PCM16XRO_技术文档

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MPLAB^®ICE

Processor Module and Device Adapter Specification

CONTENTS

2.0

TERMINOLOGY

1.0 INTRODUCTION ................................................ 1

2.0 TERMINOLOGY ................................................. 1

3.0 PROCESSOR MODULES.................................. 2

4.0 EMULATOR-RELATED ISSUES......................... 4

5.0 DEVICE ADAPTER ISSUES .............................. 5

A brief overview of the different components of the sys-

tem is shown in the figure below. Each component is

discussed in the following subsections.

FIGURE 2-1: MPLAB ICE EMULATOR

SYSTEM

Host to Pod Cable

Emulator Pod

1.0

INTRODUCTION

Processor Module

Flexible Circuit

The Processor Modules for MPLAB ICE are

interchangeable personality modules that allow

MPLAB ICE to be reconfigured for emulation of differ-

ent PICmicro^®microcontrollers (MCUs). This modular-

ity allows the emulation of many different devices by

the addition of just a Processor Module and Device

Adapter, which makes for a very cost effective multipro-

cessor emulation system.

Cable

Logic Probe

Connector

Device

Adapter

Transition

Socket

The Device Adapters for MPLAB ICE are interchange-

able assemblies that allow the emulator system to

interface to a target application system. Device Adapt-

ers also have control logic that allows the target appli-

cation to provide a clock source and power to the

Processor Module. The Device Adapters support PIC-

micro MCUs in DIP, SDIP, and PLCC packages.

2.1

Host to Pod Cable

This is a standard parallel interface cable. MPLAB ICE

is tested with a 6-foot cable. A longer cable may work,

but is not guaranteed. The cable connects to a parallel

port on the PC. If a PC has a printer connected to an

LPT device, it is recommended that an additional inter-

face card be installed, rather than using a splitter or an

A/B switch.

Transition Sockets, used along with a Device Adapter,

provide a method of accommodating all PICmicro MCU

packages, including SOIC, SSOP, PQFP, and TQFP

packages.

2.2

Emulator Pod

The Emulator Pod contains emulator memory and con-

trol logic. MPLAB ICE 2000 contains a main board and

an additional board for expanded trace memory and

complex control logic. There are no field serviceable

parts in the pod. For more information on the pod, see

the MPLAB ICE User’s Guide (DS51159).

The MPLAB ICE Processor Module is inserted into the

pod for operation.

2.3

Processor Module

The Processor Module contains the emulator chip,

logic and low-voltage circuitry. There are no field ser-

viceable parts mounted on the printed circuit board

housed within the Processor Module enclosure.

MPLAB is a registered trademark of Microchip Technology Inc.

PICMASTER is a registered trademark of Microchip Technology Inc.

 2001 Microchip Technology Inc.

DS51140D-page 1

MPLAB^®ICE

2.4

Flex Circuit Cable

3.1

POWER

Once the Processor Module is inserted into the Emula-

tor Pod, the flex circuit cable extends the emulator sys-

tem to the target application. This is a custom cable that

is attached inside the Processor Module enclosure and

can be replaced in the field by removing the end cap of

the Processor Module enclosure.

The operating voltage for most of the control logic and

buffering on the Processor Module is +5V and is

supplied by the Emulator Pod. Power to the emulator

processor and some of its surrounding buffers is user

selectable, and can be powered by the Emulator Pod

(at +5V only) or the target application system (from

2.0V to 5.5V). This is software selectable and is config-

urable through the MPLAB IDE software. At no time will

the emulator system directly power the target applica-

tion system. ALWAYS insert the Processor Module into

the Emulator Pod before applying power to the pod.

Please, DO NOT PULL on the flex circuit cable to

remove the Processor Module from the pod. Use the

fins of the Processor Module end cap to leverage the

module from the pod.

2.5

Device Adapter

When connecting to a target application system, the

user may notice a voltage level on the target application

even though they have not yet applied power to the tar-

get application circuit. This is normal, and is due to cur-

rent leakage through VCC of the Device Adapter. The

current leakage will typically be less than 20 mA.

However, if the target application is using a voltage

regulator, it should be noted that some regulators

require the use of an external shunt diode between VIN

and VOUT for reverse-bias protection. Refer to the

manufacturer’s data sheets for additional information.

The Device Adapter provides a common interface for

the device being emulated. They are provided in stan-

dard DIP and PLCC styles. The adapter also contains

a special device that provides an oscillator clock to

accurately emulate the oscillator characteristics of the

PICmicro MCU.

2.6

Transition Socket

Transition Sockets are available in various styles to

allow a common Device Adapter to be connected to

one of the supported surface mount package styles.

Transition Sockets are available for various pin counts

and pitches for SOIC, QFP and other styles. For more

information on transition sockets, see the MPLAB ICE

Transition Socket Specification (DS51194).

3.1.1

EMULATOR PROCESSOR POWER

SUPPLIED BY EMULATOR SYSTEM

If the emulator system is selected to power the

emulator processor in the Processor Module, the emu-

lator system can be operated without being connected

to a target application. If the system is being connected

to a target application, the power to the pod should be

applied before applying power to the target application.

An emulator system consists of the following compo-

nents which are ordered separately:

• An Emulator Pod (including the host-to-pod cable

and power supply)

Note that the target application system’s VCC will expe-

rience a small current load (10 mA typical) when the

emulator system is connected via a Device Adapter.

This is because the target system must always power

the clock chip in the Processor Module.

• A Processor Module (including the flex circuit

cable)

• A Device Adapter

• An optional Transition Socket (for surface mount

emulation)

3.1.2

EMULATOR PROCESSOR POWER

SUPPLIED BY TARGET APPLICATION

SYSTEM

3.0

PROCESSOR MODULES

Processor Modules are identified on the top of the

assembly (e.g., PCM17XA0). To determine which pro-

cessors are supported by a specific module, refer to the

latest Development Systems Ordering Guide

(DS30177) or Product Line Card (DS00148). Both can

be found on our Web site (www.microchip.com).

When the MPLAB IDE software is brought up, the emu-

lator system is first initialized with the emulator system

powering the emulator processor. The “Processor

Power Supplied by Target Board” option may then be

selected using the Power tab of the Options>Develop-

ment Mode dialog to power the Processor Module from

the target board.

A typical Processor Module contains a special bond-

out version of a PICmicro MCU, device buffers to con-

trol data flow and control logic. It provides the means of

configuring the MPLAB ICE emulator for a specific PIC-

micro MCU family and handles low-voltage emulation

when needed.

When operating from external power, the Processor

Module will typically represent a current load equivalent

to the device being emulated (according to its data

sheet) plus approximately 100 mA. Keep in mind that

the target application will affect the overall current load

of the Processor Module, dependent upon the load

placed upon the processor I/O.

Note: When removing the Processor Module,

DO NOT pull on the flex cable. Use the

tabs on the Processor Module or damage

to the flex cable may occur.

DS51140D-page 2

 2001 Microchip Technology Inc.

Processor Module and Device Adapter Specification

When the processor power is supplied by the target

application system, an external clock (from the target

board) may also be provided. MPLAB IDE will not allow

use of an external clock without the use of external

power.

3.2

OPERATING FREQUENCY

The Processor Modules will support the maximum

frequency (except where noted in Section 4.0) of the

device under emulation. Note that the maximum fre-

quency of a PICmicro MCU device is significantly lower

when the operating voltage is less than 4.5V.

3.1.3

OPERATING VOLTAGE OF 4.6 TO 5.5

VOLTS

The Processor Modules will support a minimum

frequency of 32 kHz. When operating at low frequen-

cies, response to the screen may be slow.

If the target application system’s operating voltage is

between 4.55V (±120 mV) and 5.5V, the Processor

Module will consider this a STANDARD VOLTAGE

condition. In this mode the processor can run to its

highest rated speed (as indicated in its data sheet).

3.3

CLOCK OPTIONS

MPLAB ICE allows internal and external clocking.

When set to internal, the clock is supplied from the

internal programmable clock, located in the Emulator

Pod. When set to external, the oscillator on the target

application system will be utilized.

The recommended power-up sequence is:

1. Apply power to the PC host.

2. Apply power to the Emulator Pod and Processor

Module assembly.

3.3.1

CLOCK SOURCE FROM EMULATOR

3. Invoke MPLAB IDE.

4. Configure system for Processor Power Supplied

by Target Board through the Power tab of the

Options/Development Mode dialog box.

Refer to the MPLAB ICE User’s Guide (DS51159),

“Chapter 3, Using the On-Board Clock” for configuring

MPLAB IDE to supply the clock source.

5. At the error message, apply power to the target

application circuit. Then acknowledge the error.

3.3.2

CLOCK SOURCE FROM THE TARGET

APPLICATION

6. Issue a System Reset (from the Debug Menu)

before proceeding.

If the Target Application is selected to provide the clock

source, the target board must also be selected to

power the emulator processor (see the MPLAB ICE

User’s Guide (DS51159), “Chapter 3. Using a Target

Board Clock”).

3.1.4

OPERATING VOLTAGE OF 2.0 TO 4.6

VOLTS

If the target application system’s operating voltage is

between 2.0V and 4.55V (±120 mV), the Processor

Module will consider this a LOW VOLTAGE condition.

In this mode the processor is limited to its rated speed

at a given voltage level (as indicated in its data sheet).

At low voltage, the maximum speed of the processor

will be limited to the rated speed of the device under

emulation.

An oscillator circuit on the Device Adapter generates a

clock to the Processor Module and buffers the clock cir-

cuit on the target board. In this way, the MPLAB ICE

emulator closely matches the oscillator options of the

actual device. All oscillator modes are supported (as

documented in the device’s data sheet) except as

noted in Section 4.0. The OSC1 and OSC2 inputs of

the Device Adapter have a 5 pF to 10 pF load. Note this

when using a crystal in HS, XT, LP or LF modes, or an

RC network in RC mode.

To minimize the amount of reverse current that the tar-

get system is exposed to, the recommended power-up

sequence is:

1. Apply power to the PC host.

2. Apply power to the Emulator Pod and Processor

Module assembly.

3. Invoke MPLAB IDE.

4. Configure system for Processor Power Supplied

by Target Board through the Power tab of the

Options/Development Mode dialog box.

The frequency of the emulated RC network may vary

relative to the actual device due to emulator circuitry. If

a specific frequency is important, adjust the RC values

to achieve the desired frequency. Another alternative

would be to allow the emulator to provide the clock as

described in Section 3.3.1.

5. At the error message, apply power to the target

application circuit. Then acknowledge the error.

6. Issue a System Reset (from the Debug Menu)

before proceeding.

7. Select Options > Development Mode and click

the Power tab. Verify that the dialog says “Low

Voltage Enabled.” Click Cancel to close the dia-

log.

3.4

ESD PROTECTION AND ELECTRICAL

OVERSTRESS

All CMOS chips are susceptible to electrostatic

discharge (ESD). In the case of the Processor Mod-

ules, the pins of the CMOS emulator are directly con-

nected to the target connector, making the chip

vulnerable to ESD. Note that ESD can also induce

 2001 Microchip Technology Inc.

DS51140D-page 3

MPLAB^®ICE

latch-up in CMOS chips, causing excessive current

through the chip and possible damage. MPLAB ICE

has been designed to minimize potential damage by

implementing over-current protection and transient

suppressors. However, care should be given to mini-

mizing ESD conditions while using the system.

4.0

EMULATOR-RELATED ISSUES

The following general limitations apply to the MPLAB

ICE 2000 Emulator.

• All configuration bit settings are enabled/disabled

through Options>Development Mode of MPLAB

IDE rather than through MPASM __CONFIG

directive.

During development, contention on an I/O pin is possi-

ble (e.g., when an emulator pin is driving a ‘1’ and the

target board is driving a ‘0’). Prolonged contention may

cause latch-up and damage to the emulator chip. One

possible precaution is to use current limiting resistors

(~100 Ω) during the development phase on

bidirectional I/O pins. Using limiting resistors can also

help avoid damage to modules, device adapters and

pods that occurs when a voltage source is accidentally

connected to an I/O pin on the target board.

• The Reset Processor (Debug>Run>Reset) func-

tion in MPLAB IDE will not currently wake the pro-

cessor if it is in SLEEP mode. To wake the

processor, you must use Debug>System Reset.

• Do not single step into a SLEEP instruction. If you

do step into a SLEEP instruction, you will need to

select Debug>System Reset in order to wake up

the processor module.

• Initiating a master clear on the MCLR pin will not

reset the processor if you are in step or animate

mode.

3.5

FREEZE MODE

The MPLAB ICE system allows the option of “freezing”

peripheral operation or allowing them to continue oper-

ating when the processor is halted. This option is con-

figured in the MPLAB IDE. The Freeze function is

available on all Processor Modules except the

PCM16XA0.

• Debug > Power On Reset randomizes GPRs,

(i.e., SFR's are not set to POR values). This can

help in debugging. If your application works on the

emulator but not the simulator, try using this fea-

ture.

Device-specific limitations can be found in MPLAB IDE

by selecting Options > Development Mode and clicking

the Details button.

This function is useful to halt an on-board timer while at

a break point. Note that at a break point and while sin-

gle stepping, interrupts are disabled.

DS51140D-page 4

 2001 Microchip Technology Inc.

Processor Module and Device Adapter Specification

switches. Target pins RB1 and RB2 can be routed to

the emulator silicon on the PCM16XE1 Processor Mod-

ule or the TIMER1 oscillator device on the Device

Adapter. Target pin RB1 is routed to T1CKI. Target pin

RB3 can be a general purpose input or CCP1, as

shown in Table 5-4.

5.0

DEVICE ADAPTER ISSUES

This section details processor-specific considerations

that have been made on Device Adapters. Only adapt-

ers with special considerations are listed.

There will be a max of 10 mA of current draw from the

users target system even when the emulator Processor

Module is being powered by the emulator system, and

running internal clock. This is due to components on

the Device Adapter being powered by the user target

board.

5.5

DVA16XP200

This Device Adapter is intended for use with

PIC16C770/771 20-pin DIP devices. It has three

mechanical switches that allow target pins RA6 and

RA7 to be routed to the emulator silicon on the

PCM16XM0 Processor Module or the oscillator device

on the Device Adapter. Target pin RA5 routed MCLR of

the emulator silicon on the PCM16XM0, as shown in

Table 5-5.

5.1

DVA12XP080

This Device Adapter is intended for use with

PIC12C50X 8-pin DIP devices. It has four mechanical

switches that allow target pins GP2 to GP5 to be routed

to the emulator silicon on the PCM16XA0 Processor

Module or the oscillator chip on the Device Adapter, as

shown in Table 5-1.

Target pins RB6 and RB7 can be routed (via software)

to the emulator silicon of the PCM16XM0 or to a sec-

ond oscillator supporting a TIMER1 oscillator input

ranging from 32 to 40 kHz.

In addition, a 24C00 EEPROM (U1) is connected to

RA0 and RA1 of the emulator silicon to support the

EEPROM capabilities of the PIC12CE51X family

devices. For information on how to use EEPROM

memory, see the online device-specific limitations for

the PCM16XA0, PIC12CE518/519 devices by select-

ing Options > Development Mode and clicking the

Details button.

5.6

DVA16XP282, DVA16XP401,

DVA16XL441, and DVA16PQ441

These Device Adapters are intended for use with PIC-

micro MCU devices supported by the PCM16XB0/B1,

PCM16XE0/E1, PCM16XK0, PCM16XL0, and the

PCM18XA0 Processor Modules. The Device Adapters

have a second oscillator device that allows TIMER1

oscillator input ranging from 32 to 40 kHz.

5.2

DVA12XP081

This Device Adapter is intended for use with

PIC12C67X 8-pin DIP devices. It has two mechanical

switches that allow target pins GP4 and GP5 to be

routed to the emulator silicon on the PCM12XA0 Pro-

cessor Module or the oscillator device on the Device

Adapter, as shown in Table 5-2.

For PCM16XB0/B1, PCM16XE0/E1, PCM16XK0 and

PCM16XL0, configure jumper J1 per Table 5-6.

For PCM18XA0 leave the jumper on pins 1-2 (OFF);

the timer1 oscillator enable/disable function is software

configurable.

5.7

DVA17xxxx0

5.3

DVA16XP140

These Device Adapters are intended for use with PIC-

micro MCU devices supported by the PCM17XA0 Pro-

cessor Module. In all processors in EC mode, OSC/4 is

not supported. OSC/4 in EC mode is supported in

DVA17xxxx1 Device Adapters.

This Device Adapter is intended for use with the

PIC16C505 14-pin DIP device. It has four mechanical

switches. Two of the switches allow target pins RB4

and RB5 to be routed to the emulator silicon on the

PCM16XA0 Processor Module or the oscillator device

on the Device Adapter. The other two switches control

the routing of RB3 and RC5 signals. RB3 can be a gen-

eral-purpose input or MCLR. RC5 can be a general

purpose I/O or can drive the TOCKI input, as shown in

Table 5-3.

5.8

Emulating a .600 28-Pin Part

When emulating a .600 wide, 28-pin device, an adapter

will be needed to convert the standard .300 wide

socket on the Device Adapters to the .600 wide socket

on the target board.

5.4

DVA16XP182

There are many adapters available for this purpose,

such as Digi-Key part number A502-ND.

This Device Adapter is intended for use with

PIC16C712/716 18-pin DIP devices. It has a second

oscillator device that allows TIMER1 oscillator input

ranging from 32-40 kHz. It has four mechanical

 2001 Microchip Technology Inc.

DS51140D-page 5

MPLAB^®ICE

TABLE 5-1:

DVA12XP080 DEVICE ADAPTER SWITCH ASSIGNMENT

Switch Positions

Desired Function

RB2

Set S4 to RB2.

Set S3 to RB3.

Set S2 to RB4.

Set S1 to RB5.

Set S3 to MCLR.

RB3

RB4

RB5

MCLR

External Oscillator Input

Set S1 to OSC1 and

set S2 to OSC2.

TIMER0 Clock Input

Set S4 to T0CLK.

TABLE 5-2:

DVA12XP081 DEVICE ADAPTER SWITCH ASSIGNMENT

Switch Positions

Desired Function

GP4

Set S2 to GP4.

Set S1 to GP5.

GP5

External Oscillator Input

Set S1 to OSC1 and

set S2 to OSC2.

TABLE 5-3:

DVA16XP140 DEVICE ADAPTER SWITCH ASSIGNMENT

Switch Positions

Desired Function

RC5

Set S4 to RC5.

Set S3 to RB3.

Set S2 to RB4.

Set S1 to RB5.

Set S3 to MCLR.

RB3

RB4

RB5

MCLR

External Oscillator Input

Set S1 to OSC1 and

set S2 to OSC2.

TIMER0 Clock Input

DS51140D-page 6

Set S4 to TOCKI.

 2001 Microchip Technology Inc.

Processor Module and Device Adapter Specification

TABLE 5-4:

DVA16XP182 DEVICE ADAPTER SWITCH ASSIGNMENT

Switch Positions

Desired Function

RB1

Set S2-1 to position B.

Set S2-2 to position B.

Set S2-3 to position B.

Set S2-3 to position A.

RB2

RB3

CCP1

TIMER1 Clock Input

Set S2-1 to position A and

set S1 to position B.

TIMER1 Oscillator Input

Set S2-1 to position A and

set S2-2 to position A and

set S1 to position A.

TABLE 5-5:

DVA16XP200 DEVICE ADAPTER SWITCH ASSIGNMENT

Switch Positions

Desired Function

RA5

Set S1 to RA5.

Set S3 to RA6.

Set S2 to RA7.

Set S1 to MCLR.

RA6

RA7

MCLR

External Oscillator Input

Set S3 to OSC1 and

set S2 to OSC2.

TABLE 5-6:

DVA16XP282, DVA16XP401, DVA16XL441, AND DVA16PQ441 JUMPER SETTINGS

Switch Positions

Desired Function

TIMER1 Oscillator Input enabled

TIMER1 Oscillator Input disabled

Short J1 pins 2-3 (ON).

Short J1 pins 1-2 (OFF).

 2001 Microchip Technology Inc.

DS51140D-page 7

MPLAB^®ICE

NOTES:

DS51140D-page 8

 2001 Microchip Technology Inc.

Processor Module and Device Adapter Specification

NOTES:

 2001 Microchip Technology Inc.

DS51140D-page 9

MPLAB^®ICE

NOTES:

DS51140D-page 10

 2001 Microchip Technology Inc.

Incorporated, USA. Information contained in this publication

regarding device applications and the like is intended through

suggestion only and may be superseded by updates. No rep-

resentation or warranty is given and no liability is assumed by

Microchip Technology Incorporated with respect to the accu-

racy or use of such information, or infringement of patents or

other intellectual property rights arising from such use or oth-

erwise. Use of Microchip’s products as critical components in

life support systems is not authorized except with express

written approval by Microchip. No licenses are conveyed,

implicitly or otherwise, under any intellectual property rights.

The Microchip logo and name are registered trademarks of

Microchip Technology Inc. in the U.S.A. and other countries.

the property of their respective companies. No licenses are

conveyed, implicitly or otherwise, under any intellectual prop-

erty rights.”

Trademarks

The Microchip name, logo, PIC, PICmicro, PICMASTER, PIC-

START, PRO MATE, KEELOQ, SEEVAL, MPLAB and The

Embedded Control Solutions Company are registered trade-

marks of Microchip Technology Incorporated in the U.S.A. and

other countries.

Total Endurance, In-Circuit Serial Programming (ICSP), Filter-

Lab, FlexROM, fuzzyLAB, ICEPIC, microID, MPASM, MPLIB,

MPLINK, MXDEV, PICDEM and Migratable Memory are

trademarks of Microchip Technology Incorporated in the

U.S.A.

Serialized Quick Term Programming (SQTP) is a service mark

of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Microchip received QS-9000 quality system

certification for its worldwide headquarters,

design and wafer fabrication facilities in

Chandler and Tempe, Arizona in July 1999. The

Company’s quality system processes and

procedures are QS-9000 compliant for its

PICmicro^®8-bit MCUs, KEELOQ^®code hopping

devices, Serial EEPROMs and microperipheral

products. In addition, Microchip’s quality

system for the design and manufacture of

development systems is ISO 9001 certified.

 2001 Microchip Technology Inc.

DS51140D-page 11

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Tel: 937-291-1654 Fax: 937-291-9175

India

Microchip Technology Inc.

India Liaison Office

Detroit

Tri-Atria Office Building

32255 Northwestern Highway, Suite 190

Farmington Hills, MI 48334

Tel: 248-538-2250 Fax: 248-538-2260

Divyasree Chambers

Italy

1 Floor, Wing A (A3/A4)

No. 11, O’Shaugnessey Road

Bangalore, 560 025, India

Tel: 91-80-2290061 Fax: 91-80-2290062

Arizona Microchip Technology SRL

Centro Direzionale Colleoni

Palazzo Taurus 1 V. Le Colleoni 1

20041 Agrate Brianza

Los Angeles

18201 Von Karman, Suite 1090

Irvine, CA 92612

Japan

Milan, Italy

Tel: 39-039-65791-1 Fax: 39-039-6899883

Microchip Technology Intl. Inc.

Benex S-1 6F

Tel: 949-263-1888 Fax: 949-263-1338

United Kingdom

Arizona Microchip Technology Ltd.

505 Eskdale Road

Winnersh Triangle

Wokingham

3-18-20, Shinyokohama

Kohoku-Ku, Yokohama-shi

Kanagawa, 222-0033, Japan

Tel: 81-45-471- 6166 Fax: 81-45-471-6122

Mountain View

Analog Product Sales

1300 Terra Bella Avenue

Mountain View, CA 94043-1836

Tel: 650-968-9241 Fax: 650-967-1590

Berkshire, England RG41 5TU

Tel: 44 118 921 5869 Fax: 44-118 921-5820

01/30/01

Printed on recycled paper.

Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by

updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is

assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual

property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with

express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, except as maybe explicitly expressed herein, under any intellec-

tual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights

reserved. All other trademarks mentioned herein are the property of their respective companies.

DS51140D-page 12

 2001 Microchip Technology Inc.

'ꢀꢁ"ꢂꢂ!ꢃꢀ'


型号：	PCM16XRO
厂家：	ETC
描述：	PIC16F870/871 PROG MODULE PIC16F870 / 871 PROG MODULE\n
文件：	总12页 (文件大小：214K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

PCM16XRO [ETC]

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