MPXV7025GC6T1 [FREESCALE]
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated; 集成硅压力传感器片上信号调节,温度补偿和校准型号: | MPXV7025GC6T1 |
厂家: | Freescale |
描述: | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
文件: | 总12页 (文件大小:125K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MPXV7025G
Rev 0, 05/2005
Freescale Semiconductor
Technical Data
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPXV7025G series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications, but
particularly those employing a microcontroller or microprocessor with A/D inputs.
This patented, single element transducer combines advanced micromachining
techniques, thin-film metallization, and bipolar processing to provide an accurate,
high level analog output signal that is proportional to the applied pressure.
MPXV7025G
SERIES
INTEGRATED
PRESSURE SENSOR
-25 to 25 kPa (-3.6 to 3.6 psi)
0.2 to 4.7 V OUTPUT
SMALL OUTLINE PACKAGE
Features
•
•
•
•
•
•
5.0% Maximum Error Over 0° to 85°C
Ideally Suited for Microprocessor or Microcontroller-Based Systems
Temperature Compensated Over –40° to +125°C
Thermoplastic (PPS) Surface Mount Package
Patented Silicon Shear Stress Strain Gauge
MPXV7025GC6U
CASE 482A-01
Available in Differential and Gauge Configurations
Typical Applications
•
•
•
•
Respiratory Systems
Process Control
MPXV7025GP
CASE 1369-01
MPXV7025DP
CASE 1351-01
Patient Monitoring
Remote Monitoring Devices
SMALL OUTLINE PACKAGE
PIN NUMBERS(1)
ORDERING INFORMATION
1
2
N/C
5
6
N/C
N/C
Device
Type
Case
No.
MPX Series
Order No.
Packing
Options
Device
Marking
Options
V
S
SMALL OUTLINE PACKAGE (MPXV7025G SERIES)
3
4
Gnd
7
8
N/C
N/C
Ported Gauge, Axial Port, SMT 482A MPXV7025GC6U
Elements
Rails MPXV7025
G
V
out
Gauge, Axial Port, SMT 482A MPXV7025GC6T1 Tape & MPXV7025
Reel
G
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
Gauge, Side Port, SMT 1369 MPXV7025GP
Gauge, Dual Port, SMT 1351 MPXV7025DP
Trays MPXV7025
G
G
Trays MPXV7025
V
S
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
V
out
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for Small Outline Package Device
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
© Freescale Semiconductor, Inc., 2005. All rights reserved.
Table 1. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
Storage Temperature
P
200
kPa
max
T
–40° to +125°
–40° to +125°
°C
°C
stg
Operating Temperature
T
A
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 3 required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
(1)
P
-25
—
25
kPa
Pressure Range
OP
(2)
V
4.75
—
5.0
7.0
5.25
10
Vdc
mAdc
Vdc
S
Supply Voltage
Supply Current
I
o
(3)
V
off
0.116
0.25
0.384
Minimum Pressure Offset
@ V = 5.0 Volts
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
S
(4)
V
V
4.610
—
4.75
4.5
—
4.890
—
Vdc
Vdc
Full Scale Output
FSO
FSS
@ V = 5.0 Volts
S
(5)
Full Scale Span
@ V = 5.0 Volts
S
(6)
—
—
±5.0
%V
FSS
Accuracy
Sensitivity
V/P
—
—
90
—-
—-
mV/kPa
ms
(7)
t
1.0
Response Time
R
Output Source Current at Full Scale Output
I
—
—
—
0.1
20
—-
—-
—-
mAdc
ms
o+
(8)
—
—
Warm-Up Time
(9)
±0.5
%V
FSS
Offset Stability
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (V ) is defined as the output voltage at the minimum rated pressure.
off
4. Full Scale Output (V
) is defined as the output voltage at the maximum or full rated pressure.
FSO
5. Full Scale Span (V
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
FSS
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure at 25°C.
• TcSpan:
• TcOffset:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V
at 25°C.
FSS
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
The MPXV7025G series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
MPXV7025G
Sensors
2
Freescale Semiconductor
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
5.0
Transfer Function:
4.5
V
V
= V *(0.018*P+0.5) ± ERROR
S
= 5.0 Vdc
out
4.0
3.5
3.0
S
TEMP = 0 to 85°C
TYPICAL
2.5
MAX
2.0
1.5
1.0
0.5
0
MIN
-25
0
25
Differential Pressure (kPa)
Figure 2. Output versus Pressure Differential
+5 V
OUTPUT
V
out
V
s
IPS
1.0 µF
GND
470 pF
0.01 µF
Figure 3. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, please refer to
Application Note AN1646.)
MPXV7025G
Sensors
Freescale Semiconductor
3
Transfer Function
Nominal Transfer Value:
V
= V (P x 0.018 + 0.5)
out S
± (Pressure Error x Temp. Factor x 0.018 x V )
S
V
= 5.0 V ± 0.25 Vdc
S
Temperature Error Band
MPXV7025G SERIES
4.0
Temp
Multiplier
3.0
–40
0 to 85
+125
3
1
3
Temperature
Error
Factor
2.0
1.0
0.0
–40
–20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.
Pressure Error Band
Error Limits for Pressure
3.0
2.0
1.0
Pressure (in kPa)
0.0
-25
0
25
–1.0
–2.0
–3.0
Pressure
Error (Max)
-25 to 25 (kPa) ±1.25 (kPa)
MPXV7025G
Sensors
Freescale Semiconductor
4
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor sensor is designed to operate with positive differential
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel
which protects the die from harsh media. The MPX pressure
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Pressure (P1)
Side Identifier
Part Number
Case Type
MPX7025GC6U/C6T1
MPXV7025GP
482A
1369
1351
Gauge, Axial Port, SMT
Side with Port Attached
Side with Part Marking
MPXV7025DP
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
0.100 TYP 8X
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
inch
0.100 TYP 8X
2.54
mm SCALE 2:1
Figure 4. Small Outline Package Footprint
MPXV7025G
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
-A-
D 8 PL
0.25 (0.010)
4
1
M
S
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
T
B
5
8
N
-B-
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
G
INCHES
MIN MAX
MILLIMETERS
DIM
A
B
C
D
G
H
J
K
M
N
MIN
10.54
10.54
12.70
0.96
MAX
10.79
10.79
13.21
1.07
S
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
W
2.54 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0.05
0.23
1.55
0˚
0.25
0.28
1.80
7˚
V
0˚
7˚
C
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
11.28
18.01
6.22
2.92
11.38
18.41
6.48
3.17
S
V
W
H
J
-T-
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXV7025G
Sensors
Freescale Semiconductor
6
PACKAGE DIMENSIONS
2 PLACES 4 TIPS
0.006 (0.15) C
A
B
E
A
GAGE
PLANE
e
5
4
1
e/2
.014 (0.35)
θ
L
A1
D
F
DETAIL G
8
NOTES:
8X b
0.004 (0.1)
1. CONTROLLING DIMENSION: INCH.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
4. DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
STYLE 1:
PIN 1. GND
STYLE 2:
PIN 1. N/C
2. Vs
M
C
A
B
2. +Vout
3. Vs
3. GND
4. Vout
5. N/C
6. N/C
7. N/C
8. N/C
4. -Vout
5. N/C
6. N/C
7. N/C
8. N/C
E1
B
INCHES
DIM MIN MAX
0.370
A1 0.002
MILLIMETERS
MIN MAX
N
T
∅
A
0.390
0.010
0.042
0.485
0.700
0.485
9.39
0.05
0.96
9.91
0.25
1.07
b
D
E
0.038
0.465
0.680
11.81 12.32
17.27 17.78
11.81 12.32
2.54 BSC
E1 0.465
M
A
e
F
K
L
M
N
P
T
θ
0.100 BSC
0.240
0.115
0.040
0.270
0.160
0.009
0.110
0˚
0.260
0.135
0.060
0.290
0.180
0.011
0.130
7˚
6.10
2.92
1.02
6.86
4.06
0.23
2.79
0˚
6.60
3.43
1.52
7.37
4.57
0.28
3.30
7˚
8X
0.004 (0.1)
K
P
DETAIL G
SEATING
PLANE
C
CASE 1351-01
ISSUE O
SMALL OUTLINE PACKAGE
MPXV7025G
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
2 PLACES 4 TIPS
0.008 (0.20) C
A
B
E
A
GAGE
PLANE
e
5
4
1
e/2
.014 (0.35)
θ
L
A1
D
F
DETAIL G
8
NOTES:
1. CONTROLLING DIMENSION: INCH.
8X
b
0.004 (0.1)
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
4. DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
M
C
A
B
E1
B
INCHES
DIM MIN MAX
0.300
A1 0.002
MILLIMETERS
MIN
7.11
MAX
7.62
0.25
N
T
∅
A
0.330
0.010
0.042
0.485
K
0.05
0.96
b
D
E
0.038
0.465
0.717 BSC
1.07
12.32
11.81
18.21 BSC
E1 0.465
0.485
11.81
2.54 BSC
12.32
A
M
e
F
K
L
M
N
P
T
θ
0.100 BSC
0.245
0.120
0.061
0.270
0.080
0.009
0.115
0˚
0.255
0.130
0.071
0.290
0.090
0.011
0.125
7˚
6.22
3.05
1.55
6.86
2.03
0.23
2.92
0˚
6.47
3.30
1.80
7.36
2.28
0.28
3.17
7˚
8X
0.004 (0.1)
P
DETAIL G
SEATING
PLANE
C
CASE 1369-01
ISSUE O
SMALL OUTLINE PACKAGE
MPXV7025G
Sensors
Freescale Semiconductor
8
NOTES
MPXV7025G
Sensors
Freescale Semiconductor
9
NOTES
MPXV7025G
Sensors
10
Freescale Semiconductor
NOTES
MPXV7025G
Sensors
Freescale Semiconductor
11
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MPXV7025G
Rev 0
05/2005
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