FSMD005-0603-R [FUZETEC]
Surface Mountable PTC Resettable Fuse: FSMD0603 Series;
| 型号： | FSMD005-0603-R |
| 厂家： | 
Fuzetec Technology Co., Ltd. |
| 描述： | Surface Mountable PTC Resettable Fuse: FSMD0603 Series |
| 文件： | 总4页 (文件大小：182K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NO.
PQ35-101E
FUZETEC TECHNOLOGY CO., LTD.
Version A2 Page 1/4
Product Specification and Approval Sheet
Surface Mountable PTC Resettable Fuse: FSMD0603 Series
1. Summary
(a) RoHS Compliant & Halogen Free
(b) Applications: All high-density boards
(c) Product Features: Small surface mountable, Solid state, Faster time to trip than
standard SMD devices, Lower resistance than standard SMD devices
(d) Operation Current: 0.01A~0.20A
(e) Maximum Voltage: 9V~60VDC
(f) Temperature Range : -40℃ to 85℃
2. Agency Recognition
UL:
C-UL:
TÜ V:
File No. E211981
File No. E211981
File No. R50090556
3. Electrical Characteristics (23℃)
Max Time to Trip
Resistance
Hold
Current
IH, A
Trip
Current
IT, A
Rated
Max
Typical
Power
Pd, W
Part
Voltage
Current
Current
A
Time
Sec
RMIN
R1MAX
Number
VMAX, VDC IMAX, A
Ohms Ohms
FSMD001-0603-R
FSMD002-0603-R
FSMD003-0603-R
FSMD004-0603-R
FSMD005-0603-R
FSMD010-0603-R
FSMD012-0603-R
FSMD016-0603-R
FSMD020-0603-R
0.01
0.02
0.03
0.04
0.05
0.10
0.12
0.16
0.20
0.03
0.06
0.09
0.12
0.15
0.25
0.30
0.40
0.45
60
60
30
24
15
15
9
40
40
40
40
40
40
40
40
40
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.20
0.20
0.20
0.20
0.50
0.70
0.80
1.00
2.00
1.00
1.00
1.00
1.00
0.10
0.10
0.10
0.10
0.10
15.00 100.00
12.00
6.00
4.00
3.80
0.90
1.10
1.00
0.55
70.00
50.00
40.00
30.00
8.00
5.80
4.20
3.50
9
9
I
I
H
=Hold current-maximum current at which the device will not trip at 23℃still air.
T
=Trip current-minimum current at which the device will always trip at 23℃ still air.
MAX=Maximum voltage device can withstand without damage at it rated current.(I MAX)
MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment.
V
I
R
MIN=Minimum device resistance at 23℃ prior to tripping.
R1MAX=Maximum device resistance at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds.
Termination pad characteristics
Termination pad materials: Pure Tin
NOTE : Specification subject to change without notice.
2015/9/7
NO.
PQ35-101E
FUZETEC TECHNOLOGY CO., LTD.
Version A2 Page 2/4
Product Specification and Approval Sheet
4. FSMD Product Dimensions (Millimeters)
E
A
B
C
D
Part
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Number
FSMD001-0603-R
FSMD002-0603-R
FSMD003-0603-R
FSMD004-0603-R
FSMD005-0603-R
FSMD010-0603-R
FSMD012-0603-R
FSMD016-0603-R
FSMD020-0603-R
1.40
1.40
1.40
1.40
1.40
1.40
1.40
1.40
1.40
1.80
1.80
1.80
1.80
1.80
1.80
1.80
1.80
1.80
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.00
0.35
0.35
0.35
0.35
0.35
0.35
0.35
0.35
0.35
0.85
0.85
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.08
0.08
0.08
0.08
0.08
0.08
0.08
0.08
0.08
0.40
0.40
0.40
0.40
0.40
0.40
0.40
0.40
0.40
5. Thermal Derating Curve
FSMD0603 Series
200%
150%
100%
50%
0%
-40
-20
0
20
40
60
80
Ambient Temperature (℃)
NOTE : Specification subject to change without notice.
2015/9/7
NO.
PQ35-101E
FUZETEC TECHNOLOGY CO., LTD.
Version A2 Page 3/4
Product Specification and Approval Sheet
6. Typical Time-To-Trip at 23℃
A=FSMD001-0603-R
A
B
C
D E
F GHI
B=FSMD002-0603-R
C=FSMD003-0603-R
D=FSMD004-0603-R
E=FSMD005-0603-R
F=FSMD010-0603-R
G=FSMD012-0603-R
H=FSMD016-0603-R
I=FSMD020-0603-R
100
10
1
0.1
0.01
0.001
0.01
0.1
1
10
Fault Current (A)
7. Material Specification
Terminal pad material: Pure Tin
Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3
X=FSMD001-0603-R
8. Part Numbering and Marking System
Y=FSMD002-0603-R
Z=FSMD003-0603-R
A=FSMD004-0603-R
B=FSMD005-0603-R
D=FSMD010-0603-R
E=FSMD012-0603-R
F=FSMD016-0603-R
G=FSMD020-0603-R
Part Numbering System
Part Marking System
F S M D □ □ □ – 0603 - R
□
D
Current Rating
Part Identification
Example
Warning: -Operation beyond the specified maximum ratings or improper use may result in damage and possible
electrical arcing and/or flame.
-PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent
condition and/or prolonged trip are not anticipated.
-Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device
performance.
NOTE : Specification subject to change without notice.
2015/9/7
NO.
PQ35-101E
FUZETEC TECHNOLOGY CO., LTD.
Version A2 Page 4/4
Product Specification and Approval Sheet
9. Pad Layouts、Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each FSMD0603 device
Pad dimensions (millimeters)
A
B
C
Device
Nominal
Nominal
Nominal
FSMD0603 Series
0.80
0.60
0.80
Solder reflow
※ Due to “Lead Free” nature, Temperature and
Dwelling time for the soldering zone is higher
than those for Regular. This may cause
damage to other components.
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat :
Pb-Free Assembly
3 ℃/second max.
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
150 ℃
200 ℃
60-180 seconds
1. Recommended max past thickness > 0.25mm.
2. Devices can be cleaned using standard
methods and aqueous solvent.
Time maintained above:
Temperature(TL)
Time (tL)
3. Rework use standard industry practices.
4. Storage Envorinment : < 30℃ / 60%RH
217 ℃
60-150 seconds
260 ℃
Peak/Classification Temperature(Tp) :
Time within 5℃ of actual Peak :
Temperature (tp)
Ramp-Down Rate :
Caution:
20-40 seconds
6 ℃/second max.
8 minutes max.
1. If reflow temperatures exceed the
recommended profile, devices may not meet
the performance requirements.
Time 25 ℃ to Peak Temperature :
Note 1: All temperatures refer to of the package,
measured on the package body surface.
2. Devices are not designed to be wave soldered
to the bottom side of the board.
Reflow Profile
NOTE : Specification subject to change without notice.
2015/9/7
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