FAN2110MPX [FAIRCHILD]

TinyBuck™, 3-24V Input, 10A, High-Efficiency, Integrated Synchronous Buck Regulator; TinyBuck一体化™ , 3-24V输入, 10A ,高效,集成的同步降压稳压器
FAN2110MPX
型号: FAN2110MPX
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

TinyBuck™, 3-24V Input, 10A, High-Efficiency, Integrated Synchronous Buck Regulator
TinyBuck一体化™ , 3-24V输入, 10A ,高效,集成的同步降压稳压器

稳压器
文件: 总17页 (文件大小:1484K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
August 2009  
FAN2110 — TinyBuck™  
3-24V Input, 10A, High-Efficiency, Integrated  
Synchronous Buck Regulator  
Features  
Description  
The FAN2110 TinyBuck™ is a highly efficient, small  
footprint, constant frequency, 10A integrated  
synchronous Buck regulator.  
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Wide Input Voltage Range: 3V-24V  
Wide Output Voltage Range: 0.8V to 80% VIN  
10A Output Current  
The FAN2110 contains both synchronous MOSFETs  
and a controller/driver with optimized interconnects in  
one package, which enables designers to solve high-  
current requirements in a small area with minimal  
external components. Integration helps to minimize  
critical inductances making component layout simpler  
and more efficient compared to discrete solutions.  
1% Reference Accuracy Over Temperature  
Over 93% Peak Efficiency  
Programmable Frequency Operation: 200KHz to  
600KHz  
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Fully Synchronous Operation with Integrated  
Schottky Diode on Low-Side MOSFET Boosts  
Efficiency  
The FAN2110 provides for external loop compensation,  
programmable switching frequency, and current limit.  
These features allow design flexibility and optimization.  
High frequency operation allows for all ceramic  
solutions.  
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Internal Bootstrap Diode  
Power-Good Signal  
Starts up on Pre-Bias Outputs  
Accepts Ceramic Capacitors on Output  
External Compensation for Flexible Design  
Programmable Current Limit  
The summing current mode modulator uses lossless  
current sensing for current feedback and over-current  
protection. Voltage feedforward helps operation over a  
wide input voltage range.  
Fairchild’s advanced BiCMOS power process,  
combined with low-RDS(ON) internal MOSFETs and a  
thermally efficient MLP package, provide the ability to  
dissipate high power in a small package.  
Under-Voltage, Over-Voltage, and Thermal  
Shutdown Protections  
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Internal Soft-Start  
5x6mm, 25-Pin, 3-Pad MLP Package  
Output over-voltage, under-voltage, and thermal  
shutdown protections help protect the device from  
damage during fault conditions. FAN2110 also prevents  
pre-biased output discharge during startup in point-of-  
load applications.  
Applications  
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Servers & Telecom  
Graphics Cards & Displays  
Computing Systems  
Related Application Notes  
AN-8022 — TinyCalc™ Calculator  
Point-of-Load Regulation  
Set-Top Boxes & Game Consoles  
Ordering Information  
Operating  
Part Number Temperature Range  
Eco  
Status  
Packing  
Method  
Package  
FAN2110MPX  
-10°C to 85°C  
-40°C to 85°C  
Molded Leadless Package (MLP) 5x6mm  
Molded Leadless Package (MLP) 5x6mm  
Green  
Green  
Tape and Reel  
Tape and Reel  
FAN2110EMPX  
For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.  
© 2008 Fairchild Semiconductor Corporation  
FAN2110 • Rev. 1.0.2  
www.fairchildsemi.com  
Typical Application  
Figure 1. Typical Application Diagram  
Block Diagram  
Figure 2. Block Diagram  
© 2008 Fairchild Semiconductor Corporation  
FAN2110 • Rev. 1.0.2  
www.fairchildsemi.com  
2
Pin Configuration  
Figure 3. MLP 5x6mm Pin Configuration (Bottom View)  
Pin Definitions  
Pin #  
P1, 6-12  
P2, 2-5  
Name Description  
SW  
VIN  
Switching Node. Junction of high-side and low-side MOSFETs.  
Power Conversion Input Voltage. Connect to the main input power source.  
P3, 21-23  
PGND Power Ground. Power return and Q2 source.  
High-Side Drive BOOT Voltage. Connect through capacitor (CBOOT) to SW. The IC  
1
BOOT  
PGOOD  
EN  
includes an internal synchronous bootstrap diode to recharge the capacitor on this pin to  
CC when SW is LOW.  
V
Power-Good Flag. An open-drain output that pulls LOW when FB is outside the limits  
specified in electrical specs. PGOOD does not assert HIGH until the fault latch is enabled.  
13  
14  
ENABLE. Enables operation when pulled to logic HIGH or left open. Toggling EN resets the  
regulator after a latched fault condition. This input has an internal pull-up when the IC is  
functioning normally. When a latched fault occurs, EN is discharged by a current sink.  
Input Bias Supply for IC. The IC’s logic and analog circuitry are powered from this pin.  
This pin should be decoupled to AGND through a > 2.2µF X5R / X7R capacitor.  
15  
16  
17  
VCC  
AGND  
ILIM  
Analog Ground. The signal ground for the IC. All internal control voltages are referred to  
this pin. Tie this pin to the ground island/plane through the lowest impedance connection.  
Current Limit. A resistor (RILIM) from this pin to AGND can be used to program the current-  
limit trip threshold lower than the internal default setting.  
Oscillator Frequency. A resistor (RT) from this pin to AGND sets the PWM switching  
frequency.  
18  
19  
20  
24  
25  
R(T)  
FB  
Output Voltage Feedback. Connect through a resistor divider to the output voltage.  
Compensation. Error amplifier output. Connect the external compensation network  
between this pin and FB.  
COMP  
NC  
No Connect. This pin is not used.  
Ramp Amplitude. A resistor (RRAMP) connected from this pin to VIN sets the ramp amplitude  
and provides voltage feedforward functionality.  
RAMP  
© 2008 Fairchild Semiconductor Corporation  
FAN2110 • Rev. 1.0.2  
www.fairchildsemi.com  
3
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device  
reliability. The absolute maximum ratings are stress ratings only.  
Parameter  
VIN to PGND  
VCC to AGND  
BOOT to PGND  
BOOT to SW  
Conditions  
Min.  
Max.  
28  
Unit  
V
AGND=PGND  
Continuous  
6
V
35  
V
-0.5  
-0.5  
-5  
6.0  
V
24.0  
30  
V
SW to PGND  
All other pins  
ESD  
Transient (t < 20ns, f < 600KHz)  
V
-0.3  
2.0  
2.5  
VCC+0.3  
V
Human Body Model, JEDEC JESD22-A114  
Charged Device Model, JEDEC JESD22-C101  
KV  
Recommended Operating Conditions  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended  
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not  
recommend exceeding them or designing to absolute maximum ratings.  
Symbol  
VCC  
Parameter  
Bias Voltage  
Conditions  
VCC to AGND  
Min.  
4.5  
3
Typ.  
Max.  
5.5  
Unit  
V
5.0  
VIN  
Supply Voltage  
VIN to PGND  
FAN2110MPX  
FAN2110EMPX  
24  
V
-10  
-40  
+85  
+85  
+125  
600  
°C  
°C  
°C  
kHz  
TA  
Ambient Temperature  
TJ  
Junction Temperature  
Switching Frequency  
fSW  
200  
Thermal Information  
Symbol  
Parameter  
Min.  
Typ.  
Max.  
+150  
+300  
Unit  
°C  
TSTG  
TL  
Storage Temperature  
-65  
Lead Soldering Temperature, 10 Seconds  
Thermal Resistance: Junction-to-Case  
°C  
P1 (Q2)  
P2 (Q1)  
P3  
4
7
°C/W  
°C/W  
°C/W  
°C/W  
W
θJC  
4
Thermal Resistance: Junction-to-Mounting Surface(1)  
Power Dissipation, TA=25°C(1)  
35  
θJ-PCB  
PD  
2.8  
Note:  
1. Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 35. Actual results  
are dependent on mounting method and surface related to the design.  
© 2008 Fairchild Semiconductor Corporation  
FAN2110 • Rev. 1.0.2  
www.fairchildsemi.com  
4
Electrical Specifications  
Electrical specifications are the result of using the circuit shown in Figure 1 with VIN=12V, unless otherwise noted.  
Symbol  
Parameter  
Conditions  
Min. Typ. Max. Unit  
Power Supplies  
SW=Open, VFB=0.7V, VCC=5V,  
8
12  
mA  
f
SW=600KHz  
ICC  
VCC Current  
Shutdown: EN=0, VCC=5V  
Rising VCC  
7
10  
µA  
V
4.1  
4.3  
300  
4.5  
VUVLO  
Oscillator  
fSW  
VCC UVLO Threshold  
Hysteresis  
mV  
255  
540  
300  
600  
50  
345  
660  
65  
KHz  
KHz  
ns  
RT=50KΩ to GND  
RT=24KΩ to GND  
Frequency  
tONmin  
Minimum On-Time(2)  
16VIN, 1.8VOUT, RT=30KΩ,  
VRAMP  
Ramp Amplitude, Peak-to-Peak  
Minimum Off-Time(2)  
0.53  
100  
V
RRAMP=200KΩ  
tOFFmin  
150  
ns  
Reference  
FAN2110MPX, 25°C  
FAN2110EMPX, 25°C  
794  
795  
800  
800  
806  
805  
mV  
mV  
Reference Voltage (see Figure 4 for  
Temperature Coefficient)  
VFB  
Error Amplifier  
G
DC Gain(2)  
Gain Bandwidth Product(2)  
Output Voltage(2)  
80  
12  
85  
15  
dB  
MHz  
V
VCC=5V  
GBW  
VCOMP  
ISINK  
0.4  
1.5  
0.8  
3.2  
Output Current, Sourcing  
VCC=5V, VCOMP=2.2V  
VCC=5V, VCOMP=1.2V  
VFB=0.8V, 25°C  
2.2  
1.2  
mA  
mA  
nA  
ISOURCE Output Current, Sinking  
IBIAS FB Bias Current  
Protection and Shutdown  
-850 -650 -450  
RILIM=182 KΩ,, 25°C, fSW=500KHz,  
Current Limit (see Circuit  
ILIM  
12  
14  
16  
-9  
A
Description)(2)  
V
OUT=1.5V, RRAMP=243KΩ,  
16 Consecutive Clock Cycles(3)  
VCC=5V, 25°C  
IILIM  
TTSD  
THYS  
VOVP  
VUVSD  
VFLT  
ILIM Current  
-11  
-10  
+155  
+30  
115  
73  
µA  
°C  
°C  
Over-Temperature Shutdown(2)  
Over-Temperature Hysteresis(2)  
Over-Voltage Threshold  
Under-Voltage Shutdown  
Fault Discharge Threshold  
Internal IC Temperature  
2 Consecutive Clock Cycles(3)  
16 Consecutive Clock Cycles(3)  
Measured at FB Pin  
110  
68  
121 %VOUT  
78  
%VOUT  
mV  
250  
250  
VFLT_HYS Fault Discharge Hysteresis  
Measured at FB Pin (VFB ~500mV)  
mV  
Soft-Start  
tSS  
tEN  
VOUT to Regulation (T0.8)  
Fault Enable/SSOK (T1.0)(2)  
5.3  
6.7  
ms  
ms  
f
SW=500KHz  
Continued on the following page…  
© 2008 Fairchild Semiconductor Corporation  
FAN2110 • Rev. 1.0.2  
www.fairchildsemi.com  
5
Electrical Specifications (Continued)  
Electrical specifications are the result of using the circuit shown in Figure 1 with VIN=12V, unless otherwise noted.  
Symbol  
Parameter  
Conditions  
Min. Typ. Max. Unit  
Control Functions  
VEN  
EN Threshold, Rising  
VCC=5V  
VCC=5V  
VCC=5V  
1.35 2.00  
V
VEN_HYS EN Hysteresis  
250  
800  
1
mV  
KΩ  
µA  
Ω
REN  
EN Pull-Up Resistance  
IEN_DISC EN Discharge Current  
Auto-Restart Mode, VCC=5V  
RFBok  
FB OK Drive Resistance  
PGOOD LOW Threshold  
800  
FB < VREF, 2 Consecutive Clock  
Cycles(3)  
VPGTH_LO  
-14  
+7  
-11  
-8  
%VREF  
FB > VREF, 2 Consecutive Clock  
Cycles(3)  
VPGTH_UP  
+10 +13.5  
0.4  
VPG_LO PGOOD Output Low  
IOUT < 2mA  
VPGOOD=5V  
V
IPG_LK  
PGOOD Leakage Current  
0.2  
1.0  
µA  
Notes:  
2. Specifications guaranteed by design and characterization; not production tested.  
3. Delay times are not tested in production. Guaranteed by design.  
© 2008 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN2110 • Rev. 1.0.2  
6
Typical Characteristics  
1.010  
1.005  
1.000  
0.995  
0.990  
1.20  
1.10  
1.00  
0.90  
0.80  
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
Temperature (oC)  
Temperature (oC)  
Figure 4. Reference Voltage (VFB  
)
Figure 5. Reference Bias Current (IFB  
)
vs. Temperature, Normalized  
vs. Temperature, Normalized  
1500  
1200  
900  
600  
300  
0
1.02  
1.01  
1.00  
0.99  
0.98  
600KHz  
300KHz  
-50  
0
50  
100  
150  
0
20  
40  
60  
80  
100  
120  
140  
Temperature (oC)  
RT (K )  
Ω
Figure 6. Frequency vs. RT  
Figure 7. Frequency vs. Temperature, Normalized  
1.4  
1.2  
1
1.04  
1.02  
1.00  
0.98  
0.96  
Q1 ~0.32%/°C  
Q2 ~0.35%/°C  
0.8  
0.6  
-50  
-50  
0
50  
100  
150  
0
50  
100  
150  
Temperature (oC)  
Temperature (°C)  
Figure 8. RDS vs. Temperature, Normalized  
(VCC=VGS=5V), Figure 1  
Figure 9. ILIM Current (IILIM) vs. Temperature,  
Normalized  
© 2008 Fairchild Semiconductor Corporation  
FAN2110 • Rev. 1.0.2  
www.fairchildsemi.com  
7
Application Circuits  
FAN2110  
Figure 10. Application Circuit: 1.5VOUT, 10A, 500KHz (10V-20VIN)  
FAN2110  
Figure 11. Application Circuit: 1.5VOUT, 10A, 500KHz (3.3V-5.5VIN)  
© 2008 Fairchild Semiconductor Corporation  
FAN2110 • Rev. 1.0.2  
www.fairchildsemi.com  
8
Typical Performance Characteristics  
Typical operating characteristics using the circuit in Figure 10. VIN=12V, VCC=5V, TA=25°C, unless otherwise specified.  
FAN2110_1.5V_500Khz  
FAN2110_3.3V_500Khz  
100  
95  
90  
85  
80  
75  
70  
100  
95  
90  
85  
80  
75  
70  
VIN = 10V  
VIN = 12V  
VIN = 16V  
VIN = 20V  
VIN = 10V  
VIN = 12V  
VIN = 16V  
VIN = 20V  
0
2
4
6
8
10  
0
2
4
6
8
10  
Load Current (Amps)  
Load Current (Amps)  
Figure 12. 1.5VOUT Efficiency, 500KHz  
Figure 13. 3.3VOUT Efficiency, 500KHz(4)  
FAN2110_1.5V_300Khz  
FAN2110_3.3V_300Khz  
100  
100  
95  
90  
85  
80  
75  
70  
95  
90  
85  
80  
75  
70  
VIN = 10V  
VIN = 10V  
VIN = 12V  
VIN = 16V  
VIN = 20V  
VIN = 12V  
VIN = 16V  
VIN = 20V  
0
2
4
6
8
10  
0
2
4
6
8
10  
Load Current (Amps)  
Load Current (Amps)  
Figure 14. 1.5VOUT Efficiency, 300KHz  
Figure 15. 3.3VOUT Efficiency, 300KHz(4)  
FAN2110_2.5V_600Khz  
FAN2110_1.5V_500K(3.3-5.5V)  
95  
90  
85  
80  
75  
70  
100  
95  
90  
85  
80  
75  
70  
VIN = 10V  
VIN = 12V  
VIN = 16V  
VIN = 20V  
VIN=3.5V  
VIN=4.5V  
VIN=5.5V  
0
2
4
6
8
10  
0
2
4
6
8
10  
Load Current (Amps)  
Load Current (Amps)  
Figure 16. 2.5VOUT Efficiency ,600KHz(4)  
Figure 17. 1.5VOUT Efficiency, 500KHz  
(VIN=3.3V to 5V), Figure 11  
Note:  
4. Circuit values for this configuration change in Figure 10.  
© 2008 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN2110 • Rev. 1.0.2  
9
Typical Performance Characteristics (Continued)  
Typical operating characteristics using the circuit in Figure 10. VIN=12V, VCC=5V, TA=25°C unless otherwise specified.  
Peak HS & LS Mosfet Tempr for 1.5V Output  
(Measured on Demo Board)  
Package Power Dissipation at various Vout(s)  
Fsw = 500Khz  
80  
70  
60  
50  
40  
30  
20  
10  
0
3
2.5  
2
1.5  
1
VIN=10V_HS  
VIN=10V_LS  
VIN=20V_HS  
VIN=20V_LS  
Vout = 1.5V  
Vout = 1.8V  
Vout = 3.3V  
0.5  
0
0
2
4
6
8
10  
1
2
3
4
5
6
7
8
9
10  
Load Current (A)  
Load Current (Amps)  
Figure 18. Peak MOSFET Temperatures, Figure 10  
Figure 19. Device Dissipation Over VOUT vs. Load  
Line Regulation Data  
Load Regulation  
0.05  
0.02  
0
0.01  
0
0
2
4
6
8
10  
-0.05  
-0.1  
5
10  
15  
20  
25  
-0.01  
-0.02  
-0.03  
-0.04  
-0.15  
-0.2  
VIN=10V  
VIN=20V  
No Load  
1A Load  
-0.25  
Input Voltage (Volts)  
Load Current (Amps)  
Figure 20. 1.5VOUT Line Regulation  
Figure 21.  
1.5VOUT Load Regulation  
Peak HS & LS Mosfet Tempr for 3.3V Output  
(Measured on Demo Board)  
Safe Operating Area curves for 70 Deg Temperature rise  
VIN = 20V, Natural Convection  
100  
80  
60  
40  
20  
0
12  
10  
8
6
4
VIN=10V_HS  
300K  
500K  
600K  
VIN=10V_LS  
VIN=20V_HS  
VIN=20V_LS  
2
0
0
2
4
6
8
10  
12  
14  
1
2
3
4
5
6
7
8
9
10  
Load Current (Amps)  
Output Voltage (Volts)  
Figure 23.  
Typical 20VIN Safe Operation Area  
Figure 22. Peak MOSFET Temperatures, 3.3V Output(5)  
(SOA), 70°C Ambient Temperature, Natural  
Convection  
Note:  
5. Circuit values for this configuration change in Figure 10.  
© 2008 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN2110 • Rev. 1.0.2  
10  
Typical Performance Characteristics (Continued)  
Typical operating characteristics using the circuit in Figure 10. VIN=12V, VCC=5V, TA=25°C unless otherwise specified.  
VOUT  
VOUT  
VSW  
EN  
PGOOD  
PGOOD  
Figure 24. Startup, 10A Load  
Figure 25. Startup with 1.0V Pre-Bias on VOUT  
VOUT, 50mV/div  
VOUT  
EN  
VSW, 10V/Div  
PGOOD  
Figure 26. Shutdown, 10A Resistive Load  
Figure 27. VOUT Ripple and SW Voltage, 10A Load  
VOUT, 200mV/div  
IOUT, 5A/Div  
IOUT, 5A/Div  
EN, 2V/Div  
Figure 28. Transient Response, 0-8A Load,  
5A / µs Slew Rate  
Figure 29. Restart on Short Circuit (Fault)  
© 2008 Fairchild Semiconductor Corporation  
FAN2110 • Rev. 1.0.2  
www.fairchildsemi.com  
11  
Circuit Description  
PWM Generation  
1.35V  
EN  
FB  
Refer to Figure 2 for the PWM control mechanism.  
FAN2110 uses the summing-mode method of control to  
generate the PWM pulses. An amplified current-sense  
signal is summed with an internally generated ramp and  
the combined signal is compared with the output of the  
error amplifier to generate the pulse width to drive the  
high-side MOSFET. Sensed current from the previous  
cycle is used to modulate the output of the summing  
block. The output of the summing block is also  
compared against a voltage threshold set by the RLIM  
resistor to limit the inductor current on a cycle-by-cycle  
basis. RRAMP resistor helps set the charging current for  
the internal ramp and provides input voltage feed-  
forward function. The controller facilitates external  
compensation for enhanced flexibility.  
2400 CLKs  
0.8V  
Fault  
Latch  
Enable  
1.0V  
0.8V  
SS  
3200 CLKs  
4000 CLKs  
T0.8  
Initialization  
T1.0  
Once VCC exceeds the UVLO threshold and EN is  
HIGH, the IC checks for a shorted FB pin before  
releasing the internal soft-start ramp (SS).  
Figure 31. Soft-Start Timing Diagram  
VCC UVLO or toggling the EN pin discharges the  
internal SS and resets the IC. In applications where  
external EN signal is used, VIN and VCC should be  
established before the EN signal comes up to prevent  
skipping the soft-start function.  
If the parallel combination of R1 and RBIAS is 1KΩ, the  
internal SS ramp is not released and the regulator does  
not start.  
Enable  
Startup on Pre-Bias  
FAN2110 has an internal pull-up to the enable (EN) pin  
so that the IC is enabled once VCC exceeds the UVLO  
threshold. Connecting a small capacitor across EN and  
AGND delays the rate of voltage rise on the EN pin. The  
EN pin also serves for the restart whenever a fault  
occurs (refer to the Auto-Restart section). If the  
regulator is enabled externally, the external EN signal  
should go HIGH only after VCC is established. For  
applications where such sequencing is required,  
FAN2110 can be enabled (after the VCC comes up) with  
external control, as shown in Figure 30.  
The regulator does not allow the low-side MOSFET to  
operate in full synchronous mode until SS reaches 95%  
of VREF (~0.76V). This enables the regulator to startup  
on a pre-biased output and ensures that pre-biased  
outputs are not discharged during the soft-start cycle.  
Protections  
The converter output is monitored and protected  
against extreme overload, short-circuit, over-voltage,  
under-voltage, and over-temperature conditions.  
Under-Voltage Shutdown  
If voltage on the FB pin remains below the under-  
voltage threshold for 16 consecutive clock cycles, the  
fault latch is set and the converter shuts down. This  
protection is not active until the internal SS ramp  
reaches 1.0V during soft-start.  
Over-Voltage Protection  
Figure 30. Enabling with External Control  
If voltage on the FB pin exceeds 115% of VREF for two  
consecutive clock cycles, the fault latch is set and  
shutdown occurs.  
Soft-Start  
Once internal SS ramp has charged to 0.8V (T0.8), the  
output voltage is in regulation. Until SS ramp reaches  
1.0V (T1.0), the fault latch is inhibited.  
A shorted high-side MOSFET condition is detected  
when SW voltage exceeds ~0.7V while the low-side  
MOSFET is fully enhanced. The fault latch is set  
immediately upon detection.  
To avoid skipping the soft-start cycle, it is necessary to  
apply VIN before VCC reaches its UVLO threshold. Normal  
sequence for powering up would be VINÆVCCÆEN.  
The OV/UV fault protection circuits above are active all  
the time, including during soft-start.  
Soft-start time is a function of oscillator frequency.  
© 2008 Fairchild Semiconductor Corporation  
FAN2110 • Rev. 1.0.2  
www.fairchildsemi.com  
12  
If auto-restart is not desired, tie the EN pin to the VCC  
pin or pull it HIGH after VCC comes up with a logic gate  
to keep the 1µA current sink from discharging EN to  
1.1V. Figure 32 shows one method to pull up EN to VCC  
for a latch configuration.  
Over-Temperature Protection (OTP)  
The chip incorporates an over-temperature protection  
circuit that sets the fault latch when a die temperature of  
about 150°C is reached. The IC restarts when the die  
temperature falls below 125°C.  
Auto-Restart  
After a fault, EN pin is discharged by a 1µA current sink  
to a 1.1V threshold before the internal 800KΩ pull-up is  
restored. A new soft-start cycle begins when EN  
charges above 1.35V.  
Depending on the external circuit, the FAN2110 can be  
configured to remain latched-off or to automatically  
restart after a fault.  
Table 1. Fault / Restart Configurations  
EN Pin  
Controller / Restart State  
Figure 32. Enable Control with Latch Option  
Pull to GND  
OFF (Disabled)  
No Restart – Latched OFF  
(After VCC Comes Up)  
Pull-up to VCC with 100K  
Open  
Power-Good (PGOOD) Signal  
Immediate Restart After Fault  
PGOOD is an open-drain output that asserts LOW  
when VOUT is out of regulation, as measured at the FB  
pin. Thresholds are specified in the Electrical  
Specifications section. PGOOD does not assert HIGH  
until the fault latch is enabled (T1.0) (see Figure 31).  
New Soft-Start Cycle After:  
Cap. to GND  
t
DELAY (ms)=3.9 • C(nf)  
When EN is left open, restart is immediate.  
© 2008 Fairchild Semiconductor Corporation  
FAN2110 • Rev. 1.0.2  
www.fairchildsemi.com  
13  
Application Information  
Bias Supply  
The FAN2110 requires a 5V supply rail to bias the IC  
and provide gate-drive energy. Connect a 2.2µf X5R  
or X7R decoupling capacitor between VCC and AGND.  
VOUT  
Vin  
ΔIL f  
VOUT (1-  
)
(4)  
L =  
where f is the oscillator frequency.  
Since VCC is used to drive the internal MOSFET gates,  
supply current is frequency and voltage dependent.  
Approximate VCC current (ICC) is calculated by:  
Setting the Ramp Resistor Value  
RRAMP resistor plays a critical role in the design by  
providing charging current to the internal ramp capacitor  
and also serving as a means to provide input voltage  
feedforward.  
VCC 5  
ICC  
= 4.58 + [(  
+ 0.013)(f 128)]  
(1)  
(mA)  
227  
RRAMP is calculated by the following formula:  
where frequency (f) is expressed in KHz.  
(VIN 1.8)VOUT  
(312.05 IOUT )VIN f 106  
RRAMP(KΩ)  
=
2  
Setting the Output Voltage  
(5)  
The output voltage of the regulator can be set from 0.8V  
to 80% of VIN by an external resistor divider (R1 and  
RBIAS in Figure 1). For output voltages >3.3V, output  
current rating may need to be de-rated depending on  
the ambient temperature, power dissipated in the  
package and the PCB layout. (Refer to Thermal  
Information table on page 4, Figure 22, and Figure 23.)  
where frequency (f) is expressed in KHz.  
For wide input operation, first calculate RRAMP for the  
minimum and maximum input voltage conditions and  
use larger of the two values calculated.  
In all applications, current through the RRAMP pin must  
be greater than 10µA from the equation below for  
proper operation:  
The external resistor divider is calculated using:  
VOUT 0.8V  
R1  
0.8V  
=
+ 650nA  
(2)  
RBIAS  
VIN 1.8  
RRAMP + 2  
10μA  
(6)  
Connect RBIAS between FB and AGND.  
If R1 is open (see Figure 1), the output voltage is not  
regulated and a latched fault occurs after the SS is  
complete (T1.0).  
If the calculated RRAMP values in Equation (5) result in a  
current less than 10µA, use the RRAMP value that  
satisfies Equation (6). In applications with large Input  
ripple voltage, the RRAMP resistor should be adequately  
decoupled from the input voltage to minimize ripple on  
the ramp pin. For example, see Figure 11.  
If the parallel combination of R1 and RBIAS is 1KΩ, the  
internal SS ramp is not released and the regulator does  
not start.  
Setting the Current Limit  
Setting the Clock Frequency  
Oscillator frequency is determined by an external resistor,  
RT, connected between the RT pin and AGND.  
Resistance is calculated by:  
There are two levels of current-limit thresholds. The first  
level of protection is through an internal default limit set  
at the factory to limit output current beyond normal  
usage levels. The second level of protection is set  
externally at the ILIM pin by connecting a resistor (RILIM  
)
(106 / f ) 135  
(3)  
between ILIM and AGND. Current-limit protection is  
enabled whenever the lower of the two thresholds is  
reached (see Figure 33). FAN2110 uses its internal low-  
side MOSFET for current-sensing. The current-limit  
threshold voltage (VILIM) is compared to a scaled  
version of voltage drop across the low-side MOSFET  
sampled at the end of each PWM off-time/cycle. The  
internal default threshold (with ILIM open) is temperature  
compensated.  
RT  
=
(KΩ)  
65  
where RT is in KΩ and frequency (f) is in KHz.  
The regulator cannot start if RT is left open.  
Calculating the Inductor Value  
Typically the inductor value is chosen based on ripple  
current (ΔIL), which is chosen between 10 to 35% of the  
maximum DC load. Regulator designs that require fast  
transient response use a higher ripple-current setting,  
while regulator designs that require higher efficiency  
keep ripple current on the low side and operate at a  
lower switching frequency. The inductor value is  
calculated by the following formula:  
© 2008 Fairchild Semiconductor Corporation  
FAN2110 • Rev. 1.0.2  
www.fairchildsemi.com  
14  
Figure 34. Compensation Network  
Figure 33.ILIM Network  
Since the FAN2110 employs summing current-mode  
architecture, type-2 compensation can be used for  
many applications. For applications that require wide  
loop bandwidth and/or use very low-ESR output  
capacitors, type-3 compensation may be required.  
The ILIM pin can source a 10µA current that can be  
used to establish a lower, temperature–dependent,  
current-limit threshold by connecting an external  
resistor (RILIM) to AGND. RILIM can be approximated with  
the equation:  
RRAMP also provides feedforward compensation for  
changes in VIN. With a fixed RRAMP value, the modulator  
gain increases as VIN is reduced, which could make it  
difficult to compensate the loop. For low-input-voltage-  
range designs (3V to 8V), RRAMP and the compensation  
component values will be different compared to designs  
with VIN between 8V and 24V.  
(V 1.8)VOUT 3.33106  
IN  
RILIM(KΩ) = 95+ 6.1IOUT  
+
(7)  
(RRAMP + 2)V f  
IN  
where:  
IOUT = Full load current in Amps;  
VOUT = Set output voltage;  
VIN = Input voltage;  
Recommended PCB Layout  
R
f
RAMP = Ramp resistor used in KΩ; and  
Good PCB layout and careful attention to temperature  
rise is essential for reliable operation of the regulator.  
Four-layer PCB with two-ounce copper on the top and  
bottom side and thermal vias connecting the layers is  
recommended. Keep power traces wide and short to  
minimize losses and ringing. Do not connect AGND to  
PGND below the IC. Connect the AGND pin to PGND at  
the output OR to the PGND plane.  
= Selected switching frequency in KHz.  
After 16 consecutive, pulse-by-pulse, current-limit  
cycles, the fault latch is set and the regulator shuts  
down. Cycling VCC or EN restores operation after a  
normal soft-start cycle (refer to Auto-Restart section).  
The over-current protection fault latch is active during  
the soft-start cycle. Use a 1% resistor for RILIM  
.
Always use an external resistor RILIM to set the current  
limit at the desired level. When RILIM is not connected,  
the IC’s internal default current limit is fairly high. This  
could lead to operation at high load currents, causing  
overheating of the regulator. For a given RILIM and  
VIN  
SW  
GND  
RRAMP setting, the current limit point varies slightly in an  
inverse relationship with respect to input voltage (VIN).  
GND  
Loop Compensation  
The loop is compensated using a feedback network  
around the error amplifier. Figure 34 shows a complete  
VOUT  
type-3  
compensation  
network.  
For  
type-2  
compensation, eliminate R3 and C3.  
Figure 35. Recommended PCB Layout  
© 2008 Fairchild Semiconductor Corporation  
FAN2110 • Rev. 1.0.2  
www.fairchildsemi.com  
15  
Physical Dimensions  
2X  
TOP VIEW  
2X  
RECOMMENDED LAND PATTERN  
ALL VALUES TYPICAL EXCEPT WHERE NOTED  
SIDE VIEW  
SEATING  
PLANE  
OPTIONAL LEAD DESIGN  
(LEADS# 1, 24 & 25 ONLY)  
SCALE: 1.5X  
A) DIMENSIONS ARE IN MILLIMETERS.  
B) DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 1994  
BOTTOM VIEW  
C) DIMENSIONS DO NOT INCLUDE MOLD  
FLASH OR BURRS.  
D) DESIGN BASED ON JEDEC MO-220  
VARIATION WJHC  
E) TERMINALS ARE SYMMETRICAL AROUND THE  
X & Y AXIS EXCEPT WHERE DEPOPULATED.  
F) DRAWING FILENAME: MKT-MLP25AREV3  
Figure 36. 5x6mm Molded Leadless Package (MLP)  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify  
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically  
the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
© 2008 Fairchild Semiconductor Corporation  
FAN2110 • Rev. 1.0.2  
www.fairchildsemi.com  
16  
© 2008 Fairchild Semiconductor Corporation  
FAN2110 • Rev. 1.0.2  
www.fairchildsemi.com  
17  

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