

MHz

Propagation delay t_PLH

155 —

195 ns

Clock to output

time

t_PHL

13 31

—

Output enable

time

t_ZH

t_ZL

150 —

190 ns

13 30

—

Output disable

time

t_HZ

t_LZ

150 —

190 ns

15 30

—

Setup time

Hold time

t_su

100 —

125 ns

—

t_h

—

Pulse width

t_w

—

100

—

Output rise/fall

time

t_TLH

t_THL

—

Input capacitance Cin

Unit: mm

24.50

25.40 Max

1.30

0.89

7.62

1.27 Max

+ 0.11

– 0.05

0.25

2.54 ± 0.25

0.48 ± 0.10

0° – 15°

Hitachi Code

JEDEC

EIAJ

DP-20N

—

Conforms

Weight (reference value) 1.26 g

Unit: mm

12.6

13 Max

+ 0.20

7.80

– 0.30

0.80 Max

1.15

0° – 8°

1.27

0.70 ± 0.20

*0.42 ± 0.08

0.40 ± 0.06

0.15

0.12 M

Hitachi Code

JEDEC

FP-20DA

—

EIAJ

Conforms

*Dimension including the plating thickness

Base material dimension

Weight (reference value) 0.31 g

Unit: mm

12.8

13.2 Max

+ 0.25

– 0.40

10.40

0.935 Max

1.45

0° – 8°

+ 0.57

– 0.30

1.27

0.70

*0.42 ± 0.08

0.40 ± 0.06

0.15

0.12

Hitachi Code

JEDEC

EIAJ

FP-20DB

Conforms

—

*Dimension including the plating thickness

Base material dimension

Weight (reference value) 0.52 g

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,

Hitachi bears no responsibility for problems that may arise with third party’s rights, including

intellectual property rights, in connection with use of the information contained in this document.

2. Products and product specifications may be subject to change without notice. Confirm that you have

received the latest product standards or specifications before final design, purchase or use.

3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,

contact Hitachi’s sales office before using the product in an application that demands especially high

quality and reliability or where its failure or malfunction may directly threaten human life or cause risk

of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,

traffic, safety equipment or medical equipment for life support.

4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly

for maximum rating, operating supply voltage range, heat radiation characteristics, installation

conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used

beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable

failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-

safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other

consequential damage due to operation of the Hitachi product.

5. This product is not designed to be radiation resistant.

6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without

written approval from Hitachi.

7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor

products.

Hitachi, Ltd.

Semiconductor & Integrated Circuits.

Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan

Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109

URL

NorthAmerica

Europe

: http:semiconductor.hitachi.com/

: http://www.hitachi-eu.com/hel/ecg

Asia (Singapore)

Asia (Taiwan)

: http://www.has.hitachi.com.sg/grp3/sicd/index.htm

: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm

Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm

Japan

: http://www.hitachi.co.jp/Sicd/indx.htm

For further information write to:

Hitachi Semiconductor

(America) Inc.

Hitachi Europe GmbH

Hitachi Asia (Hong Kong) Ltd.

Group III (Electronic Components)

7/F., North Tower, World Finance Centre,

Harbour City, Canton Road, Tsim Sha Tsui,

Kowloon, Hong Kong

Tel: <852> (2) 735 9218

Fax: <852> (2) 730 0281

Hitachi Asia Pte. Ltd.

16 Collyer Quay #20-00

Hitachi Tower

Singapore 049318

Tel: 535-2100

Electronic components Group

Dornacher Stra§e 3

D-85622 Feldkirchen, Munich

Germany

Tel: <49> (89) 9 9180-0

Fax: <49> (89) 9 29 30 00

179 East Tasman Drive,

San Jose,CA 95134

Tel: <1> (408) 433-1990

Fax: <1>(408) 433-0223

Fax: 535-1533

Hitachi Asia Ltd.

Taipei Branch Office

3F, Hung Kuo Building. No.167,

Tun-Hwa North Road, Taipei (105)

Tel: <886> (2) 2718-3666

Fax: <886> (2) 2718-8180

Telex: 40815 HITEC HX

Hitachi Europe Ltd.

Electronic Components Group.

Whitebrook Park

Lower Cookham Road

Maidenhead

Berkshire SL6 8YA, United Kingdom

Tel: <44> (1628) 585000

Fax: <44> (1628) 778322

HD74HC564RP [ETC]

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