74LVT245WM [FAIRCHILD]

Low Voltage Octal Bidirectional Transceiver with 3-STATE Inputs/Outputs; 低电压八路双向收发器3 -STATE输入/输出
74LVT245WM
型号: 74LVT245WM
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Low Voltage Octal Bidirectional Transceiver with 3-STATE Inputs/Outputs
低电压八路双向收发器3 -STATE输入/输出

总线驱动器 总线收发器 逻辑集成电路 光电二极管 信息通信管理
文件: 总8页 (文件大小:105K)
中文:  中文翻译
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November 1999  
Revised March 2005  
74LVT245 74LVTH245  
Low Voltage Octal Bidirectional Transceiver  
with 3-STATE Inputs/Outputs  
General Description  
Features  
Input and output interface capability to systems at  
The LVT245 and LVTH245 contain eight non-inverting bidi-  
rectional buffers with 3-STATE outputs and are intended for  
bus-oriented applications. The Transmit/Receive (T/R)  
input determines the direction of data flow through the bidi-  
rectional transceiver. Transmit (active-HIGH) enables data  
from A ports to B ports; Receive (active-LOW) enables  
data from B ports to A ports. The Output Enable input,  
when HIGH, disables both A and B ports by placing them in  
a HIGH Z condition.  
5V VCC  
Bushold data inputs eliminate the need for external  
pull-up resistors to hold unused inputs (74LVTH245),  
also available without bushold feature (74LVT245)  
Live insertion/extraction permitted  
Power Up/Down high impedance provides glitch-free  
bus loading  
Outputs source/sink, 32 mA/ 64 mA  
Latch-up performance exceeds 500 mA  
ESD performance:  
The LVTH245 data inputs include bushold, eliminating the  
need for external pull-up resistors to hold unused inputs.  
These transceivers are designed for low-voltage (3.3V)  
VCC applications, but with the capability to provide a TTL  
Human-body model 2000V  
Machine model 200V  
interface to a 5V environment. The LVT245 and LVTH245  
are fabricated with an advanced BiCMOS technology to  
achieve high speed operation similar to 5V ABT while  
maintaining a low power dissipation.  
Charged-device model 1000V  
Ordering Code:  
Package  
Order Number  
Package Description  
Number  
74LVT245WM  
74LVT245SJ  
M20B  
M20D  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
74LVT245MSA  
74LVT245MTC  
MSA20  
MTC20  
MTC20  
74LVT245MTCX_NL  
(Note 1)  
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
Wide  
74LVTH245WM  
74LVTH245SJ  
M20B  
M20D  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
74LVTH245MSA  
74LVTH245MTC  
MSA20  
MTC20  
MTC20  
74LVTH245MTCX_NL  
(Note 1)  
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
Wide  
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.  
Pb-Free package per JEDEC J-STD-020B.  
Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.  
© 2005 Fairchild Semiconductor Corporation  
DS500203  
www.fairchildsemi.com  
Logic Symbols  
Pin Descriptions  
Pin Names  
Description  
Output Enable Input  
Transmit/Receive Input  
OE  
T/R  
A0A7  
B0B7  
Side A Inputs or 3-STATE Outputs  
Side B Inputs or 3-STATE Outputs  
IEEE/IEC  
Truth Table  
Inputs  
Outputs  
OE  
L
T/R  
L
Bus B Data to Bus A  
Bus A Data to Bus B  
HIGH-Z State  
L
H
H
X
H
L
X
HIGH Voltage Level  
LOW Voltage Level  
Immaterial  
Connection Diagram  
www.fairchildsemi.com  
2
Absolute Maximum Ratings(Note 2)  
Symbol  
VCC  
Parameter  
Supply Voltage  
Value  
0.5 to 4.6  
0.5 to 7.0  
0.5 to 7.0  
0.5 to 7.0  
50  
Conditions  
Units  
V
VI  
DC Input Voltage  
Output Voltage  
V
VO  
Output in 3-STATE  
V
Output in HIGH or LOW State (Note 3)  
VI GND  
V
IIK  
IOK  
IO  
DC Input Diode Current  
DC Output Diode Current  
DC Output Current  
mA  
mA  
50  
VO GND  
64  
VO VCC Output at HIGH State  
VO VCC Output at LOW State  
mA  
128  
ICC  
DC Supply Current per Supply Pin  
DC Ground Current per Ground Pin  
Storage Temperature  
64  
mA  
mA  
C
IGND  
TSTG  
128  
65 to 150  
Recommended Operating Conditions  
Symbol  
VCC  
Parameter  
Min  
2.7  
0
Max  
3.6  
5.5  
32  
Units  
Supply Voltage  
V
V
VI  
Input Voltage  
IOH  
IOL  
TA  
High-Level Output Current  
Low-Level Output Current  
mA  
mA  
C
64  
Free Air Operating Temperature  
40  
0
85  
t/ V  
Input Edge Rate, VIN 0.8V2.0V, VCC 3.0V  
10  
ns/V  
Note 2: Absolute Maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions  
beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum rated conditions is not implied.  
Note 3: I Absolute Maximum Rating must be observed.  
O
DC Electrical Characteristics  
V
T
40 C to 85 C  
CC  
A
Symbol  
Parameter  
Units  
Conditions  
(V)  
2.7  
Min  
Max  
V
V
V
V
Input Clamp Diode Voltage  
Input HIGH Voltage  
1.2  
V
V
I
18 mA  
0.1V or  
IK  
I
2.73.6  
2.73.6  
2.73.6  
2.7  
2.0  
V
V
IH  
O
Input LOW Voltage  
0.8  
V
0.1V  
A
IL  
O
CC  
Output HIGH Voltage  
V
- 0.2  
V
V
V
V
V
V
V
V
A
A
A
A
A
A
A
A
A
I
I
I
I
I
I
I
I
100  
OH  
CC  
OH  
OH  
OH  
OL  
OL  
OL  
OL  
OL  
2.4  
2.0  
8 mA  
3.0  
32 mA  
V
Output LOW Voltage  
2.7  
0.2  
0.5  
100 A  
OL  
2.7  
24 mA  
16 mA  
32 mA  
64 mA  
0.8V  
3.0  
0.4  
3.0  
0.5  
3.0  
0.55  
I
Bushold Input Minimum Drive  
3.0  
75  
75  
V
V
I(HOLD)  
I
(Note 4)  
2.0V  
I
I
Bushold Input Over-Drive  
Current to Change State  
Input Current  
3.0  
500  
(Note 5)  
(Note 6)  
I(OD)  
(Note 4)  
500  
I
3.6  
3.6  
3.6  
10  
1
V
V
V
V
5.5V  
0V or V  
0V  
I
I
I
I
I
Control Pins  
Data Pins  
CC  
5
1
V
CC  
I
I
Power Off Leakage Current  
Power Up/Down  
0
100  
0V V or V  
5.5V  
OFF  
I
O
V
V
V
V
V
0.5V to V  
CC  
PU/PD  
O
I
01.5V  
100  
A
3-STATE Current  
GND to V  
0.5V  
CC  
I
I
I
3-STATE Output Leakage Current  
3.6  
3.6  
3.6  
5
5
A
A
A
OZL  
O
O
O
(Note 4) 3-STATE Output Leakage Current  
3-STATE Output Leakage Current  
0.0V  
OZL  
OZH  
5
3.0V  
3
www.fairchildsemi.com  
DC Electrical Characteristics (Continued)  
V
T
40 C to 85 C  
CC  
A
Symbol  
Parameter  
Units  
Conditions  
(V)  
3.6  
3.6  
3.6  
3.6  
3.6  
Min  
Max  
5
I
I
I
I
I
I
(Note 4) 3-STATE Output Leakage Current  
3-STATE Output Leakage Current  
Power Supply Current  
A
A
V
V
3.6V  
OZH  
OZH  
CCH  
CCL  
CCZ  
CCZ  
O
10  
V
5.5V  
CC  
O
0.19  
5
mA  
mA  
mA  
Outputs HIGH  
Outputs LOW  
Power Supply Current  
Power Supply Current  
0.19  
Outputs Disabled  
Power Supply Current  
V
V
5.5V,  
Outputs Disabled  
One Input at V  
CC  
O
3.6  
3.6  
0.19  
0.2  
mA  
mA  
I
Increase in Power Supply Current  
(Note 7)  
0.6V  
CC  
CC  
Other Inputs at V or GND  
CC  
Note 4: Applies to Bushold versions only (LVTH245).  
Note 5: An external driver must source at least the specified current to switch from LOW-to-HIGH.  
Note 6: An external driver must sink at least the specified current to switch from HIGH-to-LOW.  
Note 7: This is the increase in supply current for each input that is at the specified voltage level rather than V or GND.  
CC  
Dynamic Switching Characteristics (Note 8)  
V
T
25 C  
Typ  
Conditions  
CC  
A
Symbol  
Parameter  
Units  
C
50 pF, R  
500  
(V)  
3.3  
3.3  
Min  
Max  
L
L
V
V
Quiet Output Maximum Dynamic V  
0.8  
0.8  
V
V
(Note 9)  
(Note 9)  
OLP  
OL  
Quiet Output Minimum Dynamic V  
OLV  
OL  
Note 8: Characterized in SOIC package. Guaranteed parameter, but not tested.  
Note 9: Max number of outputs defined as (n). n 1 data inputs are driven 0V to 3V. Output under test held LOW.  
AC Electrical Characteristics  
T
40 C to 85 C  
50 pF, R 500  
A
C
L
L
Symbol  
Parameter  
Units  
V
3.3V 0.3V  
V
2.7V  
Max  
CC  
CC  
Min  
1.2  
1.2  
1.3  
1.7  
2.0  
2.0  
Max  
3.6  
3.5  
5.5  
5.7  
5.9  
5.0  
Min  
1.2  
1.2  
1.3  
1.7  
2.0  
2.0  
t
Propagation Delay  
Output Enable Time  
Output Disable  
4.0  
4.0  
7.1  
6.7  
6.5  
5.1  
PLH  
ns  
ns  
ns  
ns  
t
PHL  
t
PZH  
t
PZL  
t
PHZ  
t
PLZ  
t
Output to Output Skew  
(Note 10)  
OSHL  
1.0  
1.0  
t
OSLH  
Note 10: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The  
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (t  
) or LOW-to-HIGH (t  
).  
OSLH  
OSHL  
Capacitance (Note 11)  
Symbol  
Parameter  
Input Capacitance  
Input/Output Capacitance  
Conditions  
Typical  
Units  
pF  
C
V
V
0V, V 0V or V  
4
8
IN  
CC  
CC  
I
CC  
C
3.0V, V  
0V or V  
CC  
pF  
I/O  
O
Note 11: Capacitance is measured at frequency f 1 MHz, per MIL-STD-883, Method 3012.  
www.fairchildsemi.com  
4
Physical Dimensions inches (millimeters) unless otherwise noted  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
Package Number M20B  
5
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
Package Number M20D  
www.fairchildsemi.com  
6
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide  
Package Number MSA20  
7
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
Package Number MTC20  
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and  
Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
www.fairchildsemi.com  
8

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