FQB7N65C [FAIRCHILD]

650V N-Channel MOSFET; 650V N沟道MOSFET
FQB7N65C
型号: FQB7N65C
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

650V N-Channel MOSFET
650V N沟道MOSFET

文件: 总8页 (文件大小:723K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
September 2006  
®
QFET  
FQB7N65C  
650V N-Channel MOSFET  
Features  
Description  
7A, 650V, RDS(on) = 1.4@VGS = 10 V  
Low gate charge ( typical 28 nC)  
Low Crss ( typical 12 pF)  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary, planar  
stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the avalanche  
and commutation mode. These devices are well suited for high  
efficient switched mode power supplies, active power factor  
correction, electronic lamp ballast based on half bridge  
topology.  
D
D
G
D2-PAK  
G
S
FQB Series  
S
Absolute Maximum Ratings  
Symbol  
Parameter  
FQB7N65C  
Units  
V
VDSS  
ID  
Drain-Source Voltage  
650  
7
Drain Current  
- Continuous (TC = 25°C)  
- Continuous (TC = 100°C)  
- Pulsed  
A
4.45  
28  
A
(Note 1)  
IDM  
Drain Current  
A
VGSS  
EAS  
IAR  
Gate-Source Voltage  
± 30  
212  
V
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
7
EAR  
dv/dt  
PD  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Power Dissipation (TC = 25°C)  
17.3  
4.5  
mJ  
V/ns  
W
173  
- Derate above 25°C  
1.38  
-55 to +150  
W/°C  
°C  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
Maximum lead temperature for soldering purposes,  
1/8" from case for 5 seconds  
300  
°C  
Thermal Characteristics  
Symbol  
Parameter  
FQB7N65C  
0.75  
Units  
°C/W  
RθJC  
RθJA  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient  
62.5  
°C/W  
©2006 Fairchild Semiconductor Corporation  
FQB7N65C Rev. A  
1
www.fairchildsemi.com  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
Quantity  
FQB7N65C  
FQB7N65CTM  
D2-PAK  
330mm  
24mm  
800  
Electrical Characteristics  
T
= 25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min  
Typ Max Units  
Off Characteristics  
BVDSS  
Drain-Source Breakdown Voltage  
VGS = 0 V, ID = 250 µA  
650  
--  
--  
--  
V
BVDSS  
TJ  
/
Breakdown Voltage Temperature Coefficient ID = 250 µA, Referenced to 25°C  
--  
0.8  
V/°C  
IDSS  
Zero Gate Voltage Drain Current  
VDS = 650 V, VGS = 0 V  
VDS = 520 V, TC = 125°C  
VGS = 30 V, VDS = 0 V  
VGS = -30 V, VDS = 0 V  
--  
--  
--  
--  
--  
--  
--  
--  
1
µA  
µA  
nA  
nA  
10  
IGSSF  
IGSSR  
Gate-Body Leakage Current, Forward  
Gate-Body Leakage Current, Reverse  
100  
-100  
On Characteristics  
VGS(th)  
RDS(on)  
gFS  
Gate Threshold Voltage  
VDS = VGS, ID = 250 µA  
VGS = 10 V, ID = 3.5 A  
VDS = 40 V, ID =3.5 A  
2.0  
--  
--  
1.2  
8
4.0  
1.4  
--  
V
S
Static Drain-Source On-Resistance  
Forward Transconductance  
(Note 4)  
--  
Dynamic Characteristics  
Ciss  
Coss  
Crss  
Input Capacitance  
VDS = 25 V, VGS = 0 V,  
f = 1.0 MHz  
--  
--  
--  
955  
100  
12  
1245  
130  
16  
pF  
pF  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Switching Characteristics  
td(on) Turn-On Delay Time  
tr  
td(off)  
tf  
VDD = 325 V, ID = 7A,  
--  
--  
--  
--  
--  
--  
--  
ns  
ns  
20  
50  
90  
55  
28  
4.5  
12  
50  
RG = 25 Ω  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
110  
190  
120  
ns  
(Note 4, 5)  
ns  
Qg  
VDS = 520 V, ID = 7A,  
GS = 10 V  
nC  
nC  
nC  
36  
--  
V
Qgs  
Qgd  
(Note 4, 5)  
--  
Drain-Source Diode Characteristics and Maximum Ratings  
IS  
Maximum Continuous Drain-Source Diode Forward Current  
Maximum Pulsed Drain-Source Diode Forward Current  
--  
--  
--  
--  
--  
--  
--  
7
28  
1.4  
--  
A
A
ISM  
VSD  
trr  
Drain-Source Diode Forward Voltage  
Reverse Recovery Time  
VGS = 0 V, IS = 7 A  
--  
V
VGS = 0 V, IS = 7 A,  
400  
3.3  
ns  
dIF / dt = 100 A/µs  
(Note 4)  
Qrr  
Reverse Recovery Charge  
--  
µC  
NOTES:  
1. Repetitive Rating : Pulse width limited by maximum junction temperature  
2. L = 8mH, I = 7A, V = 50V, R = 25 Ω, Starting T = 25°C  
AS  
DD  
G
J
3. I 7A, di/dt 200A/µs, V BV Starting T = 25°C  
DSS, J  
SD  
DD  
4. Pulse Test : Pulse width 300µs, Duty cycle 2%  
5. Essentially independent of operating temperature  
2
www.fairchildsemi.com  
FQB7N65C Rev. A  
Typical Performance Characteristics  
Figure 1. On-Region Characteristics  
Figure 2. Transfer Characteristics  
VGS  
Top:  
15.0V  
10.0V  
8.0V  
7.0V  
6.0V  
5.5V  
1
10  
1
10  
Bottom: 5.0V  
150oC  
-55oC  
0
25oC  
10  
0
10  
Notes:  
1. 250µ s Pulse Test  
Notes :  
1. VDS = 40V  
2. T = 25℃  
C
2. 250µ s Pulse Test  
-1  
10  
-1  
10  
0
10  
1
10  
2
4
6
8
10  
VGS, Gate-Source Voltage [V]  
V , Drain-Source Voltage [V]  
DS  
Figure 3. On-Resistance Variation vs.  
Drain Current and Gate Voltage  
Figure 4. Body Diode Forward Voltage  
Variation vs. Source Current  
and Temperatue  
3.0  
2.5  
101  
VGS = 10V  
2.0  
100  
150  
25℃  
1.5  
VGS = 20V  
Notes :  
1. VGS = 0V  
2. 250µ s Pulse Test  
Note: T = 25℃  
J
-1  
1.0  
10  
0
5
10  
15  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
ID, Drain Current [A]  
VSD, Source-Drain voltage [V]  
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
2000  
12  
Ciss = Cgs + Cgd (Cds = shorted)  
C
oss = Cds + C  
gd  
C
rss = C  
gd  
10  
8
VDS = 130V  
VDS = 325V  
VDS = 520V  
1600  
1200  
800  
400  
0
C
iss  
6
C
oss  
Note;  
1. VGS = 0 V  
2. f =1MHz  
4
C
rss  
2
Note : ID = 7A  
0
-1  
0
10  
1
10  
10  
0
4
8
12  
16  
20  
24  
28  
VDS, Drain-Source Voltage [V]  
QG, Total Gate Charge [nC]  
3
www.fairchildsemi.com  
FQB7N65C Rev. A  
Typical Performance Characteristics (Continued)  
Figure 7. Breakdown Voltage Variation  
vs. Temperature  
Figure 8. On-Resistance Variation  
vs. Temperature  
1.2  
1.1  
1.0  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
0.9  
0.8  
Notes :  
1. VGS = 0 V  
2. ID= 250 µ A  
Notes :  
1. VGS = 10 V  
2. ID = 3.5 A  
-100  
-50  
0
50  
100  
150  
200  
-100  
-50  
0
50  
100  
150  
200  
T, Junction Temperature [oC]  
T, Junction Temperature [oC]  
J
J
Figure 9. Maximum Safe Operating Area  
Figure 10. Maximum Drain Current  
vs. Case Temperature  
102  
8
6
4
2
0
10 µs  
100 µs  
101  
100  
1ms  
10ms  
100ms  
Operation in This Area  
is Limited by R DS(on)  
DC  
10-1  
* Notes :  
1. TC = 25 o  
2. TJ = 150 o  
3. Single Pulse  
C
C
10-2  
100  
101  
102  
103  
25  
50  
75  
100  
125  
150  
TC, Case Temperature [oC]  
VDS, Drain-SourceVoltage[V]  
Figure 11. Transient Thermal Response Curve  
100  
D=0.5  
0.2  
0.1  
10-1  
0.05  
PDM  
0.02  
0.01  
t1  
t2  
* Notes :  
1. ZθJC(t) = 0.75 0C/W Max.  
2. Duty Factor, D=t1/t2  
10-2  
single pulse  
3. TJM - TC = PDM * Z? (t)  
JC  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
t1, Square Wave Pulse Duration [sec]  
4
www.fairchildsemi.com  
FQB7N65C Rev. A  
Gate Charge Test Circuit & Waveform  
Resistive Switching Test Circuit & Waveforms  
Unclamped Inductive Switching Test Circuit & Waveforms  
5
www.fairchildsemi.com  
FQB7N65C Rev. A  
Peak Diode Recovery dv/dt Test Circuit & Waveforms  
6
www.fairchildsemi.com  
FQB7N65C Rev. A  
Mechanical Dimensions  
D2-PAK  
4.50 ±0.20  
9.90 ±0.20  
+0.10  
–0.05  
1.30  
0.10 ±0.15  
2.40 ±0.20  
0.80 ±0.10  
1.27 ±0.10  
+0.10  
0.50  
–0.05  
2.54 TYP  
2.54 TYP  
10.00 ±0.20  
(8.00)  
(4.40)  
10.00 ±0.20  
(2XR0.45)  
0.80 ±0.10  
Dimensions in Millimeters  
7
www.fairchildsemi.com  
FQB7N65C Rev. A  
TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be  
an exhaustive list of all such trademarks.  
ACEx™  
FACT Quiet Series™  
GlobalOptoisolator™  
GTO™  
OCX™  
OCXPro™  
SILENT SWITCHER®  
SMART START™  
SPM™  
UniFET™  
UltraFET®  
VCX™  
ActiveArray™  
Bottomless™  
Build it Now™  
CoolFET™  
CROSSVOLT™  
DOME™  
OPTOLOGIC®  
OPTOPLANAR™  
PACMAN™  
POP™  
HiSeC™  
Stealth™  
Wire™  
I2C™  
SuperFET™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SyncFET™  
TCM™  
TinyBoost™  
TinyBuck™  
TinyPWM™  
TinyPower™  
TinyLogic®  
TINYOPTO™  
TruTranslation™  
UHC™  
i-Lo™  
ImpliedDisconnect™  
IntelliMAX™  
ISOPLANAR™  
LittleFET™  
MICROCOUPLER™  
MicroFET™  
MicroPak™  
MICROWIRE™  
MSX™  
MSXPro™  
Power247™  
PowerEdge™  
PowerSaver™  
PowerTrench®  
QFET®  
EcoSPARK™  
E2CMOS™  
EnSigna™  
FACT™  
FAST®  
FASTr™  
FPS™  
FRFET™  
QS™  
QT Optoelectronics™  
Quiet Series™  
RapidConfigure™  
RapidConnect™  
µSerDes™  
Across the board. Around the world.™  
The Power Franchise®  
ScalarPump™  
Programmable Active Droop™  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO  
IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF  
ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF  
OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE  
WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT  
THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or systems which,  
(a) are intended for surgical implant into the body, or (b) support  
or sustain life, or (c) whose failure to perform when properly used  
in accordance with instructions for use provided in the labeling,  
can be reasonably expected to result in significant injury to the  
user.  
2. A critical component is any component of a life support device  
or system whose failure to perform can be reasonably expected to  
cause the failure of the life support device or system, or to affect  
its safety or effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or In  
Design  
This datasheet contains the design specifications for  
product development. Specifications may change in  
any manner without notice.  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later date.  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
design.  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specifications. Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve design.  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductor.  
The datasheet is printed for reference information only.  
Rev. I20  
8
www.fairchildsemi.com  
FQB7N65C Rev. A  

相关型号:

FQB7N65CTM

650V N-Channel MOSFET
FAIRCHILD

FQB7N80

800V N-Channel MOSFET
FAIRCHILD

FQB7N80TM

Power Field-Effect Transistor, 6.6A I(D), 800V, 1.5ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, D2PAK-3
FAIRCHILD

FQB7P06

60V P-Channel MOSFET
FAIRCHILD

FQB7P06TM

Power Field-Effect Transistor, 7A I(D), 60V, 0.41ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, D2PAK-3
FAIRCHILD

FQB7P20

200V P-Channel MOSFET
FAIRCHILD

FQB7P20TM

200v P-Channel MOSFET
FAIRCHILD

FQB7P20TM

功率 MOSFET,P 沟道,QFET®,-200 V,-7.3 A,690 mΩ,D2PAK
ONSEMI

FQB7P20TM_F085

200V P-Channel MOSFET
FAIRCHILD

FQB85N06

60V N-Channel MOSFET
FAIRCHILD

FQB85N06TM

85A, 60V, 0.01ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263, D2PAK-3
ROCHESTER

FQB8N25

250V N-Channel MOSFET
FAIRCHILD