FAN2108 [FAIRCHILD]

TinyBuck⑩ 3-24V Input, 8A, High-Efficiency, Integrated Synchronous Buck Regulator; TinyBuck⑩ 3-24V输入, 8A ,高效,集成的同步降压稳压器
FAN2108
型号: FAN2108
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

TinyBuck⑩ 3-24V Input, 8A, High-Efficiency, Integrated Synchronous Buck Regulator
TinyBuck⑩ 3-24V输入, 8A ,高效,集成的同步降压稳压器

稳压器
文件: 总14页 (文件大小:503K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
September 2008  
FAN2108 — TinyBuck™  
3-24V Input, 8A, High-Efficiency, Integrated Synchronous  
Buck Regulator  
Features  
Description  
The FAN2108 TinyBuck™ is a highly efficient, small  
footprint, 8A, synchronous buck regulator.  
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Wide Input Voltage Range: 3V-24V  
Wide Output Voltage Range: 0.8V to 80% VIN  
8A Output Current  
The FAN2108 contains both synchronous MOSFETs  
and a controller/driver with optimized interconnects in  
one package, which enables designers to solve high-  
current requirements in a small area with minimal  
external components.  
Programmable Frequency Operation: 200KHz to  
600KHz  
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Over 95% Peak Efficiency  
External compensation, programmable switching  
frequency, and current limit features allow design  
optimization and flexibility.  
Integrated Schottky Diode on Low-side MOSFET  
Boosts Efficiency  
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Internal Bootstrap diode  
The summing current mode modulator uses lossless  
current sensing for current feedback and over-current  
protection. Voltage feedforward helps operation over a  
wide input voltage range.  
Power-Good Signal  
Pre-Bias Startup  
Accepts Ceramic Capacitors on Output  
External Compensation for Flexible Design  
Input Under-Voltage Lockout  
Programmable Current Limit  
Fairchild’s advanced BiCMOS power process,  
combined with low-RDS(ON) internal MOSFETs and a  
thermally efficient MLP package, provide the ability to  
dissipate high power in a small package.  
Under-Voltage, Over-Voltage, and Thermal  
Shutdown Protections  
Output over-voltage, under-voltage, and thermal  
shutdown protections help protect the device from  
damage during fault conditions. FAN2108 prevents pre-  
biased output discharge during startup in point-of-load  
applications.  
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Internal Soft-Start  
5x6mm, 25-Pin, 3-Pad MLP Package  
Applications  
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Servers  
Point-of-Load Regulation  
High-End Computing Systems  
Graphics Cards  
Battery-Powered Equipment  
Set-Top Boxes  
Ordering Information  
Operating  
Part Number Temperature Range  
Eco  
Status  
Packing  
Method  
Package  
FAN2108MPX  
-10°C to 85°C  
-40°C to 85°C  
Molded Leadless Package (MLP) 5x6mm  
Molded Leadless Package (MLP) 5x6mm  
Green  
Green  
Tape and Reel  
Tape and Reel  
FAN2108EMPX  
For Fairchild’s definition of “green” Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.  
© 2008 Fairchild Semiconductor Corporation  
FAN2108 • Rev. 1.0.0  
www.fairchildsemi.com  
Typical Application  
Figure 1. Typical Application Diagram  
Block Diagram  
Figure 2. Block Diagram  
© 2008 Fairchild Semiconductor Corporation  
FAN2108 • Rev. 1.0.0  
www.fairchildsemi.com  
2
Pin Configuration  
Figure 3. MLP 5x6mm Pin Configuration (Bottom View)  
Pin Definitions  
Pin #  
P1, 6-12  
P2, 2-5  
Name Description  
SW  
VIN  
Switching Node.  
Power Input Voltage. Connect to the main input power source.  
P3, 21-23  
PGND Power Ground. Power return and Q2 source.  
High-Side Drive BOOT Voltage. Connect through capacitor (CBOOT) to SW. The IC  
1
BOOT  
PGOOD  
EN  
includes an internal synchronous bootstrap diode to recharge the capacitor on this pin to  
CC when SW is LOW.  
V
Power-Good Flag. An open-drain output that pulls LOW when FB is outside a ±10% range  
of the reference. PGOOD does not assert HIGH until the fault latch is enabled.  
13  
14  
ENABLE. Enables operation when pulled to logic HIGH or left open. Toggling EN resets the  
regulator after a latched fault condition. This input has an internal pull-up when the IC is  
functioning normally. When a latched fault occurs, EN is discharged by a current sink.  
15  
16  
VCC  
Input Bias Supply for IC. The IC’s logic and analog circuitry are powered from this pin.  
Analog Ground. The signal ground for the IC. All internal control voltages are referred to  
this pin. Tie this pin to the ground island/plane through the lowest impedance connection.  
AGND  
Current Limit. A resistor (RILIM) from this pin to AGND can be used to program the current-  
limit trip threshold lower than the default setting.  
17  
ILIM  
Oscillator Frequency. A resistor (RT) from this pin to AGND sets the PWM switching  
frequency.  
18  
19  
20  
24  
25  
R(T)  
FB  
Output Voltage Feedback. Connect through a resistor divider to the output voltage.  
Compensation. Error amplifier output. Connect the external compensation network  
between this pin and FB.  
COMP  
NC  
No Connect. This pin is not used.  
Ramp Amplitude. A resistor (RRAMP) connected from this pin to VIN sets the ramp amplitude  
and provides voltage feedforward functionality.  
RAMP  
© 2008 Fairchild Semiconductor Corporation  
FAN2108 • Rev. 1.0.0  
www.fairchildsemi.com  
3
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device  
reliability. The absolute maximum ratings are stress ratings only.  
Parameter  
VIN to PGND  
VCC to AGND  
BOOT to PGND  
BOOT to SW  
Conditions  
Min.  
Max.  
28  
Unit  
V
AGND=PGND  
Continuous  
6
V
35  
V
-0.3  
-0.5  
-5  
6.0  
V
24.0  
30  
V
SW to PGND  
All other pins  
ESD  
Transient (t < 20ns, f < 600KHz)  
V
-0.3  
2
VCC+0.3  
V
Human Body Model, JEDEC JESD22-A114  
Charged Device Model, JEDEC JESD22-C101  
kV  
2.5  
Recommended Operating Conditions  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended  
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not  
recommend exceeding them or designing to absolute maximum ratings.  
Symbol  
VCC  
Parameter  
Bias Voltage  
Conditions  
VCC to AGND  
Min.  
4.5  
3
Typ.  
Max.  
5.5  
Unit  
V
5.0  
VIN  
Supply Voltage  
VIN to PGND  
FAN2108MPX  
FAN2108EMPX  
24  
V
-10  
-40  
+85  
+85  
+125  
600  
°C  
°C  
°C  
kHz  
TA  
Ambient Temperature  
TJ  
f
Junction Temperature  
Switching Frequency  
Thermal Information  
Symbol  
Parameter  
Min.  
Typ.  
Max.  
+150  
+300  
+215  
+220  
Unit  
°C  
TSTG  
TL  
Storage Temperature  
-65  
Lead Soldering Temperature, 10 Seconds  
Vapor Phase, 60 Seconds  
°C  
TVP  
TI  
°C  
Infrared, 15 Seconds  
°C  
P1 (Q2)  
P2 (Q1)  
P3  
4
7
°C/W  
°C/W  
°C/W  
°C/W  
W
Thermal Resistance: Junction-to-Case  
θJC  
4
Thermal Resistance: Junction-to-Mounting Surface(1)  
Power Dissipation, TA=25°C(1)  
35  
θJ-PCB  
PD  
2.8  
Note:  
1. Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 24. Actual results  
are dependent on mounting method and surface related to the design.  
© 2008 Fairchild Semiconductor Corporation  
FAN2108 • Rev. 1.0.0  
www.fairchildsemi.com  
4
Electrical Specifications  
Electrical specifications are the result of using the circuit shown in Figure 1 unless otherwise noted.  
Symbol  
Parameter  
Conditions  
Min. Typ. Max. Unit  
Power Supplies  
SW=Open, FB=0.7V, VCC=5V,  
8
12  
mA  
f
SW=600KHz  
ICC  
VCC Current  
Shutdown: EN=0, VCC=5V  
Rising VCC  
7
10  
µA  
V
4.1  
4.3  
300  
4.5  
VUVLO  
VCC UVLO Threshold  
Hysteresis  
mV  
Oscillator  
255  
540  
300  
600  
50  
345  
660  
65  
KHz  
KHz  
ns  
RT=50KΩ  
RT=24KΩ  
f
Frequency  
tON  
Minimum On-Time(2)  
16VIN, 1.8VOUT, RT=30KΩ,  
VRAMP  
Ramp Amplitude, peak-to–peak  
Minimum Off-Time(2)  
0.53  
100  
V
RRAMP=200KΩ  
tOFF  
150  
ns  
Reference  
FAN2108MPX, 25°C  
FAN2108EMPX, 25°C  
794  
795  
800 806  
800 805  
mV  
mV  
Reference Voltage (see Figure 4 for  
Temperature Coefficient)  
VFB  
Error Amplifier  
G
DC Gain(2)  
Gain Bandwidth Product(2)  
80  
12  
85  
15  
dB  
MHz  
V
V
CC=5V  
BW  
VCOMP  
ISINK  
Output Voltage  
0.4  
1.5  
0.8  
3.2  
2.2  
1.2  
Output Current, Sourcing  
VCC=5V, VCOMP=2.2V  
VCC=5V, VCOMP=1.2V  
VFB=0.8V, 25°C  
mA  
mA  
nA  
ISOURCE Output Current, Sinking  
IBIAS FB Bias Current  
Protection and Shutdown  
-850 -650 -450  
RILIM Open at 25°C (see Circuit  
Description)  
ILIM  
Current Limit  
12  
15  
18  
-9  
A
IILIM  
TTSD  
THYS  
VOVP  
VUVLO  
VFLT  
ILIM Current  
-11  
-10  
+155  
+30  
µA  
°C  
°C  
Over-Temperature Shutdown  
Over-Temperature Hysteresis  
Over-Voltage Threshold  
Under-Voltage Shutdown  
Fault Discharge Threshold  
Internal IC Temperature  
Two Consecutive Clock Cycles  
16 Consecutive Clock Cycles  
Measured at FB Pin  
110  
68  
115 121 %VOUT  
73  
78 %VOUT  
250  
250  
mV  
mV  
VFLT_HYS Fault Discharge Hysteresis  
Measured at FB Pin (VFB ~500mV)  
Soft-Start  
tSS  
tEN  
VOUT to Regulation (T0.8)  
Fault Enable/SSOK (T1.0)  
5.3  
6.7  
ms  
ms  
Frequency=600KHz  
Note:  
2. Specifications guaranteed by design and characterization; not production tested.  
© 2008 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN2108 • Rev. 1.0.0  
5
Electrical Specifications (Continued)  
Recommended operating conditions are the result of using the circuit shown in Figure 1 unless otherwise noted.  
Symbol  
Parameter  
Conditions  
Min. Typ. Max. Unit  
Control Functions  
VEN_R  
EN Threshold, Rising  
1.35 2.00  
V
VEN_HYS EN Hysteresis  
250  
800  
1
mV  
KΩ  
µA  
Ω
REN  
IEN  
EN Pull-Up Resistance  
EN Discharge Current  
Auto-Restart Mode  
RFB  
FB OK Drive Resistance  
800  
FB < VREF  
FB > VREF  
IOUT < 2mA  
-14  
+7  
-11  
-8  
VPG  
PGOOD Threshold  
PGOOD Output Low  
%VREF  
V
+10 +13.5  
0.4  
VPG_L  
© 2008 Fairchild Semiconductor Corporation  
FAN2108 • Rev. 1.0.0  
www.fairchildsemi.com  
6
Typical Characteristics  
1.010  
1.005  
1.000  
0.995  
0.990  
1.20  
1.10  
1.00  
0.90  
0.80  
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
Temperature (oC)  
Temperature (oC)  
Figure 4. Reference Voltage (VFB  
)
Figure 5. Reference Bias Current (IFB  
)
vs. Temperature, Normalized  
vs. Temperature, Normalized  
1500  
1200  
900  
600  
300  
0
1.02  
1.01  
1.00  
0.99  
0.98  
600KHz  
300KHz  
-50  
0
50  
100  
150  
0
20  
40  
60  
80  
100  
120  
140  
Temperature (oC)  
RT (K )  
Ω
Figure 6. Frequency vs. RT  
Figure 7. Frequency vs. Temperature, Normalized  
1.4  
1.2  
1
1.04  
1.02  
1.00  
0.98  
0.96  
Q1 ~0.32%/°C  
Q2 ~0.35%/°C  
0.8  
0.6  
-50  
-50  
0
50  
100  
150  
0
50  
100  
150  
Temperature (oC)  
Temperature (°C)  
Figure 9. ILIM Current (IILIM) vs. Temperature,  
Normalized  
Figure 8. RDS vs. Temperature, Normalized  
(VCC=VGS=5V)  
© 2008 Fairchild Semiconductor Corporation  
FAN2108 • Rev. 1.0.0  
www.fairchildsemi.com  
7
Application Circuit  
Figure 10. Application Circuit: 1.8VOUT, 500KHz  
Typical Performance Characteristics  
Typical operating characteristics using the circuit shown in Figure 10. VIN=12V, VCC=5V, unless otherwise specified.  
Efficiency @ Vo=1.8V, fsw=500KHz, Ta=250C  
Efficiency @ Vo=3.3V, fsw=300KHz, Ta=250C  
100  
95  
90  
85  
80  
75  
70  
95  
90  
85  
80  
75  
70  
Vin=5V  
Vin=8V  
Vin=10V  
Vin=12V  
Vin=14V  
Vin=20V  
Vin=12V  
Vin=16V  
Vin=20V  
Vin=24V  
0
2
4
6
8
0
2
4
6
8
Load Current (A)  
Load Current (A)  
Figure 11. 1.8VOUT Efficiency Over VIN vs. Load  
Figure 12. 3.3VOUT Efficiency Over VIN vs. Load  
Efficiency@ Vin=12V, Vo=1.8V  
Load Regulation @ Vo=0.8V, 500kHz, 25°C  
0.8012  
Vin=8V  
95  
90  
85  
0.801  
Vin=12V  
0.8008  
Vin=16V  
0.8006  
0.8004  
0.8002  
0.8  
Vin=20V  
Vin=24V  
300KHz  
500KHz  
600KHz  
80  
75  
70  
0.7998  
0.7996  
0.7994  
0.7992  
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
Load Current (A)  
Load Current (A)  
Figure 13. 1.8VOUT Efficiency Over Frequency  
vs. Load  
Figure 14. 0.8VOUT Load Regulation Over VIN  
vs. Load  
© 2008 Fairchild Semiconductor Corporation  
FAN2108 • Rev. 1.0.0  
www.fairchildsemi.com  
8
Typical Performance Characteristics (Continued)  
Typical operating characteristics using the circuit shown in Figure 10. VIN=12V, VCC=5V, unless otherwise specified.  
VOUT  
VOUT  
SW  
PGOOD  
EN  
EN  
Figure 15. Startup, 3A Load  
Figure 16. Startup with 1V Pre-Bias on Vout  
SW  
EN  
VOUT  
PGOOD  
EN  
Figure 17. Shutdown, 1A Load  
Figure 18. Restart on Fault  
HS and LS MOSFET Temperature  
90  
VOUT  
LSFET@ 20Vin  
80  
LSFET@ 12Vin  
HSFET@ 20Vin  
70  
HSFET@ 12Vin  
60  
50  
40  
30  
20  
IOUT  
0
2
4
6
8
Load Current (A)  
Figure 20. MOSFET Temperature – Still Air at Room  
Temperature  
Figure 19. Transient Response, 2-8A Load  
© 2008 Fairchild Semiconductor Corporation  
FAN2108 • Rev. 1.0.0  
www.fairchildsemi.com  
9
Circuit Description  
Initialization  
Soft-Start  
Once VCC exceeds the UVLO threshold and EN is  
HIGH, the IC checks for an open or shorted FB pin  
before releasing the internal soft-start ramp (SS).  
Once internal SS ramp has charged to 0.8V (T0.8), the  
output voltage is in regulation. Until SS ramp reaches  
1.0V (T1.0), the fault latch is inhibited.  
If R1 is open (Figure 1), the error amplifier output  
(COMP) is forced LOW and no pulses are generated.  
After the SS ramp times out (T1.0), an under-voltage  
latched fault occurs.  
To avoid skipping the soft-start cycle, it is necessary to  
apply VIN before VCC reaches its UVLO threshold.  
Soft-start time is a function of oscillator frequency.  
If the parallel combination of R1 and RBIAS is 1KΩ, the  
internal SS ramp is not released and the regulator does  
not start.  
1.35V  
EN  
2400 CLKs  
0.8V  
Bias Supply  
FB  
The FAN2108 requires a 5V supply rail to bias the IC  
and provide gate-drive energy. Connect a 1.0µf X5R  
or X7R decoupling capacitor between VCC and PGND.  
Fault  
Latch  
Enable  
1.0V  
0.8V  
Since VCC is used to drive the internal MOSFET gates,  
supply current is frequency and voltage dependent.  
Approximate VCC current (ICC) is calculated by:  
SS  
3200 CLKs  
4000 CLKs  
VCC 5  
ICC  
= 4.58 + [(  
+ 0.013)(f 128)]  
(1)  
(mA)  
227  
T0.8  
where frequency (f) is expressed in KHz.  
T1.0  
Enable  
Figure 21. Soft-Start Timing Diagram  
FAN2108 has an internal pull-up to enable pin so that  
the IC is enabled once VCC is applied. Connecting a  
small capacitor across EN and AGND delays the rate of  
voltage rise on the EN pin. EN pin also serves for the  
restart whenever a fault occurs (refer to the Auto-  
Restart section). For applications where sequencing is  
required, FAN2108 can be enabled (after the VCC  
comes up) with external control, as shown in Figure 20.  
The regulator does not allow the low-side MOSFET to  
operate in full synchronous rectification mode until  
internal SS ramp reaches 95% of VREF (~0.76V). This  
helps the regulator to start on a pre-biased output and  
ensures that inductor current does not "ratchet" up  
during the soft-start cycle.  
V
CC UVLO or toggling the EN pin discharges the SS and  
FAN2108  
resets the IC.  
14  
EN  
Setting the Output Voltage  
The output voltage of the regulator can be set from 0.8V  
to 80% of VIN by an external resistor divider (R1 and  
3.3n  
RBIAS in Figure 1).  
The internal reference is 0.8V with 650nA, sourced from  
the FB pin to ensure that, if the pin is open, the  
regulator does not start.  
Figure 20. Enabling with External Control  
Setting the Frequency  
Oscillator frequency is determined by an external resistor,  
RT, connected between the R(T) pin and AGND.  
Resistance is calculated by:  
The external resistor divider is calculated using:  
VOUT 0.8V  
R1  
0.8V  
=
+ 650nA  
(3)  
RBIAS  
(106 / f ) 135  
Connect RBIAS between FB and AGND.  
(2)  
RT  
=
(KΩ)  
65  
where RT is in KΩ and frequency (f) is in KHz.  
The regulator cannot start if RT is left open.  
© 2008 Fairchild Semiconductor Corporation  
FAN2108 • Rev. 1.0.0  
www.fairchildsemi.com  
10  
The over-current protection fault latch is active during  
the soft-start cycle. Use a 1% resistor for RILIM  
Calculating the Inductor Value  
.
Typically the inductor is set for a ripple current (ΔIL) of  
10% to 35% of the maximum DC load. Regulators  
requiring fast transient response use a value on the  
high side of this range; while regulators that require very  
low output ripple and/or use high-ESR capacitors  
restrict allowable ripple current.  
In case RILIM is not connected, the IC uses an internal  
default current-limit threshold.  
Loop Compensation  
The loop is compensated using a feedback network  
around the error amplifier. Figure 22 shows a complete  
VOUT  
type-3  
compensation  
network.  
For  
type-2  
VOUT (1-  
)
(4)  
VIN  
compensation, eliminate R3 and C3.  
L =  
ΔIL f  
where f is the oscillator frequency.  
Setting the Ramp Resistor Value  
The internal ramp voltage excursion (ΔVRAMP) during tON  
should be set to 0.6V at nominal operating point. RRAMP  
is approximately:  
(VIN 1.8) VOUT  
18x106 VIN f  
RRAMP(KΩ)  
=
2  
(5)  
where frequency (f) is expressed in KHz.  
Figure 22. Compensation Network  
Since the FAN2108 employs summing current-mode  
architecture, type-2 compensation can be used for  
many applications. For applications that require wide  
loop bandwidth and/or use very low-ESR output  
capacitors, type-3 compensation may be required.  
Setting the Current Limit  
There are two levels of current-limit thresholds in  
FAN2108. The first level of protection is through an  
internal default limit set at the factory to limit output  
current beyond normal usage levels. The second level  
of protection is externally settable at the ILIM pin.  
Current-limit protection is enabled whenever the lower  
of the two thresholds is reached. FAN2108 uses its  
internal low-side MOSFET for current-sensing. The  
current-limit threshold voltage (VILIM) is compared to a  
scaled version of voltage drop across the low-side  
MOSFET, sampled at the end of each PWM off-  
time/cycle. The internal default threshold (with ILIM open)  
is temperature compensated.  
Protection  
The converter output is monitored and protected  
against extreme overload, short-circuit, over-voltage,  
under-voltage, and over-temperature conditions.  
An internal fault latch is set for any fault intended to  
shut down the IC. When the fault latch is set, the IC  
discharges VOUT by enhancing the low-side MOSFET  
until FB<0.25V. The MOSFET is not turned on again  
unless FB>0.5V. This behavior discharges the output  
without causing undershoot (negative output voltage).  
The ILIM pin can source a 10µA current that can be  
used to establish a lower, temperature–dependent,  
current-limit threshold by connecting a resistor (RILIM  
)
between ILIM and AGND. RILIM can be approximated  
with the equation:  
Under-Voltage Shutdown  
If voltage on the FB pin remains below the under-  
voltage threshold for 16 consecutive clock cycles, the  
fault latch is set and the converter shuts down. This  
protection is not active until the internal SS ramp  
reaches 1.0V during soft-start.  
Vout 3.33 106  
RILIM(KΩ) = 95 + 3 Iout KT K1+  
(6)  
Rramp fsw  
where:  
Over-Voltage Protection / Shutdown  
If voltage on the FB pin exceeds the over-voltage  
threshold for two consecutive clock cycles, the fault  
latch is set and shutdown occurs.  
I
= Desired current limit setpoint in Amps;  
KT  
= Normalized temperature coefficient of the  
low-side MOSFET (Q2 from Figure 8);  
K1  
= Overload co-efficient (use 1.2 to 1.4);  
VOUT = Set output voltage;  
A shorted high-side MOSFET condition is detected  
when SW voltage exceeds ~0.7V while the low-side  
MOSFET is fully enhanced. The fault latch is set  
immediately upon detection.  
Rramp = Ramp resistor used in KΩ; and  
fsw  
= Selected switching frequency in KHz.  
After 16 consecutive, pulse-by-pulse, current-limit  
cycles, the fault latch is set and the regulator shuts  
down. Cycling VCC or EN restores operation after a  
normal soft-start cycle (refer to Auto-Restart section).  
The two fault protection circuits above are active all the  
time, including during soft-start.  
© 2008 Fairchild Semiconductor Corporation  
FAN2108 • Rev. 1.0.0  
www.fairchildsemi.com  
11  
Auto-Restart  
Over-Temperature Protection (OTP)  
After a fault, EN pin is discharged by a 1µA current sink  
to a 1.1V threshold before the internal 800KΩ pull-up is  
restored. A new soft-start cycle begins when EN  
charges above 1.35V.  
The chip incorporates an over-temperature protection  
circuit that sets the fault latch when a die temperature of  
about 150°C is reached. The IC restarts when the die  
temperature falls below 125°C.  
Depending on the external circuit, the FAN2108 can be  
configured to remain latched-off or to automatically  
restart after a fault.  
Power-Good (PGOOD) Signal  
PGOOD is an open-drain output that asserts LOW  
when VOUT is out of regulation, as measured at the FB  
pin. Thresholds are specified in the Electrical  
Specifications section. PGOOD does not assert HIGH  
until the fault latch is enabled (T1.0).  
Table 1. Fault / Restart Configurations  
EN Pin  
Controller / Restart State  
Pull to GND  
OFF (Disabled)  
Pull-up to VCC with No Restart – Latched OFF(After  
PCB Layout  
100K  
VCC Comes Up)  
Open  
Immediate Restart After Fault  
New Soft-Start Cycle After:  
Cap. to GND  
t
DELAY (ms)=3.9 • C(nf)  
With EN is left open, restart is immediate.  
If auto-restart is not desired, tie the EN pin to the VCC  
pin or pull it HIGH after VCC comes up with a logic gate  
to keep the 1µA current sink from discharging EN to  
1.1V. Figure 23 shows one method to pull up EN to VCC  
for a latch configuration.  
VCC  
15  
Figure 24. Recommended PCB Layout  
100K  
FAN2108  
EN  
14  
3.3n  
Figure 23. Enable Control with Latch Option  
© 2008 Fairchild Semiconductor Corporation  
FAN2108 • Rev. 1.0.0  
www.fairchildsemi.com  
12  
Physical Dimensions  
2X  
TOP VIEW  
2X  
RECOMMENDED LAND PATTERN  
ALL VALUES TYPICAL EXCEPT WHERE NOTED  
SIDE VIEW  
SEATING  
PLANE  
A) DIMENSIONS ARE IN MILLIMETERS.  
B) DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 1994  
C) DIMENSIONS DO NOT INCLUDE MOLD  
FLASH OR BURRS.  
D) DESIGN BASED ON JEDEC MO-220  
VARIATION WJHC  
E) TERMINALS ARE SYMMETRICAL AROUND THE  
X & Y AXIS EXCEPT WHERE DEPOPULATED.  
F) DRAWING FILENAME: MKT-MLP25AREV2  
BOTTOM VIEW  
Figure 25. 5x6mm Molded Leadless Package (MLP)  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify  
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically  
the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
© 2008 Fairchild Semiconductor Corporation  
FAN2108 • Rev. 1.0.0  
www.fairchildsemi.com  
13  
© 2008 Fairchild Semiconductor Corporation  
FAN2108 • Rev. 1.0.0  
www.fairchildsemi.com  
14  

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