FSA2567UMX [FAIRCHILD]
Low-Power, Dual SIM Card Analog Switch; 低功耗，双卡双待模拟开关
| 型号： | FSA2567UMX |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | Low-Power, Dual SIM Card Analog Switch |
| 文件： | 总2页 (文件大小：384K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Click to see this datasheet
in Simplified Chinese!
August 2007
FSA2567 — Low-Power, Dual SIM Card Analog Switch
Features
Description
The FSA2567 is a bi-directional, low-power, dual
double-pole, double-throw (4PDT) analog switch
targeted at dual SIM card multiplexing. It is optimized
for switching the WLAN-SIM data and control signals
and dedicates one channel as a supply-source switch.
Low On Capacitance for Data Path: 10pF Typical
Low On Resistance for Data Path: 6Ω Typical
Low On Resistance for Supply Path: 0.4Ω Typical
Low Power Consumption: 1μA Maximum
The FSA2567 is compatible with the requirements of
SIM cards and features a low on capacitance (CON) of
10pF to ensure high-speed data transfer. The VSIM
switch path has a low RON characteristic to ensure
minimal voltage drop in the dual SIM card supply paths.
-15μA Maximum ICCT Over Expanded Voltage
Range (VIN=1.8V, VCC=4.3V)
Wide -3db Bandwidth: > 160MHz
Packaged in:
The FSA2567 contains special circuitry that minimizes
current consumption when the control voltage applied to
the SEL pin is lower than the supply voltage (VCC). This
feature is especially valuable in ultra-portable
applications, such as cell phones; allowing direct
interface with the general-purpose I/Os of the baseband
processor. Other applications include switching and
connector sharing in portable cell phones, PDAs, digital
cameras, printers, and notebook computers.
-Pb-free 16-Lead MLP
-Pb-free 16-Lead UMLP (1.8 x 2.6mm)
8kV ESD Rating, >16kV Power/GND ESD Rating
Applications
Cell phone, PDA, Digital Camera, and Notebook
LCD Monitor, TV, and Set-Top Box
IMPORTANT NOTE:
For additional performance information, please contact
analogswitch@fairchildsemi.com.
Ordering Information
Operating
Temperature Range
Part Number Top Mark Pb-Free
Package
16-Lead, Molded Leadless Package (MLP)
Quad, JEDEC MO-220, 3mm Square
FSA2567MPX
FSA2567
GX
-40 to +85°C
-40 to +85°C
FSA2567UMX
(Preliminary)
16-Lead, Quad, Ultrathin Molded Leadless
Package (UMLP), 1.8 x 2.6mm
1VSIM
V
SIM
2VSIM
1RST
RST
CLK
2RST
1CLK
2CLK
1DAT
DAT
Sel
2DAT
Figure 1. Analog Symbol
© 2007 Fairchild Semiconductor Corporation
FSA2567 Rev. 1.0.0
www.fairchildsemi.com
© 2007 Fairchild Semiconductor Corporation
FSA2567 Rev. 1.0.0
www.fairchildsemi.com
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