FCP13N60N

更新时间:2024-09-18 08:29:14
品牌:FAIRCHILD
描述:N-Channel MOSFET 600V, 13A, 0.258Ω

FCP13N60N 概述

N-Channel MOSFET 600V, 13A, 0.258Ω N沟道MOSFET 600V , 13A , 0.258Ω 功率场效应晶体管

FCP13N60N 规格参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TO-220
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.69
雪崩能效等级(Eas):235 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:600 V最大漏极电流 (Abs) (ID):13 A
最大漏极电流 (ID):13 A最大漏源导通电阻:0.258 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):116 W
最大脉冲漏极电流 (IDM):39 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FCP13N60N 数据手册

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August 2009  
TM  
SupreMOS  
FCP13N60N / FCPF13N60NT  
N-Channel MOSFET  
600V, 13A, 0.258Ω  
Features  
Description  
RDS(on) = 0.244Ω ( Typ.) @ VGS = 10V, ID = 6.5A  
Ultra Low Gate Charge ( Typ.Qg = 30.4nC)  
Low Effective Output Capacitance  
100% Avalanche Tested  
The SupreMOS MOSFET, Fairchild’s next generation of high  
voltage super-junction MOSFETs, employs a deep trench filling  
process that differentiates it from preceding multi-epi based  
technologies. By utilizing this advanced technology and precise  
process control, SupreMOS provides world class Rsp, superior  
switching performance and ruggedness.  
This SupreMOS MOSFET fits the industry’s AC-DC SMPS  
requirements for PFC, server/telecom power, FPD TV power, ATX  
power, and industrial power applications.  
RoHS Compliant  
D
G
TO-220  
FCP Series  
TO-220F  
FCPF Series  
G D S  
G D S  
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted  
Symbol  
VDSS  
VGSS  
Parameter  
FCP13N60N FCPF13N60NT  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
600  
±30  
V
V
-Continuous (TC = 25oC)  
-Continuous (TC = 100oC)  
- Pulsed  
13  
8.2  
39  
13*  
8.2*  
39  
ID  
Drain Current  
A
IDM  
EAS  
IAR  
Drain Current  
(Note 1)  
(Note 2)  
A
mJ  
Single Pulsed Avalanche Energy  
Avalanche Current  
235  
4.3  
A
EAR  
Repetitive Avalanche Energy  
MOSFET dv/dt Ruggedness  
Peak Diode Recovery dv/dt  
1.16  
100  
20  
mJ  
V/ns  
V/ns  
W
W/oC  
oC  
dv/dt  
PD  
(Note 3)  
(TC = 25oC)  
- Derate above 25oC  
116  
33.8  
0.27  
Power Dissipation  
0.93  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
300  
oC  
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Thermal Resistance, Junction to Case  
FCP13N60N FCPF13N60NT Units  
RθJC  
RθCS  
RθJA  
1.07  
0.5  
3.7  
0.5  
Thermal Resistance, Case to Heak Sink ( Typical)  
Thermal Resistance, Junction to Ambient  
oC/W  
62.5  
62.5  
©2009 Fairchild Semiconductor Corporation  
FCP13N60N / FCPF13N60NT Rev. A  
1
www.fairchildsemi.com  
Package Marking and Ordering Information  
Device Marking  
FCP13N60N  
Device  
Package  
TO-220  
Reel Size  
Tape Width  
Quantity  
FCP13N60N  
FCPF13N60NT  
-
-
-
-
50  
50  
FCPF13N60NT  
TO-220F  
Electrical Characteristics TC = 25oC unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Units  
Off Characteristics  
BVDSS  
Drain to Source Breakdown Voltage  
ID = 1mA, VGS = 0V, TC = 25oC  
600  
-
-
-
V
ΔBVDSS  
ΔTJ  
Breakdown Voltage Temperature  
Coefficient  
I
D = 1mA, Referenced to 25oC  
-
-
0.73  
V/oC  
V
DS = 480V, VGS = 0V  
-
-
-
10  
IDSS  
IGSS  
Zero Gate Voltage Drain Current  
Gate to Body Leakage Current  
μA  
VDS = 480V, VGS = 0V, TC = 125oC  
-
-
100  
VGS = ±30V, VDS = 0V  
±100  
nA  
On Characteristics  
VGS(th)  
RDS(on)  
gFS  
Gate Threshold Voltage  
VGS = VDS, ID = 250μA  
VGS = 10V, ID = 6.5A  
VDS = 40V, ID = 6.5A  
2.0  
-
4.0  
0.258  
-
V
Ω
S
Static Drain to Source On Resistance  
Forward Transconductance  
-
-
0.244  
16.3  
Dynamic Characteristics  
Ciss  
Input Capacitance  
-
-
-
-
-
-
-
-
-
1325  
50  
1765  
pF  
pF  
pF  
pF  
pF  
nC  
nC  
nC  
Ω
VDS = 100V, VGS = 0V  
f = 1MHz  
Coss  
Crss  
Output Capacitance  
65  
Reverse Transfer Capacitance  
Output Capacitance  
3
5
Coss  
Cosseff  
Qg(tot)  
Qgs  
VDS = 380V, VGS = 0V, f = 1MHz  
VDS = 0V to 480V, VGS = 0V  
30  
-
Effective Output Capacitance  
Total Gate Charge at 10V  
Gate to Source Gate Charge  
Gate to Drain “Miller” Charge  
Equivalent Series Resistance (G-S)  
145  
30.4  
6.0  
9.5  
2.8  
-
39.5  
V
V
DS = 380V,ID = 6.5A  
GS = 10V  
-
-
-
(Note 4)  
Qgd  
ESR  
Drain Open  
Switching Characteristics  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
-
-
-
-
14.5  
10.6  
45  
39  
ns  
ns  
ns  
ns  
VDD = 380V, ID = 6.5A  
31.2  
100  
29.6  
R
G = 4.7Ω  
9.8  
(Note 4)  
Drain-Source Diode Characteristics  
IS  
Maximum Continuous Drain to Source Diode Forward Current  
Maximum Pulsed Drain to Source Diode Forward Current  
-
-
-
-
-
-
-
13  
39  
1.2  
-
A
A
ISM  
VSD  
trr  
Drain to Source Diode Forward Voltage  
Reverse Recovery Time  
VGS = 0V, ISD = 6.5A  
-
V
287  
3.5  
ns  
μC  
V
GS = 0V, ISD = 6.5A  
dIF/dt = 100A/μs  
Qrr  
Reverse Recovery Charge  
-
Notes:  
1. Repetitive Rating: Pulse width limited by maximum junction temperature  
2. I = 4.3A, R = 25Ω, Starting T = 25°C  
AS  
G
J
3. I 13A, di/dt 200A/μs, V BV  
, Starting T = 25°C  
J
SD  
DD  
DSS  
4. Essentially Independent of Operating Temperature Typical Characteristics  
www.fairchildsemi.com  
FCP13N60N / FCPF13N60NT Rev. A  
2
Typical Performance Characteristics  
Figure 1. On-Region Characteristics  
Figure 2. Transfer Characteristics  
60  
40  
VGS = 15.0 V  
10.0 V  
8.0 V  
7.0 V  
6.5 V  
6.0 V  
5.5 V  
5.0 V  
10  
-55oC  
150oC  
10  
25oC  
1
*Notes:  
1. 250μs Pulse Test  
2. TC = 25oC  
*Notes:  
1. VDS = 20V  
2. 250μs Pulse Test  
0.2  
3
0.6  
2
4
6
8
1
10  
20  
VGS, Gate-Source Voltage[V]  
VDS, Drain-Source Voltage[V]  
Figure 3. On-Resistance Variation vs.  
Drain Current and Gate Voltage  
Figure 4. Body Diode Forward Voltage  
Variation vs. Source Current  
and Temperature  
100  
0.8  
0.6  
150oC  
25oC  
10  
0.4  
VGS = 10V  
VGS = 20V  
0.2  
*Notes:  
1. VGS = 0V  
*Notes: TC = 25oC  
30 40  
2. 250μs Pulse Test  
1
0.4  
0.0  
0.8  
1.2  
1.6  
0
10  
20  
VSD, Body Diode Forward Voltage [V]  
ID, Drain Current [A]  
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
10  
50000  
C
C
C
= C + C (C = shorted)  
gs gd ds  
iss  
VDS = 120V  
VDS = 380V  
= C + C  
ds gd  
oss  
rss  
10000  
= C  
gd  
8
6
4
2
0
VDS = 480V  
Ciss  
1000  
100  
10  
Coss  
*Notes:  
1. VGS = 0V  
Crss  
*Notes: ID = 6.5A  
30  
2. f = 1MHz  
1
0.1  
0
10  
20  
40  
1
10  
100  
600  
Qg, Total Gate Charge [nC]  
VDS, Drain-Source Voltage [V]  
www.fairchildsemi.com  
FCP13N60N / FCPF13N60NT Rev. A  
3
Typical Performance Characteristics (Continued)  
Figure 7. Breakdown Voltage Variation  
vs. Temperature  
Figure 8. On-Resistance Variation  
vs. Temperature  
3.0  
1.2  
1.1  
1.0  
2.5  
2.0  
1.5  
1.0  
0.9  
*Notes:  
1. VGS = 0V  
*Notes:  
1. VGS = 10V  
0.5  
2. ID = 1mA  
2. ID = 6.5A  
0.0  
-100  
0.8  
-100  
-50  
0
50  
100  
150  
200  
-50  
0
50  
100  
150  
200  
TJ, Junction Temperature [oC]  
TJ, Junction Temperature [oC]  
Figure 9. Maximum Safe Operating Area  
_ FCP13N60N  
Figure 10. Maximum Safe Operating Area  
_ FCPF13N60NT  
100  
100  
10μs  
10μs  
100μs  
10  
1
100μs  
10  
1ms  
1ms  
10ms  
10ms  
1
DC  
Operation in This Area  
is Limited by R DS(on)  
Operation in This Area  
is Limited by R DS(on)  
DC  
*Notes:  
1. TC = 25oC  
2. TJ = 150oC  
0.1  
*Notes:  
0.1  
1. TC = 25oC  
2. TJ = 150oC  
3. Single Pulse  
3. Single Pulse  
0.01  
0.01  
0.1  
1
10  
100  
1000  
0.1  
1
10  
100  
1000  
VDS, Drain-Source Voltage [V]  
VDS, Drain-Source Voltage [V]  
Figure 11. Maximum Drain Current  
vs. Case Temperature  
15  
12  
9
6
3
0
25  
50  
75  
100  
125  
150  
TC, Case Temperature [oC]  
www.fairchildsemi.com  
FCP13N60N / FCPF13N60NT Rev. A  
4
Typical Performance Characteristics (Continued)  
Figure 12. Transient Thermal Response Curve_ FCP13N60N  
2
1
0.5  
0.2  
0.1  
PDM  
0.1  
t1  
*Notes:  
0.05  
t2  
0.02  
0.01  
1. ZθJC(t) = 1.07oC/W Max.  
2. Duty Factor, D= t1/t2  
3. TJM - TC = PDM * ZθJC(t)  
Single pulse  
0.01  
10-5  
10-4  
10-3  
Rectangular Pulse Duration [sec]  
10-2  
10-1  
_ FCPF13N60NT  
Figure 13. Transient Thermal Response Curve  
5
0.5  
1
0.2  
0.1  
PDM  
0.05  
t1  
t2  
0.1  
0.02  
*Notes:  
0.01  
1. ZθJC(t) = 3.7oC/W Max.  
2. Duty Factor, D= t1/t2  
3. TJM - TC = PDM * ZθJC(t)  
Single pulse  
0.01  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
102  
Rectangular Pulse Duration [sec]  
www.fairchildsemi.com  
FCP13N60N / FCPF13N60NT Rev. A  
5
Gate Charge Test Circuit & Waveform  
Resistive Switching Test Circuit & Waveforms  
Unclamped Inductive Switching Test Circuit & Waveforms  
www.fairchildsemi.com  
FCP13N60N / FCPF13N60NT Rev. A  
6
Peak Diode Recovery dv/dt Test Circuit & Waveforms  
+
D
U
T
V
D
S
_
I
S
D
L
D
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e
r
R
G
S
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T
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V
a
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D
U
T
D
D
V
G
S
d
v
/ d  
c
t
c
o
n
t r o l l e  
d
b
y
R
G
I S  
o
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t r o l l e  
d
b
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p
u
l s  
e
p
e
r i o  
d
D
G
a
t e  
P
u
l s  
e
W
i d t h  
V
- - - - - - - - - - - - - - - - - - - - - - - - - -  
D
=
G
S
G
a
t e  
P
u
l s  
e
P
e
r i o  
d
1
0
V
(
D
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)
I F  
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B
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D
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F
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a
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C
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r r e  
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t
M
I
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D
d
i / d  
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(
D
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T
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I R  
d
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B
o
d
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D
e
i o  
R
e
R
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C
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r r e  
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t
V
D
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(
D
U
T
)
B
o
d
y
S
D
i o  
d
e
c
o
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e
r y  
v
/ d  
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V
V
D
D
D
B
o
d
y
D
i o  
d
g
e
F
o
r w  
a
r d  
V
o
l t a  
e
D
r o  
p
www.fairchildsemi.com  
FCP13N60N / FCPF13N60NT Rev. A  
7
Mechanical Dimensions  
TO-220  
Dimensions in Millimeters  
www.fairchildsemi.com  
FCP13N60N / FCPF13N60NT Rev. A  
8
Mechanical Dimensions  
TO-220F  
Dimensions in Millimeters  
www.fairchildsemi.com  
FCP13N60N / FCPF13N60NT Rev. A  
9
TRADEMARKS  
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not  
intended to be an exhaustive list of all such trademarks.  
®
®
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Auto-SPM™  
Build it Now™  
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CorePOWER™  
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CTL™  
FPS™  
F-PFS™  
FRFET  
Global Power Resource  
Green FPS™  
PowerTrench  
PowerXS™  
The Power Franchise  
®
®
Programmable Active Droop™  
SM  
®
QFET  
TinyBoost™  
TinyBuck™  
TinyCalc™  
QS™  
Green FPS™ e-Series™  
Gmax™  
Quiet Series™  
RapidConfigure™  
®
TinyLogic  
Current Transfer Logic™  
EcoSPARK  
EfficentMax™  
GTO™  
IntelliMAX™  
ISOPLANAR™  
MegaBuck™  
MICROCOUPLER™  
MicroFET™  
®
TINYOPTO™  
TinyPower™  
TinyPWM™  
TinyWire™  
TriFault Detect™  
TRUECURRENT™*  
Saving our world, 1mW /W /kW at a time™  
SmartMax™  
EZSWITCH™*  
™*  
SMART START™  
®
SPM  
MicroPak™  
STEALTH™  
SuperFET™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SupreMOS™  
SyncFET™  
Sync-Lock™  
®*  
®
MillerDrive™  
MotionMax™  
Motion-SPM™  
®
Fairchild  
®
®
Fairchild Semiconductor  
FACT Quiet Series™  
UHC  
®
OPTOLOGIC  
Ultra FRFET™  
UniFET™  
VCX™  
VisualMax™  
XS™  
®
®
FACT  
OPTOPLANAR  
®
®
FAST  
FastvCore™  
tm  
FETBench™  
PDP SPM™  
Power-SPM™  
®
FlashWriter  
*
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.  
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE  
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY  
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
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THEREIN, WHICH COVERS THESE PRODUCTS.  
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE  
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As used herein:  
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and (c) whose failure to perform when properly used in accordance with  
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PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Datasheet contains the design specifications for product development. Specifications  
may change in any manner without notice.  
Advance Information  
Formative / In Design  
Datasheet contains preliminary data; supplementary data will be published at a later  
date. Fairchild Semiconductor reserves the right to make changes at any time without  
notice to improve design.  
Preliminary  
First Production  
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to  
make changes at any time without notice to improve the design.  
No Identification Needed  
Obsolete  
Full Production  
Datasheet contains specifications on a product that is discontinued by Fairchild  
Semiconductor. The datasheet is for reference information only.  
Not In Production  
Rev. I41  
www.fairchildsemi.com  
FCP13N60N / FCPF13N60NT Rev. A  
10  

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FCP150N65F ONSEMI 功率 MOSFET,N 沟道,SUPERFET® II,FRFET®,650V,24A,150mΩ,TO-220 获取价格
FCP165N60E ONSEMI N 沟道 SuperFET® II Easy-Drive MOSFET 获取价格
FCP165N65S3 ONSEMI 功率 MOSFET,N 沟道,SUPERFET® III,Easy Drive,650 V,19 A,165 mΩ,TO-220 获取价格
FCP165N65S3R0 ONSEMI Power MOSFET, N-Channel, SUPERFET® III, Easy Drive, 650 V, 19 A, 165 mΩ, TO-220 获取价格
FCP16N60 FAIRCHILD 600V N-Channel MOSFET 获取价格

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