74LVTH16500MTD [FAIRCHILD]

Low Voltage 18-Bit Universal Bus Transceivers with 3-STATE Outputs Preliminary; 低电压18位通用总线收发器与3态输出的初步
74LVTH16500MTD
型号: 74LVTH16500MTD
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Low Voltage 18-Bit Universal Bus Transceivers with 3-STATE Outputs Preliminary
低电压18位通用总线收发器与3态输出的初步

总线驱动器 总线收发器 触发器 逻辑集成电路 光电二极管 信息通信管理
文件: 总7页 (文件大小:70K)
中文:  中文翻译
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Preliminary  
May 2000  
Revised May 2000  
74LVTH16500  
Low Voltage 18-Bit Universal Bus Transceivers  
with 3-STATE Outputs (Preliminary)  
General Description  
The LVTH16500 is an 18-bit universal bus transceiver  
combining D-type latches and D-type flip-flops to allow  
data flow in transparent, latched, and clocked modes.  
Features  
Input and output interface capability to systems at  
5V VCC  
Bushold data inputs eliminate the need for external  
Data flow in each direction is controlled by output-enable  
(OEAB and OEBA), latch-enable (LEAB and LEBA), and  
clock (CLKAB and CLKBA) inputs.  
pull-up resistors to hold unused inputs  
Live insertion/extraction permitted  
Power Up/Down high impedance provides glitch-free  
bus loading  
The LVTH16500 data inputs include bushold, eliminating  
the need for external pull-up resistors to hold unused  
inputs.  
Outputs source/sink 32 mA/+64 mA  
Functionally compatible with the 74 series 16500  
Latch-up performance exceeds 500 mA  
The transceiver is designed for low voltage (3.3V) VCC  
applications, but with the capability to provide a TTL inter-  
face to a 5V environment. The LVTH16500 is fabricated  
with an advanced BiCMOS technology to achieve high  
speed operation similar to 5V ABT while maintaining low  
power dissipation.  
Ordering Code:  
Order Number  
74LVTH16500MEA  
74LVTH16500MTD  
Package Number  
MS56A  
Package Description  
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300 Wide  
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
MTD56  
Devices also available in Tape and Reel. Specify by appending the suffix “X” to the ordering code.  
© 2000 Fairchild Semiconductor Corporation  
DS012447  
www.fairchildsemi.com  
Preliminary  
Connection Diagram  
Pin Descriptions  
Pin Names  
Description  
A1A18  
B1B18  
Data Register A Inputs/3-STATE Outputs  
Data Register B Inputs/3-STATE Outputs  
CLKAB, CLKBA Clock Pulse Inputs  
LEAB, LEBA  
OEAB, OEBA  
Latch Enable Inputs  
Output Enable Inputs  
Function Table (Note 1)  
Inputs  
Output  
B
OEAB  
LEAB  
CLKAB  
A
X
L
L
X
H
H
L
X
X
X
Z
H
H
H
H
H
H
L
H
L
H
L
L
H
X
X
H
L
H
L
B
0 (Note 2)  
L
B0 (Note 3)  
H = HIGH Voltage Level  
X = Immaterial  
L = LOW Voltage Level  
Z = High Impedance  
↓ = HIGH-to-LOW Clock Transition  
Note 1: A-to-B data flow is shown: B-to-A flow is similar but uses OEBA,  
LEBA, and CLKBA.  
Note 2: Output level before the indicated steady-state input conditions  
were established.  
Note 3: Output level before the indicated steady-state input conditions  
were established, provided that CLKAB was LOW before LEAB went LOW.  
Functional Description  
For A-to-B data flow, the device operates in the transparent  
mode when LEAB is HIGH. When LEAB is LOW, the A  
data is latched if CLKAB is held at a HIGH or LOW logic  
level. If LEAB is LOW, the A bus data is stored in the latch/  
flip-flop on the HIGH-to-LOW transition of CLKAB. Output-  
enable OEAB is active-HIGH. When OEAB is HIGH, the  
outputs are active. When OEAB is LOW, the outputs are in  
the high-impedance state.  
Data flow for B-to-A is similar to that of A-to-B but uses  
OEBA, LEBA, and CLKBA. The output enables are com-  
plementary (OEAB is active-HIGH and OEBA is active-  
LOW).  
Logic Diagram  
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2
Preliminary  
Absolute Maximum Ratings(Note 4)  
Symbol  
VCC  
Parameter  
Supply Voltage  
Value  
Conditions  
Units  
0.5 to +4.6  
0.5 to +7.0  
V
V
V
VI  
DC Input Voltage  
VO  
DC Output Voltage  
0.5 to +7.0 Output in 3-STATE  
0.5 to +7.0 Output in HIGH or LOW State (Note 5)  
V
IIK  
IOK  
IO  
DC Input Diode Current  
DC Output Diode Current  
DC Output Current  
50  
50  
VI < GND  
mA  
mA  
V
V
V
O < GND  
64  
O > VCC Output at HIGH State  
O > VCC Output at LOW State  
mA  
128  
ICC  
DC Supply Current per Supply Pin  
DC Ground Current per Ground Pin  
Storage Temperature  
±64  
mA  
mA  
°C  
IGND  
TSTG  
±128  
65 to +150  
Recommended Operating Conditions  
Symbol  
VCC  
Parameter  
Min  
2.7  
0
Max  
Units  
V
Supply Voltage  
3.6  
5.5  
32  
64  
VI  
Input Voltage  
V
IOH  
IOL  
TA  
HIGH-Level Output Current  
LOW-Level Output Current  
mA  
mA  
°C  
Free-Air Operating Temperature  
40  
85  
t/V  
Input Edge Rate, VIN = 0.8V 2.0V, VCC = 3.0V  
0
10  
ns/V  
Note 4: Absolute Maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions  
beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum rated conditions is not implied.  
Note 5: IO Absolute Maximum Rating must be observed.  
3
www.fairchildsemi.com  
Preliminary  
DC Electrical Characteristics  
VCC  
T A = −40°C to +85°C  
Symbol  
Parameter  
Units  
Conditions  
(V)  
2.7  
Min  
Max  
VIK  
Input Clamp Diode Voltage  
Input HIGH Voltage  
1.2  
V
V
II = −18 mA  
VIH  
VIL  
2.73.6  
2.73.6  
2.73.6  
2.7  
2.0  
V
O 0.1V or  
O VCC 0.1V  
Input LOW Voltage  
0.8  
V
VOH  
Output HIGH Voltage  
V
CC 0.2  
V
V
I
I
I
I
I
I
I
I
OH = −100 µA  
OH = −8 mA  
OH = −32 mA  
OL = 100 µA  
OL = 24 mA  
OL = 16 mA  
OL = 32 mA  
OL = 64 mA  
2.4  
3.0  
2.0  
V
VOL  
Output LOW Voltage  
2.7  
0.2  
0.5  
V
2.7  
V
3.0  
0.4  
V
3.0  
0.5  
V
3.0  
0.55  
V
II(HOLD)  
II(OD)  
II  
Bushold Input Minimum Drive  
3.0  
75  
75  
500  
500  
µA  
µA  
µA  
µA  
µA  
µA  
µA  
µA  
µA  
VI = 0.8V  
VI = 2.0V  
Bushold Input Over-Drive  
Current to Change State  
3.0  
(Note 6)  
(Note 7)  
Input Current  
3.6  
3.6  
3.6  
10  
±1  
VI = 5.5V  
Control Pins  
Data Pins  
VI = 0V or VCC  
VI = 0V  
5  
1
VI = VCC  
IOFF  
Power Off Leakage Current  
Power Up/Down 3-STATE  
Output Current  
0
±100  
0V VI or VO 5.5V  
IPU/PD  
VO = 0.5V to 3.0V  
01.5V  
±100  
µA  
VI = GND or VCC  
IOZL  
IOZH  
IOZH  
3-STATE Output Leakage Current  
3-STATE Output Leakage Current  
3-STATE Output Leakage Current  
Power Supply Current  
3.6  
3.6  
3.6  
3.6  
3.6  
3.6  
3.6  
5  
5
µA  
µA  
V
V
V
O = 0.0V  
O = 3.6V  
+
10  
µA  
CC < VO 5.5V  
ICCH  
ICCL  
ICCZ  
0.19  
5
mA  
mA  
mA  
mA  
Outputs HIGH  
Outputs LOW  
Power Supply Current  
Power Supply Current  
0.19  
0.19  
Outputs Disabled  
ICCZ  
+
Power Supply Current  
VCC VO 5.5V,  
Outputs Disabled  
ICC  
Increase in Power Supply Current  
(Note 8)  
3.6  
0.2  
mA  
One Input at VCC 0.6V  
Other Inputs at VCC or GND  
Note 6: An external driver must source at least the specified current to switch from LOW-to-HIGH.  
Note 7: An external driver must sink at least the specified current to switch from HIGH-to-LOW.  
Note 8: This is the increase in supply current for each input that is at the specified voltage level rather than VCC or GND.  
Dynamic Switching Characteristics (Note 9)  
VCC  
T
A = 25°C  
Conditions  
Symbol  
Parameter  
Units  
C
L = 50 pF, RL = 500Ω  
(V)  
3.3  
3.3  
Min  
Typ  
0.8  
Max  
VOLP  
VOLV  
Quiet Output Maximum Dynamic VOL  
Quiet Output Minimum Dynamic VOL  
V
V
(Note 10)  
(Note 10)  
0.8  
Note 9: Characterized in SSOP package. Guaranteed parameter, but not tested.  
Note 10: Max number of outputs defined as (n). n1 data inputs are driven 0V to 3V. Output under test held LOW.  
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4
Preliminary  
AC Electrical Characteristics  
TA = −40°C to +85°C, CL = 50 pF, RL = 500 Ω  
Symbol  
Parameter  
VCC = 3.3 ± 0.3V  
VCC = 2.7V  
Units  
Min  
150  
1.3  
1.3  
1.5  
1.5  
1.3  
1.3  
1.3  
1.3  
1.7  
1.7  
Max  
Min  
150  
1.3  
1.3  
1.5  
1.5  
1.3  
1.3  
1.3  
1.3  
1.7  
1.7  
Max  
fMAX  
MHz  
ns  
tPLH  
tPHL  
tPLH  
tPHL  
tPLH  
tPHL  
tPZH  
tPZL  
tPHZ  
tPLZ  
Propagation Delay  
3.7  
3.7  
5.1  
5.1  
5.0  
5.0  
4.8  
4.8  
5.8  
5.8  
4.0  
4.0  
5.7  
5.7  
5.9  
5.9  
5.5  
5.5  
6.3  
6.3  
Data to Outputs  
Propagation Delay  
ns  
ns  
ns  
ns  
LEBA or LEAB to B or A  
Propagation Delay  
CLKBA or CLKAB to B or A  
Output Enable Time  
Output Disable Time  
Setup Time  
tSU  
A before CLKAB  
B before CLKBA  
2.9  
2.9  
1.4  
2.9  
2.9  
2.9  
0.5  
2.3  
ns  
A or B before LE, CLK HIGH  
A or B before LE, CLK LOW  
tH  
Hold Time  
A or B after CLK  
A or B after LE  
LE HIGH  
0.4  
1.6  
3.3  
0.4  
1.6  
3.3  
ns  
ns  
ns  
tW  
Pulse Duration  
CLK HIGH or LOW  
3.3  
3.3  
tOSLH  
tOSHL  
Output to Output Skew (Note 11)  
1.0  
1.0  
1.0  
1.0  
Note 11: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The  
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH).  
Capacitance (Note 12)  
Symbol  
CIN  
CI/O  
Parameter  
Input Capacitance  
Input/Output Capacitance  
Conditions  
CC = 0V, VI = 0V or VCC  
CC = 3.0V, VO = 0V or VCC  
Typical  
Units  
pF  
V
V
4
8
pF  
Note 12: Capacitance is measured at frequency f = 1 MHz, per MIL-STD-883, Method 3012.  
5
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Preliminary  
Physical Dimensions inches (millimeters) unless otherwise noted  
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300 Wide  
Package Number MS56A  
www.fairchildsemi.com  
6
Preliminary  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Package Number MTD56  
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and  
Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
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7
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