MPU-3000A [ETC]
Motion Processing Unit Product Specification; 议案处理单元产品规格
| 型号： | MPU-3000A |
| 厂家： | 
ETC |
| 描述： | Motion Processing Unit Product Specification |
| 文件： | 总47页 (文件大小：1347K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
MPU-3000/MPU-3050
Motion Processing Unit
Product Specification
Rev 2.9
1 of 47
Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
CONTENTS
1
DOCUMENT INFORMATION .....................................................................................................................4
1.1
REVISION HISTORY.................................................................................................................................4
PURPOSE AND SCOPE ............................................................................................................................6
PRODUCT OVERVIEW..............................................................................................................................6
SOFTWARE SOLUTIONS ..........................................................................................................................7
APPLICATIONS........................................................................................................................................9
1.2
1.3
1.4
1.5
2
FEATURES ...............................................................................................................................................10
2.1
SENSORS.............................................................................................................................................10
DIGITAL OUTPUT ..................................................................................................................................10
MOTIONPROCESSING ...........................................................................................................................10
CLOCKING............................................................................................................................................10
POWER................................................................................................................................................10
PACKAGE.............................................................................................................................................11
2.2
2.3
2.4
2.5
2.6
3
ELECTRICAL CHARACTERISTICS ........................................................................................................12
3.1
SENSOR SPECIFICATIONS .....................................................................................................................12
ELECTRICAL SPECIFICATIONS................................................................................................................13
ELECTRICAL SPECIFICATIONS, CONTINUED ............................................................................................14
ELECTRICAL SPECIFICATIONS, CONTINUED ............................................................................................15
I2C TIMING CHARACTERIZATION ............................................................................................................16
SPI TIMING CHARACTERIZATION (MPU-3000 ONLY)..............................................................................17
ABSOLUTE MAXIMUM RATINGS..............................................................................................................18
3.2
3.3
3.4
3.5
3.6
3.7
4
5
APPLICATIONS INFORMATION .............................................................................................................19
4.1
PIN OUT AND SIGNAL DESCRIPTION.......................................................................................................19
TYPICAL OPERATING CIRCUITS .............................................................................................................20
BILL OF MATERIALS FOR EXTERNAL COMPONENTS.................................................................................20
RECOMMENDED POWER-ON PROCEDURE..............................................................................................21
4.2
4.3
4.4
FUNCTIONAL OVERVIEW.......................................................................................................................22
5.1
BLOCK DIAGRAM ..................................................................................................................................22
OVERVIEW ...........................................................................................................................................22
THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING ..................................22
DIGITAL MOTION PROCESSOR...............................................................................................................23
PRIMARY I2C AND SPI SERIAL COMMUNICATIONS INTERFACES...............................................................23
SECONDARY I2C SERIAL INTERFACE (FOR A THIRD-PARTY ACCELEROMETER OR OTHER SENSORS)...........24
INTERNAL CLOCK GENERATION.............................................................................................................26
CLOCK OUTPUT....................................................................................................................................27
SENSOR DATA REGISTERS ...................................................................................................................27
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10 FIFO...................................................................................................................................................27
5.11 INTERRUPTS.........................................................................................................................................27
5.12 DIGITAL-OUTPUT TEMPERATURE SENSOR .............................................................................................27
5.13 BIAS AND LDO.....................................................................................................................................27
5.14 CHARGE PUMP.....................................................................................................................................27
5.15 CHIP VERSION......................................................................................................................................27
6
7
DIGITAL INTERFACE...............................................................................................................................28
6.1
SERIAL INTERFACE CONSIDERATIONS (MPU-3050) .........................................................................33
I2C AND SPI (MPU-3000 ONLY) SERIAL INTERFACES.............................................................................28
7.1
MPU-3050 SUPPORTED INTERFACES ...................................................................................................33
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
7.2
LOGIC LEVELS......................................................................................................................................33
8
ASSEMBLY...............................................................................................................................................36
8.1
ORIENTATION OF AXES .........................................................................................................................36
PACKAGE DIMENSIONS: ........................................................................................................................37
PCB DESIGN GUIDELINES:....................................................................................................................38
ASSEMBLY PRECAUTIONS.....................................................................................................................39
PACKAGE MARKING SPECIFICATION ......................................................................................................42
TAPE & REEL SPECIFICATION................................................................................................................43
LABEL..................................................................................................................................................44
PACKAGING..........................................................................................................................................45
8.2
8.3
8.4
8.5
8.6
8.7
8.8
9
RELIABILITY ............................................................................................................................................46
9.1
9.2
QUALIFICATION TEST POLICY................................................................................................................46
QUALIFICATION TEST PLAN...................................................................................................................46
10
ENVIRONMENTAL COMPLIANCE ......................................................................................................47
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
1
Document Information
1.1
Revision History
Revision
Date
Revision Description
06/25/09
09/28/09
1.0
2.0
Initial Release
Changes for revision level compliance of MPU-30X0 to MPU-3000
Specification:
Sec. 1.2
Sec. 1.3
Sec. 2.3
Sec. 3.1
Sec. 3.2
Added Revision B1 silicon note
Updated noise specification to 0.03º/s/√Hz
Added secondary I2C interface
Updated sensor specifications table
Changed VDD to 2.5V and TA = 250C
Sec. 3.2-3.3 Changed electrical specifications table format and typical values
Sec. 4.1
Sec. 4.2
Sec. 5.1
Updated pin-out and signal descriptions with new diagram
Updated typical operating circuit diagram
Updated new block diagram descriptions for primary and
secondary I2C serial interfaces
Sec. 5.9
Sec. 6
Changed FIFO description
Edited digital interface
Sec. 10.2
Sec. 10.7
Sec. 13
Updated package drawing/dimensions
Edited trace routing
Added Appendix 1.0, Errata for Revision G devices
11/5/09
12/23/09
2.1
2.2
Sec. 10
Sec. 3.2
Added Material Handling Specification content
Updated Electrical Specifications with Power-Supply Ramp Rate
for VLOGIC Reference Voltage
Sec. 3.3
Sec. 3.4
Updated Level Output Current specifications for the Primary and
Secondary I2C interfaces
Updated Frequency Variation Over Temperature Specification
for Internal Clock Source
Sec. 3.5.1
Sec. 4.4
Updated ESD Specification
Added recommended Power-On Procedure diagram
03/15/2010
08/17/2010
08/26/2010
2.3
Sec. 1.4
Sec. 2.2
Sec. 3.1
Sec. 4.4
Sec. 8.2
Added new InvenSense trademarks under Applications
Edited Digital Output for 400KHz standard (not up to)
Changed Sensitivity Scale Factor to 115 LSB/(º/s)
Updated Recommended Power-on Procedure diagram
Modified Example Power Configuration diagram to remove IME-
3000 reference
Updated ESD-HBM for Device Component Level Tests.
Removed all references to IME-3000 and replaced with third-
party accelerometer.
Updated sensitivity scale factor, ZRO, Noise performance
Added operating current for case without DMP
Added start-up time
Updated table with reference to AUX_VDDIO
Added Demo Software Section
Sec. 11.2
2.4
Sec. 3.1
Sec. 3.2
Sec. 8.2
Sec. 9.1
Sec. 10-11 Added Register Maps and Register Description Sections
Sec. 12.9
Sec. 12.11
Sec. 14
Updated table and accompanying text
Added Storage Specifications Section
Added Environment Compliance Section
2.4b
Sec. 3.2-3.3 Updated specifications for Ci
Sec. 3.5
Sec. 3.3
Updated specifications for Cb
Updated VIH and Vhys
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
Revision
Date
Revision Description
12/23/2010
2.5
2.6
Sec. 9
Removed MPL section. Created a separate document for
Register Information
Clarified SPI Usage case
Fixed C1 and C2 Specifications
Clarified SPI Usage case
03/03/2011
Sec. 2.2
Sec. 4.3
Sec. 5.5
Sec. 5.5
Documented inoperable primary bus when VDD is low and
interface pins are low impedance
Sec. 5.6
Sec. 5.6
Documented gyro access capability in Pass-Through Mode
Documented the Secondary I2C bus Internal Pull Up
configuration
Sec. 7.2
Sec. 8
Modified diagrams to clarify usage of 3rd party accelerometers
Modified assembly rules and Moisture Sensitivity Level (MSL)
Labels
05/19/2011
2.7
Sec. 1.2
Sec. 1.4
Sec. 3.2
Sec. 3.2
Sec. 4.4
Sec. 5.6
Sec. 8.4.3
Sec. 8.5
Sec. 8.8
Updated Software References
Added section describing InvenSense software solutions
Clarified Digital Input and Digital Output specifications
Added CLKOUT Digital Out Specifications
Clarified TVLG-VDD value
Modified diagrams for clarity
Clarified Trace Routing precautions
Modified Package Marking diagrams for clarity
Updated packaging images
06/13/2011
11/14/2011
2.8
2.9
Sec. 3.5
Specified I2C Timing Specifications as only for the Primary I2C
bus. Added reference to App Note for details regarding the
Auxiliary I2C bus specifications.
Sec. 4.1
Sec. 4.4
Specified CLKIN and FSYNC to be connected to GND if unused.
Modified TVDDR value for consistency with Electrical
Characteristics. Modified Power Up Sequencing Notes for clarity
Updated absolute maximum rating for acceleration
Updated package marking description
Sec. 3.7
Sec. 8.5
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
1.2
Purpose and Scope
This document is a product specification, providing a description, specifications, and design related
information for the MPU-3000™ and MPU-3050™ Motion Processing Unit™ (collectively called the
MPU-30X0™).
Electrical characteristics are based upon simulation results and limited characterization data of
advanced samples only. Specifications are subject to change without notice. Final specifications will
be updated based upon characterization of final silicon.
1.3
Product Overview
The MPU-30X0 Motion Processing Unit (MPU™) is the world’s first MotionProcessing™ solution with
integrated 6-axis sensor fusion using its field-proven and proprietary MotionFusion™ engine for smart
phone applications. The MPU-30X0 has an embedded 3-axis gyroscope and Digital Motion
Processor™ (DMP) hardware accelerator engine with a secondary I2C port that interfaces to third
party digital accelerometers to deliver a complete 6-axis sensor fusion output to its primary I2C port.
This combines both linear and rotational motion into a single data stream for the application. This
breakthrough in gyroscope technology provides a dramatic 68% smaller footprint, 40% thinner
package, consumes 55% less power, and has inherent cost advantages compared to the latest
competitive gyro solutions to uniquely address the fast-growing demand for 6-axis MotionProcessing
in mobile handsets. The primary interface also supports SPI protocol on the MPU-3000 and can be
used to read/write to all the registers on the part. The MPU’s memory and FIFO are not accessible
via the SPI interface.
The MPU-30X0 significantly extends and transforms motion sensing features provided by
accelerometers beyond portrait and landscape orientation, to MotionProcessing functionality. The
MPU measures and processes both linear and rotational movements, creating a higher degree of 1:1
motion interactivity between the user and their handset. Similar to the proliferation of Bluetooth,
camera phone image sensors and Wi-Fi, MotionProcessing is becoming a “must-have” function in
mobile handsets benefitting wireless carriers, mobile handset OEMs, application developers and end-
users. By providing an integrated sensor fusion output, the DMP in the MPU-30X0 offloads the
intensive MotionProcessing computation requirements from the applications processor, reducing the
need for frequent polling of the motion sensor output and enabling use of low cost, low power
application processors thereby increasing overall battery life of handsets. Since handsets today are of
multi-function nature, MPU-30X0 not only provides accurate 1:1 motion tracking for some of the more
common applications such as still/video image stabilization, gaming and dead reckoning, the 32-bit
DMP can be programmed to deliver advanced UI, e.g. multiple kinds of gestures and character
recognition leading to applications such as Airsign™, TouchAnywhere™, MotionCommand™.
By leveraging its patented and volume-proven Nasiri-Fabrication platform, which integrates MEMS
wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the
MPU-30X0 package size down to a revolutionary footprint of 4x4x0.9mm (QFN), while providing the
highest performance, lowest noise, and the lowest cost semiconductor packaging to address a wide
range of handheld consumer electronic devices.
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
The MPU-30X0 integrates 16-bit analog-to-digital converters (ADCs), selectable low-pass filters,
FIFO, embedded temperature sensor, and Fast Mode I2C or SPI (MPU-3000 only) interfaces.
Performance features include programmable full-scale range from ±250 degrees-per-second up to
±2000 degrees-per-second (º/s or dps), and low-noise of 0.01º/s/√Hz, while providing the highest
robustness supporting 10,000g shock in operation. The highest cross-axis isolation is achieved by
design from its single silicon integration. Factory-calibrated initial sensitivity reduces production-line
calibration requirements. The part’s on-chip FIFO and dedicated I2C-master accelerometer sensor
bus simplify system timing and lower system power consumption. The sensor bus allows the MPU-
30X0 to directly acquire data from the off-chip accelerometer without intervention from an external
processor. Other industry-leading features include a small 4mmx4mmx0.9mm plastic QFN package,
an embedded temperature sensor, programmable interrupts, and a low 13mW power consumption.
Parts are available with I2C and SPI serial interfaces, a VDD operating range of 2.1 to 3.6V, and a
VLOGIC interface voltage from 1.71V to 3.6V.
The MPU-3000 and MPU-3050 are identical, except that the MPU-3050 supports the I2C serial
interface only, and has a separate VLOGIC reference pin (in addition to its analog supply pin, VDD),
which sets the logic levels of its I2C interface. The VLOGIC voltage may be between 1.71V min to
VDD max. The MPU-3000 supports both I2C and SPI interfaces and has a single supply pin, VDD,
which is the device’s logic reference supply and the analog supply for the part. The table below
outlines these differences:
Primary Differences between MPU-3000 and MPU-3050
Part / Item
VDD
MPU-3000
2.1V to 3.6V
n/a
I2C, SPI
MPU-3050
2.1V to 3.6V
1.71V to VDD
I2C
VLOGIC
Serial Interfaces
Supported
Pin 8
/CS
VLOGIC
AD0
Pin 9
AD0/SDO
SCL/SCLK
SDA/SDI
Pin 23
Pin 24
SCL
SDA
1.4
Software Solutions
This section describes the MotionApps™ software solutions included with the InvenSense MPU™
(MotionProcessing Unit™) and IMU (Inertial Measurement Unit) product families. Please note that the
products within the IDG, IXZ, and ITG families do not include these software solutions.
The MotionApps Platform is a complete software solution that in combination with the InvenSense
IMU and MPU MotionProcessor™ families delivers robust, well-calibrated 6-axis and/or 9-axis sensor
fusion data using its field proven and proprietary MotionFusion™ engine. Solution packages are
available for smartphones and tablets as well as for embedded microcontroller-based devices.
The MotionApps Platform provides a turn-key solution for developers and accelerates time-to-market.
It consists of complex 6/9-axis sensor fusion algorithms, robust multi-sensor calibration, a proven
software architecture for Android and other leading operating systems, and a flexible power
management scheme.
The MotionApps Platform is integrated within the middleware of the target OS (the sensor framework),
and also provides a kernel device driver to interface with the physical device. This directly benefits
application developers by providing a cohesive set of APIs and a well-defined sensor data path in the
user-space.
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
The table below describes the MotionApps software solutions included with the InvenSense MPU and
IMU product families.
InvenSense MotionProcessor Devices and Included MotionApps Software
Included Software
Embedded
Embedded
MotionApps
MotionApps
Lite
Feature
MotionApps
MotionApps
Lite
Notes
MPU-3050™
MPU-6050™
Part Number
Processor Type
IMU-3000™
Mobile
Application
Processor
Mobile
8/16/32-bit
8/16/32-bit
Application
Processor
Microcontroller
Microcontroller
TV remotes,
health/fitness,
toys, other
TV remotes,
health/fitness,
toys, other
Smartphones,
tablets
Smartphones,
tablets
Applications
embedded
embedded
< 2% Application Processor
load using on-chip Digital
Motion Processor (DMP).
6-Axis
MotionFusion
Yes
Yes
Reduces processing
requirements for embedded
applications
9-Axis
MotionFusion
Yes
No
Gyro Bias
Calibration
3rd Party Compass
Cal API
No-Motion calibration and
temperature calibration
Integrates 3rd party compass
libraries
Yes
Yes
Yes
No
Gyro-Assisted
Compass
Calibration (Fast
Quick compass calibration
using gyroscope
Yes
Yes
No
No
Heading)
Magnetic Anomaly
Rejection
(Improved
Uses gyro heading data
when magnetic anomaly is
detected
Heading)
The table below lists recommended documentation for the MotionApps software solutions.
Software Documentation
Platform
MotionApps and MotionApps Lite
Embedded MotionApps and
Embedded MotionApps Lite
Installation Guide for Linux and Android
MotionApps Platform, v1.9 or later
Embedded MotionApps Platform
User Guide, v3.0 or later
Software
Documentation
MPL Functional Specifications
Embedded MPL Functional
Specifications
For more information about the InvenSense MotionApps Platform, please visit the Developer’s Corner
or consult your local InvenSense Sales Representative.
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
1.5
Applications
BlurFree™ technology (for Video/Still Image Stabilization)
AirSign™ technology (for Security/Authentication)
TouchAnywhere™ technology (for Application Control/Navigation)
MotionCommand™ technology (for Gesture Short-cuts)
Motion-enabled game and application framework
InstantGesture™ iG™ gesture recognition
“No Touch” UI
Handset gaming
Location based services, points of interest, and dead reckoning
Improved camera image quality through image stabilization
Health and sports monitoring
Power management
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
2
Features
The MPU-30X0 Motion Processing Unit includes a wide range of features:
2.1
Sensors
X-, Y-, Z-Axis angular rate sensors (gyros) on one integrated circuit
Digital-output temperature sensor
External sync signal connected to the FSYNC pin supports image, video and GPS
synchronization
6-axis MotionProcessing capability using secondary I2C interface to directly connect to a digital 3-
axis third-party accelerometer
Factory calibrated scale factor
High cross-axis isolation via proprietary MEMS design
10,000g shock tolerant
2.2
2.3
Digital Output
Fast Mode (400kHz) I2C
1MHz SPI (MPU-3000 only) to access gyro, temp and auxiliary sensor registers only; aimed at
higher speed applications which need raw data, refer to Section 5.5 for further explanation
16-bit ADCs for digitizing sensor outputs
Angular rate sensors (gyros) with applications-programmable full-scale-range of ±250°/sec,
±500°/sec, ±1000°/sec, or ±2000°/sec.
MotionProcessing
Embedded Digital Motion Processing™ (DMP™) engine supports 3D MotionProcessing and
gesture recognition algorithms
When used together with a digital 3-axis third party accelerometer, the MPU-30X0 collects the
accelerometer data via a dedicated interface, while synchronizing data sampling at a user defined
rate. The total data set obtained by the MPU-30X0 includes 3-axis gyroscope data and 3-axis
accelerometer data, temperature data, and the one bit external sync signal connected to the
FSYNC pin. The MPU also downloads the results calculated by the digital 3-axis third party
accelerometer internal registers.
FIFO buffers complete data set, reducing timing requirements on the system processor and
saving power by letting the processor burst read the FIFO data, and then go into a low-power
sleep mode while the MPU collects more data.
Programmable interrupt supports features such as gesture recognition, panning, zooming,
scrolling, zero-motion detection, tap detection, and shake detection
Hand jitter filter
Programmable low-pass filters
Feature extraction for peak and zero-crossing detection
Pedometer functionality
2.4
2.5
Clocking
On-chip timing generator clock frequency ±1% over full temperature range
Optional external clock inputs of 32.768kHz or 19.2MHz
1MHz clock output to synchronize with digital 3-axis accelerometer
Power
VDD supply voltage range of 2.1V to 3.6V
Flexible VLOGIC reference voltage allows for multiple I2C interface voltage levels (MPU-3050
only)
Power consumption with all three axes and DMP active: 6.1mA
Sleep mode: 5μA
Each axis can be individually powered down
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
2.6
Package
4x4x0.9mm QFN plastic package
MEMS structure hermetically sealed and bonded at wafer level
RoHS and Green compliant
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
3
Electrical Characteristics
3.1
Sensor Specifications
Typical Operating Circuit of Section 4.2, VDD = 2.5V, VLOGIC = 2.5V (MPU-3050 Only), TA=25°C.
Parameter
Conditions
Min
Typical
Max
Unit
Notes
GYRO SENSITIVITY
Full-Scale Range
FS_SEL=0
FS_SEL=1
FS_SEL=2
FS_SEL=3
±250
±500
±1000
±2000
16
º/s
4, 7
4, 7
4, 7
4, 7
3
Gyro ADC Word Length
Sensitivity Scale Factor
bits
FS_SEL=0
FS_SEL=1
FS_SEL=2
FS_SEL=3
25°C
131
LSB/(º/s)
1
3
3
3
65.5
32.8
16.4
±2
Sensitivity Scale Factor Tolerance
-6
+6
%
%
1
Sensitivity Scale Factor Variation Over
Temperature
-40°C to +85°C
±2
8
Nonlinearity
Best fit straight line; 25°C
0.2
2
%
%
6
6
Cross-Axis Sensitivity
GYRO ZERO-RATE OUTPUT (ZRO)
Initial ZRO Tolerance
25°C
±20
±0.03
0.2
º/s
º/s/°C
º/s
1
8
5
5
5
ZRO Variation Over Temperature
-40°C to +85°C
Power-Supply Sensitivity (1-10Hz)
Sine wave, 100mVpp; VDD=2.2V
Sine wave, 100mVpp; VDD=2.2V
Sine wave, 100mVpp; VDD=2.2V
Power-Supply Sensitivity (10 - 250Hz)
0.2
º/s
Power-Supply Sensitivity (250Hz -
100kHz)
4
º/s
Linear Acceleration Sensitivity
GYRO NOISE PERFORMANCE
Total RMS Noise
Static
0.1
º/s/g
6
FS_SEL=0
DLPFCFG=2 (100Hz)
Bandwidth 1Hz to10Hz
At 10Hz
0.1
0.033
0.01
º/s-rms
º/s-rms
º/s/√Hz
1
1
3
Low-frequency RMS noise
Rate Noise Spectral Density
GYRO MECHANICAL FREQUENCIES
X-Axis
30
27
24
33
30
27
36
33
30
kHz
kHz
kHz
1
1
1
Y-Axis
Z-Axis
GYRO START-UP TIME
ZRO Settling
DLPFCFG=0
to ±1º/s of Final
50
ms
5
TEMPERATURE SENSOR
Range
Sensitivity
-30 to 85
280
ºC
LSB/ºC
LSB
2
2
1
2
Untrimmed
Room-Temperature Offset
Linearity
35oC
-13200
±1
Best fit straight line (-30°C to +85°C)
°C
TEMPERATURE RANGE
Specified Temperature Range
-40
85
ºC
2
Notes:
1. Tested in production
2. Based on characterization of 30 parts over temperature on evaluation board or in socket
3. Based on design, through modeling, and simulation across PVT
4. Typical. Randomly selected part measured at room temperature on evaluation board or in socket
5. Based on characterization of 5 parts over temperature
6. Tested on 20 parts at room temperature
7. Part is characterized to Full-Scale Range. Maximum ADC output is [216 / (Sensitivity x 2)]
Example: For Sensitivity of 131 LSB/(º/s), [216 / (131 x 2)] = ±250 º/s.
8. Based on characterization of 48 parts on evaluation board or in socket
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
3.2
Electrical Specifications
Typical Operating Circuit of Section 4.2, VDD = 2.5V, VLOGIC = 2.5V (MPU-3050 only), TA = 25°C.
Parameters
Conditions
Min
2.1
0
Typical
Max
3.6
5
Units
V
Notes
VDD POWER SUPPLY
Operating Voltage Range
2
2
Monotonic ramp. Ramp
rate is 10% to 90% of the
final value (see Figure in
Section 4.4)
Power-Supply Ramp Rate
ms
6.1
5.9
5
mA
mA
µA
1
1
4
Normal Operating Current
Sleep Mode Current
DMP disabled
VLOGIC REFERENCE VOLTAGE
(must be regulated)
VLOGIC must be ≤VDD at
all times
Voltage Range
1.71
VDD
1
V
3, 5
3, 5
Monotonic ramp. Ramp
rate is 10% to 90% of the
final value
Power-Supply Ramp Rate
ms
(see Figure in Section 4.4)
Does not include pull up
resistor current draw as
that is system dependent
Normal Operating Current
100
20
µA
ms
4
4
START-UP TIME FOR REGISTER
READ/WRITE
100
AD0 = 0
AD0 = 1
1101000
1101001
1
1
I2C ADDRESS
DIGITAL INPUTS (SDI/SDA,
SCLK/SCL, FSYNC, AD0, /CS, CLKIN)
VIH, High Level Input Voltage
MPU-3000
MPU-3050
MPU-3000
MPU-3050
0.7*VDD
0.7*VLOGIC
V
V
V
V
pF
4
4
4
4
6
VIL, Low Level Input Voltage
CI, Input Capacitance
0.3*VDD
0.3*VLOGIC
< 5
DIGITAL OUTPUT (SDO, INT)
VOH, High Level Output Voltage
RLOAD=1MΩ; MPU-3000
RLOAD=1MΩ; MPU-3050
RLOAD=1MΩ; MPU-3000
RLOAD=1MΩ; MPU-3050
OPEN=1, 0.3mA sink
current
0.9*VDD
0.9*VLOGIC
V
V
V
V
V
2
2
2
2
2
VOL1, LOW-Level Output Voltage
0.1*VDD
0.1*VLOGIC
0.1
VOL.INT1, INT Low-Level Output Voltage
100
50
Output Leakage Current
tINT, INT Pulse Width
OPEN=1
LATCH_INT_EN=0
nA
µs
3
3
DIGITAL OUTPUT (CLKOUT)
VOH, High Level Output Voltage
VOL1, LOW-Level Output Voltage
RLOAD=1MΩ
RLOAD=1MΩ
0.9*VDD
V
V
2
2
0.1*VDD
Notes:
1. Tested in production
2. Based on characterization of 30 parts over temperature on evaluation board or in socket
3. Typical. Randomly selected part measured at room temperature on evaluation board or in socket
4. Based on characterization of 5 parts over temperature
5. Refer to Section 4.4 for the recommended power-on procedure
6. Guaranteed by design
13 of 47
Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
3.3
Electrical Specifications, continued
Typical Operating Circuit of Section 4.2, VDD = 2.5V, VLOGIC = 2.5V (MPU-3050 only), TA=25°C.
Parameters
Conditions
Typical
Units
Notes
Primary I2C I/O (SCL, SDA)
VIL, LOW-Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
MPU-3000
MPU-3000
MPU-3000
MPU-3050
MPU-3050
MPU-3050
3mA sink current
-0.5 to 0.3*VDD
0.7*VDD to VDD + 0.5V
0.1*VDD
V
V
V
V
V
V
V
1
1
1
1
1
1
1
1
1
2
VIL, LOW Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
-0.5V to 0.3*VLOGIC
0.7*VLOGIC to VLOGIC + 0.5V
0.1*VLOGIC
VOL1, LOW-Level Output Voltage
IOL, LOW-Level Output Current
0 to 0.4
VOL = 0.4V
VOL = 0.6V
3
5
mA
mA
Output Leakage Current
100
20+0.1Cb to 250
< 10
nA
ns
pF
Cb bus capacitance in
pf
tof, Output Fall Time from VIHmax to VILmax
1
3
CI, Capacitance for Each I/O pin
Secondary I2C I/O (AUX_CL,
AUX_DA)
AUX_VDDIO=0 (MPU-
3050)
VIL, LOW-Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
-0.5V to 0.3*VLOGIC
V
V
V
V
1
1
1
1
0.7*VLOGIC to
VLOGIC + 0.5V
0.1*VLOGIC
VLOGIC > 2V; 1mA sink
current
VOL1, LOW-Level Output Voltage
0 to 0.4
VLOGIC < 2V; 1mA sink
current
VOL3, LOW-Level Output Voltage
IOL, LOW-Level Output Current
0 to 0.2*VLOGIC
V
1
1
1
2
VOL = 0.4V
VOL = 0.6V
1
1
mA
mA
Output Leakage Current
100
20+0.1Cb to 250
< 10
nA
ns
pF
Cb bus capacitance in
pF
tof, Output Fall Time from VIHmax to VILmax
CI, Capacitance for Each I/O pin
1
3
Secondary I2C I/O (AUX_CL,
AUX_DA)
AUX_VDDIO=1
VIL, LOW-Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
-0.5 to 0.3*VDD
0.7*VDD to VDD+0.5V
0.1*VDD
V
V
V
V
1
1
1
1
1
1
2
VOL1, LOW-Level Output Voltage
IOL, LOW-Level Output Current
1mA sink current
0 to 0.4
VOL = 0.4V
VOL = 0.6V
1
1
mA
mA
Output Leakage Current
100
20+0.1Cb to 250
< 10
nA
ns
pF
tof, Output Fall Time from VIHmax to VILmax
CI, Capacitance for Each I/O pin
1
3
Cb bus cap. in pF
Notes:
1. Based on characterization of 5 parts over temperature.
2. Typical. Randomly selected part measured at room temperature on evaluation board or in socket
3. Guaranteed by design
14 of 47
Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
3.4
Electrical Specifications, continued
Typical Operating Circuit of Section 4.2, VDD = 2.5V, VLOGIC = 2.5V (MPU-3050 only), TA=25°C.
Parameters
Conditions
Min
Typical
Max
Units Notes
INTERNAL CLOCK SOURCE
CLK_SEL=0,1,2,3
DLPFCFG=0
SAMPLERATEDIV = 0
Sample Rate, Fast
Sample Rate, Slow
8
kHz
kHz
3
3
DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0
1
Reference Clock Output
CLKOUTEN = 1
CLK_SEL=0, 25°C
CLK_SEL=1,2,3; 25°C
CLK_SEL=0
1.024
MHz
%
3
1
1
2
2
4
Clock Frequency Initial Tolerance
-5
-1
+5
+1
%
Frequency Variation over Temperature
-15 to +10
%
CLK_SEL=1,2,3
CLK_SEL=1,2,3
+/-1
1
%
PLL Settling Time
ms
EXTERNAL 32.768kHz CLOCK
External Clock Frequency
External Clock Jitter
CLK_SEL=4
32.768
1 to 2
kHz
µs
4
4
Cycle-to-cycle rms
DLPFCFG=0
SAMPLERATEDIV = 0
Sample Rate, Fast
Sample Rate, Slow
8.192
1.024
kHz
kHz
4
4
DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0
Reference Clock Output
PLL Settling Time
CLKOUTEN = 1
1.0486
1
MHz
ms
4
4
EXTERNAL 19.2MHz CLOCK
External Clock Frequency
CLK_SEL=5
19.2
MHz
4
DLPFCFG=0
SAMPLERATEDIV = 0
Sample Rate, Fast
Sample Rate, Slow
8
1
kHz
kHz
4
4
DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0
Reference Clock Output
PLL Settling Time
CLKOUTEN = 1
1.024
1
MHz
ms
4
4
Notes:
1. Tested in production
2. Based on characterization of 30 parts over temperature on evaluation board or in socket
3. Typical. Randomly selected part measured at room temperature on evaluation board or in socket
4. Based on design, through modeling, and simulation across PVT
15 of 47
Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
3.5
I2C Timing Characterization
Typical Operating Circuit of Section 4.2, VDD = 2.5V, VLOGIC = 1.8V±5% (MPU-3050 only), 2.5V±5%,
3.0V±5%, or 3.3V±5%, TA=25°C.
Parameters
I2C TIMING
Conditions
I2C FAST-MODE
Min
Typical
Max
Units
Notes
fSCL, SCL Clock Frequency
0
400
kHz
µs
1
1
tHD.STA, (Repeated) START Condition
Hold Time
0.6
tLOW, SCL Low Period
tHIGH, SCL High Period
1.3
0.6
0.6
µs
µs
µs
1
1
1
tSU.STA, Repeated START Condition
Setup Time
tHD.DAT, SDA Data Hold Time
tSU.DAT, SDA Data Setup Time
tr, SDA and SCL Rise Time
0
µs
ns
ns
1
1
1
100
Cb bus cap. from 10 to
400pF
Cb bus cap. from 10 to
400pF
20+0.1
Cb
20+0.1
Cb
300
300
tf, SDA and SCL Fall Time
ns
1
tSU.STO, STOP Condition Setup Time
0.6
µs
µs
1
1
tBUF, Bus Free Time Between STOP and
START Condition
1.3
Cb, Capacitive Load for each Bus Line
< 400
pF
µs
µs
3
1
1
tVD.DAT, Data Valid Time
0.9
0.9
tVD.ACK, Data Valid Acknowledge Time
Notes:
1. Based on characterization of 5 parts over temperature on evaluation board or in socket
2. S = Start Condition, P = Stop Condition, Sr = Repeated Start Condition
3. Guaranteed by design
Note: Specifications apply to the Primary I2C bus only. For Auxiliary I2C bus specifications, please refer to
the Application Note, AN-MPU-3000A-20.
I2C Bus Timing Diagram
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
3.6
SPI Timing Characterization (MPU-3000 only)
Typical Operating Circuit of Section 4.2, VDD = 2.1V to 3.6V, TA = -40°C to +85°C, unless otherwise noted.
Typical values are at TA=25°C.
Parameters
Conditions
Min
Typical
Max
Units
SPI TIMING
fSCLK, SCLK Clock Frequency
tLOW, SCLK Low Period
tHIGH, SCLK High Period
tSU.CS, CS Setup Time
tHD.CS, CS Hold Time
tSU.SDI, SDI Setup Time
tHD.SDI, SDI Hold Time
tVD.SDO, SDO Valid Time
tHD.SDO, SDO Hold Time
tDIS.SDO, SDO Output Disable Time
0.9
400
400
8
1
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
500
11
7
Cload = 20pF
Cload = 20pF
100
10
4
Note:
1. Based on characterization of 5 parts over temperature as mounted on evaluation board or in sockets
SPI Bus Timing Diagram
17 of 47
Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
3.7
Absolute Maximum Ratings
Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these conditions is not implied.
Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
Parameter
Rating
Supply Voltage, VDD
-0.5V to +6V
VLOGIC Input Voltage Level
(MPU-3050)
-0.5V to VDD + 0.5V
-0.5V to 2V
REGOUT
Input Voltage Level (CLKIN, AUX_DA,
AD0, FSYNC, INT, SCL, SDA)
-0.5V to VDD + 0.5V
CPOUT (2.1V ≤ VDD ≤ 3.6V )
Acceleration (Any Axis, unpowered)
Operating Temperature Range
Storage Temperature Range
-0.5V to 30V
10,000g for 0.2ms
-40°C to +105°C
-40°C to +125°C
Electrostatic Discharge (ESD)
Protection
1.5kV (HBM); 200V (MM)
JEDEC Class II (2),125°C
Level B, ±60mA
Latch-up
18 of 47
Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
4
Applications Information
4.1
Pin Out and Signal Description
MPU-
3000
MPU-
3050
Pin Number
Pin Name
CLKIN
Pin Description
1
Y
Y
External reference clock input. Connect to GND if unused.
6
Y
Y
Y
Y
AUX_DA
Interface to a 3rd party accelerometer, SDA pin. Logic levels are set to be
either VDD or VLOGIC. See Section 6 for more details.
Interface to a 3rd party accelerometer, SCL pin. Logic levels are set to be
either VDD or VLOGIC. See Section 6 for more details.
SPI chip select (0=SPI mode, 1= I2C mode)
Digital I/O supply voltage. VLOGIC must be ≤ VDD at all times.
I2C Slave Address LSB (AD0); SPI serial data output (SDO)
I2C Slave Address LSB
7
Y
AUX_CL
8
8
9
9
/CS
Y
VLOGIC
AD0 / SDO
AD0
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
10
11
12
13
18
19
20
21
22
23
23
24
24
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
REGOUT
FSYNC
INT
Regulator filter capacitor connection
Frame synchronization digital input. Connect to GND if unused.
Interrupt digital output (totem pole or open-drain)
Power supply voltage and Digital I/O supply voltage
Power supply ground
VDD
GND
RESV
Reserved. Do not connect.
CPOUT
RESV
Charge pump capacitor connection
Reserved. Do not connect.
CLKOUT
SCL / SCLK
SCL
1MHz clock output for third-party accelerometer synchronization
I2C serial clock (SCL); SPI serial clock (SCLK)
I2C serial clock
I2C serial data (SDA); SPI serial data input (SDI)
I2C serial data
Y
Y
Y
SDA / SDI
SDA
Y
Y
2, 3, 4, 5, 14,
15, 16, 17
NC
Not internally connected. May be used for PCB trace routing.
24 23 22 21 20 19
24 23 22 21 20 19
18 GND
CLKIN
1
2
3
4
5
6
18 GND
17 NC
16 NC
15 NC
14 NC
CLKIN
NC
1
2
3
4
5
6
+Z
NC
NC
17 NC
NC
16 NC
M
P
MPU-3000
MPU-3050
U
3
M
-
P
3
5
U
0
0
NC
NC
15 NC
14 NC
13 VDD
0
-
0
0
NC
NC
AUX_DA
13 VDD
AUX_DA
+Y
+X
7
8
9
10 11 12
7
8
9
10 11 12
Orientation of Axes of Sensitivity
and Polarity of Rotation
QFN Package (Top View)
24-pin, 4mm x 4mm x 0.9mm
QFN Package (Top View)
24-pin, 4mm x 4mm x 0.9mm
19 of 47
Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
4.2
Typical Operating Circuits
GND
GND
C3
C3
2.2nF
2.2nF
24 23 22 21 20 19
24 23 22 21 20 19
1
2
3
4
5
6
18
17
16
15
14
13
1
2
3
4
5
6
18
17
16
15
14
13
CLKIN
CLKIN
GND
GND
MPU-3000
MPU-3050
VDD
VDD
AUX_DA
AUX_CL
AUX_DA
AUX_CL
7
8
9
10 11 12
7
8
9
10 11 12
C2
0.1µF
C2
0.1µF
GND
GND
C1
C1
VLOGIC
0.1µF
0.1µF
C4
10nF
GND
GND
GND
Typical Operating Circuits
4.3
Bill of Materials for External Components
Component
Label
Specification
Quantity
Regulator Filter Capacitor
VDD Bypass Capacitor
Charge Pump Capacitor
VLOGIC Bypass Capacitor
*MPU-3050 only
C1
Ceramic, X7R, 0.1µF ±10%, 2V
Ceramic, X7R, 0.1µF ±10%, 4V
1
1
1
1
C2
C3
Ceramic, X7R, 2.2nF ±10%, 50V
Ceramic, X7R, 10nF ±10%, 4V
C4*
20 of 47
Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
4.4
Recommended Power-on Procedure
Power-Up Sequencing
1. VLOGIC amplitude must always be
≤VDD amplitude
2. TVDDR is VDD rise time: Time for VDD
to rise from 10% to 90% of its final
value
TVDDR
90%
10%
3. TVDDR is ≤5ms
4. TVLGR is VLOGIC rise time: Time for
VLOGIC to rise from 10% to 90% of
its final value
10%
VDD
TVLGR
90%
5. TVLGR is ≤1ms
6. TVLG-VDD is the delay from the start of
VDD ramp to the start of VLOGIC
rise
VLOGIC
7. TVLG-VDD is ≥0ms;
8. VDD and VLOGIC must be
monotonic ramps
TVLG - VDD
21 of 47
Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
5
Functional Overview
5.1
Block Diagram
1
12
MPU-3000
MPU-3050
CLKIN
CLKOUT
INT
Clock
CLOCK
Interrupt
Status
Register
22
8
(/CS)
Primary
9
23
24
I2C or SPI
Serial
AD0 / (SDO)
SCL / (SCLK)
SDA / (SDI)
Signal
Conditioning
X Gyro
Y Gyro
Z Gyro
ADC
ADC
ADC
FIFO
Interface
Signal
Conditioning
Config
Register
7
6
Secondary
Interface
Bypass
Mux
Secondary
I2C Serial
Interface
AUX_CL
AUX_DA
Signal
Conditioning
Sensor
Register
11
FSYNC
Temp
Sensor
ADC
OTP
Digital
Motion
Processor
(DMP)
Charge
Pump
Bias & LDO
20
CPOUT
13
VDD
8
18
10
[VLOGIC] GND
REGOUT
Note: Pin names in round brackets ( ) are MPU-3000 only
Pin names in square brackets [ ] are MPU-3050 only
5.2
Overview
The MPU-30X0 is comprised of the following key blocks / functions:
Three-axis MEMS rate gyroscope sensors with 16-bit ADCs and signal conditioning
Digital Motion Processor (DMP)
Primary I2C and SPI (MPU-3000 only) serial communications interfaces
Secondary I2C serial interface for 3rd party accelerometer or other sensors
Clocking
Sensor Data Registers
FIFO
Interrupts
Digital-Output Temperature Sensor
Bias and LDO
Charge Pump
5.3
Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning
The MPU-30X0 consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about
the X, Y, and Z axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes a
vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filtered
to produce a voltage that is proportional to the angular rate. This voltage is digitized using individual on-chip
16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensors
may be digitally programmed to ±250, ±500, ±1000, or ±2000 degrees per second (dps). ADC sample rate is
programmable from 8,000 samples per second, down to 3.9 samples per second, and user-selectable low-
pass filters enable a wide range of cut-off frequencies.
22 of 47
Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
5.4
Digital Motion Processor
The embedded Digital Motion Processor (DMP) is located within the MPU-30X0 and offloads computation of
motion processing algorithms from the host processor. The DMP acquires data from accelerometers,
gyroscopes, and additional sensors such as magnetometers, and processes the data. The resulting data can
be read from the DMP’s registers, or can be buffered in a FIFO. The DMP has access to some of MPU’s
external pins, which can be used for synchronizing external devices to the motion sensors, or generating
interrupts for the application.
The purpose of the DMP is to offload both timing requirements and processing power from the host
processor. Typically, motion processing algorithms should be run at a high rate, often around 200Hz, in order
to provide accurate results with low latency. This is required even if the application updates at a much lower
rate; for example, a low power user interface may update as slowly as 5Hz, but the motion processing should
still run at 200Hz. The DMP can be used as a tool in order to minimize power, simplify timing and software
architecture, and save valuable MIPS on the host processor for use in the application.
5.5
Primary I2C and SPI Serial Communications Interfaces
The MPU-30X0 has a primary I2C serial interface and the MPU-3000 also supports SPI protocol on the
primary interface. SPI interface can be used to read/write to all the registers of MPU-3000 but the MPU’s
memory and FIFO are not accessible via the SPI interface. MPU-30X0 always acts as a slave when
communicating to the system processor. The logic level for communications to the master is set by the
voltage on the VLOGIC pin (MPU-3050) or by VDD (MPU-3000). The LSB of the of the I2C slave address is
set by pin 9 (AD0).
I2C and SPI protocols are described in more detail in Section 6.
Note: When VDD is low, the primary I2C or SPI (MPU-3000 only) interface pins become low impedance and
thus can load the serial bus. This is a concern if other devices are active on the bus during this time.
SPI Usage Cases (MPU-3000 only):
Primary
SPI
Interface
Gyro
Registers
Application
Processor
Temp
Registers
MPU-3000
Configure
Auxiliary
I2C
Registers
Interface
Ext. Sensor
Registers
External
Sensor
Accessing Raw Sensor Data and Configuring MPU-3000 using SPI interface
Primary interface on the MPU-3000 supports SPI protocol and this feature was designed in keeping in mind
high speed applications which need access to raw sensor data. As depicted in the above diagram all the
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
sensor registers can be accessed using the SPI interface and the MPU-3000 can be configured through the
SPI interface. MPU’s memory and FIFO are not accessible via the SPI interface.
Application
Processor
I2C or SPI
I2C
Select
MUX
MPU-3000
Primary
SPI
I2C/SPI
Interface
OIS
Controller
Dual Mode Operation Using SPI
The MPU-3000’s SPI interface can also be used in a dual-mode configuration as shown above. In this
configuration, the application processor accesses all the functions of MPU-3000 using the I2C interface of the
MPU-3000, and the OIS controller accesses only raw data from the MPU-3000 gyroscope registers using the
SPI interface. The multiplexer (MUX) is used to select which interface device is connected to the primary
serial interface of the MPU-3000. The figure above is simplified, since there needs to be communication
between the application processor and the OIS controller, and this is not shown.
5.6
Secondary I2C Serial Interface (for a third-party Accelerometer or other sensors)
The MPU-30X0 has a secondary I2C bus for communicating to an off-chip 3-axis digital output
accelerometer. This bus has two operating modes: I2C Master Mode, where the MPU-30X0 acts as a master
to an external accelerometer connected to the secondary I2C bus; and Pass-Through Mode, where the MPU-
30X0 directly connects the primary and secondary I2C buses together, to allow the system processor to
directly communicate with the external accelerometer.
Secondary I2C Bus Modes of Operation:
I2C Master Mode: allows the MPU-30X0 to directly access the data registers of an external digital
accelerometer. In this mode, the MPU-30X0 directly obtains sensor data from accelerometers and
optionally, another sensor (such as a magnetometer), thus allowing the on-chip DMP to generate
sensor fusion data without intervention from the system applications processor. In I2C master mode,
the MPU-30X0 can be configured to perform burst reads, returning the following data from the
accelerometer:
.
.
.
X accelerometer data (2 bytes)
Y accelerometer data (2 bytes)
Z accelerometer data (2 bytes)
Pass-Through Mode: allows an external system processor to act as master and directly
communicate to the external accelerometer connected to the secondary I2C bus pins (AUX_DA and
AUX_CL). This is useful for configuring the accelerometers, or for keeping the MPU-30X0 in a low-
power mode, when only accelerometers are to be used. In this mode, the secondary I2C bus control
logic (third-party accelerometer Interface block) of the MPU-30X0 is disabled, and the secondary I2C
pins AUX_DA and AUX_CL (Pins 6 and 7) are connected to the main I2C bus (Pins 23 and 24)
through analog switches.
In the Pass-Through Mode the system processor can still access MPU-30X0 gyro data through the
I2C interface.
24 of 47
Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
Secondary I2C Bus IO Logic Levels
The logic levels of the secondary I2C bus can be programmed to be either VDD or VLOGIC (see Sections 6
and 7).
Secondary I2C Bus Internal Pull-up Configuration
I2C Master Mode Equivalent Circuit: The simplified equivalent circuit diagram below shows the MPU-
30X0 auxiliary I²C interface while in master mode. It should be noted that the AUX_CL pin is output
only and is driven by a CMOS output buffer which does not require a pull-up resistor. The AUX_DA
pin is open drain and an internal pull-up resistor is enabled. The CMOS output buffer and the pull up
resistor can be powered from VDD or VLOGIC. Please refer to Section 7.2 for more details.
VLOGIC/VDD
AUX_CL
PULLUP
Equivalent
~2.5k Ohm
MPU-30X0
P
AUX_DA
N
MPU-30X0 I2C Master Mode Auxiliary I2C interface – equivalent circuit
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Pass-Through Mode – Equivalent Circuit: The simplified equivalent circuit diagram below shows the
MPU-30X0 I²C interface during pass-through mode. Internal analog switches are used to connect the
primary and auxiliary I²C interfaces together (SCL to AUX_CL through a buffer and SDA to AUX_DA
pins through a level shifter).
VLOGIC/VDD
SCL
AUX_CL
AUX_DA
Analog
switch
MPU-30X0
Level
Shifter
Circuit
SDA
VLOGIC/VDD
Analog
switch
MPU-30X0 Pass-Through Mode Equivalent Circuit
Internal Clock Generation
5.7
The MPU-30X0 has a flexible clocking scheme, allowing for a variety of internal or external clock sources for
the internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and ADCs, the
DMP, and various control circuits and registers. An on-chip PLL provides flexibility in the allowable inputs for
generating this clock.
Allowable internal sources for generating the internal clock are:
An internal relaxation oscillator
Any of the X, Y, or Z gyros (MEMS oscillators with a drift of ±1% over temperature)
Allowable external clocking sources are:
32.768kHz square wave
19.2MHz square wave
The choice of which source to select for generating the internal synchronous clock depends on the
availability of external sources and the requirements for power consumption and clock accuracy. Most likely,
these requirements will vary by mode of operation. For example, in one mode, where the biggest concern is
power consumption, one may wish to operate the Digital Motion Processor of the MPU-30X0 to process
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accelerometer data, while keeping the gyros off. In this case, the internal relaxation oscillator is a good clock
choice. However, in another mode, where the gyros are active, selecting the gyros as the clock source
provides for a more-accurate clock source.
Clock accuracy is important, since timing errors directly affect the distance and angle calculations performed
by the Digital Motion Processor (or by extension, by any processor).
There are also start-up conditions to consider. When the MPU-30X0 initially starts up; the device operates
off of its internal clock until programmed to operate from another source. This allows the user, for example,
to wait for the MEMS oscillators to stabilize before they are selected as the clock source.
5.8
Clock Output
In addition, the MPU-30X0 provides a clock output, which allows the device to operate synchronously with an
external digital 3-axis accelerometer. Operating synchronously provides for higher-quality sensor fusion data,
since the sampling instant for the sensor data can be set to be coincident for all sensors.
5.9
Sensor Data Registers
The sensor data registers contain the latest gyro and temperature data. They are read-only registers, and
are accessed via the Serial Interface. Data from these registers may be read anytime, however, the interrupt
function may be used to determine when new data is available.
5.10 FIFO
The MPU-30X0 contains a 512-byte FIFO register that is accessible via the Serial Interface. The FIFO
configuration register determines what data goes into it, with possible choices being gyro data,
accelerometer data, temperature readings, auxiliary ADC readings, and FSYNC input. A FIFO counter
keeps track of how many bytes of valid data are contained in the FIFO. The FIFO register supports burst
reads. The interrupt function may be used to determine when new data is available.
5.11 Interrupts
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable
include the INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt.
Items that can trigger an interrupt are (1) Clock generator locked to new reference oscillator (used when
switching clock sources); (2) Digital Motion Processor Done (programmable function); (3) new data is
available to be read (from the FIFO and Data registers); and (4) the MPU-30X0 did not receive an
acknowledge from the accelerometer on the Secondary I2C bus. The interrupt status can be read from the
Interrupt Status register.
5.12 Digital-Output Temperature Sensor
An on-chip temperature sensor and ADC are used to measure the MPU-30X0 die temperature. The
readings from the ADC can be read from the FIFO or the Sensor Data registers.
5.13 Bias and LDO
The bias and LDO section generates the internal supply and the reference voltages and currents required by
the MPU-30X0. Its two inputs are an unregulated VDD of 2.1V to 3.6V and a VLOGIC logic reference supply
voltage of 1.71V to VDD (MPU-3050 only). The LDO output is bypassed by a 0.1µF capacitor at REGOUT.
5.14 Charge Pump
An on-board charge pump generates the high voltage required for the MEMS oscillators. Its output is
bypassed by a 2.2nF capacitor at CPOUT.
5.15 Chip Version
The chip version is written into OTP memory.
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6
Digital Interface
I2C and SPI (MPU-3000 only) Serial Interfaces
6.1
The internal registers and memory of the MPU-3000/MPU-3050 can be accessed using either I2C or SPI
(MPU-3000 & raw sensor data only ). SPI operates in four-wire mode.
Serial Interface
Pin Number
MPU-3000 MPU-3050
Pin Name
Pin Description
SPI chip select (0=SPI mode, I2C disable, 1= I2C mode, SPI
disable)
8
Y
/CS
Digital I/O supply voltage. VLOGIC must be ≤ VDD at all
times.
8
Y
VLOGIC
9
Y
Y
Y
Y
Y
Y
AD0 / SDO
AD0
I2C Slave Address LSB (AD0); SPI serial data output (SDO)
I2C Slave Address LSB
I2C serial clock (SCL); SPI serial clock (SCLK)
I2C serial clock
I2C serial data (SDA); SPI serial data input (SDI)
I2C serial data
9
23
23
24
24
SCL / SCLK
SCL
SDA / SDI
SDA
Note 1:
To prevent switching into I2C mode when using SPI (MPU-3000), the I2C interface should be disabled by
setting the I2C_IF_DIS configuration bit in the WHO_AM_I register. Setting this bit should be performed
immediately after waiting the time specified by the “Start-Up Time for Register Read/Write” in Section 3.2.
6.1.1 I2C Interface
I2C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the
lines are open-drain and bi-directional. In a generalized I2C interface implementation, attached devices can
be a master or a slave. The master device puts the slave address on the bus, and the slave device with the
matching address acknowledges the master.
The MPU-30X0 always operates as a slave device when communicating to the system processor, which thus
acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is
400kHz.
The slave address of the MPU-30X0 is b110100X which is 7 bits long. The LSB bit of the 7 bit address is
determined by the logic level on pin ADO. This allows two MPU-30X0s to be connected to the same I2C bus.
When used in this configuration, the address of the one of the devices should be b1101000 (pin ADO is logic
low) and the address of the other should be b1101001 (pin AD0 is logic high). The I2C address is stored in
WHO_AM_I register.
I2C Communications Protocol
START (S) and STOP (P) Conditions
Communication on the I2C bus starts when the master puts the START condition (S) on the bus, which is
defined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus is
considered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to
HIGH transition on the SDA line while SCL is HIGH (see figure below).
Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.
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SDA
SCL
S
P
START condition
STOP condition
START and STOP Conditions
Data Format / Acknowledge
I2C data bytes are defined to be 8 bits long. There is no restriction to the number of bytes transmitted per
data transfer. Each byte transferred must be followed by an acknowledge (ACK) signal. The clock for the
acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal
by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse.
If a slave is busy and is unable to transmit or receive another byte of data until some other task has been
performed, it can hold SCL LOW, thus forcing the master into a wait state. Normal data transfer resumes
when the slave is ready, and releases the clock line (refer to the following figure).
DATA OUTPUT BY
TRANSMITTER (SDA)
not acknowledge
DATA OUTPUT BY
RECEIVER (SDA)
acknowledge
SCL FROM
MASTER
1
2
8
9
clock pulse for
acknowledgement
START
condition
Acknowledge on the I2C Bus
Communications
After beginning communications with the START condition (S), the master sends a 7-bit slave address
followed by an 8th bit, the read/write bit. The read/write bit indicates whether the master is receiving data from
or is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge
signal (ACK) from the slave device. Each byte transferred must be followed by an acknowledge bit. To
acknowledge, the slave device pulls the SDA line LOW and keeps it LOW for the high period of the SCL line.
Data transmission is always terminated by the master with a STOP condition (P), thus freeing the
communications line. However, the master can generate a repeated START condition (Sr), and address
another slave without first generating a STOP condition (P). A LOW to HIGH transition on the SDA line while
SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the
exception of start and stop conditions.
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SDA
SCL
1 – 7
8
9
1 – 7
8
9
1 – 7
8
9
S
P
START
STOP
ADDRESS
R/W
ACK
DATA
ACK
DATA
ACK
condition
condition
Complete I2C Data Transfer
To write the internal MPU-30X0 registers, the master transmits the start condition (S), followed by the I2C
address and the write bit (0). At the 9th clock cycle (when the clock is high), the MPU-30X0 acknowledges the
transfer. Then the master puts the register address (RA) on the bus. After the MPU-30X0 acknowledges the
reception of the register address, the master puts the register data onto the bus. This is followed by the ACK
signal, and data transfer may be concluded by the stop condition (P). To write multiple bytes after the last
ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case, the
MPU-30X0 automatically increments the register address and loads the data to the appropriate register. The
following figures show single and two-byte write sequences.
Single-Byte Write Sequence
Master
Slave
S
AD+W
RA
RA
DATA
DATA
P
ACK
ACK
ACK
ACK
ACK
Burst Write Sequence
Master
Slave
S
AD+W
DATA
P
ACK
ACK
To read the internal MPU-30X0 registers, the master sends a start condition, followed by the I2C address and
a write bit, and then the register address that is going to be read. Upon receiving the ACK signal from the
MPU-30X0, the master transmits a start signal followed by the slave address and read bit. As a result, the
MPU-30X0 sends an ACK signal and the data. The communication ends with a not acknowledge (NACK)
signal and a stop bit from master. The NACK condition is defined such that the SDA line remains high at the
9th clock cycle. The following figures show single and two-byte read sequences.
Single-Byte Read Sequence
Master
Slave
S
AD+W
RA
RA
S
S
AD+R
AD+R
NACK
ACK
P
ACK
ACK
ACK
ACK DATA
ACK DATA
Burst Read Sequence
Master
Slave
S
AD+W
NACK
P
ACK
DATA
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MPU-3000/MPU-3050 Product Specification
I2C Terms
Signal
S
Description
Start Condition: SDA goes from high to low while SCL is high
AD
Slave I2C address
W
Write bit (0)
R
Read bit (1)
ACK
NACK
RA
Acknowledge: SDA line is low while the SCL line is high at the 9th clock cycle
Not-Acknowledge: SDA line stays high at the 9th clock cycle
MPU-30X0 internal register address
DATA
P
Transmit or received data
Stop condition: SDA going from low to high while SCL is high
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6.1.2 SPI interface (MPU-3000 only)
SPI is a 4-wire synchronous serial interface that uses two control and two data lines. The MPU-3000 always
operates as a Slave device during standard Master-Slave SPI operation. With respect to the Master, the
Serial Clock output (SCLK), the Data Output (SDO) and the Data Input (SDI) are shared among the Slave
devices. The Master generates an independent Chip Select (/CS) for each Slave device; /CS goes low at the
start of transmission and goes back high at the end. The Serial Data Output (SDO) line, remains in a high-
impedance (high-z) state when the device is not selected, so it does not interfere with any active devices.
SPI Operational Features
1. Data is delivered MSB first and LSB last
2. Data is latched on rising edge of SCLK
3. Data should be transitioned on the falling edge of SCLK
4. SCLK frequency is 1MHz max
5. SPI read and write operations are completed in 16 or more clock cycles (two or more bytes). The
first byte contains the SPI Address, and the following byte(s) contain(s) the SPI data. The first
bit of the first byte contains the Read/Write bit and indicates the Read (1) or Write (0) operation.
The following 7 bits contain the Register Address. In cases of multiple-byte Read/Writes, data is
two or more bytes:
SPI Address format
MSB
LSB
R/W A6 A5 A4 A3 A2 A1 A0
SPI Data format
MSB
D7
LSB
D6 D5 D4 D3 D2 D1 D0
6. Supports Single or Burst Read/Writes.
SCLK
SDI
SPI Master
/CS1
SPI Slave 1
SDO
/CS
/CS2
SCLK
SDI
SDO
/CS
SPI Slave 2
Typical SPI Master / Slave Configuration
Each SPI slave requires its own Chip Select (/CS) line. SDO, SDI and SCLK lines are shared. Only one /CS
line is active (low) at a time ensuring that only one slave is selected at a time. The /CS lines of other slaves
are held high which causes their respective SDO pins to be high-Z.
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MPU-3000/MPU-3050 Product Specification
7
Serial Interface Considerations (MPU-3050)
7.1
MPU-3050 Supported Interfaces
The MPU-3050 supports I2C communications on both its primary (microprocessor) serial interface and its
secondary (accelerometer) interface.
7.2
Logic Levels
The MPU-3050 I/O logic levels are set to be either VDD or VLOGIC, as shown in the table below.
I/O Logic Levels vs. AUX_VDDIO (Secondary I2C Bus IO Level)
ACCELEROMETER LOGIC LEVELS
MICROPROCESSOR LOGIC LEVELS
AUX_VDDIO
(Pins: SDA, SCL, AD0,CLKIN, INT)
(Pins: AUX_DA, AUX_CL)
0
1
VLOGIC
VLOGIC
VLOGIC
VDD
Notes:
1. CLKOUT has logic levels that are always referenced to VDD
2. The power-on-reset value for AUX_VDDIO is 0.
VLOGIC may be set to be equal to VDD or to another voltage, such that at all times VLOGIC is ≤ VDD.
When AUX_VDDIO is set to 0 (its power-on-reset value), VLOGIC is the power supply voltage for both the
microprocessor system bus and the accelerometer secondary bus, as shown in the figure of Section 7.2.1.
When AUX_VDDIO is set to 1, VLOGIC is the power supply voltage for the microprocessor system bus and
VDD is the supply for the accelerometer secondary bus, as shown in the figure of Section 7.2.2.
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7.2.1 AUX_VDDIO = 0
The figure below shows logic levels and voltage connections for AUX_VDDIO = 0. Note: Actual configuration
will depend on the type of third-party accelerometer used.
VLOGIC
(0V - VLOGIC)
SYSTEM BUS
System
Processor
SDA
VDD
VLOGIC
SCL
VDD
(0V - VLOGIC)
INT
VLOGIC
(0V - VLOGIC)
(0V - VLOGIC)
SDA
SCL
(0V - VLOGIC)
(0V - VLOGIC)
CLKIN
FSYNC
VLOGIC
MPU-30X0
0V - VDD
No connect
CLKOUT
VLOGIC
AD0
CS
(0V - VLOGIC)
(0V - VLOGIC)
3rd Party
Accel
(0V - VLOGIC)
(0V - VLOGIC)
INT 1
INT 2
AUX_DA
AUX_CL
SDA
SCL
(0V, VLOGIC)
(0V, VLOGIC)
SA0
Notes:
1. AUX_VDDIO is bit 7 in Register 24, and determines the IO voltage levels of AUX_DA and AUX_CL (0
= set output levels relative to VLOGIC)
2. CLKOUT is always referenced to VDD
3. Other MPU-3050 logic IO are always referenced to VLOGIC
I/O Levels and Connections for AUX_VDDIO = 0
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Document Number: PS-MPU-3000A-00
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7.2.2 AUX_VDDIO = 1
When AUX_VDDIO is set to 1 by the user, VLOGIC is the power supply voltage for the microprocessor
system bus and VDD is the power supply for the accelerometer secondary bus, as shown in the figure below.
This is useful when interfacing to a third-party accelerometer where there is only one supply for both the logic
and analog sections of the 3rd party accelerometer.
VLOGIC
(0V - VLOGIC)
SYSTEM BUS
System
Processor
SDA
VDD
VLOGIC
SCL
(0V - VLOGIC)
INT
(0V - VLOGIC)
(0V - VLOGIC)
VLOGIC
SDA
SCL
(0V - VLOGIC)
(0V - VLOGIC)
CLKIN
VDD
FSYNC
VLOGIC
MPU-30X0
VLOGIC
AD0
INT 1
0V - VDD
DIO
CLKOUT
(0V - VLOGIC)
INT 2
0V - VDD
0V - VDD
AUX_DA
AUX_CL
SDA
SCL
(0V - VLOGIC)
(0V, VLOGIC)
3rd Party
Accel
0V - VDD
ADDR
Voltage/
Configuration
Configuration 1
Configuration 2
VLOGIC
1.8V±5%
2.5V±5%
1
3.0V±5%
3.0V±5%
1
VDD
AUX_VDDIO
Notes:
1. AUX_VDDIO is bit 7 in Register 24, and determines the IO voltage levels of AUX_DA and
AUX_CL (1 = set output levels relative to VDD)
2. CLKOUT is always referenced to VDD
3. Other MPU-3050 logic IO are always referenced to VLOGIC
4. Third-party accelerometer logic levels are referenced to VDD; setting INT1 and INT2 to open-
drain configuration provides voltage compatibility when VDD ≠ VLOGIC.
When VDD = VLOGIC, INT1 and INT2 may be set to push-pull outputs, and the external pull-up
resistors will not be needed.
I/O Levels and Connections for Two Example Power Configurations (AUX_VDDIO = 1)
Note: Actual configuration will depend on the type of third-party accelerometer used.
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Document Number: PS-MPU-3000A-00
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MPU-3000/MPU-3050 Product Specification
8
Assembly
This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems
(MEMS) gyros packaged in Quad Flat No leads package (QFN) surface mount integrated circuits.
8.1
Orientation of Axes
The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1
identifier in the figure.
+Z
M
P
U
3
M
-
P
3
5
0
0
U
0
-
0
0
+Y
+X
Orientation of Axes of Sensitivity and Polarity of Rotation
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MPU-3000/MPU-3050 Product Specification
8.2
Package Dimensions:
I
PIN 1 IDENTIFIER IS A LASER
MARKED FEATURE ON TOP
c
PIN 1 IDENTIFIER
S1
24
19
19
24
1
18
I
18
1
S1
C 0.16
f
b
E
E2
e
13
6
6
13
L1 (12x)
12
7
7
12
A1
D
D2
L(12x)
A
On 4 corner lead dim.
SYMBOLS
DIMENSIONS IN MILLIMETERS
MIN
NOM
MAX
A
A1
b
c
D
D2
E
E2
e
f (e-b)
L
L1
I
0.85
0.00
0.18
---
3.90
2.95
3.90
2.75
---
0.20
0.30
0.35
0.20
0.05
0.05
0.15
0.90
0.02
0.25
0.20 REF.
4.00
3.00
4.00
2.80
0.50
0.25
0.35
0.40
0.25
---
0.95
0.05
0.30
---
4.10
3.05
4.10
2.85
---
0.32
0.40
0.45
0.30
0.10
0.15
0.25
S
S
R
R
s
S1
---
0.20
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Document Number: PS-MPU-3000A-00
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MPU-3000/MPU-3050 Product Specification
8.3
PCB Design Guidelines:
The Pad Diagram using a JEDEC type extension with solder rising on the outer edge is shown below. The
Pad Dimensions Table shows pad sizing (mean dimensions) recommended for the MPU-30X0 product.
JEDEC type extension with solder rising on outer edge
PCB Lay-out Diagram
SYMBOLS
DIMENSIONS IN MILLIMETERS
NOM
Nominal Package I/O Pad Dimensions
e
b
L
L1
D
E
Pad Pitch
Pad Width
Pad Length
Pad Length
0.50
0.25
0.35
0.40
4.00
4.00
3.00
2.80
Package Width
Package Length
Exposed Pad Width
Exposed Pad Length
I/O Land Design Dimensions (Guidelines )
I/O Pad Extent Width
I/O Pad Extent Length
Land Width
Outward Extension
Inward Extension
Land Length
D2
E2
D3
E3
c
Tout
Tin
L2
4.80
4.80
0.35
0.40
0.05
0.80
0.85
L3
Land Length
PCB Dimensions Table (for PCB Lay-out Diagram)
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MPU-3000/MPU-3050 Product Specification
8.4
Assembly Precautions
8.4.1 Gyroscope Surface Mount Guidelines
InvenSense MEMS Gyros sense rate of rotation. In addition, gyroscopes sense mechanical stress coming
from the printed circuit board (PCB). This PCB stress can be minimized by adhering to certain design rules:
When using MEMS gyroscope components in plastic packages, PCB mounting and assembly can cause
package stress. This package stress in turn can affect the output offset and its value over a wide range of
temperatures. This stress is caused by the mismatch between the Coefficient of Linear Thermal Expansion
(CTE) of the package material and the PCB. Care must be taken to avoid package stress due to mounting.
Traces connected to pads should be as symmetric as possible. Maximizing symmetry and balance for pad
connection will help component self alignment and will lead to better control of solder paste reduction after
reflow.
Any material used in the surface mount assembly process of the MEMS gyroscope should be free of
restricted RoHS elements or compounds. Pb-free solders should be used for assembly.
8.4.2 Exposed Die Pad Precautions
The MPU-30X0 has very low active and standby current consumption. The exposed die pad is not required
for heat sinking, and should not be soldered to the PCB. Failure to adhere to this rule can induce
performance changes due to package thermo-mechanical stress. There is no electrical connection between
the pad and the CMOS.
8.4.3 Trace Routing
Routing traces or vias under the gyro package such that they run under the exposed die pad is prohibited.
Routed active signals may harmonically couple with the gyro MEMS devices, compromising gyro response.
These devices are designed with the drive frequencies as follows: X = 33±3kHz, Y = 30±3kHz, and
Z=27±3kHz. To avoid harmonic coupling don’t route active signals in non-shielded signal planes directly
below, or above the gyro package. Note: For best performance, design a ground plane under the e-pad to
reduce PCB signal noise from the board on which the gyro device is mounted. If the gyro device is stacked
under an adjacent PCB board, design a ground plane directly above the gyro device to shield active signals
from the adjacent PCB board.
8.4.4 Component Placement
Do not place large insertion components such as keyboard or similar buttons, connectors, or shielding boxes
at a distance of less than 6 mm from the MEMS gyro. Maintain generally accepted industry design practices
for component placement near the MPU-30X0 to prevent noise coupling and thermo-mechanical stress.
8.4.5 PCB Mounting and Cross-Axis Sensitivity
Orientation errors of the gyroscope mounted to the printed circuit board can cause cross-axis sensitivity in
which one gyro responds to rotation about another axis. For example, the X-axis gyroscope may respond to
rotation about the Y or Z axes. The orientation mounting errors are illustrated in the figure below.
.
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Z
Φ
Y
M
P
M
U
-
P
3
U
0
0
0
-
3
0
0
5
X
Θ
Package Gyro Axes (
) Relative to PCB Axes (
) with Orientation Errors (Θ and Φ)
The table below shows the cross-axis sensitivity of the gyroscope for a given orientation error.
Cross-Axis Sensitivity vs. Orientation Error
Orientation Error
Cross-Axis Sensitivity
(θ or Φ)
(sinθ or sinΦ)
0º
0.5º
1º
0%
0.87%
1.75%
The specification for cross-axis sensitivity in Section 3.1 includes the effect of the die orientation error with
respect to the package.
8.4.6 MEMS Handling Instructions
MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds of
millions of consumer, automotive and industrial products. MEMS devices consist of microscopic moving
mechanical structures. They differ from conventional IC products, even though they can be found in similar
packages. Therefore, MEMS devices require different handling precautions than conventional ICs prior to
mounting onto printed circuit boards (PCBs).
The MPU-30X0 gyroscope has been qualified to a shock tolerance of 10,000g. InvenSense packages its
gyroscopes as it deems proper for protection against normal handling and shipping. It recommends the
following handling precautions to prevent potential damage.
Do not drop individually packaged gyroscopes, or trays of gyroscopes onto hard surfaces. Components
placed in trays could be subject to g-forces in excess of 10,000g if dropped.
Printed circuit boards that incorporate mounted gyroscopes should not be separated by manually
snapping apart. This could also create g-forces in excess of 10,000g.
8.4.7 ESD Considerations
Establish and use ESD-safe handling precautions when unpacking and handling ESD-sensitive devices.
Store ESD sensitive devices in ESD safe containers until ready for use. The Tape-and-Reel moisture-
sealed bag is an ESD approved barrier. The best practice is to keep the units in the original moisture
sealed bags until ready for assembly.
Restrict all device handling to ESD protected work areas that measure less than 200V static charge.
Ensure that all workstations and personnel are properly grounded to prevent ESD.
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
8.4.8 Reflow Specification
Qualification Reflow: The MPU-30X0 gyroscope was qualified in accordance with IPC/JEDEC J-STD-
020D.01. This standard classifies proper packaging, storage and handling in order to avoid subsequent
thermal and mechanical damage during the solder reflow attachment phase of assembly. The classification
specifies a sequence consisting of a bake cycle, a moisture soak cycle in a temperature humidity oven,
followed by three solder reflow cycles and functional testing for qualification. All temperatures refer to the
topside of the QFN package, as measured on the package body surface. The peak solder reflow
classification temperature requirement is (260 +5/-0°C) for lead-free soldering of components measuring less
than 1.6 mm in thickness.
Production Reflow: Check the recommendations of your solder manufacturer. For optimum results,
production solder reflow processes should reduce exposure to high temperatures, and use lower ramp-up
and ramp-down rates than those used in the component qualification profile shown for reference below.
Production reflow should never exceed the maximum constraints listed in the table and shown in the figure
below. These constraints were used for the qualification profile, and represent the maximum tolerable ratings
for the device.
Maximum Temperature IR / Convection Solder Reflow Curve Used for Qualification
Temperature Set Points for IR / Convection Reflow Corresponding to Figure Above
CONSTRAINTS
Step Setting
Temp (°C) Time (sec) Rate (°C/sec)
A
B
C
D
E
F
G
H
I
Troom
25
TSmin
150
200
217
255
260
255
217
25
TSmax
TLiquidus
TPmin
60 < tBC < 120
r(TLiquidus-TPmax) < 3
r(TLiquidus-TPmax) < 3
r(TLiquidus-TPmax) < 3
r(TPmax-TLiquidus) < 4
[255°C, 260°C]
TPmax
TPmin
tAF < 480
[ 260°C, 265°C]
[255°C, 260°C]
10< tEG < 30
60 < tDH < 120
TLiquidus
Troom
Note: For users TPmax must not exceed the classification temperature (260°C).
For suppliers TPmax must equal or exceed the classification temperature.
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
8.4.9 Storage Specifications
The storage specification of the MPU-30X0 gyroscope conforms to IPC/JEDEC J-STD-020D.01 Moisture
Sensitivity Level (MSL) 3.
Calculated shelf-life in moisture-sealed bag 12 months -- Storage conditions: <40°C and <90% RH
After opening moisture-sealed bag
168hours -- Storage conditions: ambient ≤30°C at 60%RH
8.5
Package Marking Specification
TOP VIEW
INVENSENSE
MPU-3050
INVENSENSE
MPU-3000
XXXXXX-XX
XX YYWW X
Lot traceability code
XXXXXX-XX
XX YYWW X
Foundry code
Rev Code
YY = Year Code
WW = Work Week
Package Vendor Code
Package Marking Specification
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
8.6
Tape & Reel Specification
Tape Dimensions
Reel Outline Drawing
Reel Dimensions and Package Size
PACKAGE
REEL (mm)
SIZE
L
330
V
W
Z
4x4
100
13.2
2.2
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
User Direction of
Package Orientation
Feed
Cover Tape
(Anti-Static)
Carrier Tape
(Anti-Static)
Label
Pin 1
Terminal Tape
Reel
Tape and Reel Specification
Reel Specifications
Quantity Per Reel
5,000
Reels per Box
1
3
Boxes Per Carton (max)
Pieces per Carton (max)
15,000
8.7
Label
Location of Label
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
8.8
Packaging
ESD Anti-static Label
Moisture-Sensitivity
Caution Label
Tape & Reel
Barcode Label
Moisture Barrier Bag
With Labels
Moisture-Sensitive Caution Label
Reel in Box
Box with Tape & Reel Label
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
9
Reliability
9.1
Qualification Test Policy
Before InvenSense products are released for production, they complete a series of qualification tests. The
Qualification Test Plan for the MPU-30X0 followed the JEDEC JESD47G.01 Standard, “Stress-Test-Driven
Qualification of Integrated Circuits.” The individual tests are described below.
9.2
Qualification Test Plan
Accelerated Life Tests
Method/Condition
TEST
Lot
Quantity
Sample
/ Lot
Acc /
Reject
Criteria
High Temperature
Operating Life (HTOL/LFR)
JEDEC JESD22-A108C, Dynamic,
3.63V biased, Tj>125°C
[read-points 168, 500, 1000 hours]
3
3
77
77
(0/1)
Highly Accelerated Stress
Test (1) (HAST)
(0/1)
JEDEC JESD22-A118
Condition A, 130°C, 85%RH, 33.3 psia.,
unbiased, [read-point 96 hours]
High Temperature Storage
Life (HTS)
JEDEC JESD22-A103C, Cond. A, 125°C,
Non-Biased Bake
3
77
(0/1)
[read-points 168, 500, 1000 hours]
Device Component Level Tests
Method/Condition
TEST
Lot
Quantity
Sample
/ Lot
Acc /
Reject
Criteria
ESD-HBM
ESD-MM
Latch Up
JEDEC JESD22-A114F, (1.5KV)
JEDEC JESD22-A115-A, (200V)
1
1
1
3
3
6
(0/1)
(0/1)
(0/1)
JEDEC JESD78B Class II (2), 125°C;
Level B ±60mA
Mechanical Shock
JEDEC JESD22-B104C,
3
30
(0/1)
Mil-Std-883H, method 2002.5,
Cond. E, 10,000g’s, 0.2ms,
±X, Y, Z – 6 directions, 5 times/direction
Vibration
JEDEC JESD22-B103B, Variable Frequency
(random), Cond. B, 5-500Hz,
X, Y, Z – 4 times/direction
3
3
5
(0/1)
(0/1)
Temperature Cycling (TC) (1)
JEDEC JESD22-A104D Condition N,
77
[-40°C to +85°C], Soak Mode 2 [5’], 100 cycles
Board Level Tests
Method/Condition
TEST
Lot
Quantity
Sample
/ Lot
Acc /
Reject
Criteria
Board Mechanical Shock
JEDEC JESD22-B104C,
Mil-Std-883H, method 2002.5,
Cond. E, 10000g’s, 0.2ms,
1
1
5
(0/1)
+-X, Y, Z – 6 directions, 5 times/direction
Board
JEDEC JESD22-A104D Condition N,
[ -40°C to +85°C], Soak Mode 2 [5’], 100 cycles
40
(0/1)
Temperature Cycling (TC) (1)
(1) Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F
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Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
MPU-3000/MPU-3050 Product Specification
10 Environmental Compliance
The MPU-30X0 is RoHS and Green compliant.
The MPU-30X0 is in full environmental compliance as evidenced in report HS-MPU-30X0A, Materials
Declaration Data Sheet.
Environmental Declaration Disclaimer:
InvenSense believes this environmental information to be correct but cannot guarantee accuracy or completeness. Conformity
documents for the above component constitutes are on file. InvenSense subcontracts manufacturing and the information contained
herein is based on data received from vendors and suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense
for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to
change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to
improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding
the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising
from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited
to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for
any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
InvenSense®, AirSign®, TouchAnywhere®, and MotionCommand®, are registered trademarks of InvenSense, Inc., MPU™, MPU-
30X0™, MPU-3000™, MPU-3050™, MPU-6050™, IMU-3000™, Motion Processing Unit™, Digital Motion Processor™, Digital Motion
Processing™, DMP™, MotionApps™, MotionProcessing™, MotionProcessor™, MotionFusion™, InstantGesture™, iG™, and
BlurFree™ are trademarks of InvenSense, Inc.
©2011 InvenSense, Inc. All rights reserved.
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