SGL50N60 [FAIRCHILD]

Short Circuit Rated IGBT; 短路额定IGBT
SGL50N60
型号: SGL50N60
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Short Circuit Rated IGBT
短路额定IGBT

双极性晶体管
文件: 总7页 (文件大小:564K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IGBT  
SGL50N60RUF  
Short Circuit Rated IGBT  
General Description  
Features  
Fairchild's RUF series of Insulated Gate Bipolar Transistors  
(IGBTs) provide low conduction and switching losses as  
well as short circuit ruggedness. The RUF series is  
Short circuit rated 10us @ T = 100°C, V = 15V  
C
GE  
High speed switching  
Low saturation voltage : V  
High input impedance  
= 2.2 V @ I = 50A  
CE(sat)  
C
designed for  
applications such as motor control,  
uninterrupted power supplies (UPS) and general inverters  
where short circuit ruggedness is a required feature.  
Applications  
AC & DC motor controls, general purpose inverters, robotics, and servo controls.  
C
E
G
TO-264  
G
C
E
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Description  
SGL50N60RUF  
Units  
V
V
V
Collector-Emitter Voltage  
600  
± 20  
CES  
GES  
Gate-Emitter Voltage  
V
Collector Current  
@ T  
=
25°C  
80  
A
C
I
I
C
Collector Current  
@ T = 100°C  
50  
A
C
Pulsed Collector Current  
150  
A
CM (1)  
T
Short Circuit Withstand Time  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction Temperature  
Storage Temperature Range  
Maximum Lead Temp. for Soldering  
Purposes,1/8” from Case for 5 Seconds  
@ T = 100°C  
10  
us  
W
W
°C  
°C  
SC  
C
P
@ T = 25°C  
250  
D
C
@ T = 100°C  
100  
C
T
-55 to +150  
-55 to +150  
J
T
stg  
T
300  
°C  
L
Notes :  
(1) Repetitive rating : Pulse width limited by max. junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Typ.  
--  
Max.  
Units  
°C/W  
°C/W  
R
R
Thermal Resistance, Junction-to-Case  
0.5  
25  
θJC  
θJA  
Thermal Resistance, Junction-to-Ambient  
--  
©2002 Fairchild Semiconductor Corporation  
SGL50N60RUF Rev. A1  
Electrical Characteristics of the IGBT  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Units  
Off Characteristics  
BV  
Collector-Emitter Breakdown Voltage  
Temperature Coefficient of Breakdown  
Voltage  
V
V
= 0V, I = 250uA  
600  
--  
--  
--  
--  
V
CES  
GE  
C
B  
/
VCES  
J
= 0V, I = 1mA  
0.6  
V/°C  
GE  
C
T  
I
I
Collector Cut-Off Current  
G-E Leakage Current  
V
V
= V  
= V  
, V = 0V  
--  
--  
--  
--  
250  
uA  
nA  
CES  
GES  
CE  
CES  
GE  
, V = 0V  
± 100  
GE  
GES  
CE  
On Characteristics  
V
G-E Threshold Voltage  
Ic = 50mA, V = V  
GE  
5.0  
--  
6.0  
2.2  
2.5  
8.5  
2.8  
--  
V
V
V
GE(th)  
CE  
I
I
= 50A,  
= 80A,  
V
V
= 15V  
= 15V  
Collector to Emitter  
Saturation Voltage  
C
C
GE  
GE  
V
CE(sat)  
--  
Dynamic Characteristics  
C
C
C
Input Capacitance  
--  
--  
--  
3311  
399  
139  
--  
--  
--  
pF  
pF  
pF  
ies  
V
=30V V = 0V,  
, GE  
CE  
Output Capacitance  
oes  
res  
f = 1MHz  
Reverse Transfer Capacitance  
Switching Characteristics  
t
t
t
t
Turn-On Delay Time  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
26  
89  
--  
--  
ns  
ns  
d(on)  
Rise Time  
r
Turn-Off Delay Time  
Fall Time  
66  
100  
200  
--  
ns  
V
R
= 300 V, I = 50A,  
C
d(off)  
f
CC  
= 5.9, V = 15V,  
118  
1.68  
1.03  
2.71  
28  
ns  
G
GE  
Inductive Load, T = 25°C  
E
E
E
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Turn-On Delay Time  
Rise Time  
mJ  
mJ  
mJ  
ns  
C
on  
off  
--  
3.8  
--  
ts  
t
t
t
t
d(on)  
r
91  
--  
ns  
Turn-Off Delay Time  
Fall Time  
68  
110  
400  
--  
ns  
V
= 300 V, I = 50A,  
C
d(off)  
f
CC  
R
= 5.9, V = 15V,  
261  
1.7  
ns  
G
GE  
Inductive Load, T = 125°C  
E
E
E
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
mJ  
mJ  
mJ  
C
on  
off  
ts  
2.31  
4.01  
--  
5.62  
V
= 300 V, V = 15V,  
GE  
C
CC  
T
Short Circuit Withstand Time  
10  
--  
--  
us  
sc  
@ T = 100°C  
Q
Total Gate Charge  
--  
--  
--  
--  
145  
25  
210  
35  
nC  
nC  
nC  
nH  
g
V
V
= 300 V, I = 50A,  
= 15V  
CE  
GE  
C
Q
Q
Gate-Emitter Charge  
Gate-Collector Charge  
Internal Emitter Inductance  
ge  
gc  
70  
100  
--  
L
Measured 5mm from PKG  
18  
e
©2002 Fairchild Semiconductor Corporation  
SGL50N60RUF Rev. A1  
140  
120  
100  
80  
15V  
20V  
Common Emitter  
TC = 25  
140  
120  
100  
80  
Common Emitter  
VGE = 15V  
TC  
= 25━  
TC = 125------  
12V  
60  
60  
VGE = 10V  
40  
40  
20  
20  
0
0
0
2
4
6
8
1
10  
Collector - Emitter Voltage, VCE [V]  
Collector - Emitter Voltage, VCE [V]  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Saturation Voltage Characteristics  
5
60  
VCC = 300V  
Common Emitter  
Load Current : peak of square wave  
V
GE = 15V  
50  
4
3
2
1
0
100A  
40  
30  
20  
50A  
IC = 30A  
10  
Duty cycle : 50%  
T
C = 100  
Power Dissipation = 70W  
0
1
10  
100  
1000  
-50  
0
50  
100  
150  
Frequency [KHz]  
Case Temperature, TC  
[
]
Fig 3. Saturation Voltage vs. Case  
Fig 4. Load Current vs. Frequency  
Temperature at Variant Current Level  
20  
16  
12  
8
20  
Common Emitter  
Common Emitter  
TC = 25  
TC = 125  
16  
12  
8
100A  
100A  
4
4
50A  
50A  
IC = 30A  
IC = 30A  
8
0
0
0
4
8
12  
16  
20  
0
4
12  
16  
20  
Gate - Emitter Voltage, VGE [V]  
Gate - Emitter Voltage, VGE [V]  
Fig 6. Saturation Voltage vs. V  
Fig 5. Saturation Voltage vs. V  
GE  
GE  
©2002 Fairchild Semiconductor Corporation  
SGL50N60RUF Rev. A1  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
0
1000  
Common Emitter  
VGE = 0V, f = 1MHz  
Common Emitter  
VCC = 300V, VGE = ± 15V  
IC = 50A  
T
C = 25℃  
TC  
= 25━  
Ton  
Tr  
TC = 125------  
Cies  
Coes  
Cres  
100  
1
10  
Collector - Emitter Voltage, VCE [V]  
10  
100  
Gate Resistance, RG []  
Fig 7. Capacitance Characteristics  
Fig 8. Turn-On Characteristics vs.  
Gate Resistance  
10000  
Common Emitter  
Common Emitter  
±
15V  
VCC = 300V, VGE  
IC = 50A  
=
±
15V  
VCC = 300V, VGE  
C = 50A  
=
I
1000  
━  
= 25  
TC  
TC = 125 ------  
━  
= 25  
TC  
C = 125 ------  
Eon  
Toff  
Toff  
T
Eoff  
Eoff  
Tf  
Tf  
1000  
100  
10  
Gate Resistance, RG []  
100  
10  
Gate Resistance, RG []  
100  
Fig 9. Turn-Off Characteristics vs.  
Gate Resistance  
Fig 10. Switching Loss vs. Gate Resistance  
1000  
1000  
Common Emitter  
±
25  
VGE  
TC  
=
15V, RG = 5.9  
━  
=
TC = 125 ------  
Ton  
Tr  
Toff  
Tf  
100  
Toff  
100  
Tf  
Common Emitter  
±
VGE  
TC  
=
15V, RG = 5.9Ω  
━  
25  
=
TC = 125 ------  
10  
10  
20  
40  
60  
80  
100  
10  
20  
40  
60  
80  
100  
Collector Current, IC [A]  
Collector Current, IC [A]  
Fig 11. Turn-On Characteristics vs.  
Collector Current  
Fig 12. Turn-Off Characteristics vs.  
Collector Current  
©2002 Fairchild Semiconductor Corporation  
SGL50N60RUF Rev. A1  
15  
12  
9
10000  
1000  
100  
Common Emitter  
RL = 6  
TC = 25℃  
Common Emitter  
±
VGE  
TC  
=
15V, RG = 5.9Ω  
━  
25  
=
TC = 125 ------  
VCC = 100 V  
300 V  
200 V  
Eoff  
Eoff  
Eon  
6
3
0
10  
20  
40  
60  
80  
100  
0
30  
60  
90  
120  
150  
180  
Collector Current, IC [A]  
Gate Charge, Qg [ nC ]  
Fig 13. Switching Loss vs. Collector Current  
Fig 14. Gate Charge Characteristics  
500  
IC MAX. (Pulsed)  
100  
100  
50us  
IC MAX. (Continuous)  
100us  
1
DC Operation  
10  
1
10  
Single Nonrepetitive  
Pulse TC = 25  
Curves must be derated  
linearly with increase  
in temperature  
Safe Operating Area  
VGE = 20V, TC = 100  
10 100  
Collector-Emitter Voltage, VCE [V]  
0.1  
1
0.3  
1
10  
100  
1000  
1
1000  
Collector-Emitter Voltage, VCE [V]  
Fig 15. SOA Characteristics  
Fig 16. Turn-Off SOA Characteristics  
1
0.5  
0.2  
0.1  
0.1  
0.05  
Pdm  
0.02  
0.01  
0.01  
t1  
t2  
single pulse  
1E-3  
Duty factor D = t1 / t2  
Peak Tj = Pdm  
× Zthjc + T  
C
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
Rectangular Pulse Duration [sec]  
Fig 17. Transient Thermal Impedance of IGBT  
©2002 Fairchild Semiconductor Corporation  
SGL50N60RUF Rev. A1  
Package Dimension  
TO-264  
20.00 ±0.20  
(8.30) (8.30)  
(2.00)  
(1.00)  
(0.50)  
(7.00)  
(7.00)  
4.90 ±0.20  
(1.50)  
(1.50)  
(1.50)  
2.50 ±0.20  
3.00 ±0.20  
+0.25  
–0.10  
1.00  
+0.25  
–0.10  
0.60  
2.80 ±0.30  
5.45TYP  
5.45TYP  
[5.45 ±0.30  
]
[5.45 ±0.30]  
Dimensions in Millimeters  
©2002 Fairchild Semiconductor Corporation  
SGL50N60RUF Rev. A1  
TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not  
intended to be an exhaustive list of all such trademarks.  
ACEx™  
FAST®  
FASTr™  
FRFET™  
GlobalOptoisolator™ PACMAN™  
GTO™  
HiSeC™  
I2C™  
ISOPLANAR™  
LittleFET™  
MicroFET™  
MICROWIRE™  
OPTOLOGIC™  
OPTOPLANAR™  
SLIENT SWITCHER® UHC™  
SMART START™  
SPM™  
STAR*POWER™  
Stealth™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SyncFET™  
Bottomless™  
CoolFET™  
CROSSVOLT™  
DenseTrench™  
DOME™  
EcoSPARK™  
E2CMOS™  
EnSigna™  
FACT™  
UltraFET®  
VCX™  
POP™  
Power247™  
PowerTrench®  
QFET™  
QS™  
QT Optoelectronics™ TinyLogic™  
Quiet Series™ TruTranslation™  
FACT Quiet Series™ MicroPak™  
STAR*POWER is used under license  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY  
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY  
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;  
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR  
CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body,  
or (b) support or sustain life, or (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to  
result in significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or In  
Design  
This datasheet contains the design specifications for  
product development. Specifications may change in  
any manner without notice.  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later date.  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
design.  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specifications. Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve design.  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductor.  
The datasheet is printed for reference information only.  
©2002 Fairchild Semiconductor Corporation  
Rev. H5  

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