FAN302ULMY [FAIRCHILD]

PWM Controller for Low Standby Power Battery-Charger Applications; PWM控制器,用于低待机功耗电池充电器应用
FAN302ULMY
型号: FAN302ULMY
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

PWM Controller for Low Standby Power Battery-Charger Applications
PWM控制器,用于低待机功耗电池充电器应用

电池 控制器
文件: 总19页 (文件大小:1943K)
中文:  中文翻译
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May 2012  
FAN302UL  
PWM Controller for Low Standby Power Battery-  
Charger Applications — mWSaver™ Technology  
Features  
Description  
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mWSaver™ Technology Provides  
Best-in-Class Standby Power  
Advanced PWM controller FAN302UL significantly  
simplifies isolated power supply designs that require  
Constant Current (CC) regulation of the output. The  
output current is precisely estimated with information in  
the primary side of the transformer and controlled with  
an internal compensation circuit, not only removing the  
output current sensing loss, but also eliminating external  
CC control circuitry. A Green-Mode function with an  
extremely low operating current (200µA) in Burst Mode  
maximizes light-load efficiency, enabling conformance  
to worldwide Standby Mode efficiency guidelines.  
Achieves <10mW, Far Below Energy Star’s 5-Star  
Level (<30mW).  
Proprietary 500V High-Voltage JFET Startup  
Reduces Startup Resistor Loss  
Low Operation Current in Burst Mode:  
350µA Maximum  
Constant-Current (CC) Control without Secondary-  
Side Feedback Circuitry  
Integrated protections include two-level pulse-by-pulse  
current limit, Over-Voltage Protection (OVP), brownout  
protection, and Over-Temperature Protection (OTP).  
Fixed PWM Frequency at 140kHz with Frequency  
Hopping to Reduce EMI  
.
.
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High-Voltage Startup  
Compared with a conventional approach using external  
control circuit in the secondary side for CC regulation;  
the FAN302UL reduces total cost, component count,  
size, and weight, while simultaneously increasing  
efficiency, productivity, and system reliability.  
Low Operating Current: 3.5mA  
Peak-Current-Mode Control with Slope  
Compensation  
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Cycle-by-Cycle Current Limiting  
Maximum  
Typical  
Minimum  
VO  
VDD Over-Voltage Protection (Auto-Restart)  
VS Over-Voltage Protection (Latch Mode)  
VDD Under-Voltage Lockout (UVLO)  
Gate Output Maximum Voltage Clamped at 15V  
Fixed Over-Temperature Protection (Latch Mode)  
Available in an 8-Lead SOIC Package  
Applications  
IO  
Battery chargers for cellular phones, cordless phones,  
PDA, digital cameras, and power tools. Replaces linear  
transformers and RCC SMPS.  
Figure 1. Typical Output V-I Characteristic  
Ordering Information  
Operating  
Part Number  
Packing  
Method  
Package  
Temperature Range  
8-Lead, Small-Outline Integrated Circuit (SOIC),  
JEDEC MS-012, .150-Inch Narrow Body  
FAN302ULMY  
Tape & Reel  
-40°C to +105°C  
© 2011 Fairchild Semiconductor Corporation  
FAN302UL • Rev. 1.0.3  
www.fairchildsemi.com  
Application Diagram  
Figure 2. Typical Application  
Internal Block Diagram  
Figure 3. Functional Block Diagram  
© 2011 Fairchild Semiconductor Corporation  
FAN302UL • Rev. 1.0.3  
www.fairchildsemi.com  
2
Marking Information  
F- Fairchild Logo  
Z: Assembly Plant Code  
X: Year Code  
Y: Week Code  
TT: Die Run Code  
T: M=SOP  
P: Y= Green Package  
M: Manufacture Flow Code  
Figure 4.Top Mark  
Pin Configuration  
Figure 5. Pin Assignments  
Description  
Pin Definitions  
Pin #  
Name  
Current Sense. This pin connects a current-sense resistor to detect the MOSFET current for  
Peak-Current-Mode control for output regulation. The current-sense information is also used to  
estimate the output current for CC regulation.  
1
CS  
PWM Signal Output. This pin has an internal totem-pole output driver to drive the power  
MOSFET. It is internally clamped at 15V.  
2
3
GATE  
VDD  
Power Supply. IC operating current and MOSFET driving current are supplied through this pin.  
This pin is typically connected to an external VDD capacitor.  
Voltage Sense. This pin detects the output voltage information and diode current discharge  
time based on voltage of the auxiliary winding.  
4
5
VS  
GND  
Ground  
Feedback. Typically, an Opto-Coupler is connected to this pin to provide feedback information  
to the internal PWM comparator. This feedback is used to control the duty cycle in CV  
regulation.  
6
FB  
7
8
NC  
HV  
No Connect  
High Voltage. This pin connects to the DC bus for high-voltage startup.  
© 2011 Fairchild Semiconductor Corporation  
FAN302UL • Rev. 1.0.3  
www.fairchildsemi.com  
3
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
Parameter  
Min.  
Max.  
Unit  
VHV  
VVDD  
VVS  
VCS  
VFB  
PD  
HV Pin Input Voltage  
DC Supply Voltage(1,2)  
VS Pin Input Voltage  
CS Pin Input Voltage  
FB Pin Input Voltage  
500  
30  
V
V
-0.3  
-0.3  
-0.3  
7.0  
7.0  
7.0  
660  
150  
V
V
V
mW  
°C/W  
Power Dissipation (TA=25°C)  
θJA  
Thermal Resistance (Junction-to-Air)  
Thermal Resistance (Junction-to-Case)  
Operating Junction Temperature  
θJC  
TJ  
39  
°C/W  
°C  
-40  
-55  
+150  
+150  
+260  
TSTG  
TL  
Storage Temperature Range  
°C  
Lead Temperature (Wave Soldering or IR, 10 Seconds)  
°C  
Human Body Model,  
JEDEC:JESD22_A114  
5.0  
1.5  
(Except HV Pin)(3)  
Electrostatic Discharge Capability  
ESD  
kV  
Charged Device Model,  
JEDEC:JESD22_C101  
(Except HV Pin)(3)  
Notes:  
1. All voltage values, except differential voltages, are given with respect to the GND pin.  
2. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.  
3. ESD ratings including the HV pin: HBM=500V, CDM=750V.  
© 2011 Fairchild Semiconductor Corporation  
FAN302UL • Rev. 1.0.3  
www.fairchildsemi.com  
4
Electrical Characteristics  
VDD=15V and TA=25°C unless noted.  
Symbol  
Parameter  
Condition  
Min. Typ. Max. Unit  
HV Section  
VHV-MIN Minimum Startup Voltage on HV Pin  
50  
V
VHV=100V, VDD=0V,  
Controller Off  
IHV  
Supply Current Drawn from HV Pin  
0.8  
1.5  
0.8  
5.0  
mA  
VHV=500V, VDD=15V  
(Controller On with  
Auxiliary Supply)  
IHV-LC  
Leakage Current Drawn from HV Pin  
3.0  
μA  
VDD Section  
VDD-ON Turn-On Threshold Voltage  
VDD-OFF Turn-Off Threshold Voltage  
VDD-LH Threshold Voltage for Latch-Off Release  
VDD Rising  
15  
16  
5.0  
17  
V
V
VDD Falling  
4.7  
5.3  
VDD Falling  
2.50  
V
IDD-ST  
Startup Current  
VDD=VDD-ON – 0.16V  
VDD=18V, f=fOSC, CL=1nF  
VDD=8V, CL=1nF  
400 450  
3.5 4.0  
200 350  
μA  
mA  
μA  
V
IDD-OP Operating Supply Current  
IDD-BURST Burst-Mode Operating Supply Current  
VDD-OVP VDD Over-Voltage Protection Level  
tD-VDDOVP VDD Over-Voltage Protection Debounce Time  
Oscillator Section  
25.0 26.5 28.0  
100 180  
f=140kHz  
μs  
Center Frequency  
VCS=5V, VS=2.5, VFB=5V  
135 140 145  
fOSC  
Frequency  
kHz  
Hopping Range  
±5  
Minimum Frequency by Continuous Conduction  
Mode (CCM) Prevention Circuit(4)  
fOSC-CM-MIN  
17  
40  
22  
45  
27  
50  
kHz  
kHz  
fOSC-CCM Minimum Frequency in (CC) Regulation  
VCS=5V, VS=0V  
Feedback Input Section  
AV  
Internal Voltage Scale-Down Ratio of FB Pin(5)  
1/3.5 1/3.0 1/2.5 V/V  
ZFB  
FB Pin Input Impedance  
38  
42  
5.3  
1.1  
44  
kΩ  
V
VFB-OPEN FB Pin Pull-Up Voltage  
FB Pin Open  
VFB-L  
FB Threshold to Disable Gate Drive in Burst Mode VFB Falling,VCS=5V, VS=0V 1.0  
1.2  
V
VFB-H FB Threshold to Enable Gate Drive in Burst Mode  
Over-Temperature Protection Section  
VFB Rising,VCS=5V, VS=0V 1.05 1.15 1.25  
V
Threshold Temperature for Over-Temperature  
TOTP  
+130 +140 +150  
°C  
Protection(6)  
Continued on the following page…  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN302UL • Rev. 1.0.3  
5
Electrical Characteristics (Continued)  
VDD=15V and TA=25°C unless noted.  
Symbol  
Parameter  
Condition  
Min. Typ. Max. Unit  
Voltage-Sense Section  
ITC  
Bias Current  
VS Sampling Voltage to Switch to the Second  
VCS=5V  
8.75 10.00 11.25 μA  
VVS-CM-MIN Pulse-by-Pulse Current Limit in Power Limit  
0.55  
V
Mode(6)  
VS Sampling Voltage to Switch Back to the  
VVS-CM-MAX  
0.75  
2.15  
0.70  
64  
V
V
Normal Pulse-by-Pulse Current Limit(6)  
VS Sampling Voltage to Start Frequency  
Decreasing in CC Mode  
VSN-CC  
VCS=5V, fS1=fOSC-2KHz  
VS Sampling Voltage to End Frequency  
Decreasing in CC Mode  
VCS=5V, fS2=fOSC-CCM  
+2KHz  
VSG-CC  
V
SG-CC= (fS1-fS2)  
kHz/V  
SG-CC  
Frequency Decreasing Slope of CC Regulation  
52  
76  
/(VSN-CC-VSG-CC  
)
Sinking Current Threshold for Brownout  
Protection(6)  
VVS-OFFSET ZCD Comparator Internal Offset Voltage(6)  
IVS-UVP  
47  
μA  
mV  
V
200  
Output Over-Voltage Protection with VS Sampling  
VVS-OVP  
Voltage  
2.80 2.85  
60 120  
tVS-OVP  
Output Over-Voltage Protection Debounce Time f=140kHz  
μs  
Current-Sense Section  
VVR  
Internal Reference Voltage for CC Regulation  
2.475 2.500 2.525  
2.405 2.430 2.455  
V
V
Variation Test Voltage on CS Pin for CC Output  
(Non-Inverting Input of Error Amplifier for CC  
Regulation)  
VCCR  
VCS=0.41V  
VSTH  
VSTH-VA  
tPD  
Normal Current Limit Threshold Voltage  
0.7  
V
V
Second Current Limit Threshold Voltage at Power  
VVS=0.3V  
0.25 0.30 0.35  
100 150  
Limit Mode (Vs<VVS-CM-MAX  
)
GATE Output Turn-Off Delay  
ns  
ns  
VCS=5V, VVS=2.5, VFB=5V  
(Test Mode)  
tMIN  
Minimum On Time  
180 250 320  
tLEB  
Leading-Edge Blanking Time(6)  
100 150 200  
0.3  
ns  
V
VSLOPE Slope Compensation(6)  
Maximum Duty Cycle  
GATE Section  
DCYMAX Maximum Duty Cycle  
VGATE-L Output Voltage Low  
VGATE-H Output Voltage High  
VGATE-H Output Voltage High  
61  
64  
67  
1.5  
8
%
V
VDD=25V, IO=10mA  
VDD=8V, IO=1mA  
VDD=5.5V, IO=1mA  
VDD=15V, CL=1nF  
VDD=15V, CL=1nF  
5
V
4.0  
5.5  
V
tr  
tf  
Rising Time  
Falling Time  
100 140 180  
ns  
ns  
30  
50  
70  
VGATE-  
CLAMP  
Gate Output Clamping Voltage  
VDD=25V  
13  
15  
17  
V
Notes:  
4. fOSC-CM-MIN occurs when the power unit enters CCM operation.  
5. AV is a scale-down ratio of the internal voltage divider of the FB pin.  
6. Not tested; guaranteed by design.  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN302UL • Rev. 1.0.3  
6
Typical Performance Characteristics  
Figure 6. VDD Turn-On Threshold Voltage (VDD-ON  
)
Figure 7. VDD Turn-Off Threshold Voltage (VDD-OFF  
)
vs. Temperature  
vs. Temperature  
Figure 8. Operating Current (IDD-OP) vs. Temperature  
Figure 9. Burst Mode Operating Current (IDD-BURST  
vs. Temperature  
)
Figure 10. CC Regulation Minimum Frequency  
(fOSC-CCM) vs. Temperature  
Figure 11. Enter Zero Duty Cycle of FB Voltage (VFB-L  
vs. Temperature  
)
© 2011 Fairchild Semiconductor Corporation  
FAN302UL • Rev. 1.0.3  
www.fairchildsemi.com  
7
Typical Performance Characteristics  
2.95  
2.90  
2.85  
2.80  
2.75  
2.70  
2.65  
-40  
-30  
-15  
0
25  
50  
75  
85  
100  
125  
Temperature (ºC)  
Figure 12. Leave Zero Duty Cycle of FB Voltage  
(VFB-H) vs. Temperature  
Figure 13. VS Over-Voltage Protection (VVS-OVP  
vs. Temperature  
)
Figure 14. Reference Voltage of CS (VVR  
)
Figure 15. Variation Voltage on CS Pin for CC  
Regulation (VCCR) vs. Temperature  
vs. Temperature  
Figure 16. Starting Voltage of Frequency Decreasing Figure 17. Ending Voltage of Frequency Decreasing of  
of CC Regulation (VSN-CC) vs. Temperature CC Regulation (VSG-CC) vs. Temperature  
© 2011 Fairchild Semiconductor Corporation  
FAN302UL • Rev. 1.0.3  
www.fairchildsemi.com  
8
Typical Performance Characteristics  
Figure 18. Threshold Voltage for Current Limit (VSTH  
)
Figure 19. Threshold Voltage for Current Limit at  
Power Mode (VSTH-VA) vs. Temperature  
vs. Temperature  
Figure 20. Minimum On Time (tMIN) vs. Temperature  
Figure 21.Leading-Edge Blanking Time (tLEB  
)
vs. Temperature  
Figure 22. Maximum Duty Cycle (DCYMAX  
vs. Temperature  
)
Figure 23. Gate Output Clamp Voltage (VGATE-CLAMP  
vs. Temperature  
)
© 2011 Fairchild Semiconductor Corporation  
FAN302UL • Rev. 1.0.3  
www.fairchildsemi.com  
9
Operational Description  
Basic Control Principle  
VEA.I  
VEA.V  
VEA.I  
VEA.V  
Figure 24 shows the internal PWM control circuit. The  
Constant Voltage (CV) regulation is implemented in the  
same way as in a conventional isolated power supply,  
where the output voltage is sensed using a voltage  
divider and compared with the internal 2.5V reference of  
shut regulator (KA431) to generate a compensation  
signal. The compensation signal is transferred to the  
primary side using an opto-coupler and scaled down  
through an attenuator, Av, generating VEA.V signal. Then,  
the error signal VEA.V is applied to the PWM comparator  
(PWM.V) to determine the duty cycle.  
VSAW  
Gate  
PWM.V  
PWM.I  
OSC CLK  
Meanwhile, CC regulation is implemented internally  
without directly sensing output current. The output  
CV Regulation  
CC Regulation  
current estimator reconstructs output current data (VCCR  
)
using the transformer primary-side current and diode  
current discharge time. Then VCCR is compared with a  
reference voltage (2.5V) by an internal error amplifier,  
generating a VEA.I signal to determine duty cycle.  
Figure 25.PWM Operation for CC and CV  
Output Current Estimation  
Figure 26 shows the key waveform of a flyback  
converter operating in Discontinuous Conduction Mode  
(DCM), where the secondary-side diode current reaches  
zero before the next switching cycle begins. Since the  
output current estimator is designed for DCM operation,  
the power stage should be designed such that DCM is  
guaranteed for the entire operating range. The output  
current is obtained by averaging the triangular output  
diode current area over a switching cycle as:  
The two error signals, VEA.I and VEA.V, are compared with  
an internal sawtooth waveform (VSAW  
) by PWM  
comparators PWM.I and PWM.V, respectively, to  
determine the duty cycle. Figure 24 shows the outputs  
of two comparators (PWM.I and PWM.V) combined with  
OR gate and used as a reset signal of flip-flop to  
determine the MOSFET turn-off instant. Of VEA.V and  
VEA.I, the lower signal determines the duty cycle, as  
shown in Figure 25. During CV regulation, VEA.V  
determines the duty cycle while VEA.I is saturated to  
HIGH. During CC regulation mode, VEA.I determines the  
duty cycle while VEA.V is saturated to HIGH.  
NP TDIS  
IO =< ID >AVG = IPK  
(1)  
NS 2TS  
where IPK is the peak value of the primary-side  
current; NP and NS are the number of turns of  
transformer primary side and secondary side,  
respectively; tDIS is the diode current discharge time;  
and tS is the switching period.  
I PK  
NP  
IPK  
NS  
< ID >AVG = IO  
Figure 24. Internal PWM Control Circuit  
Figure 26. Key Waveforms of DCM Flyback  
Converter  
© 2011 Fairchild Semiconductor Corporation  
FAN302UL • Rev. 1.0.3  
www.fairchildsemi.com  
10  
With a given current sensing resistor, the output current  
can be programmed as:  
1.25 NP  
IO =  
(2)  
K RSENSE NS  
where K is the design parameter of IC, which is 12  
for FAN302UL.  
The peak value of primary-side current is obtained by an  
internal peak-detection circuit while diode current  
discharge time is obtained by detecting the diode  
current zero-crossing instant. Since the diode current  
cannot be sensed directly with primary-side control, the  
Zero Crossing Detection (ZCD) is accomplished  
indirectly by monitoring the auxiliary winding voltage.  
When the diode current reaches zero, the transformer  
winding voltage begins to drop by the resonance  
between the MOSFET output capacitance and  
transformer magnetizing inductance. To detect the  
starting instant of the resonance, the VS is sampled at  
85% of the diode current discharge time of the previous  
switching cycle and compared with the instantaneous VS  
voltage. When instantaneous voltage of the VS pin  
drops below the sampled voltage by more than 200mV,  
ZCD of diode current is obtained as shown in Figure 27.  
Figure 28. tDIS Variation in CC Mode  
0.85 tDIS (n-1)  
ZCD  
VS  
VSH  
Sampling  
200mV  
tDIS (n)  
Figure 29. Frequency Reduction with VSH  
Figure 27. Detailed Waveform for ZCD  
Frequency Reduction in CC Mode  
The transformer should be designed to guarantee DCM  
operation over the whole operation range since the  
output current is properly estimated only in DCM  
operation. As can be seen in Figure 28, the discharge  
time (tDIS) of the diode current increases as the output  
voltage decreases in CC Mode. The converter tends to  
go into CCM as output voltage drops in CC Mode when  
operating at the fixed switching frequency. To prevent  
this CCM operation and maintain good output current  
estimation in DCM, FAN302UL decreases switching  
frequency as output voltage drops, as shown in Figure  
28 and Figure 29. FAN302UL indirectly monitors the  
output voltage by the sample-and-hold voltage (VSH) of  
VS, which is taken at 85% of diode current discharge  
time of the previous switching cycle, as shown in Figure  
27. Figure 30 shows how the frequency reduces as the  
sample-and-hold voltage of the VS pin decreases.  
Δf  
ΔV  
= SGCC  
Figure 30. Frequency Reduction Curve in  
CC Regulation  
© 2011 Fairchild Semiconductor Corporation  
FAN302UL • Rev. 1.0.3  
www.fairchildsemi.com  
11  
CCM Prevention Function  
Even if the power supply is designed to operate in DCM,  
it can go into Continuous Conduction Mode (CCM)  
when there is not enough design margin to cover all the  
circuit parameter variations and operating conditions.  
FAN302UL has a CCM-prevention function that delays  
the next cycle turn-on of MOSFET until ZCD on the VS  
pin is obtained, as shown in Figure 31. To guarantee  
stable DCM operation, FAN302UL prohibits the turn-on  
of the next switching cycle for 10% of its switching  
period after ZCD is obtained. In Figure 31, the first  
switching cycle has ZCD before 90% of its original  
switching period and, therefore, the turn-on instant of  
the next cycle is determined from its original switching  
period without being affected by the ZCD instant. The  
second switching cycle does not have ZCD by the end  
of its original switching period. The turn-on of the third  
switching cycle occurs after ZCD is obtained, with a  
delay of 10% of its original switching period. The  
minimum switching frequency the CCM-prevention  
function allows is 22kHz (fOSC-CM-MIN). If the ZCD is not  
given until the end of maximum switching period of  
45.5µs (1/22kHz), the converter can go into CCM  
operation losing output regulation.  
Figure 32. Power-Limit Mode Operation  
High-Voltage (HV) Startup  
Figure 33 shows the high-voltage startup circuit for  
FAN302UL applications. Internally a JFET is used to  
implement the high-voltage current source, whose  
characteristics are shown in Figure 34. Technically, the  
HV pin can be directly connected to the DC link (VDL).  
However, to improve reliability and surge immunity, it is  
typical to use about 100kresistor between the HV pin  
and DC link. The actual HV current with given DC link  
voltage and startup resistor is determined by the  
intersection of V-I characteristics line and load line, as  
shown in Figure 34.  
During startup, the internal startup circuit is enabled and  
the DC link supplies the current, IHV, to charge the hold-  
up capacitor, CVDD, through RSTART. When the VDD  
voltage reaches VDD-ON, the internal HV startup circuit is  
disabled and the IC starts PWM switching. Once the HV  
startup circuit is disabled, the energy stored in CVDD  
should supply the IC operating current until the  
transformer auxiliary winding voltage reaches the  
nominal value. Therefore, CVDD should be designed to  
prevent VDD from dropping to VDD-OFF before the auxiliary  
winding builds up enough voltage to supply VDD  
.
Figure 31. CCM Prevention Function  
Power-Limit Mode  
When the sampled voltage of VS (VSH) drops below VS-  
(0.55V), FAN302UL enters Constant Power Limit  
CM-MIN  
Mode, where the primary-side current limit voltage (VCS  
)
changes from VSTH (0.7V) to VSTH-VA (0.3V) to avoid  
miss-operation of VS sampling and ZCD, as shown in  
Figure 32. Once the VS sampling voltage is higher than  
VS-CM-MAX (0.75V), the VCS returns to VSTH. This mode  
prevents the power supply from going into CCM and  
losing output regulation when the output voltage is too  
low. This effectively protects the power supply when  
there is a fault condition in the load, such as output  
short or overload. This operation mode also implements  
soft-start by limiting the transformer current until the VS  
sampling voltage reaches VS-CM-MAX (0.75V).  
Figure 33. HV Startup Circuit  
© 2011 Fairchild Semiconductor Corporation  
FAN302UL • Rev. 1.0.3  
www.fairchildsemi.com  
12  
VDL VHV  
IHV  
=
RHV  
VDL  
RHV  
VDL  
Figure 36. Burst-Mode Operation  
Figure 34.V-I Characteristics of HV Pin  
Slope Compensation  
The sensed voltage across the current-sense resistor is  
used for current-mode control and pulse-by-pulse  
Frequency Hopping  
EMI reduction is accomplished by frequency hopping,  
which spreads the energy over a wider frequency range  
than the bandwidth of the EMI test equipment, allowing  
compliance with EMI limitations. The internal frequency-  
hopping circuit changes the switching frequency  
progressively between 135kHz and 145kHz with a  
period of tp, as shown in Figure 35.  
current limiting.  
A synchronized ramp signal with  
positive slope is added to the current-sense information  
at each switching cycle, improving noise immunity of  
current-mode control.  
Protections  
The FAN302UL self-protection functions include VDD  
Over-Voltage Protection (VDD OVP), internal Over-  
Temperature Protection (OTP), VS Over-Voltage  
Protection (VS OVP), and brownout protection. The VDD  
OVP and brownout protection are implemented as Auto-  
Restart Mode, while the VS OVP and internal OTP are  
implemented as Latch Mode.  
When an Auto Restart Mode protection is triggered,  
switching is terminated and the MOSFET remains off,  
causing VDD to drop. When VDD drops to the VDD turn-off  
voltage of 5V; the protection is reset, the internal startup  
circuit is enabled, and the supply current drawn from the  
HV pin charges the hold-up capacitor. When VDD  
reaches the turn-on voltage of 16V, normal operation  
resumes. In this manner, auto restart alternately  
enables and disables MOSFET switching until the  
abnormal condition is eliminated, as shown in Figure 37.  
When a Latch Mode protection is triggered, PWM  
switching is terminated and the MOSFET remains off,  
causing VDD to drop. When VDD drops to the VDD turn-off  
voltage of 5V, the internal startup circuit is enabled  
without resetting the protection, and the supply current  
drawn from HV pin charges the hold-up capacitor. Since  
the protection is not reset, the IC does not resume PWM  
switching even when VDD reaches the turn-on voltage of  
16V, disabling the HV startup circuit. Then, VDD drops  
again down to 5V. In this manner, the Latch Mode  
protection alternately charges and discharges VDD until  
there is no more energy in the DC link capacitor. The  
protection is reset when VDD drops to 2.5V, which is  
allowed only after power supply is unplugged from the  
AC line, as shown in Figure 38.  
Figure 35. Frequency Hopping  
Burst-Mode Operation  
The power supply enters Burst Mode at no-load or  
extremely light-load conditionS. As shown in Figure 36,  
when VFB drops below VFBL, the PWM output shuts off  
and the output voltage drops at a rate dependent on  
load current. This causes the feedback voltage to rise.  
Once VFB exceeds VFBH, the internal circuit starts to  
provide switching pulse. The feedback voltage then falls  
and the process repeats. Burst Mode alternately  
enables and disables switching of the MOSFET,  
reducing the switching losses in Standby Mode. Once  
FAN302UL enters Burst Mode, the operating current is  
reduced from 3.5mA to 200μA to minimize power  
consumption in Burst Mode.  
© 2011 Fairchild Semiconductor Corporation  
FAN302UL • Rev. 1.0.3  
www.fairchildsemi.com  
13  
NP  
VDL  
PWM  
Control  
Block  
RVS1  
Minimum  
On Time  
Modulation  
Current  
Monitoring  
Block  
VS  
RVS2  
CVS  
Brownout  
Protection  
NA  
Figure 39.VS Pin Current Sensing  
FAN302UL modulates the minimum ON time of the  
MOSFET such that it reduces as input voltage  
increases, as shown Figure 40. This allows smaller  
minimum ON time for high-line condition, ensuring Burst  
Mode operation occurs at almost the same power level,  
regardless of line voltage variation. The minimum ON  
time is also related to the bundle frequency of Burst  
Mode operation.  
Figure 37. Auto-Restart Mode Operation  
The VS current is also used for brownout protection.  
When the current out of the VS pin while the MOSFET  
is on is smaller than 47μA for longer than 10ms, the  
brownout protection is triggered.  
Figure 38. Latch-Mode Operation  
VDD Over-Voltage Protection  
VDD over-voltage protection prevents IC damage from  
over-voltage exceeding the IC voltage rating. When the  
VDD voltage exceeds 26.5V due to abnormal conditions,  
the protection is triggered. This protection is typically  
caused by an open circuit of the secondary-side  
feedback network.  
Figure 40. Minimum On Time vs. VS Pin Current  
Over-Temperature Protection (OTP)  
The temperature-sensing circuit shuts down PWM  
output if the junction temperature exceeds 140°C (tOTP).  
VS Over-Voltage Protection (OVP)  
Input Voltage Sensing and Brownout Protection  
The FAN302UL indirectly senses input voltage using the  
VS pin current while the MOSFET is turned on. Since  
the VS pin voltage is clamped at 0.7V when the  
MOSFET is turned on, the current flowing out of the VS  
pin is approximately proportional to the input voltage, as  
shown in Figure 38. Current flowing out of the VS pin is  
calculated by:  
VS over-voltage protection prevents damage due to  
output over-voltage conditions. Figure 41 shows the VS  
OVP protection method. When abnormal system  
conditions occur that cause VS to exceed 2.8V, after a  
period of debounce time; PWM pulses are disabled and  
FAN302UL enters Latch Mode until VDD drops to under  
VDD-LH. By that time, PWM pulses revive. VS over-voltage  
conditions are usually caused by an open circuit of the  
secondary-side feedback network or abnormal behavior  
by the VS pin divider resistor.  
NA  
IVS.ON = ( VDL + 0.7)  
NP  
1
0.7 NA VDL  
+
(3)  
RVS1 RVS 2 NP RVS1  
© 2011 Fairchild Semiconductor Corporation  
FAN302UL • Rev. 1.0.3  
www.fairchildsemi.com  
14  
Figure 41. VS OVP Protection  
Leading-Edge Blanking (LEB)  
Each time the power MOSFET is switched on, a turn-on  
spike occurs at the sense resistor. To avoid premature  
termination of the switching pulse, a 150ns leading-edge  
blanking time is built in. Conventional RC filtering can  
therefore be omitted. During this blanking period, the  
current-limit comparator is disabled and it cannot switch  
off the gate driver.  
Noise Immunity  
Noise from the current sense or the control signal can  
cause significant pulse-width jitter. While slope  
compensation helps alleviate these problems, further  
precautions should still be taken. Good placement and  
layout practices should be followed. Avoid long PCB  
traces and component leads and, locate bypass filter  
components near the PWM IC.  
© 2011 Fairchild Semiconductor Corporation  
FAN302UL • Rev. 1.0.3  
www.fairchildsemi.com  
15  
Typical Application Circuit (Flyback Charger)  
Application  
Fairchild Device  
Input Voltage Range  
Output  
Cell Phone Charger  
FAN302UL  
90~265VAC  
5V/1.2A (6W)  
Features  
.
.
Ultra-Low Standby Power Consumption: <20mW at 264VAC (Pin=6.3mW for 115VAC and Pin=7.3mW for 230VAC)  
Output Regulation: CV:±5%, CC:±15%  
Figure 42.Measured Efficiency and Output Regulation  
Figure 43.Schematic of Typical Application Circuit  
© 2011 Fairchild Semiconductor Corporation  
FAN302UL • Rev. 1.0.3  
www.fairchildsemi.com  
16  
Typical Application Circuit (Continued)  
Transformer Specification  
.
.
Core: EI12.5  
Bobbin: EI12.5  
Figure 44.Transformer  
.
.
W1 is space winding in one layer.  
W2 consists of three layers with different numbers of turns. The number of turns of each layer is specified in  
Table 1.  
.
W3 consists of two layers with triple-insulated wire. The leads of positive and negative fly lines are 3.5cm and  
2.5cm, respectively.  
Table 1. Transformer Winding Specifications  
Terminal  
No.  
Insulation  
Wire  
Turns  
Start Pin  
End Pin  
Turns  
W1  
W2  
W3  
1
2
2UEW 0.15*2  
8
2
0
1
3
3
22  
22  
22  
5
4
5
2UEW 0.12*1  
TEX-E 0.4*1  
Fly+  
Fly-  
Pin  
45  
45  
Specifications  
530μH ±7%  
Remark  
Primary-Side Inductance  
100kHz, 1V  
Short One of the Secondary Windings  
Primary-Side Effective Leakage Inductance  
52μH ±5%  
© 2011 Fairchild Semiconductor Corporation  
FAN302UL • Rev. 1.0.3  
www.fairchildsemi.com  
17  
Physical Dimensions  
5.00  
4.80  
A
0.65  
3.81  
8
5
B
1.75  
6.20  
5.80  
4.00  
3.80  
5.60  
1
4
PIN ONE  
INDICATOR  
1.27  
1.27  
(0.33)  
M
0.25  
C B A  
LAND PATTERN RECOMMENDATION  
SEE DETAIL A  
0.25  
0.10  
0.25  
0.19  
C
1.75 MAX  
0.10  
C
0.51  
0.33  
OPTION A - BEVEL EDGE  
0.50  
0.25  
x 45°  
R0.10  
R0.10  
GAGE PLANE  
OPTION B - NO BEVEL EDGE  
0.36  
NOTES: UNLESS OTHERWISE SPECIFIED  
8°  
0°  
0.90  
A) THIS PACKAGE CONFORMS TO JEDEC  
MS-012, VARIATION AA, ISSUE C,  
B) ALL DIMENSIONS ARE IN MILLIMETERS.  
C) DIMENSIONS DO NOT INCLUDE MOLD  
FLASH OR BURRS.  
SEATING PLANE  
(1.04)  
0.406  
D) LANDPATTERN STANDARD: SOIC127P600X175-8M.  
E) DRAWING FILENAME: M08AREV13  
DETAIL A  
SCALE: 2:1  
Figure 45. 8-Lead, Small Outline Integrated Circuit (SOIC), JEDEC MS-012, .150-Inch, Narrow Body  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,  
specifically the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
© 2011 Fairchild Semiconductor Corporation  
FAN302UL • Rev. 1.0.3  
www.fairchildsemi.com  
18  
© 2011 Fairchild Semiconductor Corporation  
FAN302UL • Rev. 1.0.3  
www.fairchildsemi.com  
19  

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