RFD12N06RLE_NL [FAIRCHILD]
Power Field-Effect Transistor, 18A I(D), 60V, 0.063ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-251AA, LEAD FREE PACKAGE-3;型号: | RFD12N06RLE_NL |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | Power Field-Effect Transistor, 18A I(D), 60V, 0.063ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-251AA, LEAD FREE PACKAGE-3 晶体 晶体管 功率场效应晶体管 开关 |
文件: | 总10页 (文件大小:216K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
RFD12N06RLE, RFD12N06RLESM,
RFP12N06RLE
Data Sheet
January 2002
17A, 60V, 0.071 Ohm, N-Channel, Logic
Level UltraFET Power MOSFET
Packaging
Features
• Ultra Low On-Resistance
JEDEC TO-251AA
JEDEC TO-252AA
DRAIN
SOURCE
DRAIN
GATE
- r
- r
= 0.063Ω, VGS = 10V
= 0.071Ω, VGS = 5V
DS(ON)
DS(ON)
DRAIN
(FLANGE)
(FLANGE)
GATE
• Simulation Models
SOURCE
®
©
- Temperature Compensated PSPICE and SABER
Electrical Models
RFD12N06RLE
RFD12N06RLESM
©
- Spice and SABER Thermal Impedance Models
JEDEC TO-220AB
- www.fairchildsemi.com
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
SOURCE
DRAIN
GATE
DRAIN (FLANGE)
• Switching Time vs R
Curves
GS
Ordering Information
RFP12N06RLE
PART NUMBER
RFD12N06RLE
PACKAGE
BRAND
12N6LE
TO-251AA
TO-252AA
TO-220AB
Symbol
RFD12N06RLESM
RFP12N06RLE
12N6LE
D
12N06RLE
NOTE: When ordering, use the entire part number. Add the suffix T to
obtain the TO-252AA variant in tape and reel, i.e. RFD12N06RLESM9A.
G
S
o
Absolute Maximum Ratings
T = 25 C, Unless Otherwise Specified
C
RFD12N06RLE, RFD12N06RLESM,
RFP12N06RLE
UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
60
60
V
V
V
DSS
Drain to Gate Voltage (R
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
±16
GS
Drain Current
o
Continuous (T = 25 C, V
C
= 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . .I
17
18
8
8
A
A
A
A
GS
GS
D
D
o
Continuous (T = 25 C, V
C
o
Continuous (T = 135 C, V
= 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
= 4.5V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . .I
C
GS
GS
D
o
Continuous (T = 135 C, V
C
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Figure 4
Figures 6, 17, 18
49
DM
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
W
D
o
o
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
0.327
W/ C
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T
-55 to 175
C
J
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . .T
o
300
260
C
C
L
o
pkg
NOTE:
o
o
1. T = 25 C to 150 C.
J
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
©2002 Fairchild Semiconductor Corporation
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE Rev. B
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE
o
Electrical Specifications
T
= 25 C, Unless Otherwise Specified
C
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
OFF STATE SPECIFICATIONS
Drain to Source Breakdown Voltage
BV
I
I
= 250µA, V
= 250µA, V
= 0V (Figure 12)
o
60
55
-
-
-
-
-
-
-
-
V
DSS
D
D
GS
GS
GS
GS
= 0V , T = -40 C (Figure 12)
C
V
Zero Gate Voltage Drain Current
I
V
V
V
= 55V, V
= 50V, V
= ±16V
= 0V
= 0V, T = 150 C
1
µA
µA
nA
DSS
DS
DS
GS
o
-
250
±100
C
Gate to Source Leakage Current
ON STATE SPECIFICATIONS
Gate to Source Threshold Voltage
Drain to Source On Resistance
I
-
GSS
V
V
= V , I = 250µA (Figure 11)
1
-
-
3
V
Ω
Ω
Ω
GS(TH)
GS
DS
D
r
I
I
I
= 18A, V
= 10V (Figures 9, 10)
0.052
0.060
0.064
0.063
0.071
0.075
DS(ON)
D
D
D
GS
= 8A, V
= 5V (Figure 9)
-
GS
GS
= 8A, V
= 4.5V (Figure 9)
-
THERMAL SPECIFICATIONS
o
Thermal Resistance Junction to Case
R
R
TO-251AA, TO-252AA
-
-
-
-
3.06
100
C/W
θJC
o
Thermal Resistance Junction to
Ambient
C/W
θJA
SWITCHING SPECIFICATIONS (V
Turn-On Time
= 4.5V)
GS
t
V
V
= 30V, I = 8A
-
-
-
-
-
-
-
153
ns
ns
ns
ns
ns
ns
ON
DD
GS
D
= 4.5V, R
= 22Ω
GS
Turn-On Delay Time
Rise Time
t
13
89
22
37
-
-
-
d(ON)
(Figures 15, 21, 22)
t
r
Turn-Off Delay Time
Fall Time
t
-
d(OFF)
t
-
f
Turn-Off Time
t
89
OFF
SWITCHING SPECIFICATIONS (V
Turn-On Time
= 10V)
t
GS
V
V
R
= 30V, I = 18A
D
= 10V,
= 24Ω
-
-
-
-
-
-
-
59
ns
ns
ns
ns
ns
ns
ON
DD
GS
Turn-On Delay Time
Rise Time
t
5.3
34
41
50
-
-
d(ON)
GS
t
-
r
(Figures 16, 21, 22)
Turn-Off Delay Time
Fall Time
t
-
-
d(OFF)
t
f
Turn-Off Time
t
136
OFF
GATE CHARGE SPECIFICATIONS
Total Gate Charge
Q
V
V
V
= 0V to 10V
= 0V to 5V
= 0V to 1V
V
= 30V,
-
-
-
-
-
12
6.8
0.54
1.7
3
15
8.2
0.65
-
nC
nC
nC
nC
nC
g(TOT)
GS
GS
GS
DD
= 8A,
I
I
D
Gate Charge at 5V
Q
g(5)
= 1.0mA
g(REF)
Threshold Gate Charge
Q
g(TH)
(Figures 14, 19, 20)
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
CAPACITANCE SPECIFICATIONS
Input Capacitance
Q
gs
gd
Q
-
C
V
= 25V, V
GS
= 0V,
-
-
-
485
130
28
-
-
-
pF
pF
pF
ISS
DS
f = 1MHz
(Figure 13)
Output Capacitance
C
C
OSS
Reverse Transfer Capacitance
RSS
Source to Drain Diode Specifications
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
1.25
1.0
UNITS
Source to Drain Diode Voltage
V
I
I
I
I
= 8A
= 4A
-
-
-
-
-
-
-
-
V
V
SD
SD
SD
SD
SD
Reverse Recovery Time
t
= 8A, dI /dt = 100A/µs
SD
70
ns
nC
rr
Reverse Recovered Charge
Q
= 8A, dI /dt = 100A/µs
SD
165
RR
©2002 Fairchild Semiconductor Corporation
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE Rev. B
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE
Typical Performance Curves
1.2
1.0
0.8
0.6
0.4
0.2
0
20
15
10
V
= 10V
GS
V
= 4.5V
GS
5
0
0
25
50
75
100
150
175
125
o
25
50
75
100
125
150
175
o
T
, CASE TEMPERATURE ( C)
T , CASE TEMPERATURE ( C)
C
C
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE
TEMPERATURE
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
2
DUTY CYCLE - DESCENDING ORDER
0.5
1
0.2
0.1
0.05
0.02
0.01
P
DM
0.1
t
1
t
2
NOTES:
DUTY FACTOR: D = t /t
1
2
SINGLE PULSE
PEAK T = P
x Z
x R + T
J
DM
θJC
θJC C
0.01
-5
-4
10
-3
-2
10
-1
0
1
10
10
10
10
10
t, RECTANGULAR PULSE DURATION (s)
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
200
100
o
= 25 C
T
C
FOR TEMPERATURES
o
ABOVE 25 C DERATE PEAK
CURRENT AS FOLLOWS:
175 - T
150
C
I = I
25
V
= 5V
GS
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
10
-5
-4
10
-3
10
-2
-1
0
1
10
10
10
t, PULSE WIDTH (s)
10
10
FIGURE 4. PEAK CURRENT CAPABILITY
©2002 Fairchild Semiconductor Corporation
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE Rev. B
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE
Typical Performance Curves (Continued)
60
100
If R = 0
= (L)(I )/(1.3*RATED BV
t
- V
)
DD
AV
If R ≠ 0
= (L/R)ln[(I *R)/(1.3*RATED BV
AS
DSS
t
AV
- V ) +1]
DD
AS DSS
100µs
10
10
o
STARTING T = 25 C
J
1ms
OPERATION IN THIS
AREA MAY BE
1
LIMITED BY r
10ms
DS(ON)
o
STARTING T = 150 C
J
SINGLE PULSE
o
T
= MAX RATED T = 25 C
J
C
1
0.1
0.01
0.1
1
10
100
1
10
, DRAIN TO SOURCE VOLTAGE (V)
100
t
, TIME IN AVALANCHE (ms)
AV
V
DS
NOTE: Refer to Fairchild Application Notes AN9321 and AN9322.
FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING
CAPABILITY
FIGURE 5. FORWARD BIAS SAFE OPERATING AREA
20
20
V
= 10V
= 5V
GS
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
DD
V
= 4V
GS
V
GS
V
= 15V
15
10
15
10
V
= 3.5V
GS
o
T
= 25 C
J
V
= 3V
GS
5
0
5
0
o
T
= 175 C
J
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
o
T
= -55 C
o
J
T
= 25 C
C
2.0
1.0
3.0
4.0
5.0
0
1
2
3
4
V
, GATE TO SOURCE VOLTAGE (V)
V
, DRAIN TO SOURCE VOLTAGE (V)
DS
GS
FIGURE 7. TRANSFER CHARACTERISTICS
FIGURE 8. SATURATION CHARACTERISTICS
80
2.5
2.0
1.5
1.0
0.5
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
o
T = 25 C
I
= 17A
C
D
70
60
I
= 12A
D
I
= 7A
D
50
40
V
= 10V, I = 18A
D
GS
-80
-40
0
40
80
120
160
200
2
4
6
8
10
o
V
, GATE TO SOURCE VOLTAGE (V)
T , JUNCTION TEMPERATURE ( C)
GS
J
FIGURE 9. DRAIN TO SOURCE ON RESISTANCE vs GATE
VOLTAGE AND DRAIN CURRENT
FIGURE 10. NORMALIZED DRAIN TO SOURCE ON
RESISTANCE vs JUNCTION TEMPERATURE
©2002 Fairchild Semiconductor Corporation
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE Rev. B
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE
Typical Performance Curves (Continued)
1.2
1.2
1.1
1.0
0.9
I
= 250µA
D
V
= V , I = 250µA
DS
GS
D
1.0
0.8
0.6
0.4
-80
-40
0
40
80
120
160
200
-80
-40
0
40
80
120
160
200
o
o
T , JUNCTION TEMPERATURE ( C)
T , JUNCTION TEMPERATURE ( C)
J
J
FIGURE 11. NORMALIZED GATE THRESHOLD VOLTAGE vs
JUNCTION TEMPERATURE
FIGURE 12. NORMALIZED DRAIN TO SOURCE BREAKDOWN
VOLTAGE vs JUNCTION TEMPERATURE
10
2000
V
= 30V
DD
C
=
C
+ C
GS GD
ISS
8
6
4
2
0
1000
100
10
WAVEFORMS IN
DESCENDING ORDER:
C
C
+ C
OSS
DS GD
I
I
I
= 17A
= 12A
= 7A
D
D
D
V
= 0V, f = 1MHz
1.0
GS
C
= C
GD
RSS
0
3
6
9
12
15
60
0.1
10
Q , GATE CHARGE (nC)
g
V
, DRAIN TO SOURCE VOLTAGE (V)
DS
NOTE: Refer to Fairchild Application Notes AN7254 and AN7260.
FIGURE 14. GATE CHARGE WAVEFORMS FOR CONSTANT
GATE CURRENT
FIGURE 13. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
150
100
V
= 4.5V, V
DD
= 30V, I = 8A
D
V
= 10V, V
= 30V, I = 18A
GS
GS
DD D
120
90
80
60
40
t
r
t
r
t
f
60
t
f
t
d(OFF)
t
d(OFF)
30
0
20
0
t
d(ON)
t
d(ON)
0
10
20
30
40
50
0
10
20
30
40
50
R
, GATE TO SOURCE RESISTANCE (Ω)
GS
R
, GATE TO SOURCE RESISTANCE (Ω)
GS
FIGURE 15. SWITCHING TIME vs GATE RESISTANCE
FIGURE 16. SWITCHING TIME vs GATE RESISTANCE
©2002 Fairchild Semiconductor Corporation
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE Rev. B
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE
Test Circuits and Waveforms
V
DS
BV
DSS
L
t
P
V
DS
I
VARY t TO OBTAIN
P
AS
+
-
V
DD
R
REQUIRED PEAK I
G
AS
V
DD
V
GS
DUT
t
P
I
0V
AS
0
0.01Ω
t
AV
FIGURE 17. UNCLAMPED ENERGY TEST CIRCUIT
FIGURE 18. UNCLAMPED ENERGY WAVEFORMS
V
DS
V
Q
DD
R
g(TOT)
L
V
DS
V
= 10V
GS
V
Q
GS
g(5)
+
-
V
DD
V
= 5V
V
GS
GS
DUT
V
= 1V
GS
I
0
g(REF)
Q
g(TH)
Q
Q
gd
gs
I
g(REF)
0
FIGURE 19. GATE CHARGE TEST CIRCUIT
FIGURE 20. GATE CHARGE WAVEFORMS
V
t
t
DS
ON
OFF
t
d(OFF)
t
d(ON)
t
t
f
R
L
r
V
DS
90%
90%
+
V
GS
V
DD
10%
10%
0
-
DUT
90%
50%
R
GS
V
GS
50%
PULSE WIDTH
10%
V
GS
0
FIGURE 21. SWITCHING TIME TEST CIRCUIT
FIGURE 22. SWITCHING TIME WAVEFORM
©2002 Fairchild Semiconductor Corporation
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE Rev. B
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE
PSPICE Electrical Model
.SUBCKT HUF76409D 2 1 3 ;
rev 23 August 1999
CA 12 8 6.30e-10
CB 15 14 6.30e-10
CIN 6 8 4.60e-10
DBODY 7 5 DBODYMOD
DBREAK 5 11 DBREAKMOD
DPLCAP 10 5 DPLCAPMOD
LDRAIN
DPLCAP
DRAIN
2
5
10
RLDRAIN
RSLC1
51
EBREAK 11 7 17 18 66.55
EDS 14 8 5 8 1
EGS 13 8 6 8 1
ESG 6 10 6 8 1
EVTHRES 6 21 19 8 1
EVTEMP 20 6 18 22 1
DBREAK
+
RSLC2
5
ESLC
11
51
-
50
+
-
17
18
-
DBODY
RDRAIN
6
8
EBREAK
ESG
IT 8 17 1
EVTHRES
+
+
16
21
-
19
8
MWEAK
LDRAIN 2 5 1.00e-9
LGATE 1 9 3.73e-9
LSOURCE 3 7 3.43e-9
LGATE
RGATE
EVTEMP
+
GATE
1
6
-
18
22
MMED
9
20
MSTRO
8
RLGATE
MMED 16 6 8 8 MMEDMOD
MSTRO 16 6 8 8 MSTROMOD
MWEAK 16 21 8 8 MWEAKMOD
LSOURCE
CIN
SOURCE
3
7
RSOURCE
RBREAK 17 18 RBREAKMOD 1
RDRAIN 50 16 RDRAINMOD 1.88e-2
RGATE 9 20 3.76
RLDRAIN 2 5 10
RLSOURCE
S1A
S2A
RBREAK
12
15
13
8
14
13
17
18
RLGATE 1 9 37.3
RLSOURCE 3 7 34.3
RSLC1 5 51 RSLCMOD 1e-6
RSLC2 5 50 1e3
RSOURCE 8 7 RSOURCEMOD 2.40e-2
RVTHRES 22 8 RVTHRESMOD 1
RVTEMP 18 19 RVTEMPMOD 1
RVTEMP
19
-
S1B
S2B
13
CB
CA
IT
14
+
+
VBAT
6
8
5
8
EGS
EDS
+
-
-
8
S1A 6 12 13 8 S1AMOD
S1B 13 12 13 8 S1BMOD
S2A 6 15 14 13 S2AMOD
S2B 13 15 14 13 S2BMOD
22
RVTHRES
VBAT 22 19 DC 1
ESLC 51 50 VALUE={(V(5,51)/ABS(V(5,51)))*(PWR(V(5,51)/(1e-6*43),3))}
.MODEL DBODYMOD D (IS = 3.84e-13 RS = 1.56e-2 TRS1 = -1.0e-3 TRS2 = 7.0e-6 CJO = 6.4e-10 TT = 5.10e-8 XTI =4.35 M = 0.52)
.MODEL DBREAKMOD D (RS = 3.70e- 1TRS1 = 9.10e- 4TRS2 = -1e-6)
.MODEL DPLCAPMOD D (CJO = 3.70e-1 0IS = 1e-3 0N = 10 M = 0.79)
.MODEL MMEDMOD NMOS (VTO = 2.08 KP = 3.2 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 3.76)
.MODEL MSTROMOD NMOS (VTO = 2.40 KP = 28 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u)
.MODEL MWEAKMOD NMOS (VTO = 1.80 KP = 0.08 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 37.6 RS = 0.1)
.MODEL RBREAKMOD RES (TC1 = 1.13e- 3TC2 = -3.00e-7)
.MODEL RDRAINMOD RES (TC1 = 9.80e-3 TC2 = 2.85e-5)
.MODEL RSLCMOD RES (TC1 = 5.00e-3 TC2 = 5.05e-6)
.MODEL RSOURCEMOD RES (TC1 = 1.5e-3 TC2 = 1e-6)
.MODEL RVTHRESMOD RES (TC1 = -1.48e-3 TC2 = -8.30e-6)
.MODEL RVTEMPMOD RES (TC1 = -1.68e- 3TC2 = 8e-7)
.MODEL S1AMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = -5 VOFF= -2.8)
.MODEL S1BMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = -2.8 VOFF= -5)
.MODEL S2AMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = -0.5 VOFF= 0.5)
.MODEL S2BMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = 0.5 VOFF= -0.5)
.ENDS
NOTE: For further discussion of the PSPICE model, consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global
Temperature Options; IEEE Power Electronics Specialist Conference Records, 1991, written by William J. Hepp and C. Frank Wheatley.
©2002 Fairchild Semiconductor Corporation
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE Rev. B
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE
SABER Electrical Model
REV 23 August 1999
template huf76409d n2,n1,n3
electrical n2,n1,n3
{
var i iscl
d..model dbodymod = (is = 3.84e-13, cjo = 6.40e-10, tt = 5.10e-8, xti = 4.35, m = 0.52)
d..model dbreakmod = ()
d..model dplcapmod = (cjo = 3.70e-10, is = 1e-30, m = 0.79)
m..model mmedmod = (type=_n, vto = 2.08, kp = 3.2, is = 1e-30, tox = 1)
m..model mstrongmod = (type=_n, vto = 2.40, kp = 28, is = 1e-30, tox = 1)
m..model mweakmod = (type=_n, vto = 1.80, kp = 0.08, is = 1e-30, tox = 1)
sw_vcsp..model s1amod = (ron = 1e-5, roff = 0.1, von = -5, voff = -2.8)
sw_vcsp..model s1bmod = (ron =1e-5, roff = 0.1, von = -2.8, voff = -5)
sw_vcsp..model s2amod = (ron = 1e-5, roff = 0.1, von = -0.5, voff = 0.5)
sw_vcsp..model s2bmod = (ron = 1e-5, roff = 0.1, von = 0.5, voff = -0.5)
LDRAIN
RLDRAIN
RDBODY
DPLCAP
DRAIN
2
5
10
RSLC1
51
RDBREAK
72
DBREAK
11
c.ca n12 n8 = 6.30e-10
c.cb n15 n14 = 6.30e-10
c.cin n6 n8 = 4.60e-10
RSLC2
ISCL
50
-
d.dbody n7 n71 = model=dbodymod
d.dbreak n72 n11 = model=dbreakmod
d.dplcap n10 n5 = model=dplcapmod
71
RDRAIN
6
8
ESG
EVTHRES
+
+
16
21
-
19
8
MWEAK
i.it n8 n17 = 1
LGATE
EVTEMP
+
DBODY
RGATE
GATE
1
6
-
18
22
EBREAK
+
l.ldrain n2 n5 = 1.00e-9
l.lgate n1 n9 = 3.73e-9
l.lsource n3 n7 = 3.43e-9
MMED
9
20
MSTRO
8
17
18
-
RLGATE
LSOURCE
CIN
SOURCE
3
m.mmed n16 n6 n8 n8 = model=mmedmod, l=1u, w=1u
m.mstrong n16 n6 n8 n8 = model=mstrongmod, l=1u, w=1u
m.mweak n16 n21 n8 n8 = model=mweakmod, l=1u, w=1u
7
RSOURCE
RLSOURCE
S1A
S2A
res.rbreak n17 n18 = 1, tc1 = 1.13e-3, tc2 = -3.00e-7
res.rdbody n71 n5 = 1.56e-2, tc1 = -1.0e-3, tc2 = 7.00e-6
res.rdbreak n72 n5 = 3.70e-1, tc1 = 9.10e-4, tc2 = -1e-6
res.rdrain n50 n16 = 1.88e-2, tc1 = 9.80e-3, tc2 = 2.85e-5
res.rgate n9 n20 = 3.76
res.rldrain n2 n5 = 10
res.rlgate n1 n9 = 37.3
res.rlsource n3 n7 = 34.3
res.rslc1 n5 n51= 1e-6, tc1 = 5.00e-3, tc2 = 5.05e-6
res.rslc2 n5 n50 = 1e3
RBREAK
12
15
13
14
13
17
18
8
RVTEMP
19
S1B
S2B
13
CB
CA
IT
14
-
+
+
VBAT
6
8
5
8
EGS
EDS
+
-
-
8
22
res.rsource n8 n7 = 2.40e-2, tc1 = 1.5e-3, tc2 =1e-6
res.rvtemp n18 n19 = 1, tc1 = -1.68e-3, tc2 = 8.00e-7
res.rvthres n22 n8 = 1, tc1 = -1.48e-3, tc2 = -8.30e-6
RVTHRES
spe.ebreak n11 n7 n17 n18 = 66.55
spe.eds n14 n8 n5 n8 = 1
spe.egs n13 n8 n6 n8 = 1
spe.esg n6 n10 n6 n8 = 1
spe.evtemp n20 n6 n18 n22 = 1
spe.evthres n6 n21 n19 n8 = 1
sw_vcsp.s1a n6 n12 n13 n8 = model=s1amod
sw_vcsp.s1b n13 n12 n13 n8 = model=s1bmod
sw_vcsp.s2a n6 n15 n14 n13 = model=s2amod
sw_vcsp.s2b n13 n15 n14 n13 = model=s2bmod
v.vbat n22 n19 = dc=1
equations {
i (n51->n50) +=iscl
iscl: v(n51,n50) = ((v(n5,n51)/(1e-9+abs(v(n5,n51))))*((abs(v(n5,n51)*1e6/43))** 3))
}
}
©2002 Fairchild Semiconductor Corporation
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE Rev. B
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE
SPICE Thermal Model
JUNCTION
th
REV 10 September 1999
HUF76409T
RTHERM1
RTHERM2
RTHERM3
RTHERM4
RTHERM5
RTHERM6
CTHERM1
CTHERM2
CTHERM3
CTHERM4
CTHERM5
CTHERM6
CTHERM1 th 6 9.50e-4
CTHERM2 6 5 2.40e-3
CTHERM3 5 4 3.90e-3
CTHERM4 4 3 4.10e-3
CTHERM5 3 2 5.60e-3
CTHERM6 2 tl 4.00e-2
6
RTHERM1 th 6 2.00e-2
RTHERM2 6 5 1.10e-1
RTHERM3 5 4 2.75e-1
RTHERM4 4 3 5.53e-1
RTHERM5 3 2 7.25e-1
RTHERM6 2 tl 7.56e-1
5
SABER Thermal Model
SABER thermal model HUF76409T
4
3
2
template thermal_model th tl
thermal_c th, tl
{
ctherm.ctherm1 th 6 = 9.50e-4
ctherm.ctherm2 6 5 = 2.40e-3
ctherm.ctherm3 5 4 = 3.90e-3
ctherm.ctherm4 4 3 = 4.10e-3
ctherm.ctherm5 3 2 = 5.60e-3
ctherm.ctherm6 2 tl = 4.00e-2
rtherm.rtherm1 th 6 = 2.00e-2
rtherm.rtherm2 6 5 = 1.10e-1
rtherm.rtherm3 5 4 = 2.75e-1
rtherm.rtherm4 4 3 = 5.53e-1
rtherm.rtherm5 3 2 = 7.25e-1
rtherm.rtherm6 2 tl = 7.56e-1
}
tl
CASE
©2002 Fairchild Semiconductor Corporation
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE Rev. B
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Rev. H4
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