FAN2110MPX [FAIRCHILD]
TinyBuck™, 3-24V Input, 10A, High-Efficiency, Integrated Synchronous Buck Regulator; TinyBuck一体化™ , 3-24V输入, 10A ,高效,集成的同步降压稳压器型号: | FAN2110MPX |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | TinyBuck™, 3-24V Input, 10A, High-Efficiency, Integrated Synchronous Buck Regulator |
文件: | 总17页 (文件大小:1484K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
August 2009
FAN2110 — TinyBuck™
3-24V Input, 10A, High-Efficiency, Integrated
Synchronous Buck Regulator
Features
Description
The FAN2110 TinyBuck™ is a highly efficient, small
footprint, constant frequency, 10A integrated
synchronous Buck regulator.
Wide Input Voltage Range: 3V-24V
Wide Output Voltage Range: 0.8V to 80% VIN
10A Output Current
The FAN2110 contains both synchronous MOSFETs
and a controller/driver with optimized interconnects in
one package, which enables designers to solve high-
current requirements in a small area with minimal
external components. Integration helps to minimize
critical inductances making component layout simpler
and more efficient compared to discrete solutions.
1% Reference Accuracy Over Temperature
Over 93% Peak Efficiency
Programmable Frequency Operation: 200KHz to
600KHz
Fully Synchronous Operation with Integrated
Schottky Diode on Low-Side MOSFET Boosts
Efficiency
The FAN2110 provides for external loop compensation,
programmable switching frequency, and current limit.
These features allow design flexibility and optimization.
High frequency operation allows for all ceramic
solutions.
Internal Bootstrap Diode
Power-Good Signal
Starts up on Pre-Bias Outputs
Accepts Ceramic Capacitors on Output
External Compensation for Flexible Design
Programmable Current Limit
The summing current mode modulator uses lossless
current sensing for current feedback and over-current
protection. Voltage feedforward helps operation over a
wide input voltage range.
Fairchild’s advanced BiCMOS power process,
combined with low-RDS(ON) internal MOSFETs and a
thermally efficient MLP package, provide the ability to
dissipate high power in a small package.
Under-Voltage, Over-Voltage, and Thermal
Shutdown Protections
Internal Soft-Start
5x6mm, 25-Pin, 3-Pad MLP Package
Output over-voltage, under-voltage, and thermal
shutdown protections help protect the device from
damage during fault conditions. FAN2110 also prevents
pre-biased output discharge during startup in point-of-
load applications.
Applications
Servers & Telecom
Graphics Cards & Displays
Computing Systems
Related Application Notes
AN-8022 — TinyCalc™ Calculator
Point-of-Load Regulation
Set-Top Boxes & Game Consoles
Ordering Information
Operating
Part Number Temperature Range
Eco
Status
Packing
Method
Package
FAN2110MPX
-10°C to 85°C
-40°C to 85°C
Molded Leadless Package (MLP) 5x6mm
Molded Leadless Package (MLP) 5x6mm
Green
Green
Tape and Reel
Tape and Reel
FAN2110EMPX
For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
© 2008 Fairchild Semiconductor Corporation
FAN2110 • Rev. 1.0.2
www.fairchildsemi.com
Typical Application
Figure 1. Typical Application Diagram
Block Diagram
Figure 2. Block Diagram
© 2008 Fairchild Semiconductor Corporation
FAN2110 • Rev. 1.0.2
www.fairchildsemi.com
2
Pin Configuration
Figure 3. MLP 5x6mm Pin Configuration (Bottom View)
Pin Definitions
Pin #
P1, 6-12
P2, 2-5
Name Description
SW
VIN
Switching Node. Junction of high-side and low-side MOSFETs.
Power Conversion Input Voltage. Connect to the main input power source.
P3, 21-23
PGND Power Ground. Power return and Q2 source.
High-Side Drive BOOT Voltage. Connect through capacitor (CBOOT) to SW. The IC
1
BOOT
PGOOD
EN
includes an internal synchronous bootstrap diode to recharge the capacitor on this pin to
CC when SW is LOW.
V
Power-Good Flag. An open-drain output that pulls LOW when FB is outside the limits
specified in electrical specs. PGOOD does not assert HIGH until the fault latch is enabled.
13
14
ENABLE. Enables operation when pulled to logic HIGH or left open. Toggling EN resets the
regulator after a latched fault condition. This input has an internal pull-up when the IC is
functioning normally. When a latched fault occurs, EN is discharged by a current sink.
Input Bias Supply for IC. The IC’s logic and analog circuitry are powered from this pin.
This pin should be decoupled to AGND through a > 2.2µF X5R / X7R capacitor.
15
16
17
VCC
AGND
ILIM
Analog Ground. The signal ground for the IC. All internal control voltages are referred to
this pin. Tie this pin to the ground island/plane through the lowest impedance connection.
Current Limit. A resistor (RILIM) from this pin to AGND can be used to program the current-
limit trip threshold lower than the internal default setting.
Oscillator Frequency. A resistor (RT) from this pin to AGND sets the PWM switching
frequency.
18
19
20
24
25
R(T)
FB
Output Voltage Feedback. Connect through a resistor divider to the output voltage.
Compensation. Error amplifier output. Connect the external compensation network
between this pin and FB.
COMP
NC
No Connect. This pin is not used.
Ramp Amplitude. A resistor (RRAMP) connected from this pin to VIN sets the ramp amplitude
and provides voltage feedforward functionality.
RAMP
© 2008 Fairchild Semiconductor Corporation
FAN2110 • Rev. 1.0.2
www.fairchildsemi.com
3
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Parameter
VIN to PGND
VCC to AGND
BOOT to PGND
BOOT to SW
Conditions
Min.
Max.
28
Unit
V
AGND=PGND
Continuous
6
V
35
V
-0.5
-0.5
-5
6.0
V
24.0
30
V
SW to PGND
All other pins
ESD
Transient (t < 20ns, f < 600KHz)
V
-0.3
2.0
2.5
VCC+0.3
V
Human Body Model, JEDEC JESD22-A114
Charged Device Model, JEDEC JESD22-C101
KV
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
VCC
Parameter
Bias Voltage
Conditions
VCC to AGND
Min.
4.5
3
Typ.
Max.
5.5
Unit
V
5.0
VIN
Supply Voltage
VIN to PGND
FAN2110MPX
FAN2110EMPX
24
V
-10
-40
+85
+85
+125
600
°C
°C
°C
kHz
TA
Ambient Temperature
TJ
Junction Temperature
Switching Frequency
fSW
200
Thermal Information
Symbol
Parameter
Min.
Typ.
Max.
+150
+300
Unit
°C
TSTG
TL
Storage Temperature
-65
Lead Soldering Temperature, 10 Seconds
Thermal Resistance: Junction-to-Case
°C
P1 (Q2)
P2 (Q1)
P3
4
7
°C/W
°C/W
°C/W
°C/W
W
θJC
4
Thermal Resistance: Junction-to-Mounting Surface(1)
Power Dissipation, TA=25°C(1)
35
θJ-PCB
PD
2.8
Note:
1. Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 35. Actual results
are dependent on mounting method and surface related to the design.
© 2008 Fairchild Semiconductor Corporation
FAN2110 • Rev. 1.0.2
www.fairchildsemi.com
4
Electrical Specifications
Electrical specifications are the result of using the circuit shown in Figure 1 with VIN=12V, unless otherwise noted.
Symbol
Parameter
Conditions
Min. Typ. Max. Unit
Power Supplies
SW=Open, VFB=0.7V, VCC=5V,
8
12
mA
f
SW=600KHz
ICC
VCC Current
Shutdown: EN=0, VCC=5V
Rising VCC
7
10
µA
V
4.1
4.3
300
4.5
VUVLO
Oscillator
fSW
VCC UVLO Threshold
Hysteresis
mV
255
540
300
600
50
345
660
65
KHz
KHz
ns
RT=50KΩ to GND
RT=24KΩ to GND
Frequency
tONmin
Minimum On-Time(2)
16VIN, 1.8VOUT, RT=30KΩ,
VRAMP
Ramp Amplitude, Peak-to-Peak
Minimum Off-Time(2)
0.53
100
V
RRAMP=200KΩ
tOFFmin
150
ns
Reference
FAN2110MPX, 25°C
FAN2110EMPX, 25°C
794
795
800
800
806
805
mV
mV
Reference Voltage (see Figure 4 for
Temperature Coefficient)
VFB
Error Amplifier
G
DC Gain(2)
Gain Bandwidth Product(2)
Output Voltage(2)
80
12
85
15
dB
MHz
V
VCC=5V
GBW
VCOMP
ISINK
0.4
1.5
0.8
3.2
Output Current, Sourcing
VCC=5V, VCOMP=2.2V
VCC=5V, VCOMP=1.2V
VFB=0.8V, 25°C
2.2
1.2
mA
mA
nA
ISOURCE Output Current, Sinking
IBIAS FB Bias Current
Protection and Shutdown
-850 -650 -450
RILIM=182 KΩ,, 25°C, fSW=500KHz,
Current Limit (see Circuit
ILIM
12
14
16
-9
A
Description)(2)
V
OUT=1.5V, RRAMP=243KΩ,
16 Consecutive Clock Cycles(3)
VCC=5V, 25°C
IILIM
TTSD
THYS
VOVP
VUVSD
VFLT
ILIM Current
-11
-10
+155
+30
115
73
µA
°C
°C
Over-Temperature Shutdown(2)
Over-Temperature Hysteresis(2)
Over-Voltage Threshold
Under-Voltage Shutdown
Fault Discharge Threshold
Internal IC Temperature
2 Consecutive Clock Cycles(3)
16 Consecutive Clock Cycles(3)
Measured at FB Pin
110
68
121 %VOUT
78
%VOUT
mV
250
250
VFLT_HYS Fault Discharge Hysteresis
Measured at FB Pin (VFB ~500mV)
mV
Soft-Start
tSS
tEN
VOUT to Regulation (T0.8)
Fault Enable/SSOK (T1.0)(2)
5.3
6.7
ms
ms
f
SW=500KHz
Continued on the following page…
© 2008 Fairchild Semiconductor Corporation
FAN2110 • Rev. 1.0.2
www.fairchildsemi.com
5
Electrical Specifications (Continued)
Electrical specifications are the result of using the circuit shown in Figure 1 with VIN=12V, unless otherwise noted.
Symbol
Parameter
Conditions
Min. Typ. Max. Unit
Control Functions
VEN
EN Threshold, Rising
VCC=5V
VCC=5V
VCC=5V
1.35 2.00
V
VEN_HYS EN Hysteresis
250
800
1
mV
KΩ
µA
Ω
REN
EN Pull-Up Resistance
IEN_DISC EN Discharge Current
Auto-Restart Mode, VCC=5V
RFBok
FB OK Drive Resistance
PGOOD LOW Threshold
800
FB < VREF, 2 Consecutive Clock
Cycles(3)
VPGTH_LO
-14
+7
-11
-8
%VREF
FB > VREF, 2 Consecutive Clock
Cycles(3)
VPGTH_UP
+10 +13.5
0.4
VPG_LO PGOOD Output Low
IOUT < 2mA
VPGOOD=5V
V
IPG_LK
PGOOD Leakage Current
0.2
1.0
µA
Notes:
2. Specifications guaranteed by design and characterization; not production tested.
3. Delay times are not tested in production. Guaranteed by design.
© 2008 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN2110 • Rev. 1.0.2
6
Typical Characteristics
1.010
1.005
1.000
0.995
0.990
1.20
1.10
1.00
0.90
0.80
-50
0
50
100
150
-50
0
50
100
150
Temperature (oC)
Temperature (oC)
Figure 4. Reference Voltage (VFB
)
Figure 5. Reference Bias Current (IFB
)
vs. Temperature, Normalized
vs. Temperature, Normalized
1500
1200
900
600
300
0
1.02
1.01
1.00
0.99
0.98
600KHz
300KHz
-50
0
50
100
150
0
20
40
60
80
100
120
140
Temperature (oC)
RT (K )
Ω
Figure 6. Frequency vs. RT
Figure 7. Frequency vs. Temperature, Normalized
1.4
1.2
1
1.04
1.02
1.00
0.98
0.96
Q1 ~0.32%/°C
Q2 ~0.35%/°C
0.8
0.6
-50
-50
0
50
100
150
0
50
100
150
Temperature (oC)
Temperature (°C)
Figure 8. RDS vs. Temperature, Normalized
(VCC=VGS=5V), Figure 1
Figure 9. ILIM Current (IILIM) vs. Temperature,
Normalized
© 2008 Fairchild Semiconductor Corporation
FAN2110 • Rev. 1.0.2
www.fairchildsemi.com
7
Application Circuits
FAN2110
Figure 10. Application Circuit: 1.5VOUT, 10A, 500KHz (10V-20VIN)
FAN2110
Figure 11. Application Circuit: 1.5VOUT, 10A, 500KHz (3.3V-5.5VIN)
© 2008 Fairchild Semiconductor Corporation
FAN2110 • Rev. 1.0.2
www.fairchildsemi.com
8
Typical Performance Characteristics
Typical operating characteristics using the circuit in Figure 10. VIN=12V, VCC=5V, TA=25°C, unless otherwise specified.
FAN2110_1.5V_500Khz
FAN2110_3.3V_500Khz
100
95
90
85
80
75
70
100
95
90
85
80
75
70
VIN = 10V
VIN = 12V
VIN = 16V
VIN = 20V
VIN = 10V
VIN = 12V
VIN = 16V
VIN = 20V
0
2
4
6
8
10
0
2
4
6
8
10
Load Current (Amps)
Load Current (Amps)
Figure 12. 1.5VOUT Efficiency, 500KHz
Figure 13. 3.3VOUT Efficiency, 500KHz(4)
FAN2110_1.5V_300Khz
FAN2110_3.3V_300Khz
100
100
95
90
85
80
75
70
95
90
85
80
75
70
VIN = 10V
VIN = 10V
VIN = 12V
VIN = 16V
VIN = 20V
VIN = 12V
VIN = 16V
VIN = 20V
0
2
4
6
8
10
0
2
4
6
8
10
Load Current (Amps)
Load Current (Amps)
Figure 14. 1.5VOUT Efficiency, 300KHz
Figure 15. 3.3VOUT Efficiency, 300KHz(4)
FAN2110_2.5V_600Khz
FAN2110_1.5V_500K(3.3-5.5V)
95
90
85
80
75
70
100
95
90
85
80
75
70
VIN = 10V
VIN = 12V
VIN = 16V
VIN = 20V
VIN=3.5V
VIN=4.5V
VIN=5.5V
0
2
4
6
8
10
0
2
4
6
8
10
Load Current (Amps)
Load Current (Amps)
Figure 16. 2.5VOUT Efficiency ,600KHz(4)
Figure 17. 1.5VOUT Efficiency, 500KHz
(VIN=3.3V to 5V), Figure 11
Note:
4. Circuit values for this configuration change in Figure 10.
© 2008 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN2110 • Rev. 1.0.2
9
Typical Performance Characteristics (Continued)
Typical operating characteristics using the circuit in Figure 10. VIN=12V, VCC=5V, TA=25°C unless otherwise specified.
Peak HS & LS Mosfet Tempr for 1.5V Output
(Measured on Demo Board)
Package Power Dissipation at various Vout(s)
Fsw = 500Khz
80
70
60
50
40
30
20
10
0
3
2.5
2
1.5
1
VIN=10V_HS
VIN=10V_LS
VIN=20V_HS
VIN=20V_LS
Vout = 1.5V
Vout = 1.8V
Vout = 3.3V
0.5
0
0
2
4
6
8
10
1
2
3
4
5
6
7
8
9
10
Load Current (A)
Load Current (Amps)
Figure 18. Peak MOSFET Temperatures, Figure 10
Figure 19. Device Dissipation Over VOUT vs. Load
Line Regulation Data
Load Regulation
0.05
0.02
0
0.01
0
0
2
4
6
8
10
-0.05
-0.1
5
10
15
20
25
-0.01
-0.02
-0.03
-0.04
-0.15
-0.2
VIN=10V
VIN=20V
No Load
1A Load
-0.25
Input Voltage (Volts)
Load Current (Amps)
Figure 20. 1.5VOUT Line Regulation
Figure 21.
1.5VOUT Load Regulation
Peak HS & LS Mosfet Tempr for 3.3V Output
(Measured on Demo Board)
Safe Operating Area curves for 70 Deg Temperature rise
VIN = 20V, Natural Convection
100
80
60
40
20
0
12
10
8
6
4
VIN=10V_HS
300K
500K
600K
VIN=10V_LS
VIN=20V_HS
VIN=20V_LS
2
0
0
2
4
6
8
10
12
14
1
2
3
4
5
6
7
8
9
10
Load Current (Amps)
Output Voltage (Volts)
Figure 23.
Typical 20VIN Safe Operation Area
Figure 22. Peak MOSFET Temperatures, 3.3V Output(5)
(SOA), 70°C Ambient Temperature, Natural
Convection
Note:
5. Circuit values for this configuration change in Figure 10.
© 2008 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN2110 • Rev. 1.0.2
10
Typical Performance Characteristics (Continued)
Typical operating characteristics using the circuit in Figure 10. VIN=12V, VCC=5V, TA=25°C unless otherwise specified.
VOUT
VOUT
VSW
EN
PGOOD
PGOOD
Figure 24. Startup, 10A Load
Figure 25. Startup with 1.0V Pre-Bias on VOUT
VOUT, 50mV/div
VOUT
EN
VSW, 10V/Div
PGOOD
Figure 26. Shutdown, 10A Resistive Load
Figure 27. VOUT Ripple and SW Voltage, 10A Load
VOUT, 200mV/div
IOUT, 5A/Div
IOUT, 5A/Div
EN, 2V/Div
Figure 28. Transient Response, 0-8A Load,
5A / µs Slew Rate
Figure 29. Restart on Short Circuit (Fault)
© 2008 Fairchild Semiconductor Corporation
FAN2110 • Rev. 1.0.2
www.fairchildsemi.com
11
Circuit Description
PWM Generation
1.35V
EN
FB
Refer to Figure 2 for the PWM control mechanism.
FAN2110 uses the summing-mode method of control to
generate the PWM pulses. An amplified current-sense
signal is summed with an internally generated ramp and
the combined signal is compared with the output of the
error amplifier to generate the pulse width to drive the
high-side MOSFET. Sensed current from the previous
cycle is used to modulate the output of the summing
block. The output of the summing block is also
compared against a voltage threshold set by the RLIM
resistor to limit the inductor current on a cycle-by-cycle
basis. RRAMP resistor helps set the charging current for
the internal ramp and provides input voltage feed-
forward function. The controller facilitates external
compensation for enhanced flexibility.
2400 CLKs
0.8V
Fault
Latch
Enable
1.0V
0.8V
SS
3200 CLKs
4000 CLKs
T0.8
Initialization
T1.0
Once VCC exceeds the UVLO threshold and EN is
HIGH, the IC checks for a shorted FB pin before
releasing the internal soft-start ramp (SS).
Figure 31. Soft-Start Timing Diagram
VCC UVLO or toggling the EN pin discharges the
internal SS and resets the IC. In applications where
external EN signal is used, VIN and VCC should be
established before the EN signal comes up to prevent
skipping the soft-start function.
If the parallel combination of R1 and RBIAS is ≤ 1KΩ, the
internal SS ramp is not released and the regulator does
not start.
Enable
Startup on Pre-Bias
FAN2110 has an internal pull-up to the enable (EN) pin
so that the IC is enabled once VCC exceeds the UVLO
threshold. Connecting a small capacitor across EN and
AGND delays the rate of voltage rise on the EN pin. The
EN pin also serves for the restart whenever a fault
occurs (refer to the Auto-Restart section). If the
regulator is enabled externally, the external EN signal
should go HIGH only after VCC is established. For
applications where such sequencing is required,
FAN2110 can be enabled (after the VCC comes up) with
external control, as shown in Figure 30.
The regulator does not allow the low-side MOSFET to
operate in full synchronous mode until SS reaches 95%
of VREF (~0.76V). This enables the regulator to startup
on a pre-biased output and ensures that pre-biased
outputs are not discharged during the soft-start cycle.
Protections
The converter output is monitored and protected
against extreme overload, short-circuit, over-voltage,
under-voltage, and over-temperature conditions.
Under-Voltage Shutdown
If voltage on the FB pin remains below the under-
voltage threshold for 16 consecutive clock cycles, the
fault latch is set and the converter shuts down. This
protection is not active until the internal SS ramp
reaches 1.0V during soft-start.
Over-Voltage Protection
Figure 30. Enabling with External Control
If voltage on the FB pin exceeds 115% of VREF for two
consecutive clock cycles, the fault latch is set and
shutdown occurs.
Soft-Start
Once internal SS ramp has charged to 0.8V (T0.8), the
output voltage is in regulation. Until SS ramp reaches
1.0V (T1.0), the fault latch is inhibited.
A shorted high-side MOSFET condition is detected
when SW voltage exceeds ~0.7V while the low-side
MOSFET is fully enhanced. The fault latch is set
immediately upon detection.
To avoid skipping the soft-start cycle, it is necessary to
apply VIN before VCC reaches its UVLO threshold. Normal
sequence for powering up would be VINÆVCCÆEN.
The OV/UV fault protection circuits above are active all
the time, including during soft-start.
Soft-start time is a function of oscillator frequency.
© 2008 Fairchild Semiconductor Corporation
FAN2110 • Rev. 1.0.2
www.fairchildsemi.com
12
If auto-restart is not desired, tie the EN pin to the VCC
pin or pull it HIGH after VCC comes up with a logic gate
to keep the 1µA current sink from discharging EN to
1.1V. Figure 32 shows one method to pull up EN to VCC
for a latch configuration.
Over-Temperature Protection (OTP)
The chip incorporates an over-temperature protection
circuit that sets the fault latch when a die temperature of
about 150°C is reached. The IC restarts when the die
temperature falls below 125°C.
Auto-Restart
After a fault, EN pin is discharged by a 1µA current sink
to a 1.1V threshold before the internal 800KΩ pull-up is
restored. A new soft-start cycle begins when EN
charges above 1.35V.
Depending on the external circuit, the FAN2110 can be
configured to remain latched-off or to automatically
restart after a fault.
Table 1. Fault / Restart Configurations
EN Pin
Controller / Restart State
Figure 32. Enable Control with Latch Option
Pull to GND
OFF (Disabled)
No Restart – Latched OFF
(After VCC Comes Up)
Pull-up to VCC with 100K
Open
Power-Good (PGOOD) Signal
Immediate Restart After Fault
PGOOD is an open-drain output that asserts LOW
when VOUT is out of regulation, as measured at the FB
pin. Thresholds are specified in the Electrical
Specifications section. PGOOD does not assert HIGH
until the fault latch is enabled (T1.0) (see Figure 31).
New Soft-Start Cycle After:
Cap. to GND
t
DELAY (ms)=3.9 • C(nf)
When EN is left open, restart is immediate.
© 2008 Fairchild Semiconductor Corporation
FAN2110 • Rev. 1.0.2
www.fairchildsemi.com
13
Application Information
Bias Supply
The FAN2110 requires a 5V supply rail to bias the IC
and provide gate-drive energy. Connect a ≥ 2.2µf X5R
or X7R decoupling capacitor between VCC and AGND.
VOUT
Vin
ΔIL • f
VOUT • (1-
)
(4)
L =
where f is the oscillator frequency.
Since VCC is used to drive the internal MOSFET gates,
supply current is frequency and voltage dependent.
Approximate VCC current (ICC) is calculated by:
Setting the Ramp Resistor Value
RRAMP resistor plays a critical role in the design by
providing charging current to the internal ramp capacitor
and also serving as a means to provide input voltage
feedforward.
VCC − 5
ICC
= 4.58 + [(
+ 0.013)•(f −128)]
(1)
(mA)
227
RRAMP is calculated by the following formula:
where frequency (f) is expressed in KHz.
(VIN −1.8)•VOUT
(31− 2.05 •IOUT )•VIN • f •10−6
RRAMP(KΩ)
=
− 2
Setting the Output Voltage
(5)
The output voltage of the regulator can be set from 0.8V
to 80% of VIN by an external resistor divider (R1 and
RBIAS in Figure 1). For output voltages >3.3V, output
current rating may need to be de-rated depending on
the ambient temperature, power dissipated in the
package and the PCB layout. (Refer to Thermal
Information table on page 4, Figure 22, and Figure 23.)
where frequency (f) is expressed in KHz.
For wide input operation, first calculate RRAMP for the
minimum and maximum input voltage conditions and
use larger of the two values calculated.
In all applications, current through the RRAMP pin must
be greater than 10µA from the equation below for
proper operation:
The external resistor divider is calculated using:
VOUT − 0.8V
R1
0.8V
=
+ 650nA
(2)
RBIAS
VIN −1.8
RRAMP + 2
≥ 10μA
(6)
Connect RBIAS between FB and AGND.
If R1 is open (see Figure 1), the output voltage is not
regulated and a latched fault occurs after the SS is
complete (T1.0).
If the calculated RRAMP values in Equation (5) result in a
current less than 10µA, use the RRAMP value that
satisfies Equation (6). In applications with large Input
ripple voltage, the RRAMP resistor should be adequately
decoupled from the input voltage to minimize ripple on
the ramp pin. For example, see Figure 11.
If the parallel combination of R1 and RBIAS is ≤ 1KΩ, the
internal SS ramp is not released and the regulator does
not start.
Setting the Current Limit
Setting the Clock Frequency
Oscillator frequency is determined by an external resistor,
RT, connected between the RT pin and AGND.
Resistance is calculated by:
There are two levels of current-limit thresholds. The first
level of protection is through an internal default limit set
at the factory to limit output current beyond normal
usage levels. The second level of protection is set
externally at the ILIM pin by connecting a resistor (RILIM
)
(106 / f ) −135
(3)
between ILIM and AGND. Current-limit protection is
enabled whenever the lower of the two thresholds is
reached (see Figure 33). FAN2110 uses its internal low-
side MOSFET for current-sensing. The current-limit
threshold voltage (VILIM) is compared to a scaled
version of voltage drop across the low-side MOSFET
sampled at the end of each PWM off-time/cycle. The
internal default threshold (with ILIM open) is temperature
compensated.
RT
=
(KΩ)
65
where RT is in KΩ and frequency (f) is in KHz.
The regulator cannot start if RT is left open.
Calculating the Inductor Value
Typically the inductor value is chosen based on ripple
current (ΔIL), which is chosen between 10 to 35% of the
maximum DC load. Regulator designs that require fast
transient response use a higher ripple-current setting,
while regulator designs that require higher efficiency
keep ripple current on the low side and operate at a
lower switching frequency. The inductor value is
calculated by the following formula:
© 2008 Fairchild Semiconductor Corporation
FAN2110 • Rev. 1.0.2
www.fairchildsemi.com
14
Figure 34. Compensation Network
Figure 33.ILIM Network
Since the FAN2110 employs summing current-mode
architecture, type-2 compensation can be used for
many applications. For applications that require wide
loop bandwidth and/or use very low-ESR output
capacitors, type-3 compensation may be required.
The ILIM pin can source a 10µA current that can be
used to establish a lower, temperature–dependent,
current-limit threshold by connecting an external
resistor (RILIM) to AGND. RILIM can be approximated with
the equation:
RRAMP also provides feedforward compensation for
changes in VIN. With a fixed RRAMP value, the modulator
gain increases as VIN is reduced, which could make it
difficult to compensate the loop. For low-input-voltage-
range designs (3V to 8V), RRAMP and the compensation
component values will be different compared to designs
with VIN between 8V and 24V.
(V −1.8)•VOUT •3.33•106
IN
RILIM(KΩ) = 95+ 6.1•IOUT
+
(7)
(RRAMP + 2)•V •f
IN
where:
IOUT = Full load current in Amps;
VOUT = Set output voltage;
VIN = Input voltage;
Recommended PCB Layout
R
f
RAMP = Ramp resistor used in KΩ; and
Good PCB layout and careful attention to temperature
rise is essential for reliable operation of the regulator.
Four-layer PCB with two-ounce copper on the top and
bottom side and thermal vias connecting the layers is
recommended. Keep power traces wide and short to
minimize losses and ringing. Do not connect AGND to
PGND below the IC. Connect the AGND pin to PGND at
the output OR to the PGND plane.
= Selected switching frequency in KHz.
After 16 consecutive, pulse-by-pulse, current-limit
cycles, the fault latch is set and the regulator shuts
down. Cycling VCC or EN restores operation after a
normal soft-start cycle (refer to Auto-Restart section).
The over-current protection fault latch is active during
the soft-start cycle. Use a 1% resistor for RILIM
.
Always use an external resistor RILIM to set the current
limit at the desired level. When RILIM is not connected,
the IC’s internal default current limit is fairly high. This
could lead to operation at high load currents, causing
overheating of the regulator. For a given RILIM and
VIN
SW
GND
RRAMP setting, the current limit point varies slightly in an
inverse relationship with respect to input voltage (VIN).
GND
Loop Compensation
The loop is compensated using a feedback network
around the error amplifier. Figure 34 shows a complete
VOUT
type-3
compensation
network.
For
type-2
compensation, eliminate R3 and C3.
Figure 35. Recommended PCB Layout
© 2008 Fairchild Semiconductor Corporation
FAN2110 • Rev. 1.0.2
www.fairchildsemi.com
15
Physical Dimensions
2X
TOP VIEW
2X
RECOMMENDED LAND PATTERN
ALL VALUES TYPICAL EXCEPT WHERE NOTED
SIDE VIEW
SEATING
PLANE
OPTIONAL LEAD DESIGN
(LEADS# 1, 24 & 25 ONLY)
SCALE: 1.5X
A) DIMENSIONS ARE IN MILLIMETERS.
B) DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994
BOTTOM VIEW
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
D) DESIGN BASED ON JEDEC MO-220
VARIATION WJHC
E) TERMINALS ARE SYMMETRICAL AROUND THE
X & Y AXIS EXCEPT WHERE DEPOPULATED.
F) DRAWING FILENAME: MKT-MLP25AREV3
Figure 36. 5x6mm Molded Leadless Package (MLP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2008 Fairchild Semiconductor Corporation
FAN2110 • Rev. 1.0.2
www.fairchildsemi.com
16
© 2008 Fairchild Semiconductor Corporation
FAN2110 • Rev. 1.0.2
www.fairchildsemi.com
17
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