FJI5603D [FAIRCHILD]

NPN Silicon Transistor; NPN硅晶体管
FJI5603D
型号: FJI5603D
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

NPN Silicon Transistor
NPN硅晶体管

晶体 晶体管
文件: 总7页 (文件大小:226K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
June 2008  
FJI5603D  
NPN Silicon Transistor  
Applications  
Equivalent Circuit  
C
High Voltage and High Speed Power Switch Application  
Electronic Ballast Application  
Features  
B
Wide Safe Operating Area  
Small Variance in Storage Time  
Built-in Free Wheeling Diode  
I2-PAK  
1.Base 2.Collector 3.Emitter  
1
E
Absolute Maximum Ratings*  
T = 25°C unless otherwise noted  
a
Symbol  
Parameter  
Ratings  
Units  
V
BVCBO  
BVCEO  
BVEBO  
IC  
Collector-Base Voltage  
Collector-Emitter Voltage  
Emitter-Base Voltage  
Collector Current(DC)  
Collector Current(Pulse)**  
Base Current  
1600  
800  
V
12  
V
3
A
ICP  
6
A
IB  
2
A
IBP  
Base Current(Pulse)**  
Power Dissipation(TC=25°C)  
Junction Temperature  
4
100  
A
PD  
W
°C  
°C  
mJ  
TJ  
150  
TSTG  
EAS  
Storage Junction Temperature Range  
- 65 ~ +150  
3.5  
Avalanche Energy(Tj=25°C, 8mH)  
* These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.  
** Pulse Test : Pulse Width = 5ms, Duty Cycle < 10%  
Thermal Characteristics* Ta=25°C unless otherwise noted  
Symbol  
Parameter  
Ratings  
1.25  
Units  
°C/W  
Rθjc  
Rθja  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
80  
°C/W  
* Device mounted on minimum pad size  
Ordering Information  
Part Number  
Marking  
Package  
Packing Method  
Remarks  
FJI5603DTU  
J5603D  
I2PAK  
TUBE  
© 2008 Fairchild Semiconductor Corporation  
FJI5603D Rev. A3  
www.fairchildsemi.com  
1
Electrical Characteristics* Ta=25°C unless otherwise noted  
Symbol  
BVCBO  
BVCEO  
BVEBO  
ICES  
Parameter  
Test Condition  
Min. Typ. Max. Units  
Collector-Base Breakdown Voltage  
Collector-Emitter Breakdown Voltage  
Emitter-Base Breakdown Voltage  
Collector Cut-off Current  
IC=0.5mA, IE=0  
1600  
800  
12  
1689  
870  
V
V
IC=5mA, IB=0  
IE=0.5mA, IC=0  
14.8  
0.01  
V
VCES=1600V,  
IE=0  
TC=25°C  
TC=125°C  
TC=25°C  
TC=125°C  
100  
1000  
100  
1000  
500  
35  
µA  
ICEO  
Collector Cut-off Current  
VCE=800V,  
VBE=0  
0.01  
µA  
µA  
IEBO  
hFE  
Emitter Cut-off Current  
DC Current Gain  
VEB=12V, IC=0  
0.05  
29  
VCE=3V,  
IC=0.4A  
TC=25°C  
TC=125°C  
TC=25°C  
TC=125°C  
20  
6
15  
VCE=10V, IC=5mA  
20  
20  
43  
46  
VCE(sat)  
VBE(sat)  
Collector-Emitter Saturation Voltage  
Base-Emitter Saturation Voltage  
IC=250mA, IB=25mA TC=25°C  
IC=500mA, IB=50mA TC=25°C  
0.5  
1.5  
1.2  
0.74  
0.61  
0.85  
0.74  
745  
56  
1.25  
2.5  
V
V
V
V
IC=1A, IB=0.2A  
TC=25°C  
2.5  
IC=500mA, IB=50mA TC=25°C  
TC=125°C  
1.2  
1.1  
IC=2A, IB=0.4A  
TC=25°C  
1.2  
V
TC=125°C  
1.1  
Cib  
Cob  
fT  
Input Capacitance  
VEB=10V, IC=0, f=1MHz  
VCB=10V, IE=0, f=1MHz  
IC=0.1A,VCE=10V  
IF=0.4A  
1000  
500  
pF  
pF  
MHz  
V
Output Capacitance  
Current Gain Bandwidth Product  
Diode Forward Voltage  
5
VF  
0.76  
0.83  
1.2  
1.5  
IF=1A  
V
* Pulse Test: Pulse Widt=20µs, Duty Cycle10%  
© 2008 Fairchild Semiconductor Corporation  
FJI5603D Rev. A3  
www.fairchildsemi.com  
2
Electrical Characteristics TC=25°C unless otherwise noted  
Symbol Parameter Test Condition  
Min  
Typ. Max. Units  
RESISTIVE LOAD SWITCHING (D.C < 10%, Pulse Width=20µs)  
tON  
tSTG  
tF  
Turn On Time  
Storage Time  
Fall Time  
IC=0.3A, IB1=50mA IB2=150mA  
CC=125V  
RL = 416Ω  
400  
2.1  
600  
2.3  
ns  
µs  
ns  
ns  
µs  
ns  
V
1.9  
310  
600  
1.3  
1000  
1100  
1.5  
tON  
tSTG  
tF  
Turn On Time  
Storage Time  
Fall Time  
IC=0.5A, IB1=50mA, IB2=250mA  
VCC=125V, RL = 250Ω  
180  
350  
INDUCTIVE LOAD SWITCHING (VCC=15V)  
tSTG  
tF  
Storage Time  
Fall Time  
IC=0.3A, IB1=50mAIB2=150mA,  
Vz=300V, LC=200H  
0.8  
0.8  
-
1.2  
250  
250  
1.2  
µs  
ns  
ns  
µs  
ns  
ns  
170  
180  
-
tC  
Cross-over Time  
Storage Time  
Fall Time  
tSTG  
tF  
IC=0.5A, IB1=50mA, IB2=250mA,  
Vz=300V, LC=200H  
140  
170  
175  
200  
tC  
Cross-over Time  
© 2008 Fairchild Semiconductor Corporation  
FJI5603D Rev. A3  
www.fairchildsemi.com  
3
Typical Characteristics  
3
1A  
VCE=10V  
900mA  
800mA  
100  
10  
1
700mA  
600mA  
500mA  
TJ=125oC  
TJ=25oC  
2
1
0
400mA  
300mA  
200mA  
IB=100mA  
1
10  
100  
1000  
0
1
2
3
4
5
6
7
IC[mA], COLLECTOR CURRENT  
Figure 2. DC current Gain  
VCE[V], COLLECTOR EMITTER VOLTAGE  
Figure 1. Static Characteristic  
IC=5IB  
IC=5IB  
10  
1
TJ=25oC  
1
TJ=125oC  
TJ=125oC  
0.1  
0.01  
TJ=25oC  
0.1  
1
10  
100  
1000  
1
10  
100  
1k  
IC(mA), COLLECTOR CURRENT  
IC[mA], COLLECTOR CURRENT  
Figure 3. Collector-Emitter Saturation Voltage  
Figure 4. Base-Emitter Saturation Voltage  
2
TJ=25oC  
1000  
F=1MHz  
C
3.0A  
ib  
2.0A  
1.0A  
100  
1
0.4A  
IC=0.2A  
Cob  
10  
0
1
10  
100  
1k  
1
1
10  
100  
IB[mA], BASE CURRENT  
REVERSE VOLTAGE[V]  
Figure 6. Capacitance  
Figure 5. Typical Collector Saturation Voltage  
© 2008 Fairchild Semiconductor Corporation  
FJI5603D Rev. A3  
www.fairchildsemi.com  
4
Typical Characteristics (Continued)  
5
1000  
900  
4.5  
800  
IC=6IB1=2IB2  
VCC=125V  
PW=20us  
IC=6IB1=2IB2  
VCC=125V  
PW=20us  
4
700  
3.5  
600  
500  
3
400  
TJ=125oC  
TJ=125oC  
2.5  
300  
2
200  
TJ=25oC  
TJ=25oC  
1.5  
1
0.3  
100  
0.3  
0.4  
0.5 0.6 0.7 0.8 0.9  
1
2
3
0.4  
0.5 0.6 0.7 0.8 0.9  
1
2
3
IC[A], COLLECTOR CURRENT  
IC[A], COLLECTOR CURRENT  
Figure 7. Resistive Switching Time, ton  
Figure 8. Resistive Switching Time, toff  
10  
1000  
9
8
900  
IC=10IB1=5IB2  
VCC=125V  
PW=20us  
IC=10IB1=5IB2  
VCC=125V  
PW=20us  
800  
7
6
700  
TJ=125oC  
5
4
600  
TJ=125oC  
500  
400  
3
2
TJ=25oC  
300  
TJ=25oC  
1
0.3  
200  
0.3  
0.4  
0.5 0.6 0.7 0.8 0.9  
1
2
3
0.4  
0.5 0.6 0.7 0.8 0.9  
1
2
3
IC[A], COLLECTOR CURRENT  
IC[A], COLLECTOR CURRENT  
Figure 9. Resistive Switching Time, ton  
Figure 10. Resistive Switching Time, toff  
4
6
IC=6IB1=2IB2  
VCC=15V  
VZ=300V  
IC=10IB1=2IB2  
VCC=15V  
VZ=300V  
5
4
TJ=125oC  
3
LC=200uH  
LC=200uH  
TJ=125oC  
3
2
2
TJ=25oC  
TJ=25oC  
1
0.3  
1
0.3  
0.4  
0.5 0.6 0.7 0.8 0.9  
1
2
3
0.4  
0.5  
0.6 0.7 0.8 0.9  
1
2
IC[A], COLLECTOR CURRENT  
IC[A], COLLECTOR CURRENT  
Figure 11. Inductive Switching Time, tSTG  
Figure 12. Inductive Switching Time, tSTG  
© 2008 Fairchild Semiconductor Corporation  
FJI5603D Rev. A3  
www.fairchildsemi.com  
5
Typical Characteristics (Continued)  
400  
800  
700  
IC=6IB1=2IB2  
VCC=15V  
VZ=300V  
LC=200uH  
IC=10IB1=2IB2  
VCC=15V  
VZ=300V  
300  
600  
500  
TJ=25oC  
LC=200uH  
200  
400  
300  
TJ=25oC  
100  
90  
200  
80  
70  
TJ=125oC  
60  
50  
40  
100  
90  
TJ=125oC  
80  
70  
30  
60  
20  
0.3  
50  
0.3  
0.4  
0.5 0.6 0.7 0.8 0.9  
1
2
3
0.4  
0.5  
0.6 0.7 0.8 0.9  
1
2
IC[A], COLLECTOR CURRENT  
IC[A], COLLECTOR CURRENT  
Figure 13. Inductive Switching Time, tF  
Figure 14. Inductive Switching Time, tF  
500  
2000  
IC=6IB1=2IB2  
VCC=15V  
IC=10IB1=2IB2  
VCC=15V  
TJ=125oC  
400  
VZ=300V  
LC=200uH  
VZ=300V  
LC=200uH  
1000  
900  
800  
300  
700  
600  
TJ=25oC  
500  
400  
200  
300  
200  
TJ=25oC  
TJ=125oC  
100  
0.3  
100  
0.3  
0.4  
0.5 0.6 0.7 0.8 0.9  
1
2
3
0.4  
0.5  
0.6 0.7 0.8 0.9  
1
2
IC[A], COLLECTOR CURRENT  
IC[A], COLLECTOR CURRENT  
Figure 15. Inductive Switching Time, tc  
Figure 16. Inductive Switching Time, tc  
100  
50  
0
0
50  
100  
150  
200  
TC(oC), CASE TEMPERATURE  
Figure 17. Power Derating  
© 2008 Fairchild Semiconductor Corporation  
FJI5603D Rev. A3  
www.fairchildsemi.com  
6
TRADEMARKS  
The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and  
is not intended to be an exhaustive list of all such trademarks.  
ACEx®  
Green FPS™  
Green FPS™ e-Series™  
GTO™  
i-Lo™  
IntelliMAX™  
ISOPLANAR™  
MegaBuck™  
MICROCOUPLER™  
MicroFET™  
Power247®  
SuperSOT™-8  
SyncFET™  
Build it Now™  
CorePLUS™  
CROSSVOLT™  
CTL™  
Current Transfer Logic™  
EcoSPARK®  
POWEREDGE®  
Power-SPM™  
PowerTrench®  
Programmable Active Droop™  
QFET®  
The Power Franchise®  
TinyBoost™  
TinyBuck™  
TinyLogic®  
TINYOPTO™  
TinyPower™  
TinyPWM™  
TinyWire™  
µSerDes™  
UHC®  
QS™  
QT Optoelectronics™  
Quiet Series™  
RapidConfigure™  
SMART START™  
SPM®  
STEALTH™  
SuperFET™  
SuperSOT™-3  
SuperSOT™-6  
Fairchild®  
Fairchild Semiconductor®  
FACT Quiet Series™  
FACT®  
MicroPak™  
MillerDrive™  
Motion-SPM™  
OPTOLOGIC®  
FAST®  
FastvCore™  
FPS™  
OPTOPLANAR®  
®
UniFET™  
VCX™  
FRFET®  
PDP-SPM™  
Power220®  
Global Power ResourceSM  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS  
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF  
THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE  
UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF  
FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE  
PRODUCTS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR  
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to result  
in significant injury to the user.  
2.  
A critical component is any component of a life support  
device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
This datasheet contains the design specifications for product development.  
Specifications may change in any manner without notice.  
Advance Information  
Formative or In Design  
This datasheet contains preliminary data; supplementary data will be pub-  
lished at a later date. Fairchild Semiconductor reserves the right to make  
changes at any time without notice to improve design.  
Preliminary  
First Production  
Full Production  
Not In Production  
This datasheet contains final specifications. Fairchild Semiconductor reserves  
the right to make changes at any time without notice to improve design.  
No Identification Needed  
Obsolete  
This datasheet contains specifications on a product that has been discontin-  
ued by Fairchild semiconductor. The datasheet is printed for reference infor-  
mation only.  
Rev. I31  
© 2008 Fairchild Semiconductor Corporation  
FJI5603D Rev. A3  
www.fairchildsemi.com  
7

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