FSUSB42UMX_12 [FAIRCHILD]

Low-Power, Two-Port, Hi-Speed, USB2.0 (480Mbps) UART Switch;
FSUSB42UMX_12
型号: FSUSB42UMX_12
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Low-Power, Two-Port, Hi-Speed, USB2.0 (480Mbps) UART Switch

文件: 总10页 (文件大小:723K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Click here for this datasheet  
translated into Chinese!  
February 2012  
FSUSB42 — Low-Power, Two-Port, Hi-Speed,  
USB2.0 (480Mbps) UART Switch  
Description  
Features  
The FSUSB42 is a bi-directional, low-power, two-port,  
Hi-Speed, USB2.0 switch. Configured as a double-pole,  
double-throw switch (DPDT) switch, it is optimized for  
switching between two Hi-Speed (480Mbps) sources or  
a Hi-Speed and Full-Speed (12Mbps) source.  
.
.
.
Low On Capacitance: 3.7pF Typical  
Low On Resistance: 3.9Typical  
Low Power Consumption: 1μA Maximum  
-15μA Maximum ICCT over an Expanded Voltage  
The FSUSB42 is compatible with the requirements of  
USB2.0 and features an extremely low on capacitance  
(CON) of 3.7pF. The wide bandwidth of this device  
(720MHz) exceeds the bandwidth needed to pass the  
third harmonic, resulting in signals with minimum edge  
and phase distortion. Superior channel-to-channel  
crosstalk also minimizes interference.  
Range (VIN=1.8V, VCC=4.4V)  
.
.
Wide -3db Bandwidth: > 720MHz  
Packaged in:  
-10-Lead UMLP (1.4 x 1.8mm)  
-10-Lead MSOP  
.
.
8kV ESD Rating, >16kV Power/GND ESD Rating  
Over-Voltage Tolerance (OVT) on all USB Ports  
Up to 5.25V without External Components  
The FSUSB42 contains special circuitry on the switch  
I/O pins for applications where the VCC supply is  
powered-off (VCC=0), which allows the device to  
withstand an over-voltage condition. This device is  
designed to minimize current consumption even when  
the control voltage applied to the SEL pin is lower than  
the supply voltage (VCC). This feature is especially  
valuable to ultra-portable applications, such as cell  
phones, allowing for direct interface with the general-  
purpose I/Os of the baseband processor. Other  
applications include switching and connector sharing in  
portable cell phones, PDAs, digital cameras, printers,  
and notebook computers.  
Applications  
.
.
Cell phone, PDA, Digital Camera, and Notebook  
LCD Monitor, TV, and Set-Top Box  
IMPORTANT NOTE:  
For additional performance information, please contact  
analogswitch@fairchildsemi.com.  
Ordering Information  
Operating Temperature  
Part Number Top Mark  
Range  
Package  
10-Lead, Quad, Ultrathin Molded Leadless Package  
(UMLP), 1.4 x 1.8mm  
FSUSB42UMX  
FSUSB42MUX  
HE  
-40 to +85°C  
-40 to +85°C  
10-Lead, Molded Small Outline Package (MSOP)  
JEDEC MO-187, 3.0mm Wide  
FSUSB42  
MicroPak™ is a trademark of Fairchild Semiconductor Corporation.  
HSD1+  
HSD2+  
D+  
D-  
HSD1-  
HSD2-  
Sel  
Control  
/OE  
Figure 1. Analog Symbol  
© 2007 Fairchild Semiconductor Corporation  
FSUSB42 • Rev. 1.1.5  
www.fairchildsemi.com  
Pin Assignments  
V
/OE  
CC  
10  
9
1
2
3
4
5
D- D+  
Sel  
HSD2+  
HSD2-  
HSD1+  
HSD1-  
2
1
GND  
3
4
10 Sel  
D+  
8
9
HSD1-  
Vcc  
5
8
/OE  
HSD1+  
6
7
D-  
7
HSD2- HSD2+  
GND  
6
Figure 2. Pin Assignment 10L UMLP  
(Top Through View)  
Figure 3. Pin Assignment 10L MSOP  
(Top Through View)  
Pin Definitions  
UMLP Pin#  
MSOP Pin#  
Name  
D+  
Description  
1
2
3
4
USB Data Bus  
D-  
USB Data Bus  
3
5
GND  
HSD1-  
HSD1+  
HSD2-  
HSD2+  
/OE  
Ground  
4
6
Multiplexed Source Inputs (UART / USB)  
Multiplexed Source Inputs (UART / USB)  
Multiplexed Source Inputs (USB Only)  
Multiplexed Source Inputs (USB Only)  
Switch Enable  
5
7
6
8
7
9
8
10  
1
9
VCC  
Supply Voltage  
10  
2
Sel  
Switch Select  
Truth Table  
Sel  
X
/OE  
HIGH  
LOW  
LOW  
Function  
Disconnect  
LOW  
HIGH  
D+, D-=HSD1+, HSD1-  
D+, D-=HSD2+, HSD2-  
© 2007 Fairchild Semiconductor Corporation  
FSUSB42 • Rev. 1.1.5  
www.fairchildsemi.com  
2
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
VCC  
Parameter  
Min.  
-0.5  
-0.5  
-0.50  
-50  
Max.  
5.6  
Unit  
V
Supply Voltage  
VCNTRL  
VSW  
DC Input Voltage (S, /OE)(1)  
DC Switch I/O Voltage(1)  
VCC  
V
5.25  
V
IIK  
DC Input Diode Current  
mA  
mA  
°C  
IOUT  
DC Output Current  
100  
+150  
1
TSTG  
MSL  
Storage Temperature  
-65  
Moisture Sensitivity Level (JEDEC J-STD-020A)  
Level  
All Pins  
7
8
I/O to GND  
Power to GND  
D+/D-  
Human Body Model, JEDEC: JESD22-A114  
16  
ESD  
kV  
9
15  
8
Air Discharge  
Contact  
IEC 61000-4-2 System on USB Connector  
Pins D+ & D-  
2
Charged Device Model, JEDEC: JESD22-C101  
Note:  
1. The input and output negative ratings may be exceeded if the input and output diode current ratings are observed.  
Recommended Operating Conditions  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended  
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not  
recommend exceeding them or designing to Absolute Maximum Ratings.  
Symbol  
Parameter  
Min.  
3.0  
0
Max.  
4.4  
Unit  
V
VCC  
Supply Voltage  
(2)  
VCNTRL  
Control Input Voltage (S, /OE)  
Switch I/O Voltage  
VCC  
4.5  
V
VSW  
TA  
-0.5  
-40  
V
Operating Temperature  
+85  
°C  
Note:  
2. The control input must be held HIGH or LOW and it must not float.  
© 2007 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FSUSB42 • Rev. 1.1.5  
3
DC Electrical Characteristics  
All typical value are at TA=25°C unless otherwise specified.  
TA=- 40°C to +85°C  
Symbol  
VIK  
Parameter  
Clamp Diode Voltage  
Input Voltage High  
Condition  
VCC (V)  
Unit  
Min. Typ. Max.  
IIN=-18mA  
3.0  
3.0 to 3.6  
4.3  
-1.2  
V
V
1.3  
1.7  
0.5  
0.7  
VIH  
V
3.0 to 3.6  
4.3  
V
VIL  
Input Voltage Low  
V
IIN  
Control Input Leakage  
Off State Leakage  
VSW=0 to VCC  
0 to 4.3  
-1  
-2  
1
2
µA  
0 Dn, HSD1n, HSD2n  
3.6V  
IOZ  
4.3  
0
µA  
µA  
  
Power-Off Leakage Current  
(All I/O Ports)  
VSW=0V to 4.3V, VCC=0V  
Figure 5  
IOFF  
RON  
-2  
2
VSW=0.4V, ION=-8mA  
Figure 4,  
HS Switch On Resistance(3)  
3.0  
3.9  
6.5  
(4)  
RON  
HS Delta RON  
VSW=0.4V, ION=-8mA  
VCNTRL=0 or VCC, IOUT=0  
VCNTRL=2.6V, VCC=4.3V  
VCNTRL=1.8V, VCC=4.3V  
3.0  
4.3  
4.3  
4.3  
0.65  
ICC  
Quiescent Supply Current  
1
µA  
µA  
µA  
10  
15  
Increase in ICC Current per  
Control Voltage and VCC  
ICCT  
Notes:  
3. Measured by the voltage drop between HSDn and Dn pins at the indicated current through the switch.  
On resistance is determined by the lower of the voltage on the two (HSDn or Dn ports).  
4. Guaranteed by characterization.  
© 2007 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FSUSB42 • Rev. 1.1.5  
4
AC Electrical Characteristics  
All typical value are for VCC=3.3V at TA=25°C unless otherwise specified.  
TA=- 40°C to +85°C  
Min. Typ. Max.  
Symbol  
Parameter  
Condition  
VCC (V)  
Unit  
RL=50, CL=5pF  
SW=0.8V  
Figure 6, Figure 7  
Turn-On Time  
S, /OE to Output  
tON  
V
3.0 to 3.6  
13  
30  
25  
ns  
RL=50, CL=5pF  
Turn-Off Time  
S, /OE to Output  
tOFF  
VSW=0.8V  
3.0 to 3.6  
3.3  
12  
ns  
ns  
ns  
Figure 6, Figure 7  
CL=5 pF, RL=50Ω  
Figure 6, Figure 8  
tPD  
Propagation Delay(5)  
Break-Before-Make  
Off Isolation  
0.25  
RL=50, CL=5pF  
VSW1=VSW2=0.8V  
Figure 10  
tBBM  
3.0 to 3.6  
2.0  
6.5  
RL=50, f=240MHz  
Figure 12  
OIRR  
3.0 to 3.6  
3.0 to 3.6  
-30  
-45  
720  
550  
dB  
dB  
Non-Adjacent Channel  
Crosstalk  
RL=50, f=240MHz  
Figure 13  
Xtalk  
RL=50, CL=0pF  
Figure 11  
MHz  
MHz  
BW  
-3db Bandwidth  
3.0 to 3.6  
RL=50, CL=5pF  
Figure 11  
Note:  
5. Guaranteed by characterization.  
USB Hi-Speed-Related AC Electrical Characteristics  
TA=- 40ºC to +85ºC  
Min. Typ. Max.  
Symbol  
Parameter  
Condition  
VCC (V)  
Unit  
Skew of Opposite Transitions CL=5pF, RL=50Ω  
tSK(P)  
3.0 to 3.6  
20  
ps  
of the Same Output(6)  
Figure 9  
RL=50, CL=5pf,  
tR=tF=500ps (10-90%) at  
480Mbps  
tJ  
Total Jitter(6)  
3.0 to 3.6  
200  
ps  
(PRBS=215 – 1)  
Note:  
6. Guaranteed by characterization.  
Capacitance  
TA=- 40°C to +85°C  
Symbol  
Parameter  
Condition  
Unit  
Min.  
Typ. Max.  
CIN  
Control Pin Input Capacitance  
D+/D- On Capacitance  
VCC=0V  
1.5  
VCC=3.3V, /OE=0V, f=240MHz  
Figure 15  
CON  
3.7  
2.0  
pF  
VCC and /OE=3.3V  
Figure 14  
COFF  
D1n, D2n Off Capacitance  
© 2007 Fairchild Semiconductor Corporation  
FSUSB42 • Rev. 1.1.5  
www.fairchildsemi.com  
5
Test Diagrams  
VON  
IDn(OFF)  
NC  
A
HSD  
n
V
Dn  
SW  
V
Select  
SW  
GND  
ION  
GND  
V
Sel= 0 orVcc  
Select  
GND  
**Each switch port is tested separately  
V
Sel= 0 orVcc  
R
ON = VON / ION  
Figure 4. On Resistance  
Figure 5. Off Leakage  
HSD  
n
tRISE= 2.5ns  
tFALL = 2.5ns  
Dn  
C
V
SW  
V
CC  
VOUT  
90%  
CC /2  
90%  
CC /2  
R
R
GND  
L
L
S
InputV/OE, VSel  
V
V
GND  
10%  
GND  
10%  
90%  
V
VOH  
Sel  
90%  
tON  
GND  
Output- VOUT  
RL , R , and CL are functions of the application  
VOL  
S
tOFF  
environment (see AC Tables for specific values)  
CL includes test fixture and stray capacitance.  
Figure 6. AC Test Circuit Load  
Figure 7. Turn-On / Turn-Off Waveforms  
tRISE  
tFALL  
= 500ps  
= 500ps  
+400mV  
-400mV  
400mV  
90%  
0V  
90%  
50%  
50%  
Input  
0V  
10%  
10%  
tPLH  
tPHL  
VOH  
Output  
50%  
50%  
Output  
VOL  
tPHL  
tPLH  
Figure 8. Propagation Delay (tRtF – 500ps)  
Figure 9. Intra-Pair Skew Test tSK(P)  
© 2007 Fairchild Semiconductor Corporation  
FSUSB42 • Rev. 1.1.5  
www.fairchildsemi.com  
6
Test Diagrams (Continued)  
tRISE= 2.5ns  
Vcc  
Input - VSel  
HSD  
90%  
Vcc/2  
n
Dn  
C
V
SW1  
10%  
0V  
VOUT  
GND  
L
V
R
L
SW2  
VOUT  
GND  
0.9*Vout  
GND  
0.9*Vout  
R
S
tBBM  
V
Sel  
RL , RS, and CL are functions of the application  
environment (see AC Tables for specific values)  
CL includes test fixture and stray capacitance.  
GND  
Figure 10. Break-Before-Make Interval Timing  
Network Analyzer  
RS  
Network Analyzer  
R
S
VIN  
V
IN  
V
GND  
V
GND  
S
R
S
T
GND  
OUT  
GND  
VOUT  
V
GND  
V
Sel  
Sel  
V
GND  
GND  
GND  
R
GND  
T
RT  
RS and RT are functions of the application  
environment (see AC Tables for specific values).  
Off isolation = 20 Log (VOUT / VIN  
GND  
GND  
RS and RT are functions of the application  
)
environment (see AC Tables for specific values).  
Figure 11. Bandwidth  
Figure 12. Channel Off Isolation  
Network Analyzer  
NC  
R
S
V
IN  
V
GND  
S
GND  
V
Sel  
GND  
R
T
GND  
V
OUT  
GND  
R
T
RS and RT are functions of the application environment  
(see AC Tables for specific values).  
GND  
Crosstalk = 20 Log (VOUT / VIN)  
Figure 13. Non-Adjacent Channel-to-Channel Crosstalk  
HSD  
HSD  
n
Capacitance  
Meter  
n
S
S
V
Capacitance  
Meter  
V
= 0 or V  
cc  
Sel  
= 0 or V  
cc  
Sel  
HSD  
HSD  
n
n
Figure 14. Channel Off Capacitance  
Figure 15. Channel On Capacitance  
© 2007 Fairchild Semiconductor Corporation  
FSUSB42 • Rev. 1.1.5  
www.fairchildsemi.com  
7
Physical Dimensions  
(9X)  
0.563  
1.70  
0.15  
C
1.40  
A
B
0.663  
2X  
1
2.10  
1.80  
PIN#1 IDENT  
0.40  
0.15  
C
0.225  
(10X)  
TOP VIEW  
2X  
RECOMMENDED  
LAND PATTERN  
0.55 MAX.  
0.152  
0.10 C  
9X  
0.45  
1.45  
0.08  
C
0.55  
0.40  
SEATING  
PLANE  
C
0.05  
SIDE VIEW  
1.85  
0.35  
(9X)  
0.45  
0.225  
(10X)  
3
OPTIONAL MINIMIAL  
TOE LAND PATTERN  
0.40  
6
DETAIL A  
1
NOTES:  
PIN#1 IDENT  
A. PACKAGE DOES NOT FULLY CONFORM TO  
0.15  
0.25  
10  
JEDEC STANDARD.  
(10X)  
B. DIMENSIONS ARE IN MILLIMETERS.  
C. DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 1994.  
0.10  
0.05  
C A B  
C
BOTTOM VIEW  
D. LAND PATTERN RECOMMENDATION IS  
BASED ON FSC DESIGN ONLY.  
E. DRAWING FILENAME: MKT-UMLP10Arev3.  
0.55  
0.45  
0.10  
0.10  
0.10  
DETAIL A  
SCALE : 2X  
PACKAGE  
EDGE  
LEAD  
LEAD  
OPTION 2  
SCALE : 2X  
OPTION 1  
SCALE : 2X  
Figure 16. 10-Lead, Ultrathin Molded Leadless Package (UMLP)  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,  
specifically the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
© 2007 Fairchild Semiconductor Corporation  
FSUSB42 • Rev. 1.1.5  
www.fairchildsemi.com  
8
Physical Dimensions (Continued)  
Figure 17. 10-Lead, Molded Small Outline Package (MSOP)  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,  
specifically the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
© 2007 Fairchild Semiconductor Corporation  
FSUSB42 • Rev. 1.1.5  
www.fairchildsemi.com  
9
© 2007 Fairchild Semiconductor Corporation  
FSUSB42 • Rev. 1.1.5  
www.fairchildsemi.com  
10  

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