STP9NM60 [ETC]

N-CHANNEL 600V 0.55 OHM 8.3A TO-220/DPAK/IPAK ZENER-PROTECTED MDMESH POWER MOSFET ; N沟道600V 0.55 OHM 8.3A TO-220 / DPAK / IPAK齐纳保护的MDmesh功率MOSFET\n
STP9NM60
型号: STP9NM60
厂家: ETC    ETC
描述:

N-CHANNEL 600V 0.55 OHM 8.3A TO-220/DPAK/IPAK ZENER-PROTECTED MDMESH POWER MOSFET
N沟道600V 0.55 OHM 8.3A TO-220 / DPAK / IPAK齐纳保护的MDmesh功率MOSFET\n

晶体 晶体管 开关 脉冲 局域网
文件: 总9页 (文件大小:339K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
STP9NM60  
STD9NM60 - STD9NM60-1  
N-CHANNEL 600V - 0.55- 8.3A TO-220/DPAK/IPAK  
Zener-Protected MDmesh™Power MOSFET  
TARGET DATA  
TYPE  
V
R
I
D
Pw  
DSS  
DS(on)  
STP9NM60  
STD9NM60  
STD9NM60-1  
600 V < 0.60 8.3 A 100 W  
600 V < 0.60 8.3 A 100 W  
600 V < 0.60 8.3 A 100 W  
3
2
TYPICAL R (on) = 0.55  
DS  
1
HIGH dv/dt AND AVALANCHE CAPABILITIES  
IMPROVED ESD CAPABILITY  
LOW INPUT CAPACITANCE AND GATE  
CHARGE  
IPAK  
TO-220  
LOW GATE INPUT RESISTANCE  
TIGHT PROCESS CONTROL AND HIGH  
MANUFACTORING YIELDS  
3
1
DPAK  
DESCRIPTION  
The MDmesh™ is a new revolutionary MOSFET  
technology that associates the Multiple Drain pro-  
cess with the Company’s PowerMESH™ horizontal  
layout. The resulting product has an outstanding low  
on-resistance, impressively high dv/dt and excellent  
avalanche characteristics. The adoption of the  
Company’s proprietary strip technique yields overall  
dynamic performance that is significantly better than  
that of similar completition’s products.  
INTERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
The MDmesh™ family is very suitable for increase  
the power density of high voltage converters allow-  
ing system miniaturization and higher efficiencies.  
ORDERING INFORMATION  
SALES TYPE  
MARKING  
P9NM60  
D9NM60  
D9NM60  
PACKAGE  
TO-220  
DPAK  
PACKAGING  
TUBE  
STP9NM60  
STD9NM60T4  
STD9NM60-1  
TAPE & REEL  
TUBE  
IPAK  
June 2003  
1/9  
STP9NM60 / STD9NM60 / STD9NM60-1  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
600  
600  
± 30  
8.3  
Unit  
V
V
DS  
Drain-source Voltage (V = 0)  
GS  
V
Drain-gate Voltage (R = 20 k)  
V
DGR  
GS  
V
Gate-source Voltage  
V
GS  
I
Drain Current (continuous) at T = 25°C  
A
D
C
I
Drain Current (continuous) at T = 100°C  
5.2  
A
D
C
I
( )  
Drain Current (pulsed)  
33.2  
100  
0.8  
A
DM  
P
Total Dissipation at T = 25°C  
W
TOT  
C
Derating Factor  
W/°C  
V/ns  
dv/dt (1)  
Peak Diode Recovery voltage slope  
15  
T
T
stg  
Operating Junction Temperature  
Storage Temperature  
j
-65 to 150  
°C  
( ) Pulse width limited by safe operating area  
(1) I 7A, di/dt 400 µA, V V  
, T T  
j JMAX.  
SD  
DD  
(BR)DSS  
THERMAL DATA  
DPAK  
IPAK  
TO-220  
Rthj-case  
Rthj-amb  
Thermal Resistance Junction-case Max  
1.25  
300  
°C/W  
°C/W  
°C  
Thermal Resistance Junction-ambient Max  
Maximum Lead Temperature For Soldering Purpose  
62.5  
100  
T
l
AVALANCHE CHARACTERISTICS  
Symbol  
Parameter  
Max Value  
Unit  
I
Avalanche Current, Repetitive or Not-Repetitive  
3.5  
A
AR  
(pulse width limited by T max)  
j
E
Single Pulse Avalanche Energy  
TBD  
mJ  
AS  
(starting T = 25 °C, I = I , V = 50 V)  
j
D
AR  
DD  
GATE-SOURCE ZENER DIODE  
Symbol  
BV  
Parameter  
Test Conditions  
Igs=± 1mA (Open Drain)  
Min.  
Typ.  
Max.  
Unit  
Gate-Source Breakdown  
Voltage  
30  
V
GSO  
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES  
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s  
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be  
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and  
cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the  
usage of external components.  
2/9  
STP9NM60 / STD9NM60 / STD9NM60-1  
ELECTRICAL CHARACTERISTICS (T  
=25°C UNLESS OTHERWISE SPECIFIED)  
CASE  
ON/OFF  
Symbol  
Parameter  
Drain-source  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
I
= 250 µA, V = 0  
600  
V
(BR)DSS  
D
GS  
Breakdown Voltage  
I
Zero Gate Voltage  
V
V
= Max Rating  
DS  
1
10  
µA  
µA  
DSS  
Drain Current (V = 0)  
= Max Rating, T = 125 °C  
GS  
DS  
C
I
Gate-body Leakage  
V
= ± 20V  
±5  
µA  
GSS  
GS  
Current (V = 0)  
DS  
V
V
V
= V , I = 250µA  
Gate Threshold Voltage  
3
4
5
V
GS(th)  
DS  
GS  
GS  
D
R
Static Drain-source On  
Resistance  
= 10V, I = 3.5 A  
0.55  
0.60  
DS(on)  
D
DYNAMIC  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
g
(1)  
Forward Transconductance  
V
= 15 V I = 4.1 A  
TBD  
S
fs  
DS  
, D  
C
Input Capacitance  
Output Capacitance  
Reverse Transfer  
Capacitance  
V
= 25 V, f = 1 MHz, V = 0  
580  
160  
20  
pF  
pF  
pF  
iss  
DS  
GS  
C
oss  
C
rss  
SWITCHING ON  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
Turn-on Delay Time  
Rise Time  
V
R
= 300 V, I = 4.1 A  
= 4.7V = 10 V  
GS  
TBD  
TBD  
ns  
ns  
d(on)  
DD  
D
t
r
G
(Resistive Load see, Figure 3)  
Q
Q
Q
V
V
= 480 V, I = 8.3 A,  
= 10 V  
30  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
22  
TBD  
TBD  
nC  
nC  
nC  
g
DD  
GS  
D
gs  
gd  
SWITCHING OFF  
Symbol  
Parameter  
Test Conditions  
Min.  
Min.  
Typ.  
Max.  
Unit  
t
V
R
= 480 V, I = 8.3 A,  
r(Voff)  
Off-voltage Rise Time  
Fall Time  
Cross-over Time  
DD  
D
TBD  
TBD  
TBD  
ns  
ns  
ns  
t
f
= 4.7Ω, V = 10V  
G
GS  
t
c
(Inductive Load see, Figure 5)  
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Typ.  
Max.  
Unit  
I
TBD  
TBD  
A
A
Source-drain Current  
Source-drain Current (pulsed)  
SD  
(2)  
I
SDM  
V
(1)  
I
I
= 8.3 A, V = 0  
Forward On Voltage  
TBD  
V
SD  
SD  
SD  
GS  
t
= 8.3 A, di/dt = 100A/µs  
= 100 V, T = 25°C  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
TBD  
TBD  
TBD  
ns  
µC  
A
rr  
Q
V
DD  
rr  
j
I
(see test circuit, Figure 5)  
RRM  
t
Q
I
= 8.3 A, di/dt = 100A/µs  
= 100 V, T = 150°C  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
TBD  
TBD  
TBD  
ns  
µC  
A
rr  
SD  
V
DD  
rr  
j
I
(see test circuit, Figure 5)  
RRM  
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
2. Pulse width limited by safe operating area.  
3/9  
STP9NM60 / STD9NM60 / STD9NM60-1  
Fig. 1: Unclamped Inductive Load Test Circuit  
Fig. 2: Unclamped Inductive Waveform  
Fig. 3: Switching Times Test Circuit For  
Fig. 4: Gate Charge test Circuit  
Resistive Load  
Fig. 5: Test Circuit For Inductive Load Switching  
And Diode Recovery Times  
4/9  
STP9NM60 / STD9NM60 / STD9NM60-1  
TO-220 MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
4.40  
1.23  
2.40  
TYP.  
MAX.  
4.60  
1.32  
2.72  
MIN.  
0.173  
0.048  
0.094  
MAX.  
0.181  
0.051  
0.107  
A
C
D
D1  
E
1.27  
0.050  
0.49  
0.61  
1.14  
1.14  
4.95  
2.4  
0.70  
0.88  
1.70  
1.70  
5.15  
2.7  
0.019  
0.024  
0.044  
0.044  
0.194  
0.094  
0.393  
0.027  
0.034  
0.067  
0.067  
0.203  
0.106  
0.409  
F
F1  
F2  
G
G1  
H2  
L2  
L4  
L5  
L6  
L7  
L9  
DIA.  
10.0  
10.40  
16.4  
0.645  
13.0  
2.65  
15.25  
6.2  
14.0  
2.95  
15.75  
6.6  
0.511  
0.104  
0.600  
0.244  
0.137  
0.147  
0.551  
0.116  
0.620  
0.260  
0.154  
0.151  
3.5  
3.93  
3.85  
3.75  
L2  
Dia.  
L5  
L9  
L7  
L6  
L4  
P011C  
5/9  
STP9NM60 / STD9NM60 / STD9NM60-1  
TO-252 (DPAK) MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
2.20  
0.90  
0.03  
0.64  
5.20  
0.45  
0.48  
6.00  
6.40  
4.40  
9.35  
TYP.  
MAX.  
2.40  
1.10  
0.23  
0.90  
5.40  
0.60  
0.60  
6.20  
6.60  
4.60  
10.10  
MIN.  
0.087  
0.035  
0.001  
0.025  
0.204  
0.018  
0.019  
0.236  
0.252  
0.173  
0.368  
MAX.  
0.094  
0.043  
0.009  
0.035  
0.213  
0.024  
0.024  
0.244  
0.260  
0.181  
0.398  
A
A1  
A2  
B
B2  
C
C2  
D
E
G
H
L2  
L4  
V2  
0.8  
0.031  
0.60  
0o  
1.00  
8o  
0.024  
0o  
0.039  
0o  
P032P_B  
6/9  
STP9NM60 / STD9NM60 / STD9NM60-1  
TO-251 (IPAK) MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
2.2  
TYP.  
MAX.  
2.4  
MIN.  
0.086  
0.035  
0.027  
0.025  
0.204  
MAX.  
0.094  
0.043  
0.051  
0.031  
0.212  
0.033  
A
A1  
A3  
B
0.9  
1.1  
0.7  
1.3  
0.64  
5.2  
0.9  
B2  
B3  
B5  
B6  
C
5.4  
0.85  
0.3  
0.012  
0.95  
0.6  
0.6  
6.2  
6.6  
4.6  
16.3  
9.4  
1.2  
1
0.037  
0.023  
0.023  
0.244  
0.260  
0.181  
0.641  
0.370  
0.047  
0.039  
0.45  
0.48  
6
0.017  
0.019  
0.236  
0.252  
0.173  
0.626  
0.354  
0.031  
C2  
D
E
6.4  
4.4  
15.9  
9
G
H
L
L1  
L2  
0.8  
0.8  
0.031  
H
L
D
L2  
L1  
0068771-E  
7/9  
STP9NM60 / STD9NM60 / STD9NM60-1  
DPAK FOOTPRINT  
TUBE SHIPMENT (no suffix)*  
All dimensions  
are in millimeters  
All dimensions are in millimeters  
TAPE AND REEL SHIPMENT (suffix ”T4”)*  
REEL MECHANICAL DATA  
mm  
MIN. MAX. MIN. MAX.  
330 12.992  
inch  
DIM.  
A
B
C
D
G
N
T
1.5  
12.8  
20.2  
16.4  
50  
0.059  
13.2 0.504 0.520  
0.795  
18.4 0.645 0.724  
1.968  
22.4  
0.881  
BASE QTY  
BULK QTY  
2500  
TAPE MECHANICAL DATA  
2500  
mm  
MIN. MAX. MIN. MAX.  
6.8 0.267 0.275  
10.4 10.6 0.409 0.417  
12.1 0.476  
inch  
DIM.  
A0  
B0  
B1  
D
7
1.5  
1.5  
1.6 0.059 0.063  
0.059  
D1  
E
1.65 1.85 0.065 0.073  
7.4 7.6 0.291 0.299  
2.55 2.75 0.100 0.108  
F
K0  
P0  
P1  
P2  
R
3.9  
7.9  
1.9  
40  
4.1 0.153 0.161  
8.1 0.311 0.319  
2.1 0.075 0.082  
1.574  
W
15.7  
16.3 0.618 0.641  
* on sales type  
8/9  
STP9NM60 / STD9NM60 / STD9NM60-1  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the  
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from  
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications  
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information  
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or  
systems without express written approval of STMicroelectronics.  
© The ST logo is a registered trademark of STMicroelectronics  
© 2003 STMicroelectronics - Printed in Italy - All Rights Reserved  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco  
Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.  
© http://www.st.com  
9/9  

相关型号:

STP9NM60N

N-channel 600 V, 0.63 ohm, 6.5 A TO-220, TO-220FP, DPAK MDmesh ll Power MOSFET
STMICROELECTR

STPA001

power amplifiers moving to the green zone
ETC

STPA002

power amplifiers moving to the green zone
ETC

STPA008

4 x 50 W MOSFET quad bridge power amplifier
STMICROELECTR

STPA008-48X

4 x 50 W MOSFET quad bridge power amplifier
STMICROELECTR

STPA008-4WX

4 x 50 W MOSFET quad bridge power amplifier
STMICROELECTR

STPA008-QIX

4 x 50 W MOSFET quad bridge power amplifier
STMICROELECTR

STPA05FR

Rectifier Diode, 1 Phase, 2 Element, 14A, Silicon,
SENSITRON

STPA05HE

Rectifier Diode, 1 Phase, 2 Element, 20A, 50V V(RRM), Silicon, 436, 3 PIN
SENSITRON

STPA10

Rectifier Diode, 1 Phase, 2 Element, 17A, 1000V V(RRM), Silicon,
SENSITRON

STPA100

Rectifier Diode, 1 Phase, 2 Element, 17A, Silicon,
SENSITRON

STPA100FR

Rectifier Diode, 1 Phase, 2 Element, 12.6A, Silicon,
SENSITRON