STPS5L25B-TR [ETC]
LOW DROP POWER SCHOTTKY RECTIFIER ; 电力低压降肖特基整流器型号: | STPS5L25B-TR |
厂家: | ETC |
描述: | LOW DROP POWER SCHOTTKY RECTIFIER
|
文件: | 总4页 (文件大小:54K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
STPS5L25B
®
LOW DROP POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
2
IF(AV)
VRRM
5 A
4 (TAB)
3
25 V
Tj (max)
VF (max)
150°C
0.35 V
4
FEATURES AND BENEFITS
3
VERY LOW FORWARD VOLTAGE DROP FOR
LESS POWER DISSIPATION AND REDUCED
HEATSINK
2
1
NC
OPTIMIZED CONDUCTION/REVERSE LOSSES
TRADE-OFF WHICH MEANS THE HIGHEST
EFFICIENCY IN THE APPLICATIONS
HIGH POWER SURFACE MOUNT MINIATURE
PACKAGE
DPAK
AVALANCHE CAPABILITY SPECIFIED
DESCRIPTION
Single Schottky rectifier suited to Switched Mode
Power Supplies and high frequency DC to DC con-
verters.
This device is especially intended for use as a
Rectifier at the secondary of 3.3V SMPS units.
ABSOLUTE RATINGS (limiting values)
Symbol
Parameter
Repetitive peak reverse voltage
Value
Unit
V
VRRM
25
7
IF(RMS) RMS forward current
A
IF(AV)
IFSM
IRRM
IRSM
PARM
Tstg
Average forward current
Tc = 145°C δ = 0.5
5
A
Surge non repetitive forward current
Repetitive peak reverse current
Non repetitive peak reverse current
Repetitive peak avalanche power
Storage temperature range
tp = 10 ms Sinusoidal
75
1
A
tp=2 µs square F=1kHz
tp = 100 µs square
tp = 1µs Tj = 25°C
A
2
A
3000
W
°C
°C
V/µs
- 65 to + 150
150
Tj
Maximum operating junction temperature *
dV/dt
dPtot
Critical rate of rise of reverse voltage
1
10000
* :
<
thermal runaway condition for a diode on its own heatsink
dTj
Rth(j − a)
July 2003 - Ed: 5A
1/4
STPS5L25B
THERMAL RESISTANCES
Symbol
Parameter
Value
Unit
Rth(j-c)
Junction to case
2.5
°C/W
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Tests Conditions
Tests Conditions
Min. Typ. Max.
Unit
µA
mA
V
IR *
Reverse leakage current
Tj = 25°C
VR = VRRM
350
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
55
115
0.47
0.35
0.59
0.50
VF *
Forward voltage drop
IF = 5 A
IF = 5 A
IF = 10 A
IF = 10 A
0.31
0.41
Pulse test : * tp = 380 µs, δ < 2%
Fig. 1: Average forward power dissipation versus
average forward current.
Fig. 2: Average forward current versus ambient
temperature (δ=0.5).
PF(av)(W)
IF(av)(A)
6
2.5
δ = 0.2
δ = 0.1
δ = 0.5
Rth(j-a)=Rth(j-c)
5
2.0
1.5
1.0
0.5
0.0
δ = 0.05
4
δ = 1
Rth(j-a)=70°C/W
3
2
T
T
1
Tamb(°C)
tp
=tp/T
δ
tp
IF(av) (A)
=tp/T
δ
0
0
25
50
75
100
125
150
0
1
2
3
4
5
6
Fig. 3: Normalized avalanche power derating
versus pulse duration.
Fig. 4: Normalized avalanche power derating
versus junction temperature.
P
(t )
p
(1µs)
ARM
P
ARM
(t )
p
(25°C)
ARM
P
ARM
P
1
1.2
1
0.1
0.8
0.6
0.4
0.2
0
0.01
T (°C)
j
t (µs)
p
0.001
0
25
50
75
100
125
150
0.01
0.1
1
10
100
1000
2/4
STPS5L25B
Fig. 5: Non repetitive surge peak forward current
versus overload duration (maximum values).
Fig. 5: Relative variation of thermal impedance
junction to case versus pulse duration.
IM(A)
Zth(j-c)/Rth(j-c)
100
1.0
80
0.8
Tc=25°C
60
δ = 0.5
0.6
Tc=75°C
40
0.4
δ = 0.2
T
Tc=100°C
IM
20
Single pulse
0.2
δ = 0.1
t
t(s)
tp
=tp/T
δ
δ=0.5
tp(s)
0
0.0
1.0E-4
1E-3
1E-2
1E-1
1E+0
1.0E-3
1.0E-2
1.0E-1
1.0E+0
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values).
Fig. 8: Junction capacitance versus reverse
voltage applied (typical values).
IR(mA)
C(pF)
3E+2
Tj=150°C
1E+2
2000
F=1MHz
Tj=25°C
Tj=125°C
1E+1
1000
500
1E+0
1E-1
Tj=25°C
200
1E-2
VR(V)
VR(V)
100
1E-3
1
2
5
10
20
30
0
5
10
15
20
25
Fig. 9: Forward voltage drop versus forward
current (maximum values).
Fig. 10: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness: 35µm).
Rth(j-a) (°C/W)
IFM(A)
100.0
100
Typical values
Tj=150°C
80
60
40
20
0
10.0
Tj=125°C
Tj=25°C
1.0
VFM(V)
0
2
4
6
8
10
12
14
16
18
20
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
S(Cu) (cm²)
3/4
STPS5L25B
PACKAGE MECHANICAL DATA
DPAK
DIMENSIONS
Millimeters Inches
Min. Min.
REF.
Max
2.40
1.10
0.23
0.90
5.40
0.60
0.60
6.20
6.60
4.60
10.10
Max.
0.094
0.043
0.009
0.035
0.212
0.023
0.023
0.244
0.259
0.181
0.397
A
A1
A2
B
2.20
0.90
0.03
0.64
5.20
0.45
0.48
6.00
6.40
4.40
9.35
0.086
0.035
0.001
0.025
0.204
0.017
0.018
0.236
0.251
0.173
0.368
B2
C
C2
D
E
G
H
L2
L4
V2
0.80 typ.
0.031 typ.
0.60
0°
1.00
8°
0.023
0°
0.039
8°
FOOT PRINT DIMENSIONS (in millimeters)
6.7
6.7
3
3
1.6
1.6
2.3 2.3
Ordering type
STPS5L25B
Marking
Package
DPAK
Weight
0.30g
Base qty
75
Delivery mode
Tube
STPS5L25B
STPS5L25B
STPS15LB-TR
DPAK
0.30g
2500
Tape & reel
Epoxy meets UL94,V0
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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
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