FAN2108 [FAIRCHILD]
TinyBuck⑩ 3-24V Input, 8A, High-Efficiency, Integrated Synchronous Buck Regulator; TinyBuck⑩ 3-24V输入, 8A ,高效,集成的同步降压稳压器型号: | FAN2108 |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | TinyBuck⑩ 3-24V Input, 8A, High-Efficiency, Integrated Synchronous Buck Regulator |
文件: | 总14页 (文件大小:503K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
September 2008
FAN2108 — TinyBuck™
3-24V Input, 8A, High-Efficiency, Integrated Synchronous
Buck Regulator
Features
Description
The FAN2108 TinyBuck™ is a highly efficient, small
footprint, 8A, synchronous buck regulator.
Wide Input Voltage Range: 3V-24V
Wide Output Voltage Range: 0.8V to 80% VIN
8A Output Current
The FAN2108 contains both synchronous MOSFETs
and a controller/driver with optimized interconnects in
one package, which enables designers to solve high-
current requirements in a small area with minimal
external components.
Programmable Frequency Operation: 200KHz to
600KHz
Over 95% Peak Efficiency
External compensation, programmable switching
frequency, and current limit features allow design
optimization and flexibility.
Integrated Schottky Diode on Low-side MOSFET
Boosts Efficiency
Internal Bootstrap diode
The summing current mode modulator uses lossless
current sensing for current feedback and over-current
protection. Voltage feedforward helps operation over a
wide input voltage range.
Power-Good Signal
Pre-Bias Startup
Accepts Ceramic Capacitors on Output
External Compensation for Flexible Design
Input Under-Voltage Lockout
Programmable Current Limit
Fairchild’s advanced BiCMOS power process,
combined with low-RDS(ON) internal MOSFETs and a
thermally efficient MLP package, provide the ability to
dissipate high power in a small package.
Under-Voltage, Over-Voltage, and Thermal
Shutdown Protections
Output over-voltage, under-voltage, and thermal
shutdown protections help protect the device from
damage during fault conditions. FAN2108 prevents pre-
biased output discharge during startup in point-of-load
applications.
Internal Soft-Start
5x6mm, 25-Pin, 3-Pad MLP Package
Applications
Servers
Point-of-Load Regulation
High-End Computing Systems
Graphics Cards
Battery-Powered Equipment
Set-Top Boxes
Ordering Information
Operating
Part Number Temperature Range
Eco
Status
Packing
Method
Package
FAN2108MPX
-10°C to 85°C
-40°C to 85°C
Molded Leadless Package (MLP) 5x6mm
Molded Leadless Package (MLP) 5x6mm
Green
Green
Tape and Reel
Tape and Reel
FAN2108EMPX
For Fairchild’s definition of “green” Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
© 2008 Fairchild Semiconductor Corporation
FAN2108 • Rev. 1.0.0
www.fairchildsemi.com
Typical Application
Figure 1. Typical Application Diagram
Block Diagram
Figure 2. Block Diagram
© 2008 Fairchild Semiconductor Corporation
FAN2108 • Rev. 1.0.0
www.fairchildsemi.com
2
Pin Configuration
Figure 3. MLP 5x6mm Pin Configuration (Bottom View)
Pin Definitions
Pin #
P1, 6-12
P2, 2-5
Name Description
SW
VIN
Switching Node.
Power Input Voltage. Connect to the main input power source.
P3, 21-23
PGND Power Ground. Power return and Q2 source.
High-Side Drive BOOT Voltage. Connect through capacitor (CBOOT) to SW. The IC
1
BOOT
PGOOD
EN
includes an internal synchronous bootstrap diode to recharge the capacitor on this pin to
CC when SW is LOW.
V
Power-Good Flag. An open-drain output that pulls LOW when FB is outside a ±10% range
of the reference. PGOOD does not assert HIGH until the fault latch is enabled.
13
14
ENABLE. Enables operation when pulled to logic HIGH or left open. Toggling EN resets the
regulator after a latched fault condition. This input has an internal pull-up when the IC is
functioning normally. When a latched fault occurs, EN is discharged by a current sink.
15
16
VCC
Input Bias Supply for IC. The IC’s logic and analog circuitry are powered from this pin.
Analog Ground. The signal ground for the IC. All internal control voltages are referred to
this pin. Tie this pin to the ground island/plane through the lowest impedance connection.
AGND
Current Limit. A resistor (RILIM) from this pin to AGND can be used to program the current-
limit trip threshold lower than the default setting.
17
ILIM
Oscillator Frequency. A resistor (RT) from this pin to AGND sets the PWM switching
frequency.
18
19
20
24
25
R(T)
FB
Output Voltage Feedback. Connect through a resistor divider to the output voltage.
Compensation. Error amplifier output. Connect the external compensation network
between this pin and FB.
COMP
NC
No Connect. This pin is not used.
Ramp Amplitude. A resistor (RRAMP) connected from this pin to VIN sets the ramp amplitude
and provides voltage feedforward functionality.
RAMP
© 2008 Fairchild Semiconductor Corporation
FAN2108 • Rev. 1.0.0
www.fairchildsemi.com
3
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Parameter
VIN to PGND
VCC to AGND
BOOT to PGND
BOOT to SW
Conditions
Min.
Max.
28
Unit
V
AGND=PGND
Continuous
6
V
35
V
-0.3
-0.5
-5
6.0
V
24.0
30
V
SW to PGND
All other pins
ESD
Transient (t < 20ns, f < 600KHz)
V
-0.3
2
VCC+0.3
V
Human Body Model, JEDEC JESD22-A114
Charged Device Model, JEDEC JESD22-C101
kV
2.5
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
VCC
Parameter
Bias Voltage
Conditions
VCC to AGND
Min.
4.5
3
Typ.
Max.
5.5
Unit
V
5.0
VIN
Supply Voltage
VIN to PGND
FAN2108MPX
FAN2108EMPX
24
V
-10
-40
+85
+85
+125
600
°C
°C
°C
kHz
TA
Ambient Temperature
TJ
f
Junction Temperature
Switching Frequency
Thermal Information
Symbol
Parameter
Min.
Typ.
Max.
+150
+300
+215
+220
Unit
°C
TSTG
TL
Storage Temperature
-65
Lead Soldering Temperature, 10 Seconds
Vapor Phase, 60 Seconds
°C
TVP
TI
°C
Infrared, 15 Seconds
°C
P1 (Q2)
P2 (Q1)
P3
4
7
°C/W
°C/W
°C/W
°C/W
W
Thermal Resistance: Junction-to-Case
θJC
4
Thermal Resistance: Junction-to-Mounting Surface(1)
Power Dissipation, TA=25°C(1)
35
θJ-PCB
PD
2.8
Note:
1. Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 24. Actual results
are dependent on mounting method and surface related to the design.
© 2008 Fairchild Semiconductor Corporation
FAN2108 • Rev. 1.0.0
www.fairchildsemi.com
4
Electrical Specifications
Electrical specifications are the result of using the circuit shown in Figure 1 unless otherwise noted.
Symbol
Parameter
Conditions
Min. Typ. Max. Unit
Power Supplies
SW=Open, FB=0.7V, VCC=5V,
8
12
mA
f
SW=600KHz
ICC
VCC Current
Shutdown: EN=0, VCC=5V
Rising VCC
7
10
µA
V
4.1
4.3
300
4.5
VUVLO
VCC UVLO Threshold
Hysteresis
mV
Oscillator
255
540
300
600
50
345
660
65
KHz
KHz
ns
RT=50KΩ
RT=24KΩ
f
Frequency
tON
Minimum On-Time(2)
16VIN, 1.8VOUT, RT=30KΩ,
VRAMP
Ramp Amplitude, peak-to–peak
Minimum Off-Time(2)
0.53
100
V
RRAMP=200KΩ
tOFF
150
ns
Reference
FAN2108MPX, 25°C
FAN2108EMPX, 25°C
794
795
800 806
800 805
mV
mV
Reference Voltage (see Figure 4 for
Temperature Coefficient)
VFB
Error Amplifier
G
DC Gain(2)
Gain Bandwidth Product(2)
80
12
85
15
dB
MHz
V
V
CC=5V
BW
VCOMP
ISINK
Output Voltage
0.4
1.5
0.8
3.2
2.2
1.2
Output Current, Sourcing
VCC=5V, VCOMP=2.2V
VCC=5V, VCOMP=1.2V
VFB=0.8V, 25°C
mA
mA
nA
ISOURCE Output Current, Sinking
IBIAS FB Bias Current
Protection and Shutdown
-850 -650 -450
RILIM Open at 25°C (see Circuit
Description)
ILIM
Current Limit
12
15
18
-9
A
IILIM
TTSD
THYS
VOVP
VUVLO
VFLT
ILIM Current
-11
-10
+155
+30
µA
°C
°C
Over-Temperature Shutdown
Over-Temperature Hysteresis
Over-Voltage Threshold
Under-Voltage Shutdown
Fault Discharge Threshold
Internal IC Temperature
Two Consecutive Clock Cycles
16 Consecutive Clock Cycles
Measured at FB Pin
110
68
115 121 %VOUT
73
78 %VOUT
250
250
mV
mV
VFLT_HYS Fault Discharge Hysteresis
Measured at FB Pin (VFB ~500mV)
Soft-Start
tSS
tEN
VOUT to Regulation (T0.8)
Fault Enable/SSOK (T1.0)
5.3
6.7
ms
ms
Frequency=600KHz
Note:
2. Specifications guaranteed by design and characterization; not production tested.
© 2008 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN2108 • Rev. 1.0.0
5
Electrical Specifications (Continued)
Recommended operating conditions are the result of using the circuit shown in Figure 1 unless otherwise noted.
Symbol
Parameter
Conditions
Min. Typ. Max. Unit
Control Functions
VEN_R
EN Threshold, Rising
1.35 2.00
V
VEN_HYS EN Hysteresis
250
800
1
mV
KΩ
µA
Ω
REN
IEN
EN Pull-Up Resistance
EN Discharge Current
Auto-Restart Mode
RFB
FB OK Drive Resistance
800
FB < VREF
FB > VREF
IOUT < 2mA
-14
+7
-11
-8
VPG
PGOOD Threshold
PGOOD Output Low
%VREF
V
+10 +13.5
0.4
VPG_L
© 2008 Fairchild Semiconductor Corporation
FAN2108 • Rev. 1.0.0
www.fairchildsemi.com
6
Typical Characteristics
1.010
1.005
1.000
0.995
0.990
1.20
1.10
1.00
0.90
0.80
-50
0
50
100
150
-50
0
50
100
150
Temperature (oC)
Temperature (oC)
Figure 4. Reference Voltage (VFB
)
Figure 5. Reference Bias Current (IFB
)
vs. Temperature, Normalized
vs. Temperature, Normalized
1500
1200
900
600
300
0
1.02
1.01
1.00
0.99
0.98
600KHz
300KHz
-50
0
50
100
150
0
20
40
60
80
100
120
140
Temperature (oC)
RT (K )
Ω
Figure 6. Frequency vs. RT
Figure 7. Frequency vs. Temperature, Normalized
1.4
1.2
1
1.04
1.02
1.00
0.98
0.96
Q1 ~0.32%/°C
Q2 ~0.35%/°C
0.8
0.6
-50
-50
0
50
100
150
0
50
100
150
Temperature (oC)
Temperature (°C)
Figure 9. ILIM Current (IILIM) vs. Temperature,
Normalized
Figure 8. RDS vs. Temperature, Normalized
(VCC=VGS=5V)
© 2008 Fairchild Semiconductor Corporation
FAN2108 • Rev. 1.0.0
www.fairchildsemi.com
7
Application Circuit
Figure 10. Application Circuit: 1.8VOUT, 500KHz
Typical Performance Characteristics
Typical operating characteristics using the circuit shown in Figure 10. VIN=12V, VCC=5V, unless otherwise specified.
Efficiency @ Vo=1.8V, fsw=500KHz, Ta=250C
Efficiency @ Vo=3.3V, fsw=300KHz, Ta=250C
100
95
90
85
80
75
70
95
90
85
80
75
70
Vin=5V
Vin=8V
Vin=10V
Vin=12V
Vin=14V
Vin=20V
Vin=12V
Vin=16V
Vin=20V
Vin=24V
0
2
4
6
8
0
2
4
6
8
Load Current (A)
Load Current (A)
Figure 11. 1.8VOUT Efficiency Over VIN vs. Load
Figure 12. 3.3VOUT Efficiency Over VIN vs. Load
Efficiency@ Vin=12V, Vo=1.8V
Load Regulation @ Vo=0.8V, 500kHz, 25°C
0.8012
Vin=8V
95
90
85
0.801
Vin=12V
0.8008
Vin=16V
0.8006
0.8004
0.8002
0.8
Vin=20V
Vin=24V
300KHz
500KHz
600KHz
80
75
70
0.7998
0.7996
0.7994
0.7992
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
Load Current (A)
Load Current (A)
Figure 13. 1.8VOUT Efficiency Over Frequency
vs. Load
Figure 14. 0.8VOUT Load Regulation Over VIN
vs. Load
© 2008 Fairchild Semiconductor Corporation
FAN2108 • Rev. 1.0.0
www.fairchildsemi.com
8
Typical Performance Characteristics (Continued)
Typical operating characteristics using the circuit shown in Figure 10. VIN=12V, VCC=5V, unless otherwise specified.
VOUT
VOUT
SW
PGOOD
EN
EN
Figure 15. Startup, 3A Load
Figure 16. Startup with 1V Pre-Bias on Vout
SW
EN
VOUT
PGOOD
EN
Figure 17. Shutdown, 1A Load
Figure 18. Restart on Fault
HS and LS MOSFET Temperature
90
VOUT
LSFET@ 20Vin
80
LSFET@ 12Vin
HSFET@ 20Vin
70
HSFET@ 12Vin
60
50
40
30
20
IOUT
0
2
4
6
8
Load Current (A)
Figure 20. MOSFET Temperature – Still Air at Room
Temperature
Figure 19. Transient Response, 2-8A Load
© 2008 Fairchild Semiconductor Corporation
FAN2108 • Rev. 1.0.0
www.fairchildsemi.com
9
Circuit Description
Initialization
Soft-Start
Once VCC exceeds the UVLO threshold and EN is
HIGH, the IC checks for an open or shorted FB pin
before releasing the internal soft-start ramp (SS).
Once internal SS ramp has charged to 0.8V (T0.8), the
output voltage is in regulation. Until SS ramp reaches
1.0V (T1.0), the fault latch is inhibited.
If R1 is open (Figure 1), the error amplifier output
(COMP) is forced LOW and no pulses are generated.
After the SS ramp times out (T1.0), an under-voltage
latched fault occurs.
To avoid skipping the soft-start cycle, it is necessary to
apply VIN before VCC reaches its UVLO threshold.
Soft-start time is a function of oscillator frequency.
If the parallel combination of R1 and RBIAS is ≤ 1KΩ, the
internal SS ramp is not released and the regulator does
not start.
1.35V
EN
2400 CLKs
0.8V
Bias Supply
FB
The FAN2108 requires a 5V supply rail to bias the IC
and provide gate-drive energy. Connect a ≥ 1.0µf X5R
or X7R decoupling capacitor between VCC and PGND.
Fault
Latch
Enable
1.0V
0.8V
Since VCC is used to drive the internal MOSFET gates,
supply current is frequency and voltage dependent.
Approximate VCC current (ICC) is calculated by:
SS
3200 CLKs
4000 CLKs
VCC − 5
ICC
= 4.58 + [(
+ 0.013)•(f −128)]
(1)
(mA)
227
T0.8
where frequency (f) is expressed in KHz.
T1.0
Enable
Figure 21. Soft-Start Timing Diagram
FAN2108 has an internal pull-up to enable pin so that
the IC is enabled once VCC is applied. Connecting a
small capacitor across EN and AGND delays the rate of
voltage rise on the EN pin. EN pin also serves for the
restart whenever a fault occurs (refer to the Auto-
Restart section). For applications where sequencing is
required, FAN2108 can be enabled (after the VCC
comes up) with external control, as shown in Figure 20.
The regulator does not allow the low-side MOSFET to
operate in full synchronous rectification mode until
internal SS ramp reaches 95% of VREF (~0.76V). This
helps the regulator to start on a pre-biased output and
ensures that inductor current does not "ratchet" up
during the soft-start cycle.
V
CC UVLO or toggling the EN pin discharges the SS and
FAN2108
resets the IC.
14
EN
Setting the Output Voltage
The output voltage of the regulator can be set from 0.8V
to 80% of VIN by an external resistor divider (R1 and
3.3n
RBIAS in Figure 1).
The internal reference is 0.8V with 650nA, sourced from
the FB pin to ensure that, if the pin is open, the
regulator does not start.
Figure 20. Enabling with External Control
Setting the Frequency
Oscillator frequency is determined by an external resistor,
RT, connected between the R(T) pin and AGND.
Resistance is calculated by:
The external resistor divider is calculated using:
VOUT − 0.8V
R1
0.8V
=
+ 650nA
(3)
RBIAS
(106 / f ) −135
Connect RBIAS between FB and AGND.
(2)
RT
=
(KΩ)
65
where RT is in KΩ and frequency (f) is in KHz.
The regulator cannot start if RT is left open.
© 2008 Fairchild Semiconductor Corporation
FAN2108 • Rev. 1.0.0
www.fairchildsemi.com
10
The over-current protection fault latch is active during
the soft-start cycle. Use a 1% resistor for RILIM
Calculating the Inductor Value
.
Typically the inductor is set for a ripple current (ΔIL) of
10% to 35% of the maximum DC load. Regulators
requiring fast transient response use a value on the
high side of this range; while regulators that require very
low output ripple and/or use high-ESR capacitors
restrict allowable ripple current.
In case RILIM is not connected, the IC uses an internal
default current-limit threshold.
Loop Compensation
The loop is compensated using a feedback network
around the error amplifier. Figure 22 shows a complete
VOUT
type-3
compensation
network.
For
type-2
VOUT • (1-
)
(4)
VIN
compensation, eliminate R3 and C3.
L =
ΔIL • f
where f is the oscillator frequency.
Setting the Ramp Resistor Value
The internal ramp voltage excursion (ΔVRAMP) during tON
should be set to 0.6V at nominal operating point. RRAMP
is approximately:
(VIN −1.8) •VOUT
18x10−6 •VIN • f
RRAMP(KΩ)
=
− 2
(5)
where frequency (f) is expressed in KHz.
Figure 22. Compensation Network
Since the FAN2108 employs summing current-mode
architecture, type-2 compensation can be used for
many applications. For applications that require wide
loop bandwidth and/or use very low-ESR output
capacitors, type-3 compensation may be required.
Setting the Current Limit
There are two levels of current-limit thresholds in
FAN2108. The first level of protection is through an
internal default limit set at the factory to limit output
current beyond normal usage levels. The second level
of protection is externally settable at the ILIM pin.
Current-limit protection is enabled whenever the lower
of the two thresholds is reached. FAN2108 uses its
internal low-side MOSFET for current-sensing. The
current-limit threshold voltage (VILIM) is compared to a
scaled version of voltage drop across the low-side
MOSFET, sampled at the end of each PWM off-
time/cycle. The internal default threshold (with ILIM open)
is temperature compensated.
Protection
The converter output is monitored and protected
against extreme overload, short-circuit, over-voltage,
under-voltage, and over-temperature conditions.
An internal fault latch is set for any fault intended to
shut down the IC. When the fault latch is set, the IC
discharges VOUT by enhancing the low-side MOSFET
until FB<0.25V. The MOSFET is not turned on again
unless FB>0.5V. This behavior discharges the output
without causing undershoot (negative output voltage).
The ILIM pin can source a 10µA current that can be
used to establish a lower, temperature–dependent,
current-limit threshold by connecting a resistor (RILIM
)
between ILIM and AGND. RILIM can be approximated
with the equation:
Under-Voltage Shutdown
If voltage on the FB pin remains below the under-
voltage threshold for 16 consecutive clock cycles, the
fault latch is set and the converter shuts down. This
protection is not active until the internal SS ramp
reaches 1.0V during soft-start.
Vout • 3.33 •106
RILIM(KΩ) = 95 + 3 •Iout • KT • K1+
(6)
Rramp • fsw
where:
Over-Voltage Protection / Shutdown
If voltage on the FB pin exceeds the over-voltage
threshold for two consecutive clock cycles, the fault
latch is set and shutdown occurs.
I
= Desired current limit setpoint in Amps;
KT
= Normalized temperature coefficient of the
low-side MOSFET (Q2 from Figure 8);
K1
= Overload co-efficient (use 1.2 to 1.4);
VOUT = Set output voltage;
A shorted high-side MOSFET condition is detected
when SW voltage exceeds ~0.7V while the low-side
MOSFET is fully enhanced. The fault latch is set
immediately upon detection.
Rramp = Ramp resistor used in KΩ; and
fsw
= Selected switching frequency in KHz.
After 16 consecutive, pulse-by-pulse, current-limit
cycles, the fault latch is set and the regulator shuts
down. Cycling VCC or EN restores operation after a
normal soft-start cycle (refer to Auto-Restart section).
The two fault protection circuits above are active all the
time, including during soft-start.
© 2008 Fairchild Semiconductor Corporation
FAN2108 • Rev. 1.0.0
www.fairchildsemi.com
11
Auto-Restart
Over-Temperature Protection (OTP)
After a fault, EN pin is discharged by a 1µA current sink
to a 1.1V threshold before the internal 800KΩ pull-up is
restored. A new soft-start cycle begins when EN
charges above 1.35V.
The chip incorporates an over-temperature protection
circuit that sets the fault latch when a die temperature of
about 150°C is reached. The IC restarts when the die
temperature falls below 125°C.
Depending on the external circuit, the FAN2108 can be
configured to remain latched-off or to automatically
restart after a fault.
Power-Good (PGOOD) Signal
PGOOD is an open-drain output that asserts LOW
when VOUT is out of regulation, as measured at the FB
pin. Thresholds are specified in the Electrical
Specifications section. PGOOD does not assert HIGH
until the fault latch is enabled (T1.0).
Table 1. Fault / Restart Configurations
EN Pin
Controller / Restart State
Pull to GND
OFF (Disabled)
Pull-up to VCC with No Restart – Latched OFF(After
PCB Layout
100K
VCC Comes Up)
Open
Immediate Restart After Fault
New Soft-Start Cycle After:
Cap. to GND
t
DELAY (ms)=3.9 • C(nf)
With EN is left open, restart is immediate.
If auto-restart is not desired, tie the EN pin to the VCC
pin or pull it HIGH after VCC comes up with a logic gate
to keep the 1µA current sink from discharging EN to
1.1V. Figure 23 shows one method to pull up EN to VCC
for a latch configuration.
VCC
15
Figure 24. Recommended PCB Layout
100K
FAN2108
EN
14
3.3n
Figure 23. Enable Control with Latch Option
© 2008 Fairchild Semiconductor Corporation
FAN2108 • Rev. 1.0.0
www.fairchildsemi.com
12
Physical Dimensions
2X
TOP VIEW
2X
RECOMMENDED LAND PATTERN
ALL VALUES TYPICAL EXCEPT WHERE NOTED
SIDE VIEW
SEATING
PLANE
A) DIMENSIONS ARE IN MILLIMETERS.
B) DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
D) DESIGN BASED ON JEDEC MO-220
VARIATION WJHC
E) TERMINALS ARE SYMMETRICAL AROUND THE
X & Y AXIS EXCEPT WHERE DEPOPULATED.
F) DRAWING FILENAME: MKT-MLP25AREV2
BOTTOM VIEW
Figure 25. 5x6mm Molded Leadless Package (MLP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2008 Fairchild Semiconductor Corporation
FAN2108 • Rev. 1.0.0
www.fairchildsemi.com
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© 2008 Fairchild Semiconductor Corporation
FAN2108 • Rev. 1.0.0
www.fairchildsemi.com
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