H11N1.SD [FAIRCHILD]
Logic IC Output Optocoupler, 1-Element, 5300V Isolation, DIP-6;
| 型号： | H11N1.SD |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | Logic IC Output Optocoupler, 1-Element, 5300V Isolation, DIP-6 光电 输出元件 |
| 文件： | 总9页 (文件大小：524K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
H11N3-M
PACKAGE
SCHEMATIC
1
2
6 VCC
ANODE
6
6
CATHODE
5 GND
1
1
VO
4
3
6
1
DESCRIPTION
Truth Table
The H11NX-M series has a high speed integrated circuit detector optically
coupled to an AlGaAs infrared emitting diode. The output incorporates a
Schmitt trigger, which provides hysteresis for noise immunity and pulse s
haping. The detector circuit is optimized for simplicity of operation and utilizes
an open collector output for maximum application flexibility.
Input
Output
H
L
L
H
FEATURES
•
•
•
•
•
•
•
•
High data rate, 5 MHz typical (NRZ)
Free from latch up and oscilliation throughout voltage and temperature ranges.
Microprocessor compatible drive
Logic compatible output sinks 16 mA at 0.5 V maximum
Guaranteed on/off threshold hysteresis
Wide supply voltage capability, compatible with all popular logic systems
High common mode transient immunity, 2000 V/µs minimum
Fast switching t = 7.5ns typical, t = 12ns typical
r
f
•
•
Underwriter Laboratory (UL) recognized—file #E90700
VDE recognized – File#102497 – Add option V (e.g., H11N1VM)
APPLICATIONS
•
•
•
•
•
•
Logic to logic isolator
Programmable current level sensor
Line receiver—eliminate noise and transient problems
A.C. to TTL conversion—square wave shaping
Interfaces computers with peripherals
Isolated power MOS driver for power supplies
© 2003 Fairchild Semiconductor Corporation
Page 1 of 9
4/14/03
6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
H11N3-M
ABSOLUTE MAXIMUM RATINGS
Parameters
Symbol
Device
Value
Units
TOTAL DEVICE
T
Storage Temperature
Operating Temperature
All
All
All
-55 to +150
-40 to +85
°C
°C
STG
T
OPR
T
Lead Solder Temperature
Total Device Power Dissipation @ 25°C
Derate Above 25°C
260 for 10 sec
250
°C
SOL
mW
P
All
D
2.94
mW/°C
EMITTER
I
Continuous Forward Current
All
All
All
30
6
mA
V
F
V
Reverse Voltage
R
I (pk)
Forward Current - Peak (1 µs pulse, 300 pps)
LED Power Dissipation 25°C Ambient
Derate Linearly From 25°C
1.0
120
1.41
A
F
mW
P
All
D
mW/°C
DETECTOR
Detector Power Dissipation @ 25°C
Derate Linearly from 25°C
150
1.76
mW
mW/°C
V
P
All
D
V
Allowed Range
Allowed Range
V
All
All
All
0 to 16
45
65
O
V
V
0 to 16
50
V
CC
I Output Current
I
mA
4
O
ELECTRICAL CHARACTERISTICS (T = 0-70°C Unless otherwise specified.)
A
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameters
EMITTER
Test Conditions
Symbol
Device
Min
Typ*
Max
Units
I = 10 mA
1.4
2
F
V
Input Forward Voltage
All
V
F
I = 0.3 mA
0.75
1.25
F
V = 5 V
I
Reverse Current
Capacitance
All
All
10
µA
pF
R
R
C
V = 0, f = 1.0 MHz
100
J
DETECTOR
V
Operating Voltage Range
Supply Current
All
All
All
4
15
10
V
CC
I = 0, V = 5V
I
6
mA
µA
F
CC
CC(off)
I = 0.3mA, V = V = 15V
I
Output Current, High
100
F
CC
O
OH
*Typical values at T = 25°C
A
© 2003 Fairchild Semiconductor Corporation
Page 2 of 9
4/14/03
6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
H11N3-M
TRANSFER CHARACTERISTICS
DC Characteristics
Supply Current
Test Conditions
I = 10mA, V = 5V
Symbol
Device
Min
Typ*
Max
Units
I
All
6.5
10
mA
V
F
CC
CC(on)
R =270Ω,V =5V, I =I
max.
V
Output Voltage, low
All
0.5
3.2
5
L
CC
F
F(on)
OL
H11N1-M
H11N2-M
H11N3-M
All
0.8
2.3
4.1
0.3
R =270Ω, V = 5V
L
CC
I
Turn-On Threshold Current
mA
mA
F(on)
note 1
10
R =270Ω, V = 5V
I
Turn-Off Threshold Current
Hysteresis Ratio
L
CC
F(off)
R =270Ω, V = 5V
I
/I
All
0.65
0.95
L
CC
F(off) F(on)
AC Characteristics
SWITCHING SPEED
Test Conditions
Symbol
Device
Min
Typ
Max
Units
C=120pF, t =1µs, R : Note 2
Fig. 1
Propagation delay time
High to Low
P
E
t
All
All
All
100
7.5
330
330
ns
ns
ns
PHL
C=120pF, t =1µs, R : Note 2
P
E
t
Rise Time
r
Fig. 1
C=120pF, t =1µs, R : Note 2
Propagation delay time
Low to High
P
E
t
150
PLH
Fig. 1
C=120pF, t =1µs, R : Note 2
Fig. 1
P
E
t
Fall time
All
All
12
5
ns
f
Data Rate
MHz
ISOLATION CHARACTERISTICS
Parameters
Test Conditions
Symbol
Min
Typ*
Max
Units
V
V
PEAK
Input-Output Isolation Voltage
Isolation Capacitance
Isolation Resistance
f = 60 Hz, t =1 sec.
7500
ISO
V
= 0V, f = 1 MHz
= 500 VDC
C
0.4
0.6
pF
I-O
I-O
ISO
11
V
R
Ω
10
ISO
*Typical values at T = 25°C
A
NOTES:
1. Maximum I
is the maximum current required to trigger the output. For example, a 3.2mA maximum trigger current would
F(ON)
require the LED to be driven at a current greater than 3.2mA to guarantee the device will turn on. A 10% guard band is
recommended to account for degradation of the LED over its lifetime. The maximum allowable LED drive current is 30mA.
2. H11N1: R = 910Ω
E
H11N2: R = 560Ω
E
H11N3: R = 240Ω
E
© 2003 Fairchild Semiconductor Corporation
Page 3 of 9
4/14/03
6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
H11N3-M
C
I6
V
5V
IN
50%
5V
IF
0
1 H11N1-M
6
RE
RL
270Ω
4
VIN
VO
ton
toff
0.1µF
5
tr = tf ≤ 0.01µS
Z = 50Ω
2
10%
90%
VO
tf
tr
Figure 1. Switching Test Circuit and Waveforms
Figure 2. Transfer Characteristics
Figure 3. Threshold Current vs. Supply Voltage
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
6
5
4
3
2
1
0
TURN ON THRESHOLD
V
OH
V
= 5V
= 270Ω
= 25°C
CC
R
T
L
A
TURN OFF THRESHOLD
I
I
F(ON)
F(OFF)
Hysteresis area
shaded for illustration
NORMALIZED TO:
TURN ON THRESHOLD AT
V
= 5V, T = 25°C
CC
A
V
OL
0
2
4
6
8
10
12
14
16
0
1
2
3
4
V
- SUPPLY VOLTAGE (V)
CC
I
- INPUT CURRENT (mA)
F
Figure 4. Threshold Current vs. Temperature
Figure 5. Load Current vs. Output Voltage
1.2
1.0
0.8
0.6
0.4
0.2
0.0
100
10
1
I
F(On)
I
F(Off)
I
V
= I
F
F(ON)
= 5V
CC
NORMALIZED TO :
= 5V
V
CC
T
= 25°C
A
0
10
20
30
40
50
60
70
0.0
0.2
0.4
0.6
0.8
1.0
T
A
- TEMPERATURE (°C)
VO - OUTPUT VOLTAGE, LOW (V)
© 2003 Fairchild Semiconductor Corporation
Page 4 of 9
4/14/03
6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
H11N3-M
Figure 6. Supply Current vs. Supply Voltage
Figure 7. LED Forward Voltage vs. Forward Current
100
12
10
8
T
= -25°C
A
T
= 85°C
A
T
= -25°C
A
T
= 25°C
= 85°C
A
T
= 25°C
A
6
10
T
A
4
ON STATE
I = 10mA
F
2
OFF STATE
I = 0
F
1
0
2
1.0
1.2
1.4
1.6
1.8
2.0
4
6
8
10
12
14
16
VF - FORWARD VOLTAGE (V)
VCC - SUPPLY VOLTAGE (V)
© 2003 Fairchild Semiconductor Corporation
Page 5 of 9
4/14/03
6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
H11N3-M
Package Dimensions (Through Hole)
Package Dimensions (Surface Mount)
0.350 (8.89)
0.320 (8.13)
0.350 (8.89)
0.320 (8.13)
0.390 (9.90)
0.332 (8.43)
0.260 (6.60)
0.240 (6.10)
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.070 (1.77)
0.040 (1.02)
0.320 (8.13)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.200 (5.08)
0.115 (2.93)
0.012 (0.30)
0.008 (0.20)
0.100 (2.54)
0.015 (0.38)
0.025 (0.63)
0.020 (0.51)
0.100 [2.54]
0.020 (0.50)
0.016 (0.41)
15°
0.035 (0.88)
0.006 (0.16)
0.100 (2.54)
0.020 (0.50)
0.016 (0.41)
0.012 (0.30)
Package Dimensions (0.4” Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
0.350 (8.89)
0.320 (8.13)
0.070 (1.78)
0.260 (6.60)
0.240 (6.10)
0.060 (1.52)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.425 (10.79)
0.100 (2.54)
0.305 (7.75)
0.030 (0.76)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.012 (0.30)
0.100 [2.54]
0.020 (0.50)
0.016 (0.41)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
© 2003 Fairchild Semiconductor Corporation
Page 6 of 9
4/14/03
6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
H11N3-M
ORDERING INFORMATION
Option/Order Entry Identifier
Description
S
Surface Mount Lead Bend
SR2
T
Surface Mount; Tape and reel
0.4" Lead Spacing
V
VDE 0884
TV
SV
SR2V
VDE 0884, 0.4" Lead Spacing
VDE 0884, Surface Mount
VDE 0884, Surface Mount, Tape & Reel
MARKING INFORMATION
1
2
6
H11N1
V X YY Q
5
3
4
Definitions
1
2
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
3
4
5
6
One digit year code, e.g., ‘3’
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
*Note – Parts that do not have the ‘V’ option (see definition 3 above) that are marked with
date code ‘325’ or earlier are marked in portrait format.
© 2003 Fairchild Semiconductor Corporation
Page 7 of 9
4/14/03
6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
H11N3-M
Carrier Tape Specifications
12.0 0.1
2.0 0.05
4.5 0.20
Ø1.5 MIN
1.75 0.10
0.30 0.05
4.0 0.1
11.5 1.0
24.0 0.3
9.1 0.20
21.0 0.1
Ø1.5 0.1/-0
10.1 0.20
User Direction of Feed
0.1 MAX
NOTE
All dimensions are in inches (millimeters)
Reflow Profile (White Package, -M Suffix)
300
230°C, 10–30 s
250
245°C peak
200
150
Time above 183°C, 120–180 sec
Ramp up = 2–10°C/sec
100
50
0
• Peak reflow temperature: 245°C (package surface temperature)
• Time of temperature higher than 183°C for 120–180 seconds
• One time soldering reflow is recommended
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Time (Minute)
© 2003 Fairchild Semiconductor Corporation
Page 8 of 9
4/14/03
6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
H11N3-M
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
© 2003 Fairchild Semiconductor Corporation
Page 9 of 9
4/14/03
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