FQB9N30TM_技术文档

May 2000

TM

QFET

FQB9N30 / FQI9N30

300V N-Channel MOSFET

General Description

Features

These N-Channel enhancement mode power field effect

transistors are produced using Fairchild’s proprietary,

planar stripe, DMOS technology.

This advanced technology has been especially tailored to

minimize on-state resistance, provide superior switching

performance, and withstand high energy pulse in the

avalanche and commutation mode. These devices are well

suited for high efficiency switching DC/DC converters,

switch mode power supply.

•

9.0A, 300V, R

= 0.45Ω @V = 10 V

DS(on) GS

Low gate charge ( typical 17 nC)

Low Crss ( typical 16 pF)

Fast switching

100% avalanche tested

Improved dv/dt capability

D

!

D

"

! "

"

G !

G

S

D²-PAK

FQB Series

I²-PAK

FQI Series

G

D

S

!

S

Absolute Maximum Ratings

T = 25°C unless otherwise noted

C

Symbol

Parameter

FQB9N30 / FQI9N30

Units

V

I

Drain-Source Voltage

300

9.0

DSS

- Continuous (T = 25°C)

Drain Current

A

D

C

- Continuous (T = 100°C)

5.7

A

C

I

(Note 1)

Drain Current

- Pulsed

36

A

DM

V

E

I

Gate-Source Voltage

± 30

420

V

GSS

(Note 2)

(Note 1)

(Note 3)

Single Pulsed Avalanche Energy

Avalanche Current

mJ

A

AS

9.0

AR

E

Repetitive Avalanche Energy

Peak Diode Recovery dv/dt

9.8

mJ

V/ns

W

AR

dv/dt

4.5

Power Dissipation (T = 25°C) *

3.13

98

P

A

D

Power Dissipation (T = 25°C)

W

C

- Derate above 25°C

Operating and Storage Temperature Range

0.78

-55 to +150

W/°C

°C

T , T

J

STG

Maximum lead temperature for soldering purposes,

T

300

°C

L

1/8" from case for 5 seconds

Thermal Characteristics

Symbol

Parameter

Typ

--

Max

Units

°C/W

R

Thermal Resistance, Junction-to-Case

Thermal Resistance, Junction-to-Ambient *

Thermal Resistance, Junction-to-Ambient

1.28

40

θJC

θJA

--

62.5

* When mounted on the minimum pad size recommended (PCB Mount)

Rev. A, May 2000

Electrical Characteristics

T = 25°C unless otherwise noted

C

Symbol

Parameter

Test Conditions

Min

Typ

Max

Units

Off Characteristics

BV

V

= 0 V, I = 250 µA

GS D

Drain-Source Breakdown Voltage

300

--

V

DSS

∆BV

Breakdown Voltage Temperature

Coefficient

DSS

I

= 250 µA, Referenced to 25°C

0.28

V/°C

D

/

∆T

J

I

V

= 300 V, V = 0 V

--

1

µA

nA

DSS

DS

GS

Zero Gate Voltage Drain Current

= 240 V, T = 125°C

10

DS

GS

C

I

= 30 V, V = 0 V

Gate-Body Leakage Current, Forward

Gate-Body Leakage Current, Reverse

100

-100

GSSF

DS

I

= -30 V, V = 0 V

GSSR

DS

On Characteristics

V

= V , I = 250 µA

Gate Threshold Voltage

3.0

--

5.0

0.45

--

V

Ω

S

GS(th)

DS

GS

DS

GS

D

R

Static Drain-Source

On-Resistance

DS(on)

= 10 V, I = 4.5 A

0.35

4.9

D

g

= 50 V, I = 4.5 A

(Note 4)

Forward Transconductance

--

FS

D

Dynamic Characteristics

C

Input Capacitance

--

570

120

16

740

155

20

pF

iss

V

= 25 V, V = 0 V,

GS

DS

Output Capacitance

oss

rss

f = 1.0 MHz

Reverse Transfer Capacitance

Switching Characteristics

t

Turn-On Delay Time

Turn-On Rise Time

Turn-Off Delay Time

Turn-Off Fall Time

Total Gate Charge

Gate-Source Charge

Gate-Drain Charge

--

16

120

27

40

250

65

110

22

--

ns

d(on)

V

= 150 V, I = 9.0 A,

DD

D

r

R

= 25 Ω

G

ns

d(off)

f

(Note 4, 5)

48

ns

Q

17

nC

g

V

= 240 V, I = 9.0 A,

DS

D

3.9

9.2

= 10 V

gs

gd

GS

--

Drain-Source Diode Characteristics and Maximum Ratings

I

Maximum Continuous Drain-Source Diode Forward Current

--

9.0

36

1.5

--

A

S

I

Maximum Pulsed Drain-Source Diode Forward Current

SM

V

t

V

= 0 V, I = 9.0 A

Drain-Source Diode Forward Voltage

Reverse Recovery Time

--

V

SD

GS

S

= 0 V, I = 9.0 A,

170

1.4

ns

µC

rr

GS

S

(Note 4)

dI / dt = 100 A/µs

Q

Reverse Recovery Charge

--

F

rr

Notes:

1. Repetitive Rating : Pulse width limited by maximum junction temperature

2. L = 8.64mH, I = 9.0A, V = 50V, R = 25 Ω, Starting T = 25°C

AS

DD

G

J

3. I ≤ 9.0A, di/dt ≤ 200A/µs, V ≤ BV Starting T = 25°C

SD

DD

DSS, J

4. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2%

5. Essentially independent of operating temperature

Rev. A, May 2000

Typical Characteristics

V_GS

Top :

15.0 V

10.0 V

8.0 V

7.0 V

6.5 V

6.0 V

10¹

Bottom : 5.5 V

℃

150

10⁰

℃

25

※

Notes :

μ

℃

-55

※

Notes :

1. 250 s Pulse Test

1. V_DS= 50V

-1

10

℃

2. T_C= 25

μ

2. 250 s Pulse Test

-1

10

-1

10

10⁰

10¹

2

4

6

8

10

V_GS, Gate-Source Voltage [V]

V_DS, Drain-Source Voltage [V]

Figure 1. On-Region Characteristics

Figure 2. Transfer Characteristics

2.5

2.0

1.5

1.0

0.5

0.0

10¹

V_GS= 10V

V_GS= 20V

10⁰

※

Notes :

℃

25

150

1. V_GS= 0V

※

℃

Note : T = 25

J

μ

2. 250 s Pulse Test

-1

10

0

6

12

18

24

30

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

I_D, Drain Current [A]

V_SD, Source-Drain voltage [V]

Figure 3. On-Resistance Variation vs.

Drain Current and Gate Voltage

Figure 4. Body Diode Forward Voltage

Variation vs. Source Current

and Temperature

1200

1000

800

600

400

200

0

12

10

8

C

_iss= C_gs+ C_gd(C_ds= shorted)

_oss= C_ds+ C_gd

_rss= C_gd

C

V_DS= 60V

V_DS= 150V

V_DS= 240V

C

iss

C_oss

6

※

Notes :

4

1. V_GS= 0 V

2. f = 1 MHz

C

rss

2

※

Note : I_D= 9.0 A

15

0

-1

10

10⁰

10¹

0

3

6

9

12

18

Q_G, Total Gate Charge [nC]

V_DS, Drain-Source Voltage [V]

Figure 5. Capacitance Characteristics

Figure 6. Gate Charge Characteristics

Rev. A, May 2000

Typical Characteristics (Continued)

3.0

2.5

2.0

1.5

1.0

0.5

0.0

1.2

1.1

1.0

※Notes :

1. V_GS= 0 V

2. I_D= 250 μA

0.9

※

Notes :

1. V_GS= 10 V

2. I_D= 4.5 A

0.8

-100

-50

0

50

100

150

200

-100

-50

0

50

100

150

200

T_J, Junction Temperature [^oC]

Figure 7. Breakdown Voltage Variation

vs. Temperature

Figure 8. On-Resistance Variation

vs. Temperature

10

8

10²

10¹

10⁰

Operation in This Area

is Limited by R _DS(on)

100 µs

1 ms

10 ms

6

DC

4

※

Notes :

1. T_C= 25 ^o

2. T_J= 150 ^o

2

C

3. Single Pulse

-1

0

25

10

10⁰

10¹

10²

50

75

100

125

150

℃

T_C, Case Temperature [

]

V_DS, Drain-Source Voltage [V]

Figure 9. Maximum Safe Operating Area

Figure 10. Maximum Drain Current

vs. Case Temperature

1 0 ⁰

D = 0 .5

0 .2

0 .1

※

N o te s

1 . Z _θ_{J C}(t)

2 . D u ty F a c to r, D = t₁/t₂

:

℃

/W M a x .

=

1 .2 8

3 . T _{J M}

-

T _C

=

P _D

* Z _θ_{J C}(t)

M

1 0^-1

0 .0 5

P_DM

0 .0 2

t₁

0 .0 1

t₂

s in g le p u ls e

1 0^-2

1 0 ^-5

1 0^-4

1 0 ^-3

1 0 ^-2

1 0 ^-1

1 0 ⁰

1 0 ¹

t₁, S q u a re W a v e P u ls e D u ra tio n [s e c ]

Figure 11. Transient Thermal Response Curve

Rev. A, May 2000

Gate Charge Test Circuit & Waveform

V_GS

Same Type

50KΩ

as DUT

Q_g

12V

200nF

10V

300nF

V_DS

V_GS

Q_gs

Q_gd

DUT

3mA

Charge

Resistive Switching Test Circuit & Waveforms

R_L

V_DS

90%

V_DS

V_DD

V_GS

R_G

10%

V_GS

DUT

10V

t_d(on)

t_r

t_d(off)

t_f

t _on

t _off

Unclamped Inductive Switching Test Circuit & Waveforms

BV_DSS

--------------------

BV_DSS- V_DD

L

1

2

----

E_AS

=

L I_AS

V_DS

I _D

BV_DSS

I_AS

R_G

V_DD

I_D(t)

V_DD

V_DS(t)

DUT

10V

t _p

Time

Rev. A, May 2000

Peak Diode Recovery dv/dt Test Circuit & Waveforms

+

DUT

V_DS

_

I _SD

L

Driver

R_G

Same Type

as DUT

V_DD

V_GS

• dv/dt controlled by R_G

• I_SDcontrolled by pulse period

Gate Pulse Width

--------------------------

V_GS

D =

Gate Pulse Period

10V

( Driver )

I_FM, Body Diode Forward Current

I _SD

di/dt

( DUT )

I_RM

Body Diode Reverse Current

Body Diode Recovery dv/dt

V_SD

V_DS

( DUT )

V_DD

Body Diode

Forward Voltage Drop

Rev. A, May 2000

Package Dimensions

D²PAK

4.50 ±0.20

9.90 ±0.20

+0.10

–0.05

1.30

0.10 ±0.15

2.40 ±0.20

0.80 ±0.10

1.27 ±0.10

+0.10

0.50

–0.05

2.54 TYP

10.00 ±0.20

(8.00)

(4.40)

10.00 ±0.20

(2XR0.45)

0.80 ±0.10

Rev. A, May 2000

Package Dimensions ^(Continued)

I²PAK

4.50 ±0.20

9.90 ±0.20

+0.10

–0.05

1.30

1.27 ±0.10

1.47 ±0.10

0.80 ±0.10

+0.10

–0.05

0.50

2.40 ±0.20

2.54 TYP

10.00 ±0.20

Rev. A, May 2000

TRADEMARKS

The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is

not intended to be an exhaustive list of all such trademarks.

QFET™

QS™

QT Optoelectronics™

VCX™

FASTr™

ACEx™

GlobalOptoisolator™

GTO™

HiSeC™

Bottomless™

CoolFET™

CROSSVOLT™

DOME™

E²CMOS^TM

EnSigna^TM

FACT™

Quiet Series™

SuperSOT™-3

SuperSOT™-6

SuperSOT™-8

SyncFET™

TinyLogic™

UHC™

ISOPLANAR™

MICROWIRE™

OPTOLOGIC™

OPTOPLANAR™

POP™

FACT Quiet Series™

FAST^®

PowerTrench^®

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER

NOTICE TOANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD

DOES NOTASSUMEANY LIABILITYARISING OUT OF THEAPPLICATION OR USE OFANY PRODUCT

OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT

RIGHTS, NOR THE RIGHTS OF OTHERS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

DEVICES OR SYSTEMS WITHOUTTHE EXPRESS WRITTENAPPROVALOF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:

1. Life support devices or systems are devices or

systems which, (a) are intended for surgical implant into

the body, or (b) support or sustain life, or (c) whose

failure to perform when properly used in accordance

with instructions for use provided in the labeling, can be

reasonably expected to result in significant injury to the

user.

2. A critical component is any component of a life

support device or system whose failure to perform can

be reasonably expected to cause the failure of the life

support device or system, or to affect its safety or

effectiveness.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification

Product Status

Definition

Advance Information

Formative or

In Design

This datasheet contains the design specifications for

product development. Specifications may change in

any manner without notice.

Preliminary

First Production

This datasheet contains preliminary data, and

supplementary data will be published at a later date.

Fairchild Semiconductor reserves the right to make

changes at any time without notice in order to improve

design.

No Identification Needed

Full Production

This datasheet contains final specifications. Fairchild

Semiconductor reserves the right to make changes at

any time without notice in order to improve design.

Obsolete

Not In Production

This datasheet contains specifications on a product

that has been discontinued by Fairchild semiconductor.

The datasheet is printed for reference information only.

Rev. F1

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FQB9N30


型号：	FQB9N30TM
厂家：	FAIRCHILD SEMICONDUCTOR
描述：	Power Field-Effect Transistor, 9A I(D), 300V, 0.45ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, D2PAK-3 开关脉冲晶体管
文件：	总11页 (文件大小：677K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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