SFM28 [FORMOSA]

Chip Super Fast Rectifiers;
SFM28
型号: SFM28
厂家: FORMOSA MS    FORMOSA MS
描述:

Chip Super Fast Rectifiers

超快速恢复二极管 光电二极管
文件: 总7页 (文件大小:60K)
中文:  中文翻译
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Chip Super Fast Rectifiers  
Formosa MS  
SFM21 THRU SFM28  
List  
1
2
2
2
2
3
4
4
4
5
6
6
7
List.................................................................................................  
Package outline...............................................................................  
Features..........................................................................................  
Mechanical data...............................................................................  
Maximum ratings .............................................................................  
Rating and characteristic curves........................................................  
Pinning information...........................................................................  
Marking...........................................................................................  
Suggested solder pad layout.............................................................  
Packing information..........................................................................  
Reel packing....................................................................................  
Suggested thermal profiles for soldering processes.............................  
High reliability test capabilities...........................................................  
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-121404  
Issued Date  
2008/02/10  
Revised Date  
2011/11/18  
Revision  
F
Page.  
7
Page 1  
Chip Super Fast Rectifiers  
Formosa MS  
SFM21 THRU SFM28  
2.0A Surface Mount Super  
Fast Rectifiers-50-600V  
Package outline  
Features  
Batch process design, excellent power dissipation offers  
better reverse leakage current and thermal resistance.  
SMA  
Low profile surface mounted application in order to  
optimize board space.  
0.196(4.9)  
0.180(4.5)  
0.012(0.3) Typ.  
High current capability.  
Superfast recovery tim for switching mode application.  
High surge current capability.  
Glass passivated chip junction.  
0.106(2.7)  
0.091(2.3)  
Lead-free parts meet RoHS requirments.  
Suffix "-H" indicates Halogen free parts, ex. SFM21-H.  
Mechanical data  
0.068(1.7)  
0.060(1.5)  
Epoxy:UL94-V0 rated flame retardant  
Case : Molded plastic, JEDEC DO-214AC / SMA  
0.032(0.8) Typ.  
0.032 (0.8) Typ.  
Terminals : Solder plated, solderable per  
MIL-STD-750, Method 2026  
Polarity : Indicated by cathode band  
Mounting Position : Any  
Dimensions in inches and (millimeters)  
Weight : Approximated 0.05 gram  
Maximum ratings and Electrical Characteristics (AT TA=25oC unless otherwise noted)  
MAX.  
Symbol  
IO  
TYP.  
UNIT  
A
MIN.  
PARAMETER  
CONDITIONS  
2.0  
Forward rectified current  
See Fig.2  
IFSM  
50  
Forward surge current  
A
8.3ms single half sine-wave (JEDEC methode)  
VR = VRRM TJ = 25OC  
VR = VRRM TJ = 125OC  
5.0  
IR  
μA  
Reverse current  
100  
RθJA  
RθJC  
40  
24  
Junction to ambient, note 2  
Junction to case, note 2  
OC/W  
pF  
Typical thermal resistance  
25  
CJ  
Diode junction capacitance  
Storage temperature  
f=1MHz and applied 4V DC reverse voltage  
OC  
+175  
-65  
TSTG  
Operating  
temperature  
TJ, (OC)  
*5  
*1  
*3  
VR  
(V)  
*4  
VF  
(V)  
*2  
VRMS  
(V)  
trr  
(ns)  
SYMBOLS  
VRRM  
(V)  
*1 Repetitive peak reverse voltage  
*2 RMS voltage  
50  
35  
50  
SFM21  
SFM22  
SFM23  
100  
150  
200  
70  
100  
150  
200  
0.95  
105  
140  
210  
280  
350  
*3 Continuous reverse voltage  
*4 Maximum forward voltage@IF=2.0A  
*5 Maximum Reverse recovery time, note 1  
-55 to +150  
SFM24  
SFM25  
SFM26  
SFM27  
35  
300  
400  
500  
600  
300  
400  
500  
600  
1.25  
1.70  
SFM28  
420  
Note 1. Reverse recovery time test condition, IF=0.5A, IR=1.0A, IRR=0.25A  
2. Mounted on 2.8 mm x 1.6 mm PCB  
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-121404  
Issued Date  
2008/02/10  
Revised Date  
2011/11/18  
Revision  
F
Page.  
7
Page 2  
Rating and characteristic curves (SFM21 THRU SFM28)  
FIG.1-TYPICAL FORWARD  
CHARACTERISTICS  
FIG.2-TYPICAL FORWARD CURRENT  
DERATING CURVE  
10  
1.0  
.1  
2.8  
2.4  
2.0  
1.6  
1.2  
.8  
P.C.B. Mounted on  
2.8 mm x 1.6 mm  
Copper Pad Areas  
.4  
0
0
20  
40  
60  
80  
100  
120  
140  
160  
180  
TJ=25 C  
LEAD TEMPERATURE (°C)  
Pulse Width 300us  
1% Duty Cycle  
.01  
.001  
FIG.4-MAXIMUM NON-REPETITIVE FORWARD  
SURGE CURRENT  
50  
40  
30  
20  
10  
0
1.6 1.8  
.4  
.6  
.8  
1.0 1.2 1.4  
FORWARD VOLTAGE,(V)  
FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE  
RECOVERY TIME CHARACTERISTICS  
8.3ms Single Half  
TJ=25 C  
Sine Wave  
50  
NONINDUCTIVE  
W
10W  
NONINDUCTIVE  
JEDEC method  
(
)
(+)  
D.U.T.  
25Vdc  
(approx.)  
PULSE  
GENERATOR  
(NOTE 2)  
50  
1
5
10  
100  
(
)
(+)  
NUMBER OF CYCLES AT 60Hz  
1W  
NON-  
INDUCTIVE  
OSCILLISCOPE  
(NOTE 1)  
NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF.  
2. Rise Time= 10ns max., Source Impedance= 50 ohms.  
FIG.5-TYPICAL JUNCTION CAPACITANCE  
70  
trr  
60  
50  
40  
|
|
|
|
|
|
|
|
+0.5A  
0
-0.25A  
30  
20  
10  
0
-1.0A  
1cm  
SET TIME BASE FOR  
50 / 10ns / cm  
.01  
.05  
.1  
.5  
1
5
10  
50  
100  
REVERSE VOLTAGE,(V)  
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-121404  
Issued Date  
2008/02/10  
Revised Date  
2011/11/18  
Revision  
F
Page.  
7
Page 3  
Chip Super Fast Rectifiers  
Formosa MS  
SFM21 THRU SFM28  
Pinning information  
Pin  
Simplified outline  
Symbol  
Pin1 cathode  
Pin2 anode  
1
2
1
2
Marking  
Type number  
Marking code  
SFM21  
SFM22  
SFM23  
SFM24  
SFM25  
SFM26  
SFM27  
SFM28  
S21  
S22  
S23  
S24  
S25  
S26  
S27  
S28  
Suggested solder pad layout  
C
A
B
Dimensions in inches and (millimeters)  
PACKAGE  
SMA  
A
B
C
0.110 (2.80)  
0.063 (1.60)  
0.087 (2.20)  
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-121404  
Issued Date  
2008/02/10  
Revised Date  
2011/11/18  
Revision  
F
Page.  
7
Page 4  
Chip Super Fast Rectifiers  
Formosa MS  
SFM21 THRU SFM28  
Packing information  
P0  
P1  
d
E
F
W
B
A
P
D2  
D1  
T
C
W1  
D
unit:mm  
Symbol  
SMA  
Item  
Tolerance  
Carrier width  
A
0.1  
0.1  
0.1  
0.1  
2.0  
min  
2.0  
min  
0.5  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.3  
1.0  
2.80  
5.00  
Carrier length  
B
Carrier depth  
C
1.90  
Sprocket hole  
d
1.50  
13" Reel outside diameter  
13" Reel inner diameter  
7" Reel outside diameter  
7" Reel inner diameter  
Feed hole diameter  
Sprocket hole position  
Punch hole position  
Punch hole pitch  
D
330.00  
50.00  
178.00  
62.00  
13.00  
1.75  
D1  
D
D1  
D2  
E
F
5.50  
P
4.00  
Sprocket hole pitch  
Embossment center  
Overall tape thickness  
Tape width  
P0  
P1  
T
4.00  
2.00  
0.23  
W
W1  
12.00  
18.00  
Reel width  
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.  
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-121404  
Issued Date  
2008/02/10  
Revised Date  
2011/11/18  
Revision  
F
Page.  
7
Page 5  
Chip Super Fast Rectifiers  
Formosa MS  
SFM21 THRU SFM28  
Reel packing  
APPROX.  
GROSS WEIGHT  
COMPONENT  
SPACING  
INNER  
BOX  
REEL  
DIA,  
CARTON  
SIZE  
BOX  
(pcs)  
CARTON  
(pcs)  
REEL  
(pcs)  
PACKAGE  
REEL SIZE  
(m/m)  
(m/m)  
(m/m)  
(kg)  
(m/m)  
4.0  
4.0  
178  
330  
160,000  
120,000  
16.0  
14.2  
SMA  
SMA  
7"  
2,000  
7,500  
20,000 183*155*183  
15,000  
382*356*392  
350*330*360  
13"  
337*337*37  
Suggested thermal profiles for soldering processes  
1.Storage environment: Temperature=5oC~40oC Humidity=55% 25%  
2.Reflow soldering of surface-mount devices  
Critical Zone  
TL to TP  
Tp  
TP  
Ramp-up  
TL  
TL  
Tsmax  
Tsmin  
tS  
Preheat  
Ramp-down  
25  
t25oC to Peak  
Time  
3.Reflow soldering  
Profile Feature  
Soldering Condition  
Average ramp-up rate(TL to TP)  
<3oC/sec  
Preheat  
-Temperature Min(Tsmin)  
-Temperature Max(Tsmax)  
-Time(min to max)(ts)  
150oC  
200oC  
60~120sec  
Tsmax to TL  
-Ramp-upRate  
<3oC/sec  
Time maintained above:  
-Temperature(TL)  
-Time(tL)  
217oC  
60~260sec  
Peak Temperature(TP)  
255oC-0/+5oC  
Time within 5oC of actual Peak  
Temperature(tP)  
10~30sec  
Ramp-down Rate  
<6oC/sec  
Time 25oC to Peak Temperature  
<6minutes  
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-121404  
Issued Date  
2008/02/10  
Revised Date  
2011/11/18  
Revision  
F
Page.  
7
Page 6  
Chip Super Fast Rectifiers  
Formosa MS  
SFM21 THRU SFM28  
High reliability test capabilities  
Item Test  
Conditions  
at 260 5OC for 10 2sec.  
immerse body into solder 1/16" 1/32"  
Reference  
1. Solder Resistance  
MIL-STD-750D  
METHOD-2031  
at 245 5OC for 5 sec.  
2. Solderability  
MIL-STD-202F  
METHOD-208  
VR=80% rate at TJ=150OC for 168 hrs.  
Rated average rectifier current at TA=25OC for 500hrs.  
3. High Temperature Reverse Bias  
4. Forward Operation Life  
5. Intermittent Operation Life  
6. Pressure Cooker  
MIL-STD-750D  
METHOD-1038  
MIL-STD-750D  
METHOD-1027  
TA = 25OC, IF = IO  
MIL-STD-750D  
METHOD-1036  
On state: power on for 5 min.  
off state: power off for 5 min.  
on and off for 500 cycles.  
JESD22-A102  
15PSIG at TA=121OC for 4 hrs.  
MIL-STD-750D  
METHOD-1051  
-55OC to +125OC dwelled for 30 min.  
and transferred for 5min. total 10 cycles.  
7. Temperature Cycling  
8. Forward Surge  
MIL-STD-750D  
METHOD-4066-2  
8.3ms single half sine-wave , one surge.  
at TA=85OC, RH=85% for 1000hrs.  
at 175OC for 1000 hrs.  
MIL-STD-750D  
METHOD-1021  
9. Humidity  
MIL-STD-750D  
METHOD-1031  
10. High Temperature Storage Life  
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-121404  
Issued Date  
2008/02/10  
Revised Date  
2011/11/18  
Revision  
F
Page.  
7
Page 7  

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