74LVTH273SJ [FAIRCHILD]

Low Voltage Octal D-Type Flip-Flop with Clear; 低电压八路D型触发器与Clear
74LVTH273SJ
型号: 74LVTH273SJ
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Low Voltage Octal D-Type Flip-Flop with Clear
低电压八路D型触发器与Clear

触发器 锁存器 逻辑集成电路 光电二极管 信息通信管理
文件: 总7页 (文件大小:98K)
中文:  中文翻译
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July 1999  
Revised March 2005  
74LVTH273  
Low Voltage Octal D-Type Flip-Flop with Clear  
General Description  
Features  
The LVTH273 is a high-speed, low-power positive-edge-  
triggered octal D-type flip-flop featuring separate D-type  
inputs for each flip-flop. A buffered Clock (CP) and Clear  
(CLR) are common to all flip-flops.  
Input and output interface capability to systems at  
5V VCC  
Bushold on the data inputs eliminate the need for  
external pull-up resistors to hold unused inputs  
The state of each D-type input, one setup time before the  
positive clock transition, is transferred to the corresponding  
flip-flop’s output.  
Outputs source/sink 32 mA/ 64 mA  
Functionally compatible with the 74 series 273  
Latch-up performance exceeds 500 mA  
ESD performance:  
The LVTH273 data inputs include bushold, eliminating the  
need for external pull-up resistors to hold unused inputs.  
Human-body model 2000V  
These octal flip-flops are designed for low-voltage (3.3V)  
VCC applications, but with the capability to provide a TTL  
Machine model 200V  
interface to a 5V environment. The LVTH273 is fabricated  
with an advanced BiCMOS technology to achieve high  
speed operation similar to 5V ABT while maintaining low  
power dissipation.  
Charged-device model 1000V  
Ordering Code:  
Package  
Order Number  
Package Description  
Number  
74LVTH273WM  
74LVTH273SJ  
74LVTH273MTC  
M20B  
M20D  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
MTC20  
MTC20  
74LVTH273MTCX_NL  
(Note 1)  
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
Wide  
Device also available in Tape and Reel. Specify by appending suffix letter Xto the ordering code.  
Pb-Free package per JEDEC J-STD-020B.  
Note 1: _NLindicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.  
Logic Symbols  
IEEE/IEC  
© 2005 Fairchild Semiconductor Corporation  
DS500100  
www.fairchildsemi.com  
Connection Diagram  
Pin Descriptions  
Pin Names  
Description  
Data Inputs  
D0D7  
CP  
Clock Pulse Input  
Clear  
CLR  
O0O7  
Outputs  
Truth Table  
Inputs  
Outputs  
Dn  
H
L
CP  
CLR  
H
On  
H
H
L
X
H or L  
X
H
Oo  
L
X
L
H
L
X
HIGH Voltage Level  
LOW Voltage Level  
Immaterial  
LOW-to-HIGH Transition  
Previous O before HIGH-to-LOW of CP  
O
o
o
Functional Description  
The LVTH273 consists of eight positive-edge-triggered flip-flops with individual D-type inputs. The buffered Clock and Clear  
are common to all flip-flops. The eight flip-flops will store the state of their individual D-type inputs that meet the setup and  
hold time requirements on the LOW-to-HIGH Clock (CP) transition. When the Clock is either HIGH or LOW, the D-input sig-  
nal has no effect at the output. When the Clear (CLR) is LOW, all Outputs will be forced LOW.  
Logic Diagram  
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.  
www.fairchildsemi.com  
2
Absolute Maximum Ratings(Note 2)  
Symbol  
VCC  
Parameter  
Supply Voltage  
Value  
0.5 to 4.6  
0.5 to 7.0  
0.5 to 7.0  
50  
Conditions  
Units  
V
VI  
DC Input Voltage  
V
VO  
IIK  
IOK  
IO  
DC Output Voltage  
Output in HIGH or LOW State (Note 3)  
VI GND  
V
DC Input Diode Current  
DC Output Diode Current  
DC Output Current  
mA  
mA  
50  
VO GND  
64  
VO VCC Output at HIGH State  
VO VCC Output at LOW State  
mA  
128  
ICC  
DC Supply Current per Supply Pin  
DC Ground Current per Ground Pin  
Storage Temperature  
64  
mA  
mA  
C
IGND  
TSTG  
128  
65 to 150  
Recommended Operating Conditions  
Symbol  
VCC  
Parameter  
Min  
2.7  
0
Max  
3.6  
5.5  
32  
Units  
Supply Voltage  
V
V
VI  
Input Voltage  
IOH  
IOL  
TA  
HIGH Level Output Current  
LOW Level Output Current  
mA  
mA  
C
64  
Free-Air Operating Temperature  
40  
0
85  
t/ V  
Input Edge Rate, VIN 0.8V2.0V, VCC 3.0V  
10  
ns/V  
Note 2: Absolute Maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions  
beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum rated conditions is not implied.  
Note 3: I Absolute Maximum Rating must be observed.  
O
DC Electrical Characteristics  
T
40 C to 85 C  
A
V
(V)  
CC  
Symbol  
Parameter  
Units  
Conditions  
Min  
Typ  
Max  
(Note 4)  
V
Input Clamp Diode Voltage  
Input HIGH Voltage  
2.7  
2.73.6  
2.73.6  
2.73.6  
2.7  
1.2  
0.8  
V
V
V
I
18 mA  
0.1V or  
IK  
I
V
V
V
2.0  
V
V
IH  
IL  
O
Input LOW Voltage  
V
0.1V  
A
O
CC  
Output HIGH Voltage  
V
0.2  
I
I
I
I
I
I
I
I
100  
OH  
CC  
OH  
OH  
OH  
OL  
OL  
OL  
OL  
OL  
2.4  
2.0  
V
8 mA  
3.0  
32 mA  
V
Output LOW Voltage  
2.7  
0.2  
0.5  
100 A  
OL  
2.7  
24 mA  
16 mA  
32 mA  
64 mA  
0.8V  
3.0  
0.4  
V
3.0  
0.5  
3.0  
0.55  
I
Bushold Input Minimum Drive  
3.0  
75  
75  
V
V
I(HOLD)  
I
I
A
A
2.0V  
I
Bushold Input Over-Drive  
Current to Change State  
Input Current  
3.0  
500  
500  
(Note 5)  
(Note 6)  
I(OD)  
I
3.6  
3.6  
10  
1
A
A
V
V
V
V
5.5V  
0V or V  
0V  
I
I
I
I
I
Control Pins  
Data Pins  
CC  
5
A
3.6  
1
A
V
CC  
I
Power Off Leakage Current  
Power Supply Current  
Power Supply Current  
0
100  
0.19  
5
A
0V V or V  
5.5V  
OFF  
I
O
I
3.6  
3.6  
3.6  
mA  
mA  
mA  
Outputs HIGH  
Outputs LOW  
One Input at V  
CCH  
I
CCL  
I
Increase in Power Supply Current  
(Note 7)  
0.2  
0.6V  
CC  
CC  
Other Inputs at V or GND  
CC  
Note 4: All typical values are at V  
3.3V, T  
25 C.  
CC  
A
3
www.fairchildsemi.com  
DC Electrical Characteristics (Continued)  
Note 5: An external driver must source at least the specified current to switch from LOW-to-HIGH.  
Note 6: An external driver must sink at least the specified current to switch from HIGH-to-LOW.  
Note 7: This is the increase in supply current for each input that is at the specified voltage level rather than V or GND.  
CC  
Dynamic Switching Characteristics (Note 8)  
T
25 C  
Typ  
Conditions  
A
V
(V)  
CC  
Symbol  
Parameter  
Units  
C
50 pF, R  
L
500  
Min  
Max  
L
V
V
Quiet Output Maximum Dynamic V  
3.3  
3.3  
0.8  
0.8  
V
V
(Note 9)  
(Note 9)  
OLP  
OL  
Quiet Output Minimum Dynamic V  
OLV  
OL  
Note 8: Characterized in SOIC package. Guaranteed parameter, but not tested.  
Note 9: Max number of outputs defined as (n). n 1 data inputs are driven 0V to 3V. Output under test held LOW.  
AC Electrical Characteristics  
T
40 C to 85 C  
50 pF, R 500  
A
C
L
L
Symbol  
Parameter  
Units  
V
3.3V 0.3V  
V
2.7V  
CC  
CC  
Min  
Typ  
Max  
Min  
Max  
(Note 10)  
f
t
t
Maximum Clock Frequency  
Propagation Delay  
CP to O  
150  
1.7  
1.9  
150  
1.7  
1.9  
MHz  
ns  
MAX  
4.9  
4.8  
5.5  
5.1  
PLH  
PHL  
n
t
t
t
Propagation Delay CLR to O  
Pulse Duration  
1.6  
3.3  
2.3  
2.3  
0
4.8  
1.6  
3.3  
2.7  
2.7  
0
5.4  
ns  
ns  
PHL  
W
n
Setup Time  
Data HIGH or LOW before CP  
CLR HIGH before CP  
S
ns  
ns  
t
Hold Time  
Data HIGH or LOW after CP  
H
Note 10: All typical values are at V  
3.3V, T  
25 C.  
CC  
A
Capacitance (Note 11)  
Symbol  
Parameter  
Input Capacitance  
Output Capacitance  
Conditions  
Typical  
Units  
C
C
V
V
0V, V 0V or V  
3
6
pF  
pF  
IN  
CC  
I
CC  
3.0V, V  
0V or V  
CC  
OUT  
CC  
O
Note 11: Capacitance is measured at frequency f 1 MHz, per MIL-STD-883B, Method 3012.  
www.fairchildsemi.com  
4
Physical Dimensions inches (millimeters) unless otherwise noted  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
Package Number M20B  
5
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
Package Number M20D  
www.fairchildsemi.com  
6
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
Package Number MTC20  
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and  
Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
7
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