LZ9-J0GW00-0028_技术文档

Gallery White LED Emitter

LZ9-00GW00

Key Features

.

9-die Gallery White (CRI 98) LED

3 SDCM color bins for CCT - 3000K

Superior Color Rendering: CRI (Ra) 98; R9 98 and R15 98

Up to 20 Watt power dissipation on compact 7.0mm x 7.0mm footprint

Low Thermal Resistance (1.3°C/W)

Engineered ceramic package with integrated glass lens

Very high Luminous Flux density

JEDEC Level 1 for Moisture Sensitivity Level

Autoclave compliant (JEDEC JESD22-A102-C)

Lead (Pb) free and RoHS compliant

Reflow solderable (up to 6 cycles)

Emitter available on MCPCB (optional)

Full suite of TIR secondary optics family available

Typical Applications

.

Gallery lighting

Museum lighting

High-end retail lighting

Medical surgery lighting

Description

The LZ9‐00GW00 Gallery White features warm white light with an exceptional color rendering index (CRI) of 98, as

well as impressive individual R values (R1‐16) in industry’s smallest footprint. It enables accurate color

representation and enhances the contrast of retail merchandise, artwork and skin tones, which cannot be obtained

with standard warm white LED emitters. The emitter, based on LED Engin’s LuxiGen technology platform, may be

driven up to 20W of power in a compact 7.0mmx7.0mm footprint. It has the industry lowest thermal resistance per

package size, which allows users to drive the emitter with higher current, while keeping the junction temperature

low to ensure long operating life.

LZ9-00GW00 (2.4 –11/09/2018)

Part Number Options

Base part number

Part number

Description

LZ9-00GW00-xxxx

LZ9-J0GW00-xxxx

LZ9-M0GW00-xxxx

9-die emitter Gallery White

9-die emitter Gallery White on Star MCPCB in 1x9 electrical configuration

9-die emitter Gallery White on Star MCPCB in 3x3 electrical configuration

Bin Kit Option Codes

GW, Gallery White (CRI 98)

Min

flux

Bin

Kit number

suffix

Color Bin Ranges

3-step MacAdams ellipse

Description

0030

W

full distribution flux; 3000K ANSI CCT

LZ9-00GW00 (2.4 –11/09/2018)

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Gallery White CCT Bins

3-step MacAdam ellipse color bins plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram.

Coordinates are listed below in the table.

Gallery White 3-Step MacAdam Ellipse CCT Bin Coordinates

Nominal ANSI

CCT

Center Point

(cx, cy)

Major Axis

a

Minor Axis

b

Ellipse Rotation

Angle (⁰)

3000

(0.4366, 0.4042)

0.00967

0.00399

56.6

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Luminous Flux Bins

Table 1:

Minimum

Maximum

Luminous Flux (Φ_v)

@ I_F= 700mA^[1,2]

(lm)

Luminous Flux (Φ_v)

@ I_F= 700mA^[1,2]

(lm)

Bin Code

W

868

1085

1357

X

1085

Notes for Table 1:

1.

Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements.

Forward Voltage Range per String

Table 2:

Minimum

Maximum

Forward Voltage (V_F)

@ I_F= 700mA^[1,2]

(V)

Bin Code

@ I_F= 700mA^[1,2]

(V)

0

9.0

10.8

Notes for Table 2:

1.

2.

LED Engin maintains a tolerance of ± 0.04V for forward voltage measurements.

Forward Voltage per string of 3 LED dies in series.

Color Rendering Index Bin

Table 3:

Minimum

Bin Code

Color Rendering Index

@ I_F= 700mA

0

95.0

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Absolute Maximum Ratings

Table 4:

Parameter

Symbol

Value

Unit

mA

V

°C

DC Forward Current at T_jmax=135°C^[1]

DC Forward Current at T_jmax=150°C^[1]

Peak Pulsed Forward Current^[2]

Reverse Voltage

I_F

I_FP

V_R

T_stg

T_J

800

700

1000

See Note 3

-40 ~ +150

150

Storage Temperature

Junction Temperature

Soldering Temperature^[4]

Allowable Reflow Cycles

T_sol

260

6

121°C at 2 ATM,

100% RH for 168 hours

Autoclave Conditions^[5]

> 8,000 V HBM

Class 3B JESD22-A114-D

ESD Sensitivity^[6]

Notes for Table 4:

1.

Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 10 for current

de-rating.

2:

3.

4.

5.

6.

Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.

LEDs are not designed to be reverse biased.

Solder conditions per JEDEC 020c. See Reflow Soldering Profile Figure 3.

Autoclave Conditions per JEDEC JESD22-A102-C.

LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ9-00GW00 in an electrostatic protected area (EPA).

An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.

Optical Characteristics @ T_C= 25°C

Table 5:

Typical

Parameter

Symbol

Unit

Luminous Flux (@ I_F= 700mA)^[1]

Luminous Efficacy (@ I_F= 350mA)

Correlated Color Temperature

Color Rendering Index (CRI)^[2]

Viewing Angle^[3]

Φ_v

lm

lm/W

K

1060

67

CCT

R_a

3000

98

110

135

2Θ

Degrees

½

Total Included Angle^[4]

Θ_0.9

Notes for Table 5:

1.

2.

3.

4.

Luminous flux typical value is for all 9 LED dies operating concurrently at rated current.

Typical Ra and individual R1 through R16 values listed in Table 6

Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value.

Total Included Angle is the total angle that includes 90% of the total luminous flux.

Typical CRI (Ra) and individual R values

Table 6:

Ra

98

R1

98

R2

99

R3

97

R4

98

R5

98

R6

98

R7

98

R8

98

R9

98

R10

99

R11

96

R12

86

R13

98

R14

97

R15

98

R16

96

LZ9-00GW00 (2.4 –11/09/2018)

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Electrical Characteristics @ T_C= 25°C

Table 7:

Parameter

Symbol

Typical

Unit

Forward Voltage per String (@ I_F= 700mA)

V_F

9.7

V

Temperature Coefficient

of Forward Voltage (per String)

ΔV_F/ΔT_J

-6.0

1.3

mV/°C

°C/W

Thermal Resistance

(Junction to Case)

RΘ_J-C

IPC/JEDEC Moisture Sensitivity Level

Table 8 - IPC/JEDEC J-STD-20 MSL Classification:

Soak Requirements

Floor Life

Conditions

Standard

Conditions

Accelerated

Level

Time

Time (hrs)

Conditions

≤ 30°C/

85% RH

168

+5/-0

85°C/

85% RH

1

Unlimited

n/a

Notes:

1.

The standard soak time is the sum of the default value of 24 hours for the semiconductor manufacturer’s exposure time (MET) between bake and bag

and the floor life of maximum time allowed out of the bag at the end user of distributor’s facility.

Average Lumen Maintenance Projections

Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for

solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original

light output remaining at a defined time period.

Based on accelerated lifetime testing, LED Engin projects that the LZ Series will deliver, on average, 70% Lumen

Maintenance at 65,000 hours of operation at a forward current of 700mA per die. This projection is based on

constant current operation with junction temperature maintained at or below 120°C.

LZ9-00GW00 (2.4 –11/09/2018)

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Mechanical Dimensions (mm)

Emitter pin layout

Emitter Emitter

channel pin

Die

Color

Ch1 -

Ch1

23, 24

E

B

A

G

I

White

Ch1 +

Ch2 -

Ch2

17, 18

2, 3

Ch2 +

Ch3 -

Ch3

14, 15

5, 6

C

D

H

F

Ch3+

11, 12

NC pins: 1, 4, 7, 8, 9, 10, 13, 16, 19, 20,

21, 22

DNC pins: none

Figure 1: Package outline drawing.

Notes for Figure 1:

Notes:

NC = Not internally Connected (Electrically isolated)

DNC = Do Not Connect (Electrically Non isolated)

1.

Index mark indicates case temperature measurement point.

2.

Unless otherwise noted, the tolerance = ± 0.20 mm.

Recommended Solder Pad Layout (mm)

Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad.

Note for Figure 2a:

1.

2.

Unless otherwise noted, the tolerance = ± 0.20 mm.

LED Engin recommends the use of pedestal MCPCB’s which allow the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such

MCPCB technology eliminates the high thermal resistance dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the

metal core of the MCPCB, thus lowering the overall system thermal resistance.

3.

LED Engin recommends x-ray sample monitoring to screen for solder voids underneath the emitter thermal slug. The total area covered by solder voids should

be less than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher

failure rates due to thermal over stress.

LZ9-00GW00 (2.4 –11/09/2018)

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Recommended Solder Mask Layout (mm)

Figure 2b: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad.

Note for Figure 2b:

1.

Unless otherwise noted, the tolerance = ± 0.20 mm.

Recommended 8mil Stencil Apertures Layout (mm)

Figure 2c: Recommended 8mil stencil apertures layout for anode, cathode, and thermal pad.

Note for Figure 2c:

1.

Unless otherwise noted, the tolerance = ± 0.20 mm.

LZ9-00GW00 (2.4 –11/09/2018)

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Reflow Soldering Profile

Figure 3: Reflow soldering profile for lead free soldering.

Typical Radiation Pattern

100

90

80

70

60

50

40

30

20

10

0

-90 -80 -70 -60 -50 -40 -30 -20 -10

0

10 20 30 40 50 60 70 80 90

Angular Displacement (Degrees)

Figure 4: Typical representative spatial radiation pattern.

LZ9-00GW00 (2.4 –11/09/2018)

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Typical Relative Spectral Power Distribution

1

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0

350

400

450

500

550

600

650

700

750

800

Wavelength (nm)

Figure 5: Typical relative spectral power vs. wavelength @ T_C= 25°C

Typical Relative Light Output over Forward Current

140%

120%

100%

80%

60%

40%

20%

0%

0

200

400

600

800

1000

I_F- Forward Current (mA)

Figure 6: Typical relative light output vs. forward current @ T_C= 25°C.

LZ9-00GW00 (2.4 –11/09/2018)

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Typical Normalized Radiant Flux over Temperature

110

100

90

80

70

60

0

10

20

30

40

50

60

70

80

90

100

Case Temperature (°C)

Figure 7: Typical relative light output vs. case temperature.

Typical Chromaticity Coordinate Shift over Forward Current

0.0400

Delta_Cx

Delta_Cy

0.0300

0.0200

0.0100

0.0000

-0.0100

-0.0200

-0.0300

-0.0400

0

100

200

300

400

500

600

700

800

I_F- Forward Current (mA)

Figure 8: Typical chromaticity coordinate shift vs. forward current

LZ9-00GW00 (2.4 –11/09/2018)

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Typical Chromaticity Coordinate Shift over Temperature

0.0400

0.0300

0.0200

0.0100

0.0000

-0.0100

-0.0200

-0.0300

-0.0400

Delta_Cx

Delta_Cy

0

10

20

30

40

50

60

70

80

90

100

Case Temperature (°C)

Figure 9: Typical chromaticity coordinate shift vs. Case temperature

Typical Forward Voltage Characteristics per String

1000

800

600

400

200

0

7.0

8.0

9.0

10.0

11.0

V_F- Forward Voltage (V)

Figure 10: Typical forward current vs. forward voltage¹@ T_C= 25°C.

Note for Figure 10:

1. Forward Voltage per string of 3 LED dies connected in series.

LZ9-00GW00 (2.4 –11/09/2018)

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Current De-rating

1000

800

700

(Rated)

600

400

200

R _J-A= 4°C/W

R _J-A= 5°C/W

R _J-A= 6°C/W

0

25

50

75

100

125

150

Maximum Ambient Temperature (°C)

Figure 11: Maximum forward current vs. ambient temperature based on T_J(MAX)= 150°C.

Notes for Figure 11:

1.

2.

3.

Maximum current assumes that all 9 LED dice are operating concurrently at the same current.

RΘ_J-C[Junction to Case Thermal Resistance] for the LZ9-00GW00 is typically 1.3°C/W.

RΘ_J-A[Junction to Ambient Thermal Resistance] = RΘ_J-C+ RΘ_C-A[Case to Ambient Thermal Resistance].

LZ9-00GW00 (2.4 –11/09/2018)

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Emitter Tape and Reel Specifications (mm)

Figure 12: Emitter carrier tape specifications (mm).

Figure 13: Emitter Reel specifications (mm).

LZ9-00GW00 (2.4 –11/09/2018)

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LZ9 MCPCB Family

Emitter + MCPCB

Thermal Resistance

(^oC/W)

Diameter

(mm)

Typical V_fTypical I_f

Part number Type of MCPCB

(V)

(mA)

LZ9-Jxxxxx

1-channel

3-channel

19.9

1.3 + 0.2 = 1.5

29.1

700

LZ9-Mxxxxx

9.7/ ch

700/ ch

LZ9-00GW00 (2.4 –11/09/2018)

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LZ9-Jxxxxx

1 channel, Standard Star MCPCB (1x9) Dimensions (mm)

Notes:

•

.

Unless otherwise noted, the tolerance = ± 0.2 mm.

Slots in MCPCB are for M3 or #4-40 mounting screws.

LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.

LED Engin recommends using thermal interface material when attaching the MCPCB to a heatsink.

The thermal resistance of the MCPCB is: RΘC-B 0.2°C/W. This low thermal resistance is possible by utilizing a copper based MCPCB with pedestal design. The

emitter thermal slug is in direct contact with the copper core. There are several vendors that offer similar solutions, some of them are: Rayben, Bergquist,

SinkPad, Bridge-Semiconductor.

Components used

MCPCB:

ESD chips: BZX585-C47

MHE-301 copper

(Rayben)

(NXP, for 9 LED die)

Jumpers:

CRCW06030000Z0 (Vishay)

Pad layout

MCPCB

Pad

Ch.

String/die Function

1

2

Cathode -

Anode +

1/ABCDEF

GHI

1

LZ9-00GW00 (2.4 –11/09/2018)

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LZ9-Mxxxxx

3 channel, Standard Star MCPCB (3x3) Dimensions (mm)

Notes:

•

.

Unless otherwise noted, the tolerance = ± 0.2 mm.

Slots in MCPCB are for M3 or #4-40 mounting screws.

LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.

LED Engin recommends using thermal interface material when attaching the MCPCB to a heatsink.

The thermal resistance of the MCPCB is: RΘC-B 0.2°C/W. This low thermal resistance is possible by utilizing a copper based MCPCB with pedestal design. The

emitter thermal slug is in direct contact with the copper core. There are several vendors that offer similar solutions, some of them are: Rayben, Bergquist,

SinkPad, Bridge-Semiconductor.

Components used

MCPCB:

ESD chips: BZX884-C18

MHE-301 copper

(Rayben)

(NXP, for 3 LED die)

Pad layout

MCPCB

Pad

4

3

5

2

6

1

Ch.

1

String/die Function

Cathode -

Anode +

Cathode -

Anode +

Cathode -

Anode +

1/ABE

2/CGI

3/DFH

2

3

LZ9-00GW00 (2.4 –11/09/2018)

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LZ9 secondary TIR optics family

LLxx-3T06-H

Optical Specification

Optical

efficiency ⁴

%

On-axis

intensity ⁵

cd/lm

Beam angle ²

degrees

17

Field angle ³

Part number ¹

degrees

LLSP-3T06-H

LLNF-3T06-H

LLFL-3T06-H

36

90

5.4

2.2

1.2

26

39

49

83

Notes:

1. Lenses can also be ordered without the holder. Replace –H with –O for this option.

2. Beam angle is defined as the full width at 50% of the max intensity (FWHM).

3. Field angle is defined as the full width at 10% of the max intensity.

4. Optical efficiency is defined as the ratio between the incoming flux and the outgoing flux.

5. On-axis intensity is defined as the ratio between the total input lumen and the intensity in the optical center of the lens.

LZ9-00GW00 (2.4 –11/09/2018)

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Typical Relative Intensity over Angle

100%

LZ9 emitter

LLSP-3T06-H

LLNF-3T06-H

LLFL-3T06-H

80%

60%

40%

20%

0%

-90

-60

-30

0

30

60

90

Angle (degrees)

General Characteristics

Symbol

Value

Rating

Unit

Mechanical

Height from Seating Plane

Diameter

19.2

38.9

Typical

mm

Material

Lens

PMMA

Holder

Polycarbonate

Optical

Transmission¹(>90%)

Environmental

Storage Temperature

Operating Temperature

λ

410-1100

Min-Max.

nm

T_stg

T_sol

-40 ~ +110

Min-Max.

°C

Notes:

1. It is not recommended to use a UV emitter with this lens due to lower transmission at wavelengths < 410nm.

19

LZ9-00GW00 (2.4 –11/09/2018)

Mechanical dimensions

Lens with Holder

Lens

LZ9-00GW00 (2.4 –11/09/2018)

20

Application Guidelines

MCPCB Assembly Recommendations

A good thermal design requires an efficient heat transfer from the MCPCB to the heat sink. In order to minimize air

gaps in between the MCPCB and the heat sink, it is common practice to use thermal interface materials such as

thermal pastes, thermal pads, phase change materials and thermal epoxies. Each material has its pros and cons

depending on the design. Thermal interface materials are most efficient when the mating surfaces of the MCPCB

and the heat sink are flat and smooth. Rough and uneven surfaces may cause gaps with higher thermal resistances,

increasing the overall thermal resistance of this interface. It is critical that the thermal resistance of the interface is

low, allowing for an efficient heat transfer to the heat sink and keeping MCPCB temperatures low.

When optimizing the thermal performance, attention must also be paid to the amount of stress that is applied on

the MCPCB. Too much stress can cause the ceramic emitter to crack. To relax some of the stress, it is advisable to

use plastic washers between the screw head and the MCPCB and to follow the torque range listed below. For

applications where the heat sink temperature can be above 50^oC, it is recommended to use high temperature and

rigid plastic washers, such as polycarbonate or glass-filled nylon.

LED Engin recommends the use of the following thermal interface materials:

1. Bergquist’s Gap Pad 5000S35, 0.020in thick



Part Number: Gap Pad® 5000S35 0.020in/0.508mm

Thickness: 0.020in/0.508mm

Thermal conductivity: 5 W/m-K

Continuous use max temperature: 200°C

Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the

recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m)

2. 3M’s Acrylic Interface Pad 5590H



Part number: 5590H @ 0.5mm

Thickness: 0.020in/0.508mm

Thermal conductivity: 3 W/m-K

Continuous use max temperature: 100°C

Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the

recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m)

Mechanical Mounting Considerations

The mounting of MCPCB assembly is a critical process step. Excessive mechanical stress build up in the MCPCB can

cause the MCPCB to warp which can lead to emitter substrate cracking and subsequent cracking of the LED dies

LED Engin recommends the following steps to avoid mechanical stress build up in the MCPCB:

o

Inspect MCPCB and heat sink for flatness and smoothness.

Select appropriate torque for mounting screws. Screw torque depends on the MCPCB mounting

method (thermal interface materials, screws, and washer).

o

Always use three M3 or #4-40 screws with #4 washers.

When fastening the three screws, it is recommended to tighten the screws in multiple small

steps. This method avoids building stress by tilting the MCPCB when one screw is tightened in a

single step.

o

Always use plastic washers in combinations with the three screws. This avoids high point contact

stress on the screw head to MCPCB interface, in case the screw is not seated perpendicular.

In designs with non-tapped holes using self-tapping screws, it is common practice to follow a

method of three turns tapping a hole clockwise, followed by half a turn anti-clockwise, until the

appropriate torque is reached.

LZ9-00GW00 (2.4 –11/09/2018)

21

Wire Soldering

.

To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150^oC.

Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is

recommended to use a solder iron of more than 60W.

.

It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:

24-7068-7601)

LZ9-00GW00 (2.4 –11/09/2018)

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About LED Engin

LED Engin, an OSRAM business based in California’s Silicon Valley, develops, manufactures, and sells advanced LED

emitters, optics and light engines to create uncompromised lighting experiences for a wide range of

entertainment, architectural, general lighting and specialty applications. LuxiGen^TMmulti-die emitter and

secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a

target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented

compact ceramic package. Our LuxiTune^TMseries of tunable white lighting modules leverage our LuxiGen emitters

and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of

new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior in-

source color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional

light is required. LED Engin is committed to providing products that conserve natural resources and reduce

greenhouse emissions; and reserves the right to make changes to improve performance without notice.

For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200.

LZ9-00GW00 (2.4 –11/09/2018)

23


型号：	LZ9-J0GW00-0028
厂家：	ETC
描述：	LED MOD WARM WHITE STARBOARD
文件：	总23页 (文件大小：1395K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LZ9-J0GW00-0028 [ETC]

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