HSMS-281ASERIES [ETC]
Surface Mount RF Schottky Diodes in SOT-323 (SC-70) (87K in pdf) ; 表面贴装射频肖特基二极管SOT- 323 （ SC - 70 ） （ 87K PDF格式）\n
| 型号： | HSMS-281ASERIES |
| 厂家： | 
ETC |
| 描述： | Surface Mount RF Schottky Diodes in SOT-323 (SC-70) (87K in pdf)
|
| 文件： | 总6页 (文件大小：62K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Surface Mount RF Schottky
Diodes in SOT-323 (SC-70)
Technical Data
HSMS-280A Series
HSMS-281A Series
HSMS-282A Series
Features
Package Lead Code
Identification
( Top View)
Description/Applications
These Schottky diodes are specifi-
cally designed for analog and
digital applications requiring
devices in SOT-323 surface mount
packages. This series offers a
wide range of specifications and
package configurations to give the
designer wide flexibility. Typical
applications of these Schottky
diodes are mixing, detecting,
switching, sampling, clamping,
and wave shaping.
• Surface Mount SOT-323
Package
• Low Turn-On Voltage
SERIES
SINGLE
( As Low as 0.34 V at 1 mA)
• Low FIT ( Failure in Time)
Rate*
B
C
• Six-sigma Quality Level
• Single and Dual Versions
COMMON
ANODE
COMMON
CATHODE
• Tape and Reel Options
Available
E
F
* For more information see the
Surface Mount Schottky
Reliability Data Sheet.
Absolute Maximum Ratings, TC= 25ºC
Symbol Parameter
Unit Absolute Maximum[1]
If
Forward Current (1µs Pulse) Amp
1
PIV
TJ
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance [2]
V
°C
Same as VBR
150
TSTG
θjc
°C
-65 to 150
150
°C/W
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. TC = +25°C, where TC is defined to be the temperature at the pack-
age pins where contact is made to the circuit board.
2
Electrical Specifications, TC = +25°C, Single Diode[1]
Minimum Maximum Maximum Maximum
Breakdown Forward Forward Reverse Maximum
Typical
Dynamic
Part
Package
Number Marking Lead
HSMS- Code[2] Code Configuration
Voltage
BR (V)
Voltage
Voltage Leakage Capacitance Resistance
V
V ( mV) V ( V) @ IR ( nA) @ CT ( pF)
RD ( Ω)
F
IFF ( mA)
VR ( V)
280B
280C
280E
280F
A0
A2
A3
A4
B
C
E
F
Single
Series
Common Anode
Common Cathode
70
20
15
400
400
340
1.0 15 200 50
2.0
1.2
1.0
35
281B
281C
281E
281F
B0
B2
B3
B4
B
C
E
F
Single
Series
Common Anode
Common Cathode
1.0 35 200 15
15
12
282B
282C
282E
282F
C0
C2
C3
C4
B
C
E
F
Single
Series
Common Anode
Common Cathode
0.7 30 100
1
Test Conditions
IR = 10 µA IF = 1 mA[3]
V = 0 V
IF = 5 mA
F
f = 1 MHz[4]
Notes:
1. Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at
5 mA, except HSMS-282X which is measured at 20 mA.
2. Package marking code is laser marked.
3. ∆VF for diodes in pairs is 15.0 mV maximum at 1.0 mA.
4. ∆CTO for diodes in pairs is 0.2 pF maximum.
Typical Performance, TC = 25°C ( unless otherwise noted) , Single Diode
100
100
100
TA = +125°C
TA = +75°C
TA = +25°C
TA = –25°C
10
10
10
1
1
1
TA = +125°C
TA = +75°C
TA = +25°C
TA = –25°C
TA = +125°C
TA = +75°C
TA = +25°C
TA = –25°C
0.1
0.1
0.1
0.01
0.01
0.01
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
0
0.10
V – FORWARD VOLTAGE (V)
F
0.20
0.30
0.40
0.50
V
– FORWARD VOLTAGE (V)
V
– FORWARD VOLTAGE (V)
F
F
Figure 1. Forward Current vs.
Forward Voltage at Temperatures—
HSMS-280A Series.
Figure 2. Forward Current vs.
Forward Voltage at Temperatures—
HSMS-281A Series.
Figure 3. Forward Current vs.
Forward Voltage at Temperatures—
HSMS-282A Series.
3
Typical Performance, TC = 25°C ( unless otherwise noted) , Single Diode, continued
100,000
100,000
100,000
10,000
10,000
10,000
1000
100
1000
100
1000
100
TA = +125°C
TA = +75°C
TA = +25°C
TA = +125°C
TA = +75°C
TA = +25°C
TA = +125°C
TA = +75°C
TA = +25°C
10
1
10
1
10
1
0
10
20
30
40
50
0
5
10
15
0
5
10
15
V
– REVERSE VOLTAGE (V)
V
– REVERSE VOLTAGE (V)
V – REVERSE VOLTAGE (V)
R
R
R
Figure 4. Reverse Current vs.
Reverse Voltage at Temperatures—
HSMS-280A Series.
Figure 5. Reverse Current vs.
Reverse Voltage at Temperatures—
HSMS-281A Series.
Figure 6. Reverse Current vs.
Reverse Voltage at Temperatures—
HSMS-282A Series.
1000
100
2
1.25
1
1.5
0.75
1
0.50
0.25
0
10
0.5
HSMS-2800 SERIES
HSMS-2810 SERIES
HSMS-2820 SERIES
1
0
0.1
1
10
100
0
10
20
30
40
50
0
2
4
6
8
10 12 14 16
– REVERSE VOLTAGE (V)
R
I
– FORWARD CURRENT (mA)
V
– REVERSE VOLTAGE (V)
V
F
R
Figure 7. Dynamic Resistance vs.
Forward Current.
Figure 8. Total Capacitance vs.
Reverse Voltage—HSMS-280A Series.
Figure 9. Total Capacitance vs.
Reverse Voltage—HSMS-281A Series.
1
0.8
0.6
0.4
0.2
0
0
2
4
6
8
V
– REVERSE VOLTAGE (V)
R
Figure 10. Total Capacitance vs.
Reverse Voltage—HSMS-282A Series.
4
SMT Assembly
passes through one or more
Assembly Instructions
SOT-323 PCB Footprint
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT-323
package, will reach solder reflow
temperatures faster than those
with a greater mass.
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat-
ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
A recommended PCB pad layout
for the miniature SOT-323 (SC-70)
package is shown in Figure 11
(dimensions are in inches). This
layout provides ample allowance
for package placement by auto-
mated assembly equipment
without adding parasitics that
could impair the performance.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
0.026
0.07
reflow zone (T ) should not
MAX
HP’s SOT-323 diodes have been
qualified to the time-temperature
profile shown in Figure 12. This
profile is representative of an IR
reflow type of surface mount
assembly process.
exceed 235 °C.
0.035
These parameters are typical for a
surface mount assembly process
for HP SOT-323 diodes. As a
general guideline, the circuit
board and components should be
exposed only to the minimum
temperatures and times necessary
to achieve a uniform reflow of
solder.
0.016
Figure 11. PCB Pad Layout
( dimensions in inches) .
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
250
200
TMAX
150
Reflow
Zone
100
Preheat
Zone
Cool Down
Zone
50
0
0
60
120
180
240
300
TIME (seconds)
Figure 12. Surface Mount Assembly Profile.
5
Package Dimensions
Outline SOT-323 ( SC-70 3 Lead)
1.30 (0.051)
REF.
2.20 (0.087)
2.00 (0.079)
1.35 (0.053)
1.15 (0.045)
0.650 BSC (0.025)
0.425 (0.017)
TYP.
2.20 (0.087)
1.80 (0.071)
0.10 (0.004)
0.00 (0.00)
0.30 REF.
0.20 (0.008)
0.10 (0.004)
1.00 (0.039)
0.80 (0.031)
0.25 (0.010)
0.15 (0.006)
10°
0.30 (0.012)
0.10 (0.004)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Part Number Ordering Information
Part Number
HSMS-28XA-TR1*
HSMS-28XA-BLK*
No. of Devices
Container
7" Reel
3000
100
antistatic bag
* where X = 0, 1, or 2; A = B, C, E, or F
Tape Dimensions and Product Orientation
For Outline SOT-323 ( SC-70 3 Lead)
P
P
D
2
P
0
E
F
W
C
D
1
t
(CARRIER TAPE THICKNESS)
T (COVER TAPE THICKNESS)
t
1
K
8° MAX.
5° MAX.
0
A
B
0
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
B
K
P
D
2.24 ± 0.10
2.34 ± 0.10
1.22 ± 0.10
4.00 ± 0.10
1.00 + 0.25
0.088 ± 0.004
0.092 ± 0.004
0.048 ± 0.004
0.157 ± 0.004
0.039 + 0.010
0
0
0
BOTTOM HOLE DIAMETER
1
0
PERFORATION
DIAMETER
PITCH
POSITION
D
P
E
1.55 ± 0.05
4.00 ± 0.10
1.75 ± 0.10
0.061 ± 0.002
0.157 ± 0.004
0.069 ± 0.004
CARRIER TAPE WIDTH
THICKNESS
W
8.00 ± 0.30
0.315 ± 0.012
t
0.255 ± 0.013 0.010 ± 0.0005
5.4 ± 0.10 0.205 ± 0.004
0.062 ± 0.001 0.0025 ± 0.00004
1
COVER TAPE
WIDTH
C
TAPE THICKNESS
T
t
DISTANCE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 ± 0.05
0.138 ± 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P
2
2.00 ± 0.05
0.079 ± 0.002
www.hp.com/go/rf
For technical assistance or the location of
your nearest Hewlett-Packard sales office,
distributor or representative call:
Americas/Canada: 1-800-235-0312 or
408-654-8675
Far East/Australasia: Call your local HP
sales office.
Japan: (81 3) 3335-8152
Europe: Call your local HP sales office.
Data subject to change.
Copyright © 1998 Hewlett-Packard Co.
Obsoletes 5965-4705E
Printed in U.S.A.
5966-4901E (3/98)
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