MB86064 [FUJITSU]
Dual 14-bit 1GSa/s DAC; 双14位1GSa / s的DAC型号: | MB86064 |
厂家: | FUJITSU |
描述: | Dual 14-bit 1GSa/s DAC |
文件: | 总4页 (文件大小:124K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Product Flyer
Mixed Signal Division
October 2004
Version 1.1
MB86064
FME/MS/DAC80/FL/5085
Dual 14-bit 1GSa/s DAC
The Fujitsu MB86064 is a Dual 14-bit 1GSa/s digital to analog
converter (DAC), delivering exceptional dynamic performance.
Each high performance DAC core is capable of generating
multi-standard, multi-carrier communication transmit signals,
suitable for 2, 2.5 and 3G systems. DAC data is input via two
high-speed LVDS ports. These operate in a pseudo double data
rate (DDR) mode, with data latched on both rising and falling
edges. Alternatively, the device can be configured as a
multiplexed dual-port single DAC. To simplify system
integration the DAC operates from a clock running at half the
DAC conversion rate.
PLASTIC PACKAGE
EFBGA-120
Package Dimensions
12 mm x 12 mm
Features
• Dual 14-bit, 1GSa/s Digital to Analog conversion
• Exceptional dynamic performance
PIN ASSIGNMENT
• 74dBc ACLR for 4 UMTS carriers @ 276MHz direct-IF
• 100MHz image-free generated bandwidth capability
• supports UMTS plus digital pre-distortion bandwidth
• Proprietary performance enhancement features
• LVDS data interface
AC19
AA19
AC17
AA17
AC15
AA15
AC13
AA13
AC11
AA11
AC9
AA9
AC7
AA7
AC5
AA5
AB18
Y18
AB16
Y16
AB14
Y14
AB12
Y12
AB10
Y10
AB8
Y8
AB6
Y6
• Register selectable on-chip LVDS termination resistors
• Fujitsu 4-wire serial control interface
W23
U23
R23
N23
L23
J23
W21
U21
R21
N21
L21
J21
G21
E21
W3
U3
W1
U1
X_A9
A9
X_A10
A10
X_B10
B10
X_B9
B9
V4
T4
P4
V2
T2
P2
M2
K2
H2
F2
V22
T22
P22
V20
T20
P20
M20
K20
H20
F20
DVSS
X_B8
B8
DVDD
DVSS
X_A8
A8
DVDD
X_B7
B7
• Two 16k point programmable on-chip waveform memories
• Low power 3.3V analog and 1.8V digital operation
• 750mW per DAC power dissipation at 1GSa/s
• 0.18µm CMOS technology with Triple Well
• Performance enhanced EFBGA package
X_A7
A7
R14
R12
R10
R3
N3
L3
J3
R1
N1
L1
J1
P15
P13
M13
K13
P11
P9
X_B6
B6
X_B5
B5
X_A6
A6
X_A5
A5
N14
L14
J14
N12
L12
J12
N10
L10
J10
M22
M4
K4
H4
M15
M11
M9
DVSS
X_B3
B3
DVSS
X_A3
A3
DVDD
DVDD
X_A4
A4
X_B4
B4
K22
K15
K11
K9
X_A1
X_B1
B1
X_B2
B2
X_A2
A2
H22
F22
A1
All centre pins : TG
G23
E23
G3
E3
G1
E1
DVSS
NC
DVSS
NC
DVDD
DVDD
DVSS
DVDD
DVDD
DVSS
F4
NC
NC
• Industrial temperature range (-40°C to +85°C)
D18
B18
D16
B16
D14
B14
D12
B12
D10
B10
D8
B8
D6
B6
C19
A19
C17
A17
C15
A15
C13
A13
C11
A11
C9
A9
C7
A7
C5
A5
Index
Applications
• Multi-carrier, Multi-standard cellular infrastructure
• CDMA, W-CDMA, GSM/EDGE, UMTS
• Wideband communications systems
• High Direct-IF architectures
Not to scale. Viewed from above.
• Arbitrary waveform generation
• Test equipment
• Radar, video & display systems
Copyright © 2004 Fujitsu Microelectronics Europe GmbH
Production
Page 1 of 4
Disclaimer: The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before
ordering.The information and circuit diagrams in this document are presented “as is”, no license is granted by implication or otherwise.
October 2004 Version 1.1
FME/MS/DAC80/FL/5085
MB86064 Dual 14-bit 1GSa/s DAC
Functional Overview
The MB86064 is a high performance Dual 14-bit 1GSa/s DAC. In addition to two DAC cores the
device features a host of features designed to help both system integration and operation. A
functional block diagram is shown in Figure 1. Analog performance at high frequencies is enhanced
by novel current switch and switch driver designs which provide constant data-independent switching
delay, reducing jitter and distortion.
÷
Clock output 1
LVDS
Control Interface
1.8V LVCMOS
1, 2, 4, 8
4-wire Serial Control Interface
÷
Clock output 2
LVDS
1, 2, 4, 8
RF Clock input
e.g. 500MHz
Double-Edge
clocked
(1GSa/s)
Port A data input
14-bit LVDS
Waveform
Memory
A
DAC A
Loop clock input
LVDS
Analog output A
Analog output B
(14-bit)
(16K Points)
Waveform
Memory
B
Loop clock output
LVDS
DAC B
(16K Points)
(14-bit)
Port B data input
14-bit LVDS
EFBGA-120
Figure 1 MB86064 Functional Block Diagram
The device requires an input clock at half the DAC conversion rate as each DAC core is clocked on
both edges of the input clock. Each DAC core can be regarded as two interleaved DACs, each
running at half rate. The main reason for adopting this approach is that the switch driver inherently
includes a multiplex function through its two input ports. Compared to a conventional switch driver
this allows twice as long to acquire and convert, though because the two paths share current sources
they match exactly at low frequencies. A characteristic of this architecture is a suppressed image
appearing reflected about Fs(dac)/4 of Fclk-Fsig. Duty cycle error in the input clock will exacerbate
this image, but can be minimised by trimming the differential DC offset at the clock input pins.
The big advantage of this approach compared to a single DAC running at half the rate is much
reduced sinx/x roll off, which gives increased output power and better in-band flatness when
generating high output frequencies (e.g. 200MHz and above). This is illustrated in Figure 2 as line 1.
An alternative approach using a return-to-zero output stage has the same sinx/x roll off (and switch
driver speed) but 6dB lower output power and a large image at Fclk-Fout. See Line 2.
Page 2 of 4
Production
Copyright © 2004 Fujitsu Microelectronics Europe GmbH
Disclaimer: The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before
ordering.The information and circuit diagrams in this document are presented “as is”, no license is granted by implication or otherwise.
October 2004 Version 1.1
FME/MS/DAC80/FL/5085
MB86064 Dual 14-bit 1GSa/s DAC
Line 3 illustrates a conventional DAC
running at half rate.
dBFS
0
-6
Input Data
Unsigned binary data to each DAC core is
input via a dedicated parallel LVDS port. As
with the DAC core, data is latched on every
rising and falling edge of the clock in a
pseudo DDR mode. For synchronisation of
data generator(s) two LVDS clock outputs
and a Loop-Clock facility are provided.
Frequency
Target high direct-IF
generating region
Figure 2 Benefits of DAC core architecture to
Sinx/x response
Loop-Clock
Maintaining valid clock-to-data timing becomes increasingly difficult at higher clock rates, particularly
taking into account device-to-device variations. The MB86064 minimises potential problems through
its DDR data interface and by providing a loop-clock facility. The on-chip ‘loop’ consists of an LVDS
input connected to an LVDS output, through a programmable delay stage. This loop-through, and the
associated tracking from the data generating device, should be incorporated in the feedback loop of
a Delay-Locked Loop (DLL) or Phase-Locked Loop (PLL) clock generator, within the data generating
device. This enables the system to compensate for variations in input/output delays in both the data
generating device and the DAC.
Performance Enhancement Features
Each DAC core integrates a number of performance enhancing features. Performance levels now
reach the level sought after for next generation systems and high direct-IF architectures.
Serial Control Interface
A Fujitsu 4-wire serial interface is provided for configuration and control of the DAC. Programmed
data is stored in a number of read/writable registers.
Waveform Memory Module
The MB86064 incorporates a Waveform Memory Module featuring two 16k point on-chip waveform
memories. These allow the DAC cores to be driven with user programmed waveforms without the
need for external high speed, pattern generators.
Development Kit
A comprehensive Development Kit (DK),
DK86064, is available which comprises a
number of modules. A base motherboard
provides an interface to the DAC, Clock and
Data modules. Also included is a PC USB
Interface Lead & Control Software.
For further details, please refer to the
associated documentation.
Copyright © 2004 Fujitsu Microelectronics Europe GmbH
Production
Page 3 of 4
Disclaimer: The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before
ordering.The information and circuit diagrams in this document are presented “as is”, no license is granted by implication or otherwise.
October 2004 Version 1.1
FME/MS/DAC80/FL/5085
MB86064 Dual 14-bit 1GSa/s DAC
Worldwide Headquarters
Japan
Asia
Tel: +81 44 754 3753
Fax: +81 44 754 3329
Tel: +65 281 0770
Fax: +65 281 0220
Fujitsu Limited
Kamikodanaka 4-1-1
Nakahara-ku
Fujitsu Microelectronics Asia Pte Ltd
151 Lorong Chauan
New Tech Park
Kawasaki-shi
Kanagawa-ken 211-8588
Japan
#05-08
Singapore 556741
http://www.fujitsu.com
http://www.fmal.fujitsu.com
USA
Europe
Tel: +1 408 737 5600
Fax: +1 408 737 5999
Fujitsu Microelectronics America, Inc. Tel: +49 6103 6900
Fujitsu Microelectronics Europe GmbH
Fax: +49 6103 690122
1250 E. Arques Avenue, M/S 333
Sunnyvale, CA 94088-3470
USA
Am Siebenstein 6-10
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Germany
Tel: +1 800 866 8608 Customer Response Center
Fax: +1 408 737 5984 Mon-Fri: 7am-5pm (PST)
http://www.fma.fujitsu.com/
http://www.fme.fujitsu.com/
4
The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information and circuit diagrams in this document presented as examples of semiconductor device applications, and are not
intended to be incorporated in devices for actual use. Also, FUJITSU is unable to assume responsibility for infringement of any patent
rights or other rights of third parties arising from the use of this information or circuit diagrams. No license is granted by implication
or otherwise under any patent or patent rights of Fujitsu Microelectronics Europe GmbH.
FUJITSU semiconductor devices are intended for use in standard applications (computers, office automation and other office
equipment, industrial, communications, and measurement equipment, personal or household devices, etc.).
CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly
affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as
aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.)
are requested to consult with FUJITSU sales representatives before such use. The company will not be responsible for damages
arising from such use without prior approval.
Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such
failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention
of over-current levels and other abnormal operating conditions.
If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign
Exchange and Foreign Trade Control Law of Japan, the prior authorization by Japanese government should be required for export
of those products from Japan.
FME/MS/DAC80/FL/5085 1.1
Page 4 of 4
Production
Copyright © 2004 Fujitsu Microelectronics Europe GmbH
Disclaimer: The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before
ordering.The information and circuit diagrams in this document are presented “as is”, no license is granted by implication or otherwise.
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