MB86064 [FUJITSU]

Dual 14-bit 1GSa/s DAC; 双14位1GSa / s的DAC
MB86064
型号: MB86064
厂家: FUJITSU    FUJITSU
描述:

Dual 14-bit 1GSa/s DAC
双14位1GSa / s的DAC

转换器 数模转换器
文件: 总4页 (文件大小:124K)
中文:  中文翻译
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Product Flyer  
Mixed Signal Division  
October 2004  
Version 1.1  
MB86064  
FME/MS/DAC80/FL/5085  
Dual 14-bit 1GSa/s DAC  
The Fujitsu MB86064 is a Dual 14-bit 1GSa/s digital to analog  
converter (DAC), delivering exceptional dynamic performance.  
Each high performance DAC core is capable of generating  
multi-standard, multi-carrier communication transmit signals,  
suitable for 2, 2.5 and 3G systems. DAC data is input via two  
high-speed LVDS ports. These operate in a pseudo double data  
rate (DDR) mode, with data latched on both rising and falling  
edges. Alternatively, the device can be configured as a  
multiplexed dual-port single DAC. To simplify system  
integration the DAC operates from a clock running at half the  
DAC conversion rate.  
PLASTIC PACKAGE  
EFBGA-120  
Package Dimensions  
12 mm x 12 mm  
Features  
• Dual 14-bit, 1GSa/s Digital to Analog conversion  
• Exceptional dynamic performance  
PIN ASSIGNMENT  
• 74dBc ACLR for 4 UMTS carriers @ 276MHz direct-IF  
• 100MHz image-free generated bandwidth capability  
• supports UMTS plus digital pre-distortion bandwidth  
• Proprietary performance enhancement features  
• LVDS data interface  
AC19  
AA19  
AC17  
AA17  
AC15  
AA15  
AC13  
AA13  
AC11  
AA11  
AC9  
AA9  
AC7  
AA7  
AC5  
AA5  
AB18  
Y18  
AB16  
Y16  
AB14  
Y14  
AB12  
Y12  
AB10  
Y10  
AB8  
Y8  
AB6  
Y6  
• Register selectable on-chip LVDS termination resistors  
• Fujitsu 4-wire serial control interface  
W23  
U23  
R23  
N23  
L23  
J23  
W21  
U21  
R21  
N21  
L21  
J21  
G21  
E21  
W3  
U3  
W1  
U1  
X_A9  
A9  
X_A10  
A10  
X_B10  
B10  
X_B9  
B9  
V4  
T4  
P4  
V2  
T2  
P2  
M2  
K2  
H2  
F2  
V22  
T22  
P22  
V20  
T20  
P20  
M20  
K20  
H20  
F20  
DVSS  
X_B8  
B8  
DVDD  
DVSS  
X_A8  
A8  
DVDD  
X_B7  
B7  
• Two 16k point programmable on-chip waveform memories  
• Low power 3.3V analog and 1.8V digital operation  
• 750mW per DAC power dissipation at 1GSa/s  
• 0.18µm CMOS technology with Triple Well  
• Performance enhanced EFBGA package  
X_A7  
A7  
R14  
R12  
R10  
R3  
N3  
L3  
J3  
R1  
N1  
L1  
J1  
P15  
P13  
M13  
K13  
P11  
P9  
X_B6  
B6  
X_B5  
B5  
X_A6  
A6  
X_A5  
A5  
N14  
L14  
J14  
N12  
L12  
J12  
N10  
L10  
J10  
M22  
M4  
K4  
H4  
M15  
M11  
M9  
DVSS  
X_B3  
B3  
DVSS  
X_A3  
A3  
DVDD  
DVDD  
X_A4  
A4  
X_B4  
B4  
K22  
K15  
K11  
K9  
X_A1  
X_B1  
B1  
X_B2  
B2  
X_A2  
A2  
H22  
F22  
A1  
All centre pins : TG  
G23  
E23  
G3  
E3  
G1  
E1  
DVSS  
NC  
DVSS  
NC  
DVDD  
DVDD  
DVSS  
DVDD  
DVDD  
DVSS  
F4  
NC  
NC  
• Industrial temperature range (-40°C to +85°C)  
D18  
B18  
D16  
B16  
D14  
B14  
D12  
B12  
D10  
B10  
D8  
B8  
D6  
B6  
C19  
A19  
C17  
A17  
C15  
A15  
C13  
A13  
C11  
A11  
C9  
A9  
C7  
A7  
C5  
A5  
Index  
Applications  
• Multi-carrier, Multi-standard cellular infrastructure  
• CDMA, W-CDMA, GSM/EDGE, UMTS  
• Wideband communications systems  
• High Direct-IF architectures  
Not to scale. Viewed from above.  
• Arbitrary waveform generation  
Test equipment  
• Radar, video & display systems  
Copyright © 2004 Fujitsu Microelectronics Europe GmbH  
Production  
Page 1 of 4  
Disclaimer: The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before  
ordering.The information and circuit diagrams in this document are presented “as is”, no license is granted by implication or otherwise.  
October 2004 Version 1.1  
FME/MS/DAC80/FL/5085  
MB86064 Dual 14-bit 1GSa/s DAC  
Functional Overview  
The MB86064 is a high performance Dual 14-bit 1GSa/s DAC. In addition to two DAC cores the  
device features a host of features designed to help both system integration and operation. A  
functional block diagram is shown in Figure 1. Analog performance at high frequencies is enhanced  
by novel current switch and switch driver designs which provide constant data-independent switching  
delay, reducing jitter and distortion.  
÷
Clock output 1  
LVDS  
Control Interface  
1.8V LVCMOS  
1, 2, 4, 8  
4-wire Serial Control Interface  
÷
Clock output 2  
LVDS  
1, 2, 4, 8  
RF Clock input  
e.g. 500MHz  
Double-Edge  
clocked  
(1GSa/s)  
Port A data input  
14-bit LVDS  
Waveform  
Memory  
A
DAC A  
Loop clock input  
LVDS  
Analog output A  
Analog output B  
(14-bit)  
(16K Points)  
Waveform  
Memory  
B
Loop clock output  
LVDS  
DAC B  
(16K Points)  
(14-bit)  
Port B data input  
14-bit LVDS  
EFBGA-120  
Figure 1 MB86064 Functional Block Diagram  
The device requires an input clock at half the DAC conversion rate as each DAC core is clocked on  
both edges of the input clock. Each DAC core can be regarded as two interleaved DACs, each  
running at half rate. The main reason for adopting this approach is that the switch driver inherently  
includes a multiplex function through its two input ports. Compared to a conventional switch driver  
this allows twice as long to acquire and convert, though because the two paths share current sources  
they match exactly at low frequencies. A characteristic of this architecture is a suppressed image  
appearing reflected about Fs(dac)/4 of Fclk-Fsig. Duty cycle error in the input clock will exacerbate  
this image, but can be minimised by trimming the differential DC offset at the clock input pins.  
The big advantage of this approach compared to a single DAC running at half the rate is much  
reduced sinx/x roll off, which gives increased output power and better in-band flatness when  
generating high output frequencies (e.g. 200MHz and above). This is illustrated in Figure 2 as line 1.  
An alternative approach using a return-to-zero output stage has the same sinx/x roll off (and switch  
driver speed) but 6dB lower output power and a large image at Fclk-Fout. See Line 2.  
Page 2 of 4  
Production  
Copyright © 2004 Fujitsu Microelectronics Europe GmbH  
Disclaimer: The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before  
ordering.The information and circuit diagrams in this document are presented “as is”, no license is granted by implication or otherwise.  
October 2004 Version 1.1  
FME/MS/DAC80/FL/5085  
MB86064 Dual 14-bit 1GSa/s DAC  
Line 3 illustrates a conventional DAC  
running at half rate.  
dBFS  
0
-6  
Input Data  
Unsigned binary data to each DAC core is  
input via a dedicated parallel LVDS port. As  
with the DAC core, data is latched on every  
rising and falling edge of the clock in a  
pseudo DDR mode. For synchronisation of  
data generator(s) two LVDS clock outputs  
and a Loop-Clock facility are provided.  
Frequency  
Target high direct-IF  
generating region  
Figure 2 Benefits of DAC core architecture to  
Sinx/x response  
Loop-Clock  
Maintaining valid clock-to-data timing becomes increasingly difficult at higher clock rates, particularly  
taking into account device-to-device variations. The MB86064 minimises potential problems through  
its DDR data interface and by providing a loop-clock facility. The on-chip ‘loop’ consists of an LVDS  
input connected to an LVDS output, through a programmable delay stage. This loop-through, and the  
associated tracking from the data generating device, should be incorporated in the feedback loop of  
a Delay-Locked Loop (DLL) or Phase-Locked Loop (PLL) clock generator, within the data generating  
device. This enables the system to compensate for variations in input/output delays in both the data  
generating device and the DAC.  
Performance Enhancement Features  
Each DAC core integrates a number of performance enhancing features. Performance levels now  
reach the level sought after for next generation systems and high direct-IF architectures.  
Serial Control Interface  
A Fujitsu 4-wire serial interface is provided for configuration and control of the DAC. Programmed  
data is stored in a number of read/writable registers.  
Waveform Memory Module  
The MB86064 incorporates a Waveform Memory Module featuring two 16k point on-chip waveform  
memories. These allow the DAC cores to be driven with user programmed waveforms without the  
need for external high speed, pattern generators.  
Development Kit  
A comprehensive Development Kit (DK),  
DK86064, is available which comprises a  
number of modules. A base motherboard  
provides an interface to the DAC, Clock and  
Data modules. Also included is a PC USB  
Interface Lead & Control Software.  
For further details, please refer to the  
associated documentation.  
Copyright © 2004 Fujitsu Microelectronics Europe GmbH  
Production  
Page 3 of 4  
Disclaimer: The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before  
ordering.The information and circuit diagrams in this document are presented “as is”, no license is granted by implication or otherwise.  
October 2004 Version 1.1  
FME/MS/DAC80/FL/5085  
MB86064 Dual 14-bit 1GSa/s DAC  
Worldwide Headquarters  
Japan  
Asia  
Tel: +81 44 754 3753  
Fax: +81 44 754 3329  
Tel: +65 281 0770  
Fax: +65 281 0220  
Fujitsu Limited  
Kamikodanaka 4-1-1  
Nakahara-ku  
Fujitsu Microelectronics Asia Pte Ltd  
151 Lorong Chauan  
New Tech Park  
Kawasaki-shi  
Kanagawa-ken 211-8588  
Japan  
#05-08  
Singapore 556741  
http://www.fujitsu.com  
http://www.fmal.fujitsu.com  
USA  
Europe  
Tel: +1 408 737 5600  
Fax: +1 408 737 5999  
Fujitsu Microelectronics America, Inc. Tel: +49 6103 6900  
Fujitsu Microelectronics Europe GmbH  
Fax: +49 6103 690122  
1250 E. Arques Avenue, M/S 333  
Sunnyvale, CA 94088-3470  
USA  
Am Siebenstein 6-10  
D-63303 Dreieich-Buchschlag  
Germany  
Tel: +1 800 866 8608 Customer Response Center  
Fax: +1 408 737 5984 Mon-Fri: 7am-5pm (PST)  
http://www.fma.fujitsu.com/  
http://www.fme.fujitsu.com/  
4
The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales  
representatives before ordering.  
The information and circuit diagrams in this document presented as examples of semiconductor device applications, and are not  
intended to be incorporated in devices for actual use. Also, FUJITSU is unable to assume responsibility for infringement of any patent  
rights or other rights of third parties arising from the use of this information or circuit diagrams. No license is granted by implication  
or otherwise under any patent or patent rights of Fujitsu Microelectronics Europe GmbH.  
FUJITSU semiconductor devices are intended for use in standard applications (computers, office automation and other office  
equipment, industrial, communications, and measurement equipment, personal or household devices, etc.).  
CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly  
affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as  
aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.)  
are requested to consult with FUJITSU sales representatives before such use. The company will not be responsible for damages  
arising from such use without prior approval.  
Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such  
failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention  
of over-current levels and other abnormal operating conditions.  
If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign  
Exchange and Foreign Trade Control Law of Japan, the prior authorization by Japanese government should be required for export  
of those products from Japan.  
FME/MS/DAC80/FL/5085 1.1  
Page 4 of 4  
Production  
Copyright © 2004 Fujitsu Microelectronics Europe GmbH  
Disclaimer: The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before  
ordering.The information and circuit diagrams in this document are presented “as is”, no license is granted by implication or otherwise.  

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