IE-703116-MC-EM1 [ETC]
IE-703116-MC-EM1 User＇s Manual | User＇s Manual[08/2001] ; IE- 703116 -MC- EM1用户手册|用户手册[ 08/2001 ]\n
| 型号： | IE-703116-MC-EM1 |
| 厂家： | 
ETC |
| 描述： | IE-703116-MC-EM1 User＇s Manual | User＇s Manual[08/2001]
|
| 文件： | 总51页 (文件大小：707K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
User’s Manual
IE-703116-MC-EM1
In-Circuit Emulator Option Board
Target Device
V850E/IA1TM
Document No. U14700EJ2V0UM00 (2nd edition)
Date Published August 2001 N CP(K)
2001
©
Printed in Japan
[MEMO]
User’s Manual U14700EJ2V0UM
2
V850E/IA1 is a trademark of NEC Corporation.
Windows is either a registered trademark or a trademark of Microsoft Corporation in the United States
and/or other countries.
PC/AT is a trademark of International Business Machines Corporation.
Ethernet is a trademark of Xerox Corporation.
UNIX is a registered trademark in the United States and/or other countries, licensed exclusively through
X/Open Company Limited.
•
The information in this document is current as of July, 2001. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
•
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
•
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4
User’s Manual U14700EJ2V0UM
3
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, pIease contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
•
•
•
•
•
Device availability
Ordering information
Product release schedule
Availability of related technical literature
Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
•
Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
NEC Electronics Inc. (U.S.)
Santa Clara, California
Tel: 408-588-6000
800-366-9782
NEC Electronics (Germany) GmbH NEC Electronics Hong Kong Ltd.
Benelux Office
Hong Kong
Eindhoven, The Netherlands
Tel: 040-2445845
Tel: 2886-9318
Fax: 2886-9022/9044
Fax: 408-588-6130
800-729-9288
Fax: 040-2444580
NEC Electronics Hong Kong Ltd.
Seoul Branch
Seoul, Korea
Tel: 02-528-0303
Fax: 02-528-4411
NEC Electronics (France) S.A.
Velizy-Villacoublay, France
Tel: 01-3067-5800
NEC Electronics (Germany) GmbH
Duesseldorf, Germany
Tel: 0211-65 03 02
Fax: 01-3067-5899
Fax: 0211-65 03 490
NEC Electronics Singapore Pte. Ltd.
Novena Square, Singapore
Tel: 253-8311
NEC Electronics (France) S.A.
Madrid Office
Madrid, Spain
Tel: 091-504-2787
Fax: 091-504-2860
NEC Electronics (UK) Ltd.
Milton Keynes, UK
Tel: 01908-691-133
Fax: 250-3583
Fax: 01908-670-290
NEC Electronics Taiwan Ltd.
Taipei, Taiwan
Tel: 02-2719-2377
NEC Electronics Italiana s.r.l.
Milano, Italy
Tel: 02-66 75 41
NEC Electronics (Germany) GmbH
Scandinavia Office
Taeby, Sweden
Fax: 02-2719-5951
Fax: 02-66 75 42 99
Tel: 08-63 80 820
Fax: 08-63 80 388
NEC do Brasil S.A.
Electron Devices Division
Guarulhos-SP, Brasil
Tel: 11-6462-6810
Fax: 11-6462-6829
J01.2
User’s Manual U14700EJ2V0UM
4
INTRODUCTION
Target Readers
Purpose
This manual is intended for users who design and develop application systems
using the V850E/IA1TM.
The purpose of this manual is to describe the proper operation of the IE-703116-MC-
EM1, and its basic specifications.
Organization
This manual is broadly divided into the following parts.
• Overview
• Names and functions of components
• Cautions
How to Read This Manual
It is assumed that the reader of this manual has general knowledge of electrical
engineering, logic circuits, and microcontrollers.
The IE-703116-MC-EM1 is used connected to the IE-V850E-MC in-circuit
emulator. This manual explains the basic setup procedure and switch settings
of the IE-703116-MC-EM1. For the names and functions, and the connection
of parts, refer to the IE-V850E-MC, IE-V850E-MC-A User’s Manual
(U14487E), which is sold separately.
To understand the basic specifications and operation methods broadly
→ Read this manual in the order listed in CONTENTS.
To know the operation methods and command functions of the IE-V850E-MC, and
IE-703116-MC-EM1-A
→ Read the user’s manual of the debugger (sold separately) that is
used.
Conventions
Note:
Footnote for item marked with Note in the text
Caution:
Information requiring particular attention
Remark:
Supplementary information
…
Numerical representation:
Binary
×××× or ××××B
…
Decimal
××××
…
Hexadecimal
××××H
Prefix indicating the power of 2 (address space, memory capacity):
K (kilo): 210 = 1024
M (mega): 220 = 10242
Terminology
The meanings of terms used in this manual are listed below.
Target device
Target system
This is the device to be emulated.
The system (user-built system) to be debugged. This includes the target program and
hardware configured by the user.
User’s Manual U14700EJ2V0UM
5
Related Documents
When using this manual, refer to the following manuals.
The related documents indicated in this publication may include preliminary versions.
However, preliminary versions are not marked as such.
{
Documents related to development tools (user’s manuals)
Product Name
Document Number
U14487E
IE-V850E-MC, IE-V850E-MC-A (In-Circuit Emulator)
IE-703116-MC-EM1 (In-Circuit Emulator Option Board)
V800 SeriesTM Development Tool (Tutorial Guide)
CA850 (Ver.2.40 or Later) (C Compiler Package)
This manual
U14218E
U15024E
U15025E
U15026E
U15027E
U15181E
U15182E
U14873E
Operation
C Language
Project Manager
Assembly Language
Operation Windows Based
Operation Windows Based
ID850 (Ver.2.40 or Later) (Integrated Debugger)
SM850 (Ver.2.40 or Later) (System Simulator)
SM850 (Ver.2.00 or Later) (System Simulator)
External Part User Open Interface
Specifications
RX850 (Real-Time OS)
Basics
U13430E
U13410E
U13773E
U13774E
U13737E
U13916E
U14410E
Installation
Basics
RX850 Pro (Real-Time OS)
Installation
RD850 (Ver. 3.0) (Task Debugger)
RD850 Pro (Ver. 3.0) (Task Debugger)
AZ850 (System Performance Analyzer)
User’s Manual U14700EJ2V0UM
6
CONTENTS
CHAPTER 1 OVERVIEW.........................................................................................................................10
1.1 Hardware Configuration.............................................................................................................11
1.2 Features (When Connected to IE-V850E-MC)...........................................................................12
1.3 Function Specifications (When Connected to IE-V850E-MC).................................................13
1.4 System Configuration.................................................................................................................14
1.5 Contents in Carton......................................................................................................................15
1.6 Connection Between IE-V850E-MC and IE-703116-MC-EM1...................................................16
CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS ...........................................................18
2.1 Component Names and Functions of IE-703116-MC-EM1......................................................18
2.2 Clock Settings .............................................................................................................................20
2.2.1 Clock settings outline.........................................................................................................................20
2.2.2 Clock setting methods .......................................................................................................................21
2.3 Operation Mode...........................................................................................................................27
2.3.1
2.3.2
When emulator is used as stand-alone unit...................................................................................27
When emulator is connected to target system...............................................................................27
2.4 Power Supply Settings for Option Board .................................................................................28
2.4.1
2.4.2
JP2 setting when emulator is used as stand-alone unit.................................................................28
JP2 setting when emulator is connected to target system.............................................................28
2.5 Emulation Memory......................................................................................................................29
2.5.1
2.5.2
Wait setting for emulation memory ................................................................................................29
Cautions related to emulation memory ..........................................................................................30
CHAPTER 3 FACTORY SETTINGS.......................................................................................................31
CHAPTER 4 CAUTIONS .........................................................................................................................32
4.1 VDD of Target System..................................................................................................................32
4.2 X1 Signal......................................................................................................................................32
4.3 Pin Termination During Operation of Emulator as Stand-Alone Unit....................................33
4.4 Internal RAM and ROM ...............................................................................................................34
4.5 Bus Control Pins.........................................................................................................................35
APPENDIX A DIMENSIONS....................................................................................................................37
APPENDIX B EXAMPLE OF USE OF CONNECTOR FOR TARGET CONNECTION....................42
APPENDIX C CONNECTORS FOR TARGET CONNECTION ............................................................44
C.1 Usage ...........................................................................................................................................44
C.2 Cautions on Handling Connectors............................................................................................46
APPENDIX D MOUNTING PLASTIC SPACER.....................................................................................47
User’s Manual U14700EJ2V0UM
7
LIST OF FIGURES
Figure No.
Title
Page
1-1
1-2
1-3
System Configuration .......................................................................................................................................14
Contents in Carton............................................................................................................................................15
Connection Between IE-V850E-MC and IE-703116-MC-EM1..........................................................................16
2-1
2-2
2-3
2-4
2-5
2-6
2-7
2-8
2-9
IE-703116-MC-EM1..........................................................................................................................................18
Clock Settings Outline ......................................................................................................................................20
Outline When Using Mounted Internal Clock....................................................................................................22
Outline When Changing Mounted Crystal Oscillator and Using It as Internal Clock ........................................23
Crystal/Ceramic Resonator Mounting Method and Connection Diagram .........................................................24
Outline When Using Crystal/Ceramic Resonator as Internal Clock..................................................................25
Outline When Using Crystal Oscillator on Target System as External Clock ...................................................26
Power Supply Settings (When Emulator Is Used as Stand-Alone Unit and Target System Power Is Off) .......28
Power Supply Setting (When Power of Target System Is On)..........................................................................28
4-1
4-2
4-3
Schematic Diagram of Power Supply Flow.......................................................................................................32
Diagram of X1 Signal Flow ...............................................................................................................................33
Circuit Diagram of CKSEL Pin ..........................................................................................................................33
C-1
C-2
C-3
Mounting NQPACK144SD................................................................................................................................44
Mounting Device...............................................................................................................................................45
NQPACK100SD and Device Pin.......................................................................................................................45
D-1
Mounting Method of Plastic Spacer..................................................................................................................47
User’s Manual U14700EJ2V0UM
8
LIST OF TABLES
Table No.
Title
Page
2-1
2-2
2-3
2-4
2-5
List of Hardware Settings When Setting Clock.................................................................................................21
Settings When Using Mounted Internal Clock..................................................................................................22
Settings When Changing Mounted Internal Clock............................................................................................23
Settings When Using Crystal/Ceramic Resonator as Internal Clock................................................................24
Settings When Using External Clock................................................................................................................26
4-1
4-2
Memory Capacity Limitation List.......................................................................................................................34
Bus Control Pin Operation List .........................................................................................................................35
User’s Manual U14700EJ2V0UM
9
CHAPTER 1 OVERVIEW
The IE-703116-MC-EM1 is an option board for the in-circuit emulator IE-V850E-MC. By connecting the IE-
703116-MC-EM1 to the IE-V850E-MC, hardware and software can be debugged efficiently in system development
using the V850E/IA1.
In this manual, the basic setup procedures and switch settings of the IE-703116-MC-EM1 when connecting it to
the IE-V850E-MC are described. For the names and functions of the parts of the IE-V850E-MC, and for the
connection of parts, refer to the IE-V850E-MC, IE-V850E-MC-A User’s Manual (U14487E) which is a separate
volume.
User’s Manual U14700EJ2V0UM
10
CHAPTER 1 OVERVIEW
1.1 Hardware Configuration
Separately sold hardware
In-circuit emulator (IE-V850E-MC)
Option board
IE-V850E-MC can be used as in-circuit emulator for V850E/IA1 by
adding this board.
(IE-703116-MC-EM1)
Separately sold hardware
Extension probeNote
SC-144SDN
General-purpose extension probe made by TOKYO ELETECH
CORPORATION.
SC-144SDN/PR
PC interface board
IE-70000-PCI-IF(-A)
IE-70000-CD-IF-A
These boards are used to connect the IE-V850E-MC-A to a personal
computer. These boards are inserted in the expansion slot of the
personal computer.
IE-70000-PCI-IF(-A): For PCI bus
IE-70000-CD-IF-A: For PCMCIA socket
Power adapter
AC adapter dedicated to NEC in-circuit emulators
(IE-70000-MC-PS-B)
Note For further information, contact Daimaru Kogyo Co., Ltd.
Tokyo Electronics Department (TEL +81-3-3820-7112)
Osaka Electronics Department (TEL +81-6-6244-6672)
User’s Manual U14700EJ2V0UM
11
CHAPTER 1 OVERVIEW
1.2 Features (When Connected to IE-V850E-MC)
{
{
{
{
Maximum operation frequency: 50 MHz (VDD = 5 V operation)
Extremely lightweight and compact
Higher equivalence with target device can be achieved by omitting buffer between signal cables.
The following pins can be masked.
RESET, NMI, WAIT, HLDRQ
{
{
Two methods of connection to target system:
• Direct connection of the IE-703116-MC-EM1
• Attach an extension probe (sold separately) to the connection tab of the IE-703116-MC-EM1.
The dimensions of the IE-703116-MC-EM1 are as follows.
Parameter
Value
Power consumption
External dimensions
0.9 W (at 50 MHz operation frequency)Note
Height
Length
Width
15 mm
206 mm
96 mm
190 g
(Refer to APPENDIX A DIMENSIONS)
Weight
Note The power consumption is 9.1 W for IE-V850E-MC + IE-703116-MC-EM1.
User’s Manual U14700EJ2V0UM
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CHAPTER 1 OVERVIEW
1.3 Function Specifications (When Connected to IE-V850E-MC)
Parameter
Specification
Emulation memory capacity
Internal ROM
External memory
Internal ROM
256 KB
4 MB
Execution/pass detection
Coverage memory capacity
256 KB
2 MB
External
memory
In ROMless mode
When using iROM
1 MB
Trace memory capacity
168 bits × 32 Kframes
Time measurement function
Can be measured with time tag and timers (3
lines)
External logic probe
Break function
8 bits external trace is possible
Event setting for trace/break is possible
Event break
Step execution break
Forcible break
Fail-safe break
• Illegal access to peripheral I/O
• Access to guard space
• Writing to ROM space
Caution Some of the functions may not be supported depending on the debugger used.
User’s Manual U14700EJ2V0UM
13
CHAPTER 1 OVERVIEW
1.4 System Configuration
The system configuration when connecting the IE-703116-MC-EM1 to the IE-V850E-MC, which is then connected
to a personal computer (PC-9800 series, PC/AT or compatibles) is shown below.
Figure 1-1. System Configuration
<12>
<5>
<6>
<7>
[Magnified drawing: example of use of
connector for target connection]
<11>
<13>
<4>
<9>
Target
system
<10>
<8>
<3>
<9>
<10>
<1>, <2>
Target system
Remark
<1> Personal computer (PC-9800 series, PC/AT or compatibles)
<2> Debugger (sold separately), Device fileNote
<3> PC interface board (IE-70000-PCI-IF(-A), IE-70000-CD-IF-A: sold separately)
<4> PC interface cable (included with IE-V850E-MC)
<5> In-circuit emulator (IE-V850E-MC: sold separately)
<6> In-circuit emulator optional board (IE-703116-MC-EM1)
<7> External logic probe
<8> Extension probe (SC-144SDN, SC-144SDN/PR: sold separately)
<9> Connector for emulator connection (YQPACK144SD: included)
<10> Connector for target connection (NQPACK144SD: included)
<11> Power adapter (IE-70000-MC-PS-B: sold separately)
<12> AC100 V power cable (sold separately: included with IE-70000-MC-PS-B)
<13> AC220 V power cable (sold separately: included with IE-70000-MC-PS-B)
Note Obtain the device file from the web site of NEC Electron Devices (http://www.ic.nec.co.jp/micro/).
User’s Manual U14700EJ2V0UM
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CHAPTER 1 OVERVIEW
1.5 Contents in Carton
The carton of the IE-703116-MC-EM1 contains a main unit, guarantee card, packing list, and accessory bag.
Make sure that the accessory bag contains this manual and connector accessories. In case of missing or damaged
items, contact an NEC sales representative or distributor.
Figure 1-2. Contents in Carton
<2> Accessory bag
<1> IE-703116-MC-EM1
<5> IC Socket
NQPACK144SD
<4> Packing list
<6> IC Socket
YQPACK144SD
<3> Guarantee card
<7> IC Socket
HQPACK144SD
<1> IE-703116-MC-EM1 × 1
<2> Accessory bag × 1
<3> Guarantee card × 1
<4> Packing list × 1
<5> IC socket NQPACK144SD × 1
<6> IC socket YQPACK144SD × 1
<7> IC socket HQPACK144SD × 1
Check that the accessory bag contains this manual, a packing list, an external logic probe, and a restriction
document.
User’s Manual U14700EJ2V0UM
15
CHAPTER 1 OVERVIEW
1.6 Connection Between IE-V850E-MC and IE-703116-MC-EM1
The procedure for connecting the IE-V850E-MC and IE-703116-MC-EM1 is described below.
Caution Connect carefully so as not to break or bend connector pins.
<1> Remove the POD cover (upper and lower) of the IE-V850E-MC.
<2> Set the PGA socket lever of the IE-703116-MC-EM1 to the OPEN position as shown in Figure 1-3 (b).
<3> Connect the IE-703116-MC-EM1 to the PGA socket at the rear of the POD (refer to Figure 1-3 (c)). When
connecting, position the IE-V850E-MC and IE-703116-MC-EM1 so that they are horizontal.
Spacers can be connected to fix the POD (refer to APPENDIX D MOUNTING PLASTIC SPACER).
<4> Set the PGA socket lever of the IE-703116-MC-EM1 to the CLOSE position as shown in Figure 1-3 (b).
<5> Fix the IE-703116-MC-EM1 between the POD covers (upper and lower) with the nylon rivets supplied with
the IE-V850E-MC.
<6> Fix the POD cover (upper) end with nylon rivets.
Figure 1-3. Connection Between IE-V850E-MC and IE-703116-MC-EM1 (1/2)
(a) Overview
Nylon rivets
Upper cover
IE-703116-MC-EM1
Nylon rivets
IE-V850E-MC
Lower cover
Nylon rivets
User’s Manual U14700EJ2V0UM
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CHAPTER 1 OVERVIEW
Figure 1-3. Connection Between IE-V850E-MC and IE-703116-MC-EM1 (2/2)
(b) PGA socket lever of IE-703116-MC-EM1
CLOSE
OPEN
(c) Connecting part (IE-703116-MC-EM1)
Pin A1 position
: Insertion guide
: IE-V850E-MC insertion area
User’s Manual U14700EJ2V0UM
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CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS
This chapter describes the names, functions, and switch settings of components comprising the IE-703116-MC-
EM1. For the details of the POD, jumper, and switch positions, etc., refer to the IE-V850E-MC, IE-V850E-MC-A
User’s Manual (U14487E).
2.1 Component Names and Functions of IE-703116-MC-EM1
Figure 2-1. IE-703116-MC-EM1
(a) Top View
(b) Bottom View
Direction of pin 1 of the connector
for target connection
Connector for
target connection
LD2
LD1
DIRECT
SW1
V850E/IA1
I/O chip
TP1
TP2
TP3
TP4
TP5
TP6
CN2
PLL
1
6
JP1
JP2
1
21
3
2
CN1
4
7
8
Connector for
IE-V850E-MC connection
Emulation memory
User’s Manual U14700EJ2V0UM
18
CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS
(1) Test pin (TP1 to TP6)
To leave the DMA cycle or refresh cycle in the tracer, or break these cycles, connect these pins to the external
logic probe.
• TP1: GND
• TP2: Test pin for product shipment inspection
• TP3: DMAAK0
• TP4: DMAAK1
• TP5: DMAAK2
• TP6: DMAAK3
(2) SW1
This is a switch for clock mode switching (for details, refer to 2.2 Clock Settings).
(3) JP1
This is a jumper for switching the clock supply source (for details, refer to 2.2 Clock Settings).
(4) JP2
This is a jumper for switching the power supply (for details, refer to 2.4 Power Supply Settings for Option
Board).
(5) CN1
Connects the external logic probe (included).
(6) CN2
This is the socket for connecting a crystal/ceramic resonator (for details, refer to 2.2 Clock Settings).
(7) LD1 (CKSEL: Green)
LED Status
Lit
Extinguished
When Used as Stand-Alone Unit
SW1 = DIRECT
When Used in Target System Connection
The CKSEL signal from the target system is high
The CKSEL signal from the target system is low
SW1 = PLL
(8) LD2 (RUN: Yellow)
LED Status
Lit
User program is being executed.
User program is halted.
Extinguished
(9) Connector for IE-V850E-MC connection
This is a connector for connecting the IE-V850E-MC.
(10)Connector for target connection
This is a connector for connecting the target system or the extension probe.
(11)Emulation memory
This is a memory that replaces the memory/memory mapped I/O on the target system (for details, refer to 2.5
Emulation Memory).
User’s Manual U14700EJ2V0UM
19
CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS
2.2 Clock Settings
2.2.1 Clock settings outline
The following 4 clock setting methods are available.
For details, refer to 2.2.2 Clock setting methods.
(1) Use the crystal oscillator mounted on OSC1 of the IE-703116-MC-EM1 as the internal clock (4.000 MHz).
(2) Change the crystal oscillator mounted on OSC1 of the IE-703116-MC-EM1 and use it as the internal clock
(other than 4.000 MHz).
(3) Mount a crystal/ceramic resonator and capacitor on CN2 of the IE-703116-MC-EM1 and use it as the internal
clock (other than 4.000 MHz).
(4) Use the crystal oscillator on the target system as the external clock (clock input from target system).
Caution When using an external clock, input the clock generated by the crystal oscillator to the X1 pin.
When a clock generated by a crystal/ceramic resonator is used, the emulator does not operate
normally.
Figure 2-2. Clock Settings Outline
IE-703116-MC-EM1
Crystal oscillator
(can be changed)
Oscillator/
resonator switch
Switching with
debugger
OSC1
Target system
JP1
IC20
Crystal
oscillator
X1
IE-V850E-MC
EVA chip
Crystal/ceramic
resonator can
be mounted
CN2
SW1
PLL/Direct
mode
V850E/IA1
I/O chip
switching
CKSEL
CLKOUT
User’s Manual U14700EJ2V0UM
20
CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS
2.2.2 Clock setting methods
A list of the hardware settings when setting the clock is shown below.
Table 2-1. List of Hardware Settings When Setting Clock
Type of Clock Used
Clock
Source
SelectionNote 1
OSC1 Crystal
Oscillator
CN2 Crystal/
Ceramic
JP1 Setting
Clock
Mode
SW1
CKSEL
PinNote 2
Resonator
PLL
2
1
(1) Use crystal
Internal
Internal
Internal
External
Factory
settings
Mounting
prohibited
PLL
Low-level
input
oscillator (OSC1)
mounted on
Direct
PLL
(4.000 MHz)
IE-703116-MC-EM1
as internal clock.
Direct
High-level
input
8
2
7
Direct
PLL
(2) Change crystal
oscillator (OSC1)
mounted on
Change
Mounting
prohibited
PLL
Low-level
input
1
(to other than
4.000 MHz)
Direct
PLL
IE-703116-MC-EM1
and use it as the
internal clock.
Direct
High-level
input
8
2
7
Direct
PLL
(3) Mount a
Crystal
Mount
PLL
Low-level
input
1
crystal/ceramic
resonator on
oscillator can
be either
Direct
PLL
IE-703116-MC-EM1
and use it as the
internal clock.
mounted or not
mounted
Direct
High-level
input
8
2
7
Direct
PLL
(4) Use the crystal
oscillator on the
target system as an
external clock.
Crystal
Mounting
prohibited
PLL
Low-level
input
1
oscillator can
be either
Direct
PLL
mounted or not
mounted
Direct
High-level
input
8
7
Direct
Notes 1. Select the clock source in the clock source selection area in the configuration dialog box on the
debugger.
2. The input setting to the CKSEL pin is made only when a target system is connected. Leave this pin
open when operating the emulator on a standalone basis.
Caution Settings other than those described above are prohibited.
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21
CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS
(1) Using the crystal oscillator (OSC1) mounted on the IE-703116-MC-EM1 as the internal clock
<1> If a crystal/ceramic resonator is mounted in the CN2 socket, remove it.
<2> Mount the 4.000 MHz crystal oscillator mounted at factory shipment in the OSC1 socket of the IE-703116-
MC-EM1 (with the default settings).
<3> Change JP1 as indicated in Table 2-2 (with the default settings).
<4> Set the SW1 and CKSEL pins according to the clock mode to be used, as shown in Table 2-2.
<5> To start up the integrated debugger (ID850), select “Internal” in the clock source selection area in the
configuration dialog box (clock selection in emulator).
Table 2-2. Settings When Using Mounted Internal Clock
Type of Clock Used
Clock Source
Selection
OSC1 Crystal
Oscillator
CN2
JP1
Clock
Mode
SW1
CKSEL
PinNote
Crystal/Ceramic
Resonator
Setting
PLL
2
1
Use crystal oscillator
(OSC1) mounted on
IE-703116-MC-EM1
as internal clock.
Internal
Factory
setting
Mounting
prohibited
PLL
Low-level
input
Direct
(4.000 MHz)
PLL
Direct
High-level
input
8
7
Direct
Note The input setting to the CKSEL pin is made only when a target system is connected. Leave this pin open
when operating the emulator on a standalone basis.
Figure 2-3. Outline When Using Mounted Internal Clock
IE-703116-MC-EM1
1-2 shorted
3-4 shorted
5-6 open
Mounted
crystal oscillator
Select
“Internal”
on ID850
7-8 open
OSC1
4 MHz
Target system
JP1
IC20
X1
Crystal
oscillator
IE-V850E-MC
Crystal/ceramic
CN2
resonator mounting
prohibited
SW1
PLL/Direct
mode
EVA chip
switching
V850E/IA1
I/O chip
CKSEL
CLKOUT
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CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS
(2) Changing the crystal oscillator (OSC1) mounted on the IE-703116-MC-EM1 and using it as the internal clock
<1> If a crystal/ceramic resonator is mounted in the CN2 socket, remove it.
<2> Remove the crystal oscillator (OSC1) that is mounted on the option board and mount the oscillator to be
used.
<3> Set JP1 as shown in Table 2-3 (factory settings).
<4> Set the SW1 and CKSEL pins according to the clock mode to be used, as shown in Table 2-3.
<5> Select “Internal” in the clock source selection area in the configuration dialog box on the integrated debugger
(ID850).
Table 2-3. Settings When Changing Mounted Internal Clock
Type of Clock Used
Clock
Source
OSC1 Crystal
Oscillator
CN2
JP1
Clock
Mode
SW1
CKSEL
pinNote
Crystal/Ceramic
Resonator
Setting
Selection
PLL
2
1
Change the crystal
oscillator mounted on
IE-703116-MC-EM1
and use it as the
internal clock.
Internal
Change
Mounting
prohibited
PLL
Low-level
input
(to other than
4.000 MHz)
Direct
PLL
Direct
High-level
input
8
7
Direct
Note The input setting to the CKSEL pin is made only when a target system is connected. Leave this pin open
when operating the emulator on a standalone basis.
Figure 2-4. Outline When Changing Mounted Crystal Oscillator and Using It as Internal Clock
IE-703116-MC-EM1
Change crystal
oscillator
1-2 shorted
3-4 shorted
5-6 open
Select
“Internal”
on ID850
Target system
7-8 open
OSC1
Other than
4 MHz
IC20
JP1
Crystal
oscillator
X1
IE-V850E-MC
EVA chip
CN2
Crystal/ceramic
resonator mounting
prohibited
SW1
PLL/Direct
mode
switching
V850E/IA1
I/O chip
CKSEL
CLKOUT
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CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS
(3) Mounting a crystal/ceramic resonator on the IE-703116-MC-EM1 and using it as the internal clock
<1> Mount the crystal/ceramic resonator and capacitor to be used in the CN2 socket as shown below (when
selecting the crystal/ceramic resonator, refer to the V850E/IA1 standards table).
<2> Set JP1 as shown in Table 2-4.
<3> Set the SW1 and CKSEL pins according to the clock mode to be used, as shown in Table 2-4.
<4> Select “Internal” in the clock source selection area in the configuration dialog box on the integrated debugger
(ID850).
Figure 2-5. Crystal/Ceramic Resonator Mounting Method and Connection Diagram
(a) Mounting method
(b) Connection diagram
V850E/IA1
I/O chip
Clock to
EVA chip
EVA chip
Crystal/ceramic resonator
X1
3
4
X2
Capacitor
Capacitor
1
2
5
6
1
6
CN2 of IE-703116-MC-EM1
: Pin No. of CN2 connector on IE-703116-MC-EM1
Table 2-4. Settings When Using Crystal/Ceramic Resonator as Internal Clock
Type of Clock Used
Clock
OSC1 Crystal
Oscillator
CN2
JP1 Setting
Clock
Mode
SW1
CKSEL
PinNote 1
Source
Selection
Crystal/Ceramic
Resonator
MountNote 2
PLL
Low-level
input
PLL
2
1
Mount crystal/ceramic
resonator on
Internal
Crystal
oscillator can
be either
Direct
IE-703116-MC-EM1
and use as internal
clock
mounted or
not mounted
PLL
Direct
High-level
input
8
7
Direct
Notes 1. The input setting to the CKSEL pin is made only when a target system is connected. Leave this pin
open when operating the emulator on a standalone basis.
2. When selecting the crystal/ceramic resonator, refer to the V850E/IA1 standards table.
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CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS
Figure 2-6. Outline When Using Crystal/Ceramic Resonator as Internal Clock
IE-703116-MC-EM1
1-2 shorted
Select
Can be either
mounted or
not mounted
3-4 open
5-6 open
7-8 open
“Internal”
on ID850
Target system
IC20
OSC1
JP1
X1
Crystal
oscillator
IE-V850E-MC
EVA chip
Mount crystal/ceramic
resonator
CN2
SW1
PLL/Direct
mode
switching
V850E/IA1
I/O chip
CKSEL
CLKOUT
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CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS
(4) Using the target system crystal oscillator as an external clock
<1> If a crystal/ceramic resonator is mounted in the CN2 socket, remove it.
<2> Set JP1 as shown in Table 2-5 (factory setting).
<3> Set the SW1 and CKSEL pins according to the clock mode to be used, as shown in Table 2-5.
<4> Select “External” in the clock source selection area in the configuration dialog box on the integrated
debugger (ID850).
Table 2-5. Settings When Using External Clock
Type of Clock Used
Clock Source
Selection
OSC1 Crystal
Oscillator
CN2 Crystal
Resonator
JP1
Clock
Mode
SW1
CKSEL
PinNote
Setting
PLL
2
Use crystal oscillator
on target system as
external clock.
External
Crystal
Mounting
prohibited
PLL
Low-level
input
1
oscillator can
be either
Direct
mounted or
not mounted
PLL
Direct
High-level
input
8
7
Direct
Note The input setting to the CKSEL pin is made only when a target system is connected. Leave this pin open
when operating the emulator on a standalone basis.
Caution Be sure to input a clock generated by a crystal oscillator to the X1 pin.
When a clock generated by a crystal/ceramic resonator is used, the emulator does not operate
normally.
Figure 2-7. Outline When Using Crystal Oscillator on Target System as External Clock
IE-703116-MC-EM1
1-2 shorted
Select
“External”
on ID850
Can be either
mounted or
not mounted
3-4 shorted
5-6 open
7-8 open
IC20
Target system
OSC1
JP1
X1
IE-V850E-MC
Crystal
oscillator
Crystal/ceramic
resonator mounting
CN2
SW1
prohibited
PLL/Direct
mode
EVA chip
switching
V850E/IA1
I/O chip
CKSEL
CLKOUT
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26
CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS
2.3 Operation Mode
The IE-703116-MC-EM1 supports single-chip mode 0, single-chip mode 1, ROMless mode 0, and ROMless mode
1 similar to the V850E/IA1. Set these as follows.
2.3.1 When emulator is used as stand-alone unit
Only operation in single-chip mode 0 is supported.
When the integrated debugger (ID850) is activated, be sure to select “Mode02” in the configuration dialog box
mask setting area.
2.3.2 When emulator is connected to target system
Set as follows in the configuration dialog box mask setting area when the integrated debugger (ID850) is activated
in accordance with the operation mode used.
Operation in ROMless mode 0: Select Mode00
Operation in ROMless mode 1: Select Mode01
Operation in single-chip mode 0: Select Mode02
Operation in single-chip mode 1: Select Mode03
Emulation of the MODE pin cannot be performed since the input level to the MODE pin is implemented using the
debugger pin mask function in the IE-703116-MC-EM1.
For the settings of the pins on the target system, refer to the V850E/IA1 Hardware User’s Manual (U14492E).
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CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS
2.4 Power Supply Settings for Option Board
Using the JP2 setting, the IE-703116-MC-EM1 can switch between operation using the emulator as a stand-alone
unit (using the power of the emulator) and operation using the emulator connected to the target system (using the
power of the target system).
2.4.1 JP2 setting when emulator is used as stand-alone unit
The IE-703116-MC-EM1 operates using the emulator’s power supply when the emulator operates as a stand-
alone unit and target system power is off.
Figure 2-2 shows the JP2 setting.
Caution If the JP2 setting is incorrect, the emulator may be damaged.
Figure 2-8. Power Supply Settings (When Emulator Is Used as Stand-Alone Unit and
Target System Power Is Off)
JP2
2
1
4
3
Set both 1 and 2, and 3 and 4 as open
2.4.2 JP2 setting when emulator is connected to target system
The IE-703116-MC-EM1 operates using the target system’s power supply when the power of the target system is
on. Figure 2-3 shows the JP2 setting.
Caution If the JP2 setting is incorrect, the emulator may be damaged.
Figure 2-9. Power Supply Setting (When Power of Target System Is On)
JP2
2
1
4
3
Set 1 and 2 as open, and 3 and 4 as shorted
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CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS
2.5 Emulation Memory
This is a substitute memory used to emulate the memory or memory mapped I/O on the target system (capacity: 4
MB).
The emulation memory is mounted on the IE-703116-MC-EM1.
2.5.1 Wait setting for emulation memory
The data wait, address wait, and idle state for the emulation memory are set as follows.
(1) ID850
Select from the following three types on the configuration screen.
Selection
Wait Type
Data wait
Emulation Memory Access
Fixed to 0 waits
External Memory Access
Depends on DWC register setting
WAIT signal masked
WAIT MASK
Address wait
Idle state
Fixed to 0 waits
Fixed to 0 cycles
Fixed to 1 wait
Depends on ASC register setting
Depends on BCC register setting
1 WAIT ACCESS
TARGET WAIT
Data wait
Depends on DWC register setting
and WAIT signal status
Address wait
Idle state
Fixed to 0 waits
Depends on ASC register setting
Depends on BCC register setting
Fixed to 0 cycles
Data wait
Depends on DWC register setting
However, 1 wait when set to 0 waits
Fixed to 0 waits
Depends on DWC register setting
and WAIT signal status
Address wait
Idle state
Depends on ASC register setting
Depends on BCC register setting
Depends on BCC register setting
(2) MULTI
Select mask or unmask for WAIT and EMWAIT using the “Pinmask” command.
Selection
Wait Type
Data wait
Emulation Memory Access
Fixed to 0 waits
External Memory Access
Depends on DWC register setting
WAIT signal masked
WAIT: Mask
EMWAIT: Mask
Address wait
Idle state
Fixed to 0 waits
Fixed to 0 cycles
Fixed to 1 wait
Depends on ASC register setting
Depends on BCC register setting
WAIT: Unmask
EMWAIT: Mask
Data wait
Depends on DWC register setting
and WAIT signal status
Address wait
Idle state
Fixed to 0 waits
Depends on ASC register setting
Depends on BCC register setting
Fixed to 0 cycles
WAIT: Unmask
Data wait
Depends on DWC register setting
However, 1 wait when set to 0 waits
Fixed to 0 waits
Depends on DWC register setting
and WAIT signal status
EMWAIT: Unmask
Address wait
Idle state
Depends on ASC register setting
Depends on BCC register setting
Depends on BCC register setting
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CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS
2.5.2 Cautions related to emulation memory
(1) Number of data waits required for emulation memory access
The number of data waits required to be inserted for emulation memory access varies depending on the
operating frequency of the emulator.
4 MHz ≤ Operating frequency < 25 MHz
25 MHz ≤ Operating frequency ≤ 40 MHz
40 MHz < Operating frequency
0 waits
1 wait
2 waits
(2) Bus sizing
Make the bus sizing 16 bits (set BSC register BSn0 to 1).
An 8-bit bus cannot be used.
(3) WAIT pin
The number of data waits for the emulation memory is not affected by the WAIT pin.
(4) Address wait
Address waits cannot be inserted in the emulation memory.
When address waits need to be inserted, set as follows.
Number of data waits for CS
space of emulation memory
Number of address waits for
external memory or external I/O
Number of data waits for
external memory or external I/O
+
=
This setting is effective to make the access speed to the emulation memory equal to that of the external memory
or external I/O to measure the performance, etc.
For how to insert waits in the emulation memory, refer to 2.5.1 Wait setting for emulation memory.
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30
CHAPTER 3 FACTORY SETTINGS
Item
Setting
Remark
JP1
JP2
Setting that uses a crystal resonator as an
internal/external clock.
2
1
8
7
Setting that supplies the IE-703116-MC-EM1 with
the power of the emulator (when the emulator
operates as a stand-alone unit and target system
power is off).
2
1
4
3
SW1
Set to PLL mode.
PLL
DIRECT
OSC1
4.000 MHz crystal oscillator is mounted.
The frequency can be changed by changing the
crystal resonator.
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CHAPTER 4 CAUTIONS
4.1 VDD of Target System
(1) VDD in the target system is used to operate the circuit in the emulator.
(2) When JP2 is set as “1 and 2 open” and “3 and 4 shorted”, the evaluation chip in the emulator operates on VDD
from the target system.
(3) When JP2 is set as “1 and 2 open” and “3 and 4 open”, the emulator recognizes the target system power is off
and operates with the 3.3 V power supply.
Figure 4-1. Schematic Diagram of Power Supply Flow
IE-V850E-MC
EVA chip
IE-703116-MC-EM1
I/O chip
Target system
CVDD
Power supply
circuit
Relay
VDD
JP2
JP2
2
1
4
2
1
4
3
3
4.2 X1 Signal
The input signal (X1 signal) from the target system is delayed (for tpLH = tpHL = 13.2 ns (MAX.)) because it passes
through VHC157 before it is input to the I/O chip of the emulator. The input voltage becomes VIH = 2.31 V (MIN.) and
VIL = 0.99 V (MAX.). The input current becomes IIN = 1.0 µA (MAX.).
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CHAPTER 4 CAUTIONS
Figure 4-2. Diagram of X1 Signal Flow
IE-703116-MC-EM1
X1 signal
Target system
X1 pin
VHC157
I/O chip
4.3 Pin Termination During Operation of Emulator as Stand-Alone Unit
(1) MODE0 to MODE2 pins
When the emulator operates as a stand-alone unit, the operation mode of the emulator is single-chip mode 0.
The MODE0 to MODE2 pins are connected as follows.
•
•
•
MODE0: Connected to VSS via a resistor (33 kΩ) (pull-down).
MODE1: Connected to VDD via a resistor (33 kΩ) (pull-up).
MODE2: Connected to VSS via a resistor (33 kΩ) (pull-down).
(2) RESET pin
This pin is connected to VDD via a resistor (33 kΩ) (Pull-up).
(3) CKSEL pin
Pull-up/pull-down switching is possible with SW1.
Figure 4-3. Circuit Diagram of CKSEL Pin
CKSEL pin
V
DD
I/O chip
33 kΩ
SW1
CKSEL
33 kΩ
VHCT541
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CHAPTER 4 CAUTIONS
4.4 Internal RAM and ROM
Because the internal RAM (iRAM) and internal ROM (iROM) capacities of the emulator are set in steps, the memory
capacity is different from that of the target device. If addresses that exceed the target device capacity are accessed,
the memory of the emulator is accessed. The memory capacities are as follows.
Table 4-1. Memory Capacity Limitation List
(a) iRAM capacity (Unit: byte)
(b) iROM capacity (Unit: byte)
Target Device
Emulator
Target Device
Emulator
(Emulation Memory)
1 K to 4 K
4 K
1 K to 32 K
32 K
5 K to 12 K (µPD70F3116, µPD703117)
13 K to 28 K
12 K
33 K to 64 K
64 K
28 K
60 K
65 K to 128 K (µPD703117)
129 K to 256 K (µPD70F3116)
257 K to 512 K
128 K
256 K
512 K
29 K to 60 K
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CHAPTER 4 CAUTIONS
4.5 Bus Control Pins
There are the following differences between the emulator and the target device in the operation of the pins for bus
control.
Table 4-2. Bus Control Pin Operation List (1/2)
(a) During break
Pin Name
Waiting for Emulator
Command
Internal Memory
Internal RAM
External Memory
Emulation RAM Target System
Internal
ROM
On-Chip
Peripheral I/O
R
R
W
R
W
R
W
R
W
AD0 to AD15
A16 to A23
Hi-Z
Hi-Z
Note
Note
Note
Note
Address accessed last is
held
Address accessed last is held
CS0 to CS7
RD
H
H
H
Note
H
H
H
Note
ASTB
H
H
Note
H
Note
LWR, UWR
WAIT
H
H
Note
Invalid
Maskable
Note
Invalid
Maskable
Note
Maskable
Maskable
Note
Maskable
Maskable
Note
HLDRQ
HLDAK
Note Performs the same operation as the cycle that is generated by the target device program execution.
Remarks 1. R:
W: Write
2. H: High-level output
Hi-Z: High-impedance
Read
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CHAPTER 4 CAUTIONS
Table 4-2. Bus Control Pin Operation List (2/2)
(b) During user program execution
Pin Name
Internal Memory
External Memory
Emulation RAM Target System
Internal ROM
Internal RAM
On-Chip
Peripheral I/O
F
R
F
R
W
R
W
F
R
W
F
R
W
AD0 to AD15
A16 to A23
CS0 to CS7
RD
Hi-Z
Note
Note
H
Note
Address accessed last is held
Note
H
Note
H
H
Note
ASTB
H
Note
H
Note
LWR, UWR
WAIT
H
Note
Invalid
Maskable
Note
Maskable
Maskable
Note
Maskable
Maskable
Note
HLDRQ
HLDAK
Note Performs the same operation as the cycle that is generated by the target device program execution.
Remarks 1. F:
Fetch
Read
R:
W: Write
2. H: High-level output
Hi-Z: High-impedance
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36
APPENDIX A DIMENSIONS
(1) IE-V850E-MC + IE-703116-MC-EM1 (Unit: mm)
448
55
166
227
Top view
Pin 1 direction
Side view
IE-V850E-MC
IE-703116-MC-EM1
Bottom view
206.6
15.88
Top view
29.0
37
User’s Manual U14700EJ2V0UM
APPENDIX A DIMENSIONS
(2) SC-144SD (Unit: mm)
144
109
108
1
36
37
73
72
40
130
213
43
38
User’s Manual U14700EJ2V0UM
APPENDIX A DIMENSIONS
(3) NQPACK144SD (Unit: mm)
[Top view]
27.0
0.5 × 35 = 17.5
3
R1.5
0.5
7.0
0.3
C1.5
109
144
108
1
φ
3
1.0
2
7
2
1
36
73
37
72
2.5
2.5
20.1
[Side view]
3
5
9
1
3
1
0.18
0
0.5
0.5
21.05
[Bottom view]
23.0
12.0
109
144
1
108
2
0
36
73
72
37
φ
4
2.0 Height of projection1.8
39
User’s Manual U14700EJ2V0UM
APPENDIX A DIMENSIONS
(4) YQPACK144SD (Unit: mm)
[Top view]
22.65
0.5
×
35 = 17.5
7.0
φ
4
2.2
0.5
C2.0
144
109
108
1
φ
1.0
3
2
2
1
1
2
1
2
7
36
73
37
72
3
R2.5
4 R1.5
[Side view]
0.3
0.25
× 0.3
2
3
1
9
1
3
7
3
2
0.25
[Bottom view]
22.8
19.6
C1.5
109
144
108
1
2
73
36
72
37
0
40
User’s Manual U14700EJ2V0UM
APPENDIX A DIMENSIONS
(5) HQPACK144SD (Unit: mm)
[Top View]
0.15
22.65
0.1
0.5
×
35 = 17.5
φ
4
2.2
0.1
C2.0
7.0
144
109
2
3
1
108
φ
3
1.0
2
1
2
2
7
1
1
73
36
3
2
37
72
3
R2.5
4
R1.5
[Side View]
1
2
3
7
1
3
2
0.25
[Bottom View]
22.8
19.6
C1.5
109
144
108
1
.
0
2
73
36
72
37
0
41
User’s Manual U14700EJ2V0UM
APPENDIX B EXAMPLE OF USE OF CONNECTOR FOR TARGET CONNECTION
(1) When directly connecting device to target system (connector for target connection is not used)
Device
Target system
(2) When using device using connector for target connection
Fastening screws
HQPACK144SD
Device
NQPACK144SD
Target system
(3) Connection between emulator and target system
(a) When extension probe is not used
Note
YQPACK144SD
NQPACK144SD
Target system
Note The connector for emulator connection (YQSOCKET144SDN) can be inserted at this position for height
adjustment.
42
User’s Manual U14700EJ2V0UM
APPENDIX B EXAMPLE OF USE OF CONNECTOR FOR TARGET CONNECTION
(b) When extension probe is used
Extension
probe
Note
YQPACK144SD
NQPACK144SD
Target system
Note The connector for emulator connection (YQSOCKET144SDN) can be inserted at this position for height
adjustment.
43
User’s Manual U14700EJ2V0UM
APPENDIX C CONNECTORS FOR TARGET CONNECTION
C.1 Usage
(1) When mounting NQPACK144SD on target system
<1> Coat the tip of the four projections (points) at the bottom of the NQPACK144SD with two-component type
epoxy adhesive (cure time longer than 30 min.) and bond the NQPACK144SD to the target system. If not
bonded properly, the pad of the printed circuit board may peel off when the emulator is removed from the
target system. If the lead of the NQPACK144SD is not aligned with the pad of the target system easily,
perform step <2> to adjust the position.
<2> To adjust the position, insert the guide pins for position adjustment (NQGUIDE) provided with
NQPACK144SD into the pin holes on the upper side of NQPACK144SD (refer to Figure C-1).
The diameter of a hole is φ = 1.0 mm. There are three non-through holes (refer to APPENDIX A
DIMENSIONS).
<3> After setting the HQPACK144SD, solder the NQPACK144SD to the target system. By following this
sequence, adherence of flux or solder sputtering to contact pins of the NQPACK144SD can be avoided.
Recommended soldering conditions… Reflow:
240°C, 20 seconds max.
Partial heating: 240°C, 10 seconds max. (per pin row)
<4> Remove the guide pins.
Figure C-1. Mounting NQPACK144SD
HQPACK144SD
Guide pins
(NQGUIDE)
NQPACK144SD
Target system
Remark NQPACK144SD: Connector for target connection
HQPACK144SD: Cover for device installation
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APPENDIX C CONNECTORS FOR TARGET CONNECTION
(2) When mounting device
Caution Check for abnormal conditions such as resin burr or bent pins before mounting a device on the
NQPACK144SD. Moreover, check that the hold pins of the HQPACK144SD are not broken or
bent before mounting the HQPACK144SD. If there are broken or bent pins, fix them with a thin,
flat plate such as a blade.
<1> Make sure that the NQPACK144SD is clean and the device pins are parallel (flat) before mounting a
device on the NQPACK144SD. Then, after mounting the NQPACK144SD on the target board, fix the
device and the HQPACK144SD (refer to Figure C-2).
<2> Using the screws provided with the HQPACK144SD (four locations: M2 × 6 mm), secure the
HQPACK144SD, device, and NQPACK144SD.
Tighten the screws in a crisscross pattern with the screwdriver provided or a driver with a torque gauge
(avoid tightening only one screw strongly). Tighten the screws with 0.55 kg⋅f⋅cm (0.054 N⋅m) max. torque.
Excessive tightening may diminish conductivity.
At this time, each pin is fixed inside the plastic dividers by the contact pin of the NQPACK144SD and the
hold pin of the HQPACK144SD (refer to Figure C-3). Thus, pins cannot cause a short with pins of
neighboring devices.
Figure C-2. Mounting Device
Fastening screws
HQPACK144SD
Device
NQPACK144SD
Target system
Figure C-3. NQPACK100SD and Device Pin
Hold pin of HQPACK144SD
Divider
Device
Pin
Contact pin of NQPACK144SD
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APPENDIX C CONNECTORS FOR TARGET CONNECTION
C.2 Cautions on Handling Connectors
(1) When taking connectors out of the case, remove the sponge while holding the main unit.
(2) When soldering the NQPACK144SD to the target system, cover it with the HQPACK144SD for protection against
splashing flux.
Recommended soldering conditions… Reflow:
240°C, 20 seconds max.
Partial heating: 240°C, 10 seconds max. (per pin row)
(3) Check for abnormal conditions such as resin burr or bent pins before mounting a device on the NQPACK144SD.
Moreover, when covering with the HQPACK144SD, check that the hold pins of the HQPACK144SD are not
broken or bent before mounting the HQPACK144SD. If there are broken or bent pins, fix them with a thin, flat
plate such as a blade.
(4) When securing the YQPACK144SD (connector for emulator connection) or HQPACK144SD to the
NQPACK144SD with screws, tighten the four screws temporarily with the screwdriver provided or a driver with a
torque gauge, then tighten the screws in a crisscross pattern (with 0.054 N⋅m max. torque).
Excessive tightening of only one screw may diminish conductivity.
If the conductivity is diminished after screw-tightening, stop tightening, remove the screws and make sure the
NQPACK144SD is clean and the device pins are parallel (flat).
(5) Device pins do not have high strength. Repeatedly connecting to the NQPACK144SD may cause pins to bend.
When mounting a device on NQPACK144SD, check and adjust bent pins.
User’s Manual U14700EJ2V0UM
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APPENDIX D MOUNTING PLASTIC SPACER
This chapter describes the mounting method for the plastic spacer supplied with the IE-V850E-MC.
When using the emulator connected to the target system, mount the plastic spacer as shown in Figure D-1 to fix
the POD horizontally.
(1) Mounting plastic spacer on IE-V850E-MC
<1> Remove the nylon rivet from the rear part of the POD.
<2> Tighten the plastic spacer with the plastic screw supplied.
<3> To adjust the height, use your own spacer or a stand.
Figure D-1. Mounting Method of Plastic Spacer
Plastic spacer
Target system
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User’s Manual U14700EJ2V0UM
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