FSTU3125MX [FAIRCHILD]

Bus Switch ; 总线开关\n
FSTU3125MX
型号: FSTU3125MX
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Bus Switch
总线开关\n

总线驱动器 总线收发器 开关 逻辑集成电路 光电二极管
文件: 总7页 (文件大小:139K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
June 2001  
Revised August 2001  
FSTU3125  
4-Bit Bus Switch with 2V Undershoot Protection  
General Description  
Features  
The Fairchild Switch FSTU3125 provides four high-speed  
CMOS TTL-compatible bus switches. The low On Resis-  
tance of the switch allows inputs to be connected to out-  
puts without adding propagation delay or generating  
additional ground bounce noise. The A and B Ports are  
protected against undershoot to support an extended  
range to 2.0V below ground. Fairchild’s integrated Under-  
shoot Hardened Circuit (UHC ) senses undershoot at the  
I/O and responds by preventing voltage differentials from  
developing and turning the switch on.  
Undershoot hardened to 2V (A and B Ports)  
4switch connection between two ports  
Minimal propagation delay through the switch  
Low lCC  
Zero bounce in flow-through mode  
Control inputs compatible with TTL level  
See application notes AN-5008 and AN-5021 for details  
on undershoot  
The device is organized as four 1-bit switches with sepa-  
rate OE inputs. When OE is LOW, the switch is ON and  
Port A is connected to Port B. When OE is HIGH, the  
switch is OPEN and  
between the two ports.  
a high-impedance state exists  
Ordering Code:  
Order Number  
FSTU3125M  
Package Number  
Package Description  
M14A  
MQA16  
MTC14  
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
16-Lead Quarter Size Outline Package (QSOP), JEDEC MO-137, 0.150" Wide  
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
FSTU3125QSC  
FSTU3125MTC  
Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Connection Diagrams  
Pin Descriptions  
Pin Name  
Description  
Pin Assignment for SOIC and TSSOP  
OE1, OE2, OE3, OE4 Bus Switch Enables  
1A, 2A, 3A, 4A  
1B, 2B, 3B, 4B  
NC  
Bus A  
Bus B  
Not Connected  
Truth Table  
Inputs  
Inputs/Outputs  
OE  
L
A,B  
A = B  
Z
Pin Assignment for QSOP  
H
© 2001 Fairchild Semiconductor Corporation  
DS500449  
www.fairchildsemi.com  
Logic Diagram  
www.fairchildsemi.com  
2
Absolute Maximum Ratings(Note 1)  
Recommended Operating  
Conditions (Note 3)  
Supply Voltage (VCC  
)
0.5V to +7.0V  
2.0V to +7.0V  
0.5V to +7.0V  
50 mA  
DC Switch Voltage (VS)  
Power Supply Operating (VCC  
Input Voltage (VIN  
Output Voltage (VOUT  
)
4.0V to 5.5V  
0V to 5.5V  
0V to 5.5V  
DC Input Voltage (VIN)(Note 2)  
DC Input Diode Current (lIK) VIN < 0V  
DC Output (IOUT) Sink Current  
)
)
128 mA  
Input Rise and Fall Time (tr, tf)  
Switch Control Input  
DC VCC/GND Current (ICC/IGND  
)
+/100 mA  
0 ns/V to 5 ns/V  
0 ns/V to DC  
Storage Temperature Range (TSTG  
)
65°C to +150 °C  
Switch I/O  
Free Air Operating Temperature (TA)  
40 °C to +85 °C  
Note 1: The Absolute Maximum Ratingsare those values beyond which  
the safety of the device cannot be guaranteed. The device should not be  
operated at these limits. The parametric values defined in the Electrical  
Characteristics tables are not guaranteed at the absolute maximum rating.  
The Recommended Operating Conditionstable will define the conditions  
for actual device operation.  
Note 2: The input and output negative voltage ratings may be exceeded if  
the input and output diode current ratings are observed.  
Note 3: Unused control inputs must be held HIGH or LOW. They may not  
float.  
DC Electrical Characteristics  
T
A = −40 °C to +85 °C  
VCC  
(V)  
Symbol  
Parameter  
Units  
Conditions  
Min  
Typ  
Max  
(Note 4)  
VIK  
Clamp Diode Voltage  
4.5  
4.05.5  
4.05.5  
5.5  
1.2  
V
V
V
IIN = −18 mA  
VIH  
VIL  
II  
HIGH Level Input Voltage  
LOW Level Input Voltage  
Input Leakage Current  
2.0  
0.8  
±1.0  
10  
±1.0  
7
0 VIN 5.5V  
IN = 5.5V  
0 A, B VCC  
µA  
0
V
IOZ  
OFF-STATE Leakage Current  
Switch On Resistance  
(Note 5)  
5.5  
µA  
RON  
4.5  
4
4
VIN = 0V, IIN = 64 mA  
VIN = 0V, IIN = 30 mA  
VIN = 2.4V, IIN = 15 mA  
VIN = 2.4V, IIN = 15 mA  
VIN = VCC or GND,  
4.5  
7
4.5  
8
15  
20  
3
4.0  
11  
ICC  
Quiescent Supply Current  
Increase in ICC per Input  
Voltage Undershoot  
5.5  
µA  
IOUT = 0  
ICC  
5.5  
5.5  
2.5  
mA  
V
One input at 3.4V.  
Other inputs at VCC or GND  
0.0 mA IIN ≥ −50 mA  
OE = 5.5V  
VIKU  
2.0  
Note 4: Typical values are at VCC = 5.0V and TA = +25°C  
Note 5: Measured by the voltage drop between A and B pins at the indicated current through the switch. On Resistance is determined by the lower of the  
voltages on the two (A or B) pins.  
3
www.fairchildsemi.com  
AC Electrical Characteristics  
T
A = −40 °C to +85 °C,  
C
L = 50pF, RU = RD = 500Ω  
Figure  
Number  
Symbol  
Parameter  
Units  
Conditions  
V
CC = 4.5 – 5.5V VCC = 4.0V  
Min Max  
Min  
Max  
tPHL, tPLH  
tPZH, tPZL  
Propagation Delay Bus to Bus (Note 6)  
Output Enable Time  
0.25  
0.25  
ns  
ns  
VI = OPEN  
Figures  
2, 3  
1.0  
1.5  
6.1  
6.4  
6.0  
VI = 7V for tPZL  
Figures  
2, 3  
VI = OPEN for tPZH  
VI = 7V for tPLZ  
tPHZ, tPLZ  
Output Disable Time  
6.6  
ns  
Figures  
2, 3  
VI = OPEN for tPHZ  
Note 6: This parameter is guaranteed by design but is not tested. The bus switch contributes no propagation delay other than the RC delay of the typical On  
Resistance of the switch and the 50pF load capacitance, when driven by an ideal voltage source (zero output impedance).  
Capacitance (Note 7)  
Symbol  
CIN  
CI/O  
Parameter  
Typ  
Max  
Units  
Conditions  
CC = 5.0V  
VCC, OE = 5.0V  
Control Pin Input Capacitance  
3
pF  
V
Input/Output Capacitance  
5
pF  
Note 7: TA = +25°C, f = 1 MHz, Capacitance is characterized but not tested.  
Undershoot Characteristic (Note 8)  
Symbol  
Parameter  
Min  
Typ  
OH 0.3  
Max  
Units  
Conditions  
VOUTU  
Output Voltage During Undershoot  
2.5  
V
V
Figure 1  
Note 8: This test is intended to characterize the devices protective capabilities by maintaining output signal integrity during an input transient voltage  
undershoot event.  
FIGURE 1.  
Device Test Conditions  
Transient  
Input Voltage (V ) Waveform  
Parameter  
VIN  
Value  
See Waveform  
100K  
Units  
IN  
V
V
V
R1 - R2  
VTRI  
11.0  
VCC  
5.5  
www.fairchildsemi.com  
4
AC Loading and Waveforms  
Note: Input driven by 50 source terminated in 50 Ω  
Note: CL includes load and stray capacitance  
Note: Input PRR = 1.0 MHz, tW = 500ns  
FIGURE 2. AC Test Circuit  
FIGURE 3. AC Waveforms  
5
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Physical Dimensions inches (millimeters) unless otherwise noted  
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
Package Number M14A  
16-Lead Quarter Size Outline Package (QSOP), JEDEC MO-137, 0.150" Wide  
Package Number MQA16  
www.fairchildsemi.com  
6
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
Package Number MTC14  
Technology Description  
The Fairchild Switch family derives from and embodies Fairchilds proven switch technology used for several years in its  
74LVX3L384 (FST3384) bus switch product.  
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and  
Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
7
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