MPX5700D [FREESCALE]
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated; 集成硅压力传感器片上信号调节,温度补偿和校准型号: | MPX5700D |
厂家: | Freescale |
描述: | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
文件: | 总9页 (文件大小:250K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MPX5700
Rev 8, 01/2007
Freescale Semiconductor
Technical Data
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
MPX5700
SERIES
INTEGRATED
PRESSURE SENSOR
0 to 700 kPa (0 to 101.5 psi)
15 to 700 kPa (2.18 to 101.5 psi)
0.2 to 4.7 V OUTPUT
The MPX5700 series piezoresistive transducer is a state-of-the-art monolithic
silicon pressure sensor designed for a wide range of applications, but particularly
those employing a microcontroller or microprocessor with A/D inputs. This
patented, single element transducer combines advanced micromachining
techniques, thin-film metallization, and bipolar processing to provide an accurate,
high level analog output signal that is proportional to the applied pressure.
Features
•
•
•
•
•
2.5% Maximum Error over 0° to 85°C
Ideally Suited for Microprocessor or Microcontroller-Based Systems
Available in Absolute, Differential and Gauge Configurations
Patented Silicon Shear Stress Strain Gauge
MPX5700D
CASE 867-08
Durable Epoxy Unibody Element
ORDERING INFORMATION
MPX Series
Device
Type
Case
Type
Options
Order Number Device Marking
Basic
Element
Differential
867
867
MPX5700D
MPX5700A
MPX5700D
MPX5700A
MPX5700DP
MPX5700GP
MPX5700D
MPX5700AP
MPX5700A
MPX5700AP
CASE 867B-04
Absolute
Ported
Elements
Differential Dual Ports
Gauge
867C
867B
867E
867B
867E
867F
MPX5700DP
MPX5700GP
MPX5700GS
MPX5700AP
MPX5700AS
Gauge, Axial
Absolute
MPX5700DP
CASE 867C-05
Absolute, Axial
Absolute, Axial PC Mount
MPX5700ASX MPX5700A
MPX5700AS
CASE 867E-03
VS
Gain Stage #2
and
Ground
Reference
Thin Film
Temperature
Compensation
and
MPX5700ASX
CASE 867F-03
Sensing
Element
Vout
Shift Circuitry
Gain Stage #1
PIN NUMBERS
1
2
3
Vout
GND
VS
4
5
6
N/C
N/C
N/C
Pins 4, 5, and 6 are no connects
GND
NOTE: Pins 4, 5, and 6 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
Figure 1. Fully Integrated Pressure Sensor Schematic
© Freescale Semiconductor, Inc., 2007. All rights reserved.
Table 1. Maximum Ratings(1)
Parametrics
Symbol
P1max
Tstg
Value
Unit
kPa
°C
Maximum Pressure(2) (P2 ≤ 1 Atmosphere)
2800
Storage Temperature
–40 to +125
–40 to +125
Operating Temperature
TA
°C
1. Maximum Ratings apply to Case 867 only. Extended exposure at the specified limits may cause permanent damage or degradation to the
device.
2. This sensor is designed for applications where P1 is always greater than, or equal to P2. P2 maximum is 500 kPa.
Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 4 required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
Gauge, Differential: MPX5700D
Absolute: MPX5700A
POP
0
15
—
—
700
700
kPa
Supply Voltage(2)
Supply Current
VS
IO
4.75
—
5.0
7.0
5.25
10
Vdc
mAdc
Vdc
Zero Pressure Offset(3)
Gauge, Differential (0 to 85°C)
Absolute (0 to 85°C)
Voff
0.088
0.184
0.2
—
0.313
0.409
Full Scale Output(4)
Full Scale Span(5)
Accuracy(6)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
VFSO
VFSS
—
4.587
—
4.7
4.5
—
4.813
—
Vdc
Vdc
—
±2.5
—-
%VFSS
mV/kPa
ms
Sensitivity
V/P
tR
—
6.4
1.0
0.1
20
Response Time(7)
—
—-
Output Source Current at Full Scale Output
Warm-Up Time(8)
IO+
—
—
—-
mAdc
ms
—
—-
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at
the minimum rated pressure.
6. Accuracy (error budget) consists of the following:
•
•
Linearity:
Temperature Hysteresis:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential
pressure applied.
•
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from
the minimum or maximum rated pressure, at 25°C.
•
•
TcSpan:
TcOffset:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C,
relative to 25°C.
•
Variation from Nominal:
The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warm-up Time is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized.
Table 3. Mechanical Characteristics
Characteristics
Typ
Unit
Weight, Basic Element (Case 867)
4.0
grams
MPX5700
Sensors
Freescale Semiconductor
2
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 3 illustrates both the Differential/Gauge and the
Absolute Sensing Chip in the basic chip carrier (Case 867).
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the sensor diaphragm. (For use of the
MPX5700D in a high-pressure cyclic application, consult the
factory.)
The MPX5700 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 4. The
output will saturate outside of the specified pressure range.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
5.0
Transfer Function:
4.5
V
V
out = VS*(0.0012858*P+0.04) ± Error
S = 5.0 Vdc
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Temperature = 0 to 85°C
Typical
Maximum
Minimum
200
400
500
600
700
800
0
100
300
Differential Pressure (kPa)
Figure 2. Output versus Pressure Differential
Fluoro Silicone
Die Coat
Fluoro Silicone
Stainless Steel
Metal Cover
Stainless Steel
Metal Cover
Die Coat
Die
Die
P1
P2
P1
P2
Wire Bond
Wire Bond
Lead Frame
Lead Frame
RTV Die
Bond
RTV Die
Bond
Epoxy Case
Epoxy Case
DIFFERENTIAL/GAUGE ELEMENT
ABSOLUTE ELEMENT
Figure 3. Cross-Sectional Diagrams (not to scale)
+5 V
Output
Vout
Vs
IPS
1.0 µF
GND
470 pF
0.01 µF
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
MPX5700
Sensors
Freescale Semiconductor
3
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor pressure sensor is designed to operate with positive
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The Freescale MPX
differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Pressure (P1)
Side Identifier
Part Number
Case Type
MPX5700D, MPX5700A
MPX5700DP
867
Stainless Steel Cap
867C
867B
867E
867F
Side with Part Marking
Side with Port Attached
Side with Port Attached
Side with Port Attached
MPX5700GP, MPX5700AP
MPX5700GS, MPX5700AS
MPX5700ASX
MPX5700
Sensors
4
Freescale Semiconductor
PACKAGE DIMENSIONS
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
R
POSITIVE PRESSURE
(P1)
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
M
B
-A-
INCHES
DIM MIN MAX MIN
MILLIMETERS
N
L
MAX
16.00
13.56
5.59
A
B
C
D
F
0.595
0.630 15.11
0.534 13.06
PIN 1
1
2
3
4
5
6
0.514
0.200
0.027
0.048
SEATING
PLANE
-T-
0.220
0.033
0.064
5.08
0.68
1.22
0.84
1.63
G
J
S
G
J
L
M
N
R
S
0.100 BSC
2.54 BSC
F
0.014
0.695
0.016 0.36
0.725 17.65
0.40
18.42
D 6 PL
0.136 (0.005)
30˚ NOM
30˚ NOM
M
M
T A
0.475
0.430
0.090
0.495 12.07
0.450 10.92
12.57
11.43
2.66
0.105
2.29
STYLE 1:
PIN 1. VOUT
2. GROUND
STYLE 2:
PIN 1. OPEN
2. GROUND
STYLE 3:
PIN 1. OPEN
2. GROUND
3. VCC
4. V1
5. V2
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. VEX
6. OPEN
CASE 867-08
ISSUE N
BASIC ELEMENT
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
P
0.25 (0.010)
-A-
U
W
M
M
T Q
INCHES
DIM MIN MAX
MILLIMETERS
MIN
29.08
17.40
10.29
0.68
MAX
29.85
18.16
11.05
0.84
X
A
B
C
D
F
1.145
0.685
0.405
0.027
0.048
1.175
0.715
0.435
0.033
0.064
L
V
R
PORT #1
POSITIVE
PRESSURE
(P1)
PORT #2 VACUUM (P2)
1.22
1.63
PORT #1 POSITIVE
PRESSURE (P1)
G
J
K
L
N
P
Q
R
S
U
V
W
X
0.100 BSC
2.54 BSC
N
0.014
0.695
0.290
0.420
0.153
0.153
0.063
0.220
0.016
0.725
0.300
0.440
0.159
0.159
0.083
0.240
0.36
17.65
7.37
10.67
3.89
3.89
1.60
5.59
0.41
18.42
7.62
11.18
4.04
4.04
2.11
6.10
-Q-
PORT #2
VACUUM
(P2)
B
PIN 1
0.910 BSC
23.11 BSC
K
1
2
3
4
5
6
0.182
0.310
0.248
0.194
0.330
0.278
4.62
7.87
6.30
4.93
8.38
7.06
C
S
SEATING
PLANE
SEATING
PLANE
-T-
-T-
6 PL
D
STYLE 1:
PIN 1. VOUT
2. GROUND
G
J
M
M
0.13 (0.005)
A
F
3. VCC
4. V1
5. V2
6. VEX
CASE 867C-05
ISSUE F
PRESSURE AND VACUUM SIDES PORTED (DP)
MPX5700
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 867B-04
ISSUE G
PRESSURE SIDE PORTED (AP, GP)
MPX5700
Sensors
Freescale Semiconductor
6
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 867B-04
ISSUE G
PRESSURE SIDE PORTED (AP, GP)
MPX5700
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
A
C
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
0.720 17.53
0.255 6.22
0.820 19.81
MILLIMETERS
MIN
MAX
18.28
6.48
A
B
C
D
E
F
0.690
0.245
0.780
0.027
0.178
0.048
-B-
V
20.82
0.84
4.72
PIN 1
0.033
0.186
0.064
0.69
4.52
1.22
1.63
PORT #1
POSITIVE
PRESSURE
(P1)
6
5
4
3
2
1
G
J
K
N
S
V
0.100 BSC
2.54 BSC
0.014
0.345
0.300
0.220
0.182
0.016
0.375
0.310
0.240
0.194
0.36
8.76
7.62
5.59
4.62
0.41
9.53
7.87
6.10
4.93
K
S
J
G
F
STYLE 1:
PIN 1. VOUT
N
E
D 6 PL
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
-T-
M
M
0.13 (0.005)
T B
CASE 867E-03
ISSUE D
PRESSURE SIDE PORTED (AS, GS)
-T-
NOTES:
C
A
U
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
E
-Q-
B
INCHES
MILLIMETERS
DIM MIN MAX
MIN
27.43
18.80
16.00
0.68
MAX
28.45
19.30
16.51
0.84
A
B
C
D
E
F
1.080 1.120
0.740 0.760
0.630 0.650
0.027 0.033
0.160 0.180
0.048 0.064
0.100 BSC
N
V
4.06
1.22
4.57
1.63
G
J
2.54 BSC
R
0.014 0.016
0.220 0.240
0.070 0.080
0.150 0.160
0.150 0.160
0.440 0.460
0.695 0.725
0.840 0.860
0.182 0.194
0.36
5.59
0.41
6.10
PIN 1
PORT #1
POSITIVE
PRESSURE
(P1)
K
N
P
Q
R
S
U
V
1.78
3.81
2.03
4.06
-P-
6
5
4
3
2
1
M
M
0.25 (0.010)
T Q
3.81
4.06
S
11.18
17.65
21.34
4.62
11.68
18.42
21.84
4.93
K
6 PL
J
D
G
STYLE 1:
PIN 1. VOUT
M
S
S
Q
0.13 (0.005)
T P
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
F
CASE 867F-03
ISSUE D
PRESSURE SIDE AXIAL PORT (ASX)
MPX5700
Sensors
Freescale Semiconductor
8
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MPX5700
Rev. 8
01/2007
相关型号:
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Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
FREESCALE
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MPX5700GP1
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
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MPX5700GS
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
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