MPXA6400A [FREESCALE]
High Temperature Accuracy Integrated Silicon Pressure Sensor; 高温度精度集成硅压力传感器
| 型号： | MPXA6400A |
| 厂家： | 
Freescale |
| 描述： | High Temperature Accuracy Integrated Silicon Pressure Sensor |
| 文件： | 总11页 (文件大小：183K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Pressure
MPXH6400A
Rev 4, 11/2009
Freescale Semiconductor
High Temperature Accuracy
Integrated Silicon Pressure Sensor
for Measuring Absolute Pressure,
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
MPXA6400A
MPXH6400A
MPXHZ6400A
Series
20 to 400 kPa (3.0 to 58 psi)
0.2 to 4.8 V Output
The Freescale MPXxx6400A series sensor integrates on-chip, bipolar op amp
circuitry and thin film resistor networks to provide a high output signal and
temperature compensation. The small form factor and high reliability of on-chip
integration make the Freescale pressure sensor a logical and economical choice
for the system designer.
Application Examples
• Industrial Controls
• Engine Control/Manifold Absolute
Pressure (MAP)/Liquefied Petroleum
Gas (LPG)
The MPXxx6400A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output signal
that is proportional to applied pressure.
Features
• Improved Accuracy at High Temperature
• Available in Small and Super Small Outline Packages
• 1.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller-Based Systems
• Temperature Compensated from -40° to +125°C
• Durable Thermoplastic (PPS) Surface Mount Package
ORDERING INFORMATION
# of Ports
Single
Pressure Type
Device
Gauge Differential Absolute
Package
Options
Case
No.
Device Name
Marking
None
Dual
Small Outline Package (MPXA6400A Series)
MPXA6400AP Tray 1369
Super Small Outline Package (MPXH6400A Series)
MPXA6400A
•
•
MPXH6400A
MPXH6400A
MPXH6400AC6U
MPXH6400AC6T1
Rails
1317A
1317A
•
•
•
•
Tape and Reel
Super Small Outline Package (Media Resistant Gel) (MPXHZ6400A Series)
MPXHZ6400AC6T1 Tape and Reel 1317A
MPXHZ6400A
•
•
SUPER SMALL OUTLINE PACKAGE
SMALL OUTLINE PACKAGE
MPXH6400AC6U/C6T1
MPXHZ6400AC6T1
CASE 1317A-04
MPXA6400AP
CASE 1369-01
© Freescale Semiconductor, Inc., 2007-2009. All rights reserved.
Pressure
OPERATING CHARACTERISTICS
(VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Pressure Range
Symbol
POP
VS
Min
20
Typ
—
Max
400
Unit
kPa
Supply Voltage(1)
4.64
—
5.0
6.0
0.2
5.36
10
Vdc
Supply Current
Io
mAdc
Vdc
Minimum Pressure Offset
@ VS = 5.0 Volts(2)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
Voff
0.133
0.267
Full Scale Output
VFSO
4.733
4.467
4.8
4.6
4.866
4.733
Vdc
Vdc
@ VS = 5.0 Volts(3)
Full Scale Span
VFSS
@ VS = 5.0 Volts(4)
Accuracy(5)
—
V/P
tR
—
—
—
—
—
—
12.1
1.0
±1.5
—
%VFSS
mV/kPa
ms
Sensitivity
Response Time(6)
Warm-Up Time(7)
Offset Stability(8)
—
—
20
—
ms
—
±0.25
—
%VFSS
1. Device is ratiometric within this specified excitation range.
2. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25°C due to all sources of error including the following:
Linearity:Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or
maximum rated pressure, at 25°C.
TcSpan: Output deviation over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXH6400A
Sensors
2
Freescale Semiconductor
Pressure
MAXIMUM RATINGS(1)
Rating
Symbol
PMAX
TSTG
TA
Value
1600
Unit
kPa
°C
Maximum Pressure (P1 > P2)
Storage Temperature
-40° to +125°
-40° to +125°
0.5
Operating Temperature
°C
Output Source Current @ Full Scale Output(2)
Output Sink Current @ Minimum Pressure Offset(2)
Io+
mAdc
mAdc
Io-
-0.5
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2. Maximum Output Current is controlled by effective impedance from Vout to GND or Vout to VS in the application circuit.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
2
VS
Thin Film
Temperature
Compensation
and
Gain Stage #2
and
Ground
Reference
Shift Circuitry
4
Vout
Sensing
Element
Gain Stage #1
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for small outline package and super small
outline package devices.
3
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
MPXH6400A
Sensors
Freescale Semiconductor
3
Pressure
Figure 1 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317). Figure 2.
illustrates a typical application circuit (output source current
operation).
Figure 3. shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXxx6400A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
Fluoro Silicone
Gel Die Coat
Stainless Steel Cap
Die
P1
Wire Bond
Thermoplastic Case
Lead Frame
Absolute Element
Die Bond
Sealed Vacuum Reference
Figure 1. Cross Sectional Diagram SSOP
(not to scale)
+5.0 V
VS Pin 2
MPXxx6400A
VOUT Pin 4
100 nF
To ADC
47 pF
51 K
GND Pin 3
Figure 2. Typical Application Circuit
(Output Source Current Operation)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Transfer Function:
VOUT = VS x (0.002421xP–0.00842 ± Error
VS = 5.0 VDC
Temperature = 0 to 85°C
MAX
TYP
MIN
Pressure (Reference to Sealed Vacuum) in kPa
Figure 3. Output vs. Absolute Pressure
MPXH6400A
Sensors
4
Freescale Semiconductor
Pressure
Transfer Function (MPXxx6400A)
VOUT = VS x (0.002421 x P – 0.00842)
Normal Transfer Value:
± Pressure Error x Temp. Factor x 0.002421 x VS
VS = 5.0 ± 0.36 VDC
Temperature Error Band
MPXxx6400A Series
4.0
3.0
Temperature
Break Points
2.0
Error
Factor
1.0
Temp
Multiplier
0.0
- 40
0 to 85
1 2 5
3
1
1 .7 5
-40
-20
0
20
40
60
80
100
120
140
Temperature in C°
NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C
Pressure Error Band
Error Limits for Pressure
±5.5 (kPa)
6.0
5.0
4.0
3.0
2.0
1.0
0.0
20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400
-1.0
-2.0
-3.0
-4.0
- 5.0
- 6.0
Pressure (in kPa)
Pressure
Error (Max)
20 to 400 (kPa) ±5.5 (kPa)
MPXH6400A
Sensors
Freescale Semiconductor
5
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
The two sides of the pressure sensor are designated as
the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel,
which protects the die from harsh media. The MPX pressure
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table:
Part Number
MPXH6400AC6U
Case Type
Pressure (P1) Side Identifier
Side with Port Attached
Side with Port Attached
Side with Port Attached
Side with Port Attached
1317A
1317A
1317A
1369
MPXH6400AC6T1
MPXHZ6400AC6T1
MPXA6400AP
SURFACE MOUNTING INFORMATION
Minimum Recommended Footprint for Small Outline Package
Surface mount board layout is a critical portion of the total
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
0.100 TYP 8X
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
inch
0.100 TYP 8X
2.54
mm SCALE 2:1
Figure 4. SOP Footprint (Case 1369)
Minimum Recommended Footprint for Super Small Outline Package
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.050
1.27
TYP
0.387
9.83
0.150
3.81
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 5. SSOP Footprint (Case 1317A)
MPXH6400A
Sensors
Freescale Semiconductor
6
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1317A-04
ISSUE D
SUPER SMALL OUTLINE PACKAGE
MPXH6400A
Sensors
Freescale Semiconductor
7
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1317A-04
ISSUE D
SUPER SMALL OUTLINE PACKAGE
MPXH6400A
Sensors
Freescale Semiconductor
8
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPXH6400A
Sensors
Freescale Semiconductor
9
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPXH6400A
10
Sensors
Freescale Semiconductor
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© Freescale Semiconductor, Inc. 2009. All rights reserved.
MPXH6400A
Rev. 4
11/2009
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MOTOROLA
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