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MPX5700DP [FREESCALE]

Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated; 集成硅压力传感器片上信号调节，温度补偿和校准
MPX5700DP
型号： MPX5700DP
厂家： Freescale    Freescale
描述：

Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
集成硅压力传感器片上信号调节，温度补偿和校准

传感器 换能器 压力传感器 温度补偿
文件： 总9页 (文件大小：250K)
中文：  中文翻译
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MPX5700  
Rev 8, 01/2007  
Freescale Semiconductor  
Technical Data  
Integrated Silicon Pressure Sensor  
On-Chip Signal Conditioned,  
Temperature Compensated and  
Calibrated  
MPX5700  
SERIES  
INTEGRATED  
PRESSURE SENSOR  
0 to 700 kPa (0 to 101.5 psi)  
15 to 700 kPa (2.18 to 101.5 psi)  
0.2 to 4.7 V OUTPUT  
The MPX5700 series piezoresistive transducer is a state-of-the-art monolithic  
silicon pressure sensor designed for a wide range of applications, but particularly  
those employing a microcontroller or microprocessor with A/D inputs. This  
patented, single element transducer combines advanced micromachining  
techniques, thin-film metallization, and bipolar processing to provide an accurate,  
high level analog output signal that is proportional to the applied pressure.  
Features  
•
•
•
•
•
2.5% Maximum Error over 0° to 85°C  
Ideally Suited for Microprocessor or Microcontroller-Based Systems  
Available in Absolute, Differential and Gauge Configurations  
Patented Silicon Shear Stress Strain Gauge  
MPX5700D  
CASE 867-08  
Durable Epoxy Unibody Element  
ORDERING INFORMATION  
MPX Series  
Device  
Type  
Case  
Type  
Options  
Order Number Device Marking  
Basic  
Element  
Differential  
867  
867  
MPX5700D  
MPX5700A  
MPX5700D  
MPX5700A  
MPX5700DP  
MPX5700GP  
MPX5700D  
MPX5700AP  
MPX5700A  
MPX5700AP  
CASE 867B-04  
Absolute  
Ported  
Elements  
Differential Dual Ports  
Gauge  
867C  
867B  
867E  
867B  
867E  
867F  
MPX5700DP  
MPX5700GP  
MPX5700GS  
MPX5700AP  
MPX5700AS  
Gauge, Axial  
Absolute  
MPX5700DP  
CASE 867C-05  
Absolute, Axial  
Absolute, Axial PC Mount  
MPX5700ASX MPX5700A  
MPX5700AS  
CASE 867E-03  
VS  
Gain Stage #2  
and  
Ground  
Reference  
Thin Film  
Temperature  
Compensation  
and  
MPX5700ASX  
CASE 867F-03  
Sensing  
Element  
Vout  
Shift Circuitry  
Gain Stage #1  
PIN NUMBERS  
1
2
3
Vout  
GND  
VS  
4
5
6
N/C  
N/C  
N/C  
Pins 4, 5, and 6 are no connects  
GND  
NOTE: Pins 4, 5, and 6 are internal device  
connections. Do not connect to external  
circuitry or ground. Pin 1 is noted by the  
notch in the lead.  
Figure 1. Fully Integrated Pressure Sensor Schematic  
© Freescale Semiconductor, Inc., 2007. All rights reserved.  
Table 1. Maximum Ratings(1)  
Parametrics  
Symbol  
P1max  
Tstg  
Value  
Unit  
kPa  
°C  
Maximum Pressure(2) (P2 ≤ 1 Atmosphere)  
2800  
Storage Temperature  
–40 to +125  
–40 to +125  
Operating Temperature  
TA  
°C  
1. Maximum Ratings apply to Case 867 only. Extended exposure at the specified limits may cause permanent damage or degradation to the  
device.  
2. This sensor is designed for applications where P1 is always greater than, or equal to P2. P2 maximum is 500 kPa.  
Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in  
Figure 4 required to meet electrical specifications.)  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Pressure Range(1)  
Gauge, Differential: MPX5700D  
Absolute: MPX5700A  
POP  
0
15  
—
—
700  
700  
kPa  
Supply Voltage(2)  
Supply Current  
VS  
IO  
4.75  
—
5.0  
7.0  
5.25  
10  
Vdc  
mAdc  
Vdc  
Zero Pressure Offset(3)  
Gauge, Differential (0 to 85°C)  
Absolute (0 to 85°C)  
Voff  
0.088  
0.184  
0.2  
—
0.313  
0.409  
Full Scale Output(4)  
Full Scale Span(5)  
Accuracy(6)  
(0 to 85°C)  
(0 to 85°C)  
(0 to 85°C)  
VFSO  
VFSS  
—
4.587  
—
4.7  
4.5  
—
4.813  
—
Vdc  
Vdc  
—
±2.5  
—-  
%VFSS  
mV/kPa  
ms  
Sensitivity  
V/P  
tR  
—
6.4  
1.0  
0.1  
20  
Response Time(7)  
—
—-  
Output Source Current at Full Scale Output  
Warm-Up Time(8)  
IO+  
—
—
—-  
mAdc  
ms  
—
—-  
1. 1.0 kPa (kiloPascal) equals 0.145 psi.  
2. Device is ratiometric within this specified excitation range.  
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.  
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.  
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at  
the minimum rated pressure.  
6. Accuracy (error budget) consists of the following:  
•
•
Linearity:  
Temperature Hysteresis:  
Output deviation from a straight line relationship with pressure over the specified pressure range.  
Output deviation at any temperature within the operating temperature range, after the temperature is  
cycled to and from the minimum or maximum operating temperature points, with zero differential  
pressure applied.  
•
Pressure Hysteresis:  
Output deviation at any pressure within the specified range, when this pressure is cycled to and from  
the minimum or maximum rated pressure, at 25°C.  
•
•
TcSpan:  
TcOffset:  
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.  
Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C,  
relative to 25°C.  
•
Variation from Nominal:  
The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.  
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to  
a specified step change in pressure.  
8. Warm-up Time is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized.  
Table 3. Mechanical Characteristics  
Characteristics  
Typ  
Unit  
Weight, Basic Element (Case 867)  
4.0  
grams  
MPX5700  
Sensors  
Freescale Semiconductor  
2
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING  
Figure 3 illustrates both the Differential/Gauge and the  
Absolute Sensing Chip in the basic chip carrier (Case 867).  
A fluorosilicone gel isolates the die surface and wire bonds  
from the environment, while allowing the pressure signal to  
be transmitted to the sensor diaphragm. (For use of the  
MPX5700D in a high-pressure cyclic application, consult the  
factory.)  
The MPX5700 series pressure sensor operating  
characteristics, and internal reliability and qualification tests  
are based on use of dry air as the pressure media. Media,  
other than dry air, may have adverse effects on sensor  
performance and long-term reliability. Contact the factory for  
information regarding media compatibility in your application.  
Figure 2 shows the sensor output signal relative to  
pressure input. Typical, minimum, and maximum output  
curves are shown for operation over a temperature range of  
0° to 85°C using the decoupling circuit shown in Figure 4. The  
output will saturate outside of the specified pressure range.  
Figure 4 shows the recommended decoupling circuit for  
interfacing the output of the integrated sensor to the A/D input  
of a microprocessor or microcontroller. Proper decoupling of  
the power supply is recommended.  
5.0  
Transfer Function:  
4.5  
V
V
out = VS*(0.0012858*P+0.04) ± Error  
S = 5.0 Vdc  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
Temperature = 0 to 85°C  
Typical  
Maximum  
Minimum  
200  
400  
500  
600  
700  
800  
0
100  
300  
Differential Pressure (kPa)  
Figure 2. Output versus Pressure Differential  
Fluoro Silicone  
Die Coat  
Fluoro Silicone  
Stainless Steel  
Metal Cover  
Stainless Steel  
Metal Cover  
Die Coat  
Die  
Die  
P1  
P2  
P1  
P2  
Wire Bond  
Wire Bond  
Lead Frame  
Lead Frame  
RTV Die  
Bond  
RTV Die  
Bond  
Epoxy Case  
Epoxy Case  
DIFFERENTIAL/GAUGE ELEMENT  
ABSOLUTE ELEMENT  
Figure 3. Cross-Sectional Diagrams (not to scale)  
+5 V  
Output  
Vout  
Vs  
IPS  
1.0 µF  
GND  
470 pF  
0.01 µF  
Figure 4. Recommended Power Supply Decoupling and Output Filtering  
(For additional output filtering, please refer to Application Note AN1646)  
MPX5700  
Sensors  
Freescale Semiconductor  
3
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE  
Freescale designates the two sides of the pressure sensor pressure sensor is designed to operate with positive  
as the Pressure (P1) side and the Vacuum (P2) side. The  
Pressure (P1) side is the side containing fluoro silicone gel  
which protects the die from harsh media. The Freescale MPX  
differential pressure applied, P1 > P2.  
The Pressure (P1) side may be identified by using the  
table below:  
Pressure (P1)  
Side Identifier  
Part Number  
Case Type  
MPX5700D, MPX5700A  
MPX5700DP  
867  
Stainless Steel Cap  
867C  
867B  
867E  
867F  
Side with Part Marking  
Side with Port Attached  
Side with Port Attached  
Side with Port Attached  
MPX5700GP, MPX5700AP  
MPX5700GS, MPX5700AS  
MPX5700ASX  
MPX5700  
Sensors  
4
Freescale Semiconductor  
PACKAGE DIMENSIONS  
C
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
R
POSITIVE PRESSURE  
(P1)  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD  
STOP RING. MOLD STOP RING NOT TO EXCEED  
16.00 (0.630).  
M
B
-A-  
INCHES  
DIM MIN MAX MIN  
MILLIMETERS  
N
L
MAX  
16.00  
13.56  
5.59  
A
B
C
D
F
0.595  
0.630 15.11  
0.534 13.06  
PIN 1  
1
2
3
4
5
6
0.514  
0.200  
0.027  
0.048  
SEATING  
PLANE  
-T-  
0.220  
0.033  
0.064  
5.08  
0.68  
1.22  
0.84  
1.63  
G
J
S
G
J
L
M
N
R
S
0.100 BSC  
2.54 BSC  
F
0.014  
0.695  
0.016 0.36  
0.725 17.65  
0.40  
18.42  
D 6 PL  
0.136 (0.005)  
30˚ NOM  
30˚ NOM  
M
M
T A  
0.475  
0.430  
0.090  
0.495 12.07  
0.450 10.92  
12.57  
11.43  
2.66  
0.105  
2.29  
STYLE 1:  
PIN 1. VOUT  
2. GROUND  
STYLE 2:  
PIN 1. OPEN  
2. GROUND  
STYLE 3:  
PIN 1. OPEN  
2. GROUND  
3. VCC  
4. V1  
5. V2  
3. -VOUT  
4. VSUPPLY  
5. +VOUT  
6. OPEN  
3. +VOUT  
4. +VSUPPLY  
5. -VOUT  
6. VEX  
6. OPEN  
CASE 867-08  
ISSUE N  
BASIC ELEMENT  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: INCH.  
P
0.25 (0.010)  
-A-  
U
W
M
M
T Q  
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
29.08  
17.40  
10.29  
0.68  
MAX  
29.85  
18.16  
11.05  
0.84  
X
A
B
C
D
F
1.145  
0.685  
0.405  
0.027  
0.048  
1.175  
0.715  
0.435  
0.033  
0.064  
L
V
R
PORT #1  
POSITIVE  
PRESSURE  
(P1)  
PORT #2 VACUUM (P2)  
1.22  
1.63  
PORT #1 POSITIVE  
PRESSURE (P1)  
G
J
K
L
N
P
Q
R
S
U
V
W
X
0.100 BSC  
2.54 BSC  
N
0.014  
0.695  
0.290  
0.420  
0.153  
0.153  
0.063  
0.220  
0.016  
0.725  
0.300  
0.440  
0.159  
0.159  
0.083  
0.240  
0.36  
17.65  
7.37  
10.67  
3.89  
3.89  
1.60  
5.59  
0.41  
18.42  
7.62  
11.18  
4.04  
4.04  
2.11  
6.10  
-Q-  
PORT #2  
VACUUM  
(P2)  
B
PIN 1  
0.910 BSC  
23.11 BSC  
K
1
2
3
4
5
6
0.182  
0.310  
0.248  
0.194  
0.330  
0.278  
4.62  
7.87  
6.30  
4.93  
8.38  
7.06  
C
S
SEATING  
PLANE  
SEATING  
PLANE  
-T-  
-T-  
6 PL  
D
STYLE 1:  
PIN 1. VOUT  
2. GROUND  
G
J
M
M
0.13 (0.005)  
A
F
3. VCC  
4. V1  
5. V2  
6. VEX  
CASE 867C-05  
ISSUE F  
PRESSURE AND VACUUM SIDES PORTED (DP)  
MPX5700  
Sensors  
Freescale Semiconductor  
5
PACKAGE DIMENSIONS  
PAGE 1 OF 2  
CASE 867B-04  
ISSUE G  
PRESSURE SIDE PORTED (AP, GP)  
MPX5700  
Sensors  
Freescale Semiconductor  
6
PACKAGE DIMENSIONS  
PAGE 2 OF 2  
CASE 867B-04  
ISSUE G  
PRESSURE SIDE PORTED (AP, GP)  
MPX5700  
Sensors  
Freescale Semiconductor  
7
PACKAGE DIMENSIONS  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
A
C
2. CONTROLLING DIMENSION: INCH.  
INCHES  
DIM MIN MAX  
0.720 17.53  
0.255 6.22  
0.820 19.81  
MILLIMETERS  
MIN  
MAX  
18.28  
6.48  
A
B
C
D
E
F
0.690  
0.245  
0.780  
0.027  
0.178  
0.048  
-B-  
V
20.82  
0.84  
4.72  
PIN 1  
0.033  
0.186  
0.064  
0.69  
4.52  
1.22  
1.63  
PORT #1  
POSITIVE  
PRESSURE  
(P1)  
6
5
4
3
2
1
G
J
K
N
S
V
0.100 BSC  
2.54 BSC  
0.014  
0.345  
0.300  
0.220  
0.182  
0.016  
0.375  
0.310  
0.240  
0.194  
0.36  
8.76  
7.62  
5.59  
4.62  
0.41  
9.53  
7.87  
6.10  
4.93  
K
S
J
G
F
STYLE 1:  
PIN 1. VOUT  
N
E
D 6 PL  
2. GROUND  
3. VCC  
4. V1  
5. V2  
6. VEX  
-T-  
M
M
0.13 (0.005)  
T B  
CASE 867E-03  
ISSUE D  
PRESSURE SIDE PORTED (AS, GS)  
-T-  
NOTES:  
C
A
U
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
E
-Q-  
B
INCHES  
MILLIMETERS  
DIM MIN MAX  
MIN  
27.43  
18.80  
16.00  
0.68  
MAX  
28.45  
19.30  
16.51  
0.84  
A
B
C
D
E
F
1.080 1.120  
0.740 0.760  
0.630 0.650  
0.027 0.033  
0.160 0.180  
0.048 0.064  
0.100 BSC  
N
V
4.06  
1.22  
4.57  
1.63  
G
J
2.54 BSC  
R
0.014 0.016  
0.220 0.240  
0.070 0.080  
0.150 0.160  
0.150 0.160  
0.440 0.460  
0.695 0.725  
0.840 0.860  
0.182 0.194  
0.36  
5.59  
0.41  
6.10  
PIN 1  
PORT #1  
POSITIVE  
PRESSURE  
(P1)  
K
N
P
Q
R
S
U
V
1.78  
3.81  
2.03  
4.06  
-P-  
6
5
4
3
2
1
M
M
0.25 (0.010)  
T Q  
3.81  
4.06  
S
11.18  
17.65  
21.34  
4.62  
11.68  
18.42  
21.84  
4.93  
K
6 PL  
J
D
G
STYLE 1:  
PIN 1. VOUT  
M
S
S
Q
0.13 (0.005)  
T P  
2. GROUND  
3. VCC  
4. V1  
5. V2  
6. VEX  
F
CASE 867F-03  
ISSUE D  
PRESSURE SIDE AXIAL PORT (ASX)  
MPX5700  
Sensors  
Freescale Semiconductor  
8
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© Freescale Semiconductor, Inc. 2007. All rights reserved.  
MPX5700  
Rev. 8  
01/2007  

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MPX5700GVSX

 GAGE, PEIZORESISTIVE PRESSURE SENSOR, 0-101.52Psi, 2.5%, 0.20-4.70V, CASE 867G-02, 6 PIN
MOTOROLA

MPX5700_09

 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
FREESCALE

MPX5999

 X-ducer SILICON PRESSURE SENSORS
MOTOROLA
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