FOD816.300W [FAIRCHILD]
AC Input-Darlington Output Optocoupler, 1-Element, 5000V Isolation, DIP-4;
| 型号： | FOD816.300W |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | AC Input-Darlington Output Optocoupler, 1-Element, 5000V Isolation, DIP-4 输入元件 输出元件 光电 |
| 文件： | 总9页 (文件大小：114K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
July 2005
FOD816 Series
4-Pin Phototransistor Optocouplers
Features
Applications
■ AC input response
■ Power supply regulators
■ Applicable to Pb-free IR reflow soldering
■ Compact 4-pin package
■ Digital logic inputs
■ Microprocessor inputs
■ High current transfer ratio: 600% minimum
■ Safety agency approvals pending
■ High input-output isolation voltage of 5000Vrms
Description
The FOD816 consists of two gallium arsenide infrared emitting
diodes, connected in inverse parallel, driving a silicon photodar-
lington output in a 4-pin dual in-line package.
Functional Block Diagram
ANODE, CATHODE 1
CATHODE, ANODE 2
4 COLLECTOR
4
3 EMITTER
1
Absolute Maximum Ratings (T = 25°C Unless otherwise specified.)
A
Parameter
Symbol
Value
Units
TOTAL DEVICE
Storage Temperature
Operating Temperature
Lead Solder Temperature
Total Power Dissipation
INPUT
T
-55 to +125
-30 to +100
260 for 10 sec
200
°C
°C
STG
T
OPR
T
°C
SOL
P
mW
TOT
Forward Current
I
50
70
mA
F
Power Dissipation
OUTPUT
P
mW
Collector-Emitter Voltage
Emitter-Collector Voltage
Collector Current
V
V
35
6
V
V
CEO
ECO
I
80
150
mA
mW
C
Collector Power Dissipation
P
C
©2005 Fairchild Semiconductor Corporation
FOD816 Series Rev. 1.0.3
1
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Electrical/Characteristics (T = 25°C Unless otherwise specified.)
A
Individual Component Characteristics
Parameter
Test Conditions
Symbol Min
Typ
Max Unit
INPUT
Forward Voltage
(I
=
20 mA)
V
—
—
1.2
50
1.4
V
F
F
Terminal Capacitance
OUTPUT
(V = 0, f = 1 kHz)
C
250
pF
t
Collector Dark Current
Collector-Emitter Breakdown Voltage
Emitter-Collector Breakdown Voltage
(V = 10 V, I = 0)
I
CEO
—
35
6
—
—
—
1
µA
V
CE
F
(I = 0.1 mA, I = 0)
BV
BV
—
—
C
F
CEO
ECO
(I = 10 µA, I = 0)
V
E
F
Transfer Characteristics (T = 25°C Unless otherwise specified.)
A
DC Characteristic
Test Conditions
Symbol Min
Typ
—
Max Unit
Collector Current
I
6
75
7,500
1
mA
%
C
(I = 1 mA, V = 2 V)
F
CE
1
Current Transfer Ratio
CTR
600
—
Collector-Emitter Saturation Voltage
Isolation Resistance
(I
=
20 mA, I = 5 mA)
V
—
0.8
V
F
C
CE (sat)
10
11
(DC500V 40~60% R.H.)
(V = 0, f = 1 MHz)
R
5x10
—
1x10
0.6
6
—
Ω
iso
Floating Capacitance
Cut-Off Frequency
C
f
1
pF
KHz
µs
µs
f
(V = 5 V, I = 2 mA, R = 100 Ω, -3dB)
1
—
CE
C
L
C
Response Time (Rise)
Response Time (Fall)
t
—
60
300
250
r
(V = 2 V, I = 10 mA, R = 100 Ω
CE
C
L
t
—
53
f
Isolation Characteristics
Characteristic
Input-Output Isolation Voltage (note 3)
Isolation Resistance
Test Conditions Symbol
Min
Typ
Max
Units
f = 60Hz, t = 1 min
V
R
C
5000
Vac(rms)
ISO
ISO
ISO
10
11
(V = 500 VDC)
5 x 10
10
0.6
Ω
I-O
Isolation Capacitance
(V = 0, f = 1 MHz)
1.0
pf
I-O
NOTES
1. Current Transfer Ratio (CTR) = I /I x 100%.
C F
2
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FOD816 Series Rev. 1.0.3
Typical Electrical/Optical Characteristic Curves (T = 25°C Unless otherwise specified.)
A
Fig. 1 Forward Current
vs. Ambient Temperature
Fig. 2 Collector Power Dissipation
vs. Ambient Temperature
60
50
40
30
20
10
0
200
150
100
50
0
0
25
50
75
0
25
50
75
-30
100 125
-30
100 125
AMBIENT TEMPERATURE T (°C)
AMBIENT TEMPERATURE T (°C)
A
A
Fig. 3 Collector-Emitted Saturation Voltage
vs. Forward Current
Fig. 4 Forward Current vs. Forward Voltage
500
8
7
6
5
4
3
2
1
0
Ta = 25°C
Ta = 75°C
50°C
200
100
25°C
0°C
- 25°C
50
20
10
5
2
1
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
0
0.5
1.0
1.5
2.0
2.5
3.0
FORWARD CURRENT I (mA)
F
FORWARD VOLTAGE V (V)
F
Fig. 5 Current Transfer Ratio
vs. Forward Current
Fig. 6 Collector Current
vs. Collector-Emitter Voltage
2000
1600
1200
800
400
0
100
80
60
40
20
0
V
= 2V
CE
Ta = 25°C
Ta = 25°C
I
= 10 mA
F
Pc(MAX.)
5mA
2mA
1mA
0.1
0.2
0.5
1
2
5
10
0
1
2
3
4
5
FORWARD CURRENT I (mA)
F
COLLECTOR-EMITTER VOLTAGE V
(V)
CE
3
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FOD816 Series Rev. 1.0.3
Typical Electrical/Optical Characteristic Curves (T = 25°C Unless otherwise specified.)
A
Fig. 8 Collector-Emitter Saturation Voltage
vs. Ambient Temperature
Fig. 7. Relative Current Transfer Ratio
vs. Ambient Temperature
150
100
50
I
I
= 20mA
= 5mA
I
V
= 5mA
= 2V
F
C
F
CE
1.0
0.8
0.6
0.4
0.2
0
0
-25
0
25
50
75
100
-30
0
25
50
75
100
AMBIENT TEMPERATURE T (°C)
AMBIENT TEMPERATURE T (°C)
A
A
Fig. 9 Collector Dark Current
vs. Ambient Temperature
Fig. 10. Response Time
vs. Load Resistance
10-5
10-6
10-7
10-8
10-9
10-10
10-11
500
200
100
50
20
10
5
V
C
= 2V
CE
V
= 20V
CE
tr
I
= 10mA
Ta = 25°C
tf
td
ts
2
1
0.5
0.2
0.05
-25
0
25
50
75
100
0.1 0.2 0.5
1
2
5
10
AMBIENT TEMPERATURE T (°C)
LOAD RESISTANCE R (kΩ)
A
L
Test Circuit for Response Time
Fig. 11. Frequency Response
V
C
= 2V
CE
= 2mA
Input
Output
I
Vcc
L
Ta = 25°C
0
-10
-20
R
R
10%
90%
D
Input
Output
td
ts
tr
tf
R =10kΩ 1kΩ
100Ω
L
Test Circuit for Frequency Response
Vcc
R
0.02
0.1
1
10
100
L
R
D
Output
FREQUENCY f (kHz)
4
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FOD816 Series Rev. 1.0.3
Package Dimensions (Through Hole)
Package Dimensions (Surface Mount)
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.312 (7.92)
0.288 (7.32)
0.200 (5.10)
0.161 (4.10)
0.200 (5.10)
0.276 (7.00)
0.161 (4.10)
0.236 (6.00)
0.157 (4.00)
0.118 (3.00)
0.157 (4.00)
0.118 (3.00)
0.010 (0.26)
0.051 (1.30)
0.043 (1.10)
0.049 (1.25)
0.030 (0.76)
0.130 (3.30)
0.020 (0.51)
0.091 (2.30)
TYP
0.024 (0.60)
0.004 (0.10)
0.412 (10.46)
0.388 (9.86)
0.010 (0.26)
0.150 (3.80)
0.110 (2.80)
0.110 (2.79)
0.090 (2.29)
0.300 (7.62)
typ
Lead Coplanarity 0.004 (0.10) MAX
0.024 (0.60)
0.016 (0.40)
0.110 (2.79)
0.090 (2.29)
Package Dimensions
(0.4” Lead Spacing)
Footprint Dimensions
(Surface Mount)
0.312 (7.92)
0.288 (7.32)
1.5
0.200 (5.10)
0.161 (4.10)
0.157 (4.00)
0.118 (3.00)
0.276 (7.00)
0.236 (6.00)
1.3
0.291 (7.40)
0.252 (6.40)
0.130 (3.30)
0.091 (2.30)
9
0.110 (2.80)
0.011 (1.80)
0.150 (3.80)
0.110 (2.80)
0.010 (0.26)
0.110 (2.79)
0.090 (2.29)
0.024 (0.60)
0.016 (0.40)
0.42 (10.66)
0.38 (9.66)
2.54
NOTE
All dimensions are in inches (millimeters)
5
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FOD816 Series Rev. 1.0.3
Ordering Information
Option
S
Order Entry Identifier
Description
Surface Mount Lead Bend
Surface Mount; Tape and reel
0.4" Lead Spacing
.S
.SD
SD
W
.W
300
300W
3S
.300
.300W
.3S
VDE Approved
VDE Approved, 0.4" Lead Spacing
VDE Approved, Surface Mount
VDE Approved, Surface Mount, Tape & Reel
3SD
.3SD
Marking Information
4
5
6
V X ZZ Y
816
3
2
1
Definitions
1
2
3
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4
5
6
One digit year code
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
6
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FOD816 Series Rev. 1.0.3
Carrier Tape Specifications
P
P
0
2
Ø1.55 0.05
1.75 0.1
F
W
B0
A0
P
1
0.3 0.05
K0
NOTE
All dimensions are in millimeters
Description
Tape wide
Symbol
Dimensions in mm (inches)
W
16 0.3 (.63)
Pitch of sprocket holes
Distance of compartment
P
4
0.1 (.15)
7.5 0.1 (.295)
0.1 (.079)
0
F
P
2
2
Distance of compartment to compartment
Compartment
P
12 0.1 (.472)
10.45 0.1 (.411)
5.30 0.1 (.209)
4.25 0.1 (.167)
1
A0
B0
K0
7
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FOD816 Series Rev. 1.0.3
Lead Free recommended IR Reflow condition
Tp
Tsmax
Tsmin
Ramp-down
25°C
Soldering zon
ts (Preheat)
Time (sec)
Profile Feature
Pb-Sn solder assembly
Lead Free assembly
Preheat condition
(Tsmin-Tsmax / ts)
100°C ~ 150°C
60 ~ 120 sec
150°C ~ 200°C
60 ~120 sec
Melt soldering zone
183°C
217°C
60 ~ 120 sec
30 ~ 90 sec
Peak temperature (Tp)
Ramp-down rate
240 +0/-5°C
250 +0/-5°C
6°C/sec max.
6°C/sec max.
Recommended Wave Soldering condition
Profile Feature
For all solder assembly
Peak temperature (Tp)
Max 260°C for 10 sec
8
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FOD816 Series Rev. 1.0.3
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DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVESTHE RIGHTTO MAKE CHANGES WITHOUTFURTHER NOTICETOANY
PRODUCTS HEREINTO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOTASSUMEANYLIABILITY
ARISING OUTOFTHEAPPLICATION OR USE OFANYPRODUCTOR CIRCUITDESCRIBED HEREIN; NEITHER DOES IT
CONVEYANYLICENSE UNDER ITS PATENTRIGHTS, NORTHE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUTTHE EXPRESS WRITTENAPPROVALOF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Obsolete
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I16
9
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FOD816 Series Rev. 1.0.3
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