JAN2N7368 [ETC]
TRANSISTOR | BJT | NPN | 80V V(BR)CEO | 10A I(C) | TO-254 ; 晶体管| BJT | NPN | 80V V（ BR ） CEO | 10A I（C ） | TO- 254\n
| 型号： | JAN2N7368 |
| 厂家： | 
ETC |
| 描述： | TRANSISTOR | BJT | NPN | 80V V(BR)CEO | 10A I(C) | TO-254
|
| 文件： | 总15页 (文件大小：81K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The documentation process conversion
measures necessary to comply with this
revision shall be completed by 22 January 1998
INCH-POUND
MIL-PRF-19500/622A
22 October 1997
SUPERSEDING
MIL-S-19500/622
5 April 1993
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, HIGH-POWER
TYPE 2N7368 JAN, JANTX, JANTXV, AND JANS
This specification is approved for use by all Depart-
ments and Agencies of the Department of Defense.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for NPN silicon, high-power transistor. Four levels of product
assurance are provided as specified in MIL-PRF-19500.
1.2 Physical dimensions. See figure 1 (TO - 254).
1.3 Maximum ratings.
P
1/
V
V
V
I
B
I
C
T
and T
R
θJC
T
CBO
CEO
EBO
J
STG
T
= +25°C
C
W
V dc
80
V dc
80
V dc
7.0
A dc
4.0
A dc
10
°C
°C/W max
2N7368
115
-65 to +200
1.5
1/ Derate linearly 0.657 W/°C above T = +25°C.
C
1.4 Primary electrical characteristics.
h
FE2
1/
V
1/
V
1/
C
|h |
fe
BE(SAT)1
CE(SAT)1
obo
V
= 2.0 V dc
I
C
I
B
= 5.0 A dc
= 0.5 A dc
I
C
I
B
= 5.0 A dc
= 0.5 A dc
V
= 10 V dc
V = 10 V dc
CE
I = 0.5 A dc
C
CE
CB
I
= 3.0 A dc
I = 0
E
C
f = 100 kHz to 1 MHz
f = 1 MHz
V dc
1.5
V dc
1.0
pF
Min
Max
30
140
4.0
20
500
1/ Pulsed (see 4.5.1).
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document
should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAT, 3990 East Broad Street, Columbus, OH
43216-5000, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or
by letter.
AMSC N/A
FSC 5961
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
MIL-PRF-19500/622A
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include
documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has
been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements
documents cited in sections 3 and 4 of this specification, whether or not they are listed.
2.2 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document
to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department
of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2).
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-19500
STANDARD
MILITARY
MIL-STD-750
- Semiconductor Devices, General Specification for.
-
Test Methods for Semiconductor Devices.
(Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for
related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document,
however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing
on the applicable qualified products list before contract award (see 4.2 and 6.3).
3.1 Associated specification. The individual item requirements shall be in accordance with MIL-PRF-19500 and as specified herein.
3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in
MIL-PRF-19500.
3.3 Interface requirements and physical dimensions. The interface requirements and physical dimensions shall be as specified in
MIL-PRF-19500, and on figure 1 herein. Methods used for electrical isolation of the terminal feedthroughs shall employ materials that
contain a minimum of 90 percent AL2O3 (ceramic). Examples of such construction techniques are metallized ceramic eyelets or ceramic
walled packages. The US government's preferred system of measurement is the metric SI system. However, since this item was
originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-
pound units shall take precedence.
3.3.1 Lead formation and finish. Lead finish shall be solderable as defined in MIL-PRF-19500, MIL-STD-750, and herein. Where a
choice of lead finish or formation is desired, it shall be specified in the acquisition requirements (see 6.2). When lead formation is
performed, as a minimum, the vendor shall perform 100 percent hermetic seal in accordance with screen 14, of MIL-PRF-19500.
3.4 Marking. Marking shall be in accordance with MIL-PRF-19500.
3.5 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in 1.3, 1.4 and table I herein.
3.6 Electrical test requirements. The electrical test requirements shall be the subgroups specified in 4.4.2 and 4.4.3.
2
MIL-PRF-19500/622A
Dimensions
Ltr
Inches
Millimeters
Min
.535
.249
.035
.530
Max
Min
Max
13.89
6.60
BL
CH
.545
.260
.045
.550
13.59
6.32
LD
0.89
1.43
LL
13.46
13.97
LO
.150 BSC
.150 BSC
3.81 BSC
3.81 BSC
3.53
LS
MHD
MHO
TL
.139
.149
.685
.800
.050
.545
3.78
17.40
20.32
1.27
.665
.790
.040
.535
16.89
20.07
1.02
TT
TW
13.59
13.89
Term 1
Term 2
Term 3
Base
Collector
Emitter
NOTES:
1. Dimensions are in millimeters.
2. Inch equivalents are given for general information only.
3. All terminals are isolated from case.
FIGURE 1. Dimensions and configuration (T0-254AA).
3
MIL-PRF-19500/622A
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3)
c. Conformance inspection (see 4.4).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500.
4.3 Screening (JANS, JANTX, and JANTXV levels only). Screening shall be in accordance with MIL-PRF-19500 (Appendix E, table
IV), and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits
of
Screen (see
Measurement
appendix E, table IV
of MIL-PRF-19500)
JANS level
JANTX and JANTXV levels
1/
9
Thermal impedance (see 4.3.2)
Thermal impedance (see 4.3.2)
Not applicable
I
and h
FE2
CES1
11
Subgroup 2 of table I herein;
and h ; ∆I = 100 percent
I
and h
FE2
CES1
I
CES1
FE2 CES1
of initial value or 10 µA dc, whichever is
greater.
∆h
FE2
= ± 20 percent of initial value.
12
13
t = 160 hours
t = 80 hours
Subgroup 2 and 3 of table I herein;
Subgroup 2 of table I herein;
I and h ; ∆I = 100 percent
CES1
I
and h
; ∆I
= 100 percent
CES1
FE2 CES1
FE2 CES1
of initial value or 10 µA dc, whichever is
of initial value or 10 µA dc, whichever is
greater.
greater.
∆h
FE2
= ± 20 percent of initial value.
∆h
FE2
= ± 20 percent of initial value.
1/ May be performed anytime before screen 9.
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows:
T
J = 187.5 ± 12.5°C, V
CE ≥ 10 V dc, T
A = 30 ± 5°C.
4.3.2 Thermal impedance Z
θJX
measurements for screening. The Z
θJX
measurements shall be performed in accordance with
MIL-STD-750, method 3131. The maximum limit and conditions for Z
θJX
in screening (table II of MIL-PRF-19500) shall be derived by
each vendor by means of process control of actual measurements which characterizes the die attach process. When three lot date
codes have exhibited control, the data from these three lots will be used to establish a fixed screening limit (not to exceed the end point
limit). Once a fixed limit has been established, monitor all future sealing lots using a sample from each lot to be plotted on the applicable
X and R chart.
4.3.2.1 Thermal impedance (Z
θJX measurements) for initial qualification. The
Z
measurements shall be performed in accordance
θJX
) derived conditions limits and thermal response curve shall be supplied to
with MIL-STD-750. Method 3131 (read and record date Z
θJX
the qualifying activity on the qualification lot prior to qualification approval.
4
MIL-PRF-19500/622A
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as specified herein.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with appendix E, table V of MIL-PRF-19500, and
table I herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in
appendix E, tables VIa and VIb of MIL-PRF-19500. Electrical measurements (end points) and delta requirements shall be in accordance
with the applicable steps of table III herein.
4.4.2.1 Group B inspection, appendix E, table VIa (JANS) of MIL-PRF-19500. Subgroup 4: Condition for intermittent operation life
are as follows: V
≥ 10 V dc. ∆T between cycles ≥ +100°C, 2,000 cycles.
CB
J
4.4.2.2 Group B inspection, appendix E, table VIb (JANTX and JANTXV) of MIL-PRF-19500. Subgroup 3: Condition for intermittent
operation life are as follows: V ± 10 V dc. ∆T between cycles ± +100°C, 2,000 cycles.
CB
J
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in
appendix E, table VII of MIL-PRF-19500. Electrical measurements (end points) and delta requirements shall be in accordance with the
applicable steps of table III herein.
4.4.3.1 Group C inspection, appendix E, table VII of MIL-PRF-19500.
a. Subgroup 2: Condition for terminal strength (tension) is method 2036, condition A, weight = 4.5 kg, t = 10 seconds.
b. Subgroup 6: Condition for intermittent operation life are as follows: V
cycles.
> 10 V dc. ∆T between cycles ≥ +100°C, 6,000
J
CB
4.5 Method of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows:
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750.
4.5.2 Thermal resistance. Thermal resistance measurements shall be conducted in accordance with test method 3131 of
MIL-STD-750. The following details shall apply:
a. Collector current magnitude during power application shall be 1.0 A dc.
b. Collector to emitter voltage magnitude shall be ≥ 10 V dc.
c. Reference temperature measuring point shall be the case.
d. Reference point temperature shall be +25°C ≤ T ≤ +75°C and recorded before the test is started.
R
e. Mounting arrangement shall be with heat sink to header.
f.
Maximum limit of R
θJC
shall be 1.5°C/W.
4.5.3 Thermal Impedance Z
limit for end point measurements.
The following test conditions shall be used for Z
, end point measurements: Z = 1.4°C/W
θJX θJX
a.
b.
c.
d.
e.
f.
I
10 mA.
.....................................................................
M
V
I
measurement voltage
CB
collector heating current
20 V (same as V ).
H
...............................
4 A (minimum).
20 V (minimum).
100 ms.
.............................
H
V
t
collector-emitter heating voltage
.................
H
heating time
................................................
H
t
t
measurement delay time
80 µs maximum.
10 µs (maximum).
...........................
MD
sample window time
g.
.....................................
s
5
MIL-PRF-19500/622A
TABLE I. Group A inspection.
Inspection 1/
Subgroup 1
MIL-STD-750
Conditions
Symbol
Limits
Unit
Method
2071
Min
Max
Visual and mechanical
examination
Subgroup 2
Collector - emitter
breakdown voltage
3011
3061
3041
Bias condition D; I = 0.2 A dc;
C
pulsed (see 4.5.1)
V
80
V dc
CEO(sus)
Emitter - base
cutoff current
1.0
1.0
mA dc
mA dc
Bias condition D; V
= 7 V dc
I
EBO
EB
Collector - emitter
cutoff current
Bias condition A; V
= 80 V dc
= 1.5 V dc;
I
BE
CEX1
V
CE
I
Bias condition C; V
CE
= 70 V dc
CES1
Collector - emitter
cutoff current
3041
3066
3071
1.0
1.5
mA dc
V dc
V
Test condition A; I = 5 A dc;
BE(sat)1
Base - emitter
saturated voltage
C
I
B
= 0.5 A dc; pulsed (see 4.5.1)
V
Collector - emitter
saturated voltage
1.0
V dc
CE(sat)1
I
C
= 5 A dc; |I = 0.5 A dc;
B
pulsed (see 4.5.1)
50
30
175
140
h
h
FE1
V
= 2.0 V dc; I = 1.0 A dc;
C
CE
pulsed (see 4.5.1)
Forward - current
transfer ratio
3076
3076
FE2
V
= 2.0 V dc; I = 3.0 A dc;
C
CE
pulsed (see 4.5.1)
Forward - current
transfer ratio
Subgroup 3
T
= +150°C
High - temperature
operation:
A
Collector to emitter
cutoff current
3041
3076
Bias condition C; V
CE
= 70 V dc
I
CES2
5.0
mA dc
Low - temperature
operation:
T
V
= -55°C
A
= 2.0 V dc; I = 3.0 A dc;
CE
C
h
FE3
Forward - current
transfer ratio
12
pulsed (see 4.5.1)
See footnote at end of table.
6
MIL-PRF-19500/622A
TABLE I. Group A inspection - Continued.
Inspection 1/
MIL-STD-750
Conditions
Symbol
Limits
Min
Unit
Method
Max
Subgroup 4
Switching parameters
Pulse delay time
Pulse rise time
See figure 2
t
t
0.2
1.3
1.4
1.2
µs
µs
µs
µs
d
See figure 2
See figure 2
See figure 2
t
r
Pulse storage time
Pulse fall time
s
t
f
|h
|
fe
Magnitude of small-
signal short-circuit
forward-current
transfer ratio
3306
3236
3051
V
= 10 V dc; I = 0.5 A dc;
4.0
20
CE
f = 1 MHz
C
C
Open circuit output
capacitance
500
pF
obo
V
= 10 V dc; I = 0;
E
CB
f = 100 kHz to 1 MHz
Subgroup 5
T
= +25°C; t ≥ 1 s; 1 cycle;
C
Safe operating area
(continuous dc)
(see figure 3)
V
V
V
= 11.5 V dc; I = 10 A dc
C
CE
CE
CE
Test 1
Test 2
Test 3
= 45 V dc; I = 2.5 A dc
C
= 60 V dc; I = 0.9 A dc
C
Safe operating area
(clamped inductive)
3053
T
A
V
= +25°C; I = 10 A dc;
C
= 11.5 V dc; (See figures 4 and 5)
CC
Clamp voltage = 80 V dc
See table III, steps 1 and 2
Electrical measurements
Subgroups 6 and 7
Not applicable
1/ For sampling plan see MIL-PRF 19500.
7
MIL-PRF-19500/622A
TABLE II. Group E inspection (all quality levels) for qualification only.
Inspection
MIL-STD-750
Conditions
Qualification
conformance
inspection
Method
Subgroup 1
Temperature cycling
Hermetic seal
22 devices, c = 0
1051
1071
500 cycles
Electrical measurements
Subgroup 2
See table III, steps 1 and 2
22 devices, c = 0
High temperature
reverse bias
1039
Condition A; 1,000 hours
See table III, steps 1 and 2
Electrical measurements
Subgroup 3
Not applicable
Subgroup 4
22 devices, c = 0
Thermal resistance
3131
R
= 1.5°C/W maximum.
θJC
See 4.5.2
Subgroup 5
Not applicable
8
MIL-PRF-19500/622A
TABLE III. Group B, C, and E electrical measurements. 1/ 2/ 3/
Step
Inspection
MIL-STD-750
Conditions
Bias condition C;
Symbol
Limit
Unit
Method
3041
Min
30
Max
1.0
1.
2.
Collector - emitter
cutoff current
I
mA dc
CES1
V
= 70 V dc
CE
Forward - current
transfer ratio
3076
V
= 2.0 V dc;
h
FE2
140
CE
I
C
= 3.0 A dc;
pulsed (see 4.5.1)
3.
4.
Collector - emitter
cutoff current
3041
3076
Bias condition C;
∆I
100 percent of initial value or 10
µA dc; whichever is greater
CES1
4/
V
V
= 70 V dc
CE
Forward - current
transfer ratio
= 2.0 V dc;
∆h
±25 percent change from initial
value
CE
FE2
4/
I
C
= 3.0 A dc;
pulsed (see 4.5.1)
5.
Thermal impedance
3131
See 4.5.3
Z
θJX
1.4
°C/W
1/ The electrical measurements for appendix E, table VIa (JANS) of MIL-PRF-19500 are as follow:
a. Subgroup 2, see table II herein, steps 1 and 2.
b. Subgroup 3, see table II herein, steps 3, 4, and 5.
c. Subgroup 6, see table II herein, steps 3, 4, and 5.
2/ The electrical measurements for table IVb (JANTX and JANTXV) of MIL-S-19500 are as follow:
a. Subgroup 2, see table II herein, steps 1 and 2.
b. Subgroup 3, see table II herein, steps 1, 2, and 5.
c. Subgroup 6, see table II herein, steps 1, 2, and 5.
3/ The electrical measurements for table V of MIL-S-19500 are as follows:
a. Subgroup 2, see table II herein, steps 1 and 2.
b. Subgroup 3, see table II herein, steps 1 and 2.
c. Subgroup 6, see table II herein, steps 1, 2, and 5.
4/ Devices which exceed the group A limits for this test shall not be shippable but are not considered failures for the test.
9
MIL-PRF-19500/622A
NOTES:
1. The input waveform is supplied by a pulse generator with the following characteristics:
t ≤ 20.0 ns, t ≤ 1 µs, 10 µs ≤ PW ≤ 100 µs, Z = 50Ω, duty cycle ≤ 2 percent.
r
f
OUT
2. Output waveforms are monitored on an oscilloscope with the following characteristics:
t ≤ 5 ns, Z ≥ 100 kS, C ≤ 12 pF.
r IN IN
3. Test circuit A for t and t ; test circuit B for t and t
f
.
d
r
s
FIGURE 2. Pulse response test circuits.
10
MIL-PRF-19500/622A
FIGURE 3. Safe operating area.
11
MIL-PRF-19500/622A
FIGURE 4. Safe operating area for switching between saturation and cutoff (clamped inductive load).
12
MIL-PRF-19500/622A
L = 4 mH, .05Ω, 20 A
Q ≥ 100 at 1 kHz
(Stanford Miller CK-20 or equivalent
Procedures:
1. With switch S1 closed, set the specified test conditions.
2. Open S1. Device fails, if clamp voltage is not reached.
3. Perform specified end-point tests.
FIGURE 5. Clamped inductive sweep test circuit.
13
MIL-PRF-19500/622A
5. PACKAGING
5.1 Packaging. Packaging shall prevent mechanical damage of the devices during shipping and handling and shall not be detrimental
to the device. When actual packaging of material is to be performed by DoD personnel, these personnel need to contact the responsible
packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Points'
packaging activity within the Military Department or Defense Agency, or within the Military Departments' System Command. Packaging
data retrieval is available from the managing Military Departments' or Defense Agency's automated packaging files, CD-ROM products, or
by contacting the responsible packaging activity.
5.2 Marking. Unless otherwise specified (see 6.2), marking shall be in accordance with MIL-STD-129.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Notes. The notes specified in MIL-PRF-19500 are applicable to this specification.
6.2 Acquisition requirements. See MIL- PRF-19500.
6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of
award of contract, qualified for inclusion in Qualified Products List QPL No.19500 whether or not such products have actually been so
listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the
products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded
contracts or purchase orders for the products covered by this specification. Information pertaining to qualification of products may be
obtained from Defense Supply Center Columbus, ATTN: DSCC-VQE, 3990 East Broad Street, Columbus, OH 43216-5000.
6.4 Interchangeability information. MIL-PRF-19500/622 is a T0-254 package version of MIL-PRF-19500/408, which is a T0-3
package version. The military 2N7368 contains the same die as the military 2N3716. The MIL-PRF-19500/622 is preferred over the MIL-
PRF-19500/408 whenever interchangeability is not a problem. For new design use 2N7368. The 2N3716 is inactive for new design.
6.5 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous
issue due to the extent of the changes.
Custodians:
Army - CR
Navy - EC
Preparing activity:
DLA - CC
Air Force - 17
NASA - NA
(Project 5961-1899-04)
Review activities:
Army - AR, MI, SM
Navy - AS, CG, MC
Air Force - 13, 19, 85, 99
14
STANDARDIZATION DOCUMENT IMPROVEMENT PROPOSAL
INSTRUCTIONS
1. The preparing activity must complete blocks 1, 2, 3, and 8. In block 1, both the document number and revision
letter should be given.
2. The submitter of this form must complete blocks 4, 5, 6, and 7.
3. The preparing activity must provide a reply within 30 days from receipt of the form.
NOTE: This form may not be used to request copies of documents, nor to request waivers, or clarification of
requirements on current contracts. Comments submitted on this form do not constitute or imply authorization to
waive any portion of the referenced document(s) or to amend contractual requirements.
I RECOMMEND A CHANGE:
3. DOCUMENT TITLE
1. DOCUMENT NUMBER
MIL-PRF-19500/622A
2. DOCUMENT DATE (YYMMDD)
971022
SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, HIGH-POWER TYPE 2N7368, JAN, JANTX, JANTXV, AND JANS
4. NATURE OF CHANGE (Identify paragraph number and include proposed rewrite, if possible. Attach extra sheets as needed.)
5. REASON FOR RECOMMENDATION
6. SUBMITTER
a. NAME (Last, First, Middle initial)
b. ORGANIZATION
c. ADDRESS (Include Zip Code)
d. TELEPHONE (Include Area Code)
(1) Commercial
7. DATE SUBMITTED
(YYMMDD)
(2) AUTOVON
(If applicable)
8. PREPARING ACTIVITY
a. NAME Alan Barone
b. TELEPHONE (Include Area Code)
(1) Commercial
(614)692-0510
(2) AUTOVON
850-0510
c. ADDRESS (Include Zip Code)
IF YOU DO NOT RECEIVE A REPLY WITHIN 45 DAYS, CONTACT:
Defense Quality and Standardization Office
5203 Leesburg Pike, Suite 1403, Falls Church, VA 22041-3466
Telephone (703) 756-2340 AUTOVON 289-2340
Defense Supply Center Columbus, ATTN:
DSCC-VAT, 3990 East Broad Street,
Columbus, OH 43216-5000
DD Form 1426, OCT 89
Previous editions are obsolete
198/290
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