MP3V5050VC6U [FREESCALE]

High Temperature Accuracy Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated; 高温度精度集成硅压力传感器片上信号调节，温度补偿和校准


型号：	MP3V5050VC6U
厂家：	Freescale
描述：	High Temperature Accuracy Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated 高温度精度集成硅压力传感器片上信号调节，温度补偿和校准传感器压力传感器温度补偿
文件：	总8页 (文件大小：92K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MP3V5050V

Rev 1, 10/2008

Freescale Semiconductor

Technical Data

High Temperature Accuracy

Integrated Silicon Pressure Sensor

On-Chip Signal Conditioned,

Temperature Compensated and

Calibrated

The MP3V5050V sensor integrates on-chip, bipolar op amp circuitry and thin

film resistor networks to provide a high output signal and temperature

compensation. The small form factor and high reliability of on-chip integration

make the Freescale Semiconductor, Inc. pressure sensor a logical and

economical choice for the system designer.

MP3V5050V

Series

INTEGRATED

PRESSURE SENSOR

–50 to 0 kPa (–7.25 to 0 psi)

0.12 to 2.8 Volts Output

SMALL OUTLINE PACKAGE

The MP3V5050V piezoresistive transducer is a state-of-the-art, monolithic,

signal conditioned, silicon pressure sensor. This sensor combines advanced

micromachining techniques, thin film metallization, and bipolar semiconductor

processing to provide an accurate, high level analog output signal that is

proportional to applied pressure.

Figure 1 shows a block diagram of the internal circuitry integrated on a

pressure sensor chip.

Features

MP3V5050VC6T1

CASE 482A-01

•

2.5% Maximum Error over 0° to 85°C

Ideally suited for Microprocessor or Microcontroller-Based Systems

Temperature Compensated from Over –40° to +125°C

Patented Silicon Shear Stress Strain Gauge

PIN NUMBER⁽¹⁾

Durable Thermoplastic (PPS) Surface Mount Package

Easy-to-Use Chip Carrier Option

N/C

V_S

N/C

Ideal for Automotive and Non-Automotive Applications

Typical Applications

Vacuum Pump Monitoring

GND

V_OUT

N/C

•

ORDERING INFORMATION

1. Pins 1, 5, 6, 7, and 8 are internal device

connections. Do not connect to external

circuitry or ground. Pin 1 is noted by the

notch in the lead.

Device

Type

Case

No.

MPX Series

Order No.

Packing

Options

Device Marking

Ported

Vacuum,

482A MP3V5050VC6T1 Tape & Reel MP3V5050V

Element Axial Port

Ported Vaccum,

Element Axial Port

482A MP3V5050VC6U

Rail

MP3V5050V

V_S

Gain Stage #2

and

Ground

Reference

Shift Circuitry

Thin Film

Temperature

Compensation

and

Sensing

Element

V_out

Gain Stage #1

Pins 1, 5, 6, 7, and 8 are NO CONNECTS

GND

MP3V5050V

Sensors

Freescale Semiconductor

Figure 1. Fully Integrated Pressure Sensor Schematic

Table 1. Maximum Ratings⁽¹⁾

Rating

Symbol

Value

Units

Maximum Pressure (P1 > P2)

Storage Temperature

P_max

200

kPa

T_stg

T_A

–40° to +125°

°C

Operating Temperature

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Table 2. Operating Characteristics (V_S= 3.0 Vdc, T_A= 25°C unless otherwise noted, P1 > P2.)

Characteristic

Symbol

Min

Typ

Max

Unit

Pressure Range

P_OP

–50

—

kPa

Vdc

Supply Voltage⁽¹⁾

Supply Current

V_S

I_o

2.7

—

3.0

7.0

2.8

3.3

mAdc

Vdc

Full Scale Output⁽²⁾

@ V_S= 3.0 Volts

(0 to 85°C)

(P_diff= 0 kPa)

V_FSO

2.7

2.9

Full Scale Span⁽³⁾

@ V_S= 3.0 Volts

(0 to 85°C)

V_FSS

—

2.7

—

Vdc

Accuracy⁽⁴⁾

Sensitivity

—

±2.5

%V_FSS

V/P

t_R

—

—-

mV/kPa

Response Time⁽⁵⁾

Warm-Up Time⁽⁶⁾

Offset Stability⁽⁷⁾

Pressure Offset⁽⁸⁾

1.0

—

—-

%V_FSS

Vdc

±0.5

0.12

V_off

0.06

0.19

(0 to 85°C)

1. Device is ratiometric within this specified excitation range.

2. Full Scale Output (V_FSO) is defined as the output voltage at the maximum or full rated pressure.

3. Full Scale Span (V_FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the

minimum rated pressure.

4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span

at 25°C due to all sources of errors, including the following:

• Linearity:

Output deviation from a straight line relationship with pressure over the specified pressure range.

• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to

and from the minimum or maximum operating temperature points, with zero differential pressure applied.

• Pressure Hysteresis:

Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum

or maximum rated pressure at 25°C.

• TcSpan:

• TcOffset:

Output deviation over the temperature range of 0° to 85°C, relative to 25°C.

Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.

5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a

specified step change in pressure.

6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.

7. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

8. Offset (V_off) is defined as the output voltage at the minimum rated pressure.

MP3V5050V

Sensors

Freescale Semiconductor

+3 V

FLUOROSILICONE

GEL DIE COAT

STAINLESS

STEEL CAP

DIE

OUTPUT

V_out

WIRE BOND

THERMOPLASTIC

CASE

V_s

LEAD

FRAME

IPS

GND

1.0 µF

470 pF

0.01 µF

DIFFERENTIAL SENSING ELEMENT

DIE BOND

Figure 3. Typical Application Circuit

(Output Source Current Operation)

Figure 2. Cross-Sectional Diagram

(not to scale)

TRANSFER FUNCTION MP3V5050VC6T1

Transfer Function:

_out= V x (0.018 x P + 0.94) ± (PE x TM x 0.018 x V_s

)

V_s= 3.0 ± 0.30 Vdc

PE = 1.25

TM = 1

Temperature = 0 to 85°C

TYPICAL

MAX

MIN

–50

–40

–30

Pressure (kPa)

–20

–10

Offset

(Typ)

Figure 4. Output versus Differential Pressure

Figure 4 shows the sensor output signal relative to

pressure input. Typical minimum and maximum output

curves are shown for operation over 0 to 85°C temperature

range. The output will saturate outside of the rated pressure

range.

be transmitted to the silicon diaphragm. The MP3V5050V

pressure sensor operating characteristics, internal reliability

and qualification tests are based on use of dry air as the

pressure media. Media other than dry air may have adverse

effects on sensor performance and long-term reliability.

Contact the factory for information regarding media

compatibility in your application.

A fluorosilicone gel isolates the die surface and wire bonds

from the environment, while allowing the pressure signal to

MP3V5050V

Sensors

Freescale Semiconductor

Transfer Function (MP3V5050VC6T1

Nominal Transfer Value: V_out= V_Sx (0.018 x P + 0.94)

± (Pressure Error x Temp Multi x 0.018 x V_S)

_S= 3.0 ± 0.3 V

Temperature Error Band

MP3V5050V

4.0

Break Points

Temp

Multiplier

3.0

–40

0 to 85

+125

Temperature

Error

Factor

2.0

1.0

0.0

–40

–20

100

120

140

Temperature in °C

NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C.

Pressure Error Band

MPXV5050V

Error Limits for Pressure

1.25

1.00

0.75

Pressure (in kPa)

–50

–40

–30

–20

–10

–0.75

–1.00

–1.25

Pressure

–50 to 0 kPa

Error (Max)

±1.25 kPa

MP3V5050V

Sensors

Freescale Semiconductor

MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE

Surface mount board layout is a critical portion of the total

solder reflow process. It is always recommended to fabricate

boards with a solder mask layer to avoid bridging and/or

shorting between solder pads, especially on tight tolerances

and/or tight layouts.

design. The footprint for the semiconductor package must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct pad

geometry, the packages will self-align when subjected to a

0.100 TYP

2.54

0.660

16.76

0.060 TYP 8X

1.52

0.300

7.62

inch

0.100 TYP 8X

2.54

Figure 5. SOP Footprint (Case 482A)

MP3V5050V

Sensors

Freescale Semiconductor

PACKAGE DIMENSIONS

-A-

D ^{8 PL}

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

0.25 (0.010)

-B-

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.

INCHES

MIN MAX

MILLIMETERS

DIM

MIN

10.54

12.70

0.96

MAX

10.79

13.21

1.07

0.415 0.425

0.500 0.520

0.038 0.042

0.100 BSC

2.54 BSC

0.002 0.010

0.009 0.011

0.061 0.071

0.05

0.23

1.55

0˚

0.25

0.28

1.80

7˚

0˚

7˚

0.444 0.448

0.709 0.725

0.245 0.255

0.115 0.125

11.28

18.01

6.22

2.92

11.38

18.41

6.48

3.17

-T-

SEATING

PLANE

PIN 1 IDENTIFIER

CASE 482A-01

ISSUE A

SMALL OUTLINE PACKAGE

MP3V5050V

Sensors

Freescale Semiconductor

NOTES

MP3V5050V

Sensors

Freescale Semiconductor

How to Reach Us:

Home Page:

www.freescale.com

Web Support:

http://www.freescale.com/support

USA/Europe or Locations Not Listed:

Freescale Semiconductor, Inc.

Technical Information Center, EL516

2100 East Elliot Road

Tempe, Arizona 85284

1-800-521-6274 or +1-480-768-2130

www.freescale.com/support

Europe, Middle East, and Africa:

Freescale Halbleiter Deutschland GmbH

Technical Information Center

Schatzbogen 7

81829 Muenchen, Germany

+44 1296 380 456 (English)

+46 8 52200080 (English)

+49 89 92103 559 (German)

+33 1 69 35 48 48 (French)

www.freescale.com/support

Information in this document is provided solely to enable system and software

implementers to use Freescale Semiconductor products. There are no express or

implied copyright licenses granted hereunder to design or fabricate any integrated

circuits or integrated circuits based on the information in this document.

Freescale Semiconductor reserves the right to make changes without further notice to

any products herein. Freescale Semiconductor makes no warranty, representation or

guarantee regarding the suitability of its products for any particular purpose, nor does

Freescale Semiconductor assume any liability arising out of the application or use of any

product or circuit, and specifically disclaims any and all liability, including without

limitation consequential or incidental damages. “Typical” parameters that may be

provided in Freescale Semiconductor data sheets and/or specifications can and do vary

in different applications and actual performance may vary over time. All operating

parameters, including “Typicals”, must be validated for each customer application by

customer’s technical experts. Freescale Semiconductor does not convey any license

under its patent rights nor the rights of others. Freescale Semiconductor products are

not designed, intended, or authorized for use as components in systems intended for

surgical implant into the body, or other applications intended to support or sustain life,

or for any other application in which the failure of the Freescale Semiconductor product

could create a situation where personal injury or death may occur. Should Buyer

purchase or use Freescale Semiconductor products for any such unintended or

unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and

its officers, employees, subsidiaries, affiliates, and distributors harmless against all

claims, costs, damages, and expenses, and reasonable attorney fees arising out of,

directly or indirectly, any claim of personal injury or death associated with such

unintended or unauthorized use, even if such claim alleges that Freescale

Japan:

Freescale Semiconductor Japan Ltd.

Headquarters

ARCO Tower 15F

1-8-1, Shimo-Meguro, Meguro-ku,

Tokyo 153-0064

Japan

0120 191014 or +81 3 5437 9125

support.japan@freescale.com

Asia/Pacific:

Freescale Semiconductor China Ltd.

Exchange Building 23F

No. 118 Jianguo Road

Chaoyang District

Beijing 100022

China

+86 010 5879 8000

support.asia@freescale.com

Semiconductor was negligent regarding the design or manufacture of the part.

For Literature Requests Only:

Freescale Semiconductor Literature Distribution Center

P.O. Box 5405

Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.

All other product or service names are the property of their respective owners.

Denver, Colorado 80217

1-800-441-2447 or +1-303-675-2140

MP3V5050V

Rev. 1

10/2008

MP3V5050VC6U [FREESCALE]

相关型号：

MP3V5050_09

MP3V5100

MP3V5100GC6T1

MP3V5100GC6U

MP3V5100GP

MP3V7007

MP3V7007DP

MP3V7007GC6T1

MP3V7007GC6U

MP3V7007GP

MP4

MP4