MB15E06SRPV1 [FUJITSU]

Single Serial Input PLL Frequency Synthesizer On-chip 3.0 GHz Prescaler; 单串行输入锁相环频率合成片3.0 GHz的预分频器
MB15E06SRPV1
型号: MB15E06SRPV1
厂家: FUJITSU    FUJITSU
描述:

Single Serial Input PLL Frequency Synthesizer On-chip 3.0 GHz Prescaler
单串行输入锁相环频率合成片3.0 GHz的预分频器

预分频器 信号电路 锁相环或频率合成电路
文件: 总25页 (文件大小:206K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
FUJITSU SEMICONDUCTOR  
DATA SHEET  
DS04-21379-1E  
ASSP  
Single Serial Input  
PLL Frequency Synthesizer  
On-chip 3.0 GHz Prescaler  
MB15E06SR  
DESCRIPTION  
The Fujitsu MB15E06SR is a serial input Phase Locked Loop (PLL) frequency synthesizer with a 3.0 GHz  
prescaler. The 3.0 GHz prescaler has a dual modulus division ratio of 64/65 or 128/129 enabling pulse swallowing  
operation.  
The supply voltage range is between 2.7 V and 4.0 V. A refined charge pump supplies well-balanced output  
currents of 4.0 mA.  
The phase noise of MB15E06SR was drastically improved comparing with the former single PLL, MB15E06. The  
data format of serial data and the pin assignments except for φP and φR pins are same as the former one, so it  
is easy to replace the former one.  
MB15E06SR is ideally suited for the high frequency wireless system such as ETC (Electronic Toll Collection  
System).  
FEATURES  
• High frequency operation: 3.0 GHz Max  
• Low power supply voltage: VCC = 2.7 V to 4.0 V  
• Ultra Low power supply current: ICC = 8.0 mA Typ (VCC = Vp = 3.0 V, Ta = +25°C, in locking state)  
• Direct power saving function:Power supply current in power saving mode  
Typ 0.1 µA (VCC = Vp = 3.0 V, Ta = +25°C)  
(Continued)  
PACKAGES  
16-pin plastic TSSOP  
16-pad plastic BCC  
(FPT-16P-M07)  
(LCC-16P-M06)  
MB15E06SR  
(Continued)  
• Dual modulus prescaler: 64/65 or 128/129  
• Serial input 14-bit programmable reference divider: R = 3 to 16,383  
• Serial input programmable divider consisting of:  
- Binary 7-bit swallow counter: 0 to 127  
- Binary 11-bit programmable counter: 3 to 2,047  
• Software selectable charge pump current  
• On-chip phase control for phase comparator  
• Built-in digital locking detector circuit to detect PLL locking and unlocking.  
• Operating temperature: Ta = 40 °C to +85 °C  
PIN ASSIGNMENTS  
16-pin TSSOP  
16-pad BCC  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
OSCIN  
OSCout  
VP  
N.C.  
N.C.  
LD/fout  
N.C.  
PS  
OSCIN N.C.  
1
16 15 14  
13  
OSCout  
VP  
N.C.  
LD/fout  
N.C.  
PS  
2
3
4
5
6
VCC  
12  
VCC  
DO  
Top view  
Top view  
DO  
11  
10  
GND  
Xfin  
LE  
LE  
GND  
Xfin  
7
8
9
Data  
Data  
Clock  
fin  
fin Clock  
(LCC-16P-M06)  
(FPT-16P-M07)  
2
MB15E06SR  
PIN DESCRIPTIONS  
Pin no.  
Pin  
I/O  
Descriptions  
name  
TSSOP BCC  
1
2
3
4
16  
1
OSCIN  
OSCOUT  
VP  
I
Programmable reference divider input. Connection to a TCXO.  
Oscillator output.  
O
2
Power supply voltage input for the charge pump.  
Power supply voltage input.  
3
VCC  
Charge pump output.  
Phase of the charge pump can be selected via programming of the FC bit.  
5
4
DO  
O
6
7
5
6
GND  
Xfin  
I
Ground.  
Prescaler complementary input, which should be grounded via a capacitor.  
Prescaler input.  
8
9
7
8
fin  
Clock  
Data  
LE  
I
I
I
I
Connection to an external VCO should be done via AC coupling.  
Clock input for the 19-bit shift register.  
Data is shifted into the shift register on the rising edge of the clock.  
(Open is prohibited.)  
Serial data input using binary code.  
The last bit of the data is a control bit. (Open is prohibited.)  
10  
11  
9
Load enable signal input. (Open is prohibited.)  
When LE is set high, the data in the shift register is transferred to a latch  
according to the control bit in the serial data.  
10  
Power saving mode control. This pin must be set at “L” at Power-ON.  
(Open is prohibited.)  
12  
13  
14  
11  
12  
13  
PS  
N.C.  
I
PS = “H”; Normal mode  
PS = “L”; Power saving mode  
No connection.  
Lock detect signal output (LD)/phase comparator monitoring output (fout).  
The output signal is selected via programming of the LDS bit.  
LDS = “H”; outputs fout (fr/fp monitoring output)  
LD/fout  
O
LDS = “L”; outputs LD (“H” at locking, “L” at unlocking.)  
15  
16  
14  
15  
N.C.  
N.C.  
No connection.  
No connection.  
3
MB15E06SR  
BLOCK DIAGRAM  
1
OSCIN(16)  
SW  
LDS  
FC  
Reference  
oscillator circuit  
Binary 14-bit  
reference couter  
Phase  
comparator  
2
OSCOUT (1)  
3-bit latch  
14-bit latch  
Intermittent  
mode control  
(power save)  
Lock  
detector  
12  
PS  
C
N
T
(11)  
19-bit shift register  
LD/fr/fp  
selector  
1-bit  
control  
latch  
14  
(13)  
LD/fout  
11  
LE  
(10)  
(2)  
3
VP  
Charge  
pump  
11-bit latch  
7-bit latch  
5
(4)  
DO  
Binary 7-bit  
swallow  
counter  
Binary 11-bit  
programmable  
counter  
10  
Data  
(9)  
9
(8)  
Clock  
fp  
7
(6)  
Prescaler  
64/65  
Xfin  
8
(7)  
128/129  
SW  
fin  
6
GND  
(5)  
4
VCC (3)  
: TSSOP  
( ) : BCC  
4
MB15E06SR  
ABSOLUTE MAXIMUM RATINGS  
Rating  
Parameter  
Symbol  
Condition  
Unit  
Remark  
Min  
–0.5  
VCC  
Max  
5.0  
VCC  
VP  
V
V
Power supply voltage  
Input voltage  
6.0  
VI  
–0.5  
GND  
GND  
–55  
VCC +0.5  
VCC  
V
VO  
Except Do  
V
Output voltage  
VO  
Do  
VP  
V
Storage temperature  
Tstg  
+125  
°C  
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,  
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.  
RECOMMENDED OPERATING CONDITIONS  
Value  
Parameter  
Symbol  
Unit  
Remark  
Min  
2.7  
Typ  
3.0  
Max  
4.0  
VCC  
VP  
VI  
V
V
Power supply voltage  
VCC  
5.5  
Input voltage  
GND  
–40  
VCC  
+85  
V
Operating temperature  
Ta  
°C  
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the  
semiconductor device. All of the device’s electrical characteristics are warranted when the device is  
operated within these ranges.  
Always use semiconductor devices within their recommended operating condition ranges. Operation  
outside these ranges may adversely affect reliability and could result in device failure.  
No warranty is made with respect to uses, operating conditions, or combinations not represented on  
the data sheet. Users considering application outside the listed conditions are advised to contact their  
FUJITSU representatives beforehand.  
5
MB15E06SR  
ELECTRICAL CHARACTERISTICS  
(VCC = 2.7 V to 4.0 V, Ta = 40 °C to +85 °C)  
Value  
Unit  
Parameter  
Symbol  
Condition  
Min  
6.0  
Typ  
8.0  
0.1*2  
Max  
11.5  
20  
Power supply current*1  
Power saving current  
ICC  
IPS  
fin = 3000 MHz, VCC = VP = 3.0 V  
mA  
PS = “L”  
µA  
fin  
fIN  
700  
3
3000 MHz  
Operating frequency  
OSCIN  
fosc  
40  
MHz  
50 system  
Pfin (Refer to the measurement  
circuit.)  
*3  
fin  
–10  
+2  
dBm  
Input sensitivity  
*3  
OSCIN  
VOSC  
0.5  
VCC  
Vp-p  
V
“H” level input voltage  
“L” level input voltage  
“H” level input current  
“L” level input current  
Data,  
Clock,  
LE, PS  
VIH  
VCC × 0.7  
VIL  
VCC × 0.3  
+1.0  
*4  
Data,  
Clock,  
LE, PS  
IIH  
–1.0  
–1.0  
µA  
*4  
IIL  
+1.0  
“H” level input current  
“L” level input current  
“H” level output voltage  
“L” level output voltage  
“H” level output voltage  
“L” level output voltage  
IIH  
0
–100  
VCC – 0.4  
+100  
0
OSCIN  
µA  
*4  
IIL  
VOH  
VOL  
VCC = VP = 3.0 V, IOH = –1 mA  
VCC = VP = 3.0 V, IOL = 1 mA  
LD/fout  
V
0.4  
VDOH  
VDOL  
VCC = VP = 3.0 V, IDOH = –0.5 mA VP – 0.4  
Do  
Do  
V
VCC = VP = 3.0 V, IDOL = 0.5 mA  
0.4  
VCC = VP = 3.0 V,  
VOFF = 0.5 V to VP – 0.5 V  
High impedance cutoff  
current  
IOFF  
2.5  
nA  
mA  
“H” level output current  
“L” level output current  
“H” level output current  
“L” level output current  
IOH  
IOL  
VCC = VP = 3.0 V  
VCC = VP = 3.0 V  
–1.0  
LD/fout  
1.0  
–5.2  
2.8  
*4  
IDOH  
–4.0  
4.0  
–2.8  
5.2  
VCC = VP = 3.0 V, VDO = VP/2,  
Do  
mA  
%
Ta = +25°C  
IDOL  
IDOL/  
IDOH  
*5  
VDO = VP/2  
5
IDOMT  
Charge pump current  
rate  
*6  
*7  
vs VDO  
0.5 V VDO VP – 0.7 V  
10  
5
%
%
IDOVD  
vs Ta IDOTA  
– 40°C Ta +85°C, VDO = VP/2  
*1: Conditions; fosc = 13 MHz, Vosc = 1.2 VPP, Ta = +25°C, in locking state.  
*2: VCC = VP = 3.0 V, fosc = 13 MHz, Vosc = 1.2 VPP, Ta = +25°C, in power saving mode  
*3: AC coupling. 1000 pF capacitor is connected under the condition of min. operating frequency.  
*4: The symbol “–” (minus) means direction of current flow.  
*5: VCC = VP = 3.0 V, Ta = +25°C (||I3| – |I4||) / [(|I3| + |I4|) /2] × 100(%)  
*6: VCC = VP = 3.0 V, Ta = +25°C [(||I2| – |I1||) /2] / [(|I1| + |I2|) /2] × 100(%) (Applied to each IDOL, IDOH)  
(Continued)  
6
MB15E06SR  
(Continued)  
*7: VCC = VP = 3.0 V, VDO = VP/2 (||IDO(+85°C)| – |IDO(–40°C)| |/2) / (||IDO(+85°C)| + |IDO(–40°C)|| /2) × 100(%)  
(Applied to each IDOL, IDOH)  
I1  
I3  
I4  
I2  
IDOL  
IDOH  
I2  
I1  
0.5  
VP/2  
VP 0.7  
VP  
Charge Pump Output Voltage (V)  
7
MB15E06SR  
FUNCTIONAL DESCRIPTION  
1. Pulse Swallow Function  
The divide ratio can be calculated using the following equation:  
fVCO = [(P × N) + A] × fOSC ÷ R (A < N)  
fVCO : Output frequency of external voltage controlled oscillator (VCO)  
N
A
: Preset divide ratio of binary 11-bit programmable counter (3 to 2,047)  
: Preset divide ratio of binary 7-bit swallow counter (0 A 127)  
fOSC : Output frequency of the reference frequency oscillator  
R
P
: Preset divide ratio of binary 14-bit programmable reference counter (3 to 16,383)  
: Preset divide ratio of modulus prescaler (64 or 128)  
2. Serial Data Input  
Serial data is processed using the Data, Clock, and LE pins. Serial data controls the programmable reference  
divider and the programmable divider separately.  
Binary serial data is entered through the Data pin.  
One bit of data is shifted into the shift register on the rising edge of the Clock. When the LE signal pin is taken  
high, stored data is latched according to the control bit data as follows:  
Table 1. Control Bit  
Control bit (CNT)  
Destination of serial data  
For the programmable reference divider  
For the programmable divider  
H
L
(1) Shift Register Configuration  
Programmable Reference Counter  
LSB  
1
MSB  
Data Flow  
10 11 12 13 14 15 16 17 18  
LDS  
2
3
4
5
6
7
8
9
CNT R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 SW FC  
CNT  
: Control bit  
[Table 1]  
R1 to R14 : Divide ratio setting bit for the programmable reference counter (3 to 16,383) [Table 2]  
SW  
FC  
LDS  
: Divide ratio setting bit for the prescaler (64/65 or 128/129)  
: Phase control bit for the phase comparator  
: LD/fOUT signal select bit  
[Table 5]  
[Table 7]  
[Table 6]  
Note: Start data input with MSB first.  
8
MB15E06SR  
Programmable Counter  
MSB  
LSB  
1
Data Flow  
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19  
CNT A1 A2 A3 A4 A5 A6 A7 N1 N2 N3 N4 N5 N6 N7 N8 N9 N10 N11  
CNT  
: Control bit  
[Table 1]  
[Table 3]  
[Table 4]  
N1 to N11: Divide ratio setting bits for the programmable counter (3 to 2,047)  
A1 to A7 : Divide ratio setting bits for the swallow counter (0 to 127)  
Note: Data input with MSB first.  
Table 2. Binary 14-bit Programmable Reference Counter Data Setting  
Divide  
R14 R13 R12 R11 R10 R9  
R8  
R7  
R6  
R5  
R4  
R3  
R2  
R1  
ratio(R)  
3
4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
16383  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Note: Divide ratio less than 3 is prohibited.  
Table 3. Binary 11-bit Programmable Counter Data Setting  
Divide  
N11 N10  
N9  
N8  
N7  
N6  
N5  
N4  
N3  
N2  
N1  
ratio(N)  
3
4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
2047  
1
1
1
1
1
1
1
1
1
1
1
Note: Divide ratio less than 3 is prohibited.  
9
MB15E06SR  
Table 4. Binary 7-bit Swallow Counter Data Setting  
Divide ratio (A) A7  
A6  
0
A5  
0
A4  
0
A3  
0
A2  
0
A1  
0
0
1
0
0
0
0
0
0
0
1
127  
1
1
1
1
1
1
1
Table 5. Prescaler Data Setting  
SW  
1
Prescaler divide ratio  
64/65  
0
128/129  
Table 6. LD/fout Output Select Data Setting  
LDS  
LD/fout output signal  
fout signal  
1
0
LD signal  
(2) Relation between the FC Input and Phase Characteristics  
The FC bit changes the phase characteristics of the phase comparator. The internal charge pump output level (DO)  
is reversed according to the FC bit. Also, the monitor pin (fout) output is controlled by the FC bit. The relationship  
between the FC bit and DO is shown below.  
Table 7. FC Bit Data Setting (LDS = “1”)  
FC = 1  
LD/fout  
FC = 0  
LD/fout  
DO  
H
L
DO  
L
fr > fP  
fr < fP  
fr = fP  
fout = fr  
H
Z
fout = fp  
Z
Z : High impedance  
10  
MB15E06SR  
When designing a synthesizer, the FC pin setting depends on the VCO and LPF characteristics.  
• When the LPF and VCO characteristics are  
similar to (1), set FC bit high.  
(1)  
• When the VCO characteristics are similar to  
(2), set FC bit low.  
VCO  
Output  
Frequency  
PLL  
LPF  
VCO  
(2)  
LPF Output Voltage  
Note : Give attention to the polarity for using active type LPF.  
11  
MB15E06SR  
3. Power Saving Mode (Intermittent Mode Control Circuit)  
Table 10. PS Pin Setting  
PS pin  
Status  
H
L
Normal mode  
Power saving mode  
The intermittent mode control circuit reduces the PLL power consumption.  
By setting the PS pin low, the device enters into the power saving mode, reducing the current consumption. See  
the Electrical Characteristics chart for the specific value.  
The phase detector output, Do, becomes high impedance.  
For the signal PLL, the lock detector, LD, remains high, indicating a locked condition.  
Setting the PS pin high, releases the power saving mode, and the device works normally.  
The intermittent mode control circuit also ensures a smooth startup when the device returns to normal operation.  
When the PLL is returned to normal operation, the phase comparator output signal is unpredictable. This is because  
of the unknown relationship between the comparison frequency (fp) and the reference frequency (fr) which can  
cause a major change in the comparator output, resulting in a VCO frequency jump and an increase in lockup time.  
To prevent a major VCO frequency jump, the intermittent mode control circuit limits the magnitude of the error  
signal from the phase detector when it returns to normal operation.  
Notes : When power (VCC) is first applied, the device must be in standby mode, PS = Low.  
The serial data input after the power supply becomes stable and the the power saving mode is released  
after completed the data input..  
OFF  
ON  
tV 1 µs  
VCC  
Clock  
Data  
LE  
tPS 100 ns  
PS  
(1)  
(2)  
(3)  
(1) PS = L (power saving mode) at Power ON  
(2) Set serial data 1 µs later after power supply remains stable (VCC > 2.2 V).  
(3) Release power saving mode (PS: “L” “H”) 100 ns later after setting serial data.  
12  
MB15E06SR  
SERIAL DATA INPUT TIMING  
1st data  
2nd data  
Control bit Invalid data  
Data  
MSB  
LSB  
Clock  
t1  
t2  
t3  
t6  
t0  
LE  
t4  
t5  
On the rising edge of the clock, one bit of data is transferred into the shift register.  
Parameter Min  
Typ  
Max Unit  
Parameter Min  
Typ  
Max Unit  
t1  
t2  
t3  
t4  
20  
20  
30  
30  
ns  
ns  
ns  
ns  
t5  
t6  
t7  
100  
20  
ns  
ns  
ns  
100  
Note: LE should be “L” when the data is transferred into the shift register.  
13  
MB15E06SR  
PHASE COMPARATOR OUTPUT WAVEFORM  
fr  
fp  
tWU  
tWL  
LD  
[FC = “1”]  
DO  
[FC = “0”]  
DO  
Notes: Phase error detection range: –2π to +2π  
Pulses on Do signal during locked state are output to prevent dead zone.  
LDoutputbecomeslowwhenphaseistWU ormore.LDoutputbecomeshighwhenphaseerror istWL  
or less and continues to be so for three cycles or more.  
tWU and tWL depend on OSCIN input frequency.  
tWU > 2/fosc (s) (e. g. tWU > 153.8 ns, fosc = 13 MHz)  
tWU < 4/fosc (s) (e. g. tWL < 307.7 ns, fosc = 13 MHz)  
LD becomes high during the power saving mode (PS = “L”).  
14  
MB15E06SR  
MEASURMENT CIRCUIT (for Measuring Input Sensitivity fin/OSCIN)  
1000 pF  
0.1 µF  
1000 pF  
0.1 µF  
1000 pF  
S.G.  
S.G.  
OSCOUT  
2
fin  
8
Xfin GND DO  
VCC VP  
OSCIN  
50 Ω  
50 Ω  
7
6
5
4
3
1
9
10  
11  
12  
13  
14  
15  
16  
Clock Data LE  
N.C. N.C.  
PS N.C. LD/fout  
VCC  
Oscilloscope  
Controller (setting divide ratio)  
Note: TSSOP-16  
15  
MB15E06SR  
TYPICAL CHARACTERISTICS  
1. fin input sensitivity  
Input sensitivity - Input frequency  
Ta = +25 °C  
10  
5
0
Catalog guaranteed range  
5  
10  
15  
20  
25  
30  
35  
VCC = 2.7 V  
VCC = 3.0 V  
VCC = 4.0 V  
SPEC  
0
500  
1000  
1500  
2000  
2500  
3000  
3500  
4000  
4500  
Input frequency fIN (MHz)  
2. OSCIN input sensitivity  
Input sensitivity - Input frequency  
Ta = +25 °C  
10.0  
Catalog  
guaranteed  
range  
0.0  
10.0  
20.0  
30.0  
40.0  
50.0  
VCC = 2.7 V  
VCC = 3.0 V  
VCC = 3.75 V  
SPEC  
0
20  
40  
60  
80  
100  
120  
140  
160  
180  
Input frequency fOSC (MHz)  
16  
MB15E06SR  
3. Do output current  
• 4.0 mA  
VDO - IDO  
2.00 mA/div  
10.00  
Ta = +25˚C, VCC = VP = 3.0 V  
0.00  
10.00  
0
1
2
3
4
5
6
7
Charge pump output voltage VDO (V)  
4. fin input impedance  
4: 75.418 Ω  
63.625 Ω  
3.3754 nH  
3 000.000 000 MHz  
1 : 27.688 Ω  
105.31 Ω  
700 MHz  
18.004 Ω  
64.969 Ω  
1 GHz  
2 :  
4
18.395 Ω  
1.0674 Ω  
2 GHz  
3 :  
3
1
2
STOP 3 000.000 000 MHz  
START  
700.000 000 MHz  
17  
MB15E06SR  
5. OSCIN input impedance  
4: 56.25 Ω  
1.3356 kΩ  
2.979 pF  
40.000 000 MHz  
1 : 5.771 kΩ  
15.199 kΩ  
3 MHz  
133.63 Ω  
2 :  
2.5508 kΩ  
20 MHz  
56.25 Ω  
1.3956 kΩ  
3 :  
40 MHz  
4
1
2
3
STOP 40.000 000 MHz  
START  
3.000 000 MHz  
18  
MB15E06SR  
REFERENCE INFORMATION  
Test Circuit  
VCC =VP = 3.0 V  
VVCO = 3.0 V  
Ta = +25 °C  
fVCO = 1619 MHz  
KV = 44 MHz/V  
fr = 100 kHz  
S.G.  
OSCIN  
fin  
CP : 4 mA  
fOSC = 10 MHz (1.2 VPP)  
LPF  
Do  
LPF  
27 kΩ  
3.3 kΩ  
2200 pF  
120 pF  
Spectrum  
Analyzer  
VCO  
15000 pF  
• PLL Reference Leakage  
ATTEN 10 dB  
RL 10.0 dBm  
VAVG 16  
10 dB/  
MKR 77.67 dB  
100.0 kHz  
MKR  
100.0 kHz  
77.67 dB  
CENTER 1.6190000 GHz  
VBW 3.0 kHz  
SPAN 300.0 kHz  
SWP 84.0 ms  
RBW 3.0 kHz  
• PLL Phase Noise  
MKR 78.84 dB/Hz  
ATTEN 10 dB  
VAVG 16  
1.000 kHz  
RL 10.0 dBm  
10 dB/  
MKR  
1.000 kHz  
78.84 dB/Hz  
CENTER 1.619000000 GHz  
SPAN 5.000 kHz  
SWP 969 ms  
VBW 30 Hz  
RBW 30 Hz  
(Continued)  
19  
MB15E06SR  
(Continued)  
• PLL Lock Up time  
1597.2 MHz 1672 MHz ± 1 kHz  
Lch Hch 1.06 ms  
Mkr  
x : 289.99777 µs  
y : 23.8776 MHz  
1.672003384 GHz  
1.671999384 GHz  
1.671995384 GHz  
0.00 s  
2.500 ms  
5.000 ms  
• PLL Lock Up time  
1672 MHz 1597.2 MHz ±1kHz  
Hch Lch 0.9 ms  
x : 300.00071 µs  
Mkr  
y : 23.8754 MHz  
1.597203471 GHz  
1.597199471 GHz  
1.597195471 GHz  
0.00 s  
2.500 ms  
5.000 ms  
20  
MB15E06SR  
APPLICATION EXAMPLE  
OUTPUT  
VCO  
LPF  
Lock Det.  
From  
a controller  
N.C.  
16  
N.C.  
15  
N.C.  
13  
LE  
11  
Data  
10  
Clock  
9
LD/fout  
14  
PS  
12  
MB15E06SR  
1
2
3
4
5
6
7
8
OSCIN  
VP  
GND  
fin  
DO  
Xfin  
VCC  
OSCOUT  
1000 pF  
1000 pF  
1000 pF  
TCXO  
0.1 µF  
0.1 µF  
VP: 5.5 V Max  
Note: TSSOP-16  
USAGE PRECAUTIONS  
To protect against damage by electrostatic discharge, note the following handling precautions:  
-Store and transport devices in conductive containers.  
-Use properly grounded workstations, tools, and equipment.  
-Turn off power before inserting device into or removing device from a socket.  
-Protect leads with a conductive sheet when transporting a board-mounted device.  
21  
MB15E06SR  
ORDERING INFORMATION  
Part number  
Package  
Remarks  
16-pin, Plastic TSSOP  
(FPT-16P-M07)  
MB15E06SRPFT  
16-pad, Plastic BCC  
(LCC-16P-M06)  
MB15E06SRPV1  
22  
MB15E06SR  
PACKAGE DIMENSIONS  
Note 1) *1 : Resin protrusion. (Each side : +0.15 (.006) Max) .  
Note 2) *2 : These dimensions do not include resin protrusion.  
Note 3) Pins width and pins thickness include plating thickness.  
Note 4) Pins width do not include tie bar cutting remainder.  
16-pin, Plastic TSSOP  
(FPT-16P-M07)  
15.00±0.10(.197±.004)  
0.17±0.05  
*
(.007±.002)  
16  
9
2 4.40±0.10 6.40±0.20  
(.173±.004) (.252±.008)  
*
INDEX  
Details of "A" part  
1.05±0.05  
(.041±.002)  
(Mounting height)  
1
8
LEAD No.  
"A"  
0.65(.026)  
0.24±0.08  
(.009±.003)  
0~8˚  
M
0.13(.005)  
0.07 +00..0073 .003 +..000031  
(0.50(.020))  
(Stand off)  
0.25(.010)  
0.60±0.15  
(.024±.006)  
0.10(.004)  
C
2003 FUJITSU LIMITED F16020S-c-3-3  
Dimensions in mm (inches) .  
Note : The values in parentheses are reference values.  
(Continued)  
23  
MB15E06SR  
(Continued)  
16-pad plastic BCC  
(LCC-16P-M06)  
4.55±0.10  
(.179±.004)  
0.80(.031)MAX  
Mounting height  
3.40(.134)TYP  
0.65(.026)  
0.325±0.10  
(.013±.004)  
TYP  
0.40±0.10  
(.016±.004)  
14  
9
9
14  
0.80(.031)  
REF  
INDEX AREA  
3.40±0.10  
(.134±.004)  
2.45(.096)  
TYP  
1.15(.045)  
REF  
"B"  
"A"  
0.075±0.025  
(.003±.001)  
(Stand off)  
1.725(.068)  
REF  
1
6
6
1
Details of "A" part  
0.75±0.10  
Details of "B" part  
0.60±0.10  
(.024±.004)  
(.030±.004)  
0.05(.002)  
0.40±0.10  
0.60±0.10  
(.016±.004)  
(.024±.004)  
C
1999 FUJITSU LIMITED C16017S-1C-1  
Dimensions in mm (inches) .  
Note : The values in parentheses are reference values.  
24  
MB15E06SR  
FUJITSU LIMITED  
All Rights Reserved.  
The contents of this document are subject to change without notice.  
Customers are advised to consult with FUJITSU sales  
representatives before ordering.  
The information, such as descriptions of function and application  
circuit examples, in this document are presented solely for the  
purpose of reference to show examples of operations and uses of  
Fujitsu semiconductor device; Fujitsu does not warrant proper  
operation of the device with respect to use based on such  
information. When you develop equipment incorporating the  
device based on such information, you must assume any  
responsibility arising out of such use of the information. Fujitsu  
assumes no liability for any damages whatsoever arising out of  
the use of the information.  
Any information in this document, including descriptions of  
function and schematic diagrams, shall not be construed as license  
of the use or exercise of any intellectual property right, such as  
patent right or copyright, or any other right of Fujitsu or any third  
party or does Fujitsu warrant non-infringement of any third-party’s  
intellectual property right or other right by using such information.  
Fujitsu assumes no liability for any infringement of the intellectual  
property rights or other rights of third parties which would result  
from the use of information contained herein.  
The products described in this document are designed, developed  
and manufactured as contemplated for general use, including  
without limitation, ordinary industrial use, general office use,  
personal use, and household use, but are not designed, developed  
and manufactured as contemplated (1) for use accompanying fatal  
risks or dangers that, unless extremely high safety is secured, could  
have a serious effect to the public, and could lead directly to death,  
personal injury, severe physical damage or other loss (i.e., nuclear  
reaction control in nuclear facility, aircraft flight control, air traffic  
control, mass transport control, medical life support system, missile  
launch control in weapon system), or (2) for use requiring  
extremely high reliability (i.e., submersible repeater and artificial  
satellite).  
Please note that Fujitsu will not be liable against you and/or any  
third party for any claims or damages arising in connection with  
above-mentioned uses of the products.  
Any semiconductor devices have an inherent chance of failure. You  
must protect against injury, damage or loss from such failures by  
incorporating safety design measures into your facility and  
equipment such as redundancy, fire protection, and prevention of  
over-current levels and other abnormal operating conditions.  
If any products described in this document represent goods or  
technologies subject to certain restrictions on export under the  
Foreign Exchange and Foreign Trade Law of Japan, the prior  
authorization by Japanese government will be required for export  
of those products from Japan.  
F0401  
FUJITSU LIMITED Printed in Japan  

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