FIN3385MTDX [FAIRCHILD]

Low-Voltage, 28-Bit, Flat-Panel Display Link Serializer / Deserializer; 低电压, 28位,平板显示器链路串行器/解串器
FIN3385MTDX
型号: FIN3385MTDX
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Low-Voltage, 28-Bit, Flat-Panel Display Link Serializer / Deserializer
低电压, 28位,平板显示器链路串行器/解串器

显示器
文件: 总21页 (文件大小:590K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
March 2012  
FIN3385 / FIN3386  
Low-Voltage, 28-Bit, Flat-Panel Display Link  
Serializer / Deserializer  
Features  
Description  
The FIN3385 and FIN3386 transform 28-bit wide parallel  
Low-Voltage TTL (LVTTL) data into four serial Low  
Voltage Differential Signaling (LVDS) data streams. A  
phase-locked transmit clock is transmitted in parallel  
with the data stream over a separate LVDS link. Every  
cycle of transmit clock, 28-bits of input LVTTL data are  
sampled and transmitted.  
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Operation -40°C to +85°C  
Low Power Consumption  
20MHz to 85MHz Shift Clock Support  
±1V Common-Mode Range around 1.2V  
Narrow Bus Reduces Cable Size and Cost  
High Throughput (up to 2.38Gbps)  
Internal PLL with No External Component  
Compatible with TIA/EIA-644 Specification  
56-Lead, TSSOP Package  
The FIN3386 receives and converts the 4/3 serial LVDS  
data streams back into 28/21 bits of LVTTL data, acting  
as the deserializer.  
For the FIN3385, at a transmit clock frequency of  
85MHz, 28-bits of LVTTL data are transmitted at a rate  
of 595Mbps per LVDS channel.  
This pair solves EMI and cable size problems  
associated with wide and high-speed TTL interfaces.  
Ordering Information  
Operating  
Temperature Range  
Packing  
Part Number  
Package  
Method  
FIN3385MTDX  
FIN3386MTDX  
56-Lead Thin-Shrink Small-Outline Package  
Tape and Reel  
-40 to +85°C  
(TSSOP), JEDEC MO-153,6.1mm Wide  
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
Block Diagrams  
Figure 1. FIN3385 Transmitter Functional Diagram  
Figure 2. FIN3386 Receiver Functional Diagram  
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
2
Transmitter Pin Configuration  
Figure 3. FIN3385 (28:4 Transmitter) Pin Assignments  
Pin Definitions  
Pin Names  
TxIn  
I/O Types  
Number of Pins  
Description of Signals  
I
28/21  
1
LVTTL Level Input  
TxCLKIn  
TxOut+  
I
LVTTL Level Clock Input, the rising edge is for data strobe  
Positive LVDS Differential Data Output  
O
O
O
O
4/3  
4/3  
1
TxOut-  
Negative LVDS Differential Data Output  
Positive LVDS Differential Clock Output  
Negative LVDS Differential Clock Output  
TxCLKOut+  
TxCLKOut-  
1
Rising Edge Data Strobe: Assert HIGH (VCC  
Falling Edge Data Strobe: Assert LOW (Ground)  
)
R_FB  
I
I
1
1
LVTTL Level Power-Down Input Assertion (LOW) puts the  
outputs in High-Impedance state  
/PwrDn  
PLL VCC  
PLL GND  
LVDS VCC  
LVDS GND  
VCC  
I
I
I
I
I
I
1
2
1
3
3
5
Power Supply Pin for PLL  
Ground Pins for PLL  
Power Supply Pin for LVDS Output  
Ground Pins for LVDS Output  
Power Supply Pins for LVTTL Input  
Ground Pin for LVTTL Input  
GND  
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
3
Receiver Pin Configuration  
Figure 4. FIN3386 (28:4 Receiver) Pin Assignments  
Pin Definitions  
Pin Names  
RxIn  
I/O Types  
Number of Pins  
Description of Signals  
Negative LVDS Differential Data Output  
Positive LVDS Differential Data Output  
Negative LVDS Differential Data Input  
Positive LVDS Differential Clock Input  
LVTTL Level Data Output, goes HIGH for /PwrDn LOW  
LVTTL Clock Output  
I
I
4/3  
RxIn+  
4/3  
RxCLKIn-  
RxCLKIn+  
RxOut  
I
1
I
1
O
O
I
28/21  
RxCLKOut-  
/PwrDn  
1
1
1
2
1
3
4
5
LVTTL Level Input. Refer to Table 2  
Power Supply Pin for PLL  
PLL VCC  
PLL GND  
LVDS VCC  
LVDS GND  
VCC  
I
I
Ground Pins for PLL  
I
Power Supply Pin for LVDS Input  
Ground Pins for LVDS Input  
I
I
Power Supply for LVTTL Output  
Ground Pins for LVTTL Output  
GND  
I
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
4
Truth Tables  
Table 1. Input / Output Truth Table  
Inputs  
Outputs  
TxIn  
Active  
TxCLKIn  
/PwrDn(1)  
HIGH  
HIGH  
HIGH  
HIGH  
LOW  
TxOut±  
LOW / HIGH  
LOW / HIGH  
LOW  
TxCLKOut±  
LOW / HIGH  
Don’t Care(2)  
LOW / HIGH  
Don’t Care(2)  
High Impedance  
Active  
LOW / HIGH / High Impedance  
Active  
Active  
Floating  
Floating  
Don’t Care  
Floating  
LOW  
Don’t Care  
High Impedance  
Notes:  
1. The outputs of the transmitter or receiver remain in a high-impedance state until VCC reaches 2V.  
2. TxCLKOut± settles at a free-running frequency when the part is powered up, /PwrDn is HIGH, and the TxCLKIn  
is a steady logic level (LOW / HIGH / High-Impedance).  
Power-Up / Power-Down Operation Truth Tables  
The outputs of the transmitter remain in the High-Impedance state until the power supply reaches 2V. Table 2 shows  
the operation of the transmitter during power-up and power-down and operation of the /PwrDn pin.  
Table 2. Transmitter Power-Up / Power-Down Operation Truth Table  
PwrDn  
>2V  
Normal  
>2V  
VCC  
TxIN  
<2V  
Don’t Care  
High Impedance  
Don’t Care  
High Impedance  
LOW  
Don’t Care  
High Impedance  
Don’t Care  
High Impedance  
LOW  
Active  
Active  
Active  
Active  
HIGH  
TxOUT  
TxCLKIn  
TxCLKOut±  
/PwrDn  
Table 3. Receiver Power-Up / Power-Down Operation Truth Table  
/PwrDn  
RxIn±  
Don’t Care  
Don’t Care  
Active  
LOW/HIGH  
Active  
Active  
Last Valid State  
Note 3  
Note 3  
HIGH  
Note 3  
High  
Impedance  
Last Valid  
State  
RxOut  
LOW  
RxCLKIn±  
RxCLKOut  
Don’t Care  
Don’t Care  
Note 4  
Note 3  
Note 4  
Note 3  
High  
Impedance  
Active  
Note 4  
Note 4  
/PwrDn  
VCC  
LOW  
<2V  
LOW  
<2V  
HIGH  
<2V  
HIGH  
<2V  
HIGH  
<2V  
HIGH  
<2V  
Notes:  
3. If the input is terminated and un-driven (high-impedance) or shorted or open (fail-safe condition).  
4. For /PwrDn or fail-safe condition, the RxCLKOut pin goes LOW for panel link devices and HIGH for channel link  
devices.  
5. Shorted means (± inputs are shorted to each other, or ± inputs are shorted to each other and ground or VCC, or  
either ± inputs are shorted to ground or VCC) with no other current/voltage sources (noise) applied. If the VID is still  
in the valid range (greater than 100mV) and VCM is in the valid range (0V to 2.4V), the input signal is still  
recognized and the part responds normally.  
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
5
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
Parameter  
Min.  
-0.3  
-0.5  
-0.3  
Max.  
+4.6  
+4.6  
+4.6  
Unit  
V
VCC  
Power Supply Voltage  
VID_TTL TTL/CMOS Input/Output Voltage  
VIO_LVDS LVDS Input/Output Voltage  
V
V
IOSD  
TSTG  
TJ  
LVDS Output Short-Circuit Current  
Storage Temperature Range  
Continuous  
-65  
+150  
+150  
+260  
>10.0  
>6.5  
°C  
°C  
°C  
Maximum Junction Temperature  
Lead Temperature, Soldering, 4 Seconds  
TL  
I/O to GND  
All Pins  
kV  
V
Human Body Model, JESD22-A114 (1.5k,100pF)  
Machine Model, JESD22-A115 (0, 200pF)  
ESD  
>400  
Note:  
6. Absolute maximum ratings are DC values beyond which the device may be damaged or have its useful life  
impaired. The datasheet specifications should be met, without exception, to ensure that the system design is  
reliable over its power supply, temperature, and output/input loading variables.  
Recommended Operating Conditions  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended  
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not  
recommend exceeding them or designing to Absolute Maximum Ratings.  
Symbol  
VCC  
Parameter  
Min.  
3.0  
Max.  
3.6  
Unit  
V
Supply Voltage  
TA  
Operating Temperature  
-40  
+85  
100  
°C  
VCCNPP Maximum Supply Noise Voltage(7)  
mVPP  
Note:  
7. 100mV VCC noise should be tested for frequency at least up to 2MHz. All the specifications should be met under  
such noise.  
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
6
Transmitter DC Electrical Characteristics  
Typical values are at TA=25°C and with VCC=3.3V; minimum and maximum are at over supply voltages and operating  
temperatures ranges, unless otherwise specified.  
Symbol  
Parameter  
Condition  
Min.  
Typ.  
Max.  
Unit  
Transmitter LVTTL Input Characteristics  
VIH  
VIL  
VIK  
Input HIGH Voltage  
Input LOW Voltage  
Input Clamp Voltage  
2.0  
VCC  
0.8  
V
V
V
GND  
IIK=-18mA  
-0.79  
1.8  
0
-1.50  
10.0  
VIN=0.4V to 4.6V  
VIN=GND  
IIN  
Input Current  
µA  
-10  
Transmitter LVDS Output Characteristics(8)  
VOD  
VOD  
VOS  
VOS  
IOS  
Output Differential Voltage  
250  
450  
35  
mV  
mV  
V
VOD Magnitude Change from Differential  
LOW-to-HIGH  
RL=100, Figure 5  
Offset Voltage  
1.125  
1.250  
25  
1.375  
Offset Magnitude Change from  
Differential LOW-to-HIGH  
mV  
mA  
µA  
Short-Circuit Output Current  
VOUT=0V  
-3.5  
±1  
-5.0  
±10  
DO=0V to 4.6V,  
/PwrDn=0V  
IOZ  
Disabled Output Leakage Current  
Transmitter Supply Current  
32.5MHz  
31.0  
32.0  
37.0  
42.0  
10.0  
29.0  
30.0  
35.0  
39.0  
49.5  
55.0  
60.5  
66.0  
55.0  
41.8  
44.0  
49.5  
55.0  
40MHz  
66MHz  
85MHz  
28:4 Transmitter Power Supply Current  
for Worst-Case Pattern (with Load)(9)  
RL=100  
ICCWT  
mA  
µA  
Figure 8  
ICCPDT Powered-Down Supply Current  
/PwrDn=0.8V  
Figure 23(10)  
32.5MHz  
40MHz  
66MHz  
85MHz  
28:4 Transmitter Supply Current for  
ICCGT  
mA  
16 Grayscale(9)  
Notes:  
8. Positive current values refer to the current flowing into device and negative values refer to current flowing out of  
pins. Voltages are referenced to ground unless otherwise specified (except VOD and VOD).  
9. The power supply current for both transmitter and receiver can vary with the number of active I/O channels.  
10. The 16-grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test  
pattern approximates signal switching needed to produce groups of 16 vertical strips across the display.  
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
7
Transmitter AC Electrical Characteristics  
Typical values are at TA=25°C and with VCC=3.3V; minimum and maximum are at over supply voltages and operating  
temperatures ranges, unless otherwise specified.  
Symbol  
tTCP  
Parameter  
Condition  
Min.  
11.76  
0.35  
Typ.  
T
Max.  
50.00  
0.65  
Unit  
ns  
T
Transmit Clock Period  
tTCH  
Transmit Clock (TxCLKIn) HIGH Time  
Transmit Clock LOW Time  
Figure 9  
0.50  
0.50  
tTCL  
0.35  
0.65  
T
(10% to 90%)  
Figure 10  
tCLKT  
TxCLKIn Transition Time (Rising and Falling)  
1.0  
1.5  
6.0  
ns  
ns  
tJIT  
tXIT  
TxCLKIn Cycle-to-Cycle Jitter  
TxIn Transition Time  
3.0  
6.0  
LVDS Transmitter Timing Characteristics  
tTLH  
tTHL  
Differential Output Rise Time (20% to 80%)  
Differential Output Fall Time (20% to 80%)  
TxIn Setup to TxCLNIn  
0.75  
0.75  
1.50  
1.50  
ns  
ns  
ns  
ns  
ns  
Figure 8  
tSTC  
tHTC  
tTPDD  
2.5  
0
Figure 9  
f=85MHz  
TxIn Holds to TxCLNIn  
Transmitter Power-Down Delay  
Figure 14 (11)  
100  
6.8  
(TA=25°C and  
with VCC=3.3V)  
Figure 13  
tTCCD  
Transmitter Clock Input to Clock Output Delay  
2.8  
5.5  
ns  
Transmitter Output Data Jitter (f=40MHz)(12)  
tTPPB0  
tTPPB1  
tTPPB2  
tTPPB3  
tTPPB4  
tTPPB5  
tTPPB6  
Transmitter Output Pulse Position of Bit 0  
Transmitter Output Pulse Position of Bit 1  
Transmitter Output Pulse Position of Bit 2  
Transmitter Output Pulse Position of Bit 3  
Transmitter Output Pulse Position of Bit 4  
Transmitter Output Pulse Position of Bit 5  
Transmitter Output Pulse Position of Bit 6  
-0.25  
0
0.25  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
a-0.25  
a
a+0.25  
2a-0.25  
3a-0.25  
4a-0.25  
5a-0.25  
6a-0.25  
2a  
3a  
4a  
5a  
6a  
2a+0.25  
3a+0.25  
4a+0.25  
5a+0.25  
6a+0.25  
Figure 20  
1
a   
f 7  
Transmitter Output Data Jitter (f=65MHz) (12)  
tTPPB0  
tTPPB1  
tTPPB2  
tTPPB3  
tTPPB4  
tTPPB5  
tTPPB6  
Transmitter Output Pulse Position of Bit 0  
Transmitter Output Pulse Position of Bit 1  
Transmitter Output Pulse Position of Bit 2  
Transmitter Output Pulse Position of Bit 3  
Transmitter Output Pulse Position of Bit 4  
Transmitter Output Pulse Position of Bit 5  
Transmitter Output Pulse Position of Bit 6  
-0.2  
0
0.2  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
a-0.2  
a
a+0.2  
2a-0.2  
3a-0.2  
4a-0.2  
5a-0.2  
6a-0.2  
2a  
3a  
4a  
5a  
6a  
2a+0.2  
3a+0.2  
4a+0.2  
5a+0.2  
6a+0.2  
Figure 20  
1
a   
f 7  
Continued on the following page…  
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
8
Transmitter AC Electrical Characteristics (Continued)  
Over supply voltage and operating temperature ranges, unless otherwise specified.  
Symbol  
Parameter  
Condition  
Min.  
Typ.  
Max.  
Unit  
Transmitter Output Data Jitter (f=85MHz)(12)  
tTPPB0  
tTPPB1  
tTPPB2  
tTPPB3  
tTPPB4  
tTPPB5  
tTPPB6  
Transmitter Output Pulse Position of Bit 0  
Transmitter Output Pulse Position of Bit 1  
Transmitter Output Pulse Position of Bit 2  
Transmitter Output Pulse Position of Bit 3  
Transmitter Output Pulse Position of Bit 4  
Transmitter Output Pulse Position of Bit 5  
Transmitter Output Pulse Position of Bit 6  
-0.2  
0
a
0.2  
a+0.2  
2a+0.2  
3a+0.2  
4a+0.2  
5a+0.2  
6a+0.2  
370  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
a-0.2  
2a-0.2  
3a-0.2  
4a-0.2  
5a-0.2  
6a-0.2  
2a  
3a  
4a  
5a  
6a  
350  
210  
110  
Figure 20  
1
a   
f 7  
f=40MHz  
f=65MHz  
f=85MHz  
Figure 26(12)  
FIN3385 Transmitter Clock Out Jitter,  
Cycle-to-Cycle, Figure 20  
tJCC  
230  
ps  
150  
tTPLLS  
Transmitter Phase Lock Loop Set Time(13)  
10  
ms  
Notes:  
11. Outputs of all transmitters stay in 3-STATE until power reaches 2V. Clock and data output begins to toggle 10ms  
after VCC reaches 3.0V and /PwrDn pin is above 1.5V.  
12. This output data pulse position works for both transmitters for TTL inputs, except the LVDS output bit mapping  
difference (see Figure 18). Figure 20 shows the skew between the first data bit and clock output. A two-bit cycle  
delay is guaranteed when the MSB is output from transmitter.  
13. This jitter specification is based on the assumption that PLL has a reference clock with cycle-to-cycle input jitter  
of less than 2ns.  
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
9
Receiver DC Characteristics  
Typical values are at TA=25°C and with VCC=3.3V. Minimum and maximum values are over supply voltage and  
operating temperature ranges unless otherwise specified. Positive current values refer to the current flowing into  
device and negative values refer to current flowing out of pins. Voltages are referenced to ground unless otherwise  
specified (except VOD and VOD).  
Symbol  
Parameter  
Condition  
Min.  
Typ.  
Max.  
Unit  
LVTTL/CMOS DC Characteristics  
VIH  
VIL  
Input High Voltage  
Input Low Voltage  
Output High Voltage  
Output Low Voltage  
Input Clamp Voltage  
Input Current  
2.0  
GND  
2.7  
VCC  
0.8  
V
V
VOH  
VOL  
VIK  
IIN  
IOH=-0.4mA  
IOL=2mA  
3.3  
V
0.06  
-0.79  
0.30  
-1.50  
10  
V
IIK=-18mA  
V
VIN=0V to 4.6V  
-10  
A  
Input/Output Power-Off  
Leakage Current  
VCC=0V, All LVTTL Inputs / Outputs  
0V to 4.6V  
IOFF  
IOS  
±10  
A  
Output Short-Circuit Current  
VOUT=0V  
-60  
-120  
m  
Receiver LVDS Input Characteristics  
Differential Input Threshold  
HIGH  
VTH  
Figure 6, Table 4  
Figure 6, Table 4  
100  
mV  
Differential Input Threshold  
LOW  
VTL  
-100  
0.05  
mV  
V
VICM  
IIN  
Input Common Mode Range  
Figure 6, Table 4  
2.35  
±10  
±10  
VIN=2.4V, VCC=3.6V or 0V  
VIN=0V, VCC=3.6V or 0V  
Input Current  
A  
Receiver Supply Current  
4:28 Receiver Power Supply  
32.5MHz  
40.0MHz  
66.0MHz  
70  
75  
Current for Worst-Case Pattern  
with Load(14)  
114  
135  
60  
85.0MHz  
ICCWR  
CL=8pF, Figure 7  
mA  
3:21 Receiver Power Supply  
Current for Worst-Case Pattern  
with Load(14)  
32.5MHz  
40.0MHz  
66.0MHz  
85.0MHz  
49  
53  
78  
90  
NA  
65  
100  
115  
55  
ICCPDT Powered-Down Supply Current /PwrDn=0.8V (RxOut Stays LOW)  
A  
© 2003 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FIN3385 / FIN3386 • Rev. 1.0.6  
10  
Receiver AC Characteristics  
Typical values are at TA=25°C and with VCC=3.3V; minimum and maximum are at over supply voltages and operating  
temperatures ranges, unless otherwise specified.  
Symbol  
tRCOP  
tRCOL  
Parameter  
Receiver Clock Output (RxCLKOut) Period  
RxCLKOut LOW Time  
Condition  
Min.  
11.76  
4.0  
Typ.  
T
Max. Unit  
50.00  
5.0  
5.0  
6.0  
6.5  
ns  
ns  
ns  
ns  
Figure 12  
Rising Edge Strobe  
f=85MHz  
tRCOH  
tRSRC  
tRHRC  
tROLH  
RxCLKOut HIGH Time  
4.5  
RxOut Valid Prior to RxCLKOut  
RxOut Valid After RxCLKOut  
Output Rise Time (20% to 80%)  
Output Fall Time (80% to 20%)  
3.5  
3.5  
2.0  
1.8  
3.5  
3.5  
CL=8pF, Figure 8  
ns  
ns  
tROHL  
Receiver Clock Input to Clock Output  
Delay(15)  
TA=25°C, VCC=3.3V,  
Figure 24  
tRCCD  
3.5  
5.0  
7.5  
tRPPD  
Receiver Power-Down Delay  
Figure 17  
1.0  
1.19  
2.87  
4.55  
6.23  
7.91  
9.59  
11.27  
µs  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ps  
ms  
ns  
tRSPB0 Receiver Input Strobe Position of Bit 0  
tRSPB1 Receiver Input Strobe Position of Bit 1  
tRSPB2 Receiver Input Strobe Position of Bit 2  
tRSPB3 Receiver Input Strobe Position of Bit 3  
tRSPB4 Receiver Input Strobe Position of Bit 4  
tRSPB5 Receiver Input Strobe Position of Bit 5  
tRSPB6 Receiver Input Strobe Position of Bit 6  
0.49  
2.17  
3.85  
5.53  
7.21  
8.89  
10.57  
290  
0.84  
2.52  
4.20  
5.88  
7.56  
9.24  
10.92  
Figure 21  
f=85MHz  
tRSKM  
tRPLLS  
tRCOP  
tRCOL  
tRCOH  
tRSRC  
tRHRC  
tRCOL  
tRCOH  
tRSRC  
tRHRC  
tROLH  
tROHL  
RxIN Skew Margin(16)  
Figure 21  
Figure 21  
Figure 12  
Receiver Phase Lock Loop Set Time  
Receiver Clock Output (RxCLKOut) Period  
RxCLKOut LOW Time  
10  
T
15  
10.0  
10.0  
6.5  
50  
11.0  
12.2  
11.6  
11.6  
6.3  
7.6  
7.3  
6.3  
2.0  
1.8  
Figure 12  
Rising Edge Strobe  
f=40MHz  
RxCLKOut HIGH Time  
ns  
RxOUT Valid Prior to RxCLKOut  
RxOUT Valid After RxCLKOut  
RxCLKOut LOW Time  
6.0  
5.0  
9.0  
9.0  
Figure 12,  
RxCLKOut HIGH Time  
5.0  
4.5  
Rising Edge Strobe(17)  
f=66MHz  
ns  
ns  
RxOUT Valid Prior to RxCLKOut  
RxOUT Valid After RxCLKOut  
Output Rise Time (20% to 80%)  
Output Fall Time (20% to 80%)  
4.0  
5.0  
5.0  
CL=8pF(17), Figure 12  
Receiver Clock Input to Clock Output  
Delay(18)  
Figure 14, TA=25°C  
and VCC=3.3v  
tRCCD  
3.5  
5.0  
7.5  
ns  
µs  
tRPDD  
Receiver Power-Down Delay  
Figure 17  
1.0  
tRSPB0 Receiver Input Strobe Position of Bit 0  
tRSPB1 Receiver Input Strobe Position of Bit 1  
tRSPB2 Receiver Input Strobe Position of Bit 2  
tRSPB3 Receiver Input Strobe Position of Bit 3  
tRSPB4 Receiver Input Strobe Position of Bit 4  
tRSPB5 Receiver Input Strobe Position of Bit 5  
tRSPB6 Receiver Input Strobe Position of Bit 6  
1.00  
4.50  
8.10  
11.6  
15.1  
18.8  
22.5  
1.40  
5.00  
8.50  
11.9  
15.6  
19.2  
22.9  
2.15  
5.80  
9.15  
12.6  
16.3  
19.9  
23.6  
Figure 21, f=40MHz  
ns  
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
11  
Receiver AC Characteristics  
Typical values are at TA=25°C and with VCC=3.3V; minimum and maximum are at over supply voltages and operating  
temperatures ranges, unless otherwise specified.  
Symbol  
Parameter  
Condition  
Min.  
0.7  
Typ.  
1.1  
Max. Unit  
tRSPB0 Receiver Input Strobe Position of Bit 0  
tRSPB1 Receiver Input Strobe Position of Bit 1  
tRSPB2 Receiver Input Strobe Position of Bit 2  
tRSPB3 Receiver Input Strobe Position of Bit 3  
tRSPB4 Receiver Input Strobe Position of Bit 4  
tRSPB5 Receiver Input Strobe Position of Bit 5  
tRSPB6 Receiver Input Strobe Position of Bit 6  
1.4  
3.6  
5.8  
2.9  
3.3  
5.1  
5.5  
Figure 21, f=66MHz  
7.3  
7.7  
8.0  
ns  
9.5  
9.9  
10.2  
12.4  
14.6  
11.7  
13.9  
490  
400  
12.1  
14.3  
f=40MHz, Figure 21  
f=66MHz, Figure 21  
Figure 15  
tRSKM  
RxIn Skew Margin(19)  
ps  
tRPLLS  
Receiver Phase Lock Loop Set Time  
10.0  
ms  
Notes:  
14. The power supply current for the receiver can vary with the number of I/O channels.  
15. Total channel latency from serializer to deserializer is (t + tTCCD) where t is a clock period.  
16. Receiver skew margin is defined as the valid sampling window after considering potential setup/hold time and  
minimum/maximum bit position.  
17. For the receiver with falling-edge strobe, the definition of setup/hold time is slightly different from the one with  
rising-edge strobe. The clock reference point is the time when the clock falling edge passes through 2V. For hold  
time tRHRC, the clock reference point is the time when falling edge passes through +0.8V.  
18. Total channel latency from serializer to deserializer is (t + tCCD) (2•t + tRCCD) where t is the clock period.  
19. Receiver skew margin is defined as the valid sampling window after considering potential setup/hold time and  
minimum / maximum bit position.  
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
12  
Test Circuits  
Figure 5. Differential LVDS Output DC Test Circuit  
Notes:  
A: For all input pulses, tR or tF<=1ns.  
B: CL includes all probe and jig capacitance.  
Figure 6. Differential Receiver Voltage Definitions, Propagation Delay, and Transition Time Test Circuit  
Table 4. Receiver Minimum and Maximum Input Threshold Test Voltages  
Resulting Differential  
Input Voltage (mV)  
Resulting Common  
Mode Input Voltage (V)  
Applied Voltages (V)  
VIA  
1.25  
1.15  
2.40  
2.30  
0.10  
0
VIB  
1.15  
1.25  
2.30  
2.40  
0
VID  
100  
-100  
100  
-100  
100  
-100  
600  
-600  
600  
-600  
600  
-600  
VICM  
1.20  
1.20  
2.35  
2.35  
0.05  
0.05  
1.20  
1.20  
2.10  
2.10  
0.30  
0.30  
0.10  
0.90  
1.50  
1.80  
2.40  
0
1.50  
0.90  
2.40  
1.80  
0.60  
0
0.60  
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
13  
AC Loadings and Waveforms  
Figure 7. Worst-Case Test Pattern  
Note:  
20. The worst-case test pattern produces a maximum toggling of digital circuits, LVDS I/O, and LVTTL/CMOS I/O.  
Depending on the valid strobe edge of the transmitter, the TxCLKIn can be rising or falling edge data strobe.  
Figure 8. Transmitter LVDS Output Load and Transition Times  
Figure 9. Transmitter Setup/Hold and HIGH/LOW Times (Rising-Edge Strobe)  
Figure 10. Transmitter Input Clock Transition Time  
Figure 11. Transmitter Outputs Channel-to-Channel Skew  
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
14  
AC Loadings and Waveforms (Continued)  
Figure 12. Receiver Setup/Hold and HIGH/LOW Times  
Note:  
21. For the receiver with falling-edge strobe, the definition of setup/hold time is slightly different from the one with  
rising-edge strobe. The clock reference point is the time when the clock falling edge passes through 2V. For hold  
time tRHRC, the clock reference point is the time when falling edge passes through +0.8V.  
Figure 13. Transmitter Clock-In to Clock-Out Delay (Rising-Edge Strobe)  
Figure 14. Receiver Clock-In to Clock-Out Delay (Falling-Edge Strobe)  
Figure 15. Receiver Phase-Lock-Loop Set Time  
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
15  
AC Loadings and Waveforms (Continued)  
Figure 16. Transmitter Power-Down Delay  
Figure 17. Receiver Power-Down Delay  
Figure 18. 28 Parallel LVTTL Inputs Mapped to Four Serial LVDS Outputs  
Note:  
22. The information in this diagram shows the difference between clock out and the first data bit. A 2-bit cycle delay  
is guaranteed when the MSB is output from the transmitter.  
Figure 19. 21 Parallel LVTTL Inputs Mapped to Three Serial Outputs  
Note:  
23. This output date pulse position works for both transmitters with 21 TTL inputs, except the LVDS output bit  
mapping difference. Two-bit cycle delay is guaranteed with the MSB is output from transmitter.  
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
16  
AC Loadings and Waveforms (Continued)  
Figure 20.Transmitter Output Pulse Bit Position  
Figure 21.Receiver Input Bit Position  
Figure 22. Receiver LVDS Input Skew Margin  
Note:  
24. tRSKM is the budget for the cable skew and source clock skew plus Inter-Symbol Interference (ISI).  
The minimum and maximum pulse position values are based on the bit position of each of the seven bits within  
the LVDS data stream across PVT (Process, Voltage Supply, and Temperature).  
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
17  
AC Loadings and Waveforms (Continued)  
Figure 23. Transmitter Clock Out Jitter Measurement Setup  
Note:  
25. Test setup considers no requirement for separation of RMS and deterministic jitter. Other hardware setups,  
such as Wavecrest boxes, can be used if no M1 software is available, but the test methodology in Figure 24  
should be followed.  
Figure 24. Timing Diagram of Transmitter Clock Input with Jitter  
Note:  
26. This jitter pattern is used to test the jitter response (clock out) of the device over the power supply range with  
worst jitter ±3ns (cycle-to-cycle) clock input. The specific test methodology is as follows:  
27. Switching input data TxIn0 to TxIn20 at 0.5MHz and the input clock is shifted to left -3ns and to the right +3ns  
when data is HIGH.  
28. The ±3ns cycle-to-cycle input jitter is the static phase error between the two clock sources. Jumping between two  
clock sources to simulate the worst-case of clock-edge jump (3ns) from graphical controllers. Cycle-to-cycle jitter  
at TxCLKOut pin should be measured cross VCC range with 100mV noise (VCC noise frequency <2MHz).  
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
18  
AC Loadings and Waveforms (Continued)  
Figure 25. “16-Grayscale” Test Pattern  
Note:  
29. The 16-grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test  
pattern approximates signal switching needed to produce groups of 16 vertical strips across the display.  
Figure 26. Transmitter Phase-Lock-Loop Time  
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
19  
Physical Dimensions  
A
56  
51  
34  
29  
B
8.10  
4.05  
0.2  
C B A  
1
6
23  
28  
0.30  
0.50  
0.1 C  
-C-  
0.50  
0.10  
A
B
C
0.25  
MTD56REV3  
Figure 27. 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,6.1mm Wide  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the  
warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
20  
© 2003 Fairchild Semiconductor Corporation  
FIN3385 / FIN3386 • Rev. 1.0.6  
www.fairchildsemi.com  
21  

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